CN209693186U - A kind of copper-clad plate of application reversion copper foil material - Google Patents
A kind of copper-clad plate of application reversion copper foil material Download PDFInfo
- Publication number
- CN209693186U CN209693186U CN201821950982.0U CN201821950982U CN209693186U CN 209693186 U CN209693186 U CN 209693186U CN 201821950982 U CN201821950982 U CN 201821950982U CN 209693186 U CN209693186 U CN 209693186U
- Authority
- CN
- China
- Prior art keywords
- copper
- foil material
- copper foil
- reversion
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of copper-clad plates of application reversion copper foil material, including reversion copper foil material and etching resist in combination, the reversion copper foil material includes insulating layer and copper layer, the insulation is placed on centre, the copper layer overlays on the two sides of insulating layer, and copper layer side is smooth surface, and the other side is the hair side that roughness is greater than smooth surface, the smooth surface is in conjunction with insulating layer, and the hair side is towards outside and in conjunction with etching resist.The effective of the utility model is: by the reversion copper foil material, can greatly improve copper face and etch the binding force of resist, so as to improve internal layer circuit open circuit, notch, defect be made to decline 50%.
Description
Technical field
The utility model relates to technical field of PCB board, more particularly to a kind of reversion copper foil copper-clad plate.
Background technique
As client is gradually developed to the promotion of product function demand and to small size direction, PCB goes over common winding displacement
Density design has been unable to meet the products application demand of continuous development, and in consumer product demand, route is distributed gradually on PCB
Develop from single lines to hundreds and thousands of route design directions, route design is more and more, but existing copper foil copper-clad plate
Hair side is designed as in conjunction with insulating layer, smooth surface is in pattern transfer process in conjunction with etching resist, it is difficult to meet newly-designed demand,
PCB pattern transfer process difficulty is caused to increase, the bad risk of open lines, notch increases.Therefore, it is necessary to existing copper foil
It improves and optimizes.
Utility model content
A kind of copper-clad plate of application reversion copper foil material that in order to overcome the deficiencies of the prior art, the utility model provides,
So that improve internal layer circuit open circuit, notch provides solution.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
A kind of copper-clad plate of application reversion copper foil material, including inverting copper foil material and etching resist in combination,
Be characterized in that: the reversion copper foil material includes insulating layer and copper layer, and the insulation is placed on centre, and the copper layer overlays on
The two sides of insulating layer, and copper layer side is smooth surface, the other side is the hair side that roughness is greater than smooth surface, the smooth surface and insulating layer
In conjunction with the hair side is towards outside and in conjunction with etching resist.
Further, the copper thickness degree of the insulating layer two sides is identical.
Further, the roughness of the hair side is between 3.5~5um.
Further, the roughness of the hair side is 4um.
Further, the reversion copper foil material two sides are combined with etching resist.
The effective of the utility model is: by the reversion copper foil material, can greatly improve copper face and etch the knot of resist
With joint efforts, so as to improve internal layer circuit open circuit, notch, defect is made to decline 50%.
Detailed description of the invention
Fig. 1 is existing copper foil copper-clad plate cross section structure schematic diagram；
Fig. 2 is the cross section structure schematic diagram that copper foil material is inverted in embodiment.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings and examples.
Referring to figs. 1 to 2, a kind of application inverts the copper-clad plate of copper foil material, including inverts copper foil material and therewith surface knot
The etching resist of conjunction, reversion copper product includes insulating layer 10 and copper layer 20, and the insulating layer 10 is placed in centre, the copper layer
20 overlay on the two sides of insulating layer 10, and 20 side of copper layer is smooth surface 21, and the other side is the hair side 22 that roughness is greater than smooth surface 21,
The smooth surface 21 is combined with insulating layer 10, and the hair side 22 is towards outside and in conjunction with etching resist.10 two sides of insulating layer
20 thickness of copper layer it is identical.The roughness of the hair side 22 can be specifically configured to 4um between 3.5~5um.It is described anti-
Turn copper foil material two sides and is combined with etching resist.By the reversion copper foil material, copper face can be greatly improved and etch resist
Binding force can make defect decline 50% so as to improve internal layer circuit open circuit, notch.
The production technology of above-mentioned copper-clad plate, comprising the following steps:
Anti-oxidant treatment is carried out to the hair side 22 of copper foil layer 20；To prevent hair side 22 from aoxidizing, oxidation rate is reduced, is ensured
Quality；
The smooth surface 21 and insulating layer 10 of copper foil 20 carry out being pressed together to form reversion copper product.
Related reliability test is carried out, to produce the stable reversion copper foil material of mass；
Pattern transfer process by hair side 22 with etching resist in conjunction with；To greatly improve copper face and to etch the combination of resist
Power can make defect decline 50% so as to improve internal layer circuit open circuit, notch.
The above is the better embodiment of the utility model, but the utility model is not limited to above-described embodiment,
As long as its technical effect for reaching the utility model with any same or similar means, should all fall into the protection model of the utility model
Within enclosing.
Claims (5)
1. a kind of copper-clad plate of application reversion copper foil material, special including reversion copper foil material and etching resist in combination
Sign is: the reversion copper foil material includes insulating layer (10) and copper layer (20), and the insulating layer (10) is placed in centre, described
Copper layer (20) overlays on the two sides of insulating layer (10), and copper layer (20) side is smooth surface (21), and the other side is greater than for roughness
The hair side (22) of smooth surface (21), the smooth surface (21) and insulating layer (10) combine, the hair side (22) towards outside and with etching
Resist combines.
2. a kind of copper-clad plate of application reversion copper foil material according to claim 1, it is characterised in that: the insulating layer
(10) copper layer (20) thickness of two sides is identical.
3. a kind of copper-clad plate of application reversion copper foil material according to claim 1 or 2, it is characterised in that: the hair side
(22) roughness is between 3.5~5um.
4. a kind of copper-clad plate of application reversion copper foil material according to claim 3, it is characterised in that: the hair side (22)
Roughness be 4um.
5. a kind of copper-clad plate of application reversion copper foil material according to claim 1, it is characterised in that: the reversion copper foil
Material two sides are combined with etching resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821950982.0U CN209693186U (en) | 2018-11-23 | 2018-11-23 | A kind of copper-clad plate of application reversion copper foil material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821950982.0U CN209693186U (en) | 2018-11-23 | 2018-11-23 | A kind of copper-clad plate of application reversion copper foil material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209693186U true CN209693186U (en) | 2019-11-26 |
Family
ID=68595009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821950982.0U Expired - Fee Related CN209693186U (en) | 2018-11-23 | 2018-11-23 | A kind of copper-clad plate of application reversion copper foil material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209693186U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219257A (en) * | 2018-11-23 | 2019-01-15 | 开平依利安达电子有限公司 | A kind of copper-clad plate and its production technology of application reversion copper foil material |
-
2018
- 2018-11-23 CN CN201821950982.0U patent/CN209693186U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219257A (en) * | 2018-11-23 | 2019-01-15 | 开平依利安达电子有限公司 | A kind of copper-clad plate and its production technology of application reversion copper foil material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191126 Termination date: 20211123 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |