CN210807650U - Waterproof dustproof antivibration silicon material microphone - Google Patents
Waterproof dustproof antivibration silicon material microphone Download PDFInfo
- Publication number
- CN210807650U CN210807650U CN201921691182.6U CN201921691182U CN210807650U CN 210807650 U CN210807650 U CN 210807650U CN 201921691182 U CN201921691182 U CN 201921691182U CN 210807650 U CN210807650 U CN 210807650U
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- casing
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- dustproof
- shell
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Abstract
The utility model discloses a waterproof dustproof antivibration silicon material microphone, include PCB, install ASIC chip and MEMS chip on the PCB to and the casing, the top of casing is equipped with the sound inlet hole, the top inboard of casing is equipped with protection film and solid fixed ring, the protection film is for covering the dustproof and waterproof antivibration membrane of nanometer in sound inlet hole, gu fixed ring will the protection film compresses tightly to be fixed the top of casing. The utility model discloses a to enter the sound hole and establish at the casing top to set up the protection film in casing top inboard, can protect the microphone to avoid coming from external environmental pollution. The protective film is a nano dustproof and waterproof anti-vibration film, so that the microphone with common design can reach a three-prevention level on the premise of no influence on performance. The inner side of the top of the shell is also provided with a fixing ring for compressing and fixing the protective film, so that the protective film is tightly connected with the shell, and the protective film is prevented from tilting and falling off.
Description
Technical Field
The utility model relates to a microphone technical field, concretely relates to waterproof dustproof antivibration silicon material microphone.
Background
A silicon microphone, i.e., an MEMS (micro electro mechanical Systems) microphone, is an electric transducer manufactured by using a micromachining technology, and has the characteristics of small volume, good frequency response, low noise, and the like. With the development of miniaturization and thinning of electronic devices, MEMS microphones are increasingly widely used for these devices.
A silicon microphone generally includes a PCB (Printed Circuit Board), a case, a MEMS chip, an ASIC (Application Specific Integrated Circuit) chip, and other components, wherein the PCB and the case enclose a housing space, and the MEMS chip and the ASIC chip are housed in the housing space.
The casing or the PCB of the silicon microphone needs to be provided with a sound inlet, and external water, gas and dust can enter the MEMS microphone through the sound inlet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a waterproof dustproof antivibration silicon material microphone solves traditional silicon microphone and is easily by environmental pollution's problem.
In order to solve the technical problems, the technical scheme is as follows:
the utility model provides a waterproof dustproof antivibration silicon material microphone, includes PCB, installs ASIC chip and MEMS chip on the PCB to and the casing, PCB with the casing encloses synthetic holding the accommodation space of ASIC chip and MEMS chip, the top of casing is equipped with the sound inlet, the top inboard of casing is equipped with the protection film and solid fixed ring, the protection film is for covering the dustproof and waterproof antivibration membrane of nanometer of sound inlet, gu fixed ring will the protection film compresses tightly to be fixed the top of casing.
Optionally, fixed ring is the ring of metal or plastic material, pastes through bonding material and fixes the top of casing is inboard, a part of protection film is located fixed ring with between the top of casing.
Optionally, the protective film is fixed to the inner side of the top of the housing by bonding material.
Optionally, the nano dustproof and waterproof vibration-proof membrane comprises two layers, wherein one layer is an expanded polytetrafluoroethylene ePTFE membrane, and the other layer is an oleophobic material.
Optionally, the MEMS chip and the ASIC chip are connected by gold wires, and the ASIC chip is mounted on the PCB in a BGA manner.
Optionally, a pad of the waterproof and dustproof silicon microphone for electrically connecting with the outside is disposed on a surface of the PCB facing away from the housing.
According to the technical solution provided by the utility model, the embodiment of the utility model has the following advantage:
the microphone can be protected from environmental pollution from the outside by arranging the sound inlet hole at the top of the shell and arranging the protective film at the inner side of the top of the shell. The protective film is a nano dustproof and waterproof anti-vibration film (namely a nano three-prevention film), so that the microphone with common design can reach a three-prevention level on the premise of no influence on performance. The inner side of the top of the shell is also provided with a fixing ring for compressing and fixing the protective film, so that the protective film is tightly connected with the shell, and the protective film is prevented from tilting and falling off.
Drawings
In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings used in the description of the embodiment will be briefly introduced below.
Fig. 1 is a schematic structural view of a waterproof, dustproof, and anti-vibration silicon microphone according to an embodiment of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
The following will explain details by way of specific examples.
Referring to fig. 1, an embodiment of the present invention provides a waterproof, dustproof and anti-vibration silicon microphone 10 (hereinafter, referred to as a silicon microphone or a microphone for short).
The silicon microphone 10 includes a housing 12, a PCB11 enclosing a receiving space with the housing 12, and an ASIC chip 14 and a MEMS chip 13 mounted on the PCB11, and the ASIC chip 14 and the MEMS chip 13 are received in the receiving space.
The housing 12 and the PCB11 are attached together to form a package structure, and a chip accommodating space is formed inside the package structure. The housing 12 is made of metal material to ensure the electromagnetic shielding effect of the package structure. The housing 12 and the PCB11 are secured to one another and electrically connected. Alternatively, the housing 12 and the PCB11 may be secured to one another by conductive glue or solder paste, or the like.
The housing 12 may include a top portion opposite the PCB11 and side wall portions extending from peripheral edges of the top portion in a direction toward the PCB. The side wall portions and the top portion define a semi-enclosed structure, and the PCB11 is fixed at the open end of the housing 12, which together form a package structure having a receiving space.
The MEMS chip 13 and the ASIC chip 14 are located in the closed housing space and mounted on the PCB 11. The MEMS chip 13 is a transducer for converting a sound signal into an electrical signal, and the MEMS chip 13 is manufactured by a MEMS (micro electro mechanical system) process. The MEMS chip and the ASIC chip are connected together, so that the electric signal output by the MEMS chip can be transmitted into the ASIC chip, processed and output by the ASIC chip.
The MEMS chip 13 and the ASIC chip 14 can be connected by gold wires 16, or can be connected by a flip-chip method through a circuit pattern in the PCB11, which is not described in detail herein.
In this embodiment, the top of the housing 12 is provided with a sound inlet hole 15 for sound to enter. External sound gets into in the accommodation space for the vibrating diaphragm sound production vibration of MEMS chip, MEMS chip is the signal of telecommunication with vibration signal conversion.
Wherein, a protective film 17 covering the sound inlet hole 15 is arranged on the inner side of the top of the shell 12. The protective film 17 may be bonded to the top inner side of the housing 12 by a bonding material such as a self-adhesive glue or glue. Alternatively, the protective film 17 may be circular, square, or other shapes. The protective film is used for preventing environmental pollution such as external water, gas, dust and the like from entering the silicon microphone.
The present embodiment preferably employs a nano dustproof and waterproof anti-vibration film (nano three-proof film) as the protective film. Optionally, the nano dustproof and waterproof vibration-proof membrane comprises two layers, wherein one layer is an expanded polytetrafluoroethylene (ePTFE) membrane, and the other layer is an oleophobic material, such as silicon dioxide.
Further, in order to ensure that the protective film 17 is firmly adhered to the inner side of the top of the shell 12, a fixing ring 18 is further provided, and the fixing ring 18 is used for pressing and fixing the protective film 17 on the top of the shell.
Optionally, the fixed ring 18 is a ring made of metal or plastic, and is fixed on the inner side of the top of the casing 12 through bonding material adhesion, and a part of the protective film 17 is located between the fixed ring 18 and the top of the casing 12.
Optionally, the MEMS chip 13 and the ASIC chip 14 are connected by gold wires, and the ASIC chip 14 is mounted on the PCB11 in a BGA manner.
