CN221427092U - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. The inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe is at a predetermined angle relative to the horizontal plane.

Description

Heat dissipation device

Technical Field

The invention relates to a heat dissipation device, and in particular to a heat dissipation device with an inclined heat pipe.

Background technique

With the advancement of technology, electronic products are becoming more and more popular, and gradually changing the way many people live or work. As computer computing power increases, the temperature control of electronic components such as CPUs and graphics chips becomes more and more important.

Electronic components such as CPUs and graphics chips generate heat when they are running and require proper cooling to achieve optimal performance. In order to keep electronic components such as CPUs and graphics chips running at an ideal temperature, the appropriate heat sink configuration will affect the performance of the electronic device.

In addition, as the size of current electronic devices is getting smaller and smaller, and the number of cores of their computing chips is increasing, the heat generated is also increasing. In a small space, not only computing chips and heat dissipation devices are installed, but also other mechanisms and electronic components are installed at the same time.

Therefore, how to balance the utilization of space and improve the heat dissipation efficiency to reduce the operating temperature of the computing chip will help improve the overall working efficiency of the electronic device.

Utility Model Content

The new content is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This new content is not a complete overview of the present disclosure, and its intention is not to point out the important/critical elements of the present embodiment or to define the scope of the present invention.

An object of the present invention is to provide a heat dissipation device that can improve the heat dissipation efficiency of the heat dissipation device, thereby improving the overall working efficiency of the electronic device.

To achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a heat dissipation device is provided, which includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. The inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion, so that the inclined heat dissipation area of the inclined heat pipe is at a predetermined angle relative to the horizontal plane.

In some embodiments, each inclined heat dissipation fin further includes a first heat dissipation portion connected to the lower side of the inclined heat dissipation portion for horizontally fixing on a substrate.

In some embodiments, each inclined heat dissipation fin further includes an extended heat dissipation portion connected to an upper portion of the first heat dissipation portion and connected to a side edge of the inclined heat dissipation portion.

In some embodiments, the inclined heat pipe further includes a heat absorbing region horizontally attached to a heat source.

In some embodiments, each inclined heat dissipation fin further includes an extended air inlet located above the first heat dissipation portion to guide heat dissipation air into the inclined heat dissipation fin.

In some embodiments, each inclined heat dissipation fin further includes an air guide protrusion to guide the heat dissipation air toward the inclined heat dissipation portion.

In some embodiments, each inclined heat dissipation fin further includes an air guide opening, and the air guide protrusion protrudes from the air guide opening to guide the heat dissipation air to pass through the air guide opening.

In some embodiments, the air guiding openings and the air guiding protrusions are rectangular, triangular or polygonal.

In some embodiments, each inclined heat dissipation fin further includes an air guide opening to allow heat dissipation air to pass through the inclined heat dissipation fin.

In some embodiments, the first heat dissipation portion of each inclined heat dissipation fin further includes a lower inclined portion, so that a lower portion of a portion of the first heat dissipation portion forms an angle with a horizontal plane.

In some embodiments, the first heat dissipation portion of each inclined heat dissipation fin further includes an air guide flange protruding from the lower inclined portion to guide the heat dissipation air.

In some embodiments, the inclined heat dissipation portion of each inclined heat dissipation fin includes an air guide flange to increase the contact area with the inclined heat dissipation area of the inclined heat pipe and guide the heat dissipation air.

In some embodiments, the extended heat dissipation portion of each inclined heat dissipation fin includes an L-shaped air guide flange connected to the air guide flange of the inclined heat dissipation portion.

In some embodiments, the heat dissipation device further includes a fan located on one side of the inclined heat dissipation fins to drive heat dissipation air to blow toward the inclined heat dissipation fins and the inclined heat dissipation area of the inclined heat pipes.

In some embodiments, the inclined heat dissipation area of the inclined heat pipe is at a predetermined angle of 5 degrees to 45 degrees relative to the horizontal plane.

Therefore, the aforementioned heat dissipation device effectively increases the air flow into the heat dissipation fins, and at the same time effectively increases the outlet width of the heat dissipation fins, reduces the bottleneck of heat dissipation air flow, thereby increasing heat dissipation efficiency, improving heat dissipation quality, and further increasing the overall performance of the electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

FIG. 1 is a schematic side view of a heat dissipation device according to an embodiment of the present invention.

