CN209248236U - Optical-mechanical module - Google Patents
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- CN209248236U CN209248236U CN201821887553.3U CN201821887553U CN209248236U CN 209248236 U CN209248236 U CN 209248236U CN 201821887553 U CN201821887553 U CN 201821887553U CN 209248236 U CN209248236 U CN 209248236U
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- 230000003287 optical effect Effects 0.000 claims abstract description 46
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- 238000001816 cooling Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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Abstract
一种光机模块,包括壳体、光阀以及补偿模块。壳体具有开口。光阀具有主动面,该光阀配置于该壳体上且该光阀的该主动面从该壳体的该开口露出,该主动面用于提供光束。补偿模块配置于该壳体上,且包括位于光束的传递路径上的光学补偿元件、以及用以固持该光学补偿元件的散热支架,其中当主动面的一部分处于第一状态时,光束传递至并通过光学补偿元件,当主动面的一部分处于第二状态时,光束传递至该散热支架。本实用新型提供的光机模块借由避免散热模块产生晃动而提升散热模块的稳定性,以提升光阀的散热效率,进而提供良好的光学效果。
An optical-mechanical module comprises a shell, a light valve and a compensation module. The shell has an opening. The light valve has an active surface, the light valve is arranged on the shell and the active surface of the light valve is exposed from the opening of the shell, and the active surface is used to provide a light beam. The compensation module is arranged on the shell and comprises an optical compensation element located on the transmission path of the light beam, and a heat dissipation bracket for holding the optical compensation element, wherein when a part of the active surface is in a first state, the light beam is transmitted to and passes through the optical compensation element, and when a part of the active surface is in a second state, the light beam is transmitted to the heat dissipation bracket. The optical-mechanical module provided by the utility model improves the stability of the heat dissipation module by preventing the heat dissipation module from shaking, thereby improving the heat dissipation efficiency of the light valve and providing a good optical effect.
Description
技术领域technical field
本实用新型是有关于一种光学模块,且特别是有关于一种用于投影装置的光机模块。The utility model relates to an optical module, in particular to an optical-mechanical module used for a projection device.
背景技术Background technique
投影装置为一种用以产生画面的显示装置。投影装置的成像原理大体上是借由光阀将光源所产生的照明光束转换成影像光束,再借由镜头将影像光束投射到屏幕或墙面上。然而,在目前的光机模块中,用以传导光阀所累积的热的散热装置锁附于壳体上的方式易造成晃动,因而使得投影装置的成像品质下降。除此之外,需设置散热片,以将光阀在光机模块内部所累积的热传导至周边环境,而额外配置散热片造成成本的提高。A projection device is a display device for generating images. The imaging principle of the projection device is generally to convert the illumination beam generated by the light source into an image beam by means of a light valve, and then project the image beam onto a screen or a wall by means of a lens. However, in the current optical-mechanical module, the manner in which the heat dissipation device for conducting the accumulated heat of the light valve is locked on the housing is likely to cause shaking, thereby deteriorating the imaging quality of the projection device. In addition, heat sinks need to be provided to conduct the heat accumulated in the light valve inside the optomechanical module to the surrounding environment, and the additional configuration of heat sinks increases the cost.
“背景技术”段落只是用来帮助了解本实用新型内容,因此在“背景技术”段落所揭露的内容可能包含一些不构成本领域技术人员所知道的已知技术。在“背景技术”段落所揭露的内容,不代表该内容或者本实用新型一个或多个实施例所要解决的问题,在本实用新型申请前已被本领域技术人员所知晓或认知。The paragraph "Background Technology" is only used to help understand the content of the present utility model, so the content disclosed in the paragraph "Background Technology" may contain some known technologies that are not known to those skilled in the art. The content disclosed in the "Background Technology" paragraph does not mean that the content or the problems to be solved by one or more embodiments of the present utility model have been known or recognized by those skilled in the art before the application of the utility model.
实用新型内容Utility model content
本实用新型提供一种光机模块,借由避免散热模块产生晃动而提升散热模块的稳定性,以提升光阀的散热效率,进而提供良好的光学效果。The utility model provides an optical-mechanical module, which improves the stability of the heat-dissipating module by avoiding shaking of the heat-dissipating module, so as to improve the heat-dissipating efficiency of the light valve and provide good optical effects.
本实用新型的其他目的和优点可以从本实用新型所揭露的技术特征中得到进一步的了解。Other purposes and advantages of the utility model can be further understood from the technical characteristics disclosed in the utility model.
