CN210741196U - Heat superconducting heat exchange plate - Google Patents
Heat superconducting heat exchange plate Download PDFInfo
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- CN210741196U CN210741196U CN201921055265.6U CN201921055265U CN210741196U CN 210741196 U CN210741196 U CN 210741196U CN 201921055265 U CN201921055265 U CN 201921055265U CN 210741196 U CN210741196 U CN 210741196U
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Abstract
The utility model provides a hot superconductive heat transfer board, include: a first cover plate; the first frame is attached to one surface of the first cover plate; the second cover plate is attached to the surface, away from the first cover plate, of the first frame, so that a first sealing cavity is formed between the first cover plate and the second cover plate; the first guide plate is positioned in the first sealed cavity to form a sealed heat transfer channel in the first sealed cavity, and the sealed heat transfer channel is filled with a thermal superconducting heat transfer working medium; the second frame is attached to the surface, far away from the first guide plate, of the second cover plate; the third cover plate is attached to the surface, far away from the second cover plate, of the second frame, so that a second sealing cavity is formed between the second cover plate and the third cover plate; the second guide plate is positioned in the second sealed cavity to form a refrigerant channel in the second sealed cavity; the refrigerant inlet is positioned on the second frame; and the refrigerant outlet is positioned on the second frame. The utility model discloses a heat superconducting heat transfer board can make each regional temperature of whole face even, has the characteristics that heat conduction rate is fast, the temperature uniformity is good.
Description
Technical Field
The utility model belongs to the technical field of heat transfer, especially, relate to a heat superconducting heat transfer board.
Background
Most of the existing heat exchange plates adopt a composite aluminum plate of a single pipeline system, and a refrigerant enters from one end and flows out from the other end after flowing through a pipeline in the composite aluminum plate. The problems with the above heat exchanger plate include: because of the limitation of the heat conductivity coefficient of the aluminum material and the thickness of the composite aluminum plate, the heat conduction resistance of the existing heat exchange plate is large, and a refrigerant pipeline cannot cover the surface of the whole heat exchange plate, so that the temperature of the whole plate surface of the heat exchange plate is uneven, the local overheating or supercooling phenomenon exists, and the heat exchange area of the whole heat exchange plate cannot be fully exerted; the heat exchange area of the refrigerant pipeline is small, so that the energy efficiency of the heat exchange plate is low; in order to meet the required strength requirement, the thickness of the heat exchange plate is generally thicker, and the whole weight of the heat exchange plate is larger, so that the heat exchange plate is inconvenient to carry, install and use.
SUMMERY OF THE UTILITY MODEL
In view of the above disadvantages of the prior art, an object of the present invention is to provide a heat superconducting heat exchange plate, which is used for solving the problems of uneven surface temperature of the heat exchange plate, local overheating or overcooling phenomena of the heat exchange plate, and incapability of fully utilizing the heat exchange area of the whole heat exchange plate; the energy efficiency of the heat exchange plate is low; the thickness of the heat exchange plate is generally thicker, the whole weight of the heat exchange plate is larger, and the heat exchange plate is inconvenient to carry, install and use and the like.
In order to achieve the above objects and other related objects, the present invention provides a heat superconducting heat exchange plate, which includes:
a first cover plate;
the first frame is attached to one surface of the first cover plate;
the second cover plate is attached to the surface, away from the first cover plate, of the first frame, so that a first sealing cavity is formed between the first cover plate and the second cover plate;
the first guide plate is positioned in the first sealed cavity to form a sealed heat transfer channel in the first sealed cavity, and a thermal superconducting heat transfer working medium is filled in the sealed heat transfer channel;
the second frame is attached to the surface, far away from the first guide plate, of the second cover plate;
the third cover plate is attached to the surface, away from the second cover plate, of the second frame, so that a second sealing cavity is formed between the second cover plate and the third cover plate;
the second guide plate is positioned in the second sealed cavity so as to form a refrigerant channel in the second sealed cavity;
the refrigerant inlet is positioned on the second frame and communicated with the refrigerant channel;
and the refrigerant outlet is positioned on the second frame and communicated with the refrigerant channel.
Optionally, the height of the first baffle is the same as the thickness of the first frame, and the height of the second baffle is the same as the thickness of the second frame.