FIG. 2 is a schematic side view of a heat dissipation device according to another embodiment of the present invention.

FIG. 3 is a schematic side view of a heat dissipation device according to another embodiment of the present invention.

FIG. 4 is a perspective schematic diagram of a heat dissipation fin of a heat dissipation device according to yet another embodiment of the present invention.

FIG. 5 is a schematic three-dimensional diagram of a heat dissipation device according to yet another embodiment of the present invention.

The reference numerals are described as follows:

100: Heat dissipation device

101: Air Inlet

102: Air outlet

103: Extended air inlet

104: Width of air outlet of the first heat dissipation unit

105: Inclined heat dissipation unit air outlet width

200: Tilted cooling fins

210: First heat dissipation unit

212: First side

214: Second side

216: Third side

218: The fourth side

220: Inclined heat dissipation unit

222: First side

224: Second side

226: Third side

230: Extended heat dissipation unit

232: First side

234: Second side

236: Third side

238: The fourth side

300: Tilted cooling fins

310: First heat dissipation unit

312: First side

314: Second side

316: Third side

318: The fourth side

320: Inclined heat dissipation unit

322: First side

324: Second side

326: Third side

330: Extended heat dissipation unit

332: First side

334: Second side

336: The third side

338: The fourth side

340: Wind guide bulge

341: Air guide opening

400: Tilted cooling fins

410: First heat dissipation unit

412: First side

414: Second side

416: Third side

418: The fourth side

419: Lower inclined part

420: Inclined heat dissipation unit

422: First side

424: Second side

426: Third side

430: Extended heat dissipation unit

432: First side

434: Second side

436: The third side

438: The fourth side

500: Tilted cooling fins

510: First heat dissipation unit

511: Wind guide flange

512: First side

514: Second side

516: Third side

517: Wind guide flange

518: The fourth side

519: Lower inclined part

520: Inclined heat dissipation unit

522: First side

524: Second side

525: Wind guide flange

526: Third side

530: Extended heat dissipation unit

532: First side

533: Wind guide flange

534: Second side

535: Wind guide flange

536: Third side

538: The fourth side

540: Wind guide bulge

541: Air guide opening

800: Inclined heat pipe

810: Heat absorption area

820: Inclined cooling area

900: Fan

Detailed ways

The following is a detailed description of the embodiments with the accompanying drawings, but the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structural operation is not intended to limit the order of its execution. Any device with equal functions produced by the re-combination of components is within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only and are not drawn in original size. For ease of understanding, the same or similar components in the following description will be indicated by the same symbols.

In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise noted. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the present disclosure.

In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to one or more. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and embodiment.

Secondly, the words "include", "including", "have", "contain" and the like used in this article are all open terms, which mean including but not limited to.

1 to 3 are schematic side views of heat dissipation devices according to various embodiments of the present invention, FIG. 4 is a schematic three-dimensional view of heat dissipation fins of the heat dissipation device, and FIG. 5 is a schematic three-dimensional view of the heat dissipation device.

First, refer to FIG. 1 . As shown in the figure, the heat dissipation device 100 includes an inclined heat pipe 800 and a plurality of inclined heat dissipation fins 200 . At the same time, refer to FIG. 5 . The inclined heat pipe 800 includes a heat absorption area 810 and an inclined heat dissipation area 820 . The inclined heat dissipation fin 200 includes a first heat dissipation portion 210 and an inclined heat dissipation portion 220 . Among them, the first heat dissipation portion 210 is connected to the bottom of the inclined heat dissipation portion 220 for horizontal fixation on a substrate. The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the hypotenuse of the inclined heat dissipation portion 220 so that the inclined heat dissipation area 820 of the inclined heat pipe 800 is at a predetermined angle relative to the horizontal plane. In some embodiments, the heat absorption area 810 of the inclined heat pipe 800 is used to horizontally fit on a heat source, and the inclined heat dissipation area 820 of the inclined heat pipe 800 is rotated by a predetermined angle relative to the heat absorption area 810 of the inclined heat pipe 800 to be installed on the inclined heat dissipation portion 220 of the inclined heat dissipation fin 200 .

