CN209897534U - cooling module - Google Patents

Abstract

A heat dissipation module is applied by matching with a fluid, wherein the fluid vertically flows to the heat dissipation module from the upper part of the heat dissipation module. The heat dissipation module comprises a base, a first fin group and a flow guide piece. The base is provided with a surface, and the first fin group is arranged on the base and provided with a plurality of fins. The flow guide piece is provided with a first guide surface, and an obtuse angle is formed between the first guide surface and the surface, wherein part of fluid vertically flowing in from the upper part of the heat dissipation module flows into the space between two adjacent fins through the guide of the first guide surface. The flow guide piece can effectively guide the fluid between the fins, so that the heat dissipation efficiency of the heat dissipation module is improved.

Description

cooling module

technical field

The utility model relates to a device, in particular to a heat dissipation module.

Background technique

Common heat dissipation modules can be divided into liquid cooling or air cooling, both of which flow through the fins of the heat dissipation module to improve the heat dissipation effect of the heat dissipation module.

FIG. 1 is a schematic diagram of a known heat dissipation module. Referring to FIG. 1 , the fluid enters the heat dissipation module 10 in a direction perpendicular to the fins 12 , and when the fluid enters, it will cause the fluid to collide with the fins 12 and rebound, so that the fluid cannot enter the two adjacent fins as expected. 12, so the heat dissipation effect cannot be effectively improved, but only the internal energy loss of water pressure.

Utility model content

The utility model provides a heat dissipation module with good heat dissipation efficiency.

The radiating module of the utility model is used in combination with a fluid, wherein the fluid flows vertically from the upper part of the radiating module to the radiating module. The heat dissipation module includes a base, a first set of fins and a flow guide. The base has a surface, and the first fin group is arranged on the base and has a plurality of fins. The flow guide has a first guide surface, and the first guide surface forms an obtuse angle with the surface, wherein the part of the fluid flowing vertically from the top of the heat dissipation module flows into the two adjacent ones through the guide of the first guide surface. between the fins.

In an embodiment of the present invention, the heat dissipation module further includes a second set of fins disposed on the base. The second fin group also has a plurality of fins, and the flow guide has a second guide surface opposite to the first guide surface, wherein another part of the fluid flows into the second fins through the guidance of the second guide surface between two adjacent fins of the plate group.

In an embodiment of the present invention, the shape of the aforesaid air guide is tapered, and the fins are arranged radially around the air guide.

In an embodiment of the present invention, the above-mentioned first guide surface is a plane or a curved surface.

In an embodiment of the present invention, the height of the above-mentioned air guide member on the surface is greater than the height of the fin on the surface.

In an embodiment of the present invention, the height of the above-mentioned air guide element on the surface is equal to the height of the fin on the surface.

In an embodiment of the present invention, the height of the above-mentioned deflector on the surface is smaller than the height of the fin on the surface.

Based on the above, by arranging the air guide in the heat dissipation module, the fluid flowing from the upper part of the heat dissipation module to the heat dissipation module can be guided by the air guide to between the fins of the fin group, thereby effectively improving the heat dissipation efficiency of the heat dissipation module.

In order to make the above-mentioned features and advantages of the present utility model more obvious and easy to understand, the following specific embodiments are given and described in detail in conjunction with the accompanying drawings in the description as follows.

Description of drawings

FIG. 1 is a schematic diagram of a known heat dissipation module.

FIG. 2 is a schematic diagram of a heat dissipation module according to an embodiment of the present invention.

FIG. 3 is a schematic diagram showing that the guide surface is a curved surface.

FIG. 4 is a cross-sectional view of a heat dissipation module according to another embodiment.

5A to 5C are schematic diagrams of a flow guide and a fin.

FIG. 6 is a schematic diagram of a heat dissipation module according to another embodiment of the present invention.

The reference numbers are as follows:

10, 100, 200: cooling module

12, 122, 132, 222: Fins

110: Base

112: Surface

120: The first fin group

130: Second fin group

140, 140a, 140', 140", 240: flow guide

142, 142': the first guide surface

144, 144': the second guide surface

242: Guide Surface

θ: obtuse angle

X, Y, Z: direction

Detailed ways

The heat dissipation module of the present invention is used in combination with a fluid, and the fluid can be gas or liquid, wherein the fluid flows vertically from the top of the heat dissipation module to the heat dissipation module. However, in the heat dissipation module of the present invention, through the use of the air guide, part of the fluid that flows vertically from the top of the heat dissipation module is guided by the guide surface of the air guide and accurately flows between the two adjacent fins. Effectively improve the cooling efficiency of the cooling module.

