CN210075451U - Camera chip inspection machine - Google Patents
Camera chip inspection machine Download PDFInfo
- Publication number
- CN210075451U CN210075451U CN201920947443.XU CN201920947443U CN210075451U CN 210075451 U CN210075451 U CN 210075451U CN 201920947443 U CN201920947443 U CN 201920947443U CN 210075451 U CN210075451 U CN 210075451U
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- 238000007689 inspection Methods 0.000 title abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 35
- 238000006073 displacement reaction Methods 0.000 claims abstract description 34
- 238000012937 correction Methods 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 3
- 230000001915 proofreading effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Abstract
The utility model discloses a camera chip inspection machine, it is used for rectifying the benchmark piece and treats the equipment position between the adjustment piece, camera chip inspection machine includes the frame, install in the correction manipulator of frame, a tool, a collimator for detecting the depth of parallelism, a camera for detecting the displacement sensor of interval and being used for the coincidence degree of detection center, the frame has correction platform and has the inspection hole, the tool is installed in the top of inspection hole, a collimator, displacement sensor and the equal movably setting in the below of inspection hole of camera, the correction manipulator is located the top of tool, a collimator, the adjustment piece detection can be treated to displacement sensor and camera, the correction manipulator can snatch treating the adjustment piece on the tool and rectify the position of treating the adjustment piece for the benchmark piece. The utility model discloses a camera chip inspection machine has advantages such as the equipment accuracy is high and degree of automation height.
Description
Technical Field
The utility model relates to a camera chip equipment technical field especially relates to a camera chip inspection machine.
Background
The camera is one of common electronic products, and has a very wide market. After all parts of the camera are machined, the camera can be formed into a final mobile phone finished product only by carrying out complete machine assembly. The camera is assembled by a plurality of different precise components, so the assembly precision of each component can seriously affect the qualification rate of products.
At present, a CMOS chip is commonly used for a camera as a photoreceptor of the camera, and for the assembly between the CMOS chip and a front cover of the camera, if parameters such as parallelism, distance and position contact ratio of a photosensitive central point of an annular bearing surface of the CMOS chip and the front cover have larger errors, namely the assembly accuracy is lower, the image capturing performance of the camera is influenced, and the existing production requirements cannot be met.
Therefore, a need exists for a camera chip calibration machine that overcomes the above-mentioned deficiencies.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a camera chip inspection machine, it has the high and high advantage of degree of automation of equipment accuracy.
To achieve the above object, the present invention provides a camera chip calibration machine for calibrating an assembly position between a reference member and a member to be adjusted, the camera chip correcting machine comprises a frame, a correcting manipulator, a jig, a collimator for detecting parallelism, a displacement sensor for detecting spacing and a camera for detecting central contact ratio, wherein the correcting manipulator is arranged on the frame, the frame is provided with a correction platform which is provided with a detection hole, the jig is arranged above the detection hole, the collimator, the displacement sensor and the camera are movably arranged below the detection hole, the correcting manipulator is positioned above the jig, the collimator, the displacement sensor and the camera can detect the piece to be adjusted, the correcting manipulator can grab the to-be-adjusted piece on the jig and correct the position of the to-be-adjusted piece relative to the reference piece.
Preferably, the camera chip calibration machine further comprises a dispensing device for dispensing between the reference member and the member to be adjusted, and the dispensing device is movably mounted on the frame.
Specifically, the camera chip correction machine further comprises a curing device for curing the dispensing, and the curing device is mounted on the rack.
Preferably, the calibration manipulator comprises a five-axis adjusting mechanism and a Z-axis moving mechanism mounted on the rack, the five-axis adjusting mechanism is mounted at an output end of the Z-axis moving mechanism, the five-axis adjusting mechanism is driven by the Z-axis moving mechanism to move along the Z-axis direction of the rack, and the five-axis adjusting mechanism can grab the to-be-adjusted piece and enable the to-be-adjusted piece to move along the Y-axis direction of the rack, or rotate along the Z-axis direction of the rack, or rotate around the X-axis direction of the rack, or rotate around the Y-axis direction of the rack, or rotate around the Z-axis direction of the rack.
