CN113823653B - Photosensitive components and camera modules - Google Patents

Abstract

The camera comprises a photosensitive assembly and a camera module, wherein the photosensitive assembly comprises a circuit board, a photosensitive element, a molding base and a light filtering element, and the photosensitive element is operatively connected to the circuit board; the molded base is integrally bonded to the circuit board and the photosensitive element and forms a light window, wherein the molded base has one or more first portion inner surfaces adjacent to the photosensitive element and one or more second portion inner surfaces connected to the first portion inner surfaces remote from the photosensitive element; the optical filter element is assembled on the top side of the molded base, the optical filter element comprises an optical filter element main body and at least one shading layer arranged on at least one side of the top side and the bottom side of the optical filter element main body, and a light suppression groove is formed among the shading layer, the inner surface of the first part and the inner surface of the second part and the outer side part of the light window; the camera shooting module comprises the photosensitive component and a lens; the filter element is positioned between the photosensitive element and the lens.

Description

Photosensitive components and camera modules

This application is a divisional application of the Chinese invention patent application with application number "201880056738.6". The application date of the original application is September 19, 2018 (PCT international application date), the Chinese national application number is "201880056738.6" (PCT international application number is PCT/CN2018/106351), and the name of the invention is "Camera module, photosensitive component, photosensitive component panel and its molding mold and manufacturing method".

Technical Field

The present invention relates to the field of camera modules, and further to a photosensitive component manufactured by a molding process, a photosensitive component panel and a manufacturing method thereof, and a camera module having the photosensitive component.

Background technique

The molding packaging technology of the camera module is a new packaging technology that has been developed based on the traditional COB packaging. As shown in Figures 1A to 1C, it is a circuit board packaged using the existing integrated packaging technology. In this structure, a packaging part 1 is packaged in a circuit board 2 and a photosensitive chip 3 by an integrated packaging method to form an integrated packaging assembly, and the packaging part 1 covers a plurality of electronic components 201 of the circuit board 2 and a series of leads 202 electrically connecting the photosensitive chip 3 and the circuit board 2, so that the length, width and thickness dimensions of the camera module can be reduced, the assembly tolerance can be reduced, the lens or lens assembly above the integrated packaging assembly can be installed flatly, and the problem of dust attached to the electronic components affecting the imaging quality of the camera module is solved.

More specifically, as shown in FIG. 1A and FIG. 1B , in order to improve production efficiency, the one-piece package assembly is generally produced by panelization, that is, a plurality of the one-piece package assemblies are produced at one time. More specifically, FIG. 1A and FIG. 1B show a method of producing the one-piece package assembly by panelization using a molding die. The molding die includes an upper die 101 and a lower die 102, wherein a circuit board panel is placed in the lower die 102 of the molding die, and the circuit board panel includes a plurality of columns of circuit boards, each column of circuit boards includes a plurality of circuit boards 2, and each circuit board 2 is operably connected to a photosensitive chip 3. The upper mold 101 and the lower mold 102 are combined to form a molding cavity, so that the upper mold 101 is pressed onto the circuit board assembly, corresponding to the two end sides of the photosensitive chip 3 on each column of the circuit board, two flow channels 103 and 104 are formed in the upper mold, and the upper mold 101 has a plurality of bumps 105, and an intermediate flow channel 106 is formed between two adjacent bumps 105, so that the plurality of intermediate flow channels 106 extend between the two flow channels 103 and 104.

During the molding process, the fluid packaging material 4 flows forward along the two channels 103 and 104 and fills the middle channel 106 between two adjacent bumps 105, so that the area between two adjacent photosensitive chips 3 is also filled with the packaging material 4, so that the packaging material 4 can form the packaging part 1 on the corresponding circuit boards 2 and the photosensitive chips 3 after solidification, and form a light window located in the middle of the packaging part 1 at the position corresponding to each bump 105, and these packaging parts 1 are integrally molded to form a connected structure, as shown in Figure 1C.

As shown in FIG. 1E , the thermosetting encapsulation material 4 has a curing time T during the molding process. As time goes by, its viscosity first decreases to the lowest point, and then gradually rises to the highest point and is completely cured. Ideally, when the viscosity of the encapsulation material 4 is relatively low, the encapsulation material 4 will fill the flow channels 103, 104 and 106. When the encapsulation material 4 is still flowing forward at a relatively high viscosity, it will have a relatively large friction with the lead 202 between the circuit board 2 and the photosensitive chip 3, which may easily cause deformation and damage to the lead 202.

In the above molding process, the encapsulating material 4 is a thermosetting material, which enters the two flow channels 103 and 104 after melting, and solidifies under heating conditions. However, in actual production, it is found that when the encapsulating material 4 flows forward along the two flow channels 103 and 104 in the molding process, if the width of the two flow channels 103 and 104 is small, it may cause problems.

More specifically, because the packaging material 4 is a fluid with a predetermined viscosity, the sizes of the two flow channels 103 and 104 are relatively small and, for example, the flow channel 103 is a narrower flow channel, the flow rate in the flow channel 103 is relatively small, and the friction generated by the inner wall of the flow channel 103 on the fluid packaging material 4 in the flow channel 103 has a relatively large effect on its flow rate, so the flow rate of the packaging material 4 in the flow channel 103 is relatively slow. In this way, during the curing time T of the packaging material 4, the packaging material 4 in the flow channel 103 may not flow from its feed end to its end within the curing time T, resulting in that a local position of the flow channel 103 cannot be filled, such as the area S shown in FIG. 1D, so that a conjoined structure of the packaging part 1 with a series of complete shapes cannot be formed between the upper mold 101 and the lower mold 102, and a gap is formed in the packaging part 1 corresponding to the position of the area S, so that a light window closed on all sides cannot be formed. In addition, if the width of the flow channel 104 is narrow, the flow channel 104 may also appear as shown in FIG. 1D.

In addition, if, for example, the packaging material 4 in the flow channel 103 flows forward too slowly and has a high viscosity, it will still flow forward in the flow channel 103, resulting in a large friction force on the lead 202 flowing through it, causing the lead 202 to deflect forward to a large extent, which can easily cause the lead 202 to deform and be damaged, and easily fall off the pad.

As shown in FIG1F , it is a camera module packaged using the existing integrated packaging technology, which includes a packaging part 1, a circuit board 2, a photosensitive chip 3, a filter 5, and a lens assembly 6. In this structure, the packaging part 1 is packaged in the circuit board 2 and the photosensitive chip 3 by an integrated packaging method, thereby forming an integrated package assembly, and the packaging part 1 covers a series of electronic components 201 of the circuit board 2 and a series of leads 202 electrically connecting the photosensitive chip 3 and the circuit board 2, so that the length, width and thickness of the camera module can be reduced, the assembly tolerance can be reduced, the lens assembly 6 above the integrated package assembly can be installed flatly, and the problem of dust attached to the electronic components 201 affecting the imaging quality of the camera module is solved.

In addition, to facilitate demolding, the inner surface of the packaging part 1 is usually formed to extend obliquely from the photosensitive chip 3 as a whole, which will result in a reduction in the area of the top surface of the packaging part 1, and the top side of the packaging part 1 is required to install the upper optical devices of the camera module, such as the lens assembly 6 mentioned above, or additional lens mounts and other components. However, the smaller top surface of the packaging part 1 may not provide enough mounting surface for the upper optical devices of the camera module, making it impossible to stably install these upper optical devices and making it easy for glue to overflow from the mounting surface.

As shown in FIG. 1B , the manufacturing process of the integrated component, the circuit board 201 connected with the photosensitive chip 3 is placed in a mold, a bump 105 is pressed on the photosensitive chip 3 as a pressure head, and the flow channels 103, 104 and 106 in the mold substantially form a groove 107 around the bump 105, and a packaging material 4 in a fluid state is filled into the groove 107, and after solidification, the packaging part 1 is formed, and a through hole of the packaging part 1 is formed corresponding to the position of the bump 105. The bump 105 has an inclined outer surface 1051, thereby forming the inner surface of the packaging part 1 extending integrally.

However, in the integrated packaging process, the fluid packaging material may enter between the photosensitive chip 3 and the bottom surface of the bump 105, so that the packaging material reaches the photosensitive area of the photosensitive chip 3, forming a "flash", thereby affecting the photosensitive effect of the photosensitive chip 3. In addition, a filling groove 1071 is formed at the bottom side of the groove 107 between the photosensitive chip 3 and the inclined outer surface 1051 of the bump 105. In the integrated packaging process, the packaging material enters the filling groove 1071, and the inclined outer surface 1051 of the bump 105 extending obliquely tends to guide the packaging material into the filling groove 1071, resulting in a larger volume of the filling groove 1071, and the fluid packaging material generates a larger pressure and pressure, thereby increasing the probability of the packaging material entering between the photosensitive chip 3 and the bottom surface of the bump 105, so that the packaging material is easy to contaminate the photosensitive area of the photosensitive chip 3, thereby affecting the photosensitive performance of the photosensitive chip 3. Furthermore, if the pressure of the bump 105 pressed onto the photosensitive chip 3 is increased in order to reduce the generation of “flash”, the photosensitive chip 3 may be damaged.

Summary of the invention

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein in a manufacturing method of a puzzle panel of a photosensitive component, the molding material in the molding process can fill a base puzzle panel molding guide groove in a molding mold to avoid the production of defective photosensitive components.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein in the molding process, the molding material can form a one-piece molded base on a circuit board panel, and the one-piece molded base can form a light window closed on all sides at the position corresponding to each photosensitive element, so that after the formed one-piece photosensitive component panel is cut, a molding base with the light window is formed on each circuit board and the corresponding photosensitive element, preventing the local formation of an opening on the molding base and connecting the light window to the outside of the molding base.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein the base panel forming guide groove is used to form the one-piece molded base on a row of circuit boards, which has two guide grooves on both sides, and a plurality of filling grooves extending laterally between the two guide grooves, and the molding material flows and solidifies in the guide grooves and the filling grooves, wherein the side walls of the two guide grooves are designed to increase the volume of the guide grooves, so that the molding material can flow forward from the feed ends of the two guide grooves and fill the guide grooves and the filling grooves of the entire base panel forming guide groove.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein the base panel forming guide groove is used to form the one-piece molded base on two adjacent rows of circuit boards integrated in a rigid area, which has two first guide grooves on both sides, a second guide groove in the middle, and a plurality of filling grooves respectively located between the two first guide grooves and the second guide grooves, the molding material flows and solidifies in the guide grooves and the filling grooves, wherein the side walls of the two first guide grooves and the second guide grooves are designed to increase the volume of the guide grooves, so that the molding material can flow forward from the feed ends of the two guide grooves and fill the guide grooves and the filling grooves of the entire base panel forming guide groove.

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein when the size of the guide groove is small to form a miniaturized photosensitive component, the side wall shape of the guide groove is designed to increase the volume of the guide groove, so that when the bottom width of the small-sized guide groove, such as the first guide groove mentioned above, is less than 1 mm, the entire base panel forming guide groove can still be filled in the molding process.

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein before the viscosity of the molding material reaches a higher value and solidifies, the molding material can fill the base panel forming guide groove, thereby preventing the connecting line between the circuit board and the photosensitive element from being damaged by the higher viscosity molding material flowing forward.

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the side walls of the guide groove are designed to increase the volume of the guide groove so that during the molding process, the molding material can reach the end of each guide groove from the feed end thereof, thereby preventing the molding material in a certain guide groove from flowing to another guide groove and hindering the forward flow of the molding material in the other guide groove.

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the molding process is capable of forming the integrated molded base on a column of circuit boards having multiple circuit boards and a column of photosensitive elements at one time, thereby forming a column of multiple photosensitive components through a panelization process, such as preferably 2-12 photosensitive components.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein the photosensitive component includes a molded base integrally molded on a photosensitive element and a circuit board, wherein in the process of forming the molded base by an integrated molding process, a molding material molded to form the molded base is not easy to enter between the photosensitive element and the bottom surface of a light window molding part of a molding mold to form "flash", thereby reducing the possibility of a photosensitive area of the photosensitive element being contaminated.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein the pressure and pressure intensity generated by the molding material entering the filling groove are reduced by reducing the volume of a filling groove between the photosensitive element and the outer surface of the light window molding part, thereby reducing the possibility of the molding material entering between the photosensitive element and the bottom surface of the light window molding part to form "flash".

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the outer surface of the light window molding part has outer surfaces extending in different directions, and the angle between the outer surface of the top side and the optical axis of the photosensitive component is smaller than the angle between the outer surface of the bottom side and the optical axis, thereby reducing the volume of the filling groove formed between the bottom side outer surface of the light window molding part and the photosensitive element, thereby reducing the possibility of generating "flash".

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the outer surface of the top side of the light window molding portion extends in a direction with a smaller angle with the optical axis, thereby slowing down the flow rate of the molding material entering the filling groove to a certain extent, reducing the pressure generated by the molding material entering the filling groove, and thus reducing the possibility of the generation of "flash".

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein because the molding material is not easy to form "flash" in the one-piece molding process, the light window molding part does not need to be pressed onto the photosensitive element with a large pressure, thereby avoiding the photosensitive element from being crushed.

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein two angles are formed between the outer surface of the light window molding part of the molding mold and the optical axis, wherein the bottom outer surface has an inclination angle, and the inclined extended bottom outer surface has a height of more than 0.05 mm to prevent the elastic coating covering the light window molding part from being easily punctured during the molding process.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein the molding base has multiple inner surfaces extending integrally, and the inner surface of the top side and the optical axis have a smaller angle than the inner surface of the bottom side and the optical axis, so that the inner surface of the molding base extends in a turning manner, and there is a smaller size of the molding material between the inner surface of the bottom side and the photosensitive element, so that the molding material is not easy to form "flash" on the photosensitive element.

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the molded base includes a photosensitive element combining portion and a top side extension portion extending integrally, and the inner surface of the molded base has different extension angles, wherein the top side extension portion has a smaller angle with the optical axis, thereby increasing the area of the top surface of the top side extension portion, thereby providing a larger mounting surface for the lens or filter element holder or lens assembly above the camera module, so as to stably mount the lens, the filter element holder or the lens assembly.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein the inner surface of the photosensitive element coupling portion of the molding base extends obliquely to facilitate the demolding operation in the molding process and reduce stray light reaching the photosensitive element, and the inner surface of the top side extension portion extends integrally from the inner surface of the photosensitive element coupling portion so that the photosensitive element coupling portion and the top side extension portion cooperate to maximize the area of the top surface of the molding base while reducing stray light.

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the inner surface of the top side extension portion extends from the photosensitive element coupling portion in an integral manner to avoid a light window molding portion of a molding mold pressing on a connecting line connecting the photosensitive element and the circuit board during the molding process, causing damage to the connecting line.

One object of the present invention is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein a smaller angle is formed between the top side extension portion and the optical axis, thereby reducing the area of the filter element.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein a filter element body of a filter element of the photosensitive component of the camera module is provided with a light-shielding layer, so that the central area of the filter element body forms an effective light-transmitting area to reduce stray light reaching the interior of a molded base.

One object of the present invention is to provide a camera module, its photosensitive component and manufacturing method, wherein in some embodiments, the shading layer is arranged on the bottom side of the filter element body to reduce the light incident on the inner surface of the top side extension portion, thereby preventing the light incident on the inner surface of the top side extension portion from being reflected and reaching the photosensitive element to form stray light and affect the imaging quality of the camera module.

In order to achieve at least one of the above invention objectives, the present invention provides a method for manufacturing a photosensitive component of a camera module, which comprises the following steps:

(a) fixing a circuit board panel to a second mold of a molding mold, wherein the circuit board panel comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards arranged side by side, each of the circuit boards comprises a rigid region and a flexible region combined, and each of the circuit boards is operably connected to a photosensitive element;

(b) closing the second mold and a first mold, filling molten molding material into a base panel molding guide groove in the molding mold, wherein a position corresponding to at least one light window molding portion is blocked from being filled with the molding material; and

(c) curing the molding material in the base panel molding guide groove to form a one-piece molded base at a position corresponding to the base panel molding guide groove, wherein the one-piece molded base is integrally formed corresponding to one or more columns of the circuit boards and one or more columns of the photosensitive elements to form a photosensitive component panel and forms a light window providing a light path for each of the photosensitive elements at a position corresponding to the light window molding portion, wherein the base panel molding guide groove has a first guide groove corresponding to a first end side of the one-piece molded base adjacent to the flexible region and a second guide groove corresponding to the one-piece molded base away from the flexible region, as well as a plurality of guide grooves extending between the first guide groove and the second guide groove. A filling groove, wherein the first guide groove has a first side surface facing the light window, the second guide groove has a second side surface facing the light window, wherein the first side surface includes a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to the first partial surface, the second side surface includes a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface relative to the optical axis of the camera module is greater than a second angle of the second partial surface relative to the optical axis, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis.

The photosensitive component panel is used to manufacture a plurality of the photosensitive components, wherein the method further includes the steps of: cutting the photosensitive component panel to obtain a plurality of photosensitive components, wherein each of the photosensitive components includes the circuit board, the photosensitive element and the molded base, wherein the molded base is integrally formed with the circuit board and the photosensitive element and forms the light window that provides a light path for the photosensitive element.

According to another aspect of the present invention, the present invention provides a photosensitive component of a camera module, comprising:

A circuit board comprising a rigid region and a flexible region combined;

a photosensitive element; and

A molded base, wherein the molded base is integrally formed with the circuit board and the photosensitive element and forms a light window that provides a light path for the photosensitive element; wherein the molded base has a first side surface facing the light window corresponding to the first end side adjacent to the flexible area of the molded base, the first side surface includes a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface relative to the optical axis of the camera module is greater than a second angle of the second partial surface relative to the optical axis; the molded base has a second side surface facing the light window corresponding to the second end side opposite to the flexible area away from the flexible area, the second side surface includes a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis.

According to another aspect of the present invention, the present invention also provides a photosensitive component panel of a camera module, which includes:

One or more columns of circuit boards, each column of circuit boards comprising one or more circuit boards arranged side by side, each of the circuit boards comprising a combined rigid region and a flexible region;

one or more arrays of photosensitive elements; and

One or more one-piece molded bases, each of which is integrally formed on a row of circuit boards and a row of photosensitive elements and forms a light window that provides a light path for each of the photosensitive elements; wherein the one-piece molded base has a first side surface facing the light window at the first end side adjacent to the flexible area, the first side surface includes a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface relative to the optical axis of the camera module is greater than a second angle of the second partial surface relative to the optical axis; the one-piece molded base has a second side surface facing the light window at the second end side opposite to the flexible area away from the flexible area, the second side surface includes a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis.

According to another aspect of the present invention, the present invention also provides a photosensitive component panel of a camera module, which includes:

A plurality of rows of circuit boards, each row of circuit boards comprising one or more circuit boards arranged side by side, each of the circuit boards comprising a rigid region and a flexible region combined;

A plurality of arrays of light sensing elements; and

One or more one-piece molded bases, each of which is integrally formed on two adjacent columns of the circuit boards and two adjacent columns of the photosensitive elements and forms a light window that provides a light path for each of the photosensitive elements, and the two adjacent columns of the circuit boards are arranged so that their flexible areas are far away from each other and their rigid areas are adjacent to each other, so that each of the one-piece molded bases has two end sides adjacent to the flexible area; wherein the first end side corresponding to the one-piece molded base adjacent to the flexible area has a first side surface facing the light window, the first side surface includes a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface relative to the optical axis of the camera module is greater than a second angle of the second partial surface relative to the optical axis; the one-piece molded base extends to a second end side located between the two adjacent columns of the photosensitive elements and has a second side surface facing the light window, the second side surface includes a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis.

According to another aspect of the present invention, the present invention also provides a camera module, which includes:

One shot;

A circuit board comprising a rigid region and a flexible region combined;

a photosensitive element; and

A molded base, wherein the molded base is integrally formed on the circuit board and the photosensitive element and forms a light window that provides a light path for the photosensitive element, wherein the lens is located in the light sensing path of the photosensitive element; wherein a first side surface facing the light window is provided at a first end side of the molded base adjacent to the flexible area, the first side surface includes a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and a first angle of the first partial surface relative to the optical axis is greater than a second angle of the second partial surface relative to the optical axis; a second side surface facing the light window is provided at a second end side opposite to the flexible area of the molded base, the second side surface includes a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis.

According to another aspect of the present invention, the present invention also provides a molding mold to produce a photosensitive component puzzle for use in a camera module, which includes a first mold and a second mold suitable for being separated and tightly fitted together, wherein the first and second molds form a molding cavity when they are tightly fitted together, and the molding mold is provided with at least one light window molding portion and a base puzzle molding guide groove formed around the light window molding portion in the molding cavity, and the molding cavity is suitable for fixing a circuit board puzzle, wherein the circuit board puzzle includes one or more columns of circuit boards, each column of circuit boards includes one or more circuit boards arranged side by side, each of the circuit boards includes a rigid area and a flexible area combined, and each of the circuit boards is operably connected to a photosensitive element, the base puzzle molding guide groove is suitable for filling the molding material to form a one-piece molded base at a position corresponding to the base puzzle molding guide groove, wherein the one-piece molded base is integrally molded with each column of the circuit boards and each column of the photosensitive elements to form the photosensitive component puzzle and is formed as each of the photosensitive elements at a position corresponding to the light window molding portion. A light window is provided for providing a light passage, wherein the base panel forming guide groove has a first guide groove corresponding to the first end side of the one-piece molded base adjacent to the flexible region and a second guide groove corresponding to the one-piece molded base away from the flexible region, and a plurality of filling grooves extending between the first guide groove and the second guide groove, wherein each light window forming portion is located between two adjacent filling grooves, wherein the first guide groove has a first side surface facing the light window, and the second guide groove has a second side surface facing the light window, wherein the first side surface includes a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and the second side surface includes a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface relative to the optical axis is greater than a second angle of the second partial surface relative to the optical axis, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis.

According to another aspect of the present invention, the present invention also provides a molding mold to produce a photosensitive component panel for use in a camera module, which includes a first mold and a second mold suitable for being separated and tightly fitted together, wherein the first and second molds form a molding cavity when they are tightly fitted together, and the molding mold is provided with a light window molding portion and a base panel molding guide groove formed around the light window molding portion in the molding cavity, and the molding cavity is suitable for fixing a circuit board panel, wherein the circuit board panel includes a plurality of columns of circuit boards, each column of circuit boards includes one or more circuit boards arranged side by side, each of the circuit boards includes a rigid area and a flexible area combined, and each of the circuit boards is operably connected to a photosensitive element, wherein the base panel molding guide groove is suitable for filling molding material to form a one-piece molded base at a position corresponding to the base panel molding guide groove, wherein the one-piece molded base is integrally molded with two adjacent columns of the circuit boards and two adjacent columns of the photosensitive elements to form the photosensitive component panel and forms a light window that provides a light path for each of the photosensitive elements at a position corresponding to the light window molding portion, wherein the two adjacent columns of the circuit boards Arranged with their flexible areas far away from each other and their rigid areas adjacent to each other, wherein the base panel forming guide groove has two first guide grooves corresponding to the two end sides of the one-piece molded base adjacent to the flexible area and a second guide groove corresponding to the area between the two adjacent columns of the photosensitive elements, and a plurality of filling grooves extending between the two first guide grooves and the second guide grooves, wherein each of the light window forming parts is located between two adjacent filling grooves, wherein the first guide groove has a first side surface facing the light window, and the second guide groove has a second side surface facing the light window, wherein the first side surface includes a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and the second side surface has a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface relative to the optical axis is greater than a second angle of the second partial surface relative to the optical axis, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis.

The present invention also provides a photosensitive component, which includes:

a circuit board;

a photosensitive element, the photosensitive element being operatively connected to the circuit board; and

A molded base, which is integrally combined with the circuit board and the photosensitive element to form a light window, wherein the molded base has one or more first portion inner surfaces adjacent to the photosensitive element and one or more second portion inner surfaces connected to the first portion inner surfaces away from the photosensitive element, wherein an angle α is formed between the first portion inner surfaces and the optical axis of the photosensitive component, and an angle β is formed between the second portion inner surfaces and the optical axis of the photosensitive component, wherein β<α.

According to another aspect of the present invention, the present invention also provides a camera module, which specifically includes:

One shot;

a circuit board;

a photosensitive element, the photosensitive element being operatively connected to the circuit board, the lens being located in a light sensing path of the photosensitive element; and

A molded base, which is integrally combined with the circuit board and the photosensitive element to form a light window, wherein the molded base has a first portion inner surface adjacent to the photosensitive element and a second portion inner surface connected to the first portion inner surface away from the photosensitive element, wherein an angle α is formed between the first portion inner surface and the optical axis of the camera module, and an angle β is formed between the second portion inner surface and the optical axis of the camera module, wherein β<α.

According to another aspect of the present invention, the present invention also provides a molding mold to produce at least one photosensitive component used in a camera module, wherein the photosensitive component includes a circuit board, a photosensitive element and a molded base, wherein the molded base is integrally molded with the circuit board and the photosensitive element to form a light window, wherein the molding mold includes a first mold and a second mold suitable for being separated and tightly fitted, and is provided with at least one light window molding part and a base molding guide groove formed around the light window molding part, when the circuit board connected with the photosensitive element is placed in the molding mold and the first and second molds are tightly fitted, a molten molding material is filled into the base molding guide groove and formed into the molded base after solidification, and the light window is formed corresponding to the position of the light window molding part, wherein the light window molding part has at least one first portion of the outer surface and at least one second portion of the outer surface from the bottom side toward the top side, which respectively form angles α and β with the optical axis perpendicular to the photosensitive element, and α＞β.

According to another aspect of the present invention, the present invention also provides an electronic device, which includes one or more of the above-mentioned camera modules. The electronic device includes but is not limited to mobile phones, computers, televisions, smart wearable devices, vehicles, cameras and monitoring devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram of the structure of a molding die for encapsulating a photosensitive component using an existing integrated packaging process.

FIG. 1B is a schematic diagram of a molding process of forming an integrated packaging component using a conventional integrated packaging process.

FIG. 1C is an enlarged structural schematic diagram showing the forward flow of packaging materials along two flow channels in a conventional integrated packaging process.

FIG. 1D is a schematic diagram showing an enlarged structure in which a part is not filled with packaging material in a conventional integrated packaging process.

FIG. 1E is a schematic diagram showing the viscosity variation trend of the molding material during the curing time.

FIG. 1F is a schematic diagram showing the structure of a camera module made of a photosensitive component encapsulated by a conventional integrated packaging process.

Figure 2 is a block diagram of a manufacturing device for a photosensitive component panel of a camera module according to a first preferred embodiment of the present invention.

3A is a schematic structural diagram of a molding die of a manufacturing device for a photosensitive component panel of a camera module according to the first preferred embodiment of the present invention.

Figure 3B is an enlarged structural schematic diagram of a local area A of the first mold of the molding mold of the manufacturing equipment for the photosensitive component panel of the camera module according to the above-mentioned first preferred embodiment of the present invention.

FIG. 4 is a schematic diagram of the structure of the photosensitive component panel of the camera module according to the first preferred embodiment of the present invention.

FIG5A is a schematic diagram of the enlarged structure of the photosensitive component of the camera module according to the first preferred embodiment of the present invention.

FIG5B is an enlarged schematic diagram of the structure of the photosensitive component of the camera module according to the first preferred embodiment of the present invention.

Figure 6A is a cross-sectional view of the photosensitive component of the camera module according to the above-mentioned first preferred embodiment of the present invention along the C-C line in Figure 5.

6B is a cross-sectional view of the second end side of the photosensitive component of the camera module according to the first preferred embodiment of the present invention after being further cut.

Figure 7A illustrates a cross-sectional view of pushing the molten molding material into the base panel molding guide groove in the molding mold of the photosensitive component panel according to the above-mentioned first preferred embodiment of the present invention, wherein the cross-sectional view corresponds to the cross-sectional view in the direction of the A-A line illustrated in Figure 4.

FIG. 7B is a partial enlarged schematic diagram of point B in FIG. 7A .

Figure 8 illustrates a cross-sectional view of the molding mold of the photosensitive component panel according to the first preferred embodiment of the present invention when the molten molding material fills the base panel molding guide groove, wherein the cross-sectional view corresponds to the cross-sectional view in the direction of the A-A line shown in Figure 4.

FIG9 is a cross-sectional view showing the molding die of the photosensitive component assembly according to the first preferred embodiment of the present invention when the molten molding material fills the base assembly assembly molding guide groove, wherein the cross-sectional view corresponds to the cross-sectional view along the B-B line shown in FIG4.

Figure 10 illustrates a cross-sectional view corresponding to the A-A line direction in Figure 4 of a one-piece molded base formed by performing a demolding step in the molding mold of the photosensitive component panel according to the above-mentioned first preferred embodiment of the present invention.

FIG. 11 is a schematic diagram of the three-dimensional structure of a camera module according to the first preferred embodiment of the present invention.

FIG. 12 is a schematic diagram showing the exploded structure of a camera module according to the first preferred embodiment of the present invention.

Figure 13A shows a cross-sectional view of the camera module along the D-D line in Figure 12 according to the above-mentioned first preferred embodiment of the present invention.

Figure 13B shows a cross-sectional view of the camera module along the E-E line in Figure 12 according to the above-mentioned first preferred embodiment of the present invention.

FIG. 14 illustrates a cross-sectional view of a modified embodiment of a camera module according to the first preferred embodiment of the present invention.

FIG15 illustrates a cross-sectional view of a camera module according to another modified implementation manner of the camera module of the above-mentioned first preferred embodiment of the present invention.

FIG16 illustrates a cross-sectional view of a camera module according to another modified implementation manner of the camera module of the first preferred embodiment of the present invention.

Figure 17A is a structural schematic diagram of a molding die of a manufacturing device for a photosensitive component panel of a camera module according to a second preferred embodiment of the present invention.

Figure 17B is a schematic diagram of the enlarged structure of a part C of the first mold of the molding mold of the manufacturing equipment for the photosensitive component panel of the camera module according to the above-mentioned second preferred embodiment of the present invention.

FIG. 18 is a schematic diagram of the structure of the photosensitive component panel of the camera module according to the above-mentioned second preferred embodiment of the present invention.

Figure 19A is an enlarged structural schematic diagram of point D of the photosensitive component panel of the camera module according to the above-mentioned second preferred embodiment of the present invention.

Figure 19B is an enlarged schematic diagram of the structure of two adjacent photosensitive components of the photosensitive component panel of the camera module according to the above-mentioned second preferred embodiment of the present invention.

Figure 20A is a cross-sectional view of the photosensitive component panel of the camera module according to the above-mentioned second preferred embodiment of the present invention along the H-H line in Figure 19A.

Figure 20B is a schematic structural diagram of the photosensitive component panel of the camera module according to the above-mentioned second preferred embodiment of the present invention, in which two photosensitive components are obtained by cutting.

Figure 21A illustrates a cross-sectional view of the case where the molten molding material is pushed into the base panel molding guide groove in the molding mold of the photosensitive component panel according to the above-mentioned second preferred embodiment of the present invention, wherein the cross-sectional view corresponds to the cross-sectional view in the direction of the F-F line illustrated in Figure 18.

FIG. 21B is a partial enlarged schematic diagram of point E in FIG. 21A .

Figure 22 illustrates a cross-sectional view of the molding mold of the photosensitive component panel according to the above-mentioned second preferred embodiment of the present invention when the molten molding material fills the base panel molding guide groove, wherein the cross-sectional view corresponds to the cross-sectional view in the direction of the F-F line shown in Figure 18.

Figure 23 illustrates a cross-sectional view of the base panel molding guide groove when the molten molding material is filled in the molding mold of the photosensitive component panel according to the above-mentioned second preferred embodiment of the present invention, wherein the cross-sectional view corresponds to the cross-sectional view in the direction of the G-G line shown in Figure 18.

Figure 24 illustrates a cross-sectional view corresponding to the F-F line direction in Figure 18 of a one-piece molded base formed by performing a demolding step in the molding mold of the photosensitive component panel according to the above-mentioned second preferred embodiment of the present invention.

Figures 25A to 25C respectively illustrate a cross-sectional view of a photosensitive component panel according to a modified implementation of the above-mentioned first and second preferred embodiments of the present invention and an enlarged structural schematic diagram of the photosensitive component obtained by cutting.

Figure 26A is a schematic diagram of the structure of a photosensitive component panel according to another variant implementation of the above-mentioned second preferred embodiment of the present invention.

Figure 26B is an enlarged structural schematic diagram of a photosensitive component according to another variant implementation of the above-mentioned second preferred embodiment of the present invention.

Figure 27 is a cross-sectional view along the I-I line in Figure 26 of a photosensitive component according to another variant implementation of the above-mentioned second preferred embodiment of the present invention.

FIG. 28 is a schematic diagram of a three-dimensional exploded view of a camera module according to a third preferred embodiment of the present invention.

FIG. 29A is a schematic diagram of the structure of a camera module according to a third preferred embodiment of the present invention.

FIG. 29B is a schematic diagram of the enlarged structure of point J in FIG. 29A .

Figure 30 is a schematic diagram showing that a light shielding layer is attached to the bottom side of the photosensitive component of the camera module according to the third preferred embodiment of the present invention to effectively reduce the stray light reflected to the photosensitive element.

31A is a cross-sectional view illustrating the process of pushing molten molding material into the base molding guide groove in the molding mold in the molding process according to the above-mentioned third preferred embodiment of the present invention.

FIG. 31B is a cross-sectional view showing a state in which the molten molding material fills the base molding guide groove according to the third preferred embodiment of the present invention.

FIG. 31C is a cross-sectional view showing a mold base formed by performing a demolding step according to the third preferred embodiment of the present invention.

Figure 32A is a schematic diagram showing a variant embodiment of the third preferred embodiment of the present invention in which light-shielding layers are attached to both sides of the photosensitive component to effectively reduce stray light.

Figure 32B shows a cross-sectional view of a camera module according to another variant implementation of the third preferred embodiment of the present invention.

Figure 33 is a cross-sectional view of a camera module according to another variant embodiment of the third preferred embodiment of the present invention.

Figure 34 shows a cross-sectional view of a camera module according to another variant implementation of the third preferred embodiment of the present invention.

Figure 35 is a schematic diagram of a three-dimensional decomposition of a camera module according to the fourth preferred embodiment of the present invention.

Figure 36A is a cross-sectional view of the camera module according to the above-mentioned fourth preferred embodiment of the present invention along the K-K line direction in Figure 35.

FIG. 36B is an enlarged schematic diagram of point L in FIG. 36A .

Figure 37 is a schematic diagram showing that a light shielding layer is attached to the bottom side of the photosensitive component of the camera module according to the fourth preferred embodiment of the present invention to effectively reduce the stray light reflected to the photosensitive element.

Figure 38 is a cross-sectional view of a camera module according to a modified implementation of the above-mentioned fourth preferred embodiment of the present invention.

Figure 39 is a schematic diagram of a three-dimensional decomposition of a camera module according to the fifth preferred embodiment of the present invention.

Figure 40 is a cross-sectional view of the camera module according to the fifth preferred embodiment of the present invention along the M-M line in Figure 39.

Figure 41 is a schematic diagram showing that a light shielding layer is attached to the bottom side of the photosensitive component of the camera module according to the fifth preferred embodiment of the present invention to effectively reduce the stray light reflected to the photosensitive element.

Figure 42 is a cross-sectional view of a camera module according to a modified embodiment of the fifth preferred embodiment of the present invention.

Figure 43 is a cross-sectional view of a camera module according to another modified embodiment of the fifth preferred embodiment of the present invention.

FIG44 is a schematic diagram of the structure of the camera module according to the present invention applied to an intelligent electronic device.

Detailed ways

The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

As shown in Figures 2 to 14, the camera module 100 and the photosensitive component 10 and the manufacturing method thereof according to the first preferred embodiment of the present invention are shown. The camera module 100 can be applied to various electronic devices 300, and the electronic device 300 includes a device body 301 and one or more camera modules 100 installed on the device body 301, as shown in Figure 44, the electronic device 30 is exemplified but not limited to a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, etc., and the camera module cooperates with the electronic device to realize image acquisition and reproduction of the target object.

More specifically, the figure illustrates a photosensitive component 10 of the camera module 100 and a manufacturing device 200 thereof. The photosensitive component 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13, wherein the molded base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms a light window 122 that provides a light path for the photosensitive element 13. The molded base 12 of the present invention is integrally molded with the circuit board 11 and the photosensitive element 13 by the manufacturing device 200 through a molding process, more specifically a transfer molding process, so that the molded base 12 can replace the lens holder or bracket of the traditional camera module, and there is no need to attach the lens holder or bracket to the circuit board 11 by glue as in the traditional packaging process.

Further, referring to FIGS. 2-4 and 7A to 10, the present invention manufactures a photosensitive component panel 1000 through the manufacturing equipment 200, that is, the photosensitive component panel 1000 having multiple photosensitive components 10 is manufactured through a panelization process. The photosensitive component panel 1000 includes a circuit board panel 1100 and one or more one-piece molded bases 1200. The circuit board panel 1100 includes multiple columns of circuit boards, such as the four columns of circuit boards shown in FIG. 4, each column of circuit boards includes multiple circuit boards 11, such as 2-12 circuit boards 11, and 6 circuit boards 11 are shown in the figure, and each circuit board 11 can be operatively connected to a photosensitive element 13. Each one-piece molded base 1200 is formed on a column of the circuit boards and is integrally formed on at least a portion of the non-photosensitive area 132 of each of the photosensitive elements 13 in a column of the photosensitive elements 13 and exposes the photosensitive area 131 of the photosensitive element 13. Each of the integrated molded bases 1200 has a plurality of light windows 122 , and the position of each of the light windows 122 corresponds to each of the photosensitive elements 13 , so as to provide a light passage for the corresponding photosensitive element 13 .

The manufacturing equipment 200 of the photosensitive component panel 1000 of the camera module 100 includes a molding mold 210, a molding material feeding mechanism 220, a mold fixing device 230, a temperature control device 250 and a controller 260. The molding material feeding mechanism 220 is used to provide a molding material 14 to a base panel molding guide groove 215. The mold fixing device 230 is used to control the opening and closing of the molding mold 210, the temperature control device 250 is used to heat the thermosetting molding material 14, and the controller 260 is used to automatically control the operation of the molding material feeding mechanism 220, the mold fixing device 230, and the temperature control device 250 during the molding process.

The molding mold 210 includes a first mold 211 and a second mold 212 which can be opened and closed under the action of the mold fixing device 230, that is, the mold fixing device 230 can separate and close the first mold 211 and the second mold 212 to form a molding cavity 213. When closing the mold, the circuit board panel 1100 is fixed in the molding cavity 213, and the fluid molding material 14 enters the molding cavity 213, so as to be integrally molded on each column of the circuit boards 11 and each corresponding column of the photosensitive elements 13, and after curing, the integrated molding base 1200 integrally molded on each column of the circuit boards 11 and each column of the photosensitive elements 13 is formed.

More specifically, the molding module 210 further has one or more base panel molding guide grooves 215 and a plurality of light window molding parts 214 located in the base panel molding guide grooves 215. When the first and second molds 211 and 212 are molded together, the light window molding parts 214 and the base panel molding guide grooves 215 extend in the molding cavity 213, and the fluid molding material 14 is filled into the base panel molding guide grooves 215, while the position corresponding to the light window molding part 214 cannot be filled with the fluid molding material 14, so that at the position corresponding to the base panel molding guide grooves 215, the fluid molding material 14 can form the one-piece molding base 1200 after solidification, which includes the annular molding body 121 of the molding base 12 corresponding to each of the photosensitive components 10, and the light window 122 of the molding base 12 is formed at the position corresponding to the light window molding part 214. The molding material 14 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.

The first and second molds 211 and 212 can be two molds that can produce relative movement, such as one of the two molds is fixed and the other is movable; or both molds are movable, and the present invention is not limited in this regard. In the example of this embodiment of the present invention, the first mold 211 is specifically implemented as a fixed upper mold, and the second mold 212 is implemented as a movable lower mold. The fixed upper mold and the movable lower mold are coaxially arranged, such as the movable lower mold can slide upward along multiple positioning axes, and can form a tightly closed molding cavity 213 when it is molded with the fixed upper mold.

The second mold 212, i.e., the lower mold, may have a circuit board positioning groove 2121, which may be in the shape of a groove or formed by a positioning column, for installing and fixing the circuit board 11, and the light window molding portion 214 and the base panel molding guide groove 215 may be formed in the first mold 211, i.e., in the upper mold, and when the first and second molds 211 and 212 are molded together, the molding cavity 213 is formed. And the fluid molding material 14 is injected into the base panel molding guide groove 215 on the top side of the circuit board panel 1100, so as to form the integrated molded base 1200 on the top side of each column of the circuit board 11 and each column of the photosensitive element 13.

It is understandable that the circuit board positioning groove 2121 can also be set in the first mold 211, i.e., the upper mold, for installing and fixing the circuit board panel 1100, and the light window molding portion 214 and the base panel molding guide groove 215 can be formed in the second mold 211, and when the first and second molds 211 and 212 are molded together, the molding cavity 213 is formed. The circuit board panel 1100 can be arranged in the upper mold with the front facing, and the fluid molding material 14 is injected into the base panel molding guide groove 215 on the bottom side of the inverted circuit board panel 1100, so as to form the one-piece molded base 1200 on the bottom side of the inverted circuit board panel 1100.

More specifically, when the first and second molds 211 and 212 are combined and the molding step is performed, the light window molding portion 214 is overlapped and closely attached to the top surface of the photosensitive element 13, so that the fluid molding material 14 is prevented from entering the photosensitive area 1311 of the top surface 131 of the photosensitive element 13 on the circuit board 11, so that the light window 122 of the integrated molded base 1200 can be finally formed at the position corresponding to the light window molding portion 214. It can be understood that the light window molding portion 214 can be a solid structure, or a structure with a groove shape inside as shown in the figure.

It can be understood that the molding surface of the first mold 211 that forms the base panel molding guide groove 215 can be constructed as a flat surface and be in the same plane, so that when the molded base 12 is solidified, the top surface of the molded base 12 is relatively flat, thereby providing a flat installation condition for the optical components above the photosensitive component 10 of the camera module 100, such as the driver, lens, and fixed lens barrel, thereby reducing the tilt error of the assembled camera module 100.

It is worth mentioning that the base panel forming guide groove 215 and the light window forming part 214 can be integrally formed in the first mold 211. Alternatively, the first mold 211 further includes a detachable forming structure, and the forming structure is formed with the base panel forming guide groove 215 and the light window forming part 214. In this way, according to the different shape and size requirements of the photosensitive component 10, such as the diameter and thickness of the molded base, the base panel forming guide groove 215 and the light window forming part 214 of different shapes and sizes can be designed. In this way, only different molding structures need to be replaced to make the manufacturing equipment suitable for the photosensitive component 10 with different specifications. It can be understood that the second mold 212 can also include a detachable fixing block to provide the groove 2121 of different shapes and sizes, so as to facilitate the replacement of the circuit board 11 adapted to different shapes and sizes.

It is understood that the molding material 14 is a thermosetting material, which is heated and melted to become a fluid molding material 14. During the molding process, the thermosetting molding material 14 is further heated to solidify, and can no longer be melted after solidification, thereby forming the one-piece molding base 1200.

It can be understood that in the molding process of the present invention, the molding material 14 can be in block, granular or powder form, which becomes fluid in the molding mold 210 after being heated, and then solidifies to form the integrated molding base 1200.

More specifically, each of the base panel forming guide grooves 215 of the present invention has a substantially parallel first guide groove 2151 and a second guide groove 2152, and a plurality of filling grooves 2153 extending between the first guide groove 2151 and the second guide groove 2152, wherein the filling groove 2153 is formed between two adjacent light window forming parts 214. As shown in the figure, the base panel forming guide groove 215 has seven filling grooves 2153, and six light window forming parts 214 are respectively located between two adjacent filling grooves 2153. The molding material 14 flows along the first guide groove 2151 and the second guide groove 2152 from its feed end 215A to its end 215B, and the molding material 14 can fill each of the filling grooves 2153, so as to form the one-piece molding base 1200 after the molding material 14 is solidified.

As shown in Figures 7A to 10, it is a schematic diagram of the manufacturing process of the photosensitive component panel 100 of the camera module 100 according to this preferred embodiment of the present invention. As shown in Figure 7A, the molding mold 210 is in a mold closing state, the circuit board panel 1100 to be molded and the solid molding material 14 are ready in place, the solid molding material 14 is heated, and the molding material 14 is melted into a fluid state or a semi-solid and semi-fluid state and is fed into the base panel molding guide groove 215, flows forward along the first guide groove 2151 and the second guide groove 2152 and fills the filling groove 2153 between the two adjacent light window molding parts 214.

As shown in Figures 8 and 9, when the base panel forming guide groove 215 is completely filled with the fluid molding material 14, the fluid molding material 14 is solidified and formed into the one-piece molded base 1200 integrally formed with each column of the circuit board 11 and each column of the photosensitive element 13 through a curing process.

As shown in Figure 10, after the molding material 14 is solidified to form the one-piece molding base 1200, the demolding process of the present invention is performed, that is, the mold fixing device 230 moves the first and second molds 211 and 212 away from each other, so that the light window molding part 214 leaves the one-piece molding base 1200, so that the light windows 122 corresponding to each of the photosensitive elements 13 are formed in the one-piece molding base 1200.

As shown in Figures 4 to 6, the obtained photosensitive component panel 1000 can be further cut to obtain individual photosensitive components 10. Each of the photosensitive components 10 includes at least one circuit board 11, at least one photosensitive element 13 and a molded base 12 integrally molded on the circuit board 11 and the photosensitive element 13. Each circuit board 11 includes a rigid area 111 and a flexible area 112 combined together, that is, each circuit board 11 can be implemented as a hard-soft board in this embodiment of the present invention. The molded base 12 integrally molds the rigid area 111 of the circuit board 11 and at least a portion of the non-photosensitive area 132 of the photosensitive element 13, and forms the light window 122 that provides a light path for the photosensitive area 131 of the photosensitive element 13.

It is worth mentioning that the manufacturing method of the photosensitive component panel 1000 of the present invention is suitable for making the photosensitive component 10 of small size. Therefore, in the molding process, the volume of the first guide groove 2151 and the second guide groove 2152 is small. From Figure 7A to Figure 10, it can be seen that the cross-section of the first guide groove 2151 and the second guide groove 2152 is basically trapezoidal. Among them, the width of the bottom end of the first guide groove 2151 and the second guide groove 2152 is limited by the size and cannot be widened.

Therefore, according to an embodiment of the present invention, the inner surface of the one-piece molded base 1200 facing the light window 122, that is, the first side surface 1201 of the first guide groove 2151 and the second side surface 1202 of the second guide groove 2152 is set to a two-end structure.

Specifically, as shown in FIG. 6A and FIG. 6B , the first side surface 1201 includes a first partial surface 1203 disposed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface, and the first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than the second angle of the second partial surface 1204 relative to the optical axis. In other words, from FIG. 6A and FIG. 6B , the first partial surface 1203 and the second partial surface 1204 extend in a direction from bottom to top, and the inclination of the first partial surface 1203 is greater than the inclination of the second partial surface 1204. In this way, since the second partial surface 1204 is inclined toward the light window relative to the first partial surface 1203, the cross-sectional area of the first guide groove 2151 is increased, thereby further increasing the volume of the first guide groove 2151.

Similarly, the second side surface 1202 includes a third partial surface 1205 disposed adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface, and the third angle of the third partial surface 1205 relative to the optical axis of the camera module is greater than the fourth angle of the fourth surface portion 1206 relative to the optical axis. In other words, from FIG. 6A and FIG. 6B , the third partial surface 1205 and the fourth partial surface 1206 extend in a direction from bottom to top, and the inclination of the third partial surface 1205 is greater than the inclination of the fourth partial surface 1206. In this way, since the fourth partial surface 1206 is inclined toward the light window relative to the third partial surface 1205, the cross-sectional area of the second guide groove 2152 is increased, thereby further increasing the volume of the second guide groove 2152.

Preferably, in an embodiment of the present invention, the cross-sectional design of the first guide groove 2151 and the second guide groove 2152 is symmetrical, that is, the first angle of the first partial surface 1203 is equal to the third angle of the third partial surface 1205, and the second angle of the second partial surface 1204 is equal to the fourth angle of the fourth partial surface 1206.

Considering the influence of stray light of the camera module, the first angle and the third angle are set to 3° to 80°. In addition, considering other factors of the module process and the structure and material properties of the molding base of the camera module, the second angle and the fourth angle are set to 0° to 20°.

Here, it should be noted that the second angle and the fourth angle in the embodiment of the present invention are further preferably set to 0 degrees, that is, the second partial surface 1204 and the fourth partial surface 1206 extend vertically upward relative to the surface of the photosensitive element 13, which can maximize the cross-sectional area of the guide groove on the one hand, and will not affect the light incident on the photosensitive chip of the camera module on the other hand.

Those skilled in the art will appreciate that the cross-sectional shape of the guide groove will affect the flow of the molding material on the one hand, and directly determine the cross-sectional shape of the resulting molding base on the other hand.

Through the two-section design of the first side surface 1201 and the second side surface 1202, that is, through the smaller inclination of the second part surface 1204 relative to the first part surface 1203, and the smaller inclination of the fourth part surface 1206 relative to the third part surface 1205, the area of the upper surface of the molding base can be further increased, thereby facilitating the support of other components of the camera module such as the lens holder.

Therefore, in the embodiment of the present invention, in addition to considering the influence of specific shape and size factors on the cross-sectional shape of the guide groove, it is also necessary to further consider the influence of the shape and size factors on the shape of the molding base.

Specifically, since the molded base needs to cover the connecting line 15 , it is necessary to further define the heights of the first side surface 1201 and the second side surface 1202 in a direction perpendicular to the surface of the photosensitive element 13 .

Preferably, in the embodiment of the present invention, the first and third heights of the first partial surface 1203 and the third partial surface 1205 in the direction perpendicular to the surface of the photosensitive element 13 are 0.05 mm to 0.7 mm, respectively. In this way, it can be ensured that the formed molded base can better cover the connecting line 15. In addition, considering the structural factors that the molded base covers the connecting line 15 as a whole and further supports the lens holder, the second and fourth heights of the second partial surface 1204 and the fourth partial surface 1206 in the direction perpendicular to the surface of the photosensitive element 13 are 0.02 mm to 0.6 mm, respectively.

The height of the module base can be further increased through the second partial surface 1204 and the fourth partial surface 1206, thereby avoiding compression of the connecting line 15 when installing other components of the camera module, such as the lens mount, thereby affecting the performance of the camera module.

In this way, by setting the side surface of the guide groove to a two-section shape, the molding material as a fluid can flow smoothly in the guide groove. Specifically, the fluid molding material 14 can flow forward along the first guide groove 2151 and the second guide groove 2152 and fill the entire base panel forming guide groove 215 with the molding material 14 before the molding material 14 solidifies.

Accordingly, the molding process of the present invention obtains the photosensitive component panel 1000, which includes: one or more columns of the circuit boards 11, one or more columns of the photosensitive elements 13, and one or more one-piece molded bases 1200. Each column of the circuit boards 11 includes one or more circuit boards 11 arranged side by side, and each circuit board 11 includes the rigid area 111 and the flexible area 112 combined. Each one-piece molded base 1200 is integrally formed with a column of the circuit boards 11 and a column of the photosensitive elements 13 and forms the light window 122 that provides a light path for each of the photosensitive elements 13. Among them, the part 1200A of the one-piece molded base corresponding to the first end side of the one-piece molded base 1200 adjacent to the flexible area 112 has a first side surface 1201, the first side surface 1201 includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface, and the first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than the second angle of the second partial surface 1204 relative to the optical axis; the part 1200B of the one-piece molded base corresponding to the second end side opposite to the one-piece molded base 1200 away from the flexible area 112 has a second side surface 1202, the second side surface 1202 includes a third partial surface 1205 arranged adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface, and the third angle of the third partial surface 1205 relative to the optical axis of the camera module is greater than the fourth angle of the fourth surface part 1206 relative to the optical axis. The first end side of the one-piece molded base 1200 corresponds to the combined side of the rigid area 111 and the flexible area 112 of the circuit board 11, that is, the proximal side adjacent to the flexible area 112; the second end side of the one-piece molded base 1200 corresponds to the distal side of the circuit board 11 away from the flexible area 112.

After the photosensitive component panel 1000 is cut, a single photosensitive component 10 can be obtained, wherein in the cutting step, the one-piece molded base 1200 can be cut except for the two wing sides of the first end side and the second end side, thereby obtaining the molded base 12, while the corresponding part 1200B of the molded base on the second end side is not cut, thereby obtaining the photosensitive component 10 having the part 1200C of the one-piece molded base on a pair of opposite wing sides.

As shown in FIG6A , the photosensitive component 10 includes the circuit board 11, the photosensitive element 13 and the molded base 12. The circuit board 11 includes the rigid region 111 and the flexible region 112 combined. The molded base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the light window 122 for providing a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connecting wires 15. The portion 12A of the molded base corresponding to the first end side of the molded base 12 adjacent to the flexible region 112 has a first side surface 1201, wherein the first side surface 1201 includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface, and a first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 relative to the optical axis; the portion 12B of the molded base corresponding to the second end side opposite to the molded base 12 away from the flexible region 112 has a second side surface 1202, wherein the second side surface 1202 includes a third partial surface 1205 arranged adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface, and a third angle of the third partial surface 1205 relative to the optical axis of the camera module is greater than a fourth angle of the fourth surface portion 1206 relative to the optical axis.

As shown in FIG6B , accordingly, in order to further reduce the size of the photosensitive component 10, at least a portion of the photosensitive component 10 on the opposite second end side of the molded base 12 away from the flexible region 112 is suitable for being removed, such as being cut with a knife or being ground off. Here, those skilled in the art can understand that the arrangement of the side surface is the same as that shown in FIG6A above, and will not be repeated here.

Through the smooth flow of the molding material 14 in the guide groove, during the molding process, the molding material 14 can form the integrated molding base 1200 on the circuit board panel 1100, and the integrated molding base 1200 can form the light window 122 closed on all sides at the position corresponding to each of the photosensitive elements 13, so that after the formed integrated photosensitive component panel 1200 is cut, a molding base 12 with the light window 122 is formed on each circuit board 11 and the corresponding photosensitive element 13, preventing the local formation of the molding base like the opening in Figure 1C and connecting the light window 122 to the outside of the molding base 12.

That is, the molding material 14 of the present invention can flow forward from the feed ends 215A of the two guide grooves 2151 and 2152 and fill the guide grooves 2151 and 2152 and the filling groove 2153 of the entire base panel forming guide groove 215. Before solidification, the molding material 14 can flow from its feed end 215A to the end 215B along the two guide grooves 2151 and 2152. And before the viscosity of the molding material 14 reaches a higher value and solidifies, the molding material 14 can fill the base panel forming guide groove 215, thereby preventing the connection line 15 between the circuit board 11 and the photosensitive element 13 from being damaged by the molding material 14 with a higher viscosity flowing forward. Furthermore, through the symmetrical design of the two guide grooves 2151 and 2152, the fluids in the two guide grooves 2151 and 2152 flow forward at substantially the same pace, and the two fluids converge substantially in the filling groove 2153, thereby preventing the molding material 14 in one guide groove from flowing to the other guide groove and hindering the molding material 14 in the other guide groove from flowing forward. Furthermore, no turbulence or turbulent flow will be generated, which will cause the connection line 15 connecting the circuit board 11 and the photosensitive element 13 to swing irregularly and thus be deformed and damaged.

Accordingly, the molding material 14 of the present invention can also select a material with a relatively high viscosity range, thereby avoiding the molding material 14 from easily entering the photosensitive area 131 of the photosensitive element 13 during the molding process and forming burrs when selecting a material with a smaller viscosity range.

In addition, it is worth mentioning that, as shown in FIG. 7B , in order to facilitate demoulding and pressing the rigid area 111 of the circuit board 11, the first mold 211 further includes a plurality of pressing blocks 216, and the outer edge 1201 of the molding base 12 and the outer edge of the rigid area 111 of the circuit board 11 will form a pressing edge 1111, that is, in the molding process, the pressing block 216 is suitable for pressing the rigid area 111 of the circuit board 11. The pressing block 216 is further pressed above the flexible area 112 of each column of the circuit board 11 to prevent the molding material 14 from flowing to the flexible area 112. In addition, the rigid area 111 of each column of the circuit board 11 is integrally formed to form an integral rigid area panel 110, so as to facilitate the pressing of each column of the circuit board 11 by the first mold. As shown in FIG7A , the bottom width W of the first guide groove 2151 on the side adjacent to the flexible region 112 is 0.2 mm to 1 mm, which is suitable for manufacturing a small-sized photosensitive component 10. Accordingly, the photosensitive component 10 manufactured has a portion 12A of the molded base on the side adjacent to the flexible region 112, and a distance W between the inner edge and the outer edge thereof is 0.2 mm to 1 mm.

Accordingly, the present invention provides a method for manufacturing the photosensitive component 12 of the camera module 100, which comprises the following steps:

Fixing the circuit board panel 1100 to the second mold 212 of the molding mold 210, wherein the circuit board panel 1100 includes one or more rows of circuit boards, each row of circuit boards includes one or more circuit boards 11 arranged side by side, each circuit board 11 includes a rigid region 111 and a flexible region 112 combined, and each circuit board 111 is operably connected to the photosensitive element 13;

The second mold 212 is molded together with the first mold 211 by the mold fixing device 213, and the molten molding material 14 is filled into the base panel forming guide groove 215 in the forming mold 210, wherein the position corresponding to the light window forming portion 214 is blocked from being filled with the molding material 14;

The molding material 14 in the base panel molding guide groove 215 undergoes a curing process to form the one-piece molded base 1200 at a position corresponding to the base panel molding guide groove 215, wherein the one-piece molded base 1200 is integrally molded corresponding to each column of the circuit board 11 and each column of the photosensitive element 13 to form a photosensitive component panel 1000 and forms the light window 122 for providing a light path for each photosensitive element 13 at a position corresponding to the light window molding portion 214, wherein the base panel molding guide groove 215 has a flexible area adjacent to the one-piece molded base 1200. The first guide groove 2151 at the first end side of the one-piece molded base 1200 and the second guide groove 2152 corresponding to the one-piece molded base 1200 away from the flexible area 112, and a filling groove 2153 extending between the first guide groove 2151 and the second guide groove 2152 for filling the molding material 14 between two adjacent photosensitive elements 13 in each column of the photosensitive elements 13 and located between two adjacent light window molding parts 214, wherein the first guide groove 2151 has a first side surface 1201 facing the light window, and the second guide groove 2152 has a second side surface 1202 facing the light window. The first side surface 1202 includes a first partial surface 1203 disposed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, the second side surface 1202 includes a third partial surface 1205 disposed adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein a first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 relative to the optical axis, and a first angle of the third partial surface 1205 relative to the optical axis is greater than a second angle of the third partial surface 1205 relative to the optical axis. The third angle is greater than the fourth angle of the fourth partial surface 1206 relative to the optical axis, so that the cross-sectional shapes of the first guide groove 2151 and the second guide groove 2152 enable the molding material 14 to fill the base panel forming guide groove 215 during the molding process of forming the one-piece molded base 1200, and the molding material 14 can reach the end 215B of the first guide groove 2151 and the second guide groove 2152 from the feeding end 215A of the first guide groove 2151 and the second guide groove 2152 respectively;

The photosensitive component panel 1000 is cut to obtain a plurality of the photosensitive components 10, wherein each of the photosensitive components 10 includes the circuit board 11, the photosensitive element 13 and the molded base 12, wherein the molded base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 to form the light window 122 that provides a light passage for the photosensitive element 13.

Furthermore, the method may further include the step of cutting a portion of the photosensitive component corresponding to the second end side opposite to the molded base 12 away from the flexible region 112, that is, a portion of portion 12B of the molded base and a portion of the circuit board 11, so that the molded base 12B has a cutting surface 125 on the second end side opposite to the flexible region 112.

As shown in FIGS. 5A to 6B, the circuit board 11 includes a plurality of electronic components 113 formed on the rigid region 111, such as those mounted by SMT process, and the electronic components 113 include but are not limited to resistors, capacitors, drive devices, etc. In this embodiment of the present invention, the molded base 12 is integrally coated on the electronic components 113, thereby preventing dust and debris similar to those in traditional camera modules from adhering to the electronic components 113, and further contaminating the photosensitive element 13, thereby affecting the imaging effect. In addition, preferably, the plurality of electronic components 113 are arranged on the first end side 11A and the second end side 11B of the rigid region 111 of the circuit board 11, except for the first end side 11A and the second end side 11B of the rigid region 111 of the circuit board 11 adjacent to the flexible region 112 and away from the flexible region 112, and at least one wing side 11C on both sides of the photosensitive element 11 on the rigid region 111, wherein the molded base 12 integrally embeds the electronic components 113.

That is to say, as shown in Figures 8 and 9, there are no electronic components 113 in the corresponding first guide groove 2151 and the second guide groove 2152, and the electronic components 113 can be concentrated in the filling groove 2153, so that in the molding process, there will be no obstruction in the first guide groove 2151 and the second guide groove 2152, thereby not affecting the forward flow of the molding material 14 along the first guide groove 2151 and the second guide groove 2152, so that the molding material 14 can flow from its feed end 215A to its end 215B in a shorter time as possible.

It can be understood that the connecting line 15 can be arranged on the four sides of the photosensitive element 13, or it can be concentrated on the two wing sides 11C of the rigid area 111 of the circuit board 11, so that it is also concentrated in the filling groove 2153 during the molding process, thereby not affecting the forward flow of the molding material 14 along the first guide groove 2151 and the second guide groove 2152.

As shown in Figures 11 to 14, the photosensitive component 10 of the present invention is used to manufacture the camera module 100. The camera module includes the photosensitive component 10, a lens 20 and a filter component 30. The photosensitive component 10 includes the circuit board 11, the molded base 12 and the photosensitive element 13. The lens 20 includes a structural member 21 and one or more lenses 22 accommodated in the structural member 21. The filter component 30 includes a filter element lens holder 31 and a filter element 32, the filter element lens holder 31 is assembled on the top side of the molded base 12, and the lens 20 is directly assembled on the top side of the filter element lens holder 31 to form a fixed-focus camera module. In this embodiment, the top side of the molded base 12 is a plane, and the filter element lens holder 31 is assembled on the plane top surface of the molded base 12. The filter element 32 plays a role in filtering the light passing through the lens 20, such as being implemented as a filter for filtering infrared rays, and is located between the lens 20 and the photosensitive element 13. In this way, the light passing through the lens 30 can pass through the filter element 32 and reach the photosensitive element 13 via the light window 122, so that the camera module 100 can provide an optical image after the photoelectric conversion.

As shown in FIG13A, in the photosensitive component 10 of the camera module 100, a portion 12A of the molded base corresponding to the first end side of the molded base 12 adjacent to the flexible region 112 has a first side surface 1201 facing the light window, and a portion 12B of the molded base corresponding to the second end side opposite to the molded base 12 away from the flexible region 112 has a second side surface 1202 facing the light window, wherein the first side surface includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203. The second side surface 1202 has a third partial surface 1205 disposed adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein the first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than the second angle of the second partial surface 1204 relative to the optical axis, and the third angle of the third partial surface 1205 relative to the optical axis is greater than the fourth angle of the fourth partial surface 1206 relative to the optical axis, so that a small-sized photosensitive component 10 can be obtained, so that the size of the entire camera module 100 is further reduced. It can be understood that the mold base 12 can be further cut away from the second end side opposite to the flexible area 112, so that the remaining part of the mold base 12 after being cut has a cutting surface 125, as shown in Figure 14. In addition, as shown in Figure 13B, it can be seen that the electronic components 113 can be concentrated on at least one of the two wing sides of the photosensitive component 10, such as being concentrated on the two wing sides.

It is understandable that, in other modified embodiments, the filter element holder 31 may be absent, and the filter element 32 may be directly assembled to the molded base 12, or the filter element 32 may be assembled to the lens 20, or the filter element 32 may be assembled to a carrier of the lens 20 such as a driver or a fixed lens barrel.

As shown in FIG. 15 , the camera module 100 may include a carrier 40, which is a driver or a fixed lens barrel. In this figure, it is illustrated as a driver, such as a voice coil motor, a piezoelectric motor, etc., to form a dynamic focus camera module, and the lens 20 is mounted on the driver. The top side of the molded base 12 has a groove 123, which can be used to install the filter element lens holder 31, and the driver can be directly mounted on the top side of the molded base 12. It can be understood that in other modified embodiments, the carrier 40 can also be mounted on the filter element lens holder 31, or a part of it can be mounted on the filter element lens holder 31, and the other part can be mounted on the molded base 12.

As shown in Fig. 16, in this embodiment of the present invention and in the accompanying drawings, the camera module 100 may include a carrier 40, which is a fixed lens barrel, and the lens 20 is mounted on the fixed lens barrel. The top side of the molded base 12 has a groove 123, which can be used to install the filter element lens holder 31, and the fixed lens barrel is mounted on the top side of the molded base 12.

As shown in Figures 17A to 24, the photosensitive component 10 of the camera module 100 according to the second embodiment of the present invention and its manufacturing process. In this embodiment, a photosensitive component panel 1000 is also made by panelization, and then the photosensitive component 10 is cut. In the embodiments shown in Figures 2 to 16, in a plurality of columns of circuit boards, the rigid area 111 of one column of circuit boards is arranged adjacent to the flexible area 112 of another column of circuit boards. In this embodiment, the two adjacent columns of circuit boards can arrange the rigid areas 111 adjacent to each other, while the corresponding flexible areas 112 are far away from each other. More preferably, the rigid areas 111 of the two adjacent columns of circuit boards are integrally formed so that an integral rigid area is formed in the middle of the two adjacent columns of circuit boards.

Correspondingly, more specifically, the molding mold 210 forms a molding cavity 213 when the mold is closed, and provides a plurality of light window molding parts 214 and one or more base panel molding guide grooves 215, each of the base panel molding guide grooves 215 includes a first guide groove 2151 arranged in the longitudinal direction and approximately parallel at both ends, a second guide groove 2152 located between the two first guide grooves 2151, and a plurality of filling grooves 2153 arranged laterally and extending between the two first guide grooves 2151 and the second guide grooves 2152, wherein two columns of the filling grooves 2153 extend between the two first guide grooves 2151 and the second guide grooves 2152, respectively.

For example, in this embodiment, the circuit board panel 1100 includes 4 columns of circuit boards 11, and two columns of circuit boards 11 are grouped together. The rigid regions 111 of the two columns of circuit boards 11 in each group of circuit boards 11 are located in the middle and are integrally formed, such as each column of circuit boards 11 has 6 circuit boards, and the rigid regions 111 thereof are integrally formed. The molding mold 210 has two base panel molding guide grooves 215, and each base panel molding guide groove 215 has 7 filling grooves 2153 between each of the first guide grooves 2151 and the second guide grooves 2152, and has a filling groove 2153 between two adjacent light window molding parts 214, and each light window molding part 214 is located between two adjacent filling grooves 2153. The molding material 14 flows from its feed end 215A toward its end 215B along the two first guide grooves 2151 and the middle second guide groove 2152, and a two-stage design is adopted on the side surfaces of the first guide grooves 2151 and the second guide grooves 2152 facing the light window. The molding material 14 can fill each of the filling grooves 2153, thereby forming the integrated molding base 1200 after the molding material 14 is solidified.

In this embodiment of the present invention, the one-piece molded base 1200 is integrally formed with two adjacent columns of the circuit boards 11 and two adjacent columns of the photosensitive elements 13 to form a photosensitive component panel 1000 and a light window 122 is formed at a position corresponding to the light window molding portion 214 to provide a light path for each of the photosensitive elements 13 .

As shown in Figures 21A to 24, it is a schematic diagram of the manufacturing process of the photosensitive component panel 100 of the camera module 100 according to this preferred embodiment of the present invention. As shown in Figure 21A, the molding mold 210 is in a mold-closing state, the circuit board 11 to be molded and the solid molding material 14 are ready, the solid molding material 14 is heated, and the molding material 14 is melted into a fluid state or a semi-solid semi-fluid state and then fed into the base panel molding guide groove 215, flows forward along the first guide groove 2151 and the second guide groove 2152 and fills the filling groove 2153 between the two adjacent light window molding parts 214. In addition, in order to make the molding surface of the first mold 211 fit closely with the circuit board 11 and the photosensitive element 13 and facilitate demolding,.

As shown in Figures 22 and 23, when the two first guide grooves 2151, the second guide groove 2152 and the filling groove 2153 of the base panel forming guide groove 215 are all filled with the fluid molding material 14, the fluid molding material 14 is solidified and formed into the one-piece molded base 1200 integrally formed with the two adjacent rows of circuit boards 11 and the two rows of photosensitive elements 13 through a curing process.

As shown in Figure 24, after the molding material 14 is solidified to form the one-piece molding base 1200, the demolding process of the present invention is performed, that is, the mold fixing device 230 moves the first and second molds 211 and 212 away from each other, so that the light window forming part 214 leaves the one-piece molding base 1200, so that two rows of light windows 122 corresponding to each of the photosensitive elements 13 are formed in the one-piece molding base 1200.

As shown in FIG. 20B , the obtained photosensitive component panel 1000 can be further cut to obtain individual photosensitive components 10. Each of the photosensitive components 10 includes at least one circuit board 11, at least one photosensitive element 13, and the molded base 12 integrally molded on the circuit board 11 and the photosensitive element 13. As shown in FIGS. 19A to 20B , the rigid regions 111 integrally molded between two adjacent rows of circuit boards 11 are separated so that each circuit board 11 includes the rigid region 111 and the flexible region 112 combined. The molded base 12 integrally molds the rigid region 111 of the circuit board 11 and at least a portion of the non-photosensitive region 132 of the photosensitive element 13, and forms the light window 122 that provides a light path for the photosensitive region 131 of the photosensitive element 13.

It is worth mentioning that when the individual photosensitive components 10 obtained by cutting the photosensitive component puzzle 1000 are used to make a dynamic focus camera module, i.e., an automatic focus camera module, the molding mold 210 is further provided with a plurality of driver pin groove molding blocks 218, each of which extends into the filling groove 2153 of the base puzzle molding guide groove 215, so as not to affect the flow of the molding material 14 in the three guide grooves 2151, 2152 and 2153, and during the molding process, the fluid molding material 14 is The material 14 will not fill the positions corresponding to the respective driver pin slot forming blocks 218, so that after the curing step, a plurality of light windows 122 and a plurality of driver pin slots 124 are formed in the integrated molded base 1200 of the photosensitive component panel 1000, and the molded base 12 of each of the single photosensitive components 10 obtained by cutting is provided with the driver pin slots 124, so that when manufacturing the dynamic focus camera module 100, the driver pins can be connected to the circuit board 11 of the photosensitive component 10 by welding or conductive adhesive bonding.

It is worth mentioning that the manufacturing method of the photosensitive component panel 1000 of the present invention is suitable for making the photosensitive component 10 of small size. In the molding process, each of the first guide grooves 2151 has a first side surface 1201 facing the light window, and the second guide grooves 2152 have a second side surface 1202 facing the light window, wherein the first side surface includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, and the second side surface 1202 has a third partial surface 1205 arranged adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein the first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than the second angle of the second partial surface 1204 relative to the optical axis, and the third angle of the third partial surface 1205 relative to the optical axis is greater than the fourth angle of the fourth partial surface 1206 relative to the optical axis. In this way, the fluid molding material 14 can flow forward along the two first guide grooves 2151 on the outside and the second guide groove 2152 in the middle and fill the entire base panel forming guide groove 215 with the molding material 14 before the molding material 14 solidifies.

Accordingly, the molding process of the present invention obtains the photosensitive component panel 1000, which includes: one or more rows of the circuit boards 11, one or more rows of the photosensitive elements 13, and one or more integrated molded bases 1200. Each row of the circuit boards 11 includes one or more circuit boards 11 arranged side by side, and each circuit board 11 includes the rigid area 111 and the flexible area 112 combined. Each of the one-piece molded bases 1200 is integrally formed on two adjacent columns of the circuit boards 11 and two adjacent columns of the photosensitive elements 13 to form a light window 122 that provides a light path for each of the photosensitive elements 13, and the two adjacent columns of the circuit boards 11 are arranged so that their flexible regions 112 are far away from each other and their rigid regions 11 are adjacent to each other, so that each of the one-piece molded bases 1200 has two end sides adjacent to the flexible region 112; wherein a portion 1200A of the one-piece molded base corresponding to each end side of the one-piece molded base 1200 adjacent to the flexible region 112 has a first side surface 1201 facing the light window, and the one-piece molded base 1200 extends to a portion located between the two adjacent columns of the photosensitive elements 13. Part 1200B, which has a second side surface 1202 facing the light window, wherein the first side surface includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, and the second side surface 1202 has a third partial surface 1205 arranged adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein a first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 relative to the optical axis, and a third angle of the third partial surface 1205 relative to the optical axis is greater than a fourth angle of the fourth partial surface 1206 relative to the optical axis. Each end side of the one-piece molded base 1200 corresponds to the combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, that is, the proximal side adjacent to the flexible region 112; the one-piece molded base 1200 corresponds to the distal side of the circuit board 11 away from the flexible region 112 and extends between two adjacent columns of the photosensitive elements 13.

After the photosensitive component panel 1000 is cut, a single photosensitive component 10 can be obtained, wherein in the cutting step, the other sides of the integrated molded base 1200 except the end side portion 1200A can be cut to obtain the molded base 12, wherein the portion 1200B of the molded base corresponding to the photosensitive elements 13 in two adjacent columns is also cut.

Correspondingly, as shown in FIG20B , the photosensitive component 10 obtained after cutting includes the circuit board 11, the photosensitive element 13 and the molded base 12. The circuit board 11 includes the rigid area 111 and the flexible area 112 combined. The molded base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the light window 122 that provides a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connecting lines 15. After cutting the photosensitive component panel 1000, each of the photosensitive components 10 has a first end side that is not cut and a second end side obtained by cutting, similar to the above-mentioned embodiment. The portion 12A of the molded base corresponding to the first end side of the molded base 12 adjacent to the flexible region 112 has a first side surface 1201 facing the light window, and the portion 12B of the molded base corresponding to the opposite second end side of the molded base 12 away from the flexible region 112 has a second side surface 1202 facing the light window, wherein the first side surface includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, and the second side surface 1202 has a third partial surface 1205 arranged adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein a first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 relative to the optical axis, and a third angle of the third partial surface 1205 relative to the optical axis is greater than a fourth angle of the fourth partial surface 1206 relative to the optical axis. In this way, the shape of the cross section is set so that the molding material 14 can fill the base panel forming guide groove 215 during the molding process, thereby avoiding the production of defective photosensitive components.

That is to say, in this embodiment of the present invention, the molding material 14 can flow forward from the feed end 215A of the three guide grooves 2151 and 2152 and fill the guide grooves 2151 and 2152 and the filling groove 2153 of the entire base panel forming guide groove 215. The molding material 14 can flow from its feed end 215A to the end 215B along the three guide grooves 2151 and 2152 before solidification. And before the viscosity of the molding material 14 reaches a higher value and solidifies, the molding material 14 can fill the base panel forming guide groove 215, thereby preventing the connecting line 15 between the circuit board 11 and the photosensitive element 13 from being damaged by the molding material 14 with higher viscosity flowing forward. And the fluids in the three guide grooves 2151 and 2152 flow forward at basically the same pace, so as to prevent the molding material 14 in a certain guide groove from flowing to another guide groove and hindering the molding material 14 in the other guide groove from flowing forward. Furthermore, no turbulence or turbulence will be generated, which may cause the connection line 15 connecting the circuit board 11 and the photosensitive element 13 to swing irregularly and thus be deformed or damaged.

As shown in FIG. 21B , in order to facilitate demoulding and laminating the rigid region 111 of the circuit board 11, the first mold 211 further includes a plurality of laminating blocks 216. The outer edge 1201 of the molding base 12 and the outer edge of the rigid region 111 of the circuit board 11 form a laminating edge 1111, that is, in the molding process, two laminating blocks 216 are respectively laminating the regions on the rigid regions 111 of the two columns of the circuit board 11. The two laminating blocks 216 are laminating above each group of the flexible regions 112 of the two adjacent columns of the circuit board 11 to prevent the molding material 14 from flowing to the flexible regions 112. In addition, the rigid regions 111 of the two adjacent columns of the circuit board 11 are integrally formed to form an integral rigid region panel 110, and the two laminating blocks 216 are respectively laminating the two end sides of the integral rigid region panel 110, thereby facilitating the laminating of the two adjacent columns of the circuit board 11 by the first mold 211. In addition, the bottom width W of the first guide groove 2151 is 0.2 mm to 1 mm, which is suitable for manufacturing a small-sized photosensitive component. Accordingly, the photosensitive component 10 manufactured has a portion 12A of the molded base on one side adjacent to the flexible area 112, and a distance W between the inner edge and the outer edge thereof is 0.2 mm to 1 mm.

Accordingly, this embodiment of the present invention provides a method for manufacturing the photosensitive component 12 of the camera module 100, which comprises the following steps:

Fixing the circuit board panel 1100 to the second mold 212 of the molding mold 210, wherein the circuit board panel 1100 includes one or more rows of circuit boards, each row of circuit boards includes one or more circuit boards 11 arranged side by side, each circuit board 11 includes a rigid region 111 and a flexible region 112 combined, and each circuit board 111 is operably connected to the photosensitive element 13;

The second mold 212 is molded together with the first mold 211 by the mold fixing device 213, and the melted molding material 14 is filled into the base panel forming guide groove 215 in the forming mold 210, wherein the position corresponding to the light window forming portion 214 is blocked from being filled with the molding material 14;

The molding material 14 in the base panel molding guide groove 215 is solidified to form a one-piece molded base 1200 at a position corresponding to the base panel molding guide groove 215, wherein the one-piece molded base 1200 is integrally molded on two adjacent columns of the circuit boards 11 and two adjacent columns of the photosensitive elements 13 to form a photosensitive component panel 1000 and forms a light window 122 at a position corresponding to the light window molding portion 214 to provide a light path for each of the photosensitive elements 13, wherein the two adjacent columns of the circuit boards 12 are arranged so that their flexible regions 112 are far away from each other and their rigid regions 11 are adjacent to each other, wherein the base panel molding guide groove 215 has two first guide grooves 2151 corresponding to the two end sides of the one-piece molded base 1200 adjacent to the flexible region 112 and a second guide groove 2152 corresponding to the region between the two adjacent columns of the photosensitive elements 13, as well as a second guide groove 2152 extending between the two first guide grooves 2151 and the second guide groove 2152 for providing light to each column of the photosensitive elements 13 A filling groove 2153 is filled with the molding material 14 between two adjacent photosensitive elements 13 and is located between two adjacent light window molding parts 214, wherein the first guide groove 2151 has a first side surface 1201 facing the light window, and the second guide groove 2152 has a second side surface 1202 facing the light window, wherein the first side surface includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, and the second side surface 1202 has a third partial surface 1205 arranged adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein a first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 relative to the optical axis, and a third angle of the third partial surface 1205 relative to the optical axis is greater than a fourth angle of the fourth partial surface 1206 relative to the optical axis.

The photosensitive component panel 1000 is cut to obtain a plurality of the photosensitive components 10, wherein each of the photosensitive components 10 includes the circuit board 11, the photosensitive element 13 and the molded base 12, wherein the molded base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 to form the light window 122 that provides a light passage for the photosensitive element 13.

Furthermore, the method may further include the step of cutting a portion of the photosensitive component 10 between the two adjacent columns of the photosensitive elements 13 to obtain a portion 12B of the molded base corresponding to the other end side of the molded base 12 away from the flexible region 112. That is, the molded base 12 of the photosensitive component 10 between the two adjacent columns of the photosensitive elements 13 and the rigid region 111 of the circuit board 11 are suitable for being cut so that the distal ends of the two adjacent columns of the photosensitive components 10 away from the flexible region 112 are respectively the cutting sides, and the cutting surfaces 125 are respectively formed.

The circuit board 11 includes a plurality of electronic components 113 formed in the rigid area 111, such as those mounted by the SMT process. In the corresponding two first guide grooves 2151 and the second guide grooves 2152, there are no electronic components 113. The electronic components 113 can be concentrated in the filling grooves 2153, so that in the molding process, there will be no obstruction in the two first guide grooves 2151 and the second guide grooves 2152, thereby not affecting the forward flow of the molding material 14 along the two first guide grooves 2151 and the second guide grooves 2152, so that the molding material 14 can flow from its feed end 215A to its end 215B as soon as possible in a relatively short time.

In the step of making the single photosensitive component 10: the photosensitive component panel 1000 can be cut to obtain multiple independent photosensitive components 10 for making a single camera module. Two or more photosensitive components 10 connected as one can also be cut and separated from the photosensitive component panel 1000 to make a split array camera module, that is, each camera module of the array camera module has an independent photosensitive component 10, wherein two or more photosensitive components 10 can be connected to the control motherboard of the same electronic device, so that the array camera module made of two or more photosensitive components 10 can transmit the images taken by multiple camera modules to the control motherboard for image information processing.

As shown in FIG. 25A , a photosensitive component panel 1000 according to another variant implementation of the first embodiment of the present invention is shown, which includes the photosensitive component panel 1000 obtained by the inventive molding process, and includes: one or more rows of circuit boards 11, one or more rows of photosensitive elements 13, one or more rows of protection frames 16, and one or more one-piece molded bases 1200. Each row of circuit boards 11 includes one or more circuit boards 11 arranged side by side, and each circuit board 11 includes the rigid area 111 and the flexible area 112 combined. Each protection frame 16 is formed on the photosensitive element 13 and is located in the non-photosensitive area 132 of the photosensitive element 13, that is, it is located outside the photosensitive area 131. Each one-piece molded base 1200 is integrally formed on a row of circuit boards 11, a row of photosensitive elements 13, and a row of protection frames 16 and forms the light window 122 that provides a light path for each photosensitive element 13.

That is, before molding the one-piece molded base 1200, the protective frame 16 is pre-formed on each of the photosensitive elements 13, and the protective frame 16 may be formed of another material different from the molding material 14, such as glue applied to the non-photosensitive area 132 of the photosensitive element 13, or a hard frame and attached to the non-photosensitive area 132 of the photosensitive element 13 by glue. Therefore, in the process of molding the one-piece molded base 1200, the light window molding portion 214 is pressed against the protective frame 16 with a predetermined hardness, and when the fluid molding material 14 enters the base panel molding guide groove 215, the fluid molding material 14 can be prevented from flowing into the photosensitive area 131 of the photosensitive element 13, thereby forming a molding flash. For example, in a specific example, the protective frame 16 is formed of glue, which has predetermined elasticity and hardness, and can be further implemented to still have stickiness after curing, so as to be used to adhere to the dust particles in the photosensitive component 10 of the manufactured camera module. More specifically, in some embodiments, the Shore hardness of the protective frame 16 ranges from A50 to A80, and the elastic modulus ranges from 0.1 Gpa to 1 Gpa.

Similarly, a portion 1200A of the one-piece molded base corresponding to the first end side of the one-piece molded base 1200 adjacent to the flexible region 112 has a first side surface 1201 facing the light window; a portion 1200B of the one-piece molded base corresponding to the second end side opposite to the one-piece molded base 1200 away from the flexible region 112 has a second side surface 1202 facing the light window. The first side surface includes a first partial surface 1203 disposed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, and the second side surface 1202 includes a third partial surface 1205 disposed adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein a first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 relative to the optical axis, and a third angle of the third partial surface 1205 relative to the optical axis is greater than a fourth angle of the fourth partial surface 1206 relative to the optical axis. The first end side of the one-piece molded base 1200 corresponds to the combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, that is, the proximal side adjacent to the flexible region 112; the second end side of the one-piece molded base 1200 corresponds to the distal side of the circuit board 11 away from the flexible region 112.

After the photosensitive component panel 1000 is cut, a single photosensitive component 10 can be obtained, as shown in FIG25C , wherein in the cutting step, the one-piece molded base 1200 can be cut except for the two wing sides of the first end side and the second end side, thereby obtaining the molded base 12, while the corresponding portion 1200B of the molded base on the second end side is not cut, thereby obtaining the photosensitive component 10 having a portion 1200C of the one-piece molded base on a pair of opposite wing sides.

Accordingly, the photosensitive component 10 includes the circuit board 11, the photosensitive element 13, the protective frame 16 and the mold base 12. The circuit board 11 includes the rigid area 111 and the flexible area 112 combined. The mold base 12 is integrally formed on the circuit board 11, and the photosensitive element 13 and the protective frame 16 form the light window 122 that provides a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connecting wires 15. The protective frame 16 can be located inside the connecting wires 15, or can cover at least a part of the connecting wires 15. The part 12A of the mold base corresponding to the first end side of the mold base 12 adjacent to the flexible area 112 has a first side surface 1201; the part 12B of the mold base corresponding to the second end side of the mold base 12 away from the flexible area 112 has a second side surface 1202. The first side surface includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, and the second side surface 1202 has a third partial surface 1205 arranged adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein a first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 relative to the optical axis, and a third angle of the third partial surface 1205 relative to the optical axis is greater than a fourth angle of the fourth partial surface 1206 relative to the optical axis.

As shown in Figure 25C, accordingly, in order to further reduce the size of the photosensitive component 10, at least a portion of the photosensitive component 10 on the second end side opposite to the molded base 12 away from the flexible area 112 is suitable for being removed to form a cutting surface 125.

As shown in FIG. 25B , the modified implementation of the second embodiment of the present invention is to obtain the photosensitive component panel 1000 through a molding process, which includes: one or more rows of circuit boards 11, one or more rows of photosensitive elements 13, one or more rows of protection frames 16, and one or more one-piece molded bases 1200, each of which is formed on the corresponding photosensitive element 13. Each row of circuit boards 11 includes one or more circuit boards 11 arranged side by side, and each circuit board 11 includes the rigid region 111 and the flexible region 112 combined. Each of the one-piece molded bases 1200 is integrally formed on two adjacent columns of the circuit boards 11, two adjacent columns of the photosensitive elements 13, and two adjacent columns of the protective frames 16 to form a light window 122 that provides a light path for each of the photosensitive elements 13, and the two adjacent columns of the circuit boards 11 are arranged so that their flexible areas 112 are far away from each other and their rigid areas 11 are adjacent to each other, so that each of the one-piece molded bases 1200 has two end sides adjacent to the flexible area 112; wherein the part 1200A of the one-piece molded base corresponding to each end side of the one-piece molded base 1200 adjacent to the flexible area 112 has a first side surface 1201; the one-piece molded base 1200 extends to between the two adjacent columns of the photosensitive elements 13 and has a second side surface 1202. The first side surface includes a first partial surface 1203 disposed adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, and the second side surface 1202 includes a third partial surface 1205 disposed adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein the first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than the second angle of the second partial surface 1204 relative to the optical axis, and the third angle of the third partial surface 1205 relative to the optical axis is greater than the fourth angle of the fourth partial surface 1206 relative to the optical axis. Each end side of the one-piece molded base 1200 corresponds to the combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, that is, the proximal side adjacent to the flexible region 112; the one-piece molded base 1200 corresponds to the distal side of the circuit board 11 away from the flexible region 112 and extends between two adjacent rows of the photosensitive elements 13.

After the photosensitive component panel 1000 is cut, a single photosensitive component 10 can be obtained, wherein in the cutting step, the other sides of the one-piece molded base 1200 except the end side portion 1200A can be cut to obtain the molded base 12, wherein the portion 1200B of the molded base corresponding to the photosensitive elements 13 between two adjacent rows is also cut, so as to obtain the photosensitive component 10 having the one-piece molded base portion 1200C on a pair of opposite wing sides. The portion 12A of the molded base corresponding to the first end side of the molded base 12 adjacent to the flexible region 112 has a first side surface 1201; the portion 12B of the molded base corresponding to the second opposite end side of the molded base 12 away from the flexible region 112 has a second side surface 1202. The first side surface includes a first partial surface 1203 arranged adjacent to the photosensitive element 13 and a second partial surface 1204 connected to the first partial surface 1203, and the second side surface 1202 has a third partial surface 1205 arranged adjacent to the photosensitive element 13 and a fourth partial surface 1206 connected to the third partial surface 1205, wherein a first angle of the first partial surface 1203 relative to the optical axis of the camera module is greater than a second angle of the second partial surface 1204 relative to the optical axis, and a third angle of the third partial surface 1205 relative to the optical axis is greater than a fourth angle of the fourth partial surface 1206 relative to the optical axis, as shown in FIG. 25C .

As shown in Figures 26A to 27, the molding process of the panelization operation can also be used to make a photosensitive component 10 with two or more light windows 122, wherein such a photosensitive component 10 can be used to make an array camera module with a common substrate. That is to say, taking the photosensitive component 10 for making a dual-camera module as an example, in the molding process of each circuit board 11 of the circuit board panelization 1100, one circuit board substrate 111 is correspondingly provided with two light window molding parts 214, so that after the molding process and the cutting is completed, each circuit board 11 forms a molding base 12 with two light windows 122 sharing one circuit board 11, and two photosensitive elements 13 and two lenses 30 are correspondingly installed. And the circuit board 11 can be connected to the control motherboard of an electronic device, so that the array camera module made in this embodiment can transmit the images taken by multiple camera modules to the control motherboard for image information processing.

As shown in Figures 28 to 31C, a camera module 100 and a photosensitive component 410 thereof according to the third preferred embodiment of the present invention are shown. The camera module 400 can be applied to various electronic devices 300. As shown in Figure 44, the electronic device 300 includes a device body 301 and one or more camera modules installed on the device body 301. The electronic device 300 includes, for example but not limited to, a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, etc. The camera module cooperates with the electronic device to realize image acquisition and reproduction of the target object.

More specifically, the camera module 400 shown in the figure includes the photosensitive component 410 and a lens 430. The photosensitive component 410 includes a circuit board 411, a molded base 412, a photosensitive element 413 and a filter element 414. The molded base 412 includes a base body 4121, which is integrally molded with the circuit board 411 and the photosensitive element 413 and forms a light window 4122. The light window 4122 is a closed space and provides a light path for the photosensitive element 413. The molded base 412 of the present invention is integrally molded with the circuit board 411 and the photosensitive element 413 through a molding process, such as a transfer molding process, so that the molded base 412 can replace the lens holder or bracket of the traditional camera module, and there is no need to attach the lens holder or bracket to the circuit board 411 by glue as in the traditional packaging process. The filter element 414 , which may be an infrared filter element, is assembled on the top side of the molded base 412 and located between the photosensitive element 413 and the lens 430 to filter the infrared light passing through the lens 430 .

The circuit board 411 can be a hard board, a soft-soft board, a hard-soft board, a ceramic substrate, etc. In this embodiment, the circuit board 411 is a hard-soft board, which includes a substrate 4111 and a plurality of electronic components 4112 formed on the substrate 4111 such as those mounted by SMT technology, and the electronic components 4112 include but are not limited to resistors, capacitors, drive devices, etc. In this embodiment of the present invention, the molded base 412 is integrally coated with the electronic components 4112, thereby preventing dust and debris similar to those in traditional camera modules from adhering to the electronic components 4112 and further contaminating the photosensitive element 413, thereby affecting the imaging effect. It is understandable that the circuit board 411 may also not have the electronic components 4112, and the electronic components 4112 may be mounted on the top surface of the substrate 4111, or may be mounted on the bottom surface of the substrate 4111, or may be embedded in the substrate 4111. When arranged on the top surface of the substrate 4111, the electronic component 4112 can be arranged around the photosensitive element 413 and located on multiple sides of the photosensitive element 413. For example, the electronic component 4112 can be arranged on two pairs of opposite sides of the photosensitive element 413 or on a pair of opposite sides of the electronic component 4112.

The circuit board 411 and the photosensitive element 413 are operatively connected. As shown in the figure, the circuit board 411 and the photosensitive element 413 each have an electrical connection element, such as a solder pad, on their surfaces, and the two are connected via one or more groups of connecting wires 415. The molded base 412 integrally embeds the connecting wires 415.

In this preferred embodiment of the present invention, the camera module 400 includes the photosensitive component 410, the lens 430 and a lens bearing element 440. The lens 430 is assembled to the lens bearing element 440 to form a lens assembly. The lens bearing element 440 can be a driver or a fixed lens barrel. In this embodiment, the lens bearing element is a driver, and the driver can be implemented as a voice coil motor, a piezoelectric motor, a thermodynamic driver, a micro-electromechanical driver, etc. to achieve an auto-focus function, thereby forming an auto-focus camera module. It is understandable that in other embodiments, the lens 430 can be directly assembled to the molded base 412 of the photosensitive component 410.

The filter element 414 includes a filter element body 4141 and a shading layer 4142. The shading layer 4142 is located on the bottom side of the filter element body 4141 and between the filter element body 4141 and the molded base 412. The shading layer 4142 is a light-absorbing material, which enables the filter element body 4141 to form an effective light-transmitting area 41411 in the middle and a surrounding area 41412. The light passing through the lens 430 can only pass through the effective light-transmitting area 41411 to reach the interior of the molded base 412. The filter element body 141 material may include IR film (infrared cutoff film), AR film (anti-reflection coating), white glass, blue glass, resin material, coated composite material, crystal, etc. The light-shielding layer 4142 is an annular structure with a window formed in the middle. That is, the light-shielding layer 4142 forms a light passage 41420 for allowing light to enter the light window 4122 and then reach the photosensitive element 413 and reduces stray light reaching the photosensitive element 413.

The photosensitive element 413 has a photosensitive area 4131 in the middle and a non-photosensitive area 4132 located around the photosensitive area 4131, and the light shielding layer 4142 has an inner edge 41421 and an outer edge 41422. The distance between the inner edge 41421 of the light shielding layer 4142 and the optical axis X is greater than or equal to, or slightly less than, the distance between the outer edge 41311 of the photosensitive area 4131 and the optical axis X.

The outer edge 41422 of the shading layer 4142 is located outside the inner edge 41241 of the top surface 4124 of the molding base 412, that is, no light-transmitting area is formed between the inner edge 41241 of the top surface 4124 of the molding base 412 and the outer edge 41422 of the shading layer 4142.

In this embodiment of the present invention, the inner surface of the base body 4121 of the molded base 412 has multiple sections of inner surfaces along its circumferential direction, for example, it can be four sections of inner surfaces, each section of the inner surface includes multiple parts extending along different directions, for example, the base body 4121 of the molded base 412 includes three parts, namely, a photosensitive element combining portion 41211 and a top side extension portion 41212 located around the light window 4122 as shown in Figure 29A, and a circuit board combining portion 41213 located around the photosensitive element 413 and integrally combined with the outer peripheral surface of the photosensitive element 413 and the top surface of the circuit board 411, these three parts extend integrally to form an integral structure. The photosensitive element combining part 41211 and the photosensitive element combining part 41211 have inner surfaces integrally extending from the photosensitive element 413, wherein at least one section of the inner surfaces integrally extending from the photosensitive element 413 is defined as the first section inner surface 41231 of the mold base 412, and the top side extension part 41212 has an inner surface integrally extending from the photosensitive element combining part 41211, which forms the second section inner surface 41232 of the mold base 412, and the second section inner surface 41232 integrally extends from the first section inner surface 41231. It can be understood that each of the first section inner surface 41231 and the second section inner surface 41232 is a certain section of the inner surface of the surrounding inner surface of the seat body 4121; or multiple sections of the inner surface have the first section inner surface 41231 and the second section inner surface 41232 of the same structure; or all the inner surfaces have the first section inner surface 41231 and the second section inner surface 41232.

The inner surfaces 41231 and 41232 of the photosensitive element combining portion 41211 and the top side extending portion 41212 extend at different slopes, respectively. The second inner surface 41232 of the top side extending portion 41212 extends upward at a greater slope than the first inner surface 41231 of the photosensitive element combining portion 41211, or the second inner surface 41232 of the top side extending portion 41212 extends upward with almost no slope, that is, the second inner surface 41232 of the top side extending portion 41212 extends substantially perpendicular to the top surface of the photosensitive element 413, and the top side extending portion 41212 extends upward at a greater slope than the first inner surface 41231 of the photosensitive element combining portion 41211. The extension portion 41212 becomes a vertical extension portion, so that the area of the top surface of the top side extension portion 41212 can be relatively large, that is, the top surface of the top side extension portion 41212 determines the area of the top surface 4124 of the molded base 412. The extension structure such as the photosensitive element combining portion 41211 and the top side extension portion 41212 can increase the area of the top surface 4124 of the molded base 412, thereby providing a larger installation area for the lens or lens assembly above the photosensitive component 410, so as to more stably install the upper lens or lens assembly, and can reduce the area of the filter element 414.

That is to say, in order to facilitate demolding during the molding process and prevent stray light, the structure formed by the photosensitive element combining portion 41211 is that the first portion inner surface 41231 defined by its inner surface extends upward from the photosensitive element 413 at a relatively small slope, and the second portion inner surface 41232 defined by the inner surface of the top side extension portion 41212 extends integrally from the first portion inner surface 41231 in a turning manner, and extends upward at a relatively large slope or without a slope, that is, an angle is formed between the second portion inner surface 41232 and the first portion inner surface 41231 of the molding base 412, thereby effectively increasing the area size of the top surface 4124 of the molding base 412 relative to extending upward at a fixed slope.

As shown in FIG. 29B , the angle between the first part inner surface 41231 defined by the inner surface of the photosensitive element combining portion 41211 and the optical axis X of the camera module 400 is α, and the angle between the second part inner surface 41232 defined by the inner surface of the top side extending portion 41212 and the optical axis X of the camera module 400 is β, wherein the value range of α is 3° to 80°, the value range of β is 0° to 10°, and α＞β. For example, in a specific embodiment, the value of α is 3°, and the value of β is 0°; in a specific embodiment, the value of α is 30°, and the value of β is 0°; in a specific embodiment, the value of α is 60°, and the value of β is 0°; in a specific embodiment, the value of α is 45°, and the value of β is 5°; in a specific embodiment, the value of α is 80°, and the value of β is 10°.

That is to say, the angle β between the second-part inner surface 41232 defined by the inner surface of the top side extension portion 41212 and the optical axis X of the camera module 400 is smaller than the angle α between the first-part inner surface 41231 defined by the inner surface of the photosensitive element combining portion 41211 and the optical axis X of the camera module 400, so that the second-part inner surface 41232 of the top side extension portion 41212 extends upward with a larger slope or in a direction perpendicular to the photosensitive element 413, thereby increasing the area of the top surface 4124 of the molded base 412.

As shown in FIG. 29B , in this preferred embodiment of the present invention, preferably, the thickness H1 of the photosensitive element combining portion 41211 has a value range of 0.05 mm to 0.7 mm, and the thickness H2 of the top side extending portion 41212 has a value range of 0.02 mm to 0.6 mm. For example, in a specific embodiment, the thickness H1 of the photosensitive element combining portion 41211 has a value range of 0.08 mm, and the thickness H2 of the top side extending portion 41212 has a value range of 0.5 mm; in a specific embodiment, the thickness H1 of the photosensitive element combining portion 41211 has a value range of 0.4 mm, and the thickness H2 of the top side extending portion 41212 has a value range of 0.3 mm; in a specific embodiment, the thickness H1 of the photosensitive element combining portion 41211 has a value range of 0.5 mm, and the thickness H2 of the top side extending portion 41212 has a value range of 0.1 mm.

It is understandable that the second inner surface 41232 of the top extension 41212 turns from the first inner surface 41231 and extends in a direction with a smaller angle with the optical axis X, so that the pressing head pressed on the photosensitive element 413 can avoid the connecting wire 415 between the circuit board 411 and the photosensitive element 413 during the molding process, thereby preventing the connecting wire 415 from being crushed. That is, in some cases, if the mold base 412 to be formed extends at a relatively small fixed slope, such as an angle of 45° to 80° between the inner surface and the optical axis X, the pressing head pressed on the photosensitive element 413 during the molding process may touch the connecting wire 415 and cause damage to the connecting wire 415.

As shown in FIG. 30 , the angle α between the first part inner surface 41231 defined by the inner surface of the photosensitive element combination part 41211 and the optical axis X of the camera module 400 can be relatively large, so that the light L12 incident on the first part inner surface 41231 will not be directly reflected to the photosensitive element 413 to form stray light. In other words, the photosensitive element combination part 41211 and the top side extension part 41212 cooperate with each other, the structure of the photosensitive element combination part 41211 facilitates demoulding and reduces stray light, the top side extension part 41212 is used to increase the area of the top surface 4124 of the molding base 412, and the structure of the top side extension part 41212 prevents the connecting line 415 from being crushed by the pressure head during the molding process.

That is, preferably, as shown in Figure 29B, the position 41230 where the inner surface 41231 of the first part and the inner surface 41232 of the second part are connected is located on the inner side of the outer edge 41321 of the photosensitive element 413, that is, the distance D1 between the position 41230 where the inner surface 41231 of the first part and the inner surface 41232 of the second part and the optical axis X is smaller than the distance D2 between the outer edge 41321 of the non-photosensitive area 4132 of the photosensitive element 413 and the optical axis X, so that the size of the portion between the photosensitive element combining portion 41211 and the photosensitive element 413 is smaller, thereby reducing the possibility of the molding material 416 generating "flash" during the molding process.

Further preferably, the position 41230 where the first portion inner surface 41231 and the second portion inner surface 41232 are connected is located inside the connecting line 415, and the distance D1 between the position 41230 where the first portion inner surface 41231 and the second portion inner surface 41232 are connected and the optical axis X is less than the distance D3 between the connecting line 415 and the optical axis X. The turning point between the photosensitive element coupling portion 41211 and the top side extension portion 41212 does not exceed the position where the connecting line 415 is located, that is, the photosensitive element coupling portion 41211 completes the transition to the top side extension portion 41212 before extending to the position of the connecting line 415, thereby preventing the connecting line 415 from being crushed by the pressing head during the molding process. For example, when the top side extension portion 41212 is a vertical extension portion, the distance between the position of the inner edge 41241 of the top surface 4124 of the molded base 412 and the optical axis X of the camera module 400 is not less than the distance between the connecting line 415 and the optical axis X of the camera module, so that the top side extension portion 41212 increases the area of the top surface 4124 of the molded base 412, and integrally buries the connecting line 415 without damaging the connecting line 415.

It can be understood that the inner surface 41231 of the photosensitive element combining portion 41211 of the molding base 412 extends obliquely so as to facilitate the demolding operation in the molding process and reduce the stray light reaching the photosensitive element 413, and the inner surface 41232 of the top side extension portion 41212 extends integrally from the inner surface 41231 of the photosensitive element combining portion 41211 so that the photosensitive element combining portion 41211 and the top side extension portion 41212 cooperate to maximize the area of the top surface of the molding base 412 while reducing the stray light.

In addition, when the filter element 414 is provided with the shading layer 4142 on the bottom side, as shown in FIG30 , part of the stray light L11 incident on the upper surface of the filter element body 4141 of the filter element 414 is reflected by the upper surface of the filter element body 4141 and does not enter the light window 4122 of the molded base 412, and when it is refracted into the surrounding area 41412 outside the light-transmitting area 41411 above the shading layer 4142, it is absorbed by the shading layer 4142 and cannot enter the light window 4122 inside the molded base 412, thereby achieving the purpose of blocking part of the stray light.

When another part of the stray light L12 passes through the effective light-transmitting area 41411 of the filter element body 4141 and is incident on the first part inner surface 41231, it will be reflected upward to the shading layer 4142 by the inclined first part inner surface 41231 of the molded base 412 or further reflected to the shading layer 4142 by the second part inner surface 41232, thereby being absorbed by the shading layer 4142 and will not be further reflected to reach the photosensitive element 413, affecting the imaging quality of the camera module 400.

Correspondingly, the light shielding layer 4142 and the second inner surface 41232 of the mold base 412 are adjacent to each other, the second inner surface 41232 of the mold base 412 extends downward from the light shielding layer 4142, and a light suppression groove 41221 is formed at the outer portion of the light window 4122 between the light shielding layer 4142, the first inner surface 41231 and the second inner surface 41232, and the light suppression groove 41221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG30 , the stray light L12 enters the light suppression groove 41221, and thus cannot be emitted from the light suppression groove 41221.

It can be understood that, because the light shielding layer 4142 and the second portion inner surface 41232 of the mold base 412 are adjacent, the light shielding layer 4142 effectively reduces the light that passes through the filter element body 4141 and reaches the second portion inner surface 41232, thereby preventing the light incident on the second portion inner surface 41232 from being reflected by the second portion inner surface 41232 and reaching the photosensitive element 413 to form stray light and affect the imaging quality of the camera module 400. As shown in FIG. 30 , the second portion inner surface 41232 extends downward from the light shielding layer 4142, and the light shielding layer 4142 extends horizontally from the second portion inner surface 41232, and an angle γ is formed between the light shielding layer 4142 and the second portion inner surface 41232, and the angle γ is an acute angle or a right angle, so that the light suppression groove 41221 with such a structure prevents the light incident on the inner surface 4123 from being reflected toward the photosensitive element 413 to form stray light.

The filter element 4141 can be attached to the top surface 4124 of the mold base 412, such as being bonded to the top surface 4124 of the mold base 412 by glue. The light shielding layer 4142, which is a black light-absorbing and light-impermeable material, can be formed on the bottom surface of the filter element body 4141 in various ways, such as being attached to the bottom surface of the filter element body 4141, or being formed on the bottom surface of the filter element body 4141 by a yellow light process or a silk screen process.

As shown in FIG. 31A to FIG. 31C, it is a schematic diagram of the manufacturing process of the integrated component of the integrated circuit board 411, the molding base 412 and the photosensitive element 413 of the photosensitive component 410 according to the present invention. Its manufacturing equipment 4200 includes a molding mold 4210, and the molding mold 4210 includes a first mold 4211 and a second mold 4212 that can be opened and closed, that is, a mold fixing device can separate and close the first mold 4211 and the second mold 4212 to form a molding cavity 4213. When the mold is closed, the circuit board 411 connected to the photosensitive element 413 is fixed in the molding cavity 4213, and the fluid molding material 416 enters the molding cavity 4213, so as to be integrally molded on the circuit board 411 and the photosensitive element 413, and after being cured, the molding base 412 integrally molded on the circuit board 411 and the photosensitive element 413 is formed. It is understandable that in the production process, the above-mentioned integrated component is usually produced by paneling, that is, a one-piece molded base is formed on the circuit board panel, and then the integrated component of the present invention is formed by cutting. In Figures 31A to 31C, the formation process of an integrated component is illustrated as an example.

More specifically, the molding die 4210 further has a base molding guide groove 4215 and a light window molding portion 4214 located in the base molding guide groove 4215. When the first and second molds 4211 and 4212 are molded together, the light window molding portion 4214 and the base molding guide groove 4215 extend in the molding cavity 4213, and the fluid molding material 416 is filled into the base molding guide groove 4215, while the position corresponding to the light window molding portion 4214 cannot be filled with the fluid molding material 416, so that at the position corresponding to the base molding guide groove 4215, the fluid molding material 416 can form the molding base 412 after solidification, which includes an annular molding base body 4121 of the molding base 412 corresponding to each of the photosensitive components 410, and the light window 4122 of the molding base 412 is formed at the position corresponding to the light window molding portion 4214. The molding material 416 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.

More specifically, when the first and second molds 4211 and 4212 are molded together and the molding step is performed, the light window molding part 4214 is superimposed on the top surface of the photosensitive element 413 and fits tightly, so that the fluid molding material 416 is prevented from entering the photosensitive area 4131 of the photosensitive element 413 on the circuit board 411, so that the light window 4122 of the molding base 412 can be finally formed at the position corresponding to the light window molding part 4214. It is understandable that the light window molding part 4214 can be a solid structure, or a structure with a groove shape inside as shown in the figure. It is understandable that in another variation, an elastic film 4217 can also be set on the bottom side of the first mold 4211 to provide buffering and facilitate demolding after the molding process.

As shown in FIG. 31A to FIG. 31C , the light window molding part 4214 is pressed on the photosensitive element 413 to form the photosensitive element coupling part 41211 and the top side extension part 41212 of the mold base 412. The light window molding part 4214 has a bottom side molding part 42141 and a top side molding part 42142. The bottom side molding part 42141 is a frustum-shaped structure with a gradually increasing inner diameter from the bottom side toward the top side. The outer surface 421411 of the bottom side molding part 42141 forms an angle α with the optical axis X (vertical direction shown in the figure) perpendicular to the photosensitive element 413, and the outer surface 421421 of the top side molding part 42142 forms an angle β with the optical axis X perpendicular to the photosensitive element 413. Accordingly, the numerical range of α is 3° to 80°, the numerical range of β is 0° to 10°, and α＞β. The top molding part 42142 extends in a diagonal manner from the bottom molding part 42141, and will not press the connection line 415 during the molding process to cause damage to the connection line 415. The outer surface 411411 of the bottom molding part 42141 extends obliquely instead of directly forming a sharp right angle, and its height is at least 0.05 mm, thereby preventing the elastic film 4217 from being punctured during the molding process.

The light window molding part 4214 has a first part outer surface 421411 and a second part outer surface 421421 from the bottom side to the top side, which respectively form angles α and β with the optical axis X perpendicular to the photosensitive element 413, wherein the numerical range of α is 3° to 80°, the numerical range of β is 0° to 10°, and α>β. Thus, after the molding process, the molding base 412 forms the photosensitive element combining part 41211 and the top side extending part 41212, and the structure formed by the photosensitive element combining part 41211 is such that the first part inner surface 41231 defined by the inner surface thereof extends upward from the photosensitive element 413 at a relatively small slope, and the second part inner surface 41232 defined by the inner surface of the top side extending part 41212 extends from the first part inner surface 41231 in a turning manner and extends upward at a relatively large slope or without a slope. That is, the angle between the first part inner surface 41231 defined by the inner surface of the photosensitive element combining part 41211 and the optical axis X of the camera module 400 is α, and the angle between the second part inner surface 41232 defined by the inner surface of the top side extension part 41212 and the optical axis X of the camera module 400 is β, wherein the numerical range of α is 3° to 80°, the numerical range of β is 0° to 10°, and α＞β. It can be understood that the structure of the light window molding part 4214 with such a turning and extension can reduce the amount of the molding material 416 that enters the non-photosensitive area 4132 of the photosensitive element 413 and the space 41251 on the bottom side of the base molding guide groove 4215 of the first part outer surface 421411 of the light window molding part 4214 during the molding process, so that the volume of the molding material 416 in the space is smaller, and the pressure and pressure generated are smaller, making it less likely to enter the photosensitive area 4131 of the photosensitive element 413, thereby avoiding the generation of "flash".

In this molding process of the present invention, the bottom side of the base molding guide groove 4215 is located between the photosensitive element 413 and the first part outer surface 421411 of the molding base 412 to form a filling groove 42151. The molding material 416 molded to form the molding base 412 is not easy to enter between the photosensitive element 413 and the bottom surface of the light window molding part 4214 to form "flash", thereby reducing the possibility of the photosensitive area 4131 of the photosensitive element 413 being contaminated. More specifically, by reducing the volume of the filling groove 42151 between the photosensitive element 413 and the first part outer surface 421411 of the light window molding part 4214, the pressure and pressure generated by the molding material 416 entering the filling groove 42151 are reduced, thereby reducing the possibility of the molding material 416 entering between the photosensitive element 413 and the bottom surface of the light window molding part 4214 to form "flash".

In this preferred embodiment of the present invention, the outer surface of the light window molding portion 4214 has outer surfaces extending in different directions, and the angle between the outer surface of the top side, i.e., the second part outer surface 421421, and the optical axis X of the photosensitive component is smaller than the angle between the outer surface of the bottom side, i.e., the first part outer surface 421411, and the optical axis X, thereby reducing the volume of the filling groove 42151 formed between the first part outer surface 421411 of the light window molding portion 4214 and the photosensitive element 413, thereby reducing the possibility of generating "flash".

In addition, the second portion outer surface 421421 of the top side of the light window molding portion extends in a direction with a smaller angle with the optical axis X, so that it is not as convenient as the inclined outer surface shown in FIG. 1B to guide the packaging material into the filling groove. In this embodiment of the present invention, the second portion outer surface 421421 of the top side of the light window molding portion can play a certain degree of blocking effect, that is, because it is turned and integrally extended from the first portion outer surface 421411, it is not a linearly inclined extending guide surface structure similar to FIG. 1B, so that the flow rate of the molding material 416 entering the filling groove 42151 is slowed down to a certain extent, and the pressure generated by the molding material 416 entering the filling groove 42151 is reduced, thereby reducing the possibility of "flash" generation. In addition, because the molding material 416 is not easy to form "flash" in the integral molding process, the light window molding portion 4214 does not need to be pressed on the photosensitive element 413 with a large pressure, thereby preventing the photosensitive element 413 from being crushed. As shown in FIG32A , according to a variant implementation of the third preferred embodiment of the present invention, in this embodiment, a top side light shielding layer 4143 is further provided on the top surface of the filter element body 4141, so that the top side light shielding layer 4143 and the light shielding layer 4142 cooperate to enhance the effect of reducing stray light. More specifically, the light L21 incident on the top side light shielding layer 4143 is absorbed by the top side light shielding layer 4143, and the light L22 is absorbed by the light shielding layer 4142. It is understandable that the third preferred embodiment may also be provided with the top side light shielding layer 4143.

As shown in FIG32B , according to a modified implementation of the third preferred embodiment of the present invention, the camera module 400 includes the photosensitive component 410, the lens 430 and a lens bearing element 440. The lens 430 is assembled to the lens bearing element 440 to form a lens assembly. The lens bearing element 440 can be a fixed lens barrel, thereby forming a fixed-focus camera module.

Correspondingly, the photosensitive component 410 includes a circuit board 411, a molded base 412, a photosensitive element 413 and a filter element 414. The molded base 412 includes a base body 4121, which is integrally formed with the circuit board 411 and the photosensitive element 413 and forms a light window 4122. The light window 4122 is a closed space and provides a light path for the photosensitive element 413. The filter element 414 includes a filter element body 4141 and a light shielding layer 4142. The light shielding layer 4142 is a light-absorbing and light-impermeable material, which is located at the bottom side of the filter element body 4141 and between the filter element body 4141 and the molded base 412.

The mold base 412 has a top side groove 4125 on its top side, and the top side groove 4125 is used to assemble the filter element 414. That is, in this embodiment of the present invention, the top surface 4124 of the mold base 412 can be a multi-step surface, and the top surface 4124 is divided into multiple non-coplanar top surface parts, such as a first part top surface 4124a and a second part top surface 4124b, and the first part top surface 4124a is recessed relative to the second part top surface 4124b toward the direction of the photosensitive element 413, so that the top side groove 4125 is formed on the top side of the first part top surface 4124a, and the filter element 414 is assembled in the top side groove 4125.

The top extension 41212 of the mold base 412 is correspondingly in two sections, and the top groove 4125 is formed on the top side thereof. The inner surface 4123 of the mold base 412 includes the first inner surface 41231 of the photosensitive element combination portion 41211 and the second inner surface 41232 and the third inner surface 41233 formed by the top extension 41212. The light shielding layer 4142 is adjacent to the second inner surface 41232 of the mold base 412, and the light suppression groove 41221 is formed between the first inner surface 41231 and the second inner surface 41232, thereby forming a space to suppress the emission of stray light. That is, the light incident on the first portion inner surface 41231 is directly reflected to the light shielding layer 4142 or further reflected to the light shielding layer 4142 by the second portion inner surface 41232 and then absorbed by the light shielding layer 4142, thereby reducing stray light. The top side light shielding layer 4143 is also provided on the top side of the filter element 414 to enhance the effect of eliminating stray light.

It can be understood that in the embodiments of Figures 28 to 33 above, the bonding direction of the connecting wire 415 is from the photosensitive element 413 to the circuit board 411, that is, by setting the photosensitive element connecting disk on the photosensitive element 413, the bonding jig first bonds at the top of the photosensitive element connecting disk to form the first end of the connecting wire 415 connected to the photosensitive element connecting disk, then raises the preset position, and then moves toward the circuit board connecting disk on the circuit board and then descends to form the second end of the connecting wire 415 connected to the circuit board connecting disk at the top of the circuit board connecting disk.

As shown in FIG. 33 , according to another variant implementation of the third preferred example of the present invention, the electronic components 4112 of the circuit board 411 of the photosensitive component 410 of the camera module 400 are mounted on the bottom side thereof, and accordingly, the photosensitive component 410 further includes one or more bottom side molding parts 419, which integrally embed the electronic components 4112. That is, the electronic components 4112 are not mounted on the top side of the circuit board 411, and these electronic components 4112 are arranged on the bottom side of the circuit board 411, and through the bottom side molding part 419, which can be multiple independent parts or form an integral molding base, the electronic components 4112 are embedded and the bottom side flat support surface is formed. The bottom side molding part 419 and the molding base 412 can be formed separately and independently, or they can be formed in a single molding process, such as the circuit board 411 can have perforations, and the molding material 416 can reach both sides of the circuit board 411 during the molding process.

It can be understood that the space on the bottom side of the circuit board 411 below the photosensitive element 413 can also be used to arrange the electronic components 4112, so that unlike the above embodiment, the electronic components 4112 need to be arranged around the photosensitive element 413. In this embodiment, the area size of the circuit board 411 can be significantly reduced.

Accordingly, the mold base 412 includes the photosensitive element combining portion 41211 and the top extension portion 41212, so that when the size of the photosensitive component 410 is further reduced, the top extension portion 41212 is extended in a turning manner to increase the area of the top surface 4124 of the mold base 412, so as to provide a larger mounting surface for the lens bearing element 440 and the filter element 414. In addition, the filter element 414 includes a bottom light shielding layer 4142 and a top light shielding layer 4143 arranged on both sides of the filter element body 4141, so as to enhance the effect of eliminating stray light.

As shown in FIG34 , the wire bonding connection between the photosensitive element 413 and the circuit board 411 is from the circuit board 411 to the photosensitive element 413. That is, by setting the circuit board connection plate on the circuit board 411, the wire bonding jig firstly forms the second end of the connection line 415 connected to the circuit board connection plate by bonding at the top of the circuit board connection plate, and then raises the preset position, and then translates toward the circuit board connection plate and forms the opposite first end of the connection line 415 connected to the photosensitive element connection plate at the top of the electric photosensitive element connection plate, so that the connection line 415 extends in a curved shape, and the height h2 of the top of the connection line 415 is lower than that of the embodiment of FIG28 to FIG33 , taking FIG33 as an example, the height h1 of the top of the connection line is lower, so that in the molding process, the space that the light window molding part 4214 of the molding mold 4210 needs to avoid the connection line 415 is reduced, so that the height of the top side extension part 41212 can be higher.

As shown in Figures 35 to 37, a camera module 400 according to a fourth preferred embodiment of the present invention is shown, wherein the camera module 400 includes a photosensitive component 410 and a lens 430. The lens 430 is assembled to the photosensitive component to form a fixed-focus camera module. It is understood that in other variant implementations, the lens can also be arranged on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive component.

Correspondingly, the photosensitive component 410 includes a circuit board 411, a molded base 412, a photosensitive element 413, a filter element 414 and a filter element bracket 417. The molded base 412 includes a base body 4121, which is integrally molded with the circuit board 411 and the photosensitive element 413 to form a light window 4122. The light window 4122 is a closed space and provides a light path for the photosensitive element 413.

The filter element bracket 417 is assembled on the molded base 412 and has a bottom window 4171 and a top mounting groove 4172. The filter element 414 is assembled in the top mounting groove 4172, so that the filter element 414 assembled on the filter element bracket 417 is less likely to be damaged than being directly assembled on the molded base 412.

The filter element 414 includes a filter element body 4141, a bottom light shielding layer 4142 and a top light shielding layer 4143. The light shielding layer 4142 is located at the bottom of the filter element body 4141 and between the filter element body 4141 and the inner top surface of the filter element support 417. The light shielding layer 4142 is a light absorbing material, which forms an effective light transmission area 41411 and a surrounding area 41412 in the middle of the filter element body 4141. The light passing through the lens 430 can only pass through the effective light transmission area 41411 to reach the inside of the mold base 412. The light shielding layer 4142 is an annular structure with a window formed in the middle. That is, the light shielding layer 4142 forms a light passage 41420 for allowing light to enter the light window 4122 and reduce stray light reaching the photosensitive element 413. The top light shielding layer 4143 can enhance the effect of reducing stray light.

The photosensitive element 413 has a photosensitive area 4131 in the middle and a non-photosensitive area 4132 located around the photosensitive area 4131, and the light shielding layer 4142 has an inner edge 41421 and an outer edge 41422. The distance between the inner edge 41421 of the light shielding layer 4142 and the optical axis X is greater than or equal to, or slightly less than, the distance between the outer edge 41311 of the photosensitive area 4131 and the optical axis X.

The outer edge 41422 of the shading layer 4142 is located outside the inner edge 41701 of the top surface of the filter element holder 417 , that is, no light-transmitting area is formed between the inner edge of the top surface of the filter element holder 417 and the outer edge 41422 of the shading layer 4142 .

In this embodiment of the present invention, the base body 4121 of the molded base 412 includes multiple inner surface sections in a circumferential direction, and each inner surface section has multiple parts extending along different directions. For example, the base body 4121 of the molded base 412 includes three parts, namely, a photosensitive element combining portion 41211 and a top side extension portion 41212 located around the light window 4122 as shown in Figures 36A and 36B, and a circuit board combining portion 41213 on the bottom side of the photosensitive element combining portion 41211. The photosensitive element coupling portion 41211 has an inner surface integrally extending from the photosensitive element 413, wherein at least one section of the inner surface integrally extending from the photosensitive element 413 is defined as a first portion inner surface 41231 of the mold base 412, and the top side extension portion 41212 has an inner surface integrally extending from the photosensitive element coupling portion 41211, and forms a second portion inner surface 41232 of the mold base 412, and the second portion inner surface 41232 integrally extends from the first portion inner surface 41231. It can be understood that each of the first portion inner surface 41231 and the second portion inner surface 41232 is a certain section of the inner surface of the surrounding inner surface of the seat body 4121; or multiple sections of the inner surface have the first portion inner surface 41231 and the second portion inner surface 41232 of the same structure; or all the inner surfaces have the first portion inner surface 41231 and the second portion inner surface 41232.

The inner surfaces 41231 and 41232 of the photosensitive element combining portion 41211 and the top side extending portion 41212 extend at different slopes, respectively. The second inner surface 41232 of the top side extending portion 41212 extends upward at a greater slope than the first inner surface 41231 of the photosensitive element combining portion 41211, or the second inner surface 41232 of the top side extending portion 41212 extends upward almost without a slope, that is, the second inner surface 41232 of the top side extending portion 41212 extends substantially perpendicular to the top surface of the photosensitive element 413, so that the top side extending portion 41212 is substantially perpendicular to the top surface of the photosensitive element 413, so that the second inner surface 41232 of the top side extending portion 41212 extends upward at a greater slope than the first inner surface 41231 of the photosensitive element combining portion 41211. The area of the top surface of the extension part 41212 can be relatively large, that is, the top surface of the top side extension part 41212 determines the area of the top surface 4124 of the mold base 412. The extension structure of the photosensitive element combining part 41211 and the top side extension part 41212 can increase the area of the top surface 4124 of the mold base 412, thereby providing a larger installation area for the lens or lens assembly or the filter element bracket 417 above the photosensitive component 410. For example, in this embodiment, the top surface 4124 of the mold base 412 can more stably install the filter element bracket 417 above. And such a structure can reduce the area of the filter element 414.

That is, in order to facilitate demoulding in the molding process and prevent stray light, the structure formed by the photosensitive element combining part 41211 is that the first part inner surface 41231 defined by the inner surface thereof extends upward from the photosensitive element 413 at a relatively small slope, and the second part inner surface 41232 defined by the inner surface of the top side extending part 41212 extends from the first part inner surface 41231 in a turning manner and extends upward at a relatively large slope or without a slope, that is, an angle is formed between the second part inner surface 41232 and the first part inner surface 41231 of the molding base 412, so that the area size of the top surface 4124 of the molding base 412 can be effectively increased relative to the upward extension at a fixed slope. It can be understood that the inner surface extending in the circumferential direction of the molding base 412 can all have the first part inner surface 41231 and the second part inner surface 41232, and these first part inner surfaces 41231 can have the same angle α or different angles α. The included angles β of the second portion inner surfaces 41232 may be the same or different.

As shown in Figure 36B, the angle between the first part inner surface 41231 defined by the inner surface of the photosensitive element combining part 41211 and the optical axis X of the camera module 400 is α, and the angle between the second part inner surface 41232 defined by the inner surface of the top side extension part 41212 and the optical axis X of the camera module 400 is β, wherein the numerical range of α is 3° to 80°, the numerical range of β is 0° to 10°, and α＞β.

That is to say, the angle β between the second-part inner surface 41232 defined by the inner surface of the top side extension portion 41212 and the optical axis X of the camera module 400 is smaller than the angle α between the first-part inner surface 41231 defined by the inner surface of the photosensitive element combining portion 41211 and the optical axis X of the camera module 400, so that the second-part inner surface 41232 of the top side extension portion 41212 extends upward with a larger slope or in a direction perpendicular to the photosensitive element 413, thereby increasing the area of the top surface 4124 of the molding base 412, reducing the area of the filter element, and reducing the possibility of "flash" generated by the molding material 416 during the molding process.

As shown in FIG. 36B , in this preferred embodiment of the present invention, preferably, the thickness H1 of the photosensitive element combining portion 41211 has a value ranging from 0.05 mm to 0.7 mm, and the thickness H2 of the top side extending portion 41212 has a value ranging from 0.02 mm to 0.6 mm.

In addition, the filter element 414 is provided with the shading layer 4142 and the top shading layer 4143, as shown in FIG37 , part of the stray light L31 incident on the upper surface of the filter element body 4141 of the filter element 414 is absorbed by the top shading layer 4143, thereby achieving the purpose of blocking part of the stray light.

When another part of the stray light L32 passes through the effective light-transmitting area 41411 of the filter element body 4141 and is incident on the first part inner surface 41231, it will be reflected upward to the shading layer 4142 by the inclined first part inner surface 41231 of the molded base 412 or further reflected to the shading layer 4142 by the second part inner surface 41232, thereby being absorbed by the shading layer 4142 and will not be further reflected to reach the photosensitive element 413, affecting the imaging quality of the camera module 400.

Correspondingly, the light shielding layer 4142 and the inner surface 41702 of the filter element holder 417 located below the filter element are adjacent to each other, the inner surface 41702 of the filter element holder 417 located below the filter element extends downward from the light shielding layer 4142, and between the light shielding layer 4142, the inner surface 41702 of the filter element holder 417 located below the filter element, the first inner surface 41231 and the second inner surface 41232, the outer portion of the light window 4122 forms a light suppression groove 41221, and the light suppression groove 41221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG37 , the stray light L32 enters the light suppression groove 41221, and thus cannot be emitted from the light suppression groove 41221.

As shown in FIG38 , according to a modified implementation of the fourth preferred embodiment of the present invention, a top side groove 4125 is formed on the top side of the mold base 412, the filter element holder 417 is assembled in the top side groove 4125 to move its position downward, and the lens 430 can be assembled on the top side of the mold base 412. That is, the top surface 4124 of the mold base 412, which is enlarged by multi-stage extension, is used to assemble the filter element holder 417 and the lens 430.

As shown in Figures 39 to 41, a camera module 400 according to the fifth preferred embodiment of the present invention is shown. Its structure is similar to that of the fourth preferred embodiment. The camera module 400 includes a photosensitive component 410 and a lens 430. The lens 430 is assembled to the photosensitive component to form a fixed-focus camera module. It is understood that in other variant embodiments, the lens can also be set in a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive component.

Correspondingly, the photosensitive component 410 includes a circuit board 411, a molded base 412, a photosensitive element 413, a filter element 414 and a filter element bracket 417. The molded base 412 includes a base body 4121, which is integrally formed with the circuit board 411 and the photosensitive element 413 and forms a light window 4122. The light window 4122 is a closed space and provides a light path for the photosensitive element 413. The molded base 412 includes a photosensitive element combining portion 41211 and a top side extending portion 41212 located around the light window 4122, which extends in multiple sections, and the inner surfaces 41231 and 41232 extend in different directions respectively, so as to reduce stray light and increase the area of the top surface 4124 of the molded base 412.

The filter element bracket 417 is assembled on the mold base 412 and has a top window 4171 and a bottom mounting groove 4173. The filter element 414 is assembled in the bottom mounting groove 4173 in an inverted manner. The filter element 414 includes a filter element body 4141 and a light shielding layer 4142. The light shielding layer 4142 is arranged on the bottom side of the filter element body 4141. Thus, similarly, the light shielding layer 4142 can play a role in reducing stray light reaching the photosensitive element 413.

In addition, the lens 430 includes a carrier 431 and one or more lenses 432 assembled on the carrier 431, wherein because the filter element 414 is inverted on the filter element bracket 417, the filter element 414 does not protrude from the upper surface of the filter element bracket 417, and the bottommost lens among the one or more lenses 432 of the lens 430 can be relatively moved downward, thereby reducing the distance between the lens and the photosensitive element 413, thereby reducing the back focal length of the camera module 400.

When the light-shielding layer 4142 is provided on the bottom side of the filter element 414, as shown in FIG41, part of the stray light L41 incident on the upper surface of the filter element bracket 417 is reflected and does not enter the light window 4122 of the molded base 412, thereby achieving the purpose of blocking part of the stray light.

When another part of the stray light L42 passes through the effective light-transmitting area 41411 of the filter element body 4141 and is incident on the first part inner surface 41231, it will be reflected upward to the shading layer 4142 by the inclined first part inner surface 41231 of the molded base 412 or further reflected to the shading layer 4142 by the second part inner surface 41232, thereby being absorbed by the shading layer 4142 and will not be further reflected to reach the photosensitive element 413, thereby affecting the imaging quality of the camera module 400.

Correspondingly, the light shielding layer 4142 and the second inner surface 41232 of the mold base 412 are adjacent, the second inner surface 41232 of the mold base 412 extends downward from the light shielding layer 4142, and between the light shielding layer 4142, the first inner surface 41231 and the second inner surface 41232, a light suppression groove 41221 is formed at the outer portion of the light window 4122, and the light suppression groove 41221 is a space for suppressing the emission of stray light. More specifically, as shown in FIG41 , the stray light L42 enters the light suppression groove 41221, and thus cannot be emitted from the light suppression groove 41221.

Furthermore, it can be understood that, because of the shading layer 4142 and the second portion inner surface 41232 of the molded base 412, the shading layer 4142 effectively reduces the light that passes through the filter element body 4141 and reaches the second portion inner surface 41232, thereby preventing the light incident on the second portion inner surface 41232 from being reflected and reaching the photosensitive element 413 to form stray light and affect the imaging quality of the camera module 400.

As shown in Figure 42, according to another variant implementation of the above-mentioned fifth embodiment of the present invention, the wiring direction of the connecting wire 415 is from the circuit board 411 to the photosensitive element 413, so that the light window molding part 4214 in the molding process does not need to provide avoidance space for the connecting wire 415 as much as possible, and the top side extension part 41212 has a larger height to increase the area of the top surface 4124 of the molding base 412.

In addition, a window 4171 is formed on the top side of the filter element holder 417, and the length of the top side portion 4174 of the filter element holder 417 extending inwardly may be greater than or equal to the length of the light shielding layer 4142 extending inwardly, so that the area of the window 4171 may not be greater than the area of the light passage 41420, so that the top surface of the filter element holder 417 has the effect of blocking a part of the stray light L51, and thus it is not necessary to set the top side light shielding layer 4143 on the top side of the filter element 414. The stray light L52 can be absorbed by the light shielding layer 4142.

As shown in FIG43, according to another variant implementation of the fifth embodiment of the present invention, the photosensitive component 410 includes a circuit board 411, a molded base 412, a photosensitive element 413, a filter element 414, a filter element bracket 417 and a stop frame 418. The molded base 412 is integrated with the circuit board, the photosensitive element 413 and the stop frame 418, the filter element 414 is assembled to the filter element bracket 417, and the filter element bracket 417 is assembled to the top side of the molded base 412. The light shielding layer 4142 of the filter element 414 is similar to the third preferred embodiment, and is arranged on the bottom side of the filter element body 142 thereof, which can play a role in reducing stray light.

The annular baffle frame 418 is disposed on the photosensitive element 413, and is used to press the light window molding portion 4214 onto the baffle frame 418 during the molding process to prevent the fluid molding material 416 from flowing into the photosensitive area 4131 of the photosensitive element 413, wherein the molding base 412 is integrally formed with the circuit board, the photosensitive element 413 and the baffle frame 418. In a preferred embodiment, the baffle frame 418 may be glue, which may have a predetermined elasticity, such as an elastic modulus range of 0.1Gpa-1Gpa.

A base body 4121 of the molded base 412 includes a photosensitive element combining portion 41211 and a top side extension portion 41212 located around the light window 4122 , and a circuit board combining portion 41213 around the photosensitive element 413 on the bottom side of the photosensitive element combining portion 41211 and on the top side of the circuit board 411 . The photosensitive element combining portion 41211 is integrally combined with the circuit board 411, the photosensitive element 413 and the blocking frame 418, and has a first portion inner surface 41231 extending obliquely from the blocking frame 418, and the top side extension portion 41212 has a second portion inner surface 41232 extending in a direction from the first portion inner surface 41231, so that such a structure enables the reflective effect of the inclined first portion inner surface 41231 to reduce stray light, and the second portion surface 1232 extending in a direction enables the top surface of the top side extension portion 41212 to have a larger installation area, reducing the area of the filter element 414, and preventing the molding material 416 from forming "flash" during the molding process, and the angle between the two portions of the inner surface and the optical axis X is similar to that of the aforementioned embodiment. It can be understood that the blocking frame 418 of this embodiment can also be applied to other embodiments of the present invention.

It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims (17)

1. A photosensitive assembly, comprising:

a circuit board;

A photosensitive element operatively connected to the circuit board;

A molded base integrally bonded to the circuit board and the photosensitive element and forming a light window, wherein the molded base has one or more first portion inner surfaces adjacent the photosensitive element and one or more second portion inner surfaces connected to the first portion inner surfaces remote from the photosensitive element;

The optical filter element is assembled on the top side of the molded base, comprises an optical filter element main body and at least one shading layer arranged on at least one side of the top side and the bottom side of the optical filter element main body, and forms a light suppression groove in the outer side part of the optical window among the shading layer, the inner surface of the first part and the inner surface of the second part;

the first angle of the first portion inner surface with respect to the optical axis X is greater than the second angle of the second portion inner surface with respect to the optical axis X.

2. The photosensitive assembly of claim 1, wherein the light shielding layer is of annular configuration, the light shielding layer forms a light path for light entering the light window and subsequently reaching the photosensitive element, and the light shielding layer is a light absorbing opaque material that forms the filter element body into a central effective light transmitting region and a surrounding region through which light passes to reach the interior of the molded base.

3. The photosensitive assembly of claim 1, wherein the photosensitive element has a photosensitive region in the middle and a non-photosensitive region surrounding the photosensitive region, the light shielding layer has an inner edge and an outer edge, and a distance between the inner edge of the light shielding layer and the optical axis X is greater than or equal to or less than a distance between the outer edge of the photosensitive region and the optical axis X.

4. A photosensitive assembly according to any of claims 1-3, wherein said filter element is assembled to a top side of said molded base.

5. The photosensitive assembly of claim 4, wherein the light shielding layer is positioned on a bottom side of the filter element body and between the filter element body and the molded base, the second portion inner surface of the molded base extending downwardly from the light shielding layer.

6. The photosensitive assembly of claim 5, wherein the light shielding layer extends horizontally from the inner surface of the second portion, and wherein an included angle γ is formed between the light shielding layer and the inner surface of the second portion, and wherein the included angle γ is an acute angle or a right angle.

7. The photosensitive assembly of claim 6, wherein an outer edge of the light shielding layer is outboard of an inner edge of a top surface of the molded base, and a light transmissive region is not formed between the inner edge of the top surface of the molded base and the outer edge of the light shielding layer.

8. The photosensitive assembly of any of claims 5-7, wherein the top surface of the filter element body is further provided with a top side light blocking layer.

9. A photosensitive assembly according to any of claims 1-3, comprising a filter element holder, said filter element holder being assembled to said molded base, and said filter element holder having a fenestration and a mounting recess, said filter element being assembled to said mounting recess.

10. The photosensitive assembly of claim 9, comprising said filter element holder having a bottom side fenestration and a top side mounting groove, said filter element being assembled to said top side mounting groove.

11. The photosensitive assembly of claim 10, wherein the filter element comprises a light shielding layer disposed on a bottom side of the filter element body and a top side light shielding layer disposed on a top side of the filter element body, and wherein the light shielding layer is disposed between the filter element body and an inside top surface of the filter element holder, wherein the light shielding layer and an inside surface of the filter element holder below the filter element are adjacent, wherein an inside surface of the filter element holder below the filter element extends downward from the light shielding layer, and wherein the light suppressing groove is formed in an outside portion of the light window between the light shielding layer and the inside surface of the filter element holder below the filter element, and between the first portion inside surface and the second portion inside surface.

12. The photosensitive assembly of claim 10, wherein an outer edge of the light shielding layer is outboard of an inner edge of a top surface of the filter element support, a light transmission region not being formed between the inner edge of the top surface of the filter element support and the outer edge of the light shielding layer.

13. The photosensitive assembly of claim 9, wherein said filter element holder has a top side fenestration and a bottom side mounting recess, said filter element being assembled in a reverse-fit manner to said bottom side mounting recess.

14. The photosensitive assembly of claim 13, wherein said filter element comprises a light shielding layer disposed on a bottom side of said filter element body and a top side light shielding layer disposed on a top side of said filter element body, and wherein said top side light shielding layer is disposed between said filter element body and an inside bottom surface of said filter element holder, and wherein said light suppressing groove is formed in an outside portion of said light window between said light shielding layer, said first portion inner surface and said second portion inner surface.

15. The photosensitive assembly of claim 13, wherein the filter element comprises a light shielding layer disposed on a bottom side of the filter element body, and the light suppressing groove is formed between the light shielding layer, the first portion inner surface and the second portion inner surface at an outer portion of the light window.

16. The photosensitive assembly of claim 15, wherein a top portion of the filter element support extends inward a length greater than or equal to a length of the light shielding layer extending inward.

17. A camera module comprising a photosensitive assembly according to any one of claims 1-16 and a lens;

The filter element is positioned between the photosensitive element and the lens.