CN111120975A - A heat dissipation device based on the combination of a PCM fin heat pipe integrated board and a semiconductor refrigeration sheet and its realization method - Google Patents
A heat dissipation device based on the combination of a PCM fin heat pipe integrated board and a semiconductor refrigeration sheet and its realization method Download PDFInfo
- Publication number
- CN111120975A CN111120975A CN202010025778.3A CN202010025778A CN111120975A CN 111120975 A CN111120975 A CN 111120975A CN 202010025778 A CN202010025778 A CN 202010025778A CN 111120975 A CN111120975 A CN 111120975A
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- Prior art keywords
- heat
- heat dissipation
- heat pipe
- semiconductor refrigeration
- integrated
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a heat dissipation device based on combination of a PCM fin heat pipe integrated plate and a semiconductor refrigeration piece, which comprises a fan, LED lamp core integrated lamp beads, the semiconductor refrigeration piece and an integrated plate, wherein the integrated plate consists of a heat pipe, a substrate and a plate cover, and the plate cover is fixedly connected with the hot end of the semiconductor refrigeration piece through heat conduction glue; the LED lamp core integrated lamp beads are fixedly packaged with the semiconductor refrigerating sheet through heat conducting glue; the substrate is hermetically connected with the plate cover, and grooves which are mutually communicated are formed in the substrate and the plate cover to form a closed heat conducting cavity; the side surface of the substrate is provided with an opening, and the evaporation end of the heat pipe is embedded into the substrate through the opening and is fixed in the heat conduction cavity. The device reasonably combines semiconductor refrigeration and heat dissipation, phase-change material heat storage and heat dissipation, heat dissipation of the heat pipe fins and forced air cooling and heat dissipation of the fan together, and has compact structure and convenient installation; the LED lamp has the advantages of good heat dissipation capacity, high efficiency, environmental protection, simple maintenance, improvement on the working performance of the LED, reliability and service life.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to a heat dissipation device based on combination of a PCM fin heat pipe integrated plate and a semiconductor refrigeration piece.
Background
As electronic devices have been developed to have high performance and high integration, their heat flux density has been gradually increased. In order to ensure that the device can be in a good working temperature environment, heat needs to be rapidly dissipated. If the heat of the LED chip can not be dissipated, the working performance and reliability of the LED chip can be affected, and the aging and even the failure of the chip can be accelerated.
The heat pipe is a heat transfer element utilizing gas-liquid phase change, and is widely applied to the field of heat dissipation of electronic equipment because the heat transfer capacity of the heat pipe is far superior to that of a metal material. The principle of the semiconductor refrigerating sheet is based on the Peltier principle, and by utilizing the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so that the aim of refrigeration is fulfilled. The fins heat the surrounding air by forced convection and radiation to dissipate the heat. The Phase Change Material (PCM) has great potential in heat energy storage and utilization, and the heat pipe can make up for the problem of low heat conductivity coefficient of the phase change material by utilizing the advantage of high heat conductivity of the heat pipe and can be used as a good heat transfer medium of the phase change material and the heat dissipation fins.
Heat pipe fin heat sinks, semiconductor cooling fins, etc. have been proposed, however, when a high power LED lamp is operated continuously, a large amount of heat is generated, and if the heat sink fails to dissipate the heat quickly and timely, the life and light emitting efficiency of the LED will be affected, and heat accumulation will occur. How to effectively solve the heat dissipation problem of the LED and design a device meeting the current heat dissipation requirement is a problem which needs to be solved urgently by technicians in the field at present.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a heat dissipation device based on the combination of a PCM fin heat pipe integrated plate and a semiconductor refrigeration piece, which comprises a fan, an LED lamp core integrated lamp bead, a semiconductor refrigeration piece and the integrated plate, wherein the integrated plate comprises a heat pipe, a substrate and a plate cover, and the plate cover is fixedly connected with the hot end of the semiconductor refrigeration piece through heat conducting glue; the LED lamp core integrated lamp beads are fixedly packaged with the semiconductor refrigerating sheet through heat conducting glue; the substrate is hermetically connected with the plate cover, and grooves which are mutually communicated are formed in the substrate and the plate cover to form a closed heat conducting cavity; an opening is formed in the side face of the substrate, and the evaporation end of the heat pipe is embedded into the substrate through the opening and extends into the heat conduction cavity;
the heat conduction cavity is filled with a phase-change material, and the evaporation end of the heat pipe is arranged in the heat conduction cavity and is coated by the phase-change material;
the heat pipe is in a U-shaped structure, and the condensation end of the heat pipe extends out of the integrated plate through the opening and is parallel to the substrate; the condensation end of the heat pipe is fixedly connected with a heat radiation fin;