Preferably, the camera chip calibration machine further comprises a pressing mechanism for pressing the to-be-adjusted piece, the pressing mechanism is mounted on the calibration platform and provided with a pressing piece extending to the jig, and the pressing piece presses or releases the to-be-adjusted piece.
Preferably, the jig comprises a left clamping piece, a right clamping piece, a butting piece and a base arranged on the correcting platform, the left clamping piece and the right clamping piece are oppositely arranged on the base and clamp the reference piece together, and the butting piece is inserted in the base and bears the piece to be adjusted in the reference piece.
Specifically, the base is provided with a through hole, the abutting piece comprises an ejector pin and an installation part arranged on the bottom end face of the base, the ejector pin is formed by extending the installation part to the through hole, and the ejector pin penetrates through the through hole and abuts against the piece to be adjusted on the through hole.
Specifically, the ejector pins are arranged at intervals along the circumferential direction of the through hole, and all the ejector pins commonly abut against the piece to be adjusted.
Specifically, the left clamping piece is provided with a locking piece, the right clamping piece is provided with a locking hole matched with the locking piece, the base is provided with a positioning piece which is of a cylindrical structure, and the locking piece penetrates through the positioning piece and is matched with the locking hole to lock the relative position of the left clamping piece and the right clamping piece.
Preferably, the camera chip calibration machine further comprises a sliding assembly mounted on the frame, the sliding assembly comprises a sliding plate, and a driving device and a driven sliding rail mounted on the frame, the sliding plate is respectively connected to an output end of the driving device and is in sliding fit with the driven sliding rail, the collimator, the displacement sensor and the camera are mounted on the sliding plate, and the sliding plate is driven by the driving device and slides under the guidance of the driven sliding rail, so that the collimator, the displacement sensor and the camera can all move below the detection hole.
Compared with the prior art, the utility model discloses a camera chip inspection machine is through with proofreading manipulator, the collimator, displacement sensor and camera fuse together, and the frame has proofreading platform and has the inspection hole, the tool is installed in the top of inspection hole, the collimator, displacement sensor and camera all can move to the below of inspection hole, during the detection, place the benchmark piece that will detect and wait to adjust the piece in the tool, the collimator switches to the below of inspection hole and detects the plane degree between benchmark piece and the piece that waits to adjust, if the degree of parallelism is unqualified, proofreading manipulator snatchs the piece that waits to adjust on the tool and proofreads the position of waiting to adjust the piece for the benchmark piece, so that the degree of parallelism accords with the standard; the displacement sensor is switched to the position below the detection hole and detects the distance between the reference piece and the piece to be adjusted, and if the distance between the reference piece and the piece to be adjusted is unqualified, the correction manipulator grabs the piece to be adjusted on the jig and corrects the distance between the piece to be adjusted and the reference piece so as to enable the distance between the two pieces to meet the standard; the camera instrument is switched to the position below the detection hole, the position contact degree between the center of the reference piece and the center of the piece to be adjusted is detected, if the contact degree between the centers of the reference piece and the piece to be adjusted is unqualified, the correction manipulator grabs the piece to be adjusted on the jig and enables the center of the piece to be adjusted to coincide with the center of the reference piece by correcting the position of the piece to be adjusted so that the center contact degree meets the standard, and therefore the parallelism, the distance and the center contact degree between the piece to be adjusted and the reference piece meet the standard, and the subsequent assembly accuracy is improved; moreover, the correction manipulator selectively adjusts according to the data of the collimator, the displacement sensor and the camera, and if the test parameters meet the standard, the correction manipulator does not adjust, so that the overall efficiency is improved; the utility model discloses a camera chip inspection machine has highly automated advantage.
Drawings
Fig. 1 is a front view of the camera chip inspection machine of the present invention.
Fig. 2 is a left side view of the camera chip correction machine of the present invention.
