CN210157258U

CN210157258U - Photosensitive assembly and camera module

Info

Publication number: CN210157258U
Application number: CN201921236646.4U
Authority: CN
Inventors: 栾仲禹; 黄桢; 刘丽; 孙鑫翔; 卢彬
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-08-01
Filing date: 2019-08-01
Publication date: 2020-03-17
Anticipated expiration: 2029-08-01

Abstract

The application relates to a sensitization subassembly and module of making a video recording. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected with the circuit board, at least one electronic component arranged on the circuit board and a molding body integrally formed on the circuit board. The molding body is provided with at least one groove concavely formed in the molding body, and the groove is positioned on the outer side of the photosensitive chip. In this way, the stress applied to the photosensitive chip by the molding body is reduced by arranging the grooves on the molding body, so that the deformation of the photosensitive chip caused by stress is effectively reduced.

Description

Photosensitive assembly and camera module

Technical Field

The application relates to the module field of making a video recording, especially relate to photosensitive assembly and the module of making a video recording.

Background

In order to adapt to the trend of miniaturization and thinning of electronic devices, the size of the camera module is gradually reduced. In response, the packaging process of the camera module gradually evolves from the conventional cob (chip on board) process to the molding process.

Fig. 1 is a schematic structural diagram illustrating a conventional camera module manufactured based on a molding process. As shown in fig. 1, the camera module is prepared by moc (molding on chip) molding process, and includes a photosensitive element and an optical lens 1P held in a photosensitive path of the photosensitive element. The photosensitive assembly comprises a circuit board 2P, a photosensitive chip 3P and a molded body 4P, wherein the molded body 4P is integrally molded on the circuit board 2P to integrally cover at least one part of the circuit board 2P and at least one part of a non-photosensitive area of the photosensitive chip 3P. However, the molding and packaging process also causes new technical problems, such as poor imaging quality due to deformation of the photosensitive chip caused by excessive stress.

Therefore, an improved structure of the camera module is needed.

SUMMERY OF THE UTILITY MODEL

The main objective of this application is to provide a photosensitive assembly and a camera module, which can effectively reduce the bending amount of the photosensitive chip caused by stress, so as to improve the imaging quality of the camera module.

Another object of the present application is to provide a photosensitive assembly and a camera module, wherein the stress applied to the photosensitive chip by the molding body is reduced by the grooves formed on the molding body, so as to effectively reduce the deformation of the photosensitive chip caused by the stress.

Another object of the present invention is to provide a photosensitive module and a camera module, wherein the groove is concavely formed on the molded body and the forming position of the groove is located outside the photosensitive chip, in such a way that the stress transmission chain formed by the molded body and the photosensitive chip is cut off or the stress transmitted on the stress transmission chain formed by the molded body and the photosensitive chip is reduced.

Another object of the present invention is to provide a photosensitive assembly and a camera module, wherein the molding body is divided into a first molding portion and a second molding portion by the slot, so that the volume of the molding portion covering the photosensitive chip is reduced compared to the conventional molding process, and the shrinkage of the molding portion covering the photosensitive chip is reduced under the same shrinkage rate. Therefore, the stress generated by the molding portion is also reduced accordingly to reduce the amount of bending of the photosensitive chip.

Another object of the present application is to provide a photosensitive assembly and a camera module, wherein the provision of the groove increases the overall exposed surface area of the molded body, so that the stress generated by the molded body can be relatively more distributed to the outer surface of the molded body, thereby relatively reducing the stress applied by the molded body to the photosensitive chip.

Another object of the present application is to provide a photosensitive assembly and a camera module, wherein the provision of the groove increases the overall exposed surface area of the molded body, which is beneficial to improve the heat dissipation performance of the photosensitive assembly.

Another aim at of this application provides a photosensitive assembly and module of making a video recording, wherein, the fluting provides a heat dissipation channel, the heat that photosensitive assembly during operation produced can pass through heat dissipation channel gives off.

Another object of the present application is to provide a photosensitive assembly and a camera module, wherein the groove can provide an overflow space for accommodating an overflow glue when the optical lens is mounted on the photosensitive assembly and/or the filter element is mounted on the molding body or the filter element support.

Another object of the present invention is to provide a photosensitive module and an image pickup module, wherein, in an embodiment of the present invention, a filter element holder is preset on the circuit board and integrally combined with a first molding portion and a second molding portion of the molding body after molding, wherein the filter element holder can be used not only for mounting the filter element but also for preventing stress generated by the second molding portion from being transmitted to the photosensitive chip, and for maintaining the shape of the first molding portion to ensure that internal stress generated by the first molding portion is not enough to excessively change the shape of the photosensitive chip.

Other advantages and features of the present application will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

To achieve at least one of the above objects or advantages, the present application provides a photosensitive assembly, including:

a circuit board;

the photosensitive chip is electrically connected with the circuit board;

at least one electronic component arranged on the circuit board; and

and the molded body is integrally molded on the circuit board, wherein the molded body is provided with at least one groove concavely formed therein, and the groove is positioned on the outer side of the photosensitive chip.

In a photosensitive assembly according to the present application, the mold body includes a first mold portion and a second mold portion divided by the groove, the first mold portion encapsulating at least a portion of the wiring board and at least a portion of the non-photosensitive region of the photosensitive chip.

In a photosensitive assembly according to the present application, the depth of the groove is greater than or equal to 30% of the height of the molded body.

In a photosensitive assembly according to the present application, the grooves are penetratingly formed at the molding body to expose corresponding regions of the circuit board.

In a photosensitive assembly according to the present application, the first molding portion and the second molding portion are connected by a molding passage.

In a photosensitive assembly according to the present application, the at least one groove includes a first groove and a second groove, the first groove and the second groove being symmetrically arranged with respect to a center line of the photosensitive chip, wherein the molding passage is formed between the first groove and the second groove during a molding process.

In a photosensitive assembly according to the present application, the groove is a closed ring groove surrounding the first molded portion to divide the molded body into the first molded portion and the second molded portion which are independent of each other.

