CN209729872U - Substrate board treatment - Google Patents

Abstract

The utility model provides a kind of substrate board treatment, it is after carrying out liquid handling to substrate using treatment fluid, it is dried by supply volatility treatment fluid, wherein, the substrate heating units heated the substrate are in the treatment fluid for being started to supply heating to the back side of substrate in the process of processing with treatment fluid, thus start the heating of substrate before supplying volatility treatment fluid, and when supplying volatility treatment fluid, to the treatment fluid certain time of the back side of substrate supply heating while supplying volatility treatment fluid to the front of substrate, the surface temperature of substrate is set to be higher than dew-point temperature before to expose on the surface of the substrate from volatility treatment fluid.Thus, it is possible to prevent the case where substrate surface generates washmarking and adheres to subparticle.

Description

Substrate board treatment

Technical field

The utility model relates to be done after carrying out liquid handling to substrate using treatment fluid using volatility treatment fluid The substrate board treatment of dry processing.

Background technique

In the past, it in the case where manufacturing semiconductor device or flat-panel monitor etc., is utilized by substrate board treatment various Treatment fluid implements liquid handling to substrates such as semiconductor crystal wafer or crystal liquid substrates, and the substrate for then implementing to make to be attached with treatment fluid is dry Dry drying process.Wherein, as the liquid handling carried out in substrate board treatment using treatment fluid, exist and utilize cleaning solution Or cleaning treatment or etching process that the medical fluids such as etching solution carry out substrate surface, and using flushing liquors such as pure water come to process Flushing processing that the substrate surface of cleaning treatment or etching process carries out etc..

In the drying process of the processing substrate, IPA (Isopropyl alcohol, isopropanol) is used as dry liquid Deng having volatile medical fluid, spraying volatility treatment fluid to substrate surface replaces flushing liquor etc., thus does substrate rapidly Dry (for example, see patent document 1).

Patent document 1: Japanese Unexamined Patent Publication 2007-227467 bulletin

Utility model content

However, in recent years along with the miniaturization of the circuit pattern or etching mask patterns for being formed in substrate surface etc., base Remaining finer particle also becomes problem on the surface of the substrate when plate processing.It may be produced in above-mentioned previous processing substrate Raw following problem: when being dried, substrate is cooled along with the gasification of volatility treatment fluid, leads to the water in atmosphere Divide and condense on substrate and generate washmarking (watermark), so that finer particle is attached to substrate surface.

Therefore, the processing substrate also proceeded as follows: the withering base of volatility treatment fluid is being utilized The inside of plate processing unit makes a large amount of dry air circulate, thus makes drying substrates under low-humidity environment.

But above-mentioned previous processing substrate is due to needing dry air, so operating cost meeting needed for processing substrate Increase.

The substrate board treatment of the utility model is volatilized after carrying out liquid handling to substrate using treatment fluid by supply Property treatment fluid be dried, which includes: treatment fluid feed unit, is set to aforesaid substrate processing The top of device supplies treatment fluid to the front and back of aforesaid substrate；Volatility treatment fluid feed unit, is set to above-mentioned The top of substrate board treatment, to the front supply volatility treatment fluid of aforesaid substrate；Substrate heating units, with above-mentioned processing The connection of liquid feed unit, heats aforesaid substrate；And control unit, with above-mentioned volatility treatment fluid feed unit and The connection of aforesaid substrate heating unit, controls above-mentioned volatility treatment fluid feed unit and aforesaid substrate heating unit, In, above-mentioned control unit is configured to, and executes: handling from above-mentioned treatment fluid feed unit to the front and back supply of aforesaid substrate Liquid is to handle aforesaid substrate；By aforesaid substrate heating unit, the aforesaid substrate for the liquid film for being formed with above-mentioned treatment fluid is carried out Heating；Front supply from from above-mentioned volatility treatment fluid feed unit to the aforesaid substrate for the liquid film for being formed with above-mentioned treatment fluid is waved Hair property treatment fluid；Stop supplying volatility treatment fluid from above-mentioned volatility treatment fluid feed unit to aforesaid substrate；And removal Above-mentioned volatility treatment fluid is so that aforesaid substrate is dry, wherein aforesaid substrate heating unit as follows to aforesaid substrate into Row heating: in the treatment fluid for being started to supply heating to the back side of aforesaid substrate in the process of processing with above-mentioned treatment fluid, and Start the heating of aforesaid substrate before supplying above-mentioned volatility treatment fluid, and when supplying above-mentioned volatility treatment fluid, to The treatment fluid heated while the front of aforesaid substrate supplies above-mentioned volatility treatment fluid to the supply of the back side of aforesaid substrate is certain Time, to make the surface temperature of aforesaid substrate be higher than dew point before the exposing of above-mentioned volatility treatment fluid on the surface of aforesaid substrate Temperature.

In this way, according to the utility model, in the drying process using volatility treatment fluid, in substrate surface from volatilization Property treatment fluid expose before make substrate surface temperature be higher than dew-point temperature mode heat the substrate, even if existing as a result, The surface temperature of substrate is reduced because of the heat of gasification of volatility treatment fluid when drying process, the surface of the substrate in drying process Temperature will not condense also above dew-point temperature, therefore in substrate surface, can prevent attached in substrate surface generation washmarking Subparticle the case where.

Detailed description of the invention

Fig. 1 is the top view for indicating substrate board treatment.

Fig. 2 is the schematic diagram for indicating processing substrate portion.

Fig. 3 is the process chart for indicating substrate processing method using same.

Fig. 4 is the action specification figure (substrate reception process) in processing substrate portion.

Fig. 5 is the action specification figure (cleaning treatment process) in processing substrate portion.

Fig. 6 is the action specification figure (rinsing treatment process) in processing substrate portion.

Fig. 7 is the action specification figure (substrate heating process) in processing substrate portion.

Fig. 8 is the action specification figure (being dried process first half) in processing substrate portion.

Fig. 9 is the action specification figure (it is later half to be dried process) in processing substrate portion.

Figure 10 is the action specification figure (substrate delivery hand over sequence) in processing substrate portion.

Figure 11 is the schematic diagram for indicating another processing substrate portion.

Figure 12 is the schematic diagram for indicating another processing substrate portion.

Specific embodiment

Referring to the drawings come illustrate the utility model relates to substrate board treatment, and be used for the substrate board treatment Substrate processing method using same, make substrate board treatment execute processing substrate substrate processing program specific structure.

As shown in Figure 1, substrate board treatment 1 has substrate carrying-in/carrying-out platform 4, board carrying room 5 and substrate processing chamber 6. Substrate carrying-in/carrying-out platform 4 is formed in the front end of substrate board treatment 1, and is placed with carrier 3, which is used for multi-disc (example Such as 25) substrate 2 (being here semiconductor crystal wafer) stored with horizontality.Board carrying room 5 is formed in substrate and moves in 4 rear portion is put into effect, handling substrate 2 is used for.Substrate processing chamber 6 is formed in the rear portion of board carrying room 5, for implementing to substrate 2 The various processing such as cleaning and drying.

Substrate carrying-in/carrying-out platform 44 carriers 3 are close contact in the state of the antetheca 7 of board carrying room 5 and left and right across It is loaded every ground.

The inside of board carrying room 5 is accommodated with substrate transfer apparatus 8 and substrate delivery/reception platform 9.Substrate transfer apparatus 8 is loading The handling substrate 2 between any one carrier 3 and substrate delivery/reception platform 9 of substrate carrying-in/carrying-out platform 4.

The central portion of substrate processing chamber 6 is accommodated with substrate transfer apparatus 10.It is arranged in the left and right sides of substrate transfer apparatus 10 Column are configured with processing substrate portion 11~22.

Substrate transfer apparatus 10 is submitted between platform 9 and each processing substrate portion 11~22 in the substrate of board carrying room 5 by base Plate 2 is carried one by one.11~22 pairs of each processing substrate portion substrate 2 is handled one by one.

Each processing substrate portion 11~22 structure having the same illustrates the structure in processing substrate portion 11 as representative.Such as Fig. 2 Shown, processing substrate portion 11 includes: substrate holding unit 23, for substrate 2 to be remained level and makes its rotation；Treatment fluid supplies To unit 24, the upper surface (front) of the substrate 2 for being kept towards substrate holding unit 23 spray treatment fluid (cleaning solution or Flushing liquor)；Volatility treatment fluid feed unit 25, the upper surface spray of the substrate 2 for being kept towards substrate holding unit 23 Volatile dry liquid is provided；And inert gas spray unit 26, the base for being kept towards substrate holding unit 23 The upper surface of plate sprays inert gas.These substrate holding units 23, treatment fluid feed unit 24, the supply of volatility treatment fluid are single Member 25 and inert gas spray unit 26 are controlled by control unit 27.In addition, control unit 27 is to substrate transfer apparatus 8,10 etc. Substrate board treatment 1 is whole to be controlled.

Substrate holding unit 23 has disk-shaped platform 29 in the upper end of its rotary shaft 28, is in horizontality. In the edge part of platform 29, multiple substrate keeping bodies 30 along the circumferential direction are installed across interval, contact the edge part of substrate 2 Substrate 2 is remained into level.Rotary shaft 28 is connect with rotary drive mechanism 31.Rotary drive mechanism 31 is by making rotary shaft 28 And platform 29 rotates, the substrate 2 keep substrate keeping body 30 rotates.The rotary drive mechanism 31 and control unit 27 connect It connects, is controlled and rotated by control unit 27.

In addition, substrate holding unit 23 has cup body 32, it is open upwards around platform 29, and can go up and down.Cup Body 32 surrounds the substrate 2 for being placed in platform 29, prevents treatment fluid or dries dispersing for liquid, and recycle process fluids or dry liquid.Cup Body 32 is connect with elevating mechanism 33, and elevating mechanism 33 makes cup body 32 relative to 2 oscilaltion of substrate.The elevating mechanism 33 and control Unit 27 connects, and is controlled and is gone up and down by control unit 27.

Treatment fluid feed unit 24 is in the top of platform 29 configured with moveable processing nozzle for liquid 34.Handle nozzle for liquid 34 Connect with mobile mechanism 35, mobile mechanism 35 make to handle nozzle for liquid 34 the evacuation position in the outside of substrate 2 and 2 center of substrate just on It is moved between the ejection starting position of side.The mobile mechanism 35 connect with control unit 27, is controlled and is moved by control unit 27.

In addition, treatment fluid feed unit 24 supplies cleaning solution (hydrofluoric acid) with to processing nozzle for liquid 34 via switching valve 38 Cleaning solution supplying source 36 and the flushing liquor supply source 37 for supplying flushing liquor (pure water) connect, and are allowed hand over by the switching valve 38 At the supply of cleaning solution, the supply of flushing liquor or stopping.Between cleaning solution supplying source 36 and switching valve 38, it is provided with flow tune Whole device 39 passes through the flow for the cleaning solution that the adjustment of flow regulator 39 is supplied from processing nozzle for liquid 34 to substrate 2.Flow adjustment Device 39 is connect with control unit 27, controls flow by control unit 27.On the other hand, in flushing liquor supply source 37 and switching valve 38 Between be provided with flow regulator 40 and the heater 41 as heating unit, by the adjustment of flow regulator 40 from treatment fluid The flow for the flushing liquor that nozzle 34 is supplied to substrate 2 adjusts the temperature of flushing liquor by heater 41.The flow regulator 40 and Heater 41 is connect with control unit 27, controls flow and temperature by control unit 27.In addition, treatment fluid feed unit 24 can 2 are heated the substrate by the flushing liquor after the heating of heater 41 to the supply of substrate 2, there is the function as substrate heating units.

Volatility treatment fluid feed unit 25 is in the top of platform 29 configured with moveable dry nozzle for liquid 42.Dry liquid Nozzle 42 is connect with mobile mechanism 43, and mobile mechanism 43 makes dry nozzle for liquid 42 in the evacuation position and substrate 2 in 2 outside of substrate It entreats and is moved between the ejection starting position of top.The mobile mechanism 43 connect with control unit 27, is controlled and is moved by control unit 27 It is dynamic.

In addition, volatility treatment fluid feed unit 25 is via flow regulator 45 and heater 51 and dry liquid supply source 44 Connection, the drying liquid supply source 44 are used to supply the drying liquid (IPA) as volatility treatment fluid to dry nozzle for liquid 42.Pass through Flow regulator 45 carries out the flow adjustment of the drying liquid supplied from dry nozzle for liquid 42 to substrate 2 and supply stops, by adding Hot device 51 adjusts the temperature of dry liquid.The flow regulator 45 and heater 51 are connect with control unit 27, by control unit 27 Control flow and temperature.

Inert gas spray unit 26 is configured with moveable inert gas nozzle 46 in the top of platform 29.Inert gas Nozzle 46 is connect with mobile mechanism 47, and mobile mechanism 47 makes evacuation position and substrate 2 of the inert gas nozzle 46 in 2 outside of substrate It is moved between the ejection starting position of overcentre.The mobile mechanism 47 connect with control unit 27, is controlled by control unit 27 It is mobile.

In addition, inert gas spray unit 26 is via flow regulator 49 and for supplying inertia to inert gas nozzle 46 The inert gas supply source 48 of gas (nitrogen) connects, and is carried out by flow regulator 49 from inert gas nozzle 46 to substrate 2 The flow of the inert gas of supply adjusts and supply stops.The flow regulator 49 is connect with control unit 27, by control unit 27 control flows.

Substrate board treatment 1 has structure described above, according to the note that can be read in control unit 27 (computer) Substrate processing program recorded in recording medium 50 handles substrate 2 by each processing substrate portion 11~22.In addition, recording medium 50 As long as being able to record the medium of the various programs such as substrate processing program, the semiconductor storages type such as ROM or RAM can be Recording medium is also possible to the disk type recording mediums such as hard disk or CD-ROM.

In aforesaid substrate processing unit 1, according to substrate processing program, according to process chart shown in Fig. 3 with as described below Mode substrate 2 is handled.

Firstly, as shown in figure 3, substrate processing program, which executes substrate, receives process, that is, the base in each processing substrate portion 11~22 Plate holding unit 23 receives substrate 2 from substrate transfer apparatus 10.

It is received in process in the substrate, as shown in figure 4, substrate processing program keeps single by 27 control base board of control unit The elevating mechanism 33 of member 23, to make cup body 32 drop to specified position.Then, substrate keeping body 30 connects from substrate transfer apparatus 10 It receives substrate 2 and supports.Then, the elevating mechanism 33 of 27 control base board holding unit 23 of control unit, rise to cup body 32 Specified position.

Secondly, as shown in figure 3, substrate processing program executes liquid handling process, that is, (utilize hydrogen herein using treatment fluid Fluoric acid and pure water) liquid handling is carried out to the substrate 2 received in substrate reception process.Here, liquid handling process by with Lower two processes are constituted: cleaning treatment process starts the cleaning processing substrate 2 with hydrofluoric acid；And treatment process is rinsed, clear It washes treatment process and is rinsed processing later, i.e., supply pure water to substrate 2 to remove hydrofluoric acid from substrate 2.

As shown in figure 5, substrate processing program controls rotary drive mechanism by control unit 27 in cleaning treatment process 31, come make substrate holding unit 23 platform 29 and platform 29 the substrate 2 that is kept of substrate keeping body 30 with egulation rotating speed Rotation.Also, control unit 27 controls mobile mechanism 35, to make the processing nozzle for liquid 34 for the treatment of fluid feed unit 24 be moved to base The top of 2 central portion of plate.Then, control unit 27 opens flow regulator 39 and controls flow, will be by cleaning solution supplying source 36 The hydrofluoric acid of the room temperature of supply sprays certain time from processing nozzle for liquid 34 towards the upper surface of substrate 2.Then, control unit 27 control flow regulators 39 make its closing, stop spraying hydrofluoric acid to make to handle nozzle for liquid 34.In addition, processing nozzle for liquid 34 can To entreat the top in portion to spray hydrofluoric acid towards the upper face center portion of substrate 2 with halted state in the substrate 2, can also lead on one side It crosses mobile mechanism 35 to move between the top of 2 periphery ora terminalis of the top in centre portion and substrate in the substrate 2, on one side towards substrate 2 Upper surface sprays hydrofluoric acid.

Then, as shown in fig. 6, in rinsing treatment process, substrate processing program is driven by the control rotation of control unit 27 Motivation structure 31, to make the platform 29 of substrate holding unit 23 and by substrate 2 that the substrate keeping body 30 of platform 29 is kept to provide Revolving speed rotation.In this case, control unit 27 controls mobile mechanism 35, to make the processing nozzle for liquid for the treatment of fluid feed unit 24 34 are moved to the top of 2 central portion of substrate.Then, control unit 27 is opened in the state that controlling heater 41 stops it Flow regulator 40 simultaneously controls flow, to the pure water supplied from flushing liquor supply source 37, is not heated by heater 41 to it And room temperature is remained at, certain time is sprayed from processing nozzle for liquid 34 towards the upper surface of substrate 2.

Secondly, as shown in figure 3, substrate processing program execute substrate heating process, that is, in liquid handling process through liquid The substrate 2 of processing is heated.

As shown in fig. 7, substrate processing program controls rotary driving machine by control unit 27 in the substrate heating process Structure 31, come the substrate 2 that makes the platform 29 of substrate holding unit 23 and kept by the substrate keeping body 30 of platform 29 with egulation rotating speed Rotation.In this case, control unit 27 carries out drive control to heater 41, opens simultaneously flow regulator 40 and controls stream The pure water supplied by flushing liquor supply source 37, is heated to predetermined temperature (such as 60 DEG C) by amount with heater 41, and from treatment fluid Nozzle 34 sprays certain time towards the upper surface of substrate 2.Then, control unit 27, which controls flow regulator 40, makes its closing, Stop spraying pure water to make to handle nozzle for liquid 34, and control heater 41 to make its stopping.

In this way, temperature to be higher than to the liquid for the treatment of fluid temperature used in liquid handling process in substrate heating process (flushing liquor) is sprayed towards the upper surface of substrate 2, heats the substrate 2 as a result, with heat transfer.Here, 2 are heated the substrate, until that can make Until the surface temperature of substrate 2 is higher than the temperature of dew-point temperature in aftermentioned drying process process.

Here, treatment process will be rinsed to be illustrated from substrate heating process as different processes, but in substrate heater In the case where spraying high temperature flushing liquor to the upper surface of substrate 2 in sequence, substrate can be carried out while being rinsed processing and added Thermal process.Thus, it is possible to shorten the substrate process time of substrate board treatment 1 to improve productivity.On the other hand, if making Then the preceding process for rinsing treatment process (is cleaning treatment process herein, is etching process process sometimes with high temperature flushing liquor Deng) in processing impact in the case where (for example, because the temperature of substrate 2 rise due to cause at the etching carried out with etching solution The case where reason accelerates etc.), as long as being rinsed treatment process with room temperature flushing liquor before substrate heating process, it will be able to prevent The adverse effect that can occur because heating the substrate 2.

Secondly, as shown in figure 3, substrate processing program, which executes, is dried process, that is, to after the heating of substrate heating process Substrate 2 be dried.

As shown in figure 8, substrate processing program controls rotary driving machine by control unit 27 in the drying process process Structure 31, come make substrate holding unit 23 platform 29 and platform 29 the substrate 2 that is kept of substrate keeping body 30 to provide to turn Speed rotation.In this case, control unit 27 controls mobile mechanism 43, to make the drying liquid of volatility treatment fluid feed unit 25 Nozzle 42 is moved to the top of 2 central portion of substrate, and control unit 27 opens flow regulator 45 and controls flow, will be by dry liquid The IPA for the high temperature (such as 50 DEG C) that supply source 44 supplies sprays certain time from dry nozzle for liquid 42 towards the upper surface of substrate 2. Here, dry nozzle for liquid 42 can the top in centre portion in the substrate 2 sprayed with halted state towards the upper face center portion of substrate 2 High temperature IPA, can also be on one side by between the mobile mechanism 43 in the substrate 2 top of 2 periphery ora terminalis of the top in centre portion and substrate It is mobile, the drying liquid of high temperature is sprayed towards the upper surface of substrate 2 on one side.

In turn, as shown in figure 9, in being dried process, substrate processing program is driven by the control rotation of control unit 27 Motivation structure 31, come make substrate holding unit 23 platform 29 and platform 29 the substrate 2 that is kept of substrate keeping body 30 to advise Determine revolving speed rotation.In this case, control unit 27 controls mobile mechanism 43, to make the dry of volatility treatment fluid feed unit 25 Liquid drier nozzle 42 is mobile towards the top of 2 periphery ora terminalis of substrate.At this point, control unit 27 controls mobile mechanism 47, to make inertia After the inert gas nozzle 46 of gas spray unit 26 is moved to the top of 2 central portion of substrate, it is made to follow dry nozzle for liquid 42 and it is mobile towards the top of 2 periphery ora terminalis of substrate.Control unit 27 opens flow regulator 45,49 and controls flow, and will By the IPA and nitrogen at room of the high temperature (such as 50 DEG C) that dry liquid supply source 44 and inert gas supply source 48 supply, from drying Nozzle for liquid 42 and inert gas nozzle 46 spray certain time towards the upper surface of substrate 2.Then, control unit 27 controls flow Adjuster 45,49 makes its closing, and dry nozzle for liquid 42 and inert gas nozzle 46 is made to stop spraying IPA and nitrogen.

In this way, spraying the drying liquid with volatility, towards the upper surface of substrate 2 in being dried process with drying Liquid is substituted in the remaining moisture in upper surface of substrate 2, evaporates dry liquid together with moisture to keep the upper surface of substrate 2 dry.

At this point, seizing heat of gasification due to using with volatile dry liquid in dry liquid gasification Shi Huicong substrate 2, making The whole surface of substrate 2 or the temperature of a part reduce.When air humidity near 2 surface of substrate is 70%, 2 surface of substrate On dew-point temperature be 19.1 DEG C, and 2 surface temperature of substrate be room temperature (25 DEG C) when, 2 surface temperature of substrate can be because of heat of gasification And dew-point temperature or less is reduced to from room temperature.Through experimental confirmation, moisture therefore in atmosphere can in 2 surface sweating of substrate, because Moisture condensation generates washmarking on 2 surface of substrate and adheres to fine particle.

Then, in the present invention, substrate heating process is carried out before being dried process, heats base in advance The surface of plate 2, to make the surface temperature of the substrate 2 in being dried be higher than dew before the surface of substrate 2 is exposed from dry liquid Point temperature (such as 2 surfaces are heated the substrate to make 35 DEG C of the surface temperature of substrate 2 with 60 DEG C of flushing liquor).

It has confirmed that, even if the surface temperature of the substrate 2 when being dried in being dried process as a result, is because of drying The heat of gasification of liquid and reduce, be also able to maintain that substrate 2 surface temperature be higher than dew-point temperature, the surface of substrate 2 is no longer tied Dew can prevent the surface of substrate 2 from generating washmarking and adhering to fine particle.

In addition, when heating the substrate 2, to make the substrate 2 in being dried before the surface of substrate 2 is exposed from dry liquid The mode that surface temperature is higher than dew-point temperature heats the substrate 2, but in the feelings for heating the substrate 2 using high-temp liquids such as flushing liquors Under condition, the humidity near the surface of substrate 2 can increase because of the moisture of liquid, and dew-point temperature can also rise (such as temperature therewith It is 25 DEG C, when humidity is 70%, dew-point temperature is 19.1 DEG C, and humidity becomes 90% dew-point temperature can rise to 23.2 DEG C). That is, using liquid such as flushing liquors to heat the substrate 2, if fluid temperature is too low (such as less than 30 DEG C), then the surface temperature of the substrate 2 in being dried can not be made to be higher than dew-point temperature, on the other hand, if fluid temperature is excessively high (such as more than 70 DEG C), then with humidity increase and dew-point temperature can also rise, as a result or can not make be dried in base The surface temperature of plate 2 is higher than dew-point temperature.Therefore, it is necessary to consider to increase with humidity and the dew-point temperature of rising, regulation is used The liquid of temperature range heat the substrate 2.Therefore, as flushing liquor, it is preferable to use 30 DEG C~70 DEG C of flushing liquor, at this time conducts It is preferable to use 20 DEG C~70 DEG C of drying liquid for dry liquid.

Finally, as shown in figure 3, substrate processing program executes substrate delivery hands over sequence, that is, by substrate 2 from each processing substrate portion 11~22 substrate holding unit 23 is submitted to substrate transfer apparatus 10.

As shown in Figure 10, it hands in sequence in the substrate delivery, substrate processing program passes through 27 control base board of control unit and keeps The elevating mechanism 33 of unit 23, to make cup body 32 drop to specified position.Then, the substrate 2 that will be supported by substrate keeping body 30 It is submitted to substrate transfer apparatus 10.Then, the elevating mechanism 33 of 27 control base board holding unit 23 of control unit, makes on cup body 32 Rise to specified position.In addition, the substrate delivery is handed over, sequence can also receive process with above-mentioned substrate and carry out simultaneously.

As described above, aforesaid substrate processing unit 1 is held in the substrate processing method using same executed according to substrate processing program Row: start the process for supplying volatility treatment fluid to substrate 2；And stop the process for supplying volatility treatment fluid to substrate 2, and And before stopping supplying volatility treatment fluid to substrate 2, especially before the surface of substrate 2 is exposed from dry liquid, execute To the substrate heating process that substrate 2 is heated, so that the surface temperature of the substrate 2 in being dried is higher than the side of dew-point temperature Formula heats substrate 2, is then dried.

Therefore, in aforesaid substrate processing unit 1, even if the surface temperature of substrate 2 is because having volatilization when being dried Property drying liquid heat of gasification and reduce, the surface temperature of substrate 2 is also above dew point before 2 surface of substrate is exposed from dry liquid Temperature, therefore will not condense on the surface of substrate 2, it can prevent the surface of substrate 2 from generating washmarking and adhering to fine particle.

In aforesaid substrate processing unit 1, heated the substrate in substrate heating process to the flushing liquor of the supply high temperature of substrate 2 2, but not limited to this, the drying liquid of high temperature can also be supplied to substrate 2 to heat the substrate 2.In addition, as shown in figure 11, it can also be with It is configured to as processing substrate portion 52, configures LED light 53 in the top of platform 29, substrate 2 is irradiated by LED light 53 to heat base Plate 2.It is irradiated by LED light 53, it will be able to so that the temperature of substrate 2 is rapidly heated up, therefore can shorten in order not to make substrate 2 Surface expose and maintain that from dry liquid, time of dry liquid liquid film, the consumption of dry liquid less amount can be suppressed to. In addition it is also possible to rise substrate surface temperature until being higher than dew-point temperature before being initially supplied dry liquid.In turn, As shown in figure 12, it is also used as processing substrate portion 54, form ejiction opening 55 in 29 central portion of platform and is supplied from ejiction opening 55 The fluid (being herein flushing liquor) of high temperature, heats substrate 2 from the back side of substrate 2.In these embodiments, also in base It maintains the liquid film of flushing liquor or dry liquid without exposing the surface of substrate 2 on the surface of plate 2, and is heated to the surface temperature of substrate Until degree is higher than dew-point temperature.

In addition, substrate heating process is carried out before being dried process in aforesaid substrate processing unit 1, but as long as 2 are heated the substrate before the surface of substrate 2 is exposed from dry liquid, it, can also be also endless when drying process process starts Height-rise temperature is extremely higher than the temperature of dew-point temperature.That is, substrate heating process can be carried out in being dried process.Such as It is also possible to supply dry liquid to substrate 2, and to the back of substrate 2 after liquid handling process (rinsing treatment process) The pure water certain time (such as 5 seconds) of face supply high temperature (such as 30 DEG C~80 DEG C) stops afterwards, to heat the substrate 2, then (example As after 5 seconds) inert gas is supplied to substrate 2 together with dry liquid.At this point, the dry of high temperature can also be supplied to 2 back side of substrate Liquid drier, but for the sake of inhibiting dry liquid consumption, preferably supply the pure water of high temperature.Furthermore it is preferred that in the surface temperature of substrate 2 When being heated above the temperature of dew-point temperature, stop the pure water or dry liquid of supply high temperature.

In addition, using hydrofluoric acid as cleaning solution in aforesaid substrate processing unit 1, pure water is used as flushing liquor, is made IPA is used for volatility treatment fluid, but not limited to this, the case where the utility model be can be adapted for using other treatment fluids, or Person such as is etched at other processing the case where.

Control unit 27

Control unit 27 for example has CPU (Central Processing Unit, central processing unit), RAM (Random Access Memory, random access memory), ROM (Read-Only Memory, read-only memory), HDD (Hard Disk Drive, hard disk drive), communication interface, input/output interface and Media Interface Connector etc..

CPU is based on the procedure operation for being stored in ROM or HDD, to carry out the control in each portion.ROM is for being stored in starting control By the CPU bootstrap executed or the program etc. for the hardware for relying on control unit 27 when unit 27 processed.HDD is for storing by CPU Data used in the program of execution and the program etc..Communication interface via communication network from other equipment receive data and by its It is sent to CPU, and the CPU data generated are sent to other equipment via communication network.

CPU controls the output devices such as display or printer via input/output interface and the inputs such as keyboard or mouse fill It sets.CPU obtains data from input unit via input/output interface.In addition, CPU is defeated to output device via input/output interface Data generated out.

Media Interface Connector reads the program or data for being stored in storage medium, and it is supplied to CPU via RAM.CPU should Program is loaded on RAM via Media Interface Connector from storage medium, and executes loaded program.Storage medium is, for example, DVD (Phase Change Rewritable Disk, phase transformation can by (Digital Versatile Disc, digital versatile disc), PD Re-write optical disk) etc. the magnetic-optical storage mediums such as optical storage mediums, MO (magneto-optic disk), band medium, magnetic storage medium or semiconductor deposit Reservoir etc..

For example, program of the CPU of control unit 27 by execution load on RAM, to realize as substrate board treatment 1 Control unit various functions.For example, the CPU of control unit 27 by execute above procedure come control base board holding unit 23, Treatment fluid feed unit 24, volatility treatment fluid feed unit 25 and inert gas spray unit 26 etc..CPU can be situated between from storage Matter reads and executes above procedure, can also obtain above procedure from other equipment via communication network.

AI: artificial intelligence

Control unit 27 can also have AI (Artificial Intelligence, artificial intelligence).AI includes mechanics Module is practised, using for example by the processing method data comprising various parameters, the substrate executed according to above-mentioned processing method data The result inspection result etc. of substrate 2 (treated) of processing and the sensor values etc. obtained in processing substrate from various sensors Data are accumulated obtained from associating to carry out rote learning.

AI can for example export the processing method number for making parameter optimization in a manner of it can obtain more preferably inspection result as a result, According to.Be able to carry out the parameter of optimization for instance that various treatment fluids temperature, flow and service time；It is temperature in device, wet Degree, air pressure and extraction flow；Transporting velocity, stand-by time of substrate 2 etc..

Control unit 27 can be such that a series of processing substrates optimize by using the processing method data of optimization.Example Such as, it can reduce the ratio for being determined as the substrate 2 of substandard products in inspection process, or can be improved the machining accuracy of substrate 2.

In addition, being for example able to use deep learning as rote learning, (Support Vector Machine is supported SVM Vector machine), it is adaptive to enhance the known algorithms such as (AdaBoost), random forest (Random Forest).

Claims (1)

1. a kind of substrate board treatment passes through supply volatility processing after carrying out liquid handling to substrate using treatment fluid Liquid is dried characterized by comprising

Treatment fluid feed unit is set to the top of the substrate board treatment, the front and back supply of Xiang Suoshu substrate Treatment fluid；

Volatility treatment fluid feed unit is set to the top of the substrate board treatment, the front supply of Xiang Suoshu substrate Volatility treatment fluid；

Substrate heating units connect with the treatment fluid feed unit, heat to the substrate；And

Control unit is connect, to the volatility with the volatility treatment fluid feed unit and the substrate heating units Treatment fluid feed unit and the substrate heating units are controlled, wherein

Described control unit is configured to, and executes:

From the treatment fluid feed unit to the front and back of substrate supply treatment fluid to handle the substrate；

By the substrate heating units, the substrate for the liquid film for being formed with the treatment fluid is heated；

Front supply from from the volatility treatment fluid feed unit to the substrate for the liquid film for being formed with the treatment fluid is waved Hair property treatment fluid；

Stop supplying volatility treatment fluid from the volatility treatment fluid feed unit to the substrate；And

The volatility treatment fluid is removed so that the drying substrates,

Wherein, the substrate heating units as follows heat the substrate: handling with the treatment fluid During start the treatment fluid that heating is supplied to the back side of the substrate, and start before supplying the volatility treatment fluid The heating of the substrate, and when supplying the volatility treatment fluid, the front of Xiang Suoshu substrate supplies at the volatility The treatment fluid certain time heated while managing liquid to the supply of the back side of the substrate, to be waved on the surface of the substrate from described Hair property treatment fluid makes the surface temperature of the substrate be higher than dew-point temperature before exposing.