Fig. 3 is a front view of the camera chip aligner of fig. 1 after concealing a portion of the frame.
Fig. 4 is a schematic view of the three-dimensional structure of the camera chip calibration machine after the curing device and part of the frame are hidden.
Fig. 5 is the perspective structure schematic diagram of the camera chip correcting machine after hiding the curing device, the glue dispensing device, the correcting manipulator and the partial frame.
Fig. 6 is a schematic view of the three-dimensional structure of the sliding assembly, the collimator, the displacement sensor, the camera and the bottom plate in the camera chip calibration machine of the present invention.
Fig. 7 is a schematic view of the three-dimensional structure of the jig of the camera chip calibration machine of the present invention, which is provided with the reference member and the adjusting member.
Fig. 8 is a schematic perspective view of the jig, the reference member and the member to be adjusted in fig. 7 in an exploded state.
Fig. 9 is a plan view of the camera chip calibration machine of the present invention when the jig is installed with the reference member and the adjustment member.
Fig. 10 is a schematic plan view of the camera chip calibration machine of fig. 9 cut along the line a-a.
Detailed Description
In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.
Referring to fig. 1 to 5 and 7, a camera chip calibration machine 100 of the present invention is used for calibrating an assembly position between a reference component 200 and a component 300 to be adjusted, the camera chip calibration machine 100 includes a frame 1, a calibration manipulator 2, a jig 3, a collimator 4, a displacement sensor 5, a camera 6, a dispensing device 7 and a curing device 8, the calibration manipulator 2, the jig 3, the collimator 4, the displacement sensor 5, the camera 6, the dispensing device 7 and the curing device 8 are all mounted on the frame 1, the frame 1 has a bottom plate 12 and a calibration platform 11 disposed above the bottom plate 12, the bottom plate 12 and the calibration platform 11 are parallel to each other and have a certain mounting distance, the calibration platform 11 has a detection hole 111, the detection hole 111 is located in the middle of the calibration platform 11, the jig 3 is mounted above the detection hole 111, the collimator 4 is used for detecting a flatness between the reference component 200 and the component 300 to be adjusted, the displacement sensor 5 is used for detecting the distance between the reference piece 200 and the piece 300 to be adjusted, the camera 6 is used for detecting the central coincidence degree between the center of the reference piece 200 and the center of the piece 300 to be adjusted, the collimator 4, the displacement sensor 5 and the camera 6 are movably arranged below the detection hole 111, the correction manipulator 2 is positioned above the jig 3, the collimator 4, the displacement sensor 5 and the camera 6 can detect the reference piece 200 and the piece 300 to be adjusted on the jig 3, the correction manipulator 2 can grab the piece 300 to be adjusted on the jig 3 and correct the position of the piece 300 to be adjusted relative to the reference piece 200, during detection, the reference piece 200 and the piece 300 to be adjusted are placed in the jig 3, the collimator 4 is switched to the lower side of the detection hole 111 and detects the flatness between the reference piece 200 and the piece 300 to be adjusted, and if the flatness is not qualified, the correction manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and corrects the piece 300 to be adjusted relative to the reference piece 200 Position to make the parallelism meet the standard; the displacement sensor 5 is switched to the position below the detection hole 111 and detects the distance between the reference piece 200 and the piece 300 to be adjusted, if the distance between the two pieces is unqualified, the correction manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and corrects the distance between the piece 300 to be adjusted and the reference piece 200 so as to enable the distance between the two pieces to meet the standard; the camera 6 is switched to the lower part of the detection hole 111 and detects the position coincidence degree between the center of the reference piece 200 and the center of the piece 300 to be adjusted, if the coincidence degree between the centers is unqualified, the correcting manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and enables the center of the piece 300 to be adjusted to coincide with the center of the reference piece 200 by correcting the position of the piece 300 to be adjusted, so that the center coincidence degree meets the standard, and the parallelism, the spacing and the