In a photosensitive assembly according to the present application, the first molding portion and the second molding portion are formed by a two-shot molding process.

In a photosensitive assembly according to the present application, the photosensitive assembly further includes a filter element holder disposed in the slot, wherein the filter element holder is configured to mount a filter element thereon.

In a photosensitive assembly according to the present application, the photosensitive assembly further includes a filter element holder disposed at the slot, wherein the filter element holder is configured to mount a filter element thereon.

In a photosensitive assembly according to the present application, the filter element holder has a passage penetrating therethrough, wherein the filter element holder is preset to the circuit board and is integrally bonded to the first molding portion and the second molding portion of the molding body after the molding body is integrally molded.

In a photosensitive assembly according to the present application, the photosensitive assembly further includes a side encapsulation wrapping a side portion of the photosensitive chip.

In a photosensitive assembly according to the present application, the side coating compound covers at least a part of a lead for electrically connecting the photosensitive chip and the circuit board.

According to another aspect of the present application, the present application further provides a camera module, which includes:

an optical lens; and

the photosensitive assembly as described above, wherein the optical lens is held in the photosensitive path of the photosensitive assembly.

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 is a schematic structural diagram illustrating a conventional camera module manufactured based on a molding process.

Fig. 2 is a schematic diagram illustrating a deformation of a photosensitive chip due to stress in a photosensitive assembly prepared based on a molding process in the prior art.

Fig. 3 illustrates a schematic diagram of a camera module according to an embodiment of the present application.

Fig. 4 illustrates a schematic view of a photosensitive assembly of the camera module according to an embodiment of the present application.

FIG. 5 illustrates another schematic view of the photosensitive assembly according to an embodiment of the present application.

Fig. 6A and 6B are schematic diagrams illustrating a modified implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 7A and 7B are schematic diagrams illustrating a modified implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 8A and 8B are schematic diagrams illustrating a modified implementation of the photosensitive assembly according to an embodiment of the present application.

Fig. 9A and 9B illustrate schematic views of a photosensitive assembly according to another embodiment of the present application.

FIG. 10 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 11 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 12 illustrates a schematic diagram of yet another variant implementation of the photosensitive assembly according to an embodiment of the present application.

FIG. 13 illustrates a schematic view of a photosensitive assembly according to yet another embodiment of the present application.

Fig. 14 illustrates a schematic diagram of yet another variant implementation according to an embodiment of the present application.

FIG. 15 illustrates a schematic diagram of a photosensitive assembly manufacturing process according to an embodiment of the present application.

FIGS. 16A and 16B illustrate a schematic diagram of a photosensitive assembly manufacturing process according to another embodiment of the present application.

FIG. 17 illustrates a schematic view of a photosensitive assembly manufacturing process according to yet another embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, although the camera module can be made smaller in size by a molding process such as moc (molding on chip). However, the mold encapsulation process also raises some new technical problems.

Specifically, in the molded camera module, the bonding between the wiring board 2P and the molded body 4P and the bonding between the molded body 4P and the photosensitive chip 3P are rigid, and the bonding strength between the two is high, and the two can be removed by a destructive method. Relatively, through glue combination between sensitization chip 3P and the circuit board 2P, belong to the flexible bonding. The thermal expansion coefficients of the wiring board 2P, the mold 4P, and the photosensitive chip 3P are different. It will be appreciated by those skilled in the art that the ambient temperature changes greatly (the molding material needs to be heated to 150 degrees or more) and the frequency of the conversion is high in the molding process, which causes the photo-sensitive chip 3P, the circuit board 2P and the molded body 4P to expand and contract to different degrees. Further, the speeds of expansion and contraction of the wiring board 2P, the molded body 4P, and the photosensitive chip 3P are also inconsistent, and these phenomena result in the minimum amount of contraction of the final photosensitive chip 3P.

Since the bonding of the wiring board 2P to the molded body 4P and the bonding of the molded body 4P and the photosensitive chip 3P are rigid bonds, stress is generated between the wiring board 2P and the molded body 4P, and between the photosensitive chip 3P and the molded body 4P. Further, since the degree of shrinkage of the photo sensor chip 3P is minimal, stress is concentrated on the photo sensor chip 3P, which causes a large deformation of the photo sensor chip 3P, and the deformation effect is shown in fig. 2. It is noted that the deformation effect illustrated in fig. 2 is exaggerated to show the direction and characteristics of the deformation, and does not represent the specific deformation size. The sensitization chip 3P after the bending can cause great influence to the formation of image quality, embodies to be in the performance of the module of making a video recording: the field curvature of the camera module is too large, and the center effect of the shot image is normal but the edge effect is poor.

Meanwhile, the imaging assembly formed by the molding process also has the defects of poor heat dissipation performance and the like.

In view of the above technical problems, the basic idea of the present application is to reduce the amount of stress applied to the photosensitive chip by the molding body by providing the grooves on the molding body, so as to effectively reduce the amount of deformation of the photosensitive chip caused by the stress.

Based on this, this application has proposed a photosensitive assembly, and it includes: the circuit board comprises a circuit board, a photosensitive chip electrically connected with the circuit board, at least one electronic component arranged on the circuit board, and a molding body integrally formed on the circuit board, wherein the molding body is provided with at least one groove concavely formed therein, and the groove is positioned on the outer side of the photosensitive chip. In this way, the stress applied to the photosensitive chip by the molding body is reduced by arranging the grooves on the molding body, so that the deformation of the photosensitive chip caused by stress is effectively reduced.

Having described the general principles of the present application, various non-limiting embodiments of the present application will now be described with reference to the accompanying drawings.