Optionally, the first guide plate includes a plurality of first guide strips arranged in parallel along a first direction, the first guide strips include a plurality of first protrusions arranged at intervals along a second direction, and bottoms of adjacent first protrusions in the second direction are integrally connected; the first direction is perpendicular to the second direction;
the second guide plate comprises a plurality of second guide strips arranged in parallel at intervals in the first direction, the second guide strips comprise a plurality of second convex parts arranged at intervals in the second direction, and the bottoms of the second convex parts are integrally connected and are adjacent to each other in the second direction.
Optionally, the first convex portions on two adjacent rows of the first guide strips are arranged in a one-to-one correspondence or staggered manner, and the second convex portions on two adjacent rows of the second guide strips are arranged in a one-to-one correspondence or staggered manner.
Optionally, the heat superconducting heat exchange plate further includes a first gas-liquid balance channel and a second gas-liquid balance channel, the first gas-liquid balance channel and the second gas-liquid balance channel are arranged at intervals on two opposite sides of the first guide plate along the first direction, and extend along the second direction, and the first gas-liquid balance channel and the second gas-liquid balance channel are both located between the second guide plate and the second frame.
Optionally, the second sealed chamber comprises a first chamber portion, a second chamber portion, and a third chamber portion; the first cavity part is parallel to the third cavity part, the second cavity part is perpendicular to the first cavity part and the third cavity part, and the second cavity part is communicated with the first cavity part and the third cavity part; the refrigerant inlet is communicated with the first cavity part, the refrigerant outlet is communicated with the third cavity part, the refrigerant inlet is located on one side, away from the second cavity part, of the first cavity part, and the refrigerant outlet is located on one side, away from the second cavity part, of the third cavity part.
Optionally, a liquid storage strip is further arranged in the second frame, and the liquid storage strip is located at a joint of the first cavity part and the second cavity part and located on an inner wall of the first cavity part, which is close to the third cavity part.
Optionally, a separating strip is further arranged in the second frame, one end of the separating strip is fixedly connected with the inner wall of the second frame, and the length of the separating strip is smaller than the size of the second sealed cavity along the length direction of the separating strip; the first cavity part and the third cavity part are respectively positioned at two opposite sides of the separating strip, and the second cavity part is positioned between the free end of the separating strip and the second frame; the liquid storage strip is positioned at the free end of the separation strip and is vertical to the separation strip.
Optionally, the second rim is a U-shaped rim and the second sealed chamber is a U-shaped chamber portion.
Optionally, in the superconducting heat exchange plate, the number of the second frames, the number of the third cover plate, the number of the second guide plates, the number of the refrigerant inlets and the number of the refrigerant outlets are all multiple, and the number of the second frames, the number of the third cover plate, the number of the second guide plates, the number of the refrigerant inlets and the number of the refrigerant outlets are the same; the second frames are arranged on the surface, far away from the first guide plate, of the second cover plate at intervals in parallel; the third cover plates are correspondingly attached to the surfaces, far away from the second cover plates, of the second frames to form a plurality of independent second sealed chambers; the second guide plate is positioned in each second sealed cavity; the refrigerant inlet and the refrigerant outlet are arranged on each second frame.
As described above, the utility model discloses a heat superconducting heat transfer board has following beneficial effect: the heat superconducting heat exchange plate of the utility model adopts the heat superconducting heat transfer technology, can ensure that the temperature of each area of the whole plate surface is uniform, and has the characteristics of high heat conduction rate and good temperature uniformity; the utility model has large heat transfer area of refrigerant in the heat superconducting heat transfer plate and higher energy efficiency; the utility model discloses an inside first sealed cavity and the sealed cavity of second that is of heat superconducting heat transfer board to set up first guide plate and second guide plate in first sealed cavity and the sealed cavity of second respectively, first guide plate and second guide plate play the additional strengthening promptly, make first apron, second apron and third cover plate thickness can the attenuate, the bearing capacity increases, intensity improves, alleviate the weight and the thickness of heat superconducting heat transfer board, increase inside heat transfer area again, strengthen heat superconducting heat-sinking capability.
Drawings
Fig. 1 is a schematic diagram illustrating an explosion structure of a heat superconducting heat exchange plate according to a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a heat superconducting heat exchange plate according to a first embodiment of the present invention.
Fig. 3 is a schematic top view of a first guide plate of a heat superconducting heat exchange plate according to a first embodiment of the present invention, the first guide plate being disposed in a first frame.