center coincidence degree between the piece 300 to be adjusted and the reference piece 200 meet the standard, so that the subsequent assembly accuracy is improved, moreover, the correcting manipulator 2 is positioned on the upper side of the jig 3, and the detection devices such as the collimator 4 are positioned on the lower side of the jig 3, so that the arrangement among the devices is more compact, and the processing efficiency can be improved; the dispensing device 7 is movably mounted on the frame 1, the dispensing device 7 moves to the jig 3 to dispense between the reference member 200 and the member to be adjusted 300, and the curing device 8 is used for curing the dispensed adhesive, so that full-automatic production such as position adjustment, dispensing and curing of the member to be adjusted 300 relative to the reference member 200 is realized. In this embodiment, reference part 200 is the protecgulum of camera, treats that adjusting part 300 is the CMOS chip, the utility model discloses a collimater 4 among camera chip correction machine 100 is used for detecting the annular of protecgulum and holds the plane degree between face and the CMOS chip, and displacement sensor 5 is used for detecting the annular of protecgulum and holds the interval between face and the CMOS chip, and camera 6 is used for detecting the center coincidence degree between the center of protecgulum and the center of CMOS chip. More specifically, the following:
referring to fig. 5 and 7, the camera chip corrector 100 further includes a pressing mechanism 10 for pressing the to-be-adjusted piece 300, the pressing mechanism 10 is mounted on the correcting platform 11 and has a pressing piece 101 extending to the jig 3, the pressing piece 101 is liftably disposed on the pressing mechanism 10, the pressing piece 101 presses or releases the to-be-adjusted piece 300 by lifting, and the pressing piece 101 can be lifted by a lifting cylinder, but is not limited thereto. With reference to fig. 4, the calibration manipulator 2 includes a five-axis adjusting mechanism 21 and a Z-axis moving mechanism 22, the Z-axis moving mechanism 22 is mounted on the rack 1, the five-axis adjusting mechanism 21 is mounted at an output end of the Z-axis moving mechanism 22, the five-axis adjusting mechanism 21 is driven by the Z-axis moving mechanism 22 to move along the Z-axis direction of the rack 1, and the five-axis adjusting mechanism 21 can grab the to-be-adjusted piece 300 and make the to-be-adjusted piece 300 move along the Y-axis direction of the rack 1, or rotate along the Z-axis direction of the rack 1, or rotate around the X-axis direction of the rack 1, or rotate around the Y-axis direction of the rack 1, or rotate around the Z-axis direction of the rack 1 (the directions of the X-axis, the Y-axis, and the Z-axis are. For example, the Z-axis moving mechanism 22 is a lifting device, the five-axis adjusting mechanism 21 includes a five-axis adjusting sliding table 211 and an adsorbing head 212 for adsorbing the to-be-adjusted piece 300, the five-axis adjusting sliding table 211 is installed at an output end of the Z-axis moving mechanism 22, and the adsorbing head 212 is installed at the output end of the five-axis adjusting sliding table 211 and connected with an external vacuum-pumping device, so that the to-be-adjusted piece 300 is grabbed by adsorption.
Referring to fig. 7 to 10, the jig 3 includes a left clamping member 31, a right clamping member 32, a propping member 33 and a base 34, the base 34 is mounted on the calibration platform 11 by a snap-fit manner, but not limited thereto, the left clamping member 31 and the right clamping member 32 are oppositely disposed on the base 34 and clamp the reference member 200 together, so as to fix the reference member 200 on the base 34, the propping member 33 is inserted into the base 34 and bears the member 300 to be adjusted in the reference member 200, and the member 300 to be adjusted is located in the reference member 200 and can perform a slight position adjustment with respect to the reference member 200. Specifically, the base 34 has a through hole 341, the abutting element 33 includes an ejector pin 332 and a mounting portion 331 disposed at a bottom end surface of the base 34, the mounting portion 331 is a mounting iron sheet disposed transversely, the ejector pin 332 is formed by extending the mounting portion 331 to the through hole 341, and the ejector pin 332 penetrates through the through hole 341 and abuts against the to-be-adjusted element 300 on the through hole 341. Preferably, the thimbles 332 are arranged at intervals along the circumferential direction of the through hole 341, and all the thimbles 332 commonly prop against the to-be-adjusted piece 300, so that the propping piece 33 supports the to-be-adjusted piece.
Referring to fig. 7 to 10, the left clamping member 31 has a locking member 311, the right clamping member 32 has a locking hole 321 matching with the locking member 311, the base 34 has a positioning member 342 having a cylindrical structure, the locking member 311 passes through the positioning member 342 and matches with the locking hole 321 to lock the relative position of the left clamping member 31 and the right clamping member 32, thereby achieving the fixing of the reference member 200, preferably, the locking member 311, the locking hole 321 and the positioning member 342 are arranged in two and symmetrical arrangements, and the locking member 311, the locking hole 321 and the positioning member 342 have a screw locking structure. The right clamping member 32 is provided with an upper positioning hole 322, the base 34 is provided with a lower positioning hole 343, the lower positioning hole 343 is positioned below the upper positioning hole 322, the lower positioning hole 343 is aligned with the upper positioning hole 322, and the upper positioning hole 322 and the lower positioning hole 343 are positioned by a positioning column (not shown), so that the right clamping member 32 can be installed on the base 34 firstly during installation, and then the left clamping member 31 is matched with the right clamping member 32, so that the assembly is convenient and the assembly accuracy is improved.
Referring to fig. 5 to 6, the camera chip calibration machine 100 further includes a sliding assembly 9 mounted on the frame 1, the sliding assembly 9 includes a sliding plate 91, a driving device 92 and a driven sliding rail 93, the driving device 92 and the driven sliding rail 93 are mounted on the frame 1, the sliding plate 91 is respectively connected to the output end of the driving device 92 and is in sliding fit with the driven sliding rail 93, the bottom of one side of the sliding plate 91 is mounted on the output end of the driving device 92, the bottom of the other side of the sliding plate 91 is in sliding fit with the driven sliding rail 93, the collimator 4, the displacement sensor 5 and the camera 6 are mounted on the sliding plate 91, the sliding plate 91 is driven by the driving device 92 and slides under the guide of the driven sliding rail 93, so that the collimator 4, the displacement sensor 5 and the camera 6 can all move below the detection hole 111, the sliding assembly 9 is configured to enable the collimator 4, the displacement sensor 5 and the camera 6 to move below the detection hole 111 as required, thereby achieving detection. Preferably, the sliding plate 91 has a light hole, and the camera 6 is disposed on the sliding plate 91 in an inverted manner and detects the reference member 200 and the member to be adjusted 300 on the jig 3 through the light hole.
Referring to fig. 1 to 10, the operation principle of the camera chip calibration machine 100 of the present invention is further described as follows:
during preparation, a reference piece 200 to be detected and a piece 300 to be adjusted are placed on the base 34 of the jig 3, the locking piece 311 penetrates through the positioning piece 342 and is matched with the locking hole 321 to lock the relative positions of the left clamping piece 31 and the right clamping piece 32, so that the reference piece 200 is fixed, the piece 300 to be adjusted (namely, a CMOS chip) is borne on the thimble 332 and is positioned in the reference piece 200 (namely, a front cover), and the pressing piece 101 of the pressing mechanism 10 presses the piece 300 to be adjusted;
during detection, the collimator 4 is switched to the position below the detection hole 111 and detects the flatness between the reference piece 200 and the piece 300 to be adjusted, if the parallelism is unqualified, the pressing piece 101 of the pressing mechanism 10 is loosened, the correction manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and corrects the position of the piece 300 to be adjusted relative to the reference piece 200, so that the parallelism meets the standard; the pressing piece 101 of the pressing mechanism 10 presses the piece 300 to be adjusted again, the displacement sensor 5 is switched to the position below the detection hole 111 and detects the distance between the reference piece 200 and the piece 300 to be adjusted, if the distance between the two pieces is unqualified, the pressing piece 101 of the pressing mechanism 10 is loosened, the correction manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and corrects the distance between the piece 300 to be adjusted and the reference piece 200 so as to enable the distance between the two pieces to meet the standard; the pressing piece 101 of the pressing mechanism 10 presses the piece 300 to be adjusted again, the camera 6 is switched to the position below the detection hole 111 and detects the position coincidence degree between the center of the reference piece 200 and the center of the piece 300 to be adjusted, if the coincidence degree between the centers of the two is not qualified, the correcting manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and enables the center of the piece 300 to be adjusted to coincide with the center of the reference piece 200 by correcting the position of the piece 300 to be adjusted so that the center coincidence degree meets the standard, and the pressing piece 101 of the pressing mechanism 10 presses the piece 300 to be adjusted again so that the parallelism, the distance and the center coincidence degree between the piece 300 to be adjusted and the reference piece 200 meet the standard; the dispensing device 7 is movably mounted on the frame 1, the dispensing device 7 moves to the jig 3 to dispense between the reference member 200 and the member 300 to be adjusted, and the curing device 8 cures the dispensing process by blowing air.