Exemplary Camera Module

As shown in fig. 3 to 5, a camera module according to an embodiment of the present application is illustrated, wherein the camera module includes an optical lens 10 and a photosensitive element 20, the optical lens 10 is maintained in a photosensitive path of the photosensitive element 20, so that light collected by the optical lens 10 can be imaged in the photosensitive element 20 along the photosensitive path. It should be noted that the camera module shown in fig. 3 is a fixed focus camera module, and of course, those skilled in the art should know that the camera module related to the present application can also be implemented as a moving focus camera module, that is, the camera module further includes a driving element (e.g., a motor) disposed between the optical lens 10 and the photosensitive component 20, so that the optical lens 10 is carried by the driving element to move along the photosensitive path, so as to change the distance between the optical lens 10 and the photosensitive component 20.

As shown in fig. 4, in the embodiment of the present application, the photosensitive assembly 20 includes a circuit board 21, a photosensitive chip 22, at least one electronic component 23, and a mold body 24. The photosensitive chip 22 is electrically connected to the circuit board 21. The at least one electronic component 23 is disposed around the photosensitive chip 22 and electrically connected to the circuit board 21. The molding body 24 is integrally formed on the circuit board 21 by a molding process to cover at least a portion of the circuit board 21. In particular, in the embodiment of the present application, the molding body 24 is provided with the groove 240 concavely formed therein, so as to reduce the magnitude of the stress applied to the photosensitive chip 22 by the molding body 24 through the groove 240, thereby effectively reducing the amount of deformation of the photosensitive chip 22 due to the stress.

Specifically, in the embodiment of the present application, the at least one electronic component 23 may be mounted on the upper Surface of the circuit board 21 by a Surface Mounting Technology (Surface Mounting Technology). Generally, the at least one electronic component 23 is mounted on the peripheral region of the photosensitive chip 22. Alternatively, the at least one electronic component 23 may be embedded in the circuit board 21, so as to reduce the height of the at least one electronic component 23 protruding from the circuit board 21. It should be understood that the mounting process for the at least one electronic component 23 is not limited by the present application. Meanwhile, in the embodiment of the present application, the type of the at least one electronic component 23 is not limited in the present application, and includes but is not limited to a capacitor, an inductor, a triode, a thyristor, a resistor, and the like.

As shown in fig. 4, in the embodiment of the present application, the electrical connection between the photosensitive chip 22 and the circuit board 21 is realized by a lead 25. Specifically, in the embodiment of the present application, each of the leads 25 extends between the light sensing chip 22 and the circuit board 21 in a bending manner, so that the light sensing chip 22 is electrically connected to the circuit board 21 through the lead 25, the circuit board 21 can supply power to the light sensing chip 22 based on the lead 25, and the light sensing chip 22 can transmit the collected signals based on the lead 25. It is noted that the type of the lead 25 is not limited in the present application, and for example, the lead 25 may be a gold wire, a silver wire, or a copper wire. The lead 25 can be mounted between the circuit board 21 and the light sensing chip 22 by a "gold wire bonding" process for electrical connection therebetween.

Specifically, "gold wire bonding" processes generally fall into two types: the 'forward bonding of gold thread' process and the 'reverse bonding of gold thread' process. The "direct bonding gold wire" process means that in the process of laying the lead wires 25, one end of the lead wires 25 is first formed on the conductive end of the wiring board 21, the lead wires 25 are further extended in a bent manner, and finally the other end of the lead wires 25 is formed on the conductive end of the photosensitive chip 22, in such a manner that the lead wires 25 are formed between the photosensitive chip 22 and the wiring board 21. The "reverse gold wire bonding" process means that in the process of laying the lead 25, one end of the lead 25 is first formed on the conductive end of the photosensitive chip 22, the lead 25 is then extended curvedly, and finally the other end of the lead 25 is formed on the conductive end of the wiring board 21, in such a manner that the lead 25 is formed between the photosensitive chip 22 and the wiring board 21. It is worth mentioning that the height of the upward protrusion of the lead 25 formed by the "reverse bonding wire" process is higher than the height of the upward protrusion of the lead 25 formed by the "forward bonding wire" process, and therefore, preferably, in this embodiment, the lead 25 is formed by the "reverse bonding wire" process.

Of course, those skilled in the art should understand that in other examples of the present application, the photosensitive chip 22 and the circuit board 21 can be conducted in other manners, such as a backside conduction manner. And is not intended to limit the scope of the present application.

As shown in fig. 4, in the embodiment of the present application, the molding body 24 is integrally formed on the circuit board 21 to integrally cover at least a portion of the circuit board 21, at least a portion of the non-photosensitive region of the photosensitive chip 22, and at least a portion of the at least one electronic component 23. In particular, in the present embodiment, the molded body 24 has at least one slot 240 concavely formed therein. The grooves 240 are located outside the photosensitive chip 22 from the layout position, and by such a position setting, the grooves 240 can effectively reduce the stress applied to the photosensitive chip 22 by the mold body 24, so as to effectively reduce the deformation of the photosensitive chip 22 caused by the stress.

Specifically, since the bonding of the wiring board 21 and the molded body 24, and the bonding of the molded body 24 and the photosensitive chip 22 belong to rigid bonding, and the bonding between the photosensitive chip 22 and the wiring board 21 belongs to flexible bonding, and the thermal expansion coefficients of the wiring board 21, the molded body 24, and the photosensitive chip 22 are different, stress may be generated between the wiring board 21 and the molded body 24, and between the photosensitive chip 22 and the molded body 24. Further, since the degree of shrinkage of the photosensitive chip 22 is minimized, stress is intensively applied to the photosensitive chip 22. Accordingly, by providing the longitudinal groove 240 on the outer side of the photosensitive chip 22 (or between the photosensitive chip 22 and the mold body 24), the amount of stress transfer between the mold body 24 and the photosensitive chip 22 can be reduced. Intuitively, as shown in fig. 4, by providing a longitudinal groove 240 on the molded body 24, the thickness of the molded portion of the molded body 24 for transmitting stress is reduced to reduce the amount of stress applied to the photosensitive chip 22 by the molded body 24.