the distribution density of the fins is in a multi-stage mode, and the density is gradually reduced along the direction far away from the surface of the attached heat pipe;
a support column is arranged on the bottom surface of the groove of the plate cover and is in contact with the bottom surface of the groove of the substrate;
the base plate is provided with a connecting column, and the fan is fixed on the connecting column;
the phase-change material is a mixture of paraffin, graphite powder and metal powder;
the heat pipe is a sintered copper bar heat pipe;
the fin is made of copper;
optionally, the heat on the fins is forced to be cooled by air through a fan;
optionally, the substrate and the plate cover are detachably combined, and are sealed by a square sealing ring or welded into a whole at the periphery to form a closed heat conducting cavity space;
optionally, the semiconductor refrigeration piece is selected according to the size of the LED chip, and the size of the integrated plate is reasonably processed according to the size of the semiconductor refrigeration piece;
optionally, the size of the heat pipe and the number of heat pipes embedded in the integrated plate are set according to actual requirements;
optionally, the heat pipe may be selected from, but not limited to, a U-shaped structure;
preferably, the invention also comprises a lampshade for mounting the LED lamp core integrated lamp beads, the semiconductor refrigeration sheet and the integrated plate;
the LED lamp core integrated lamp bead is the same as the semiconductor refrigeration piece in size and is smaller than the integrated board cover in size, and the integrated board is provided with eight tapping screw holes according to the position and the size of the lamp shade screw hole.
The LED lamp core integrated lamp comprises a lampshade, an LED lamp core integrated lamp bead, a semiconductor refrigerating piece, a lamp shade, a lamp cover and a lamp cover, wherein the contact part of the lampshade and the LED lamp core integrated lamp bead is provided with a mounting opening, the length and the width of the mounting opening are the same as those of the LED lamp core integrated lamp bead, the height of the mounting opening is the sum of the heights of the LED lamp core integrated;
the lamp shade is provided with a groove with the same size as the board cover of the integration board, and the board cover of the integration board is partially embedded into the groove so that the integration board and the lamp shade are completely matched and fixed;
the LED lamp core integrated lamp beads are fixedly packaged with the semiconductor refrigerating sheet through heat conducting glue, the semiconductor refrigerating sheet is further fixed with the surface of the integrated plate cover through the heat conducting glue, and the LED lamp core integrated lamp beads, the semiconductor refrigerating sheet and the integrated plate cover are integrated and then reasonably matched with the corresponding structure of the lamp shade;
the lampshade is fixed with the integrated board through a cross head groove cylindrical head screw;
the invention also aims to provide a realization method of the heat dissipation device based on the combination of the PCM fin heat pipe integrated plate and the semiconductor refrigeration piece.
The purpose of the invention is realized by the following technical scheme:
s1, when the LED lamp wick integrated lamp bead lamp works, the LED lamp wick integrated lamp bead is directly and actively cooled through the semiconductor refrigerating sheet, and the phase-change material in the heat conduction cavity absorbs the heat at the hot end of the semiconductor refrigerating sheet;
s2, the heat pipe transfers the heat of the phase-change material from the evaporation end to the condensation end, the heat is dissipated through the fins, and finally the heat is dissipated through forced air cooling by the fan.
Compared with the prior art, the invention has the following beneficial effects:
(1) the semiconductor refrigeration heat dissipation, the phase-change material heat storage heat dissipation, the heat pipe fin heat dissipation and the fan forced air cooling heat dissipation are reasonably combined together, so that the structure is compact, and the installation is convenient;
(2) the LED lamp has the advantages of good heat dissipation capacity, high efficiency, environmental protection and simple maintenance, can prevent the heat accumulation of the LED, ensures that the LED is in a good working temperature environment, improves the working performance, reliability and service life of the LED.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a heat pipe structure according to the present invention;
FIG. 3 is a schematic view of a substrate structure according to the present invention;
FIG. 4 is a schematic view of the plate cover structure of the present invention;
FIG. 5 is a schematic view of the structure of the integrated board of the present invention;
FIG. 6 is a schematic structural diagram of a heat dissipation module according to the present invention;
FIG. 7 is a schematic view of a lampshade of the present invention;
FIG. 8 is a schematic view of a lampshade of the present invention;
the reference numbers in the figures are: 1. a fan; 2. an integrated board; 3. a lamp shade; 4. a fin; 5. a condensing end; 6. An evaporation end; 7. a substrate recess; 8. an opening; 9. connecting columns; 10. a first tapping screw hole; 11. a plate cover groove; 12. a second tapping screw hole; 13. a support pillar; 14. an LED lamp core integrated lamp bead; 15. a semiconductor refrigeration sheet; 16. a lampshade shell; 17. a transparent lens; 18. a screw hole; 19. an installation port; 20. a card slot; 21. A heat pipe; 22. a substrate; 23. and (7) covering the plate.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the present invention is not limited thereto.