The correcting manipulator 2, the collimator 4, the displacement sensor 5 and the camera 6 are fused together, the rack 1 is provided with a correcting platform 11, the correcting platform 11 is provided with a detection hole 111, the jig 3 is installed above the detection hole 111, the collimator 4, the displacement sensor 5 and the camera 6 can move to the position below the detection hole 111, during detection, a reference piece 200 to be detected and a piece 300 to be adjusted are placed in the jig 3, the collimator 4 is switched to the position below the detection hole 111, the flatness between the reference piece 200 and the piece 300 to be adjusted is detected, if the parallelism is unqualified, the correcting manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and corrects the position of the piece 300 to be adjusted relative to the reference piece 200, so that the parallelism meets the standard; the displacement sensor 5 is switched to the position below the detection hole 111 and detects the distance between the reference piece 200 and the piece 300 to be adjusted, if the distance between the two pieces is unqualified, the correction manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and corrects the distance between the piece 300 to be adjusted and the reference piece 200 so as to enable the distance between the two pieces to meet the standard; the camera 6 is switched to the position below the detection hole 111 and detects the position contact ratio between the center of the reference piece 200 and the center of the piece 300 to be adjusted, if the contact ratio between the centers of the reference piece 200 and the piece 300 to be adjusted is unqualified, the correction manipulator 2 grabs the piece 300 to be adjusted on the jig 3 and enables the center of the piece 300 to be adjusted to coincide with the center of the reference piece 200 by correcting the position of the piece 300 to be adjusted, so that the center contact ratio meets the standard, and the parallelism, the distance and the center contact ratio between the piece 300 to be adjusted and the reference piece 200 meet the standard, thereby improving the subsequent assembly accuracy; moreover, the correction manipulator 2 selectively adjusts according to the data of the collimator 4, the displacement sensor 5 and the camera 6, and if the test parameters meet the standard, the correction manipulator 2 does not adjust, so that the overall efficiency is improved; the utility model discloses a camera chip inspection machine 100 has the advantage of high automation.
It should be noted that the collimator 4, the displacement sensor 5, the camera 6, the dispensing device 7 and the curing device 8 are well known to those skilled in the art, and are not limited thereto.
The above disclosure is only a preferred embodiment of the present invention, and the scope of the claims of the present invention should not be limited thereby, and all the equivalent changes made in the claims of the present invention are intended to be covered by the present invention.
Claims (10)
1. A camera chip corrector is used for correcting the assembly position between a reference part and a part to be adjusted, it is characterized by comprising a frame, a correcting manipulator, a jig, a collimator for detecting parallelism, a displacement sensor for detecting spacing and a camera for detecting the central contact ratio, wherein the correcting manipulator is arranged on the frame, the frame is provided with a correction platform which is provided with a detection hole, the jig is arranged above the detection hole, the collimator, the displacement sensor and the camera are movably arranged below the detection hole, the correcting manipulator is positioned above the jig, the collimator, the displacement sensor and the camera can detect the piece to be adjusted, the correcting manipulator can grab the to-be-adjusted piece on the jig and correct the position of the to-be-adjusted piece relative to the reference piece.
2. The camera chip correcting machine of claim 1, further comprising a dispensing device for dispensing between the reference member and the member to be adjusted, wherein the dispensing device is movably mounted to the frame.
3. The camera chip correction machine according to claim 2, further comprising a curing device for curing the dispensed glue, the curing device being mounted to the frame.
4. The camera chip correcting machine according to claim 1, wherein the correcting robot comprises a five-axis adjusting mechanism and a Z-axis moving mechanism mounted on the frame, the five-axis adjusting mechanism is mounted at an output end of the Z-axis moving mechanism, the five-axis adjusting mechanism is driven by the Z-axis moving mechanism to move along the Z-axis direction of the frame, and the five-axis adjusting mechanism can grab the to-be-adjusted piece and make the to-be-adjusted piece move along the Y-axis direction of the frame, or along the Z-axis direction of the frame, or rotate around the X-axis direction of the frame, or rotate around the Y-axis direction of the frame, or rotate around the Z-axis direction of the frame.
5. The camera chip calibration machine according to claim 1, further comprising a pressing mechanism for pressing the to-be-calibrated member, wherein the pressing mechanism is mounted on the calibration platform and has a pressing member extending to the jig, and the pressing member presses or releases the to-be-calibrated member.
6. The camera chip correcting machine of claim 1, wherein the jig comprises a left clamping member, a right clamping member, a butting member and a base installed on the correcting platform, the left clamping member and the right clamping member are oppositely arranged on the base and clamp the reference member together, and the butting member is inserted into the base and bears the member to be adjusted in the reference member.
7. The camera chip calibration machine according to claim 6, wherein the base has a through hole, the abutting member includes an ejector pin and a mounting portion disposed at a bottom end surface of the base, the ejector pin is formed by extending the mounting portion to the through hole, and the ejector pin penetrates through the through hole and abuts against the member to be adjusted on the through hole.
8. The camera chip correction machine according to claim 7, wherein the ejector pins are arranged at intervals along a circumferential direction of the through hole, and all the ejector pins collectively abut against the member to be adjusted.
9. The camera chip calibration machine according to claim 6, wherein the left clamping member has a locking member thereon, the right clamping member has a locking hole engaged with the locking member, the base has a positioning member in a cylindrical structure thereon, and the locking member passes through the positioning member and engages with the locking hole to lock the relative position of the left clamping member and the right clamping member.
10. The camera chip calibration machine according to claim 1, further comprising a sliding assembly mounted to the frame, wherein the sliding assembly comprises a sliding plate, and a driving device and a driven slide rail mounted to the frame, the sliding plates are respectively connected to the output ends of the driving device and slidably engaged with the driven slide rail, the collimator, the displacement sensor and the camera are mounted to the sliding plate, and the sliding plate is driven by the driving device and guided by the driven slide rail to slide, so that the collimator, the displacement sensor and the camera can all move below the detection hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920947443.XU CN210075451U (en) | 2019-06-20 | 2019-06-20 | Camera chip inspection machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920947443.XU CN210075451U (en) | 2019-06-20 | 2019-06-20 | Camera chip inspection machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210075451U true CN210075451U (en) | 2020-02-14 |
Family
ID=69428303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920947443.XU Withdrawn - After Issue CN210075451U (en) | 2019-06-20 | 2019-06-20 | Camera chip inspection machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210075451U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110213574A (en) * | 2019-06-20 | 2019-09-06 | 东莞市沃德精密机械有限公司 | Camera chip corrects machine |
-
2019
- 2019-06-20 CN CN201920947443.XU patent/CN210075451U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110213574A (en) * | 2019-06-20 | 2019-09-06 | 东莞市沃德精密机械有限公司 | Camera chip corrects machine |
| CN110213574B (en) * | 2019-06-20 | 2024-07-16 | 广东沃德精密科技股份有限公司 | Camera chip correction machine |
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