为达上述之一或部分或全部目的或是其他目的,本实用新型的一实施例提供一种光机模块,包括壳体、光阀及补偿模块。壳体具有开口,且光阀具有主动面,该光阀配置于该壳体上且该光阀的该主动面从该壳体的该开口露出。光阀的主动面用于提供光束。补偿模块,配置于该壳体上,且包括位于光束传递路径上的光学补偿元件及用以固持该光学补偿元件的散热支架,其中当主动面的一部分处于第一状态时,光束传递至并通过光学补偿元件,当该主动面的一部分处于第二状态时,光束传递至该散热支架。To achieve one or part or all of the above objectives or other objectives, an embodiment of the present invention provides an optical-mechanical module, including a housing, a light valve and a compensation module. The casing has an opening, and the light valve has an active surface, the light valve is configured on the casing, and the active surface of the light valve is exposed from the opening of the casing. The active face of the light valve is used to provide the light beam. The compensation module is arranged on the housing and includes an optical compensation element on the beam transmission path and a heat dissipation bracket for holding the optical compensation element, wherein when a part of the active surface is in the first state, the light beam is transmitted to and passes through The optical compensation element transmits the light beam to the cooling bracket when a part of the active surface is in the second state.
基于上述,本实用新型的实施例至少具有以下其中一个优点或功效。在本实用新型的光机模块中,光机模块借由至少三个固定元件与壳体的至少三个固定结构配合,将散热模块固定连接至壳体。可避免散热模块产生晃动而提升散热模块的稳定性,以提升光阀的散热效率,进而提供良好的光学效果。在本实用新型的其他光机模块中,补偿模块除了用以配置投影装置所需用的光学补偿片之外,还可用以在光机模块内实现散热及遮光的效果,以此增加光机模块内的可用空间,及/或降低花费成本。Based on the above, the embodiments of the present invention have at least one of the following advantages or effects. In the optical-mechanical module of the present invention, the optical-mechanical module is fixedly connected to the housing by at least three fixing elements cooperating with at least three fixing structures of the housing. The shaking of the heat dissipation module can be avoided to improve the stability of the heat dissipation module, so as to improve the heat dissipation efficiency of the light valve, thereby providing good optical effects. In other optical-mechanical modules of the present utility model, the compensation module can also be used to realize heat dissipation and light-shielding effects in the optical-mechanical module in addition to configuring the optical compensation sheet required by the projection device, thereby increasing the optical-mechanical module available space within the facility, and/or reduce spending costs.
为让本实用新型的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with accompanying drawings.
附图说明Description of drawings
图1为本实用新型一实施例的光机模块的立体示意图。FIG. 1 is a three-dimensional schematic diagram of an optical-mechanical module according to an embodiment of the present invention.
图2为图1的光机模块的分解示意图。FIG. 2 is an exploded schematic diagram of the optical-mechanical module of FIG. 1 .
图3为图2的光机模块中的散热模块于另一视角的立体示意图。FIG. 3 is a three-dimensional schematic diagram of a heat dissipation module in the optical-mechanical module of FIG. 2 from another perspective.
图4为图1的光机模块的俯视示意图。FIG. 4 is a schematic top view of the optical-mechanical module of FIG. 1 .
图5为图2的光机模块中的部分结构的立体示意图。FIG. 5 is a three-dimensional schematic diagram of a part of the structure of the optical-mechanical module in FIG. 2 .
图6为本实用新型另一实施例的光机模块的立体示意图。FIG. 6 is a three-dimensional schematic diagram of an optical-mechanical module according to another embodiment of the present invention.
图7为图6的光机模块的分解示意图。FIG. 7 is an exploded schematic diagram of the optical-mechanical module of FIG. 6 .
具体实施方式Detailed ways
有关本实用新型的前述及其他技术内容、特点与功效,在以下配合参考附图的一较佳实施例的详细说明中,将可清楚的呈现。以下实施例中所提到的方向用语,例如:上、下、左、右、前或后等,仅是参考附图的方向。因此,使用的方向用语是用来说明并非用来限制本实用新型。The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only referring to the directions of the drawings. Therefore, the directional terms used are used to illustrate but not to limit the present invention.
图1为本实用新型一实施例的光机模块的立体示意图。图2为图1的光机模块的分解示意图。请参考图1及图2,本实施例提供一种光机模块100,包括一壳体110、一光阀120、一散热模块130、至少三固定元件140以及一补偿模块200。具体而言,在本实施例中,光机模块100还包括一电路板160以及一光传导模块190。举例而言,电路板160可为印刷电路板(Printed circuit board,PCB)。光机模块100可配置于投影装置中,可将投影装置中光源所提供的照明光束转换成影像光束,并借由投影镜头(未绘示)更进一步转换成投影光束,以投射至投影目标(未绘示),例如屏幕或墙面。在本实施例中,光机模块100使用RTIR光路架构,但本实用新型并不限于此。FIG. 1 is a three-dimensional schematic diagram of an optical-mechanical module according to an embodiment of the present invention. FIG. 2 is an exploded schematic diagram of the optical-mechanical module of FIG. 1 . Please refer to FIG. 1 and FIG. 2 , the present embodiment provides an optical-mechanical module 100 , including a housing 110 , a light valve 120 , a heat dissipation module 130 , at least three fixing elements 140 and a compensation module 200 . Specifically, in this embodiment, the optical-mechanical module 100 further includes a circuit board 160 and an optical transmission module 190 . For example, the circuit board 160 may be a printed circuit board (Printed circuit board, PCB). The optical-mechanical module 100 can be configured in a projection device, and can convert the illumination beam provided by the light source in the projection device into an image beam, and further convert it into a projection beam through a projection lens (not shown), so as to project to a projection target ( not shown), such as screens or walls. In this embodiment, the optical-mechanical module 100 uses the RTIR optical path structure, but the present invention is not limited thereto.
光阀120例如是反射式光调变器或穿透式光调变器。以反射式光调变器为例,光阀120例如是液晶覆硅板(Liquid Crystal On Silicon panel,LCoS panel)、数字微镜元件(Digital Micro-mirror Device,DMD)等。于一些实施例中,光阀120也可以是透光液晶面板(Transparent Liquid Crystal Panel),电光调变器(Electro-Optical Modulator)、磁光调变器(Maganeto-Optic modulator)、声光调变器(Acousto-Optic Modulator,AOM)等穿透式光调变器。光阀120具有主动面S1及热介面S2。主动面S1包括多个可动式反射镜面,用以接收照明光束并提供影像光束。热介面S2用以传递热能至周边环境。电路板160电性连接于光阀120,用以借由电讯号改变光阀120的多个可动式反射镜面的状态,例如启动状态或关闭状态。光传导模块190例如是棱镜组,用以将光阀120所提供的影像光束反射或折射传递至投影镜头。本实用新型对光阀120、电路板160及光传导模块190的型态及其种类并不加以限制。The light valve 120 is, for example, a reflective light modulator or a transmissive light modulator. Taking a reflective light modulator as an example, the light valve 120 is, for example, a Liquid Crystal On Silicon panel (LCoS panel), a Digital Micro-mirror Device (Digital Micro-mirror Device, DMD) and the like. In some embodiments, the light valve 120 can also be a transparent liquid crystal panel (Transparent Liquid Crystal Panel), an electro-optical modulator (Electro-Optical Modulator), a magneto-optic modulator (Maganeto-Optic modulator), an acousto-optic modulator Acousto-Optic Modulator (AOM) and other transmissive optical modulators. The light valve 120 has an active surface S1 and a thermal interface S2. The active surface S1 includes a plurality of movable reflective mirrors for receiving illumination beams and providing image beams. The thermal interface S2 is used to transmit thermal energy to the surrounding environment. The circuit board 160 is electrically connected to the light valve 120 and is used to change the states of the movable reflectors of the light valve 120 , such as an activated state or a closed state, by electrical signals. The light transmission module 190 is, for example, a prism group for reflecting or refracting the image beam provided by the light valve 120 to the projection lens. The present invention does not limit the types and types of the light valve 120 , the circuit board 160 and the light conduction module 190 .