In some embodiments, the first heat dissipation portion 210 includes a first side 212, a second side 214, a third side 216, and a fourth side 218, and is approximately rectangular. The inclined heat dissipation portion 220 includes a first side 222, a second side 224, and a third side 226, and is approximately triangular. The first side 222 of the inclined heat dissipation portion 220 is connected to a portion of the third side 216 of the first heat dissipation portion 210, and is preferably integrally formed with a portion of the third side 216 of the first heat dissipation portion 210. The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the third side 226 of the inclined heat dissipation portion 220, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 forms a predetermined angle with the first side 222 of the inclined heat dissipation portion 220 and/or the first side 212 of the first heat dissipation portion 210, which is about 5 to 45 degrees, preferably about 10 to 40 degrees. However, the present invention is not limited to this. The inclination of the inclined heat dissipation area 820 of the inclined heat pipe 800 and the third side 226 of the inclined heat dissipation portion 220 can be designed according to actual needs and heat dissipation efficiency to improve the actual heat dissipation efficiency of the heat dissipation device 100, which does not deviate from the spirit and protection scope of the present invention.

In some embodiments, the first side edge 222 of the inclined heat dissipation portion 220 and the first side edge 212 of the first heat dissipation portion 210 are preferably disposed parallel to the substrate.

In some embodiments, the inclined heat dissipation fin 200 may further include an extended heat dissipation portion 230 connected to the top of the first heat dissipation portion 210 and connected to a side of the inclined heat dissipation portion 220. For example, the extended heat dissipation portion 230 includes a first side 232, a second side 234, a third side 236 and a fourth side 238, and is approximately rectangular. The second side 224 of the inclined heat dissipation portion 220 is connected to a portion of the second side 234 of the extended heat dissipation portion 230, and is preferably integrally formed with a portion of the second side 234 of the extended heat dissipation portion 230 to form the desired inclined heat dissipation fin 200.

It is worth noting that the heat dissipation device 100 further includes a fan 900, which is located at the second side 214 of the first heat dissipation portion 210, that is, located on the left side of the inclined heat dissipation fins 200 in the figure, to drive the heat dissipation air to blow toward the inclined heat dissipation fins 200 and the inclined heat dissipation area 820 of the inclined heat pipe 800. The heat dissipation air driven by the fan 900 can enter the inclined heat dissipation fins 200 through the air inlet 101, and then pass through the first heat dissipation portion 210, the inclined heat dissipation portion 220 and the extended heat dissipation portion 230 to reach the air outlet 102. Among them, the inclined heat dissipation portion 220 forms a gradually expanding air outlet width, see the inclined heat dissipation portion air outlet width 105, which can effectively cooperate with the first heat dissipation portion air outlet width 104 of the first heat dissipation portion 210 to increase the air outlet width, avoid the air outlet bottleneck, and thus improve the overall heat dissipation efficiency of the heat dissipation device 100.

Referring to FIG. 2 , as shown in the figure, the heat dissipation device 100 includes an inclined heat pipe 800 and a plurality of inclined heat dissipation fins 300. The inclined heat dissipation fins 300 include a first heat dissipation portion 310 and an inclined heat dissipation portion 320. The first heat dissipation portion 310 is connected to the bottom of the inclined heat dissipation portion 320 and is horizontally fixed on a substrate. The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the inclined side of the inclined heat dissipation portion 320, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 is at a predetermined angle relative to the horizontal plane.

In some embodiments, the first heat dissipation portion 310 includes a first side 312, a second side 314, a third side 316, and a fourth side 318, and is approximately rectangular. The inclined heat dissipation portion 320 includes a first side 322, a second side 324, and a third side 326, and is approximately triangular. The first side 322 of the inclined heat dissipation portion 320 is connected to a portion of the third side 316 of the first heat dissipation portion 310, and is preferably integrally formed with a portion of the third side 316 of the first heat dissipation portion 310. The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the third side 326 of the inclined heat dissipation portion 320, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 forms a predetermined angle with the first side 322 of the inclined heat dissipation portion 320 and/or the first side 312 of the first heat dissipation portion 310, which is about 5 to 45 degrees, preferably about 10 to 40 degrees. However, the present invention is not limited to this. The inclination of the inclined heat dissipation area 820 of the inclined heat pipe 800 and the third side 326 of the inclined heat dissipation portion 320 can be designed according to actual needs and heat dissipation efficiency to improve the actual heat dissipation efficiency of the heat dissipation device 100, which does not deviate from the spirit and protection scope of the present invention.

