CN210629859U - Novel anti-radio frequency interference micro-electro-mechanical system microphone structure - Google Patents
Novel anti-radio frequency interference micro-electro-mechanical system microphone structure Download PDFInfo
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- CN210629859U CN210629859U CN201921799069.XU CN201921799069U CN210629859U CN 210629859 U CN210629859 U CN 210629859U CN 201921799069 U CN201921799069 U CN 201921799069U CN 210629859 U CN210629859 U CN 210629859U
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- 239000000758 substrate Substances 0.000 claims abstract description 46
- 229910052710 silicon Inorganic materials 0.000 claims description 36
- 239000010703 silicon Substances 0.000 claims description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 35
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000001914 filtration Methods 0.000 abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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Abstract
The embodiment of the utility model discloses a novel anti-radio frequency interference micro-electromechanical system microphone structure, which comprises a PCB substrate, an MEMS chip encapsulated on the top surface of the PCB substrate, a radio frequency filter, the bottom of the radio frequency filter is arranged on the top surface of the PCB substrate through a bonding pad and is positioned at one side of the MEMS chip, an ASIC chip arranged on the top surface of the radio frequency filter, the input end of the ASIC chip is connected with the output end of the MEMS chip, a shell is covered on the outer sides of the MEMS chip, the radio frequency filter and the ASIC chip, the MEMS chip, the radio frequency filter and the ASIC chip are reasonably distributed, the area and the space on the PCB substrate are utilized to the maximum extent, the occupied space is saved, the structure is simple, the radio frequency filter can easily achieve the filtering effect, the traditional gold wire connection is omitted, the circuit board layout is clear and concise, the manufacturing process is simplified, the subsequent overhaul and updating are convenient, and the cost is reduced.
Description
Technical Field
The utility model relates to an electron device field especially relates to a novel anti radio frequency interference's micro-electromechanical system microphone structure.
Background
A mems microphone translates into a sound sensor, which acts as a microphone (microphone). It is used to receive sound waves and display a vibration image of the sound, but it is not possible to measure the intensity of the noise. The sensor has a built-in electret condenser microphone that is sensitive to sound. The sound waves vibrate the electret film in the microphone, resulting in a change in capacitance, which generates a minute voltage that changes in response thereto. This voltage is then converted to a voltage of 0-5V, received by the data collector via A/D conversion, and transmitted to the computer.
One drawback of MEMS microphones is Radio Frequency (RF) interference. Sources of radio frequency interference are: cell phones, interphones, and the like; if the radio frequency interference is caused in a special place, for example, X-ray machines, gamma knives, CT machines and other equipment in hospitals can bring strong RF interference.
To prevent this proximity effect, system designers must place the microphone away from the device antenna and isolate its power supply to mitigate radio frequency interference. This often sacrifices the design aesthetics of the product.
In order to combat radio frequency interference, a traditional mems microphone generally employs a method of embedding a resistor and a capacitor on a PCB substrate to achieve radio frequency filtering, and the embedded resistor and capacitor has limited capacity, high manufacturing cost and complex manufacturing.
Disclosure of Invention
An object of the utility model is to provide a novel anti radio frequency interference's micro electromechanical system microphone structure, solve above technical problem.
The utility model provides a technical problem can adopt following technical scheme to realize:
a novel anti-RF interference micro-electro-mechanical system microphone structure comprises
A PCB substrate;
the MEMS chip is packaged on the top surface of the PCB substrate;
the bottom of the radio frequency filter is provided with a bonding pad, and the radio frequency filter is arranged on the top surface of the PCB substrate and positioned on one side of the MEMS chip through the bonding pad;
the ASIC chip is arranged on the top surface of the radio frequency filter, and the input end of the ASIC chip is connected with the output end of the MEMS chip;
and the shell is fixed on the top surface of the PCB substrate and covers the MEMS chip, the radio frequency filter and the ASIC chip.
