CN211378617U - Radiator for electronic product - Google Patents

Abstract

The utility model discloses a radiator for electronic products, which aims to provide a radiator which increases convection heat exchange while conducting heat dissipation, so as to improve the heat exchange efficiency, with simple structure and light equipment. It includes an integrated metal radiating body and a fin type radiating structure, and the metal radiating body is a porous structure; the metal radiating body includes a metal surrounding plate, and the metal surrounding plates are separated into a porous structure by a void skeleton. The metal heat sink, the connector and the fin-type heat sink structure are formed by 3D printing. The radiator of the utility model adopts the porous metal material heat dissipation system as the carrier to contact the electronic product, increases the convection heat exchange while conducting heat dissipation, strengthens the heat exchange effect, and improves the heat exchange efficiency. At the same time, due to the design of the porous structure, the weight of the radiator is reduced, and the structure is simpler and lighter.

Description

An electronic product radiator

technical field

The utility model relates to the field of electronic technology, in particular to a novel radiator for electronic products using porous metal materials as carriers.

Background technique

With the continuous advancement of electronic technology, the demand for power of electronic components is increasing, and the accompanying problem is that the heat generated by the components increases. At the same time, in order to meet the needs of portability and other uses, the volume of electronic components tends to be miniaturized, the integration degree of electronic chips is improved, and the density per unit area is also higher and higher. Therefore, electronic products generate more and more heat during operation. The accumulation of heat causes electronic products to be placed in an excessively high temperature environment, causing electronic components to generate electronic dissociation and thermal stress, which reduces the overall stability and shortens the life of the electronic components themselves.

In order to reduce the ambient temperature of electronic devices, special heat sinks are required to dissipate heat from electronic products. At present, the radiator used for heat dissipation of electronic products is mainly made of a solid thermal conductor at the junction of the electronic device as a carrier, which is combined with a heat sink. The thermal conductor and the electronic device mainly rely on heat conduction to dissipate heat. . At the same time, the solid thermal conductor adds weight to the electronic product. In addition, since the heat conductor and the heat sink are metal materials, they are often fixedly connected by welding, and the thermal resistance at the node is large, which affects the heat dissipation effect.

Utility model content

The purpose of the utility model is to provide a radiator for electronic products with simple structure and lightweight equipment while increasing convection heat exchange while conducting heat dissipation to improve the heat exchange efficiency, aiming at the technical defects existing in the prior art.

The technical scheme adopted for realizing the purpose of the present utility model is:

A radiator for electronic products, comprising an integrated metal radiator and a fin-type radiator structure, the metal radiator is a porous structure; the metal radiator comprises a metal enclosure, and the metal enclosures are separated by a void skeleton into a porous structure.

The metal enclosure is square, and the four corners of the metal enclosure are respectively connected with connecting bodies, and the connecting bodies are arranged in a divergent shape; The primary fins and the secondary fins are respectively arranged between two adjacent connecting bodies; the primary fins are connected with the adjacent connecting bodies and metal enclosures; The secondary fins are connected to the adjacent primary fins or connecting bodies.

The connecting body is provided with fixed mounting holes.

The metal heat dissipation body, the connecting body and the fin type heat dissipation structure are formed by 3D printing.

Compared with the prior art, the beneficial effects of the present utility model are:

1. The electronic product radiator of the present invention uses a porous metal material heat dissipation system as a carrier to contact the electronic product, which increases convection heat exchange while conducting heat dissipation, strengthens the heat exchange effect, and improves the heat exchange efficiency. At the same time, due to the design of the porous structure, the weight of the radiator is reduced, and the structure is simpler and lighter.

2. The electronic product radiator of the present invention is connected with the fin type heat dissipation structure through the connecting body. The connecting body is arranged in a divergent shape, which not only supports the whole system but also plays a role of heat conduction, which further improves the heat dissipation efficiency. .

3. The radiator of the present invention adopts integrated 3D printing as a whole, thereby effectively solving the problem of difficulty in heat exchange due to the large thermal resistance at the nodes, and improving the heat exchange efficiency.

Description of drawings

Fig. 1 shows the structural representation of the radiator of the electronic product of the present invention;

FIG. 2 is a diagram showing the use state of the electronic product radiator of the present invention.

Detailed ways

The present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

The electronic product radiator of the utility model comprises an integrated metal radiator body and a fin type radiator structure, and the metal radiator body is a porous structure. A schematic diagram of a specific structure is shown in FIG. 1 , the metal heat sink includes a metal enclosure plate 1 , and the metal enclosure plates 1 are separated into a porous structure by a void skeleton 5 . In this embodiment, the metal enclosure plate 1 is square, and the four corners of the metal enclosure plate 1 are respectively connected with connecting bodies 2, and the connecting bodies 2 are arranged in a divergent shape; the fin type heat dissipation structure consists of The first-level fins 3 and the second-level fins 4 are staggered; the first-level fins 3 and the second-level fins 4 are respectively provided between the two adjacent connecting bodies 2; the first-level fins 3 is connected to the adjacent connecting body 2 and the metal enclosure plate 1 . The secondary fins 4 are connected to the adjacent primary fins 3 or the connecting body 2 .

The connecting body 2 is provided with fixed mounting holes.

In order to avoid the influence of heat dissipation due to the thermal resistance of the nodes, the metal heat dissipation body, the connecting body 2 and the fin type heat dissipation structure are formed by 3D printing.

When in use, the metal heat sink of the electronic product heat sink 7 of the present invention is installed in contact with the chip 6 . When the temperature of the electronic components rises, the heat is first transferred to the metal heat sink in contact with it, a part of which is directly transferred into the environment through convection heat exchange, and the other part is transferred to the connecting body 2 through heat conduction, and then enters the first-level fins 3. Heat conduction and convective heat exchange occur in the primary fins 3, part of the heat is dissipated into the environment, and the other part is transferred to the secondary fins 4 again. . The connecting body 2 not only supports the whole system, but also plays a role of heat conduction. The connecting body 2 is fixed with screws through the fixing and mounting holes around it. The heat dissipated into the environment is carried out using a conventional fan 8 . The radiator of the utility model adopts a porous structure, and the porous structure has the advantages of high specific surface area, high permeability, high mechanical strength, etc., and has important practical significance for reducing the volume of the heat exchanger, reducing the quality of equipment, and strengthening heat exchange.

The above are only the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, some improvements and modifications can be made without departing from the principles of the present invention. Improvement and modification should also be regarded as the protection scope of the present invention.

Claims (4)

1. The electronic product radiator is characterized by comprising an integrated metal radiator and a rib type radiating structure, wherein the metal radiator is of a porous structure; the metal radiator comprises metal enclosing plates, and the metal enclosing plates are separated into porous structures through a gap framework.

2. The heat sink for electronic products as claimed in claim 1, wherein the metal enclosure is square, and four corners of the metal enclosure are respectively connected with connectors, and the connectors are arranged in a scattered manner; the rib type heat dissipation structure consists of primary ribs and secondary ribs which are arranged in a staggered mode; the primary fins and the secondary fins are respectively arranged between two adjacent connectors; the first-stage fins are connected with the adjacent connectors and the metal enclosing plates; the second-level fins are connected with the adjacent first-level fins and the connecting body.

3. The heat sink for electronic products as claimed in claim 2, wherein the connecting body is provided with a fixing hole.

4. The electronic product heat sink as claimed in claim 2, wherein the metal heat sink, the connecting body and the finned heat sink structure are formed by 3D printing.

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