在本实施例中,光阀120及光传导模块190配置于壳体110内,且电路板160配置于壳体110上。具体而言,壳体110包括上壳体110_1、下壳体110_2以及一开口114。光阀120配置于上壳体110_1中,且从壳体110的开口114露出。主动面S1用于提供光束(即上述影像光束)。光传导模块190位于上壳体110_1及下壳体110_2之间。电路板160例如可借由一个或多个电路板固定件240(例如,螺丝)锁附固定于壳体110上。图3为图2的光机模块中的散热模块于另一视角的立体示意图。请同时参考图1至图3。散热模块130配置于壳体110上,且电路板160位于散热模块130与光阀120之间。散热模块130具有散热接触面S3,用以接触光阀120的热介面S2,以将光阀120所产生的热传递至散热模块130的散热结构。详细而言,在本实施例中,散热模块130具有一凸出部134,且散热接触面S3位于此凸出部134的末端。在此实施例中,凸出部134呈方形,但本申请不局限于此。电路板160具有一凸出部穿孔162,而散热模块130的凸出部134穿过电路板160的凸出部穿孔162与光阀120的热介面S2接触。因此,光阀120可借由散热模块130的凸出部134直接接触而将热直接传递至周边环境。In this embodiment, the light valve 120 and the light conduction module 190 are disposed in the housing 110 , and the circuit board 160 is disposed on the housing 110 . Specifically, the housing 110 includes an upper housing 110_1 , a lower housing 110_2 and an opening 114 . The light valve 120 is disposed in the upper casing 110_1 and exposed from the opening 114 of the casing 110 . The active surface S1 is used to provide light beams (ie, the aforementioned image light beams). The light transmission module 190 is located between the upper case 110_1 and the lower case 110_2 . For example, the circuit board 160 can be locked and fixed on the housing 110 by one or more circuit board fixing members 240 (eg, screws). FIG. 3 is a three-dimensional schematic diagram of a heat dissipation module in the optical-mechanical module of FIG. 2 from another perspective. Please refer to Figure 1 to Figure 3 at the same time. The heat dissipation module 130 is disposed on the casing 110 , and the circuit board 160 is located between the heat dissipation module 130 and the light valve 120 . The heat dissipation module 130 has a heat dissipation contact surface S3 for contacting the thermal interface S2 of the light valve 120 to transmit the heat generated by the light valve 120 to the heat dissipation structure of the heat dissipation module 130 . In detail, in this embodiment, the heat dissipation module 130 has a protruding portion 134 , and the heat dissipation contact surface S3 is located at the end of the protruding portion 134 . In this embodiment, the protrusion 134 is square, but the application is not limited thereto. The circuit board 160 has a protrusion hole 162 , and the protrusion 134 of the heat dissipation module 130 passes through the protrusion hole 162 of the circuit board 160 to contact the thermal interface S2 of the light valve 120 . Therefore, the light valve 120 can directly transfer heat to the surrounding environment through direct contact with the protruding portion 134 of the heat dissipation module 130 .
图4为图1的光机模块的俯视示意图。请同时参考图1、图2及图4,壳体110还包括至少三个固定结构112,其中固定结构112的数量及位置对应于固定元件140的数量及位置。换句话说,固定结构112与固定元件140成对配置。固定结构112及固定元件140的数量可为三个或以上,以下说明将以三个为例,但本实用新型并不限于此。光机模块100可借由固定结构112与固定元件140的配合,使得散热模块130、电路板160或其他元件固定连接至壳体110。举例而言,壳体110可包括至少一电路板固定结构113,电路板160中开设至少一电路板穿孔1601、1602。例如,电路板固定件240可穿过电路板穿孔1601而锁附至壳体110上的电路板固定结构113,以此将电路板160固定至壳体110。详细而言,电路板固定结构113可为内设螺纹的固定柱,电路板固定件240例如可为螺丝,螺丝的杆部穿过电路板的电路板穿孔1601,从而与电路板固定结构113螺纹连接。然而,本申请不限定电路板固定结构113、或电路板固定件240的数目。在其他实施例中,可配置两个及以上的电路板固定结构113、及两个及以上的电路板固定件240,借由电路板固定件240与电路板固定结构113的锁附而使电路板受力均匀地固定于壳体上。举例而言,在壳体包含两个电路板固定结构113的实施例中,两个电路板固定结构113相对于电路板上用以使散热模块130的凸出部134穿过的凸出部穿孔162呈对称排布,以利电路板受力均匀,避免翘曲。本申请亦不限定电路板固定结构113、或电路板固定件240的形式。在其他实施例中,用以固定电路板160的电路板固定结构113及电路板固定件240可用其他的固定元件或固定结构取代或部分取代。举例而言,在其他实施例中,可用转接元件170(下文详述)代替电路板固定元件240。FIG. 4 is a schematic top view of the optical-mechanical module of FIG. 1 . Please refer to FIG. 1 , FIG. 2 and FIG. 4 at the same time, the housing 110 further includes at least three fixing structures 112 , wherein the number and positions of the fixing structures 112 correspond to the number and positions of the fixing elements 140 . In other words, the fixing structure 112 is arranged in a pair with the fixing element 140 . The number of the fixing structures 112 and the fixing elements 140 may be three or more, and the following description will take three as an example, but the present