Preferably, the PCB substrate is a double-layer circuit board, and a bonding pad is arranged at the bottom of the PCB substrate.
Preferably, the MEMS chip includes a silicon diaphragm and a silicon back electrode, the silicon diaphragm is parallel to the silicon back electrode, and the silicon diaphragm and the silicon back electrode form a parallel plate capacitor.
Preferably, a sound transmission cavity is arranged between the silicon diaphragm and the PCB substrate.
Preferably, the bottom end of the MEME chip is hermetically sealed and packaged on the top surface of the PCB substrate.
Preferably, the radio frequency filter is packaged on the top surface of the PCB substrate by using a CSP packaging technology, and the bottom end of the radio frequency filter is connected to the circuit on the top surface of the PCB substrate through a pad.
Preferably, the housing is made of metal.
Preferably, the PCB substrate or the housing is provided with a sound hole.
Has the advantages that: the utility model discloses a MEMS chip, radio frequency filter and ASIC chip on the micro-electromechanical system microphone are reasonable in distribution, and the maximize utilizes face base and space on the PCB base plate, has saved occupation space, simple structure, and radio frequency filter can easily reach the effect of filtering, has left traditional gold thread and has connected, and the circuit board overall arrangement is clear succinct, has simplified manufacturing process, and makes things convenient for subsequent maintenance and update, the cost is reduced.
Drawings
Fig. 1 is a schematic cross-sectional view of a mems microphone structure according to the present invention.
In the figure: 1-a PCB substrate; 2-a MEMS chip; 3-a radio frequency filter; 4-an ASIC chip; 5-a sound hole; 6-a pad; 7-a first signal line; 8-a second signal line;
21-a silicon diaphragm; 22-silicon back electrode; 23-sound transmission cavity.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be further described with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.
As shown in FIG. 1, the present invention provides a novel anti-RF interference MEMS microphone structure, which comprises
The PCB comprises a PCB substrate 1, wherein a sound hole 5 is formed in the PCB substrate 1, and the sound hole 5 is used for transmitting sound; a sound hole 5 may also be provided in the housing 9 to transmit sound to the outside of the headset.
The MEMS chip 2 is packaged on the top surface of the PCB substrate 1 and is positioned at the top end of the sound hole, and the MEMS chip is used for receiving sound and generating a corresponding audio signal according to sound vibration;
the radio frequency filter 3 is arranged on the bottom of the radio frequency filter 3, the radio frequency filter 3 is arranged on the top surface of the PCB substrate through a bonding pad 6, is packaged on the top surface of the PCB substrate 1 and is positioned on one side of the MEMS chip 2, and the radio frequency filter 3 is connected to the output end of an electric signal to filter the radio frequency signal, so that the output tone quality is purer;
the ASIC chip 4 is packaged on the top surface of the radio frequency filter 3, the input end of the ASIC chip 4 is connected with the output end of the MEMS chip 2, and the output end of the ASIC chip 4 is connected with a circuit of the PCB substrate 1; the ASIC chip is an Integrated Circuit (ASIC) chip technology for special applications, and functions to convert and amplify a high-resistance audio electrical signal transmitted from the MEMS chip 2 into a low-resistance electrical signal, which is then transmitted to a radio frequency filter, filtered by an RF anti-noise Circuit, and output an electrical signal matched with a front-end Circuit, thereby completing the acoustic-electrical conversion. And the electric signals are read, so that the voice is identified. The right section of the shell 9 is inverted U-shaped, and the shell 9 is provided with a U-shaped section. The MEMS microphone protection device is fixed on the top surface of the PCB substrate and covers the outer sides of the MEMS chip 2, the radio frequency filter 3 and the ASIC chip 4, and the shell 9 serves as a protection device of the MEMS microphone, so that the MEMS microphone protection device plays a certain role in sealing, moisture protection and external force prevention, and the service life of the internal structure of the MEMS microphone is prolonged.