From the perspective of the stress transmission path, the slot 240 disposed between the photo sensor chip 22 and the mold body 24 is equivalent to "cutting a knife" on the stress transmission chain of the mold body 24 and the photo sensor chip 22 to break the stress transmission chain. More specifically, the forming position of the slot 240 may be disposed between the electronic component 23 and the lead 25, between the electronic component 23 and the electronic component 23, or outside the electronic component 23, which is not limited in this application. Preferably, in the embodiment of the present application, the forming position of the slot 240 is set between the electronic component 23 and the lead 25.

It should be appreciated that the ability of the trench 240 to reduce the stress of the mold body 24 on the photo-sensing die 22 is related to the depth of the trench 240. Specifically, as the depth of the trench 240 increases, the trench 240 has a greater ability to reduce the stress applied to the photosensitive chip 22 by the mold body 24. In particular, in some examples of the present application, the depth of the channels 240 is greater than or equal to 30% of the height of the molded body 24, as shown in fig. 6A and 6B. Here, the height of the molding body 24 indicates the height of the molding body 24 at the position where the groove 240 is provided, wherein it is understood that the heights of the molding body 24 at different positions may be different due to the shape configuration of the molding body 24. Preferably, the depth of the grooves 240 is greater than or equal to half the height of the molded body 24.

More preferably, in the present embodiment, the depth of the groove 240 is equal to the height of the molded body 24. That is, preferably, the open groove 240 is a through groove penetratingly formed at the molding body 24 to expose a corresponding region of the circuit board 21. It should be understood that when the groove 240 is a through groove penetrating through the molding body 24, the stress transmission chain between the molding body 24 and the photosensitive chip 22 is completely cut off by the groove 240, so that the stress applied to the photosensitive chip 22 by the molding body 24 is minimized. It should be noted that, in the embodiment of the present application, the width of the groove 240 may be increased as much as possible without damaging the overall structural strength of the mold body 24 too much, so as to enhance the ability of the groove 240 to reduce the stress applied by the mold body 24 to the photosensitive chip 22.

As shown in fig. 3 to 5, when the trench 240 is formed in the mold body 24, the mold body 24 is divided into a first mold part 241 and a second mold part 242 by taking the trench 240 as a boundary, wherein the first mold part 241 covers at least a portion of the circuit board 21 and at least a portion of the non-photosensitive region of the photosensitive chip 22, and the second mold part 242 covers at least a portion of the at least one electronic component 23 and at least a portion of the circuit board 21.

It should be noted that, in the embodiment of the present application, since the molding body 24 is divided into the first molding portion 241 and the second molding portion 242 by the slot 240, compared to the conventional molding process, the volume of the molding portion covering the photo chip 22 is reduced, so that the shrinkage of the molding portion covering the photo chip 22 is reduced under the same shrinkage rate, and the stress generated by the molding portion is also reduced accordingly, so as to reduce the bending amount of the photo chip 22. In particular, in the embodiment of the present application, the first molding portion 241 may have a smaller volume than the second molding portion 242 to reduce stress applied to the photosensitive chip 22 by the molding body 24.

In particular, as shown in fig. 5, in the embodiment of the present application, the first molding portion 241 and the second molding portion 242 of the molding body 24 are connected by a molding passage 243. Specifically, as shown in fig. 5, in the embodiment of the present application, the at least one slot 240 includes a first slot 2401 and a second slot 2402, wherein the first slot 2401 and the second slot 2402 are respectively formed through the molding body 24. In particular, the first slot 2401 and the second slot 2402 encircle the first mold portion 241 and join at the mold channel 243. That is, in the embodiment of the present application, the molding passage 243 is formed between the first slot 2401 and the second slot 2402 to divide the molding body 24 into the first molding part 241 and the second molding part 242 through the first slot 2401 and the second slot 2402 after the molding body 24 is molded, and the first mold is formedThe molding part 241 and the second molding part 242 are connected by the molding passage 243. Preferably, in the embodiment of the present application, the first slot 2401 and the second slot 2402 are symmetrically arranged with respect to the center line of the photosensitive chip 22, and the first slot 2401 and the second slot 2402 have

Font. Of course, in other examples of the embodiment of the present application, the first slot 2401 and the second slot 2402 may be arranged in an asymmetric manner, or when the first slot 2401 and the second slot 2402 are arranged in a symmetric manner, the first slot 2401 and the second slot 2402 may be implemented in other shapes, such as an "I" shape, which is not limited in this application.

It is worth mentioning that, in other examples of the present application, the at least one slot 240 may further include a greater number of slots 240 (for example, further includes a third slot 2403) or only includes the first slot 2401 surrounding the first molding portion 241, which is not limited by the present application.

Fig. 7A and 7B are schematic diagrams illustrating a modified implementation of the photosensitive assembly 20 according to an embodiment of the present application. As shown in fig. 7A and 7B, in this modified embodiment, the first molding portion 241 and the second molding portion 242 of the molding body 24 are connected by a molding passage 243. In particular, in the present modified embodiment, the molding passage 243 has a height lower than the first molding part 241 and the second molding part 242 to form a third opening 2403 between the molding passage 243, the first molding part 241, and the second molding part 242. That is, in this modified embodiment, the slots 240 include not only the first slots 2401 and the second slots 2402 penetrating the mold body 24 but also the third slots 2403 formed by the molding body 24 passage and the first molding portion 241 and the second molding portion 242. It should be understood that the first and

second molding portions

241, 242 of the molding body 24 illustrated in fig. 7A and 7B can be formed by a one-shot molding process, wherein the molding channel 243 is provided for this purpose.

Fig. 8A and 8B are schematic diagrams illustrating a modified implementation of the photosensitive assembly 20 according to an embodiment of the present application. As shown in fig. 8A and 8B, in this modified embodiment, the first molding portion 241 and the second molding portion 242 of the molding body 24 are connected by a molding passage 243. In particular, in this modified embodiment, the molding body 24 includes only one molding passage 243, and the molding passage 243 may have a height lower than or equal to the first molding part 241 and the second molding part 242. In the embodiment of the present application, the slot 240 has a shape as shown in FIG. 8B

Font. It should be understood that the first and

second molding portions

241, 242 of the molding body 24 illustrated in fig. 8A and 8B can be formed by a one-shot molding process, wherein the molding channel 243 is provided for this purpose.

Fig. 9A and 9B illustrate schematic views of a photosensitive assembly 20 according to another embodiment of the present application. As shown in fig. 9A and 9B, compared to the intended photosensitive assembly 20 shown in fig. 4, in the embodiment of the present application, the groove 240A is a closed ring groove completely surrounding the first molding portion 241A. That is, in the embodiment of the present application, the first molding portion 241A and the second molding portion 242A of the molding body 24A are divided into two molding portions independent of each other by the slot 240A. That is, in the embodiment of the present application, the slot 240A can completely block the connection between the first molding portion 241A and the second molding portion 242A, so that the stress generated by the second molding portion 242A is not transmitted to the first molding portion 241A and further not transmitted to the photosensitive chip 22A. In particular, in the embodiment of the present application, the first molding portion 241A and the second molding portion 242 are formed by a two-shot molding process. That is, in the embodiment of the present application, the first molding part 241A and the second molding part 242A are separately formed in batches, and the molded body 24 illustrated in fig. 4 may be formed by a one-time molding process. In this regard, a more detailed description will be provided in the subsequent process of manufacturing the photosensitive element 20A, and will be omitted.

In order to prevent the photosensitive chip 22 from being shifted in position due to impact of injected molding material during the molding process, in some examples of the embodiment of the present application, the photosensitive assembly 20 further includes a side coating 28 covering the side of the photosensitive chip 22 and at least a portion of the leads 25, so as to prevent the photosensitive chip 22 from being shifted in position during the molding process, which is shown in fig. 10. It should be understood that the side encapsulation 28 not only can prevent the position of the photosensitive chip 22 from shifting, but also can effectively reduce the stress generated by the molding body 24 from being transmitted to the photosensitive chip 22, and at the same time, can prevent the leads 25 from being collapsed by the impact of the molding material.

Further, as shown in fig. 4, in the embodiment of the present application, the photosensitive assembly 20 further includes a filter element 26 that is maintained in a photosensitive path of the photosensitive chip 22, wherein the filter element 26 corresponds to at least a photosensitive area of the photosensitive chip 22 and is used for filtering light entering the photosensitive chip 22 to improve imaging quality. In particular, in the embodiment of the present application, the filter element 26 is attached to the first molding portion 241 of the molding body 24 to maintain a photosensitive path of the photosensitive chip 22. It should be noted that when the slot 240 is disposed between the electronic component 23 and the lead 25, the slot 240 is adjacent to the first molding portion 241, so that when the filter element 26 is mounted on the first molding portion 241, the overflowing glue can be contained in the slot 240, so as to prevent the unnecessary glue from contaminating other components (especially, the photosensitive chip 22). That is, in the embodiment of the present application, the slot 240 also functions as a glue overflow slot. It should be understood that, in some examples of the embodiments of the present application, a guiding groove connected to the groove 240 may be further concavely formed on the upper surface of the first molding part 241 for guiding the flow of the excess glue to the groove 240.

In some examples of embodiments of the present application, as shown in fig. 11, the first molding part 241 further includes a mounting platform 260 concavely formed on an upper surface of the first molding part 241, the mounting platform 260 being configured to mount the filter element 26 thereon. It should be appreciated that mounting the filter element 26 to the mounting platform 260 facilitates reducing the size of the filter element 26 to reduce the cost of the filter element 26 as compared to directly attaching the filter element 26 to the upper surface of the first mold portion 241. In addition, in this way, the distance between the filter element 26 and the photosensitive chip 22 can be shortened, so that the overall thickness of the photosensitive assembly 20 can be reduced. It should be noted that, in the embodiment of the present application, the inner side surface of the first molding portion 241 may be perpendicular to the photosensitive chip 22 or inclined to the photosensitive chip 22, wherein the inner side surfaces arranged in different manners correspond to different convex parameter configurations of the forming mold 90, which is not limited by the present application.

Those skilled in the art will appreciate that in the present embodiment, the filter element 26 can be implemented in different types, including but not limited to the filter element 26 can be implemented as an infrared cut filter, a full transmission spectrum filter, and other filters or combinations of filters. Specifically, for example, when the filter element 26 is implemented as a combination of an infrared cut filter and a full-transmission spectrum filter, that is, the infrared cut filter and the full-transmission spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 22, so that, when used in an environment with sufficient light, such as daytime, the infrared cut filter can be switched to the photosensitive path of the photosensitive chip 22 to filter, through the infrared cut filter, infrared rays in the light reflected by the object entering the photosensitive chip 22, and, when used in an environment with low light, such as, nighttime, the full-transmission spectrum filter can be switched to the photosensitive path of the photosensitive chip 22 to allow partial transmission of infrared rays in the light reflected by the object entering the photosensitive chip 22.

Fig. 12 illustrates a schematic diagram of a further variant implementation of the photosensitive assembly 20 according to an embodiment of the present application. As shown in fig. 12, in this modified embodiment, the photosensitive assembly 20 further includes a filter element holder 27, wherein the filter element holder 27 is disposed in the slot 240 and configured to mount the filter element 26 thereon. Specifically, in this modified embodiment, the filter element holder 27 includes a holder main body and support arms extending inward from the holder main body, wherein the support arms form through-holes corresponding to at least the photosensitive regions of the photosensitive chips 22. Accordingly, when the filter element 26 is mounted on the support arm, the filter element 26 covers the through hole so that light is filtered by the filter element 26 before reaching the photosensitive chip 22 through the through hole, thereby improving the imaging quality. It will be appreciated that the size of the filter element 26 can be further reduced by the support arms of the filter element holder 27, so that the cost of the filter element 26 is further reduced. It should be noted that in other examples of the embodiment of the present application, the filter element 26 can also be held in the photosensitive path of the photosensitive chip 22 in other manners, for example, the filter element 26 can be directly stacked on the photosensitive chip 22 and participate in the molding process, so that the first molding portion 241 of the molded body 24 covers a portion of the filter element 26 and at least a portion of the circuit board 21 after molding. For another example, the filter element 26 may be supported in the optical lens 10, or may be formed on the surface of a lens in the optical lens 10 in a form of a coating film. And is not intended to limit the scope of the present application.

FIG. 13 illustrates a schematic view of a photosensitive assembly 20 according to yet another embodiment of the present application. As shown in fig. 13, in the embodiment of the present application, the filter element holder 27B is between a first molding portion 241B and a second molding portion 242B integrally bonded to the molding body 24B. Specifically, in the present embodiment, the filter element holder 27B is provided to the wiring board 21B before the molding process is performed, and the filter element holder 27B has a passage (not shown) therethrough, wherein the passage is configured to allow the molding material to flow therethrough. Specifically, the passage may be provided at the bottom of the filter holder 27B, or may be penetratingly formed at a sidewall of the filter holder 27B. Accordingly, after the molding material is injected into the molding die 90B and the molded body 24B is formed, the filter element holder 27B is integrally coupled between the first molding part 241B and the second molding part 242B of the molded body 24B. How the filter element 26B is combined between the first molding portion 241B and the second molding portion 242B, and how the molding body 24B is molded will be further described in the following manufacturing process of the photosensitive assembly 20B, and will not be described in detail here.

Preferably, in this embodiment of the present application, the filter element holder 27B is made of a material having a relatively high rigidity (e.g., metal, PMMA, ceramic, ABS resin, etc.), so that the filter element holder 27B has a relatively high structural strength. It should be observed that, after the molding body 24B is integrally formed, the inner side surface of the filter element holder 27B is wrapped and bonded to the first molding portion 241B, and the outer side surface of the filter element 26B is integrally bonded to the second molding portion 242B, so that the filter element holder 27B can play a role of maintaining the shape of the first molding portion 241B, thereby ensuring that the internal stress generated by the first molding portion 241B is not enough to excessively change the shape of the photosensitive chip 22B. Moreover, since the filter element holder 27B is disposed between the first molding portion 241B and the second molding portion 242B, the stress generated by the second molding portion 242B can be blocked by the filter element holder 27B, so that the stress generated by the second molding portion 242B cannot affect the photosensitive chip 22B located inside the filter element holder 27B.

That is, in the embodiment of the present application, the filter element holder 27B integrally coupled to the first molding portion 241B and the second molding portion 242B of the molding body 24B can be used not only for mounting the filter element 26B thereon but also for preventing the stress generated by the second molding portion 242B from affecting the photosensitive chip 22B, and for maintaining the shape of the first molding portion 241B to ensure that the internal stress generated by the first molding portion 241B is not sufficient to excessively change the shape of the photosensitive chip 22B.

It is worth mentioning that, as shown in fig. 3-13, the disposition of the slot 240 not only can reduce the stress applied by the mold body 24 to the photosensitive chip 22, but also can increase the overall exposed surface area of the mold body 24, so that the stress generated by the mold body 24 can be relatively more distributed to the outer surface of the mold body 24, so as to relatively reduce the stress applied by the mold body 24 to the photosensitive chip 22. It should be appreciated that the provision of the groove 240 increases the overall exposed surface area of the molded body 24, and the groove 240 provides a heat dissipation channel so that heat generated during the operation of the photosensitive assembly 20 can be dissipated through the heat dissipation channel, which is beneficial for improving the heat dissipation performance of the photosensitive assembly 20. It should also be noted that, in the embodiment of the present application, in order to take the stress influence of the molded body 24 into consideration, the grooves 240 with a certain depth are formed in the molded body, and the heat dissipation area of the heat dissipation channel is increased as the depth of the grooves 240 is increased, so that the heat dissipation performance of the photosensitive assembly 20 can be enhanced. In particular, as previously mentioned, in the present embodiment, the depth of the channels 240 is greater than or equal to 30% of the height of the molded body 24.

It should also be noted that the molded body 24 of the embodiment of the present application may also be formed by a molding process, wherein the molding material includes, but is not limited to, powdered, gel-like epoxy resin, etc., and the present application is not limited thereto.

Fig. 14 illustrates another modified embodiment of the photosensitive assembly 20 according to an embodiment of the present application. As shown in fig. 14, in this modified embodiment, the photosensitive assembly 20 further includes a reinforcing plate provided on the lower surface of the circuit board 21 to reinforce the structural strength of the circuit board 21 by the reinforcing plate. The reason for this is that when the notch 240 is opened in the molded body 24, the structural strength of a partial region (exposed region) of the wiring board 21 is weakened, and the wiring board 21 can be prevented from being deformed or even broken by the reinforcing plate. Preferably, the reinforcing plate is made of a material having high rigidity, for example, metal, ceramic, ABS resin, or the like.

In summary, the camera module and the photosensitive assembly thereof according to the embodiment of the present application are clarified, and the stress applied to the photosensitive chip by the molding body is reduced by opening the groove on the molding body, so as to prevent the photosensitive chip from being excessively deformed due to a large stress, thereby improving the imaging quality of the camera module.

Exemplary photosensitive Assembly manufacturing Process

Fig. 15 illustrates a schematic diagram of a manufacturing process of the photosensitive member 20 according to an embodiment of the present application, wherein the manufacturing process of the photosensitive member 20 illustrated in fig. 15 is exemplified by manufacturing the photosensitive member 20 as illustrated in fig. 4.

As shown in fig. 15, the manufacturing process first includes: providing a circuit board jigsaw 210, and electrically connecting at least one electronic component 23 and at least one photosensitive chip 22 to the preset position of the jigsaw of the circuit board 21.

Further, the circuit board imposition 210 is placed in a forming mold 90, wherein the forming mold 90 comprises an upper mold 91 and a lower mold 92 matched with the upper mold 91. Specifically, in this example of the present application, the circuit board imposition 210 is placed on the lower mold 92 of the molding mold 90, and the upper mold 91 and the lower mold 92 are clamped, so that the circuit board imposition 210 is accommodated in the molding space defined by the upper mold 91 and the lower mold 92.

In particular, in the present embodiment, the upper mold 91 includes a mold body 911 and first and

second protrusions

912 and 913 extending downward from the mold body 911 at intervals, wherein the first and

second protrusions

912 and 913 have a closed ring shape, for example, a "square" shape in cross section. When the upper mold 91 and the lower mold 92 are closed, the first protrusion 912 of the upper mold 91 is attached to the circuit board imposition 210 and the second protrusion 913 of the upper mold 91 is attached to the photosensitive chip 22. Specifically, the first protrusion 912 is attached to the circuit board imposition 210 at a position between the lead 25 and the electronic component 23, and the second protrusion 913 is attached to the photosensitive chip 22 at a position in the non-photosensitive region of the photosensitive chip 22, so that a second molding space 915 is formed between the first protrusion 912 and the mold main body 911, and a first molding space 914 is formed between the second protrusion 913 and the first protrusion 912. Further, in this example of the present application, a molding channel (schematically shown in the figure) is further disposed on the first protrusion 912 for communicating the first molding space 914 and the second molding space 915.

Thus, after the molding material is injected into the molding space, the molding material gradually fills the second molding space 915 along the predetermined flow path and then fills the first molding space 914 along the molding passage (not shown). Further, after the curing and molding, the first molding portion 241 is formed in the first molding space 914, and the second molding portion 242 is formed in the second molding space 915, wherein the first molding portion 241 covers at least a portion of the circuit board 21 and at least a portion of the non-photosensitive area of the photosensitive chip 22, and the second molding portion 242 covers at least a portion of the at least one electronic component 23 and at least a portion of the circuit board 21. And, the second molding part 242 and the second molding part 242 are connected by the molding passage (not shown). Further, the slots 240 are formed at positions corresponding to the first protrusions 912, that is, the slots 240 penetrating the molding body 24 are formed at the first molding part 241 and the second molding part 242.

After obtaining the photosensitive assembly imposition, cutting the photosensitive assembly imposition to obtain a plurality of single photosensitive assemblies 20. Further, assembling the filter element 26 on the photosensitive assembly 20 results in the photosensitive assembly 20 as illustrated in fig. 4.

It should be noted that, in the embodiment of the present application, the manufacturing process of the photosensitive assembly 20 illustrated in fig. 6A and 6B, fig. 7A and 7B, fig. 8A and 8B, fig. 10, fig. 11, fig. 12, and fig. 14 is similar to the manufacturing process illustrated in fig. 4, and a person skilled in the art should easily deduce the manufacturing process based on the structural schematic diagrams of the photosensitive assembly 20 illustrated in fig. 6A and 6B, fig. 7A and 7B, fig. 8A and 8B, fig. 10, fig. 11, fig. 12, and fig. 14, so the description is not repeated here.

Fig. 16A and 16B illustrate a schematic diagram of a manufacturing process of the photosensitive assembly 20 according to an embodiment of the present application, in which the manufacturing process of the photosensitive assembly 20 illustrated in fig. 16A and 16B is exemplified by manufacturing the photosensitive assembly 20A illustrated in fig. 9A and 9B. It should be noted that the molded body 24A of the embodiment of the present application is formed by a molding process, wherein the molding material 900A includes, but is not limited to, powdered, gel-like or granular epoxy resin, and the like, and the present application is not limited thereto.

As shown in fig. 16A and 16B, the manufacturing process first includes: providing a circuit board imposition 210A, and electrically connecting at least one electronic component 23A and at least one photosensitive chip 22A to preset positions of the circuit board imposition 210A. Further, the molding material 900A is applied to the predetermined position of the circuit board imposition 210A.

Further, the circuit board imposition 210A is placed in a forming mold 90A, wherein the forming mold 90A comprises an upper mold 91A and a lower mold 92A matched with the upper mold 91A. Specifically, in this example of the present application, the circuit board imposition 210A is placed on the lower mold 92A of the molding mold 90A, and the upper mold 91A and the lower mold 92A are clamped, so that the circuit board imposition 210A is accommodated in the molding space defined by the upper mold 91A and the lower mold 92A.

In particular, in the present embodiment, the upper mold 91A includes a mold main body 911A and a first protrusion 912A extending downward from the mold main body 911A at a distance, and the cross section of the first protrusion 912A is a closed ring shape, for example, a "square". When the upper mold 91A and the lower mold 92A are closed, the first protrusion 912A of the upper mold 91A is attached to the non-photosensitive region of the photosensitive chip 22A, so as to seal at least the photosensitive region of the photosensitive chip 22A by the first protrusion 912A and form a first molding space 914A between the first protrusion 912A and the mold main body 911A, wherein the molding material 900A is accommodated in the first molding space 914A.

In this way, after the molding material 900A is cured and molded, the first molding portion 241A is formed in the first molding space 914A, wherein the first molding portion 241A covers at least a portion of the wiring board 21A and at least a portion of the non-photosensitive region of the photosensitive chip 22A.

Further, the upper mold 91A is replaced with a second upper mold 91 ' a, wherein the second upper mold 91 ' a includes a second mold main body 911 ' a and a second protrusion 913 ' a extending downward from the second mold main body 911 ' a. Further, the molding material 900A is applied to a predetermined position of the circuit board imposition 210A. Further, when the second upper mold 91 ' a and the lower mold 92A are closed, the second protrusion 913 ' a of the second upper mold 91 ' a is attached to the board imposition 210A, more specifically, a position attached to the board imposition 210 is provided between the lead 25A and the electronic component 23A, so that a second molding space 915 ' a is formed between the second protrusion 913 ' a and the second mold main body 911 ' a, and the molding material 900A is accommodated in the second molding space 915 ' a.

In this way, after the molding material is cured and molded, the second molding portion 242A is formed in the second molding space 915' a, wherein the second molding portion 242A covers at least a part of the at least one electronic component 23A and at least a part of the circuit board 21A. Further, the slots 240A are formed at positions corresponding to the second protrusions 913A, that is, the slots 240A penetrating the molding body 24A are formed at the first molding portion 241A and the second molding portion 242A.

It should be understood that in the present example, in order to prepare the photosensitive member 20A as illustrated in fig. 7, two molding processes are performed and different upper molds 91A are replaced in two different molding processes.

After obtaining the photosensitive assembly imposition, cutting the photosensitive assembly imposition to obtain a plurality of single photosensitive assemblies 20A. Further, assembling the filter element 26A on the photosensitive assembly 20A results in the photosensitive assembly 20A as illustrated in fig. 9A and 9B.

Fig. 17 illustrates a schematic diagram of a manufacturing process of the photosensitive assembly 20 according to an embodiment of the present application, wherein the manufacturing process of the photosensitive assembly 20 illustrated in fig. 17 exemplifies the manufacturing of the photosensitive assembly 20 in fig. 13.

As shown in fig. 17, the manufacturing process first includes: providing a circuit board imposition 210B, and electrically connecting at least one electronic component 23B and at least one photosensitive chip 22B to a preset position of the circuit board imposition 210B.

Further, the filter element holder 27B having a passage (not shown) is provided to the board imposition 210B. Specifically, the filter holder 27B is disposed at a position where the makeup of the filter 26B is located outside the photosensitive chip 22B, or between the lead 25B and the electronic component 23B.

Further, the circuit board imposition 210B is placed in a forming mold 90B, wherein the forming mold 90B comprises an upper mold 91B and a lower mold 92B matched with the upper mold 91B. Specifically, in this example of the present application, the circuit board imposition 210B is placed on the lower mold 92B of the molding mold 90B, and the upper mold 91B and the lower mold 92B are clamped, so that the circuit board imposition 210B is accommodated in the molding space defined by the upper mold 91B and the lower mold 92B.

In particular, in the present embodiment, the upper mold 91B includes a mold main body 911B and first and

second protrusions

912B and 913B extending downward from the mold main body 911B at intervals, wherein the first and

second protrusions

912B and 913B have a closed ring shape, for example, a square shape in cross section. When the upper mold 91B and the lower mold 92B are closed, the first protrusion 912B of the upper mold 91B is attached to the filter holder 27B and the second protrusion 913B of the upper mold 91B is attached to the non-photosensitive region of the photosensitive chip 22B, so as to form a second molding space 915B between the first protrusion 912B and the mold main body 911B, and form a first molding space 914B between the second protrusion 913B and the first protrusion 912B, wherein the first molding space 914 and the second molding space 915B are communicated through the channel (not shown) provided in the filter holder 27B.

Thus, after the molding material is injected into the molding space, the molding material gradually fills the second molding space 915B along the predetermined flow path and then fills the first molding space 914B along the passage. Further, after the curing molding, the first molding portion 241B is formed in the first molding space 914B, the second molding portion 242B is formed in the second molding space 915B, and the filter element 26B is integrally bonded between the second molding portion 242B and the second molding portion 242B, wherein the first molding portion 241B covers at least a part of the circuit board 21B and at least a part of the non-photosensitive region of the photosensitive chip 22B, and the second molding portion 242B covers at least a part of the at least one electronic component 23B and at least a part of the circuit board 21B.

After obtaining the photosensitive assembly imposition, cutting the photosensitive assembly imposition to obtain a plurality of single photosensitive assemblies 20B. Further, assembling the filter element 26B on the photosensitive assembly 20B results in the photosensitive assembly 20B as illustrated in fig. 13.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims

1. A photosensitive assembly, comprising:

a circuit board;

the photosensitive chip is electrically connected with the circuit board; and

2. A photosensitive assembly according to claim 1, wherein said molded body comprises a first molded portion and a second molded portion separated by said slot, said first molded portion encapsulating at least a portion of a circuit board and at least a portion of a non-photosensitive region of said photosensitive chip.

3. The photosensitive assembly of claim 2, further comprising at least one electronic component disposed on the circuit board, wherein the second molding portion encapsulates at least a portion of the at least one electronic component and at least a portion of the circuit board.

4. A photosensitive assembly according to claim 1, wherein the depth of the groove is equal to or greater than 30% of the height of the molded body.

5. A photosensitive assembly according to claim 2, wherein the slot is formed through the molded body to expose a corresponding region of the circuit board.

6. A photosensitive assembly according to claim 5, wherein the first and second mold portions are connected by a mold tunnel.

7. A photosensitive assembly according to claim 6, wherein said at least one slot includes a first slot and a second slot, said first slot and said second slot being symmetrically disposed with respect to said photosensitive chip, wherein said molding channel is formed between said first slot and said second slot during a molding process.

8. A photosensitive assembly according to claim 5, wherein said groove is a closed ring groove surrounding said first molded portion to divide said molded body into said first molded portion and said second molded portion which are independent of each other.

9. A photosensitive assembly according to claim 8, wherein the first and second molded portions are formed by a two-shot molding process.

10. The photosensitive assembly of claim 1, further comprising a filter element holder disposed within the slot, wherein the filter element holder is configured to mount a filter element thereon.

11. The photosensitive assembly of claim 5, further comprising a filter element holder disposed in the slot, wherein the filter element holder is configured to mount a filter element thereon.

12. The photosensitive assembly of claim 11, wherein the filter element holder has a passage therethrough, wherein the filter element holder is pre-set to the circuit board and is integrally bonded to the first molding portion and the second molding portion of the molding after the molding is integrally formed.

13. The photosensitive assembly of claim 1 further comprising a side encapsulation encapsulating the sides of the photosensitive chip and at least portions of the leads for electrically connecting the photosensitive chip to the circuit board.

14. The utility model provides a module of making a video recording which characterized in that includes:

an optical lens;

the photosensitive assembly of any one of claims 1-13, wherein the optical lens is retained in a photosensitive path of the photosensitive assembly.