invention is not limited thereto. The optical-mechanical module 100 can be fixedly connected to the housing 110 through the cooperation of the fixing structure 112 and the fixing element 140 , so that the heat dissipation module 130 , the circuit board 160 or other elements are fixedly connected. For example, the casing 110 may include at least one circuit board fixing structure 113 , and at least one circuit board through hole 1601 , 1602 is defined in the circuit board 160 . For example, the circuit board fixing member 240 can pass through the circuit board through hole 1601 and be locked to the circuit board fixing structure 113 on the housing 110 , so as to fix the circuit board 160 to the housing 110 . In detail, the circuit board fixing structure 113 can be a fixing column with internal threads, and the circuit board fixing member 240 can be a screw, for example, the rod of the screw passes through the circuit board hole 1601 of the circuit board, so as to be threaded with the circuit board fixing structure 113 connect. However, the application does not limit the number of the circuit board fixing structures 113 or the circuit board fixing members 240 . In other embodiments, two or more circuit board fixing structures 113 and two or more circuit board fixing parts 240 can be configured, and the circuit board fixing parts 240 and the circuit board fixing structure 113 can be locked to make the circuit The board is evenly fixed on the shell under force. For example, in the embodiment where the housing includes two circuit board fixing structures 113, the two circuit board fixing structures 113 are perforated relative to the protrusions on the circuit board for the protrusions 134 of the heat dissipation module 130 to pass through. 162 are symmetrically arranged to facilitate uniform stress on the circuit board and avoid warping. The application also does not limit the form of the circuit board fixing structure 113 or the circuit board fixing member 240 . In other embodiments, the circuit board fixing structure 113 and the circuit board fixing member 240 for fixing the circuit board 160 can be replaced or partially replaced by other fixing elements or fixing structures. For example, in other embodiments, the circuit board fixing element 240 can be replaced by an adapter element 170 (detailed below).
详细而言,在本实施例中,固定结构112的至少其中一者为固定柱,且内设有螺纹,以下说明将以三个固定柱为例。散热模块130包含对应固定结构112数量的穿孔132,用以使固定元件140分别穿过穿孔132,且进一步与固定结构112连接固定,以达成配合。因此,当壳体110与固定元件140连接固定时,壳体110可借由固定结构112的柱状结构限定散热模块130及电路板160的水平方向位置,使整体结构更稳定。在其他实施例中,固定结构112可为内设有螺纹的固定穿孔,而固定元件140穿过散热模块130及电路板160而与固定结构112螺纹连接,以达成配合。然而,本申请不限定固定元件140与固定结构112的配合方式,二者可为直接连接,亦可为中间存在其他元件的间接连接。To be more specific, in this embodiment, at least one of the fixing structures 112 is a fixing post with threads inside, and the following description will take three fixing posts as an example. The heat dissipation module 130 includes a number of through holes 132 corresponding to the number of the fixing structures 112 , so that the fixing elements 140 respectively pass through the through holes 132 and are further connected and fixed with the fixing structures 112 to achieve cooperation. Therefore, when the housing 110 is connected and fixed with the fixing element 140 , the housing 110 can limit the horizontal position of the heat dissipation module 130 and the circuit board 160 through the columnar structure of the fixing structure 112 , making the overall structure more stable. In other embodiments, the fixing structure 112 may be a fixing through hole provided with threads, and the fixing element 140 passes through the heat dissipation module 130 and the circuit board 160 to be threadedly connected with the fixing structure 112 to achieve cooperation. However, the application does not limit how the fixing element 140 cooperates with the fixing structure 112 , the two may be directly connected, or may be indirectly connected with other elements interposed therebetween.