In some embodiments, the first side 322 of the inclined heat dissipation portion 320 and the first side 312 of the first heat dissipation portion 310 are preferably disposed parallel to the substrate.

In some embodiments, the inclined heat dissipation fin 300 may further include an extended heat dissipation portion 330 connected to the top of the first heat dissipation portion 310 and connected to a side of the inclined heat dissipation portion 320. For example, the extended heat dissipation portion 330 includes a first side 332, a second side 334, a third side 336 and a fourth side 338, and is approximately rectangular. The second side 324 of the inclined heat dissipation portion 320 is connected to a portion of the second side 334 of the extended heat dissipation portion 330, and is preferably integrally formed with a portion of the second side 334 of the extended heat dissipation portion 330 to form the desired inclined heat dissipation fin 300.

It is worth noting that the heat dissipation device 100 further includes a fan 900, which is located at the second side 314 of the first heat dissipation portion 310, that is, located at the left side of the inclined heat dissipation fins 300 in the figure, to drive the heat dissipation air to blow toward the inclined heat dissipation fins 300 and the inclined heat dissipation area 820 of the inclined heat pipe 800. The heat dissipation air driven by the fan 900 can enter the inclined heat dissipation fins 300 through the air inlet 101 and an extended air inlet 103, and then pass through the first heat dissipation portion 310, the inclined heat dissipation portion 320 and the extended heat dissipation portion 330 to reach the air outlet 102.

The extended air inlet 103 is located at the third side 316 of the first heat dissipation portion 310 , which is not covered by the inclined heat dissipation portion 320 , so as to further guide the heat dissipation air into the inclined heat dissipation fins 300 .

In some embodiments, the inclined heat dissipation fin 300 further includes an air guiding protrusion 340 to guide the heat dissipation air toward the inclined heat dissipation portion 320 , so as to effectively increase the heat dissipation efficiency of the entire heat dissipation device 100 .

In some embodiments, the inclined heat dissipation fin 300 further includes an air guide opening 341 to facilitate heat dissipation air to pass through the inclined heat dissipation fin 300 , thereby effectively increasing the heat dissipation efficiency of the entire heat dissipation device 100 .

In some embodiments, the inclined heat dissipation fin 300 includes an air guide protrusion 340 and an air guide opening 341 , and the air guide protrusion 340 protrudes from one side of the air guide opening 341 to guide the heat dissipation air to pass through the air guide opening 341 to effectively increase the heat dissipation efficiency of the entire heat dissipation device 100 .

In some embodiments, the air guiding opening 341 and the air guiding protrusion 340 are rectangular, triangular or polygonal, but the present invention is not limited thereto.

It is worth noting that in this embodiment, the inclined heat dissipation fins 300 can form a gradually expanding air outlet width through the inclined heat dissipation portion 320 of the inclined heat dissipation fins 300, referring to the inclined heat dissipation portion air outlet width 105, which can effectively cooperate with the first heat dissipation portion air outlet width 104 of the first heat dissipation portion 310 to increase the air outlet width, avoid air outlet bottlenecks, and thereby improve the overall heat dissipation efficiency of the heat dissipation device 100.

Referring to FIG. 3 , as shown in the figure, the heat dissipation device 100 includes an inclined heat pipe 800 and a plurality of inclined heat dissipation fins 400. The inclined heat dissipation fins 400 include a first heat dissipation portion 410 and an inclined heat dissipation portion 420. The first heat dissipation portion 410 is connected to the bottom of the inclined heat dissipation portion 420 and is horizontally fixed on a substrate. The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the oblique side of the inclined heat dissipation portion 420, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 is at a predetermined angle relative to the horizontal plane.

In some embodiments, the first heat dissipation portion 410 includes a first side 412, a second side 414, a third side 416, a fourth side 418, and a lower inclined portion 419, presenting a pentagon. The inclined heat dissipation portion 420 includes a first side 422, a second side 424, and a third side 426, presenting a triangle. The first side 422 of the inclined heat dissipation portion 420 is connected to a portion of the third side 416 of the first heat dissipation portion 410, and is preferably integrally formed with a portion of the third side 416 of the first heat dissipation portion 410. The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the third side 426 of the inclined heat dissipation portion 420, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 forms a predetermined angle with the first side 422 of the inclined heat dissipation portion 420 and/or the first side 412 of the first heat dissipation portion 410, which is about 5 to 45 degrees, preferably about 10 to 40 degrees. However, the present invention is not limited to this. The inclination of the inclined heat dissipation area 820 of the inclined heat pipe 800 and the third side 426 of the inclined heat dissipation portion 420 can be designed according to actual needs and heat dissipation efficiency to improve the actual heat dissipation efficiency of the heat dissipation device 100, which does not deviate from the spirit and protection scope of the present invention.

In some embodiments, the first side 422 of the inclined heat dissipation portion 420 and the first side 412 of the first heat dissipation portion 410 are preferably disposed parallel to the substrate.

In some embodiments, the inclined heat dissipation fin 400 may further include an extended heat dissipation portion 430 connected to the top of the first heat dissipation portion 410 and connected to a side of the inclined heat dissipation portion 420. For example, the extended heat dissipation portion 430 includes a first side 432, a second side 434, a third side 436 and a fourth side 438, and is approximately rectangular. The second side 424 of the inclined heat dissipation portion 420 is connected to a portion of the second side 434 of the extended heat dissipation portion 430, and is preferably integrally formed with a portion of the second side 434 of the extended heat dissipation portion 430 to form the desired inclined heat dissipation fin 400.

Similarly, the fan 900 is located at the second side 414 of the first heat dissipation portion 410, that is, at the left side of the inclined heat dissipation fins 400 in the figure, to drive the heat dissipation air to blow toward the inclined heat dissipation fins 400 and the inclined heat dissipation area 820 of the inclined heat pipe 800. The heat dissipation air driven by the fan 900 can enter the inclined heat dissipation fins 400 through the air inlet 101, and then pass through the first heat dissipation portion 410, the inclined heat dissipation portion 420 and the extended heat dissipation portion 430 to reach the air outlet 102.

It is worth noting that in this embodiment, the lower inclined portion 419 of the first heat dissipation portion 410 of the inclined heat dissipation fin 400 is connected between the first side 412 and the fourth side 418 of the first heat dissipation portion 410, so that part of the lower portion of the first heat dissipation portion 410 is at an angle to the horizontal plane to form a storage space. Therefore, through the lower inclined portion 419, some electronic components or structures can be installed below the heat dissipation device 100, and through the inclined heat dissipation portion 420 of the inclined heat dissipation fin 400, a gradually expanding air outlet width can be formed, see the inclined heat dissipation portion air outlet width 105, which can effectively cooperate with the first heat dissipation portion air outlet width 104 of the first heat dissipation portion 410 to increase the air outlet width, avoid air outlet bottlenecks, and avoid affecting the heat dissipation efficiency of the heat dissipation device 100 due to the reduction of the outlet width of the first heat dissipation portion 410, thereby improving the overall heat dissipation efficiency of the heat dissipation device 100.

4 is a three-dimensional view of an inclined heat dissipation fin 500 . As shown in the figure, the inclined heat dissipation fin 500 includes a first heat dissipation portion 510 and an inclined heat dissipation portion 520 . The first heat dissipation portion 510 is connected to the lower side of the inclined heat dissipation portion 520 .

The first heat dissipation portion 510 includes a first side 512, a second side 514, a third side 516, a fourth side 518 and a lower inclined portion 519, and is approximately pentagonal. The lower inclined portion 519 is connected between the first side 512 and the fourth side 518 of the first heat dissipation portion 510, so that a portion of the lower side of the first heat dissipation portion 510 is at an angle to the horizontal plane.

In addition, the inclined heat dissipation portion 520 includes a first side 522, a second side 524 and a third side 526, and is approximately triangular in shape. The first side 522 of the inclined heat dissipation portion 520 is connected to a portion of the third side 516 of the first heat dissipation portion 510, and is preferably integrally formed with a portion of the third side 516 of the first heat dissipation portion 510. The third side 526 of the inclined heat dissipation portion 520 is used to fix the inclined heat dissipation area of the inclined heat pipe.

In some embodiments, the first side 522 of the inclined heat dissipation portion 520 and the first side 512 of the first heat dissipation portion 510 are preferably disposed parallel to the substrate.

In some embodiments, the inclined heat dissipation fin 500 may further include an extended heat dissipation portion 530 connected to the top of the first heat dissipation portion 510 and connected to a side of the inclined heat dissipation portion 520. For example, the extended heat dissipation portion 530 includes a first side 532, a second side 534, a third side 536 and a fourth side 538, and is approximately rectangular. The second side 524 of the inclined heat dissipation portion 520 is connected to a portion of the second side 534 of the extended heat dissipation portion 530, and is preferably integrally formed with a portion of the second side 534 of the extended heat dissipation portion 530 to form the desired inclined heat dissipation fin 500.

It is worth noting that the inclined heat dissipation fins 500 are further formed with an air guide flange 511 protruding from the first side 512 of the first heat dissipation portion 510, an air guide flange 525 protruding from the third side 526 of the inclined heat dissipation portion 520, and an air guide flange 517 protruding from the lower inclined portion 519 of the first heat dissipation portion 510, so as to form a flow channel for heat dissipation air after multiple inclined heat dissipation fins 500 are stacked, thereby effectively increasing the heat dissipation efficiency of the heat dissipation device 100.

In some embodiments, the air guide flange 525 protruding from the third side 526 of the inclined heat dissipation portion 520 can not only guide the heat dissipation air, but also increase the contact area with the inclined heat dissipation area of the inclined heat pipe 800 to improve the heat dissipation efficiency.

In addition, an air guide flange 533 protrudes from the second side 534 of the extended heat dissipation portion 530, and an air guide flange 535 protrudes from the third side 536 of the extended heat dissipation portion 530, and the two form an L-shaped air guide flange and are connected to the air guide flange 525 of the inclined heat dissipation portion 520 to further guide the flow of heat dissipation air, thereby increasing the heat dissipation efficiency of the heat dissipation device 100.

Please refer to Figure 5, which is a three-dimensional diagram of the plurality of inclined heat dissipation fins 500 and the inclined heat pipes 800 in Figure 4 after being assembled. Therefore, the second side 514 of the first heat dissipation portion 510 forms an air inlet 101, and the portion of the third side 516 of the first heat dissipation portion 510 that is not connected to the inclined heat dissipation portion 520 can be formed with an extended air inlet 103 to increase the air intake of the inclined heat dissipation fins 500, thereby effectively increasing the heat dissipation efficiency of the heat dissipation device 100.

In some embodiments, the inclined heat dissipation fin 500 further includes an air guide protrusion 540 to guide the heat dissipation air toward the inclined heat dissipation portion 520 to effectively increase the heat dissipation efficiency of the entire heat dissipation device 100 .

In some embodiments, the inclined heat dissipation fin 500 further includes an air guide opening 541 to facilitate heat dissipation air to pass through the inclined heat dissipation fin 500 , thereby effectively increasing the heat dissipation efficiency of the entire heat dissipation device 100 .

In some embodiments, the inclined heat dissipation fin 500 includes an air guide protrusion 540 and an air guide opening 541 , and the air guide protrusion 540 protrudes from one side of the air guide opening 541 to guide the heat dissipation air to pass through the air guide opening 541 , thereby effectively increasing the heat dissipation efficiency of the entire heat dissipation device 100 .

In some embodiments, the air guiding opening 541 and the air guiding protrusion 540 are triangular in shape, but the present invention is not limited thereto.

In some embodiments, electronic components or structures can be installed below the heat dissipation device 100 by tilting the lower inclined portion 519 of the first heat dissipation portion 510 of the tilted heat dissipation fin 500, and a gradually expanding air outlet width can be formed by tilting the inclined heat dissipation portion 520 of the tilted heat dissipation fin 500, referring to the inclined heat dissipation portion air outlet width 105, which can effectively cooperate with the first heat dissipation portion air outlet width 104 of the first heat dissipation portion 510 to increase the air outlet width, avoid air outlet bottlenecks, and avoid affecting the heat dissipation efficiency of the heat dissipation device 100 due to the reduction of the outlet width of the first heat dissipation portion 510, thereby improving the overall heat dissipation efficiency of the heat dissipation device 100.

In some embodiments, the aforementioned inclined heat pipe is a flat heat pipe.

In summary, the heat dissipation device disclosed in the present invention can effectively increase the air intake of the heat dissipation fins, while effectively increasing the outlet width of the heat dissipation fins, reducing the bottleneck of heat dissipation air flow, thereby increasing heat dissipation efficiency, improving heat dissipation quality, and increasing the overall performance of the electronic device.

Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Any person with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.

Claims (15)

1. A heat dissipation device, comprising: an inclined heat pipe comprising an inclined heat dissipation area; and A plurality of inclined heat dissipation fins, each of which comprises an inclined heat dissipation portion, wherein the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe is at a predetermined angle relative to a horizontal plane. 2. The heat dissipation device according to claim 1, wherein each of the plurality of inclined heat dissipation fins further comprises: A first heat dissipation portion is connected to the lower side of the inclined heat dissipation portion and is used for being horizontally fixed on a substrate. 3. The heat dissipation device according to claim 2, wherein each of the plurality of inclined heat dissipation fins further comprises: An extended heat dissipation portion is connected to the upper portion of the first heat dissipation portion and to one side of the inclined heat dissipation portion. 4. The heat dissipation device according to claim 1, wherein the inclined heat pipe further comprises: A heat absorbing area is horizontally attached to a heat source. 5. The heat dissipation device according to claim 2, wherein each of the plurality of inclined heat dissipation fins further comprises: An extended air inlet is located above the first heat dissipation portion to guide heat dissipation air into the plurality of inclined heat dissipation fins. 6. The heat dissipation device according to claim 1, wherein each of the plurality of inclined heat dissipation fins further comprises: An air guiding protrusion is used to guide the heat dissipation air toward the inclined heat dissipation portion. 7. The heat dissipation device according to claim 6, wherein each of the plurality of inclined heat dissipation fins further comprises: An air guide opening is provided, and the air guide protrusion protrudes from the air guide opening to guide the heat dissipation air to pass through the air guide opening. 8 . The heat dissipation device according to claim 7 , wherein the air guide opening and the air guide protrusion are polygonal in shape. 9. The heat dissipation device according to claim 1, wherein each of the plurality of inclined heat dissipation fins further comprises: An air guide opening is provided to allow heat dissipation air to pass through each of the plurality of inclined heat dissipation fins. 10. The heat dissipation device according to claim 2, wherein the first heat dissipation portion of each of the plurality of inclined heat dissipation fins further comprises: A lower inclined portion is provided so that a portion of the lower portion of the first heat dissipation portion forms an angle with a horizontal plane. 11. The heat dissipation device according to claim 10, wherein the first heat dissipation portion of each of the plurality of inclined heat dissipation fins further comprises: An air guide flange protrudes from the lower inclined portion to guide heat dissipation air. 12. The heat dissipation device according to claim 3, wherein the inclined heat dissipation portion of each of the plurality of inclined heat dissipation fins comprises: An air guide flange is used to increase the contact area with the inclined heat dissipation area of the inclined heat pipe and guide the heat dissipation air. 13. The heat dissipation device according to claim 12, wherein the extended heat dissipation portion of each of the plurality of inclined heat dissipation fins comprises: An L-shaped air guide flange is connected to the air guide flange of the inclined heat dissipation portion. 14. The heat dissipation device as claimed in claim 2, further comprising a fan located on one side of the plurality of inclined heat dissipation fins to drive heat dissipation air to blow toward the plurality of inclined heat dissipation fins and the inclined heat dissipation area of the inclined heat pipe. 15. The heat dissipation device according to claim 1, wherein the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle of 5 degrees to 45 degrees relative to a horizontal plane.