Fig. 4 is a schematic top view of a first heat superconducting plate according to an embodiment of the present invention, wherein a second frame of the first heat superconducting plate is attached to a surface of a second cover plate away from a first guide plate, and a second guide plate is disposed in the second frame.
Fig. 5 is a schematic diagram illustrating an explosion structure of a heat superconducting heat exchange plate according to a second embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a heat superconducting heat exchange plate according to a second embodiment of the present invention.
Fig. 7 is a schematic top view showing a second frame of the heat superconducting heat exchange plate according to the second embodiment of the present invention, the second frame is attached to a surface of the second cover plate away from the first guide plate, and the second guide plate is disposed in the second frame.
Fig. 8 is a schematic view showing an explosion structure of a heat superconducting heat exchange plate according to a third embodiment of the present invention.
Fig. 9 is a schematic structural diagram of a heat superconducting heat exchange plate according to a third embodiment of the present invention.
Fig. 10 is a schematic top view illustrating a second frame of the heat superconducting heat exchange plate according to the third embodiment of the present invention, the second frame is attached to a surface of the second cover plate away from the first flow guide plate, and the second flow guide plate is disposed in the second frame.
Description of the element reference numerals
1 heat superconducting heat exchange plate
10 first cover plate
11 first frame
111 filling opening
12 second cover plate
13 first sealed cavity
131 first gas-liquid balance channel
132 second gas-liquid equilibrium channel
14 first guide plate
141 first guide strip
142 first convex part
15 second frame
151 stock solution strip
152 division bar
16 third cover plate
17 second sealed chamber
171 first cavity part
172 second chamber portion
173 third chamber portion
18 second baffle
181 second diversion strip
182 second projection
191 refrigerant inlet
192 refrigerant outlet
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Please refer to fig. 1 to 10. It should be noted that the drawings provided in the present embodiment are only schematic and illustrative of the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
Example one
Referring to fig. 1 and 2, the present invention provides a heat superconducting heat exchange plate 1, where the heat superconducting heat exchange plate 1 includes: a first cover plate 10; the first frame 11, the first frame 11 is attached to one surface of the first cover plate 10; the second cover plate 12 is attached to the surface of the first frame 11 away from the first cover plate 10, so that a first sealed chamber 13 is formed between the first cover plate 10 and the second cover plate 12; a first guide plate 14, wherein the first guide plate 14 is located in the first sealed cavity 13 to form a sealed heat transfer channel (not shown) in the first sealed cavity 13, and the sealed heat transfer channel is filled with a thermal superconducting heat transfer working medium (not shown); the second frame 15 is attached to the surface of the second cover plate 12 away from the first baffle 14; a third cover 16, wherein the third cover 16 is attached to the surface of the second frame 15 away from the second cover 12, so as to form a second sealed chamber 17 between the second cover 12 and the third cover 16; a second baffle 18, wherein the second baffle 18 is located in the second sealed chamber 17, so as to form a refrigerant channel (not shown) in the second sealed chamber 17; the refrigerant inlet 191 is positioned on the second frame 15, and the refrigerant inlet 191 is communicated with the refrigerant channel; and a refrigerant outlet 192, wherein the refrigerant outlet 192 is located on the second frame 15, and the refrigerant outlet 192 is communicated with the refrigerant channel.
It should be noted that, because the inner side of the first frame 11 is a hollow area, after the first cover plate 10 and the second cover plate 12 are attached to two opposite surfaces of the first frame 11, the first sealed cavity 13 is formed inside the first cover plate 10, the second cover plate 12 and the first frame 11; similarly, since the inner side of the second frame 15 is a hollow region, the second cover plate 12 and the third cover plate 16 are attached to two opposite surfaces of the second frame 15, and then the second sealed chamber 17 is formed inside the second cover plate 12, the third cover plate 16 and the second frame 15.
The heat superconducting heat transfer technology comprises a heat pipe technology of filling working media in a closed mutually communicated micro-channel system and realizing heat superconducting heat transfer through evaporation and condensation phase change of the working media; and the phase change suppression (PCI) heat transfer technology for realizing high-efficiency heat transfer by controlling the microstructure state of the working medium in a closed system, namely, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and the consistency of the microstructure of the working medium is achieved on the basis. In this embodiment, the thermal superconducting heat transfer working medium may be a phase change suppression heat transfer working medium, at this time, boiling or condensation of the thermal superconducting heat transfer working medium is suppressed in the heat transfer process, and on this basis, consistency of the working medium microstructure is achieved to achieve heat transfer. In this embodiment, the thermal superconducting heat transfer working medium can also continuously perform phase change circulation of evaporation heat absorption and condensation heat release in the heat transfer process to realize rapid heat transfer.
By way of example, the thermal superconducting heat transfer working medium is a fluid, preferably, the thermal superconducting heat transfer working medium may be a gas or a liquid or a mixture of a gas and a liquid, and more preferably, in the present embodiment, the thermal superconducting heat transfer working medium is a mixture of a liquid and a gas.
As an example, the first baffle 14 has a height equal to the thickness of the first frame 11, and the second baffle 18 has a height equal to the thickness of the second frame 15. The height of the first baffle 14 is set to be the same as the height of the first frame 11, and the height of the second baffle 18 is set to be the same as the thickness of the second frame 15, so that the maximum welding area between the first baffle 14 and the solder layer and the second baffle 15 can be ensured, and the welding strength can be increased.
As an example, as shown in fig. 1, the first frame 11 may include, but is not limited to, a ring frame. One side of the first frame 11 is provided with a filling hole 111 penetrating through the side wall. After the first cover plate 10 and the second cover plate 12 are welded with the first frame 11 and the first guide plate 14, one end of a filling tube (not shown) is inserted into the filling hole 111, and the heat superconducting heat transfer working medium can be filled into the sealed heat transfer channel. After the thermal superconducting heat transfer working medium is filled, the filling hole 111 is closed so as to seal the sealed heat transfer channel.
As an example, as shown in fig. 1 and fig. 3, the first guide plate 14 includes a plurality of first guide strips 141 arranged in parallel along a first direction, the first guide strips 141 include a plurality of first protrusions 142 arranged at intervals along a second direction, and bottoms of adjacent first protrusions 142 in the second direction are integrally connected; the first direction is perpendicular to the second direction. The first protrusion 142 may extend in a square wave shape along the second direction, or may extend in a wave shape. In the second direction, the first protrusions 142 are recessed. After the first cover plate 10, the second cover plate 12, the first frame 11 and the first baffle 14 are welded together, the gap between the first protrusion 142 of the first baffle 14 and the first cover plate 10, the gap between the recess between the adjacent first protrusions 142 along the second direction and the second cover plate 12, and the gap between the adjacent first guide strips 141 together form the sealed heat transfer channel.
As an example, the first guide strips 141 may be integrally connected, and specifically, a connection strip (not shown) may be disposed at one end of each of the first guide strips 141, and the connection strip extends along the arrangement direction of the first guide strips 141 and sequentially connects the first guide strips 141 in series.
As an example, the first protrusions 142 on two adjacent rows of the first guide strips 141 may be disposed in a one-to-one correspondence manner, that is, the first protrusions 142 on each first guide strip 141 are disposed in a one-to-one correspondence manner along the first direction (i.e., the direction in which the first guide strips 141 are arranged). Of course, in other examples, the first protrusions 142 on two adjacent rows of the first gibs 141 may also be arranged in a staggered manner, and the staggered arrangement of the first protrusions 142 on two adjacent rows of the first gibs 141 means that the side edges of the first protrusions 142 on two adjacent rows of the first gibs 141 are staggered; the offset distance of the first protrusions 142 of two adjacent rows of the first flow guide strips 141 may be smaller than the width of the first protrusions 142, and the offset distance of the first protrusions 142 of two adjacent rows of the first flow guide strips 141 may also be equal to the width of the first protrusions 142, at this time, the first protrusions 142 of one row of the first flow guide strips 141 are aligned with the recesses between the first protrusions 142 of one row of the first flow guide strips 141 adjacent thereto. It should be noted that, when the first convex portions 142 on the two adjacent rows of the first guide strips 141 are arranged in a staggered manner, the first convex portions 142 on the first guide strips 141 in alternate rows are arranged in a one-to-one correspondence manner, that is, the first convex portions 142 on the first guide strips 141 in odd rows are arranged in a staggered manner with the first convex portions 142 on the first guide strips 141 in even rows, the first convex portions 142 on the first guide strips 141 in odd rows are arranged in a one-to-one correspondence manner, and the second convex portions 142 on the first guide strips 141 in even rows are also arranged in a one-to-one correspondence manner.
As an example, referring to fig. 3, the superconducting heat exchange plate 1 further includes a first gas-liquid balance channel 131 and a second gas-liquid balance channel 132, the first gas-liquid balance channel 131 and the second gas-liquid balance channel 132 are arranged at intervals along the first direction on two opposite sides of the first guide plate 14, the first gas-liquid balance channel 131 and the second gas-liquid balance channel 132 extend along the second direction, and both the first gas-liquid balance channel 131 and the second gas-liquid balance channel 132 are located between the second guide plate 14 and the second frame 15. By arranging the first gas-liquid balance channel 131 and the second gas-liquid balance channel 132, the flow resistance of the heat superconducting heat transfer working medium along the second direction can be reduced, and the heat superconducting heat transfer working medium in the sealed heat transfer channel can be effectively balanced, so that the whole heat superconducting heat exchange plate 1 is in a uniform temperature state.
As an example, the second baffle 18 includes a plurality of second flow guide strips 181 arranged in parallel and at intervals along the first direction, the second flow guide strips 181 include a plurality of second protrusions 182 arranged at intervals along the second direction, and bottoms of adjacent second protrusions 182 in the second direction are integrally connected. The second protrusion 182 may extend in a square wave shape along the second direction, or may extend in a wave shape. In the second direction, the second protrusions 182 are adjacent to each other in a concave shape. After the second cover plate 12, the third cover plate 16, the second frame 15 and the second baffle 18 are welded together, a gap between the second protrusion 182 of the second flow guide strip 18 and the second cover plate 12, a gap between the second protrusion 182 adjacent to the second protrusion 182 along the second direction and the third cover plate 16, and a gap between the adjacent second flow guide strips 181 jointly form the refrigerant channel.
As an example, the plurality of second guide strips 181 may be integrally connected, and specifically, a connection strip (not shown) may be disposed at one end of the plurality of second guide strips 181, and the connection strip extends along the direction in which the plurality of second guide strips 181 are arranged, and connects the plurality of second guide strips 181 in series.
As an example, the second protrusions 182 on two adjacent rows of the second flow guiding strips 181 may be disposed in a one-to-one correspondence, that is, the second protrusions 182 on each second flow guiding strip 181 are disposed in a one-to-one correspondence along the first direction. Of course, in other examples, the second protrusions 182 on two adjacent rows of the second flow guide strips 181 may also be arranged in a staggered manner, and the staggered arrangement of the second protrusions 182 on two adjacent rows of the second flow guide strips 181 means that the side edges of the second protrusions 182 on two adjacent rows of the second flow guide strips 181 are staggered; the second protrusions 182 of two adjacent rows of the second flow guide strips 181 may be staggered by a distance less than the width of the second protrusions 182, and the second protrusions 182 of two adjacent rows of the second flow guide strips 181 may also be staggered by a distance equal to the width of the second protrusions 182, at this time, the second protrusions 182 of one row of the second flow guide strips 181 are aligned with the recesses between the second protrusions 182 of one row of the second flow guide strips 181 adjacent thereto. It should be noted that when the second protrusions 182 on the two adjacent rows of the second guide strips 181 are arranged in a staggered manner, the second protrusions 182 on each row of the second guide strips 181 are arranged in a one-to-one correspondence manner, that is, the second protrusions 182 on the odd-numbered rows of the second guide strips 181 are arranged in a staggered manner with the second protrusions 182 on the even-numbered rows of the second guide strips 181, the second protrusions 182 on each odd-numbered row of the second guide strips 181 are arranged in a one-to-one correspondence manner, and the second protrusions 182 on each even-numbered row of the second guide strips 181 are also arranged in a one-to-one correspondence manner.
As an example, referring to fig. 1 and 4, the second sealed chamber 17 includes a first chamber portion 171, a second chamber portion 172, and a third chamber portion 173; the first cavity part 171 is parallel to the third cavity part 173, the second cavity part 172 is perpendicular to the first cavity part 171 and the third cavity part 173, and the second cavity part 172 is communicated with the first cavity part 171 and the third cavity part 173; the refrigerant inlet 191 is communicated with the first cavity part 171, the refrigerant outlet 192 is communicated with the third cavity part 173, the refrigerant inlet 191 is located on one side of the first cavity part 171, which is far away from the second cavity part 172, and the refrigerant outlet 192 is located on one side of the third cavity part 173, which is far away from the second cavity part 172, that is, the refrigerant inlet 191 and the refrigerant outlet 192 are located on the same side of the second sealed cavity 17.