在本实施例中,固定元件140例如是阶梯螺丝。在其他实施例中,亦可使用一般螺丝或其他种类的螺丝,本实用新型并不限于此。在本实施例中,在平行于光阀120的热介面S2的平面上,多个固定元件140构成三角形或其他多边形。举例而言,三个固定元件140在平行于热介面S2的平面上并不会三点连成一线。如此一来,可避免散热模块130产生晃动而提升散热模块130的稳定性,以提升光阀120的散热效率,进而提供良好的光学效果。In this embodiment, the fixing element 140 is, for example, a stepped screw. In other embodiments, ordinary screws or other types of screws can also be used, and the present invention is not limited thereto. In this embodiment, on a plane parallel to the thermal interface S2 of the light valve 120 , the plurality of fixing elements 140 form a triangle or other polygons. For example, the three fixing elements 140 are not connected to a line on a plane parallel to the thermal interface S2. In this way, shaking of the heat dissipation module 130 can be avoided and the stability of the heat dissipation module 130 can be improved, so as to improve the heat dissipation efficiency of the light valve 120 and provide good optical effects.
除此之外,在本实施例中,光机模块100还包括至少三弹簧件150。举例而言,三个弹簧件150分别连接于固定元件140与壳体110的固定结构112之间。具体而言,本实施例的三个弹簧件150套设于固定元件140上,即套设于阶梯螺丝的阶梯结构部分。额外地或附加地,散热模块130的穿孔132可包含弹簧件承靠面133,当弹簧件150套接于固定元件140上而将散热模块130固定于壳体上时,弹簧件150抵靠于穿孔132的弹簧件承靠面133上。如此一来,可进一步提供散热模块130与壳体110的缓冲空间,以消除散热模块130固定至壳体110时所产生的公差。在本实施例中,弹簧件150例如为螺旋压缩弹簧,但在其他实施例中,亦可选用盘状弹簧或上述两者的组合,本实用新型并不限于此。Besides, in this embodiment, the optical-mechanical module 100 further includes at least three spring elements 150 . For example, three spring elements 150 are respectively connected between the fixing element 140 and the fixing structure 112 of the casing 110 . Specifically, the three spring elements 150 in this embodiment are sleeved on the fixing element 140 , that is, sleeved on the stepped structure portion of the stepped screw. Additionally or additionally, the through hole 132 of the heat dissipation module 130 may include a spring element bearing surface 133, when the spring element 150 is sleeved on the fixing element 140 to fix the heat dissipation module 130 on the housing, the spring element 150 leans against The spring element of the through hole 132 rests on the bearing surface 133 . In this way, a buffer space between the heat dissipation module 130 and the casing 110 can be further provided, so as to eliminate the tolerance generated when the heat dissipation module 130 is fixed to the casing 110 . In this embodiment, the spring member 150 is, for example, a helical compression spring, but in other embodiments, a disk spring or a combination of the above two can also be used, and the present invention is not limited thereto.
在本实施例中,光机模块100还可包括至少一转接元件170。举例而言,在一个转接元件170的情形中,其固定连接于固定元件140其中一者与固定结构112其中一者之间。具体而言,壳体110中的一个固定结构112借由一个转接元件170与对应的固定元件140固定连接。换句话说,在本实施例中,壳体110中的三个固定结构112的长度彼此可相同或不同。转接元件170包含一内螺纹部172及一外螺纹杆部174(图2绘示的外螺纹杆部174仅为示意目的)。内螺纹部172用以固定连接固定元件140其中之一,且外螺纹杆部174固定连接壳体110中的固定结构112其中之一。在本实施例中,内螺纹部172与外螺纹杆部174为一体成型,例如是使用转接螺丝,但本实用新型并不限于此。因此,固定元件140可借由连接转接元件170而与固定结构112配合,进一步增加散热模块130与电路板160之间的稳定性。同时,可借由改变转接元件170的高度而改变散热模块130与电路板160的距离,进而调配良好的散热效果。额外地或附加地,转接元件170亦可用以辅助固定电路板160。举例而言,转接元件170的外螺纹杆部174可穿过电路板160的电路板穿孔1602,进而与固定结构112其中一者螺纹连接。在此情形中,连接至转接元件170的固定结构112与上述电路板固定结构113系定位成分布于电路板160上凸出部穿孔162的两侧且呈对称排布,以利电路板的稳定固定及受力均匀。In this embodiment, the optical-mechanical module 100 may further include at least one transition element 170 . For example, in the case of an adapter element 170 , it is fixedly connected between one of the fixing elements 140 and one of the fixing structures 112 . Specifically, a fixing structure 112 in the housing 110 is fixedly connected to a corresponding fixing element 140 via an adapter element 170 . In other words, in this embodiment, the lengths of the three fixing structures 112 in the housing 110 may be the same or different from each other. The adapter element 170 includes an inner threaded portion 172 and an outer threaded stem portion 174 (the outer threaded stem portion 174 shown in FIG. 2 is for illustrative purposes only). The inner threaded portion 172 is used for fixed connection with one of the fixing elements 140 , and the outer threaded rod portion 174 is fixedly connected with one of the fixing structures 112 in the casing 110 . In this embodiment, the internal thread portion 172 and the external thread rod portion 174 are integrally formed, such as using an adapter screw, but the present invention is not limited thereto. Therefore, the fixing element 140 can cooperate with the fixing structure 112 by connecting the adapter element 170 to further increase the stability between the heat dissipation module 130 and the circuit board 160 . At the same time, the distance between the heat dissipation module 130 and the circuit board 160 can be changed by changing the height of the adapter element 170 , so as to adjust a good heat dissipation effect. Additionally or additionally, the adapter element 170 can also be used to assist in fixing the circuit board 160 . For example, the externally threaded rod portion 174 of the adapter element 170 can pass through the circuit board through hole 1602 of the circuit board 160 , and then be threadedly connected with one of the fixing structures 112 . In this case, the fixing structure 112 connected to the adapter element 170 and the above-mentioned circuit board fixing structure 113 are positioned to be distributed on both sides of the protrusion hole 162 on the circuit board 160 and arranged symmetrically, so as to facilitate the circuit board. Stable and fixed and uniform force.
此外,光机模块100还可包括至少一辅助元件180,套接于例如一个转接元件170上,且位于转接元件170与一个固定结构112之间。在本实施例中,辅助元件180可选用盘状弹簧等弹性元件,但在其他实施例中,亦可选用类似于弹簧件150的螺旋压缩弹簧,本实用新型并不限于此。如此一来,使用固定元件140、转接元件170、辅助元件180及固定结构112的连接方式所产生的弹力,约等同于两倍的其他固定元件140直接与固定结构112的连接方式所产生的弹力。举例而言,当完成组装时,施加于光阀120的压力可不超过12kg。因此,可进一步提供散热模块130与壳体110的缓冲空间,以消除散热模块130固定至壳体110时所产生的公差。In addition, the optomechanical module 100 may further include at least one auxiliary element 180 , which is sleeved on, for example, an adapter element 170 and located between the adapter element 170 and a fixing structure 112 . In this embodiment, the auxiliary element 180 can be an elastic element such as a disc spring, but in other embodiments, a helical compression spring similar to the spring element 150 can also be used, and the present invention is not limited thereto. In this way, the elastic force generated by the connection method using the fixing element 140 , the adapter element 170 , the auxiliary element 180 and the fixing structure 112 is approximately equal to twice that generated by the connection method between the other fixing elements 140 and the fixing structure 112 directly. elastic. For example, when assembled, the pressure applied to the light valve 120 may not exceed 12 kg. Therefore, a buffer space between the heat dissipation module 130 and the casing 110 can be further provided to eliminate the tolerance generated when the heat dissipation module 130 is fixed to the casing 110 .
在本实施例中,在固定元件140与固定结构112之间设置有转接元件170及辅助元件180的情形中,固定结构112可设计为高度较低的固定柱。换句话说,固定结构112的高度彼此可为相同或不同。或者是,在固定元件140与固定结构112之间设置有转接元件170及辅助元件180的情形中,固定元件140设计为长度较短的螺丝或阶梯螺丝,以达成稳固的配合,但本实用新型并不限于此。In this embodiment, in the case where the adapter element 170 and the auxiliary element 180 are disposed between the fixing element 140 and the fixing structure 112 , the fixing structure 112 can be designed as a lower height fixing column. In other words, the heights of the fixing structures 112 may be the same or different from each other. Alternatively, in the case where the adapter element 170 and the auxiliary element 180 are provided between the fixing element 140 and the fixing structure 112, the fixing element 140 is designed as a screw or a stepped screw with a short length to achieve a stable fit, but this practical The new type is not limited to this.