Various embodiments of the heat dissipation module will be described in detail below.

FIG. 2 is a schematic diagram of a heat dissipation module according to an embodiment of the present invention. Please refer to FIG. 2 , the cooling module 100 of the present embodiment is described by taking a water-cooling head as an example, and the water-cooling head can be used, for example, but not limited to, for cooling a display card or a motherboard in a computer. The heat dissipation module 100 is placed on a heat source (not shown), and includes a base 110 , a first fin group 120 , a second fin group 130 and a flow guide 140 . The base 110 has a surface 112, and the first fin set 120 and the second fin set 130 are disposed on the base 110, and the first fin set 120 and the second fin set 130 respectively have a plurality of fins 122, 132 , wherein the fins 122 and 132 are arranged in a manner extending along the X direction, and are arranged in rows in the Y direction at intervals.

The deflector 140 of the present embodiment is substantially in the shape of a triangular column, and is located between the first fin group 120 and the second fin group 130 , wherein the length direction of the deflector 140 is parallel to the Y direction. In this embodiment, the air guide 140 has a first guide surface 142 and a second guide surface 144 that are opposite and adjacent to each other, wherein the first guide surface 142 faces the first fin set 120 and the second guide surface 142 The guide surface 144 faces the second fin group 130 , and the first guide surface 142 and the second guide surface 144 respectively form an obtuse angle θ with the surface 112 . In other embodiments, the first guide surface 142 and a second guide surface 144 that are opposite to each other may not be adjacent to each other, and the guide member 140 is substantially in the shape of a trapezoidal column.

The deflector 140 , the first fin group 120 and the second fin group 130 in this embodiment may be independent components, and may be assembled on the surface 112 of the base 110 by CNC machining, sticking, welding or other suitable methods on, but not limited to. Those skilled in the art may also simultaneously manufacture the base 110, the air guide 140, the first fin group 120 and the second fin group 130 on the same piece of material by other processing methods; The fin group 120 , the second fin group 130 and the base 110 are structurally integral components. Preferably, the integrally formed base 110 , the air guide 140 , the first fin group 120 and the second fin group 130 are compared with the air guide 140 , the first fin group 120 and the second fin group 140 which are independent components. The assembly of the fin group 130 to the base 110 can further prevent fluid leakage from the assembly.

When the fluid (liquid in this embodiment) flows vertically from the top of the heat dissipation module 100 to the heat dissipation module 100 along the Z direction, the fluid will rush to the first fin group 120, the air guide 140 and the second fin group 130, Part of the fluid flows between any two adjacent fins 122 in the first fin group 120 through the guidance of the first guide surface 142 , and part of the fluid flows into the first fin group 120 through the guidance of the second guide surface 144 . Between any two adjacent fins 132 in the two fin groups 130 . As the fluid is effectively guided by the flow guide 140 to flow between the fins 122 and 132 , the fluid can exchange heat with the fins 122 and 132 , so that the heat on the fins 122 and 132 is absorbed The fluid is carried away, thereby increasing the overall performance of the heat dissipation module 100 . In addition, since the air guide 140 extends upward from the surface 112 of the base 110 , the heat conduction path of the heat source attached to the base 110 is increased, the heat conduction efficiency is improved, and the heat dissipation effect is improved.

Incidentally, the aforementioned first guide surface 142 and the second guide surface 144 can be flat, and in another embodiment, the first guide surface 142 ′ and the second guide surface 144 ′ can also be Curved surface, as shown in FIG. 3 , wherein FIG. 3 is a schematic diagram of the guide surface being a curved surface. Of course, it is also possible that one of the first guiding surface 142 and the second guiding surface 144 is a plane, and the other of the first guiding surface 142 and the second guiding surface 144 is a curved surface, which can be determined according to actual needs. And choose.

In particular, when the first guide surface 142 and/or the second guide surface 144 are curved surfaces, the angle of the connection between the first guide surface 142 , the second guide surface 144 and the surface 112 of the base 110 It is smoother than when the first guide surface 142 and the second guide surface 144 are flat, which can reduce the sudden change of the slope between the first guide surface 142 and/or the second guide surface 144 and the surface 112 . The probability of turbulent flow is generated, so the fluid can flow more smoothly along the curved first guide surface 142 and/or the second guide surface 144 to the surface 112, so that the fluid can flow into the fins 122 and 112 more smoothly. /or between the fins 132 .

In addition, the air guide 140 may be adjacent to the first fin group 120 and the second fin group 130, as shown in FIG. 2; or, as shown in FIG. 4, which is another embodiment of the heat dissipation Sectional view of the module. The portion of the air guide 140a may also be a portion overlapping with the fins 122 and 132 of the first fin group 120 and the second fin group 130 . In other words, the edge of the air guide 140a protrudes into the space between two adjacent fins 122 or two adjacent fins 132 . In some embodiments, the fins 122 and 132 of the first fin group 120 and the second fin group 130 may be connected to each other correspondingly.

5A to 5C are schematic diagrams of a flow guide and a fin. In the present invention, the height of the air guide 140 on the surface 112 can be greater than the height of the fins 122 and 132 on the surface 112 (as shown in FIG. 5A ), and the height of the air guide 140 ′ on the surface 112 can be equal to the height of the fins 122 and 132 on the surface 112 (as shown in FIG. 5B ), or the height of the deflector 140 ″ on the surface 112 is smaller than the height of the fins 122 and 132 on the surface 112 ( As shown in FIG. 5C ), the higher air guide 140 has a farther heat conduction path, which can improve the heat conduction effect. Those skilled in the art can change the guide according to the configuration requirements of other components in the electronic device provided with the heat dissipation module 100 The height of the flow element 140 above the surface 112 .

FIG. 6 is a schematic diagram of a heat dissipation module according to another embodiment of the present invention. Referring to FIG. 6 , in the heat dissipation module 200 of the present embodiment, the shape of the air guide 240 is tapered, and the fins 222 are arranged radially around the air guide 240 .

The conical air guide 240 is arranged in the fins 222 , when the fluid flows vertically from the top of the heat dissipation module 200 to the heat dissipation module 200 along the Z direction, the fluid can follow the air guide 240 after contacting the air guide 240 . The guiding surface 242 of the guide surface 242 flows into between the fins 222 along the radial direction of the air guide 240 , so that the fluid can exchange heat with the fins 222 .

The description of the present invention is not intended to limit the shapes, arrangement density and spacing of the fins 122 , fins 132 and 222 in the foregoing embodiments, and those of ordinary skill in the art can do so without violating the present invention. Under the new spirit, it can be adaptively changed according to actual needs.

The aforementioned heat dissipation modules 100 and 200 can also be used in combination with other heat dissipation components, such as heat pipes.

To sum up, in the heat dissipation module of the present invention, the fluid flowing from the top of the heat dissipation module to the heat dissipation module can be guided by the air guide to between the fins of the fin group and the fins through the arrangement of the air guide member. Therefore, the heat dissipation efficiency of the heat dissipation module can be effectively improved.

Furthermore, compared with the conventional heat dissipation module, when the fluid flows vertically from the top of the heat dissipation module to the heat dissipation module, the fluid will bounce off when hitting the fins. The heat dissipation module of the present invention is provided with guide fins, which can effectively Directly guide the flow direction of the fluid, reducing the internal energy consumption due to the generation of water pressure.

Although the present utility model has been disclosed above with examples, it is not intended to limit the present utility model. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present utility model. Therefore, the present utility model The scope of protection shall be defined by the appended claims.

Claims (7)

1. A heat dissipation module, used in combination with a fluid, the fluid flows vertically to the heat dissipation module from above the heat dissipation module, wherein the heat dissipation module comprises: a base having a surface; a first set of fins, disposed on the base, and having a plurality of fins; and A flow guide has a first guide surface, the first guide surface and the surface form an obtuse angle, wherein the part of the fluid flowing vertically from above the heat dissipation module is guided through the first guide surface and flow into between two adjacent plurality of the fins. 2 . The heat dissipation module of claim 1 , further comprising a second fin set, disposed on the base, and having a plurality of fins, and the air guide member has a connection with the first guide. 3 . A second guide surface opposite to each other, wherein another part of the fluid flows between two adjacent fins of the second fin group through the guidance of the second guide surface. 3 . The heat dissipation module of claim 1 , wherein the shape of the air guide is a cone, and the plurality of fins are arranged radially around the air guide. 4 . 4 . The heat dissipation module of claim 1 , wherein the first guide surface is a plane or a curved surface. 5 . 5 . The heat dissipation module of claim 1 , wherein the height of the air guide member on the surface is greater than the height of the plurality of fins on the surface. 6 . 6 . The heat dissipation module of claim 1 , wherein the height of the air guide member on the surface is equal to the height of the plurality of fins on the surface. 7 . 7 . The heat dissipation module of claim 1 , wherein the height of the air guide member on the surface is smaller than the height of the plurality of fins on the surface. 8 .

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