[go: up one dir, main page]

CN209296949U - Millimeter wave/terahertz wave imaging equipment - Google Patents

Millimeter wave/terahertz wave imaging equipment Download PDF

Info

Publication number
CN209296949U
CN209296949U CN201822275858.5U CN201822275858U CN209296949U CN 209296949 U CN209296949 U CN 209296949U CN 201822275858 U CN201822275858 U CN 201822275858U CN 209296949 U CN209296949 U CN 209296949U
Authority
CN
China
Prior art keywords
wave
millimeter wave
millimeter
imaging device
terahertz
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN201822275858.5U
Other languages
Chinese (zh)
Inventor
赵自然
游�燕
金颖康
马旭明
解欢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tsinghua University
Nuctech Co Ltd
Original Assignee
Tsinghua University
Nuctech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsinghua University, Nuctech Co Ltd filed Critical Tsinghua University
Priority to CN201822275858.5U priority Critical patent/CN209296949U/en
Application granted granted Critical
Publication of CN209296949U publication Critical patent/CN209296949U/en
Withdrawn - After Issue legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

公开了一种毫米波/太赫兹波成像设备,包括准光学组件,包括多面体转镜和第三反射板,多面体转镜能够绕其转动轴线转动,以使得多面体转镜上的多个反射板轮流用作第一反射板接收并反射来自第一被检对象的毫米波/太赫兹波波束;多个反射板中的与第一反射板相邻的另一反射板用作第二反射板接收并反射来自第二被检对象的毫米波/太赫兹波波束;斩波器,被配置成在任一时刻仅来自第一反射板或第三反射板反射的来自第二反射板的波束入射到探测器阵列,斩波器绕其中心轴线转动以使来自第一反射板和第三反射板的波束交替地由探测器阵列接收。该设备能够对两个被检对象同时成像,检测效率高、探测器利用率高。

Disclosed is a millimeter-wave/terahertz-wave imaging device, comprising a quasi-optical assembly, including a polygonal rotating mirror and a third reflecting plate, the polygonal rotating mirror can rotate around its rotation axis, so that multiple reflecting plates on the polyhedral rotating mirror take turns It is used as the first reflector to receive and reflect the millimeter wave/terahertz wave beam from the first object to be inspected; another reflector adjacent to the first reflector among the plurality of reflectors is used as the second reflector to receive and reflect Reflecting the millimeter wave/terahertz wave beam from the second object to be inspected; the chopper is configured so that only the beam from the second reflector reflected by the first reflector or the third reflector is incident on the detector at any moment array, the chopper is rotated about its central axis so that the beams from the first reflector and the third reflector are alternately received by the detector array. The device can simultaneously image two inspected objects, and has high detection efficiency and high detector utilization.

Description

毫米波/太赫兹波成像设备Millimeter wave/terahertz wave imaging equipment

技术领域technical field

本公开涉及成像技术领域,特别是涉及一种毫米波/太赫兹波成像设备。The present disclosure relates to the field of imaging technology, in particular to a millimeter wave/terahertz wave imaging device.

背景技术Background technique

在当前国内外防恐形势日益严峻的形势下,恐怖分子利用隐匿方式随身携带刀具、枪支、爆炸物等危险物品对公共安全构成了严重的威胁。基于被动式毫米波/太赫兹波的人体安检技术,具有独特的优点,通过检测目标本身的毫米波/太赫兹波辐射实现成像,无需主动辐射,对人体进行安检,利用毫米波/太赫兹波的穿透能力实现藏匿危险物的检测。然而现有的毫米波/太赫兹波成像设备工作效率低。Under the current increasingly severe anti-terrorism situation at home and abroad, terrorists use hidden methods to carry dangerous items such as knives, guns, and explosives with them, posing a serious threat to public safety. The human body security inspection technology based on passive millimeter wave/terahertz wave has unique advantages. It realizes imaging by detecting the millimeter wave/terahertz wave radiation of the target itself, without active radiation, and performs security inspection on the human body. Penetration capability enables detection of hidden dangers. However, existing millimeter-wave/terahertz-wave imaging devices work inefficiently.

实用新型内容Utility model content

本公开的目的旨在解决现有技术中存在的上述问题和缺陷的至少一个方面。The purpose of the present disclosure is to solve at least one aspect of the above-mentioned problems and disadvantages existing in the prior art.

根据本公开的实施例,提供了一种毫米波/太赫兹波成像设备包括准光学组件、毫米波/太赫兹波探测器阵列和斩波器,According to an embodiment of the present disclosure, there is provided a millimeter-wave/terahertz-wave imaging device including a quasi-optical component, a millimeter-wave/terahertz-wave detector array, and a chopper,

所述准光学组件包括:The quasi-optical components include:

多面体转镜,所述多面体转镜的每个侧面分别设置有反射板,所述多面体转镜能够绕其转动轴线转动,以使得多个反射板轮流用作第一反射板来接收并反射第一被检对象位于第一视场不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束;多个所述反射板中的与所述第一反射板相邻的另一反射板用作第二反射板来接收并反射第二被检对象位于第二视场不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束;和A polyhedron rotating mirror, each side of the polyhedron rotating mirror is provided with a reflection plate respectively, and the polyhedron rotating mirror can rotate around its rotation axis, so that a plurality of reflection plates are used as the first reflection plate in turn to receive and reflect the first Part of the spontaneously radiated or reflected millimeter-wave/terahertz wave beams of the object located at different positions in the first field of view; another reflector adjacent to the first reflector among the plurality of reflectors is used as The second reflecting plate is used to receive and reflect the part of the spontaneous radiation or the reflected millimeter wave/terahertz wave beam of the second object at different positions in the second field of view; and

第三反射板,所述第三反射板适应于将来自所述第二反射板的毫米波//太赫兹波反射到所述斩波器上;a third reflector adapted to reflect millimeter//terahertz waves from said second reflector onto said chopper;

所述斩波器位于所述第一反射板的反射波路和所述第三反射板的反射波路上,所述斩波器被配置成在任一时刻仅来自所述第一反射板的毫米波/太赫兹波或仅来自所述第三反射板的毫米波/太赫兹波反射或透射到所述毫米波/太赫兹波探测器阵列,所述斩波器绕其中心轴线转动以使来自所述第一反射板和所述第三反射板的毫米波/太赫兹波交替地由所述毫米波/太赫兹波探测器阵列接收;以及The chopper is located on the reflected wave path of the first reflector and the reflected wave path of the third reflector, and the chopper is configured to only transmit millimeter waves/waves from the first reflector at any time. The terahertz wave or only the millimeter wave/terahertz wave from the third reflection plate is reflected or transmitted to the millimeter wave/terahertz wave detector array, and the chopper rotates around its central axis to make the The millimeter wave/terahertz wave of the first reflector and the third reflector are alternately received by the millimeter wave/terahertz wave detector array; and

所述毫米波/太赫兹波探测器阵列适用于接收来自所述准光学组件的波束。The millimeter-wave/terahertz-wave detector array is adapted to receive beams from the quasi-optical component.

在一些实施例中,所述准光学组件还包括聚焦透镜,所述聚焦透镜位于所述斩波器和所述毫米波/太赫兹波探测器阵列之间。In some embodiments, the quasi-optical assembly further includes a focusing lens located between the chopper and the millimeter-wave/terahertz-wave detector array.

在一些实施例中,所述准光学组件还包括第一聚焦透镜和第二聚焦透镜,所述第一聚焦透镜位于所述第一反射板和所述斩波器之间,所述第二聚焦透镜位于所述第二反射板和所述第三反射板之间。In some embodiments, the quasi-optical assembly further includes a first focusing lens and a second focusing lens, the first focusing lens is located between the first reflecting plate and the chopper, and the second focusing lens A lens is located between the second reflective plate and the third reflective plate.

在一些实施例中,该毫米波/太赫兹波成像设备还包括吸波材料,所述吸波材料适用于吸收经由所述斩波器反射的来自所述第一反射板的毫米波/太赫兹波,以及经由所述斩波器透射的来自所述第三反射板的毫米波/太赫兹波。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a wave-absorbing material adapted to absorb the millimeter wave/terahertz wave reflected from the first reflecting plate via the chopper wave, and the millimeter wave/terahertz wave from the third reflection plate transmitted through the chopper.

在一些实施例中,所述多面体转镜的所述反射板的数量为m个,其中,6≥m≥3。In some embodiments, the number of the reflecting plates of the polygonal rotating mirror is m, where 6≥m≥3.

在一些实施例中,m个所述反射板与所述转动轴线均是平行的。In some embodiments, the m reflection plates are all parallel to the rotation axis.

在一些实施例中,m个所述反射板与所述转动轴线之间的角度沿着所述多面体转镜的旋转方向递增或递减。In some embodiments, the angles between the m reflection plates and the rotation axis increase or decrease along the rotation direction of the polygon mirror.

在一些实施例中,所述斩波器包括至少一个叶片。In some embodiments, the chopper includes at least one blade.

在一些实施例中,多个所述叶片等间隔地围绕所述中心轴线设置。In some embodiments, a plurality of said blades are equally spaced around said central axis.

在一些实施例中,该毫米波/太赫兹波成像设备还包括壳体,所述准光学组件和所述毫米波/太赫兹波探测器阵列位于所述壳体内,所述壳体的相对侧壁上分别设置有供来自所述第一被检对象的波束穿过的第一窗口和供来自所述第二被检对象的波束穿过的第二窗口。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a housing, the quasi-optical assembly and the millimeter wave/terahertz wave detector array are located in the housing, and the opposite sides of the housing are A first window through which the beam from the first inspected object passes and a second window through which the beam from the second inspected object passes are respectively arranged on the wall.

在一些实施例中,该毫米波/太赫兹波成像设备还包括适用于驱动所述多面体转镜转动的第一驱动装置。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a first driving device adapted to drive the rotation of the polygon mirror.

在一些实施例中,该毫米波/太赫兹波成像设备还包括适用于驱动所述斩波器转动的第二驱动装置。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a second driving device adapted to drive the chopper to rotate.

在一些实施例中,该毫米波/太赫兹波成像设备还包括:In some embodiments, the millimeter wave/terahertz wave imaging device also includes:

数据处理装置,所述数据处理装置与所述毫米波/太赫兹波探测器阵列连接以分别接收来自所述毫米波/太赫兹波探测器阵列的对于所述第一被检对象的图像数据和对于所述第二被检对象的图像数据并分别生成毫米波/太赫兹波图像;和a data processing device, the data processing device is connected to the millimeter wave/terahertz wave detector array to respectively receive the image data and generating millimeter wave/terahertz wave images respectively for the image data of the second inspected object; and

显示装置,所述显示装置与所述数据处理装置相连接,用于接收和显示来自所述数据处理装置的毫米波/太赫兹波图像。A display device, the display device is connected to the data processing device, and is used to receive and display the millimeter wave/terahertz wave image from the data processing device.

在一些实施例中,该毫米波/太赫兹波成像设备还包括报警装置,所述报警装置与所述数据处理装置连接,以使得当所述数据处理装置识别出所述毫米波/太赫兹波图像中的可疑物品时发出指示该毫米波/太赫兹波图像存在可疑物品的警报。In some embodiments, the millimeter wave/terahertz wave imaging device further includes an alarm device connected to the data processing device so that when the data processing device recognizes the millimeter wave/terahertz wave When there are suspicious items in the image, an alarm is issued indicating that there are suspicious items in the millimeter wave/terahertz wave image.

在一些实施例中,该毫米波/太赫兹波成像设备还包括校准源,所述校准源位于所述准光学组件的物面上,所述数据处理装置接收来自所述毫米波/太赫兹波探测器阵列的对于所述校准源的校准数据,并基于所述校准数据更新所述第一被检对象的图像数据和所述第二被检对象的图像数据。In some embodiments, the millimeter-wave/terahertz-wave imaging device further includes a calibration source, the calibration source is located on the object plane of the quasi-optical component, and the data processing device receives data from the millimeter-wave/terahertz-wave Calibration data of the detector array for the calibration source, and updating the image data of the first inspected object and the image data of the second inspected object based on the calibration data.

在一些实施例中,该毫米波/太赫兹波成像设备还包括光学摄像装置,所述光学摄像装置包括适用于采集所述第一被检对象的光学图像的第一光学摄像装置和适用于采集所述第二被检对象的光学图像的第二光学摄像装置,所述第一光学摄像装置和所述第二光学摄像装置分别与所述显示装置连接。In some embodiments, the millimeter wave/terahertz wave imaging device further includes an optical imaging device, the optical imaging device includes a first optical imaging device adapted to acquire an optical image of the first object to be inspected and a first optical imaging device adapted to acquire The second optical camera device for the optical image of the second object under inspection, the first optical camera device and the second optical camera device are respectively connected to the display device.

在一些实施例中,所述显示装置包括显示屏,所述显示屏包括适用于显示所述毫米波/太赫兹波图像的第一显示区以及适用于显示所述光学摄像装置所采集的光学图像的第二显示区。In some embodiments, the display device includes a display screen, and the display screen includes a first display area suitable for displaying the millimeter wave/terahertz wave image and a first display area suitable for displaying the optical image collected by the optical camera device. of the second display area.

根据本公开上述各种实施例所述的毫米波/太赫兹波成像设备,通过驱动多面体转镜绕转动轴线转动,以使得多个反射板轮流用作第一反射板来接收并反射第一被检对象位于第一视场不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束;多个所述反射板中的与所述第一反射板相邻的另一反射板用作第二反射板来接收并反射第二被检对象位于第二视场不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束,从而实现对两个被检对象进行成像,因而提高了检测效率,且探测器利用率高、控制简单、成本低。According to the millimeter-wave/terahertz-wave imaging device described in the above-mentioned various embodiments of the present disclosure, by driving the polygon mirror to rotate around the rotation axis, a plurality of reflectors are used as the first reflector in turn to receive and reflect the first Part of the spontaneously radiated or reflected millimeter-wave/terahertz wave beams of the object located at different positions in the first field of view; another reflector adjacent to the first reflector among the plurality of reflectors is used as the second reflector Two reflecting plates are used to receive and reflect part of the spontaneous radiation or reflected millimeter-wave/terahertz wave beams of the second object located at different positions in the second field of view, so as to realize imaging of the two objects to be inspected, thereby improving detection High efficiency, high detector utilization, simple control and low cost.

附图说明Description of drawings

图1为根据本公开的一实施例的毫米波/太赫兹波成像设备的结构示意图;FIG. 1 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure;

图2为根据本公开的另一实施例的毫米波/太赫兹波成像设备在移除壳体后的结构示意图;FIG. 2 is a schematic structural diagram of a millimeter-wave/terahertz-wave imaging device according to another embodiment of the present disclosure after removing the casing;

图3为根据本公开的一示例性实施例的毫米波/太赫兹波成像设备的多面体转镜的主视图;3 is a front view of a polygon mirror of a millimeter wave/terahertz wave imaging device according to an exemplary embodiment of the present disclosure;

图4为图3所示的多面体转镜的侧视图;Fig. 4 is the side view of the polyhedron rotating mirror shown in Fig. 3;

图5为根据本公开的毫米波/太赫兹波成像设备的斩波器的一示例性实施例的结构示意图;5 is a schematic structural diagram of an exemplary embodiment of a chopper of a millimeter-wave/terahertz-wave imaging device according to the present disclosure;

图6为根据本公开的毫米波/太赫兹波成像设备的斩波器的另一示例性实施例的结构示意图;6 is a schematic structural diagram of another exemplary embodiment of a chopper of a millimeter-wave/terahertz-wave imaging device according to the present disclosure;

图7为根据本公开的毫米波/太赫兹波成像设备的斩波器的再一示例性实施例的结构示意图;FIG. 7 is a schematic structural diagram of yet another exemplary embodiment of a chopper of a millimeter-wave/terahertz-wave imaging device according to the present disclosure;

图8为根据本公开的毫米波/太赫兹波成像设备的斩波器的又一示例性实施例的结构示意图;8 is a schematic structural diagram of another exemplary embodiment of a chopper of a millimeter wave/terahertz wave imaging device according to the present disclosure;

图9为透镜成像的示意图;以及Fig. 9 is a schematic diagram of lens imaging; and

图10为根据本公开的另一实施例的多面体转镜的各反射板与转动轴线之间的角度的示意图;10 is a schematic diagram of the angle between each reflector and the rotation axis of a polyhedral rotating mirror according to another embodiment of the present disclosure;

图11为根据本公开的一个实施例的毫米波/太赫兹波成像设备的总像素、各反射板的扫描像素与稀疏排布的毫米波/太赫兹波探测器阵列的示意图;11 is a schematic diagram of the total pixels of the millimeter wave/terahertz wave imaging device, the scanning pixels of each reflector and the sparsely arranged millimeter wave/terahertz wave detector array according to an embodiment of the present disclosure;

图12为根据本公开的一实施例的毫米波/太赫兹波成像设备对人体或物品进行检查的方法的流程图;以及FIG. 12 is a flowchart of a method for inspecting a human body or an object by a millimeter-wave/terahertz-wave imaging device according to an embodiment of the present disclosure; and

图13是根据本公开的一实施例的毫米波/太赫兹波成像设备的应用场景图。Fig. 13 is an application scene diagram of a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure.

具体实施方式Detailed ways

虽然将参照含有本公开的较佳实施例的附图充分描述本公开,但在此描述之前应了解本领域的普通技术人员可修改本文中所描述的公开,同时获得本公开的技术效果。因此,须了解以上的描述对本领域的普通技术人员而言为一广泛的揭示,且其内容不在于限制本公开所描述的示例性实施例。Although the present disclosure will be fully described with reference to the accompanying drawings containing preferred embodiments of the present disclosure, it should be understood before proceeding that those skilled in the art can modify the disclosure described herein while obtaining the technical effects of the present disclosure. Therefore, it should be understood that the above description is a broad disclosure for those of ordinary skill in the art, and its content is not intended to limit the exemplary embodiments described in the present disclosure.

另外,在下面的详细描述中,为便于解释,阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地,一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下,公知的结构和装置以图示的方式体现以简化附图。In addition, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a comprehensive understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in diagrammatic form to simplify the drawings.

图1示意性地示出了根据本公开的一种示例性实施例的毫米波/太赫兹波成像设备100。如图所示,该毫米波/太赫兹波成像设备100包括准光学组件、斩波器8和毫米波/太赫兹波探测器阵列2,准光学组件包括多面体转镜1,多面体转镜1的每个侧面分别设置有反射板1A、1B、1C、1D,多面体转镜1能够绕其转动轴线o转动,以使得多个反射板1A、1B、1C、1D轮流用作第一反射板来接收并反射第一被检对象31A位于第一视场3A不同位置的部分自发辐射或反射回来的毫米波/太赫兹波;同时多个反射板1A、1B、1C、1D中的与第一反射板相邻的另一反射板用作第二反射板来接收并反射第二被检对象31B位于第二视场3B不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束;该准光学组件还包括第三反射板7,第三反射板7适应于将第二反射板反射的波束反射到斩波器8上。准光学元件还包括第一聚焦透镜4A和第二聚焦透镜4B,该第一聚焦透镜4A适用于汇聚来自第一反射板1A的波束,该第二聚焦透镜4B适用于汇聚来自第二反射板1B的波束。斩波器8位于第一反射板的反射波路和第三反射板7的反射波路上,并且被配置成在任一时刻仅来自第一反射板的毫米波/太赫兹波或仅来自第三反射板7的毫米波/太赫兹波反射或透射到毫米波/太赫兹波探测器阵列2,斩波器8能够绕其中心轴线81转动以使来自第一反射板和第三反射板7的毫米波/太赫兹波交替地由毫米波/太赫兹波探测器阵列2接收。毫米波/太赫兹波探测器阵列2适用于接收来自准光学组件反射并汇聚后的波束;毫米波/太赫兹波探测器阵列2中的探测器的个数根据所需的视场3A、3B大小以及所需分辨率确定,其排布方向与视场法线垂直且平行于水平面,探测器的大小根据波长、加工工艺以及所需采样密度确定。FIG. 1 schematically shows a millimeter-wave/terahertz-wave imaging device 100 according to an exemplary embodiment of the present disclosure. As shown in the figure, the millimeter-wave/terahertz-wave imaging device 100 includes a quasi-optical component, a chopper 8, and a millimeter-wave/terahertz-wave detector array 2. The quasi-optical component includes a polygonal rotating mirror 1. Reflecting plates 1A, 1B, 1C, and 1D are respectively provided on each side, and the polygon mirror 1 can rotate around its rotation axis o, so that multiple reflecting plates 1A, 1B, 1C, and 1D are used in turn as the first reflecting plate to receive And reflect the part of the spontaneous radiation or the reflected millimeter wave/terahertz wave of the first object 31A located at different positions in the first field of view 3A; at the same time, the first reflecting plate among the multiple reflecting plates 1A, 1B, 1C, and 1D Another adjacent reflecting plate is used as a second reflecting plate to receive and reflect part of the spontaneous radiation or reflected millimeter-wave/terahertz wave beams of the second object 31B located at different positions in the second field of view 3B; the quasi-optical The assembly also includes a third reflector 7 adapted to reflect the beam reflected by the second reflector onto the chopper 8 . The quasi-optical element also includes a first focusing lens 4A and a second focusing lens 4B, the first focusing lens 4A is suitable for converging the beam from the first reflecting plate 1A, and the second focusing lens 4B is suitable for converging the beam from the second reflecting plate 1B beam. The chopper 8 is located on the reflection wave path of the first reflection plate and the reflection wave path of the third reflection plate 7, and is configured so that only the millimeter wave/terahertz wave from the first reflection plate or only from the third reflection plate at any moment The millimeter wave/terahertz wave of 7 is reflected or transmitted to the millimeter wave/terahertz wave detector array 2, and the chopper 8 can rotate around its central axis 81 to make the millimeter wave from the first reflecting plate and the third reflecting plate 7 The /terahertz waves are alternately received by the millimeter wave/terahertz wave detector array 2 . The millimeter-wave/terahertz-wave detector array 2 is suitable for receiving reflected and converged beams from quasi-optical components; the number of detectors in the millimeter-wave/terahertz-wave detector array 2 depends on the required field of view 3A, 3B The size and the required resolution are determined, and its arrangement direction is perpendicular to the normal of the field of view and parallel to the horizontal plane. The size of the detector is determined according to the wavelength, processing technology and required sampling density.

根据本公开的实施例的毫米波/太赫兹波成像设备,通过驱动多面体转镜1绕其转动轴线o转动,以使得多个反射板1A、1B、1C、1D轮流用作第一反射板来接收并反射第一被检对象31A位于第一视场3A不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束;多个所述反射板1A、1B、1C、1D中的与所述第一反射板相邻的另一反射板用作第二反射板来接收并反射第二被检对象31B位于第二视场3B不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束,在多面体转镜1转动的过程中,通过斩波器8将来自第一视场3A和第二视场3B的毫米波/太赫兹波交替地切换到同一个毫米波/太赫兹波探测器阵列2,从而实现对位于两个视场3A、3B的两个被检对象31A、31B进行成像的同时,可以降低毫米波/太赫兹波探测器的数量,以降低设备成本,且占地空间小。According to the millimeter-wave/terahertz-wave imaging device according to the embodiment of the present disclosure, the polyhedral rotating mirror 1 is driven to rotate around its rotation axis o so that a plurality of reflecting plates 1A, 1B, 1C, and 1D are used as the first reflecting plate in turn. receiving and reflecting the part of the spontaneously radiated or reflected millimeter wave/terahertz wave beams of the first object 31A located at different positions in the first field of view 3A; Another reflector adjacent to the first reflector is used as a second reflector to receive and reflect part of the spontaneous radiation or reflected millimeter wave/terahertz wave of the second object 31B located at different positions in the second field of view 3B. The beam, during the rotation of the polygon mirror 1, switches the millimeter wave/terahertz wave from the first field of view 3A and the second field of view 3B alternately to the same millimeter wave/terahertz wave detection through the chopper 8 Detector array 2, so as to realize imaging of two objects 31A, 31B located in two fields of view 3A, 3B, while reducing the number of millimeter wave/terahertz wave detectors, so as to reduce equipment cost and occupy an area Small space.

在该实施例中,聚焦透镜4包括第一聚焦透镜4A和第二聚焦透镜4B,第一聚焦透镜4A位于第一反射板和斩波器8之间,第二聚焦透镜4B位于第二反射板和第三反射板7之间,两个聚焦透镜4A、4B的焦距分别为f1、f2,其中f1与f2的大小可以是一样的,也可以是不一样的。由于斩波器8放置在经过聚焦透镜4A、4B聚焦后的波路中,因此斩波器8的叶片82的尺寸可以较小,在这种情况下,斩波器8的叶片82的具体尺寸由经过聚焦透镜4A、4B聚焦后在预放置斩波器8的地方的束斑大小决定。假设经过聚焦透镜4A、4B聚焦后在预放置斩波器8的地方的束斑半径为Wcut,那么斩波器8的叶片82的尺寸(面积)选择为 In this embodiment, the focusing lens 4 includes a first focusing lens 4A and a second focusing lens 4B, the first focusing lens 4A is located between the first reflecting plate and the chopper 8, and the second focusing lens 4B is located between the second reflecting plate Between the third reflecting plate 7 and the focal lengths of the two focusing lenses 4A and 4B are f1 and f2 respectively, where the sizes of f1 and f2 may be the same or different. Since the chopper 8 is placed in the wave path focused by the focusing lenses 4A, 4B, the size of the blade 82 of the chopper 8 can be relatively small. In this case, the specific size of the blade 82 of the chopper 8 is given by After being focused by the focusing lenses 4A and 4B, the size of the beam spot at the place where the chopper 8 is pre-placed is determined. Assuming that the beam spot radius at the place where the chopper 8 is pre-placed after being focused by the focusing lenses 4A and 4B is W cut , the size (area) of the blade 82 of the chopper 8 is selected as

需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,如图2所示,也可以采用一个聚焦透镜4,该聚焦透镜4位于斩波器8和毫米波/太赫兹波探测器阵列2之间。在这种情况下,由于斩波器8放置在未聚焦的波路中,所以其叶片82的尺寸大小应与多面体转镜的反射面相匹配。It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, as shown in FIG. Between 2 terahertz wave detector arrays. In this case, since the chopper 8 is placed in the unfocused wave path, the size of its blades 82 should match the reflective surface of the polygon mirror.

在图1和图2所示的示例性实施中,该毫米波/太赫兹波成像设备还包括吸波材料9,该吸波材料9适用于吸收经由斩波器8反射的来自第一反射板的毫米波/太赫兹波,以及经由斩波器8透射的来自第三反射板7的毫米波/太赫兹波。In the exemplary implementation shown in FIG. 1 and FIG. 2, the millimeter wave/terahertz wave imaging device further includes a wave-absorbing material 9, which is suitable for absorbing millimeter wave/terahertz wave, and the millimeter wave/terahertz wave from the third reflector 7 transmitted through the chopper 8.

在图1和图2所示的示例性实施例中,每个反射板1A、1B、1C、1D为长方形,其长度和宽度应与相应的聚焦透镜4A、4B相匹配,通常情况下,每个反射板1A、1B、1C、1D的宽度大于或等于相应的聚焦透镜4A、4B的直径,每个反射板1A、1B、1C、1D的长度应为其宽度的倍,聚焦透镜4A、4B的直径例如可以为3cm-50cm。In the exemplary embodiment shown in Fig. 1 and Fig. 2, each reflecting plate 1A, 1B, 1C, 1D is rectangular, and its length and width should match the corresponding focusing lens 4A, 4B, usually, each The width of each reflection plate 1A, 1B, 1C, 1D is greater than or equal to the diameter of the corresponding focusing lens 4A, 4B, and the length of each reflection plate 1A, 1B, 1C, 1D should be its width times, the diameter of the focusing lenses 4A, 4B can be, for example, 3cm-50cm.

如图1所示,在一种示例性实施例中,该毫米波/太赫兹波成像设备还包括壳体6,准光学组件和毫米波/太赫兹波探测器阵列2位于壳体6内,壳体6的相对侧壁上分别设置有供第一被检对象31A自发辐射的毫米波/太赫兹波穿过的第一窗口61A和供第二被检对象31B自发辐射的毫米波/太赫兹波穿过的第二窗口61B。As shown in FIG. 1 , in an exemplary embodiment, the millimeter wave/terahertz wave imaging device further includes a casing 6, and the quasi-optical components and the millimeter wave/terahertz wave detector array 2 are located in the casing 6, On the opposite side walls of the casing 6 are respectively provided with a first window 61A through which the millimeter wave/terahertz wave spontaneously radiated by the first subject 31A passes through and a millimeter wave/terahertz wave through which the second subject 31B spontaneously radiates. The wave passes through the second window 61B.

如图3和图4所示,在一种示例性实施例中,多面体透镜1还包括转轴11,转轴11的两端经由轴承10A、10B与壳体6可转动地连接,以使得多面体转镜1能够转动,从而使得第一反射板和第二反射板分别对来自被检对象31A、31B位于视场3A、3B不同竖直位置的部分的波束进行反射。As shown in Fig. 3 and Fig. 4, in an exemplary embodiment, the polyhedron lens 1 further includes a rotating shaft 11, and the two ends of the rotating shaft 11 are rotatably connected with the housing 6 via bearings 10A, 10B, so that the polyhedron rotating mirror 1 can be rotated, so that the first reflecting plate and the second reflecting plate respectively reflect the beams from the parts of the inspected objects 31A, 31B located at different vertical positions in the field of view 3A, 3B.

如图3和图4所示,在一种示例性实施例中,该毫米波/太赫兹波成像设备还包括适用于驱动转轴11转动的第一驱动装置13,例如伺服电机。As shown in FIG. 3 and FIG. 4 , in an exemplary embodiment, the millimeter wave/terahertz wave imaging device further includes a first driving device 13 suitable for driving the rotation shaft 11 , such as a servo motor.

如图3和图4所示,在一种示例性实施例中,该毫米波/太赫兹波成像设备还包括实时检测多面体转镜1的角位移的角位移测量机构12,例如光电码盘,以便准确地计算出多面体转镜1的姿态,这可以在相当程度上减小控制算法和成像算法的研制难度。As shown in Figures 3 and 4, in an exemplary embodiment, the millimeter wave/terahertz wave imaging device also includes an angular displacement measuring mechanism 12 for real-time detection of the angular displacement of the polygon mirror 1, such as a photoelectric code disc, In order to accurately calculate the attitude of the polyhedral rotating mirror 1, this can considerably reduce the difficulty of developing control algorithms and imaging algorithms.

图5至图8分别示出了几种斩波器的结构示意图,斩波器8包括至少一个叶片,例如1个、2个、3个和4个等,多个叶片82等间隔地围绕中心轴线81设置。在斩波器8绕其中心轴线81旋转的过程中,在任一时刻当来自第一反射板的毫米波/太赫兹波入射到斩波器8的叶片82上,该叶片82将来自第一反射板的毫米波/太赫兹波反射到吸波材料9,以由吸波材料9吸收,同时将来自第三反射板7的毫米波/太赫兹波反射到毫米波/太赫兹波探测器阵列2。随着斩波器8绕其中心轴线81的旋转,在下一时刻,来自第一反射板的毫米波/太赫兹波入射到斩波器8未设置有叶片82的部分(即空的部分),以透射到毫米波/太赫兹波探测器阵列2,该斩波器8未设置有叶片82的部分同时将来自第三反射板7的毫米波/太赫兹波透射到吸波材料9,以由吸波材料9吸收,依次循环下去。Fig. 5 to Fig. 8 respectively show the structural diagrams of several kinds of choppers, chopper 8 comprises at least one blade, for example 1, 2, 3 and 4 etc., a plurality of blades 82 are equally spaced around the center Axis 81 is provided. During the rotation of the chopper 8 around its central axis 81, at any moment when the millimeter wave/terahertz wave from the first reflection plate is incident on the blade 82 of the chopper 8, the blade 82 will come from the first reflected The millimeter wave/terahertz wave of the plate is reflected to the wave absorbing material 9 to be absorbed by the wave absorbing material 9, and at the same time, the millimeter wave/terahertz wave from the third reflecting plate 7 is reflected to the millimeter wave/terahertz wave detector array 2 . As the chopper 8 rotates around its central axis 81, at the next moment, the millimeter wave/terahertz wave from the first reflecting plate is incident on the part of the chopper 8 that is not provided with the blade 82 (ie, the empty part), To transmit to the millimeter wave/terahertz wave detector array 2, the part of the chopper 8 that is not provided with the blade 82 transmits the millimeter wave/terahertz wave from the third reflector 7 to the wave-absorbing material 9, so that the The wave-absorbing material 9 absorbs and circulates successively.

需要说明的是,斩波器8也可以由能够快速切换到高反射和高透射状态的其它装置来代替。It should be noted that the chopper 8 can also be replaced by other devices capable of quickly switching between high reflection and high transmission states.

在图1和图2所示的示例性实施例中,斩波器8与来自第一反射板的波路和来自第三反射板7的波路均呈45度夹角放置。需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,斩波器8与来自第一反射板的波路和来自第三反射板7的波路也可以呈其它角度放置。In the exemplary embodiment shown in FIG. 1 and FIG. 2 , the chopper 8 is placed at an angle of 45 degrees to both the wave path from the first reflection plate and the wave path from the third reflection plate 7 . It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the chopper 8 and the wave path from the first reflector and the wave path from the third reflector 7 can also be placed at other angles .

在未示出的一种示例性实施例中,该毫米波/太赫兹波成像设备100还包括适用于驱动斩波器8转动的第二驱动装置,例如伺服电机,以驱动斩波器8绕其中心轴线81高速旋转,斩波器8的旋转周期应与多面体转镜1的扫描周期相匹配,以使得对该毫米波/太赫兹波成像设备100能够同时对两个视场3A、3B的两个被检对象分别进行成像,优选斩波器8的旋转周期为多面体转镜的扫描周期的1/1000-1/2。In an exemplary embodiment not shown, the millimeter wave/terahertz wave imaging device 100 further includes a second driving device suitable for driving the chopper 8 to rotate, such as a servo motor, so as to drive the chopper 8 to rotate Its central axis 81 rotates at a high speed, and the rotation period of the chopper 8 should match the scanning period of the polygon mirror 1, so that the millimeter wave/terahertz wave imaging device 100 can simultaneously detect the two fields of view 3A, 3B. The two inspected objects are respectively imaged, and the rotation period of the chopper 8 is preferably 1/1000-1/2 of the scanning period of the polygon mirror.

在该实施例中,探测器的静态视场为水平视场,假定探测器的个数为N,两个相邻的探测器的中心间距d时,则探测器的最大偏馈距离ym,则In this embodiment, the static field of view of the detector is the horizontal field of view, assuming that the number of detectors is N, and when the distance between the centers of two adjacent detectors is d, the maximum offset distance of the detector is y m , but

由此可以计算出毫米波/太赫兹波探测器阵列2的静态视场为H0。如图9所示,毫米波/太赫兹波探测器阵列2的静态视场H0与物距L1、像距L2需要满足如下关系式From this, the static field of view of the millimeter wave/terahertz wave detector array 2 can be calculated as H 0 . As shown in Figure 9, the static field of view H 0 , the object distance L 1 , and the image distance L 2 of the millimeter wave/terahertz wave detector array 2 need to satisfy the following relationship

多面体转镜1绕着其转动轴线o转动,数据采集的角度大小根据需要扫描的被检对象31的高度方向的视场范围决定,假设高度方向所需的成像视场对于的角度方位为θm,那么对应的扫描视场角度为θrot=θm/2。The polyhedral rotating mirror 1 rotates around its rotation axis o, and the angle of data acquisition is determined according to the field of view range in the height direction of the object 31 to be scanned. It is assumed that the angle and orientation of the imaging field of view required in the height direction is θ m , then the corresponding scanning field angle is θ rotm /2.

第一反射板1A(第二反射板1B)完成对相应的被检对象31A(31B)所在的视场竖直范围的反射所需要摆动的次数Nv通过下式计算:The number of swings Nv required for the first reflector 1A (second reflector 1B) to complete the reflection of the vertical range of the field of view where the corresponding object 31A (31B) is located is calculated by the following formula:

式中,[]表示向上取整;In the formula, [] represents rounding up;

L为视场3A(3B)的中心到第一反射板1A(第二反射板1B)的中心的距离;L is the distance from the center of the field of view 3A (3B) to the center of the first reflector 1A (second reflector 1B);

δ表示物方分辨率;δ represents the object space resolution;

θm为竖直视场范围打所对应的视场角度。θ m is the field of view angle corresponding to the vertical field of view range.

多面体转镜1旋转一个周期对每个视场完成m幅图像的采集,其中,m为多面体转镜的反射板的数量。The polygonal rotating mirror 1 rotates in one cycle to collect m images for each field of view, where m is the number of reflecting plates of the polygonal rotating mirror.

高度方向采样密度决定于波束驻留时间,多面体转镜1转动1个周期两个视场方向各输出m副图像。假设探测器的角分辨率为θres,多面体转镜1转动θrot所包含的3dB波束数为n=360°/θres (4)The sampling density in the height direction is determined by the dwell time of the beam. The polyhedral rotating mirror 1 rotates for one cycle and outputs m images in each of the two viewing field directions. Assuming that the angular resolution of the detector is θ res , the number of 3dB beams contained in the rotation θ rot of the polyhedral rotating mirror 1 is n=360°/θ res (4)

假设成像速率要求为mHz,则每个采样波束的在高度方向的平均驻留时间τdAssuming that the imaging rate requirement is mHz, the average dwell time τ d of each sampling beam in the height direction is

以成像距离系统3000mm处,角分辨率θres=0.57°,则物方分辨率为δ=30mm,成像速率10Hz为例,可以求得高度方向采集的步数为约67个,平均每个波束驻留时间为τd=100ms/67=1.47ms。Taking the imaging distance from the system at 3000mm, the angular resolution θ res = 0.57°, the object space resolution is δ = 30mm, and the imaging rate is 10Hz as an example, the number of acquisition steps in the height direction can be obtained to be about 67, and the average The dwell time is τd = 100ms/67 = 1.47ms .

在一种示例性实施例中,工作在中心频率为94GHz的毫米波/太赫兹波成像设备100,探测器个数N=30个,排成一列,探测器的中心间距d=7mm,探测器阵列长度2ym=21cm。物距L1=3.5m,像距L2=0.7m,根据公式(2)可以计算出静态视场H0=105cm。假设成像区域高度方向大小为1.8m,那么用于重建图像的高度方向的扫描角度为θm=34°。In an exemplary embodiment, the millimeter-wave/terahertz-wave imaging device 100 operating at a center frequency of 94 GHz has N=30 detectors arranged in a row, and the distance between the centers of the detectors is d=7 mm. Array length 2y m = 21 cm. The object distance L 1 =3.5m, the image distance L 2 =0.7m, and the static field of view H 0 =105cm can be calculated according to formula (2). Assuming that the size of the imaging area in the height direction is 1.8 m, then the scanning angle in the height direction used to reconstruct the image is θ m =34°.

在另一示例性实施例中,工作在中心频率为220GHz的毫米波/太赫兹波成像设备100,探测器个数N=48个,排成一列,探测器的中心间d=3mm,探测器阵列长度2ym=14.4cm。物距Ll=5m,像距L2=0.7m,根据公式(2)可以计算出静态视场H0=103cm。假设成像区域高度方向大小为1.8m,那么用于重建图像的高度方向的扫描角度为θm=20°。In another exemplary embodiment, the millimeter-wave/terahertz-wave imaging device 100 working at a center frequency of 220 GHz has N=48 detectors arranged in a row, and the distance between the centers of the detectors is d=3 mm. Array length 2y m = 14.4 cm. Object distance L 1 =5m, image distance L 2 =0.7m, according to formula (2), the static field of view H 0 =103cm can be calculated. Assuming that the size of the imaging area in the height direction is 1.8 m, then the scanning angle in the height direction used to reconstruct the image is θ m =20°.

在图1至图3所示的示例性实施例中,多面体转镜1包括4个反射板1A、1B、1C、1D,4个反射板与转动轴线o均是平行的。需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,多面体转镜1也可以包括其它数量的反射板,优选反射板的数量m为3至6个。此外,在某些实施例中,m个反射板与转动轴线o之间的角度可以沿着多面体转镜1的旋转方向以α的增量递增或递减,以实现像素差值,这样可以将毫米波/太赫兹波探测器阵列2的探测器稀疏分布(如图11所示),从而降低探测器的数量。In the exemplary embodiment shown in FIGS. 1 to 3 , the polygonal rotating mirror 1 includes four reflecting plates 1A, 1B, 1C, and 1D, and the four reflecting plates are all parallel to the rotation axis o. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the polygonal rotating mirror 1 may also include other numbers of reflecting plates, preferably the number m of reflecting plates is 3 to 6. In addition, in some embodiments, the angles between the m reflecting plates and the rotation axis o can be increased or decreased in increments of α along the rotation direction of the polygonal mirror 1 to realize the pixel difference, so that mm The detectors of the wave/terahertz wave detector array 2 are sparsely distributed (as shown in FIG. 11 ), thereby reducing the number of detectors.

其中α由下列等式算出:where α is calculated by the following equation:

式中,λ为毫米波/太赫兹波的波长,In the formula, λ is the wavelength of millimeter wave/terahertz wave,

D为椭球面反射镜等效透镜9的直径。D is the diameter of the equivalent lens 9 of the ellipsoid reflector.

需要说明的是,上式只是一个透镜理想聚集下的角分辨率估算公式。在实际的系统中应该根据实验结果,微调α的大小,使得最终的像素排列尽可能均匀且无重叠与空隙。也就是说多面体转镜1上的反射板1A、1B、1C、1D与转动轴线o之间的角度是可微调的。It should be noted that the above formula is only a formula for estimating angular resolution under ideal lens gathering. In the actual system, the size of α should be fine-tuned according to the experimental results, so that the final pixel arrangement is as uniform as possible without overlapping and gaps. That is to say, the angles between the reflection plates 1A, 1B, 1C, 1D on the polygonal rotating mirror 1 and the rotation axis o can be finely adjusted.

如图10所示,在一种示例性实施例中,4个反射板1A、1B、1C、1D与转动轴线o之间的角度大小沿着多面体转镜1的旋转方向递增。第1个反射板1A与转动轴线o之间的角度θ为第2个反射板与转动轴线o之间的角度为第3个反射板1C与转动轴线o之间的角度θ为第4个反射板1D与转动轴线o之间的角度θ为需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,4个反射板1A、1B、1C、1D与转动轴线o之间的角度θ大小也可以沿着多面体转镜1的旋转方向递减。As shown in FIG. 10 , in an exemplary embodiment, the angles between the four reflecting plates 1A, 1B, 1C, 1D and the rotation axis o increase gradually along the rotation direction of the polygon mirror 1 . The angle θ between the first reflector 1A and the rotation axis o is The angle between the second reflector and the rotation axis o is The angle θ between the third reflecting plate 1C and the rotation axis o is The angle θ between the fourth reflector 1D and the rotation axis o is It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the angle θ between the four reflecting plates 1A, 1B, 1C, 1D and the rotation axis o can also be rotated along the polyhedron. The rotation direction of mirror 1 is decreasing.

在一些实施例中,当m为奇数时,m个反射板中沿多面体转镜1的旋转方向的第1个反射板与转动轴线o之间的角度θ为0°,第个反射板与转动轴线o之间的角度θ为个反射板与转动轴线o之间的角度θ为例如,当m为3时,第1个反射板1A与转动轴线o之间的角度θ为0°,第2个反射板1B与转动轴线o之间的角度θ为+α,第3个反射板1C与转动轴线o之间的角度θ为-α。In some embodiments, when m is an odd number, the angle θ between the first reflector and the rotation axis o of the m reflectors along the rotation direction of the polyhedral rotating mirror 1 is 0°, and the first The angle θ between a reflector and the rotation axis o is No. The angle θ between a reflector and the rotation axis o is For example, when m is 3, the angle θ between the first reflector 1A and the rotation axis o is 0°, the angle θ between the second reflector 1B and the rotation axis o is +α, and the third reflection The angle θ between the plate 1C and the axis of rotation o is -α.

在一些实施例中,当m为偶数时,m个反射板中沿旋转方向的第1个反射板与转动轴线o之间的角度θ为个反射板与转动轴线o之间的角度θ为个反射板与转动轴线o之间的角度θ为 In some embodiments, when m is an even number, the angle θ between the first reflector in the rotation direction and the rotation axis o among the m reflectors is No. The angle θ between a reflector and the rotation axis o is No. The angle θ between a reflector and the rotation axis o is

在一种示例性实施例中,该毫米波/太赫兹波成像设备100还包括数据处理装置(未示出)。该数据处理装置与毫米波/太赫兹波探测器阵列2无线连接或有线连接以分别接收毫米波/太赫兹波探测器阵列2所接收的关于第一被检对象31A和关于第二被检对象31B的图像数据。In an exemplary embodiment, the millimeter wave/terahertz wave imaging device 100 further includes a data processing device (not shown). The data processing device is wirelessly or wiredly connected to the millimeter-wave/terahertz-wave detector array 2 to receive data about the first object 31A and about the second object received by the millimeter-wave/terahertz-wave detector array 2 respectively. 31B of image data.

在一个示例性实施例中,该成像设备还可以包括显示装置,该显示装置与数据处理装置相连接,用于接收和显示来自数据处理装置的毫米波/太赫兹波图像。In an exemplary embodiment, the imaging device may further include a display device connected to the data processing device for receiving and displaying the millimeter wave/terahertz wave image from the data processing device.

如图1所示,在一种示例性实施例中,该毫米波/太赫兹波成像设备100还包括校准源5,该校准源5位于壳体6内并在准光学组件的物面上,以通过毫米波/太赫兹波探测器阵列2接收关于校准源5的校准数据,数据处理装置接收毫米波/太赫兹波探测器阵列2所接收的关于校准源5的校准数据,并基于校准数据实时地更新第一被检对象31A和第二被检对象31B的图像数据。由于校准源5封装在壳体1内部,因此使得该毫米波/太赫兹波成像设备100比采用远处的空气进行校准更加稳定可靠。As shown in FIG. 1, in an exemplary embodiment, the millimeter wave/terahertz wave imaging device 100 further includes a calibration source 5, the calibration source 5 is located in the housing 6 and on the object plane of the quasi-optical assembly, To receive the calibration data about the calibration source 5 through the millimeter wave/terahertz wave detector array 2, the data processing device receives the calibration data about the calibration source 5 received by the millimeter wave/terahertz wave detector array 2, and based on the calibration data The image data of the first inspected object 31A and the second inspected object 31B are updated in real time. Since the calibration source 5 is packaged inside the housing 1 , the millimeter wave/terahertz wave imaging device 100 is more stable and reliable than using remote air for calibration.

在该实施例中,校准源5位于多面体转镜1的斜上方,需要说明的是,校准源5的位置只要使得毫米波/太赫兹波探测器阵列2接收关于校准源5的校准数据和被检对象31A、31B的图像数据不相互干涉即可,校准源5辐射的波束经由反射板反射到毫米波/太赫兹波探测器阵列2,这样可以实现对包含聚焦透镜4和探测器的完整接收通道的校准,进一步保证了通道的一致性。In this embodiment, the calibration source 5 is located obliquely above the polygonal rotating mirror 1. It should be noted that the position of the calibration source 5 only needs to make the millimeter wave/terahertz wave detector array 2 receive the calibration data about the calibration source 5 and be The image data of the inspection objects 31A and 31B need not interfere with each other, and the beam radiated by the calibration source 5 is reflected to the millimeter-wave/terahertz-wave detector array 2 through the reflector, so that complete reception of the focusing lens 4 and the detector can be realized. The calibration of the channel further ensures the consistency of the channel.

在图1和图2所示的示例性实施例中,多面体转镜1的转轴11水平设置,以使得第一反射板、第二反射板对来自相应的被检对象31A、31B位于视场不同竖直位置的部分的波束进行反射。需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,多面体转镜1的转轴11也可以竖直设置,以使得第一反射板、第二反射板对来自相应的被检对象31A、31B位于视场不同水平位置的部分的波束进行反射。此外,校准源5可以是塑料、泡沫等发射率接近于1的吸波材料,也可以采用黑体或半导体致冷器等。In the exemplary embodiment shown in FIG. 1 and FIG. 2 , the rotating shaft 11 of the polygonal rotating mirror 1 is arranged horizontally, so that the first reflector and the second reflector are located in different fields of view from the corresponding inspected objects 31A and 31B. The part of the beam in the vertical position is reflected. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the rotating shaft 11 of the polygonal rotating mirror 1 can also be vertically arranged, so that the first reflector and the second reflector pair come from the corresponding The beams of the parts of the inspected objects 31A and 31B located at different horizontal positions in the field of view are reflected. In addition, the calibration source 5 can be a wave-absorbing material with an emissivity close to 1, such as plastic or foam, or a black body or a semiconductor refrigerator can be used.

由奈奎斯特采样定律,在一个半功率波束宽度内至少有两个采样点才能完全恢复图像。该实施例中的毫米波/太赫兹波探测器阵列2的排布方向与视场法线垂直且平行于水平面,以对高度方向的视场进行采样,毫米波/太赫兹波探测器阵列2的排列密度决定采样密度。毫米波成像系统所成图像实际为灰度图像,其空间采样率在达不到奈奎斯特采样要求(欠采样)时,仍然可以对目标场景成像,只是成像效果相对较差。为了弥补欠采样所带来的像素缺失,可以在后期信号处理时采用插值算法增加数据密度。According to the Nyquist sampling law, there are at least two sampling points within a half-power beamwidth to fully restore the image. The arrangement direction of the millimeter wave/terahertz wave detector array 2 in this embodiment is perpendicular to the field of view normal and parallel to the horizontal plane, so as to sample the field of view in the height direction, and the millimeter wave/terahertz wave detector array 2 The arrangement density of determines the sampling density. The image formed by the millimeter-wave imaging system is actually a grayscale image. When the spatial sampling rate does not meet the Nyquist sampling requirement (undersampling), the target scene can still be imaged, but the imaging effect is relatively poor. In order to compensate for the lack of pixels caused by undersampling, an interpolation algorithm can be used to increase the data density in the later signal processing.

如图1所示,在一种示例性实施例中,校准源5的长度方向平行于多面体转镜1的转轴11,校准源5的长度大于等于毫米波/太赫兹波探测器阵列2在平行于转轴11方向上的视场大小,校准源5的宽度为毫米波/太赫兹波探测器2的天线波束宽度的10倍。然而,需要说明的是,本领域的技术人员应当理解,校准源5的宽度也可以为毫米波/太赫兹波探测器的天线波束宽度的1倍或2倍或其它倍数。As shown in Figure 1, in an exemplary embodiment, the length direction of the calibration source 5 is parallel to the rotation axis 11 of the polygon mirror 1, and the length of the calibration source 5 is greater than or equal to that of the millimeter wave/terahertz wave detector array 2 in parallel For the size of the field of view in the direction of the rotating axis 11 , the width of the calibration source 5 is 10 times the width of the antenna beam of the millimeter wave/terahertz wave detector 2 . However, it should be noted that those skilled in the art should understand that the width of the calibration source 5 may also be 1 or 2 times or other multiples of the antenna beam width of the millimeter wave/terahertz wave detector.

在一种实施例中,该毫米波/太赫兹波成像设备100还包括光学摄像装置,该光学摄像装置包括适用于采集第一被检对象31A的光学图像的第一光学摄像装置和适用于采集第二被检对象31B的光学图像的第二光学摄像装置,该光学摄像装置与显示装置连接,该光学摄像装置可以实现可见光实时成像,给出第一被检对象31A和第二被检对象31B的图像信息,以与毫米波/太赫兹波图像进行对照,以供使用者参考。In one embodiment, the millimeter wave/terahertz wave imaging device 100 further includes an optical imaging device, the optical imaging device includes a first optical imaging device adapted to acquire an optical image of the first object 31A to be inspected and a first optical imaging device adapted to acquire The second optical imaging device of the optical image of the second inspected object 31B, the optical imaging device is connected with the display device, the optical imaging device can realize visible light real-time imaging, and presents the first inspected object 31A and the second inspected object 31B Image information for comparison with millimeter-wave/terahertz-wave images for user reference.

在未示出的一种示例性实施例中,显示装置包括显示屏,显示屏包括适用于显示第一被检对象31A和第二被检对象31B的毫米波/太赫兹波图像的第一显示区以及适用于显示光学摄像装置所采集的第一被检对象31A和第二被检对象31B的光学图像的第二显示区,以便于使用者将光学摄像装置所采集的光学图像和毫米波/太赫兹波图像进行对比。In an exemplary embodiment not shown, the display device includes a display screen including a first display suitable for displaying millimeter-wave/terahertz-wave images of the first inspected object 31A and the second inspected object 31B. area and a second display area suitable for displaying the optical images of the first inspected object 31A and the second inspected object 31B collected by the optical imaging device, so that the user can combine the optical images collected by the optical imaging device with the millimeter wave/ Terahertz wave images for comparison.

在未示出的一种示例性实施例中,该毫米波/太赫兹波成像设备100还包括报警装置,该报警装置与数据处理装置连接,以使得当识别出第一被检对象31A和/或第二被检对象31B的毫米波/太赫兹波图像中的可疑物品时,例如在相应的被检对象所对应的毫米波/太赫兹波图像的下方发出警报例如报警灯亮起,需要说明的是,也可以采用声音提示的报警方式。In an exemplary embodiment not shown, the millimeter wave/terahertz wave imaging device 100 further includes an alarm device connected to the data processing device so that when the first object 31A and/or or suspicious items in the millimeter-wave/terahertz-wave image of the second inspected object 31B, for example, an alarm is issued below the millimeter-wave/terahertz-wave image corresponding to the corresponding inspected object. Yes, the alarm method of sound prompt can also be adopted.

在一个示例性实施例中,数据处理装置可以用于生成控制信号并将控制信号发送给第一驱动装置13和第二驱动装置,以分别驱动多面体转镜和斩波器8转动。在另一示例性实施例中,成像设备也可以包括与数据处理装置相独立的控制装置。In an exemplary embodiment, the data processing device can be used to generate a control signal and send the control signal to the first driving device 13 and the second driving device, so as to respectively drive the rotation of the polygon mirror and the chopper 8 . In another exemplary embodiment, the imaging device may also include a control device independent of the data processing device.

如图12所示,本公开还提供了一种利用毫米波/太赫兹波成像设备100对人体或物品进行检测的方法,包括以下步骤:As shown in FIG. 12 , the present disclosure also provides a method for detecting a human body or an object using a millimeter wave/terahertz wave imaging device 100, including the following steps:

S1:驱动多面体转镜1转动,以使得多个反射板1A、1B、1C、1D轮流用作第一反射板来接收并反射第一被检对象31A位于第一视场3A不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束;多个所述反射板1A、1B、1C、1D中的与所述第一反射板相邻的另一反射板用作第二反射板来接收并反射第二被检对象31B位于第二视场3B不同位置的部分自发辐射或反射回来的毫米波/太赫兹波波束;在多面体转镜1转动的过程中,斩波器8绕其中心轴线转动以使来自所述第一反射板的毫米波/太赫兹波和第三反射板7所反射的来自所述第二反射板的毫米波/太赫兹波交替地由毫米波/太赫兹波探测器阵列2接收;S1: Drive the polygonal rotating mirror 1 to rotate, so that multiple reflectors 1A, 1B, 1C, and 1D are used in turn as the first reflector to receive and reflect the spontaneous parts of the first object 31A located at different positions in the first field of view 3A The millimeter wave/terahertz wave beam that is radiated or reflected back; another reflector adjacent to the first reflector among the plurality of reflectors 1A, 1B, 1C, and 1D is used as a second reflector to receive And reflect the second subject 31B located in different positions of the second field of view 3B part of the spontaneous radiation or reflected back millimeter wave/terahertz wave beam; during the rotation of the polygon mirror 1, the chopper 8 rotates around its central axis Rotate so that the millimeter wave/terahertz wave from the first reflecting plate and the millimeter wave/terahertz wave from the second reflecting plate reflected by the third reflecting plate 7 are alternately detected by the millimeter wave/terahertz wave Device array 2 receives;

S2:将毫米波/太赫兹波探测器阵列2所获得的对于第一被检对象31A的图像数据和关于第二被检对象31B的图像数据发送给数据处理装置;S2: Send the image data of the first inspected object 31A and the image data of the second inspected object 31B obtained by the millimeter wave/terahertz wave detector array 2 to the data processing device;

S3:利用数据处理装置分别对第一被检对象31A的图像数据和第二被检对象31B的图像数据进行重建以生成第一被检对象31A和第二被检对象31B的毫米波/太赫兹波图像。S3: Using the data processing device to reconstruct the image data of the first inspected object 31A and the image data of the second inspected object 31B respectively to generate millimeter wave/terahertz images of the first inspected object 31A and the second inspected object 31B wave image.

该方法可以同时对两个被检对象31A、31B进行全方位的成像和检测,其中被检对象31可以是人体,也可以是物品。当被检对象31A、31B是人体时,该毫米波/太赫兹波成像设备100可以配合物品成像设备200使用,如图13所示,两个被检对象31A和31B分别在左侧待检位置和右侧待检位置进行检测,或者,也可以当一个被检对象31A在左侧待检位置完成正面检测之后,可以沿着箭头所示的路径行走至到右侧待检位置,并完成背面检测,从而无需被检对象31A转身即可完成全方位的检测。This method can perform omni-directional imaging and detection on two inspected objects 31A and 31B at the same time, wherein the inspected object 31 can be a human body or an article. When the objects to be inspected 31A and 31B are human bodies, the millimeter wave/terahertz wave imaging device 100 can be used in conjunction with the object imaging device 200, as shown in FIG. 13, the two objects to be inspected 31A and 31B are respectively at the positions to be inspected on the left side and the position to be inspected on the right, or, after an object 31A to be inspected has completed the front detection at the position to be inspected on the left, it can walk along the path indicated by the arrow to the position to be inspected on the right, and complete the rear detection, so that all-round detection can be completed without turning around the subject 31A.

在一种示例性实施例中,该方法在步骤S3之前还包括以下步骤:当多面体转镜1转动到校准区域时,通过毫米波/太赫兹波探测器阵列2接收关于校准源5的校准数据;并且基于校准源5的校准数据实时更新所接收的第一被检对象31A和第二被检对象31B的图像数据。In an exemplary embodiment, the method further includes the following steps before step S3: when the polygon mirror 1 rotates to the calibration area, the calibration data about the calibration source 5 is received by the millimeter wave/terahertz wave detector array 2 and updating the received image data of the first inspected object 31A and the second inspected object 31B in real time based on the calibration data of the calibration source 5 .

检波的输出电压Vout对应的天线温度为TA,其应满足如下关系,The antenna temperature corresponding to the detection output voltage V out is T A , which should satisfy the following relationship,

TA=(Vout-b)/a (7)T A =(V out -b)/a (7)

式中,a为增益定标系数,In the formula, a is the gain scaling coefficient,

b为偏置定标系数。b is the bias scaling coefficient.

因此,基于校准源5的校准数据更新所接收的被检对象31A、31B的图像数据包括对偏置定标系数b的校正和对增益定标系数a的校正。Therefore, updating the received image data of the inspected object 31A, 31B based on the calibration data of the calibration source 5 includes correction of the bias scaling coefficient b and correction of the gain scaling coefficient a.

在校准区域内,校准源5及其周围环境的辐射亮温都可以视作是均匀的,即所有通道的天线温度TA是一致的。当通道完全一致时,焦面阵接收通道的输出Vout应该完全一致,如果输出不一致,则需要调整各通道的增益定标系数a和偏置定标系数b,使所有通道输出一致,从而实现通道的一致性调节。增益定标参数a反映的是通道的总增益和等效带宽,在通道调试时这部分已经经过仔细调节,可以认为各通道的增益定标系数a近似相等,因此在正常使用过程中校正通过调节偏置定标系数b来完成。In the calibration area, the radiation brightness temperature of the calibration source 5 and its surrounding environment can be regarded as uniform, that is, the antenna temperatures T A of all channels are consistent. When the channels are completely consistent, the output V out of the receiving channel of the focal plane array should be completely consistent. If the output is inconsistent, it is necessary to adjust the gain scaling coefficient a and bias scaling coefficient b of each channel to make the output of all channels consistent, so as to realize Consistency regulation of channels. The gain scaling parameter a reflects the total gain and equivalent bandwidth of the channel. This part has been carefully adjusted during channel debugging. It can be considered that the gain scaling coefficient a of each channel is approximately equal. Offset scaling factor b to complete.

在一种示例性实施例中,基于校准源5的校准数据更新所接收的被检对象31的图像数据主要包括对偏置定标系数b的校正,包括以下步骤:In an exemplary embodiment, updating the received image data of the inspected object 31 based on the calibration data of the calibration source 5 mainly includes correcting the bias calibration coefficient b, including the following steps:

A1:计算所述毫米波/太赫兹波探测器阵列的所有通道在所述校准区域的多次测量输出电压的平均值 A1: Calculate the average value of the multiple measured output voltages of all channels of the millimeter wave/terahertz wave detector array in the calibration area

A2:每个通道的检测区域校准后的数据为每个通道的检测区域采集的数据Vi减去所述平均值然后再除以每个通道的增益定标系数aiA2: The calibrated data of the detection area of each channel is the data V i collected in the detection area of each channel minus the average value It is then divided by the gain scaling factor a i for each channel.

该方法可以对焦平面阵系统接收通道阵列进行整体校准,校准算法只需简单的运算,耗时极少,可以实现实时校准;对每幅图像都进行通道一致性校准。The method can perform overall calibration of the receiving channel array of the focal plane array system, and the calibration algorithm only needs simple calculations, consumes very little time, and can realize real-time calibration; channel consistency calibration is performed on each image.

当设备在长期运行或者更换使用场所等情况下,由于系统温度漂移而带来的系统性能恶化,各通道的增益定标系数a通常也会发生变化。这时需要对通道的增益定标系数a和偏置定标系数b进行调整,具体包括以下步骤When the equipment is in long-term operation or the place of use is changed, the system performance deteriorates due to system temperature drift, and the gain calibration coefficient a of each channel usually changes. At this time, it is necessary to adjust the gain scaling coefficient a and the bias scaling coefficient b of the channel, which specifically includes the following steps

B1:使用所述毫米波/太赫兹波探测器阵列测量空气的电压值Vair(i),i∈[1,通道数],并计算所有通道的空气的平均电压值 B1: Use the millimeter wave/terahertz wave detector array to measure the air voltage value V air (i), i∈[1, number of channels], and calculate the average air voltage value of all channels

B2:设置所述校准源的温度与空气的温度具有差值,使用所述毫米波/太赫兹波探测器阵列测量所述校准源的电压值Vcal(i),i∈[1,通道数],并计算所有通道的校准源的平均电压值并通过下列等式计算出每个通道的增益定标系数ai和偏置定标系数biB2: Set the temperature of the calibration source to have a difference with the temperature of the air, and use the millimeter wave/terahertz wave detector array to measure the voltage value V cal (i) of the calibration source, i∈[1, the number of channels ], and calculate the average voltage value of the calibration source for all channels And calculate the gain scaling factor a i and bias scaling factor b i of each channel through the following equation:

B3:每个通道的检测区域校准后的数据为的绝对值,其中Vi为每个通道的检测区域采集的数据。B3: The data after calibration of the detection area of each channel is The absolute value of , where V i is the data collected in the detection area of each channel.

数据处理装置每个3dB波束方位内采集两次,这样在图1所示的实施例中,每个通道在校准区域获得至少10个采集数据。在校准区域的输出电压数据与检测区域的输出电压数据均存储在数据处理装置的同一个数据表格中。The data processing device acquires twice in each 3dB beam azimuth, so in the embodiment shown in FIG. 1 , each channel obtains at least 10 acquisition data in the calibration area. Both the output voltage data in the calibration area and the output voltage data in the detection area are stored in the same data table of the data processing device.

作为一个示例性实施例,该方法还可以包括S4:在生成第一被检对象31A和第二被检对象31B的毫米波/太赫兹波图像之后,对第一被检对象31A和第二被检对象31B是否带有可疑物以及可疑物的位置进行识别并将结果输出。As an exemplary embodiment, the method may further include S4: after generating the millimeter-wave/terahertz-wave images of the first inspected object 31A and the second inspected object 31B, the first inspected object 31A and the second inspected object 31A Identify whether the object 31B has a suspicious object and the location of the suspicious object, and output the result.

在上述步骤中,对于可疑物及其位置的识别可以通过计算机自动识别或是人工识别或是两者相结合的方法来进行。结果输出可以通过例如在显示装置上显示标有直接显示是否带有可疑物的结论等方式来实现,也可以将检测结果直接打印或发送。In the above steps, the identification of the suspicious object and its location can be carried out by computer automatic identification or manual identification or a combination of both. The output of the result can be realized by, for example, displaying a conclusion marked on the display device to directly show whether there is a suspicious object, or the detection result can be directly printed or sent.

执行检测的安检人员可以根据上述步骤S4给出的检测结果来对人体或物品是否带有可疑物以及可疑物的位置进行确认,也可以通过人工检测来进行复核。The security inspector who performs the detection can confirm whether the human body or object contains suspicious objects and the location of the suspicious objects according to the detection results given in the above step S4, and can also conduct a review through manual detection.

本领域的技术人员可以理解,上面所描述的实施例都是示例性的,并且本领域的技术人员可以对其进行改进,各种实施例中所描述的结构在不发生结构或者原理方面的冲突的情况下可以进行自由组合。Those skilled in the art can understand that the above-described embodiments are exemplary, and those skilled in the art can improve them, and the structures described in various embodiments do not conflict with each other in terms of structure or principle Can be combined freely.

在详细说明本公开的较佳实施例之后,熟悉本领域的技术人员可清楚的了解,在不脱离随附权利要求的保护范围与精神下可进行各种变化与改变,且本公开亦不受限于说明书中所举示例性实施例的实施方式。After describing the preferred embodiments of the present disclosure in detail, those skilled in the art can clearly understand that various changes and changes can be made without departing from the scope and spirit of the appended claims, and the present disclosure is not limited by Implementation is limited to the exemplary embodiments set forth in the specification.

Claims (17)

1. a kind of millimeter wave/THz wave imaging device, which is characterized in that visited including quasi-optics component, millimeter wave/THz wave Device array and chopper are surveyed,
The quasi-optics component includes:
Polygonal-mirror, each side of the polygonal-mirror are respectively arranged with reflecting plate, and the polygonal-mirror can be around Its pivot axis is located at so that multiple reflecting plates are used as the first reflecting plate in turn to receive and reflect the first checked object The part spontaneous radiation of first visual field different location or reflected millimeter wave/THz wave wave beam;Multiple reflecting plates In another reflecting plate adjacent with first reflecting plate be used as the second reflecting plate and receive and reflect the second checked object position Part spontaneous radiation or reflected millimeter wave/THz wave wave beam in the second visual field different location;With
Third reflecting plate, the third reflecting plate is adapted to will the millimeter wave from second reflecting plate // THz wave reflection Onto the chopper;
The chopper is located at the reflection wave paths of first reflecting plate and the back wave road of the third reflecting plate, described to cut Wave device is configured to be only from millimeter wave/THz wave of first reflecting plate at any one time or to be only from the third anti- It penetrates millimeter wave/THz wave reflection of plate or is transmitted to the millimeter wave/terahertz wave detector array, the chopper is around it Center axis thereof so that millimeter wave/THz wave from first reflecting plate and the third reflecting plate alternately by institute State millimeter wave/terahertz wave detector array received;And
The millimeter wave/terahertz wave detector array is suitable for receiving the wave beam from the quasi-optics component.
2. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that the quasi-optics component is also Including condenser lens, the condenser lens is between the chopper and the millimeter wave/terahertz wave detector array.
3. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that the quasi-optics component is also Including the first condenser lens and the second condenser lens, first condenser lens is located at first reflecting plate and the chopper Between, second condenser lens is between second reflecting plate and the third reflecting plate.
4. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that it further include absorbing material, institute Absorbing material is stated to be suitable for absorbing the millimeter wave/THz wave from first reflecting plate reflected via the chopper, And millimeter wave/the THz wave from the third reflecting plate transmitted via the chopper.
5. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that the polygonal-mirror The quantity of the reflecting plate is m, wherein 6 >=m >=3.
6. millimeter wave according to claim 5/THz wave imaging device, which is characterized in that the m reflecting plates and institute It is parallel for stating pivot center.
7. millimeter wave according to claim 5/THz wave imaging device, which is characterized in that the m reflecting plates and institute The angle between pivot center is stated along the direction of rotation increasing or decreasing of the polygonal-mirror.
8. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that the chopper includes extremely A few blade.
9. millimeter wave according to claim 8/THz wave imaging device, which is characterized in that between multiple described blades etc. It is arranged every ground around the central axis.
10. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that it further include shell, it is described Quasi-optics component and the millimeter wave/terahertz wave detector array are located in the shell, in the opposing sidewalls of the shell It is respectively arranged with the first window for supplying the wave beam from first checked object to pass through and for from second checked object The second window for passing through of wave beam.
11. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that further include being suitable for driving The first driving device of the polygonal-mirror rotation.
12. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that further include being suitable for driving Second driving device of the chopper rotation.
13. millimeter wave described in any one of -12/THz wave imaging device according to claim 1, which is characterized in that also wrap It includes:
Data processing equipment, the data processing equipment are connect with the millimeter wave/terahertz wave detector array to connect respectively It receives from the millimeter wave/terahertz wave detector array for the image data of first checked object and for described The image data of second checked object simultaneously generates millimeter wave/THz wave image respectively;With
Display device, the display device are connected with the data processing equipment, for receiving and showing from the data The millimeter wave of processing unit/THz wave image.
14. millimeter wave according to claim 13/THz wave imaging device, which is characterized in that it further include warning device, The warning device is connect with the data processing equipment so that when the data processing equipment identify the millimeter wave/ The instruction millimeter wave/THz wave image is issued when suspicious object in THz wave image, and there are the alarms of suspicious object.
15. millimeter wave according to claim 13/THz wave imaging device, which is characterized in that it further include calibration source, institute It states calibration source to be located on the object plane of the quasi-optics component, the data processing equipment, which receives, comes from the millimeter wave/Terahertz The calibration data for the calibration source of wave detector array, and first checked object is updated based on the calibration data Image data and second checked object image data.
16. millimeter wave according to claim 13/THz wave imaging device, which is characterized in that further include optical camera Device, the optical pick-up apparatus include the first optical camera dress suitable for acquiring the optical imagery of first checked object It sets and the second optical pick-up apparatus of the optical imagery suitable for acquiring second checked object, first optical camera fills It sets and is connect respectively with the display device with second optical pick-up apparatus.
17. millimeter wave according to claim 16/THz wave imaging device, which is characterized in that the display device packet Display screen is included, the display screen includes being suitable for showing the first viewing area of the millimeter wave/THz wave image and being applicable in In the second viewing area for showing the optical pick-up apparatus optical imagery collected.
CN201822275858.5U 2018-12-29 2018-12-29 Millimeter wave/terahertz wave imaging equipment Withdrawn - After Issue CN209296949U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822275858.5U CN209296949U (en) 2018-12-29 2018-12-29 Millimeter wave/terahertz wave imaging equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822275858.5U CN209296949U (en) 2018-12-29 2018-12-29 Millimeter wave/terahertz wave imaging equipment

Publications (1)

Publication Number Publication Date
CN209296949U true CN209296949U (en) 2019-08-23

Family

ID=67649909

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822275858.5U Withdrawn - After Issue CN209296949U (en) 2018-12-29 2018-12-29 Millimeter wave/terahertz wave imaging equipment

Country Status (1)

Country Link
CN (1) CN209296949U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109633775A (en) * 2018-12-29 2019-04-16 同方威视技术股份有限公司 The method that millimeter wave/THz wave imaging device detects human body or article
CN110716241A (en) * 2019-11-22 2020-01-21 浙江云特森科技有限公司 Single-point scanning millimeter wave security check system and method
WO2020134336A1 (en) * 2018-12-29 2020-07-02 清华大学 Millimeter-wave/terahertz-wave imaging apparatus, and inspection method for body or object

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109633775A (en) * 2018-12-29 2019-04-16 同方威视技术股份有限公司 The method that millimeter wave/THz wave imaging device detects human body or article
WO2020134336A1 (en) * 2018-12-29 2020-07-02 清华大学 Millimeter-wave/terahertz-wave imaging apparatus, and inspection method for body or object
CN109633775B (en) * 2018-12-29 2024-01-26 同方威视技术股份有限公司 Method for detecting human body or article by millimeter wave/terahertz wave imaging equipment
CN110716241A (en) * 2019-11-22 2020-01-21 浙江云特森科技有限公司 Single-point scanning millimeter wave security check system and method

Similar Documents

Publication Publication Date Title
CN109655931B (en) Millimeter wave/terahertz wave imaging device and method for detecting human body or article
CN109444977B (en) Millimeter wave/terahertz wave imaging device and method for detecting human body or article
CN209296949U (en) Millimeter wave/terahertz wave imaging equipment
Sheen et al. Active millimeter-wave standoff and portal imaging techniques for personnel screening
US8009116B2 (en) Device for two-dimensional imaging of scenes by microwave scanning
CN102681022B (en) Terahertz (THz) wave imaging device
CN209342946U (en) Millimeter wave/terahertz wave imaging equipment
CN209296946U (en) Millimeter wave/terahertz wave imaging equipment
CN108761553B (en) Passive millimeter wave dual-channel synchronous imaging system for security inspection and imaging method thereof
Cheng et al. Polarization-based method for object surface orientation information in passive millimeter-wave imaging
CN209182530U (en) Millimeter wave/terahertz wave imaging equipment
WO2020134326A1 (en) Millimeter wave/terahertz wave imaging device, check method, and calibration method
CN209296945U (en) Millimeter wave/terahertz wave imaging equipment
Yıldırım et al. Characterization of a terahertz wave scanned imaging system for threat detection at standoff distances
CN109633775B (en) Method for detecting human body or article by millimeter wave/terahertz wave imaging equipment
CN109444978B (en) Millimeter wave/terahertz wave imaging device and method for detecting human body or article
WO2020134336A1 (en) Millimeter-wave/terahertz-wave imaging apparatus, and inspection method for body or object
CN109870738B (en) Millimeter wave/terahertz wave imaging apparatus and correction method therefor
CN209296948U (en) Millimeter wave/terahertz wave imaging equipment
CN109444975B (en) Millimeter wave/terahertz wave imaging apparatus
CN209728194U (en) Millimeter wave/terahertz wave imaging equipment
CN109828313B (en) Millimeter wave/terahertz wave imaging device and method for detecting human body or article
CN109870739A (en) mmWave/THz imaging equipment
CN109444976B (en) Millimeter wave/terahertz wave imaging apparatus
CN209296953U (en) Millimeter wave/terahertz wave imaging equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20190823

Effective date of abandoning: 20240126

AV01 Patent right actively abandoned

Granted publication date: 20190823

Effective date of abandoning: 20240126

AV01 Patent right actively abandoned
AV01 Patent right actively abandoned