The utility model has the advantages that: the MEMS chip, the radio frequency filter and the ASIC chip on the PCB substrate are reasonably distributed, the surface base and the space on the PCB substrate are utilized to the maximum extent, the occupied space is saved, the structure is simple, the radio frequency filter can easily achieve the filtering effect, the traditional gold thread connection is omitted, the circuit board layout is clear and concise, the manufacturing process is simplified, the subsequent overhaul and the updating are convenient, and the cost is reduced.
As a preferred embodiment of the present invention, the PCB substrate 1 is a double-layer circuit board. The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection. The design of the double-layer PCB enables the circuit arrangement to be more compact, and the space is saved. The bottom of the PCB substrate 1 is provided with a pad which is welded inside the shell.
As a preferred embodiment of the present invention, the MEMS chip 2 includes a silicon diaphragm 21 and a silicon back electrode 22, the silicon diaphragm 21 is parallel to the silicon back electrode 22, and the silicon diaphragm 21 and the silicon back electrode 22 form a parallel plate capacitor. A power line is connected to each of the silicon back electrode 22 and the silicon diaphragm 21, so that a certain voltage is generated between the silicon back electrode 22 and the silicon diaphragm 21. When the silicon diaphragm 21 moves, the distance between the silicon diaphragm 21 and the silicon back electrode 22 changes, and the capacitance changes, so that the sound pressure signal is converted into an electric signal.
As a preferred embodiment of the present invention, a sound transmission cavity 23 is provided between the silicon diaphragm 21 and the PCB substrate 1, and the sound hole 5 is communicated with the sound transmission cavity 23. The silicon diaphragm 21 is located on the top surface of the sound-transmitting cavity 23, i.e. the sound can immediately vibrate the silicon diaphragm 21 to generate a varying electrical signal after the sound enters the sound-transmitting cavity 23 from the sound hole 5.
The utility model discloses a micro-electromechanical system microphone working process does:
external sound enters the sound transmission cavity 23 from the sound hole 5, the silicon diaphragm 21 vibrates under the action of sound pressure, and the distance between the silicon diaphragm 21 and the silicon back electrode 22 is changed, so that the capacitance value is changed, and a sound signal is converted into an electric signal. The electric signal is transmitted to the ASIC chip 4 to convert and amplify the transmitted audio electric signal into a low-resistance electric signal, and then transmitted to the radio frequency filter 3, filtered by the RF anti-noise circuit, and output an electric signal matched with the front-end circuit, thus completing the sound-electricity conversion.
As a preferred embodiment of the utility model, the whole positive section of MEME chip 2 is the "U" font of inversion, and MEME chip 2's bottom seal encapsulates in PCB base plate 1's top surface, and other places are revealed to the benefit of seal encapsulation, make silicon vibrating diaphragm 21's sensitivity higher, have avoided the noise to appear. Dust is prevented from entering the MEMS chip 2 and the radio frequency filter 3.
As an optimized embodiment of the present invention, the rf filter 3 is packaged on the top surface of the PCB substrate 1 by the CSP packaging technique, which is more precise and saves the space of the circuit board and the whole mems microphone. The bottom end of the radio frequency filter 3 is connected with a circuit on the top surface of the PCB substrate 1 through a bonding pad 6, and the bonding pad 6 ensures the electrical connection between the radio frequency filter 3 and the circuit on the PCB substrate 1, so that the electric signal is ensured to enter the radio frequency filter 3 and then output after being filtered.
As a preferred embodiment of the present invention, the output terminal of the MEMS chip 2 is connected to the input terminal of the ASIC chip 4 through a first signal line 7. The first signal line 7 is used for transmitting the electrical signal output by the MEMS to the ASIC chip 4, so that the subsequent processing of the electrical signal by the ASIC chip 4 is facilitated.
As a preferred embodiment of the present invention, the output terminal of the ASIC chip 4 is connected to the circuit of the PCB substrate 1 through a second signal line 8. The second signal line 8 is used for transmitting the signal processed by the ASIC chip 4 to a circuit of the PCB substrate 1, and the signal of the PCB substrate 1 is converted by the radio frequency filter 3 to remove an interference signal in the signal and finally output a pure and recognizable signal.
As an optimized implementation mode, the shell 9 is made of metal material, so that the protection capability is stronger and the compression resistance is good.
The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and those skilled in the art should be able to realize the equivalent alternatives and obvious variations of the present invention.
Claims (8)
1. A novel anti-radio frequency interference micro-electro-mechanical system microphone structure is characterized by comprising a PCB substrate;
the MEMS chip is packaged on the top surface of the PCB substrate;
the bottom of the radio frequency filter is provided with a bonding pad, and the radio frequency filter is arranged on the top surface of the PCB substrate and positioned on one side of the MEMS chip through the bonding pad;
the ASIC chip is arranged on the top surface of the radio frequency filter, and the input end of the ASIC chip is connected with the output end of the MEMS chip;
and the shell is fixed on the top surface of the PCB substrate and covers the MEMS chip, the radio frequency filter and the ASIC chip.
2. The novel anti-radio frequency interference micro-electromechanical system microphone structure as claimed in claim 1, wherein the PCB substrate is a double-layer circuit board PCB substrate having pads on the bottom thereof.
3. The MEMS microphone structure of claim 1, wherein the MEMS chip comprises a silicon diaphragm and a silicon back electrode, the silicon diaphragm is parallel to the silicon back electrode, and the silicon diaphragm and the silicon back electrode form a parallel-plate capacitor.
4. The novel anti-radio frequency interference MEMS microphone structure as claimed in claim 3, wherein a sound transmission cavity is formed between the silicon diaphragm and the PCB substrate.
5. The MEMS microphone structure of claim 1, wherein the bottom of the MEMS chip is hermetically sealed to the top surface of the PCB substrate.
6. The novel anti-radio frequency interference micro-electromechanical system microphone structure as claimed in claim 1, wherein the radio frequency filter is packaged on the top surface of the PCB substrate by CSP, and the bottom end of the radio frequency filter is connected to the circuit on the top surface of the PCB substrate through a pad.
7. The mems microphone structure as recited in claim 1, wherein the housing is made of metal.
8. The mems microphone structure as claimed in claim 1, wherein the PCB substrate or the housing has a sound hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921799069.XU CN210629859U (en) | 2019-10-24 | 2019-10-24 | Novel anti-radio frequency interference micro-electro-mechanical system microphone structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921799069.XU CN210629859U (en) | 2019-10-24 | 2019-10-24 | Novel anti-radio frequency interference micro-electro-mechanical system microphone structure |
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| Publication Number | Publication Date |
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| CN210629859U true CN210629859U (en) | 2020-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921799069.XU Active CN210629859U (en) | 2019-10-24 | 2019-10-24 | Novel anti-radio frequency interference micro-electro-mechanical system microphone structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856090A (en) * | 2019-10-24 | 2020-02-28 | 钰太芯微电子科技（上海）有限公司 | Novel anti-radio frequency interference micro-electro-mechanical system microphone structure |
| CN113840218A (en) * | 2021-06-21 | 2021-12-24 | 荣成歌尔微电子有限公司 | Microphone packaging structure and electronic equipment |
-
2019
- 2019-10-24 CN CN201921799069.XU patent/CN210629859U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856090A (en) * | 2019-10-24 | 2020-02-28 | 钰太芯微电子科技（上海）有限公司 | Novel anti-radio frequency interference micro-electro-mechanical system microphone structure |
| CN110856090B (en) * | 2019-10-24 | 2024-12-27 | 钰太芯微电子科技（上海）有限公司 | A novel MEMS microphone structure that is resistant to radio frequency interference |
| CN113840218A (en) * | 2021-06-21 | 2021-12-24 | 荣成歌尔微电子有限公司 | Microphone packaging structure and electronic equipment |
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