CN211650172U - Heat dissipation device based on combination of PCM fin heat pipe integrated plate and semiconductor refrigeration piece - Google Patents

Abstract

The utility model discloses a heat dissipation device based on combination of a PCM fin heat pipe integrated board and a semiconductor refrigeration piece, which comprises a fan, LED lamp wick integrated lamp beads, the semiconductor refrigeration piece and the integrated board, wherein the integrated board consists of a heat pipe, a base plate and a board cover, and the board cover is fixedly connected with the hot end of the semiconductor refrigeration piece through heat-conducting glue; the LED lamp core integrated lamp beads are fixedly packaged with the semiconductor refrigerating sheet through heat conducting glue; the substrate is hermetically connected with the plate cover, and grooves which are mutually communicated are formed in the substrate and the plate cover to form a closed heat conducting cavity; the side surface of the substrate is provided with an opening, and the evaporation end of the heat pipe is embedded into the substrate through the opening and is fixed in the heat conduction cavity. The device reasonably combines semiconductor refrigeration and heat dissipation, phase-change material heat storage and heat dissipation, heat dissipation of the heat pipe fins and forced air cooling and heat dissipation of the fan together, and has compact structure and convenient installation; the LED lamp has the advantages of good heat dissipation capacity, high efficiency, environmental protection, simple maintenance, improvement on the working performance of the LED, reliability and service life.

Description

A kind of heat dissipation based on the combination of PCM fin heat pipe integrated board and semiconductor refrigeration sheet device

technical field

The utility model relates to the field of electronic equipment, in particular to a heat dissipation device based on the combination of a PCM fin heat pipe integrated board and a semiconductor refrigeration sheet.

Background technique

With the development of electronic devices in the direction of high performance and high integration, their heat flux density is gradually increasing. In order to ensure that the device can be in a good working temperature environment, the heat needs to be dissipated quickly. If the heat of the LED chip cannot be dissipated, it will affect the working performance and reliability of the LED, and accelerate the aging or even failure of the chip.

Heat pipe is a heat transfer element that utilizes gas-liquid phase transition. Because its heat transfer capability is much better than that of metal materials, it is widely used in the field of heat dissipation of electronic equipment. The principle of semiconductor refrigeration sheet is based on the Peltier principle, using the Peltier effect of semiconductor materials, when the direct current passes through the galvanic couple formed by two different semiconductor materials in series, the two ends of the galvanic couple can absorb heat and release heat respectively to achieve refrigeration. the goal of. The fins dissipate the heat by heating the surrounding air by forced convection and radiation. Phase change materials (PCM) have great potential for thermal energy storage and utilization. Heat pipes can take advantage of their high thermal conductivity to make up for the low thermal conductivity of phase change materials, and can be used as a good heat transfer medium for phase change materials and heat dissipation fins.

People have proposed heat pipe fin heat sinks, semiconductor cooling fin heat sinks, etc. However, when high-power LED lights work continuously, a large amount of heat will be generated. Lifetime and luminous efficiency, thermal buildup is formed. How to effectively solve the heat dissipation problem of LEDs and design a device that meets current heat dissipation requirements is an urgent problem for those skilled in the art.

SUMMARY OF THE INVENTION

The purpose of the utility model is to overcome the shortcomings and deficiencies of the prior art, and propose a heat dissipation device based on the combination of a PCM fin heat pipe integrated board and a semiconductor cooling chip, including a fan, an LED lamp wick integrated lamp bead, a semiconductor cooling chip and an integrated board, The integrated board includes a heat pipe, a base plate and a plate cover, the plate cover is fixedly connected to the hot end of the semiconductor refrigeration sheet through thermal conductive glue; the LED lamp wick integrated lamp bead is packaged and fixed with the semiconductor refrigeration sheet through thermal conductive glue; the base plate and the plate The cover is sealed and connected, and the interior of the base plate and the plate cover is provided with a groove that communicates with each other to form a closed heat conduction cavity; the side surface of the base plate is provided with an opening, and the evaporation end of the heat pipe is embedded in the base plate through the opening and extends into the heat conduction cavity ;

The heat-conducting cavity is filled with a phase-change material, and the evaporation end of the heat pipe is arranged in the heat-conducting cavity and is covered by the phase-change material;

The heat pipe has a U-shaped structure, and the condensing end of the heat pipe protrudes out of the integrated board through the opening and is parallel to the base plate; the condensing end of the heat pipe is fixedly connected with radiating fins;

The distribution density of the fins is multi-level, and the density gradually decreases along the direction away from the surface of the attached heat pipe;

The bottom surface of the groove of the plate cover is provided with a support column, and the support column is in contact with the bottom surface of the groove of the base plate;

The base plate is provided with a connecting column, and the fan is fixed on the connecting column;

The phase change material is a mixture of paraffin, graphite powder and metal powder;

The heat pipe is a sintered copper rod heat pipe;

The material of the fins is copper;

Optionally, the heat on the fins is forced air cooling through a fan;

Optionally, the base plate and the plate cover are detachable and assembled, and are sealed by a square-shaped sealing ring or the outer periphery is welded into one body to form a sealed heat-conducting cavity space;

Optionally, the semiconductor refrigeration chip is selected according to the size of the LED chip, and the size of the integrated board is reasonably processed according to the semiconductor refrigeration chip;

Optionally, the size of the heat pipe and the number of heat pipes embedded in the integrated board are set according to actual needs;

Optionally, the heat pipe may be optional but not limited to a U-shaped structure;

More preferably, the present utility model further includes a lampshade for installing the LED lamp wick integrated lamp bead, the semiconductor refrigeration chip and the integrated board;

The LED lamp wick integrated lamp bead has the same size as the semiconductor refrigeration chip, and is smaller than the plate cover of the integrated board, and the integrated board is provided with eight tapping screw holes according to the position and size of the screw holes of the lampshade.

There is an installation opening at the contact between the lampshade and the integrated LED lamp bead, the installation opening is the same as the length and width of the integrated LED lamp bead, and the height is the sum of the height of the integrated LED lamp bead and the semiconductor cooling chip, which is used to install the LED The wick integrates lamp beads and semiconductor refrigeration chips;

The lampshade is provided with a groove whose size is the same as that of the cover of the integrated board, and the cover of the integrated board is partially embedded in the groove, so that the integrated board and the lampshade are completely matched and fixed;

The LED lamp wick integrated lamp bead is packaged and fixed with the semiconductor refrigeration sheet through thermal conductive adhesive, and the semiconductor refrigeration sheet is further fixed with the surface of the integrated board cover through the thermal conductive adhesive, and the three are formed into a whole and then reasonably cooperate with the corresponding structure of the lampshade;

The lampshade is fixed with the integrated board by means of cross-head slotted cylinder head screws;

Another object of the present invention is to provide a method for realizing a heat dissipation device based on the combination of a PCM fin heat pipe integrated board and a semiconductor cooling fin.

The purpose of the present utility model is achieved through the following technical solutions:

S1. When the LED wick-integrated lamp bead lamp is working, the LED wick-integrated lamp bead directly cools down actively through the semiconductor refrigeration sheet, and the phase change material in the heat conduction cavity absorbs the heat at the hot end of the semiconductor refrigeration sheet;

S2. The heat pipe transfers the heat of the phase change material from the evaporating end to the condensing end, and dissipates the heat through the fins, and finally the fan is forced to cool and dissipate the heat.

Compared with the prior art, the utility model has the following beneficial effects:

(1) Reasonable combination of semiconductor refrigeration and heat dissipation, phase change material heat storage and heat dissipation, heat pipe fin heat dissipation and fan forced air cooling and heat dissipation, compact structure and convenient installation;

(2) It has good heat dissipation capacity, high efficiency and environmental protection, simple maintenance, can prevent LED heat accumulation, ensure that the LED is in a good working temperature environment, and improve the working performance, reliability and service life of the LED.

Description of drawings

Fig. 1 is the overall structure schematic diagram of the present utility model;

Fig. 2 is the heat pipe structure schematic diagram of the utility model;

3 is a schematic diagram of a substrate structure of the present invention;

4 is a schematic diagram of a plate cover structure of the present invention;

5 is a schematic diagram of the structure of the integrated board of the present invention;

6 is a schematic structural diagram of a heat dissipation module of the present invention;

7 is a schematic diagram of the lampshade structure of the present invention;

8 is a schematic view of the lampshade structure of the present invention;

The reference signs in the figure are: 1, fan; 2, integrated board; 3, lampshade; 4, fin; 5, condensation end; 6, evaporation end; 7, base plate groove; 8, opening; 9, connecting column; 10. The first tapped screw hole; 11. The groove of the plate cover; 12. The second tapped screw hole; 13. The support column; 14. The LED wick integrated lamp bead; , transparent lens; 18, screw hole; 19, installation port; 20, card slot; 21, heat pipe; 22, base plate; 23, plate cover.

Detailed ways

The present utility model will be described in further detail below with reference to the embodiments and the accompanying drawings, but the embodiments of the present utility model are not limited thereto.

As shown in Figures 1 to 8, a heat dissipation device based on a combination of a PCM fin heat pipe integrated board and a semiconductor cooling chip includes a fan 1, an LED wick integrated lamp bead 14, a semiconductor cooling chip 15 and an integrated board 2. The integrated board 2 includes a heat pipe 21, a base plate 22 and a plate cover 23, the plate cover 23 is fixedly connected to the hot end of the semiconductor refrigeration sheet 15 through thermal conductive adhesive; the LED lamp wick integrated lamp beads 14 are packaged and fixed with the semiconductor refrigeration sheet 15 through thermal conductive adhesive; The base plate 22 and the plate cover 23 are hermetically connected, and the interior of the base plate 22 and the plate cover 23 are provided with grooves that communicate with each other to form a closed heat conduction cavity; the side of the base plate 22 is provided with an opening 8, and the evaporation end 6 of the heat pipe 21 The substrate 22 is embedded through the opening 8 and extends into the heat conduction cavity.

The device reasonably combines semiconductor cooling and heat dissipation, phase change material heat storage and heat dissipation, heat pipe fin heat dissipation and fan forced air cooling and heat dissipation, with compact structure and convenient installation; Through the active cooling of the semiconductor refrigeration sheet 15, the phase change material in the heat conduction cavity absorbs the heat of the hot end of the semiconductor refrigeration sheet 15; the heat pipe 21 transfers the heat of the phase change material from the evaporation end 6 to the condensation end 5, and dissipates the heat through the fins 4 , and finally the fan 1 forced air cooling to dissipate heat. The device effectively improves the heat dissipation capacity, is efficient and environmentally friendly, and has simple maintenance. It can prevent heat accumulation of the LED, ensure that the LED is in a good working temperature environment, and improve the working performance, reliability and service life of the LED.

The heat-conducting cavity is filled with phase-change material, and the evaporation end 6 of the heat pipe 21 is set in the heat-conducting cavity and covered by the phase-change material; the heat pipe 21 has a U-shaped structure, and the condensation end 5 of the heat pipe 21 passes through the heat pipe 21 . 22 The opening 8 extends out of the integrated board 2 and is parallel to the base plate 22; the condensation end 5 of the heat pipe 21 is provided with fins 4; the distribution density of the fins 4 is multi-level, along the distance away from the heat pipe The density gradually decreases in the direction of the 21 surface; the bottom surface of the groove of the plate cover 23 is provided with a support column 13, and the support column 13 is in contact with the bottom surface of the groove of the base plate 22 for supporting the base plate 22 and the concave surface of the plate cover 23. The groove part prevents the groove from being deformed and damaged due to uneven force on the outer surface of the groove; the base plate 22 is provided with a connecting column 9 that is fixedly matched with the fan 1, and the connecting column 9 is provided with a first tapping screw hole 10; the The phase change material is a mixture of paraffin, graphite powder and metal powder; the heat pipe 21 is a sintered copper rod heat pipe; the material of the fins 4 is copper.