The PCB11 has a first side for mounting the housing 12 and the MEMS chip 13 with the ASIC14 chip, and a second side facing away from the housing 12.
In this embodiment, pads 19 of the silicon microphone for electrical connection to the outside are provided on the side of the PCB11 facing away from the housing 12, i.e. the second side.
The pads 18 are pads that can be mounted by an SMT (Surface Mounting Technology) process.
In the silicon microphone with the above structure, since the pad (pad) having the SMT function is disposed on the surface of the PCB away from the case 12 and the protection film 17 is disposed on the case 12, the automatic mounting is not affected. The silicon microphone of the scheme can realize excellent waterproof, dustproof and anti-vibration performance, and has the advantages of low price, capability of being assembled in advance in a microphone factory and the like.
Optionally, a damping material is further disposed on the top outer side of the housing 12, and the damping material has a smaller damping effect on the sound signals within the specific frequency range and a larger damping effect on the sound signals outside the specific frequency range.
To sum up, the embodiment of the utility model provides a waterproof dustproof antivibration silicon material microphone is established at the casing top through will advancing the sound hole to set up the protection film in casing top inboard, can protect the microphone to avoid coming from external environmental pollution. The protective film is a nano dustproof and waterproof anti-vibration film (namely a nano three-prevention film), so that the microphone with common design can reach a three-prevention level on the premise of no influence on performance. The inner side of the top of the shell is also provided with a fixing ring for compressing and fixing the protective film, so that the protective film is tightly connected with the shell, and the protective film is prevented from tilting and falling off.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; those of ordinary skill in the art will understand that: the technical solutions described in the above embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (5)
1. A waterproof dustproof anti-vibration silicon material microphone comprises a PCB, an ASIC chip and an MEMS chip which are arranged on the PCB, and a shell, wherein the PCB and the shell enclose a containing space for containing the ASIC chip and the MEMS chip,
the top of casing is equipped with the sound inlet, the top inboard of casing is equipped with protection film and solid fixed ring, the protection film is for covering the dustproof and waterproof anti-vibration membrane of nanometer in sound inlet, gu fixed ring will the protection film compresses tightly to be fixed the top of casing.
2. The waterproof dustproof anti-vibration silicon material microphone as claimed in claim 1,
the fixed ring is a circular ring made of metal or plastic materials and is fixed on the inner side of the top of the shell through bonding materials, and one part of the protective film is located between the fixed ring and the top of the shell.
3. The waterproof dustproof anti-vibration silicon material microphone as claimed in claim 1,
the protective film is fixed on the inner side of the top of the shell through bonding materials in a sticking mode.
4. The waterproof dustproof anti-vibration silicon material microphone as claimed in claim 1,
the nanometer dustproof and waterproof vibration-proof membrane comprises two layers, wherein one layer is an expanded polytetrafluoroethylene ePTFE thin film, and the other layer is an oleophobic material.
5. The waterproof dustproof anti-vibration silicon material microphone as claimed in claim 1,
the MEMS chip and the ASIC chip are connected through gold wires, and the ASIC chip is installed on the PCB in a BGA mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921691182.6U CN210807650U (en) | 2019-10-10 | 2019-10-10 | Waterproof dustproof antivibration silicon material microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921691182.6U CN210807650U (en) | 2019-10-10 | 2019-10-10 | Waterproof dustproof antivibration silicon material microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210807650U true CN210807650U (en) | 2020-06-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921691182.6U Expired - Fee Related CN210807650U (en) | 2019-10-10 | 2019-10-10 | Waterproof dustproof antivibration silicon material microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210807650U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113371669A (en) * | 2021-05-06 | 2021-09-10 | 日月光半导体制造股份有限公司 | Semiconductor structure and manufacturing method thereof |
-
2019
- 2019-10-10 CN CN201921691182.6U patent/CN210807650U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113371669A (en) * | 2021-05-06 | 2021-09-10 | 日月光半导体制造股份有限公司 | Semiconductor structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200619 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |