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CN210721160U - Temperature control circuit and temperature control device - Google Patents

Temperature control circuit and temperature control device Download PDF

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Publication number
CN210721160U
CN210721160U CN201921798551.1U CN201921798551U CN210721160U CN 210721160 U CN210721160 U CN 210721160U CN 201921798551 U CN201921798551 U CN 201921798551U CN 210721160 U CN210721160 U CN 210721160U
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temperature control
temperature
chip
unit
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CN201921798551.1U
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Inventor
程智
王文伟
谢链
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Zhuhai Ruihe Electrical Co ltd
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Zhuhai Ruihe Electrical Co ltd
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Abstract

The utility model discloses a control by temperature change circuit, and disclose and have control by temperature change circuit's temperature control device, wherein control by temperature change circuit includes: the temperature control device comprises a micro-processing unit, a CAN communication interface unit, an RS485 communication interface unit, a temperature transmitting unit, a temperature control signal output unit, a first communication port and a second communication port. Through increasing CAN communication protocol on the basis at current RS485 communication protocol temperature control circuit, the temperature control circuit becomes behind the two agreement communications, had both had RS485 communication protocol's advantage: the touch screen is convenient to display actual values or modify set values; and has the advantages of CAN communication protocol: the signal quality of the system can be ensured when the multistage cascade is carried out.

Description

Temperature control circuit and temperature control device
Technical Field
The utility model relates to a temperature controller field, in particular to control by temperature change circuit and temperature control device.
Background
The temperature control circuit of the existing temperature controller mostly uses an RS485 communication protocol, is influenced by the quantity of CPU pins, and is intelligently connected with a limited number of temperature sensors. Although the RS485 communication protocol is convenient for connecting interaction ends such as a display screen, adverse effects of the RS485 communication protocol become more and more serious with the increase of the number of sensors, the RS temperature control circuit is an effective solution for expanding the number of sensors, and the adverse effects are mainly caused by the fact that signals are superposed with original signals after being reflected at the tail ends of all branches, and the signal quality is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a temperature control circuit and temperature control device can solve the current insecure problem of cascading temperature control circuit transmission signal.
According to the utility model discloses a control by temperature change circuit of first aspect embodiment, include: a micro-processing unit; the CAN communication interface unit is connected with the micro-processing unit; the RS485 communication interface unit is connected with the micro-processing unit; the temperature transmitting unit is connected with the micro-processing unit and is used for connecting the temperature sensing device and transmitting the temperature signal acquired by the temperature sensing device to the micro-processing unit; the temperature control signal output unit is connected with the micro-processing unit and used for receiving the signal of the micro-processing unit and outputting a temperature control signal; the first communication port is connected with the CAN communication interface unit and the RS485 communication interface unit; and the second communication port is connected with the CAN communication interface unit and the RS485 communication interface unit and is used for connecting the next stage in a cascade state.
According to the utility model discloses control by temperature change circuit has following beneficial effect at least: through increasing CAN communication protocol on the basis at current RS485 communication protocol temperature control circuit, the temperature control circuit becomes behind the two agreement communications, had both had RS485 communication protocol's advantage: the touch screen is convenient to display actual values or modify set values; and has the advantages of CAN communication protocol: the signal quality of the system can be ensured when the multistage cascade is carried out.
According to some embodiments of the utility model, the micro-processing unit is including the communication module CAN who is connected with CAN communication interface unit and the communication module SCI who is connected with RS485 communication interface unit.
According to some embodiments of the invention: the micro-processing unit includes a first CPU of model TMS320F28034 PNT.
According to some embodiments of the invention: the CAN communication interface unit comprises a first chip, a pin RXD and a pin TXD of the first chip are respectively connected with a first pin and a second pin of the first CPU, and a pin CANH and a pin CANL of the first chip are respectively connected to the first communication port and the second communication port.
According to some embodiments of the invention: the RS485 communication interface unit comprises a second chip, and a pin A and a pin B of the second chip are both connected to the first communication port and the second communication port; and a pin R, a pin RE and a pin D of the second chip are respectively connected with a first pin, a second pin and a first pin of the first CPU.
According to some embodiments of the invention: and a resistor RS485 is connected between the first pin and the second pin of the second communication port.
According to some embodiments of the invention: the temperature transmitting unit comprises at least one group of temperature transmitting modules, each temperature transmitting module comprises a third chip, the first CPU is connected with a pin PTA of the third chip, and KXA + and KXA-pins of the third chip are connected with the temperature sensing device.
According to some embodiments of the invention: the temperature control signal output unit comprises at least one group of temperature control signal output modules, each temperature control signal output module comprises a fourth chip and a signal isolation circuit, the micro-processing unit is connected with an input pin of the signal isolation circuit, an output pin of the signal isolation circuit is connected with an input end of the fourth chip, an output end of the fourth chip is connected with an output terminal, and the output terminal is used for outputting a temperature control signal.
According to the utility model discloses a temperature control device of first aspect embodiment, including the temperature control circuit of any one of above-mentioned embodiment.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic block diagram of an embodiment of the present invention;
FIG. 2 is a schematic diagram of the micro-processing unit shown in FIG. 1;
FIG. 3 is a schematic diagram of the RS485 communication interface unit and the CAN communication interface unit shown in FIG. 1;
FIG. 4 is a schematic diagram of the first communication port shown in FIG. 1;
FIG. 5 is a schematic diagram of the second communication port shown in FIG. 1;
FIG. 6 is a schematic diagram of the temperature transmitter unit shown in FIG. 1;
fig. 7 is a schematic diagram of the temperature control signal output unit shown in fig. 1.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
Referring to fig. 1, a temperature control circuit in the embodiment includes:
a microprocessing unit 100;
a CAN communication interface unit 210 connected to the microprocessor unit 100;
an RS485 communication interface unit 220 connected with the microprocessing unit 100;
the temperature transmitting unit 300 is connected with the microprocessor unit 100, is used for connecting with a temperature sensing device, and transmits a temperature signal acquired by the temperature sensing device to the microprocessor unit 100;
a temperature control signal output unit 400 connected to the microprocessor unit 100, for receiving the signal from the microprocessor unit 100 and outputting a temperature control signal;
the first communication port 500 is connected with the CAN communication interface unit 210 and the RS485 communication interface unit 220;
the second communication port 600 is connected to the CAN communication interface unit 210 and the RS485 communication interface unit 220, and is used for connecting to the next stage in the cascade connection state.
Through increasing CAN communication protocol on the basis at current RS485 communication protocol temperature control circuit, the temperature control circuit becomes behind the two agreement communications, had both had RS485 communication protocol's advantage: the touch screen is convenient to display actual values or modify set values; and has the advantages of CAN communication protocol: the signal quality of the system can be ensured when the multistage cascade is carried out.
Referring to fig. 1, in the temperature control circuit of the embodiment, the micro-processing unit 100 includes a communication module CAN connected to a CAN communication interface unit 210 and a communication module SCI (serial communication interface) connected to an RS485 communication interface unit 220.
Referring to fig. 1-2, in the temperature control circuit of the embodiment, the micro-processing unit 100 includes a first CPU 110 with a model number of TMS320F28034 PNT. The TMS320F28034PNT chip is high in integration level, a CAN communication pin and an RS485 communication pin are arranged in the TMS chip, two communication units CAN be directly connected, an external communication conversion module is not needed, and circuit design CAN be simplified.
Referring to fig. 1, 3 to 5, in the embodiment of the temperature control circuit, the CAN communication interface unit 210 includes a first chip 211, a pin RXD and a pin TXD of the first chip 211 are respectively connected to a 33 rd pin and a 32 th pin of the first CPU 110, and a pin CANH and a pin CANL of the first chip 211 are respectively connected to the first communication port 500 and the second communication port 600. In some embodiments, the first chip 211 has a model number ISO1050 DWR.
Referring to fig. 1, 3 to 5, in the temperature control circuit of the embodiment, the RS485 communication interface unit 220 includes a second chip 221, and a pin a and a pin B of the second chip 221 are both connected to the first communication port 500 and the second communication port 600; the pins R, RE and D of the second chip 221 are connected to the 40 th pin, the 39 th pin and the 34 th pin of the first CPU 110, respectively. In some embodiments the second chip 221 has a model number ISO3082 DW.
Referring to fig. 5, in the temperature control circuit of the embodiment, a resistor RS1 is connected between the 3 rd pin and the 5 th pin of the second communication port 600. The second communication port 600 has a gating function of interrupting and matching resistors, when the 5 th pin and the 6 th pin of the second communication port 600 are short-circuited, the resistor RS1 is connected between the pin CANH and the pin CANL, and a single temperature control circuit can be cascaded with the next temperature control circuit.
Referring to fig. 1 and 6, in the temperature control circuit of the present embodiment, the temperature transmitter 300 includes at least one set of temperature transmitting modules 310, each of the temperature transmitting modules includes a third chip 311, the first CPU 110 is connected to a pin PTA of the third chip 311, and KXA + and KXA-pins of the third chip 311 are connected to a temperature sensing device. In some embodiments, the first CPU 110 is a TMS320F28034PNT chip, which is connected to up to four sets of temperature transmitter modules 310.
Referring to fig. 1 and 7, in the embodiment of the temperature control circuit, the temperature control signal output unit 400 includes at least one set of temperature control signal output modules, each of the temperature control signal output modules includes a fourth chip 410 and a signal isolation circuit 420, the microprocessor unit 100 is connected to an input pin 421 of the signal isolation circuit, an output pin 422 of the signal isolation circuit is connected to an input terminal of the fourth chip, an output terminal of the fourth chip is connected to an output terminal 430, and the output terminal 430 is used for outputting a temperature control signal. In some embodiments, the fourth chip 410 is ULN2004AIN, and may provide up to seven sets of temperature control signal output modules.

Claims (9)

1. A temperature control circuit, comprising:
a microprocessor unit (100);
the CAN communication interface unit (210) is connected with the micro-processing unit (100);
the RS485 communication interface unit (220) is connected with the micro-processing unit (100);
the temperature transmitting unit (300) is connected with the micro-processing unit (100) and is used for connecting a temperature sensing device and transmitting a temperature signal acquired by the temperature sensing device to the micro-processing unit (100);
the temperature control signal output unit (400) is connected with the micro-processing unit (100) and is used for receiving the signal of the micro-processing unit (100) and outputting a temperature control signal;
the first communication port (500) is connected with the CAN communication interface unit (210) and the RS485 communication interface unit (220);
and the second communication port (600) is connected with the CAN communication interface unit (210) and the RS485 communication interface unit (220) and is used for connecting the next stage in a cascade state.
2. The temperature control circuit of claim 1, wherein: the micro-processing unit (100) comprises a communication module CAN connected with the CAN communication interface unit (210) and a communication module SCI connected with the RS485 communication interface unit (220).
3. The temperature control circuit of claim 1, wherein: the micro-processing unit (100) includes a first CPU (110) of model TMS320F28034 PNT.
4. A temperature control circuit according to claim 3, wherein: the CAN communication interface unit (210) comprises a first chip (211), wherein a pin RXD and a pin TXD of the first chip (211) are respectively connected with a 33 rd pin and a 32 th pin of the first CPU (110), and a pin CANH and a pin CANL of the first chip (211) are respectively connected to the first communication port (500) and the second communication port (600).
5. A temperature control circuit according to claim 3, wherein: the RS485 communication interface unit (220) comprises a second chip (221), and a pin A and a pin B of the second chip (221) are both connected to the first communication port (500) and the second communication port (600); and the pin R, the pin RE and the pin D of the second chip (221) are respectively connected with the pin 40, the pin 39 and the pin 34 of the first CPU (110).
6. The temperature control circuit of claim 1, wherein: and a resistor RS1 is connected between the No. 3 pin and the No. 5 pin of the second communication port (600).
7. A temperature control circuit according to claim 3, wherein: the temperature transmitting unit (300) comprises at least one group of temperature transmitting modules (310), the temperature transmitting modules comprise a third chip (311), the first CPU (110) is connected with a pin PTA of the third chip (311), and KXA + and KXA-pins of the third chip (311) are connected with the temperature sensing device.
8. A temperature control circuit according to claim 3, wherein: accuse temperature signal output unit (400) includes at least a set of accuse temperature signal output module, accuse temperature signal output module includes fourth chip (410) and signal isolation circuit (420), microprocessing unit (100) are connected signal isolation circuit's input pin (421), signal isolation circuit's output pin (422) are connected the input of fourth chip, output terminal (430) are connected to the output of fourth chip, output terminal (430) are used for exporting accuse temperature signal.
9. A temperature control device is characterized in that: comprising a temperature control circuit according to any of claims 1-8.
CN201921798551.1U 2019-10-24 2019-10-24 Temperature control circuit and temperature control device Active CN210721160U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921798551.1U CN210721160U (en) 2019-10-24 2019-10-24 Temperature control circuit and temperature control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921798551.1U CN210721160U (en) 2019-10-24 2019-10-24 Temperature control circuit and temperature control device

Publications (1)

Publication Number Publication Date
CN210721160U true CN210721160U (en) 2020-06-09

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CN201921798551.1U Active CN210721160U (en) 2019-10-24 2019-10-24 Temperature control circuit and temperature control device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113485474A (en) * 2021-07-20 2021-10-08 沈阳鑫博工业技术股份有限公司 Multi-protocol temperature controller and control method for aluminum oxide suspension roasting furnace

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113485474A (en) * 2021-07-20 2021-10-08 沈阳鑫博工业技术股份有限公司 Multi-protocol temperature controller and control method for aluminum oxide suspension roasting furnace

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