The fins 4 are fixedly connected to the condensation ends 5 of the heat pipes 21 through thermally conductive glue;

The heat on the fins 4 is forced air cooling through the fan 1 .

The upper surface of the substrate 22 is provided with a groove in the middle. The length and width of the groove are determined according to the size and height of the integrated LED lamp beads 14 according to the thickness of the substrate 22 . The bottom surface of the groove is 2 mm away from the bottom surface of the substrate 22 .

The fan 1 is screwed into the first tapped screw hole 10 and fixed to the base plate 22 with a cross-head slotted cylinder head screw.

As shown in FIGS. 7 and 8 , the present invention also includes a lampshade 3 for installing the LED lamp wick integrated lamp bead 14, the semiconductor refrigeration chip 15 and the integrated board; the LED lamp wick integrated lamp bead 14 is the same size as the semiconductor refrigeration chip 15, Smaller in size than the board cover 23 , the integrated board 2 is provided with eight tapped screw holes according to the position and size of the screw holes of the lampshade 3 . The lampshade 3 is provided with an installation opening at the contact point of the LED lamp bead 14 . The installation opening 19 has the same length and width as the LED lamp bead 14 , and the height is the sum of the height of the LED lamp bead 14 and the semiconductor refrigeration chip 15 . , which is used to install the LED wick integrated lamp beads 14 and the semiconductor refrigeration chip 15; the lampshade 3 is provided with a card slot 20 of the same size as the plate cover 23, which is used for the plate cover 23 to be partially embedded in the card slot 20 so that the integrated plate 2 and the The lampshade 3 is completely matched and fixed; the LED lamp wick integrated lamp bead 14 is packaged and fixed with the semiconductor cooling chip 15 through thermal conductive adhesive, and the semiconductor cooling chip 15 is further fixed with the surface of the plate cover 23 through the thermal conductive adhesive. The corresponding structures are reasonably matched; the lampshade 3 is fixed to the integrated board 2 by means of cross-slotted cylinder head screws;

The above are the preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited by the above-mentioned contents, and any other changes, modifications, substitutions, combinations, The simplification should be equivalent replacement methods, and all are included in the protection scope of the present invention.

Claims (8)

1. A heat dissipation device based on combination of a PCM fin heat pipe integrated plate and a semiconductor refrigeration piece is characterized by comprising a fan, an LED lamp core integrated lamp bead, the semiconductor refrigeration piece and an integrated plate, wherein the integrated plate comprises a heat pipe, a base plate and a plate cover, and the plate cover is fixedly connected with the hot end of the semiconductor refrigeration piece through heat conduction glue; the LED lamp core integrated lamp beads are fixedly packaged with the semiconductor refrigerating sheet through heat conducting glue; the substrate is hermetically connected with the plate cover, and grooves which are mutually communicated are formed in the substrate and the plate cover to form a closed heat conducting cavity; the side surface of the substrate is provided with an opening, and the evaporation end of the heat pipe is embedded into the substrate through the opening and extends into the heat conduction cavity.

2. The heat dissipating device of claim 1, wherein the heat conducting cavity is filled with a phase change material, and the evaporation end of the heat pipe is disposed in the heat conducting cavity and covered by the phase change material.

3. The heat dissipating device of claim 1, wherein the heat pipe has a U-shaped configuration, and the condensation end of the heat pipe extends out of the integration plate through the opening and is parallel to the substrate; and the condensation end of the heat pipe is fixedly connected with a radiating fin.

4. The heat dissipating device of claim 1, wherein the fins are distributed in a plurality of stages with decreasing density along a direction away from the surface of the heat pipe.

5. The heat dissipating device of claim 1, wherein the bottom surface of the groove of the plate cover is provided with a supporting post, and the supporting post is in contact with the bottom surface of the groove of the substrate.

6. The heat dissipating device of claim 1, wherein the base plate has a connecting post thereon, and the fan is fixed to the connecting post.

7. The heat dissipating device of claim 1, wherein the heat pipe is a sintered copper rod heat pipe.

8. The heat sink of claim 1, wherein the fin is made of copper.

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