As shown in fig. 1 to 8, a heat dissipation device based on the combination of a PCM fin heat pipe integrated plate and a semiconductor refrigeration sheet comprises a fan 1, an LED lamp core integrated lamp bead 14, a semiconductor refrigeration sheet 15 and an integrated plate 2, wherein the integrated plate 2 comprises a heat pipe 21, a substrate 22 and a plate cover 23, and the plate cover 23 is fixedly connected with the hot end of the semiconductor refrigeration sheet 15 through a heat-conducting adhesive; the LED lamp core integrated lamp beads 14 are fixedly packaged with the semiconductor refrigerating sheet 15 through heat conducting glue; the substrate 22 is hermetically connected with the plate cover 23, and grooves which are mutually communicated are formed in the substrate 22 and the plate cover 23 to form a closed heat conducting cavity; an opening 8 is formed in the side face of the substrate 22, and the evaporation end 6 of the heat pipe 21 is embedded into the substrate 22 through the opening 8 and extends into the heat conducting cavity.
The device reasonably combines semiconductor refrigeration and heat dissipation, phase-change material heat storage and heat dissipation, heat dissipation of the heat pipe fins and forced air cooling and heat dissipation of the fan together, and has compact structure and convenient installation; when the LED lamp core integrated lamp bead 14 works, the LED chip is directly and actively cooled through the semiconductor refrigerating sheet 15, and the phase-change material in the heat conduction cavity absorbs the heat at the hot end of the semiconductor refrigerating sheet 15; the heat pipe 21 transfers the heat of the phase change material from the evaporation end 6 to the condensation end 5, and dissipates the heat through the fins 4, and finally, the fan 1 performs forced air cooling to dissipate the heat. The LED heat dissipation device has the advantages that the heat dissipation capacity is effectively improved, the LED heat dissipation device is efficient and environment-friendly, the maintenance is simple, the LED heat accumulation can be prevented, the LED is ensured to be in a good working temperature environment, the working performance of the LED is improved, the reliability is improved, and the service life is prolonged.
The heat conduction cavity is filled with phase-change materials, and the evaporation end 6 of the heat pipe 21 is arranged in the heat conduction cavity and is coated by the phase-change materials; the heat pipe 21 is in a U-shaped structure, and the condensation end 5 of the heat pipe 21 extends out of the integration plate 2 through the opening 8 of the heat pipe 22 and is parallel to the substrate 22; a fin 4 is arranged on the condensation end 5 of the heat pipe 21; the distribution density of the fins 4 is in a multi-stage mode, and the density is gradually reduced along the direction far away from the surface of the attached heat pipe 21; the bottom surface of the groove of the plate cover 23 is provided with a support column 13, the support column 13 is in contact with the bottom surface of the groove of the substrate 22 and is used for supporting the groove parts of the substrate 22 and the plate cover 23 and preventing the deformation and dent damage of the groove caused by uneven stress on the outer surface of the groove; the base plate 22 is provided with a connecting column 9 fixedly matched with the fan 1, and the connecting column 9 is provided with a first tapping screw hole 10; the phase-change material is a mixture of paraffin, graphite powder and metal powder; the heat pipe 21 is a sintered copper bar heat pipe; the fin 4 is made of copper.
The fin 4 is fixedly connected to the condensation end 5 of the heat pipe 21 through heat conducting glue;
the heat on the fins 4 is forced air cooled by the fan 1.
The middle of the upper surface of the substrate 22 is provided with a groove, the length and width of the groove are determined according to the size and height of the LED lamp wick integrated lamp bead 14 and the thickness of the substrate 22, and the distance from the bottom surface of the groove to the bottom surface of the substrate 22 is 2 mm.
The fan 1 is screwed into the first tapping screw hole 10 by a cross head groove cylindrical head screw to be fixed with the base plate 22.