By way of example, the second rim 15 may include, but is not limited to, a U-shaped rim, and the second sealed chamber 17 may include, but is not limited to, a U-shaped cavity portion.
By way of example, the third cover 16 may comprise a U-shaped cover. After the third cover plate 16 is attached to a side of the second frame 15 away from the second cover plate 12, the third cover plate 16 completely covers the second frame 15. Specifically, in the superconducting heat exchange plate 1, each side edge of the third cover plate 16 is aligned with each corresponding side edge of the second frame 15 and each corresponding side edge of the second cover plate 12.
For example, referring to fig. 1 and 4, a liquid storage strip 151 is further disposed in the second frame 15, and the liquid storage strip 151 is located at a connection position of the first cavity portion 171 and the second cavity portion 172, and is located on an inner wall of the first cavity portion 171 adjacent to the third cavity portion 173. The reservoir strip 151 may extend in a first direction. The liquid storage bar 151 can play a role in guiding the refrigerant.
The heat superconducting heat exchange plate 1 of the utility model adopts the heat superconducting heat transfer technology, can ensure that the temperature of each area of the whole plate surface is uniform, and has the characteristics of high heat transfer rate and good temperature uniformity; the refrigerant in the heat superconducting heat exchange plate 1 of the utility model has large heat exchange area and higher energy efficiency; the utility model discloses a 1 inside does of heat superconducting heat transfer board first sealed cavity 13 reaches the sealed cavity 17 of second, and first sealed cavity 13 reaches set up respectively in the sealed cavity 17 of second first guide plate 14 reaches second guide plate 18, first guide plate 14 reaches second guide plate 18 plays the additional strengthening promptly, makes first apron 10 the second apron 12 reaches the thickness of third apron 16 can the attenuate, and the bearing capacity increases, and intensity improves, alleviates the weight and the thickness of heat superconducting heat transfer board 1 increase inside heat transfer area again, strengthens heat superconducting heat-sinking capability.
Example two
Referring to fig. 5 to 7 in conjunction with fig. 1 to 4, the present embodiment further provides a heat superconducting heat exchange plate 1, and the structure of the heat superconducting heat exchange plate 1 in the present embodiment is substantially the same as that of the heat superconducting heat exchange plate 1 in the first embodiment, and the difference between the two embodiments is: in the heat superconducting heat exchange plate 1 according to the first embodiment, the second frame 15 is a U-shaped frame, the second sealed chamber 17 is a U-shaped cavity, the third cover plate 16 is a U-shaped cover plate, and each side of the third cover plate 16 is aligned with each corresponding side of the second frame 15 and each corresponding side of the second cover plate 12; in this embodiment, the second frame 15 is an annular frame, a separating strip 152 is further disposed in the second frame 15, one end of the separating strip 152 is fixedly connected to the inner wall of the second frame 15, and the length of the separating strip 152 is smaller than the dimension of the second sealed cavity 17 along the length direction of the separating strip 152; the first cavity portion 171 and the third cavity portion 173 are respectively located at two opposite sides of the separation strip 152, and the second cavity portion 172 is located between the free end of the separation strip 152 and the second frame 15; when the liquid storage bar 151 is arranged on the heat superconducting heat exchange plate 1, the liquid storage bar 151 is located at the free end of the separation bar 152, and the liquid storage bar 151 is perpendicular to the separation bar 152. Other structures of the heat superconducting heat exchange plate in the embodiment are completely the same as those of the heat superconducting heat exchange plate in the first embodiment, and refer to the first embodiment specifically, and will not be described herein again.
For example, three sides of the second frame 15 are aligned with three sides corresponding to the second air deflector 18 and three sides corresponding to the second cover plate 12 in a one-to-one correspondence manner, for example, a bottom side of the second frame 15 is aligned with a bottom side of the second air deflector 18 and a bottom side of the second cover plate 12, two sides of the second frame 15 adjacent to the bottom side are aligned with two sides of the second air deflector 18 adjacent to the bottom side respectively, and two sides of the second cover plate 12 adjacent to the bottom side are aligned with one another.
EXAMPLE III
Referring to fig. 8 to 10 in conjunction with fig. 5 to 7, the present embodiment further provides a heat superconducting heat exchange plate 1, and the structure of the heat superconducting heat exchange plate 1 in the present embodiment is substantially the same as that of the heat superconducting heat exchange plate 1 in the second embodiment, and the difference between the two embodiments is: in the second embodiment, the numbers of the second frame 15, the third cover plate 16, the second flow guide plate 18, the refrigerant inlet 191 and the refrigerant outlet 192 in the superconducting heat exchange plate 1 are all one; in this embodiment, in the superconducting heat exchange plate 1, the number of the second frames 15, the number of the third cover plates 16, the number of the second guide plates 18, the number of the refrigerant inlets 191 and the number of the refrigerant outlets 192 are all multiple, and the number of the second frames 15, the number of the third cover plates 16, the number of the second guide plates 18, the number of the refrigerant inlets 191 and the number of the refrigerant outlets 192 are the same; the second frames 15 are arranged on the surface of the second cover plate 12 away from the first baffle 14 at intervals in parallel; a plurality of third cover plates 16 are correspondingly attached to the surface of each second frame 15 away from the second cover plate 12 to form a plurality of independent second sealed chambers 17; the second baffle 18 is located within each of the second sealed chambers 17; the refrigerant inlet 191 and the refrigerant outlet 192 are disposed on each of the second frames 15. Other structures of the heat superconducting heat exchange plate in the embodiment are completely the same as those of the heat superconducting heat exchange plate in the second embodiment, and specific reference is made to the second embodiment, which will not be described herein again.
To sum up, the utility model provides a heat superconducting heat transfer board, heat superconducting heat transfer board includes: a first cover plate; the first frame is attached to one surface of the first cover plate; the second cover plate is attached to the surface, away from the first cover plate, of the first frame, so that a first sealing cavity is formed between the first cover plate and the second cover plate; the first guide plate is positioned in the first sealed cavity to form a sealed heat transfer channel in the first sealed cavity, and a thermal superconducting heat transfer working medium is filled in the sealed heat transfer channel; the second frame is attached to the surface, far away from the first guide plate, of the second cover plate; the third cover plate is attached to the surface, away from the second cover plate, of the second frame, so that a second sealing cavity is formed between the second cover plate and the third cover plate; the second guide plate is positioned in the second sealed cavity so as to form a refrigerant channel in the second sealed cavity; the refrigerant inlet is positioned on the second frame and communicated with the refrigerant channel; and the refrigerant outlet is positioned on the second frame and communicated with the refrigerant channel. The heat superconducting heat exchange plate of the utility model adopts the heat superconducting heat transfer technology, can ensure that the temperature of each area of the whole plate surface is uniform, and has the characteristics of high heat conduction rate and good temperature uniformity; the utility model has large heat transfer area of refrigerant in the heat superconducting heat transfer plate and higher energy efficiency; the utility model discloses an inside first sealed cavity and the sealed cavity of second that is of heat superconducting heat transfer board to set up first guide plate and second guide plate in first sealed cavity and the sealed cavity of second respectively, first guide plate and second guide plate play the additional strengthening promptly, make first apron, second apron and third cover plate thickness can the attenuate, the bearing capacity increases, intensity improves, alleviate the weight and the thickness of heat superconducting heat transfer board, increase inside heat transfer area again, strengthen heat superconducting heat-sinking capability.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A heat superconducting heat exchange panel, characterized in that it comprises:
a first cover plate;
the first frame is attached to one surface of the first cover plate;
the second cover plate is attached to the surface, away from the first cover plate, of the first frame, so that a first sealing cavity is formed between the first cover plate and the second cover plate;
the first guide plate is positioned in the first sealed cavity to form a sealed heat transfer channel in the first sealed cavity, and a thermal superconducting heat transfer working medium is filled in the sealed heat transfer channel;
the second frame is attached to the surface, far away from the first guide plate, of the second cover plate;
the third cover plate is attached to the surface, away from the second cover plate, of the second frame, so that a second sealing cavity is formed between the second cover plate and the third cover plate;
the second guide plate is positioned in the second sealed cavity so as to form a refrigerant channel in the second sealed cavity;
the refrigerant inlet is positioned on the second frame and communicated with the refrigerant channel;
and the refrigerant outlet is positioned on the second frame and communicated with the refrigerant channel.
2. A heat superconducting heat exchange panel according to claim 1, wherein: the height of the first guide plate is the same as the thickness of the first frame, and the height of the second guide plate is the same as the thickness of the second frame.
3. A heat superconducting heat exchange panel according to claim 1, wherein:
the first guide plate comprises a plurality of first guide strips which are arranged in parallel along a first direction, the first guide strips comprise a plurality of first convex parts which are arranged at intervals along a second direction, and the bottoms of the adjacent first convex parts in the second direction are integrally connected; the first direction is perpendicular to the second direction;
the second guide plate comprises a plurality of second guide strips arranged in parallel at intervals in the first direction, the second guide strips comprise a plurality of second convex parts arranged at intervals in the second direction, and the bottoms of the second convex parts are integrally connected and are adjacent to each other in the second direction.
4. A heat superconducting heat exchange panel according to claim 3, wherein: the first convex parts on the first guide strips in two adjacent rows are arranged in a one-to-one corresponding mode or in a staggered mode, and the second convex parts on the second guide strips in two adjacent rows are arranged in a one-to-one corresponding mode or in a staggered mode.
5. A heat superconducting heat exchange panel according to claim 3, wherein: the heat superconducting heat exchange plate further comprises a first gas-liquid balance channel and a second gas-liquid balance channel, the first gas-liquid balance channel and the second gas-liquid balance channel are arranged on two opposite sides of the first guide plate at intervals along the first direction and extend along the second direction, and the first gas-liquid balance channel and the second gas-liquid balance channel are located between the second guide plate and the second frame.
6. A heat superconducting heat exchange panel according to claim 1, wherein: the second sealed chamber comprises a first chamber part, a second chamber part and a third chamber part; the first cavity part is parallel to the third cavity part, the second cavity part is perpendicular to the first cavity part and the third cavity part, and the second cavity part is communicated with the first cavity part and the third cavity part; the refrigerant inlet is communicated with the first cavity part, the refrigerant outlet is communicated with the third cavity part, the refrigerant inlet is located on one side, away from the second cavity part, of the first cavity part, and the refrigerant outlet is located on one side, away from the second cavity part, of the third cavity part.
7. A heat superconducting heat exchange panel according to claim 6, wherein: and a liquid storage strip is further arranged in the second frame, is positioned at the joint of the first cavity part and the second cavity part and is positioned on the inner wall of the first cavity part close to the third cavity part.
8. A heat superconducting heat exchange panel according to claim 7, wherein: a separating strip is further arranged in the second frame, one end of the separating strip is fixedly connected with the inner wall of the second frame, and the length of the separating strip is smaller than the size of the second sealed cavity along the length direction of the separating strip; the first cavity part and the third cavity part are respectively positioned at two opposite sides of the separating strip, and the second cavity part is positioned between the free end of the separating strip and the second frame; the liquid storage strip is positioned at the free end of the separation strip and is vertical to the separation strip.
9. A heat superconducting heat exchange panel according to claim 6, wherein: the second frame is a U-shaped frame, and the second sealed chamber is a U-shaped chamber portion.
10. A heat superconducting heat exchange panel according to claim 1, wherein: in the heat superconducting heat exchange plate, the number of the second frame, the number of the third cover plate, the number of the second guide plate, the number of the refrigerant inlets and the number of the refrigerant outlets are all multiple, and the number of the second frame, the number of the third cover plate, the number of the second guide plate, the number of the refrigerant inlets and the number of the refrigerant outlets are the same; the second frames are arranged on the surface, far away from the first guide plate, of the second cover plate at intervals in parallel; the third cover plates are correspondingly attached to the surfaces, far away from the second cover plates, of the second frames to form a plurality of independent second sealed chambers; the guide plates are positioned in the second sealed cavities; the refrigerant inlet and the refrigerant outlet are arranged on each second frame.
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| CN201921055265.6U CN210741196U (en) | 2019-07-08 | 2019-07-08 | Heat superconducting heat exchange plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110230937A (en) * | 2019-07-08 | 2019-09-13 | 浙江嘉熙科技有限公司 | Hot superconduction heat exchange plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110230937A (en) * | 2019-07-08 | 2019-09-13 | 浙江嘉熙科技有限公司 | Hot superconduction heat exchange plate |
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Address after: 311100 Room 201, 2 / F, building 2, No. 9, Taiji Road, Yuhang Economic and Technological Development Zone, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: Zhejiang Jiaxi Technology Co.,Ltd. Address before: 314117 No.1 Workshop, 188 Jinxiu Avenue, Yaozhuang Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: ZHEJIANG JIAXI OPTOELECTRONIC EQUIPMENT MANUFACTURING Co.,Ltd. |