As shown in fig. 7 and 8, the invention further comprises a lampshade 3 for mounting the LED lamp core integrated lamp beads 14, the semiconductor refrigeration sheet 15 and the integrated plate; LED wick integrated lamp pearl 14 is the same with 15 sizes of semiconductor refrigeration piece, and is little than plate cover 23 size, integrated board 2 is provided with eight tapping screws according to 3 screw positions of lamp shade and size. The contact part of the lampshade 3 and the LED lamp core integrated lamp bead 14 is provided with a mounting opening, the length and the width of the mounting opening 19 are the same as those of the LED lamp core integrated lamp bead 14, the height is the sum of the heights of the LED lamp core integrated lamp bead 14 and the semiconductor refrigerating piece 15, and the mounting opening is used for mounting the LED lamp core integrated lamp bead 14 and the semiconductor refrigerating piece 15; the lampshade 3 is provided with a clamping groove 20 with the same size as the plate cover 23, and the plate cover 23 is partially embedded into the clamping groove 20 to ensure that the integration plate 2 and the lampshade 3 are completely matched and fixed; the LED lamp core integrated lamp beads 14 are fixedly packaged with the semiconductor refrigerating sheet 15 through heat conducting glue, the semiconductor refrigerating sheet 15 is further fixed with the surface of the plate cover 23 through the heat conducting glue, and the LED lamp core integrated lamp beads, the semiconductor refrigerating sheet and the plate cover form a whole and then are reasonably matched with the corresponding structure of the lampshade 3; the lampshade 3 is fixed with the integrated board 2 through a cross head groove cylindrical head screw;
the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents and are included in the scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010025778.3A CN111120975A (en) | 2020-01-10 | 2020-01-10 | A heat dissipation device based on the combination of a PCM fin heat pipe integrated board and a semiconductor refrigeration sheet and its realization method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010025778.3A CN111120975A (en) | 2020-01-10 | 2020-01-10 | A heat dissipation device based on the combination of a PCM fin heat pipe integrated board and a semiconductor refrigeration sheet and its realization method |
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| Publication Number | Publication Date |
|---|---|
| CN111120975A true CN111120975A (en) | 2020-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010025778.3A Pending CN111120975A (en) | 2020-01-10 | 2020-01-10 | A heat dissipation device based on the combination of a PCM fin heat pipe integrated board and a semiconductor refrigeration sheet and its realization method |
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| CN (1) | CN111120975A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112097221A (en) * | 2020-09-23 | 2020-12-18 | 济南得德环保科技有限公司 | LED headlight bulb system with semiconductor refrigeration and heat pipe double heat dissipation |
| CN112097148A (en) * | 2020-10-16 | 2020-12-18 | 太仓欣华盈电子有限公司 | Lamp heat dissipation device and lamp |
| CN113669679A (en) * | 2021-08-31 | 2021-11-19 | 郑州轻工业大学 | Energy-saving control method of illumination street lamp with monitoring function |
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| CN102338363A (en) * | 2011-09-19 | 2012-02-01 | 浙江工业大学 | Split-type radiator for integrated high-power light-emitting diode (LED) automobile lamp |
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN107507811A (en) * | 2017-07-24 | 2017-12-22 | 华南理工大学 | The chip cooling cooling device that a kind of flat-plate heat pipe cluster couples with semiconductor refrigerating |
| CN209627965U (en) * | 2018-12-08 | 2019-11-12 | 周哲明 | A kind of phase-change heat equipment |
| CN211650172U (en) * | 2020-01-10 | 2020-10-09 | 广东工业大学 | Heat dissipation device based on combination of PCM fin heat pipe integrated plate and semiconductor refrigeration piece |
-
2020
- 2020-01-10 CN CN202010025778.3A patent/CN111120975A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338363A (en) * | 2011-09-19 | 2012-02-01 | 浙江工业大学 | Split-type radiator for integrated high-power light-emitting diode (LED) automobile lamp |
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN107507811A (en) * | 2017-07-24 | 2017-12-22 | 华南理工大学 | The chip cooling cooling device that a kind of flat-plate heat pipe cluster couples with semiconductor refrigerating |
| CN209627965U (en) * | 2018-12-08 | 2019-11-12 | 周哲明 | A kind of phase-change heat equipment |
| CN211650172U (en) * | 2020-01-10 | 2020-10-09 | 广东工业大学 | Heat dissipation device based on combination of PCM fin heat pipe integrated plate and semiconductor refrigeration piece |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112097221A (en) * | 2020-09-23 | 2020-12-18 | 济南得德环保科技有限公司 | LED headlight bulb system with semiconductor refrigeration and heat pipe double heat dissipation |
| CN112097148A (en) * | 2020-10-16 | 2020-12-18 | 太仓欣华盈电子有限公司 | Lamp heat dissipation device and lamp |
| CN113669679A (en) * | 2021-08-31 | 2021-11-19 | 郑州轻工业大学 | Energy-saving control method of illumination street lamp with monitoring function |
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