图5为图2的光机模块中的部分结构的立体示意图。请参考图1、图2及图5,在本实施例中,补偿模块200配置于壳体110上,且可从壳体110的一槽口116嵌入至壳体110内以完成配置。详细而言,补偿模块200包括光学补偿元件220以及散热支架210,散热支架210位于光阀120与光学补偿元件220之间。光学补偿元件220位于光束的传递路径上,例如是B270光学补偿片,用以补偿光束的光程差。散热支架210用以固持光学补偿元件220,光传导模块190位于光阀120与补偿模块200的光学补偿元件220之间。FIG. 5 is a three-dimensional schematic diagram of a part of the structure of the optical-mechanical module in FIG. 2 . Please refer to FIG. 1 , FIG. 2 and FIG. 5 , in this embodiment, the compensation module 200 is configured on the housing 110 , and can be inserted into the housing 110 from a notch 116 of the housing 110 to complete the configuration. In detail, the compensation module 200 includes an optical compensation element 220 and a heat dissipation bracket 210 , and the heat dissipation bracket 210 is located between the light valve 120 and the optical compensation element 220 . The optical compensation element 220 is located on the transmission path of the light beam, for example, a B270 optical compensation film, to compensate the optical path difference of the light beam. The heat dissipation bracket 210 is used to hold the optical compensation element 220 , and the light transmission module 190 is located between the light valve 120 and the optical compensation element 220 of the compensation module 200 .
光阀120的主动面S1可借由电讯号加以控制,而在不同的状态之间切换。在以下的说明中,定义第一状态为光阀120内所包含的例如一部分的可动式反射镜面呈启动时的状态,在此状态下,此部分的可动式反射镜面将光机模块100内的照明光束转换成影像光束,并使其传递至投影镜头。定义第二状态为光阀120内所包含的例如一部分的可动式反射镜面呈关闭的状态,在此状态下,此部分的可动式反射镜面停止传递影像光束至投影镜头处。在本实施例中,当光阀120中的一部分反射镜面处于第一状态时,使得光束传递至并通过光学补偿元件220。当光阀120中的该部分反射镜面处于第二状态时,使得光束传递至散热支架210。因此,可借由传递光束的方式,将热传递至散热支架210以进行散热。换句话说,在本实施例中,补偿模块200除了用以配置投影装置所需用的光学补偿片之外,还可用以在光机模块100内实现散热及遮光的效果,以此进一步增加光机模块100内的可用空间,及/或降低花费成本。The active surface S1 of the light valve 120 can be controlled by electrical signals to switch between different states. In the following description, the first state is defined as a state in which, for example, a part of the movable reflector included in the light valve 120 is activated. The illumination beam inside is converted into an image beam and passed to the projection lens. The second state is defined as a state in which, for example, a part of the movable reflector included in the light valve 120 is closed, and in this state, the part of the movable reflector stops transmitting the image beam to the projection lens. In this embodiment, when a part of the reflective mirrors in the light valve 120 is in the first state, the light beam is transmitted to and passes through the optical compensation element 220 . When the part of the reflective mirror in the light valve 120 is in the second state, the light beam is transmitted to the cooling bracket 210 . Therefore, the heat can be transferred to the heat dissipation bracket 210 to dissipate heat by transmitting light beams. In other words, in this embodiment, in addition to configuring the optical compensation sheet required by the projection device, the compensation module 200 can also be used to achieve heat dissipation and light shielding effects in the optical-mechanical module 100, thereby further increasing the light intensity. The available space in the machine module 100 can be improved, and/or the cost can be reduced.
更详细而言,在本实施例中,散热支架210的横剖面呈L型,且可包括散热部212及支架部214。散热部212可固定于壳体110上。支架部214可用以固持光学补偿元件220且可穿过壳体110上的槽口116,使得散热支架210将光学补偿元件220架设于光束的传递路径上。在本实施例的架构(例如,RTIR(Reverse Total Internal prism)光路架构)中,散热支架210的支架部214与光阀120分别位于光传导模块190的相邻两侧,但本实用新型并不限于此。在本施实例中,散热部212与支架部214为一体成型,但在其他实施例中,散热部212与支架部214可为单独的元件,其可加以组装,以构成散热支架210。In more detail, in this embodiment, the cross section of the heat dissipation support 210 is L-shaped, and may include a heat dissipation portion 212 and a support portion 214 . The heat dissipation part 212 can be fixed on the casing 110 . The bracket portion 214 can be used to hold the optical compensation element 220 and pass through the notch 116 on the housing 110 , so that the heat dissipation bracket 210 bridges the optical compensation element 220 on the transmission path of the light beam. In the architecture of this embodiment (for example, RTIR (Reverse Total Internal prism) optical path architecture), the bracket part 214 of the heat dissipation bracket 210 and the light valve 120 are respectively located on the adjacent two sides of the light transmission module 190, but the present invention does not limited to this. In this embodiment, the heat dissipation part 212 and the support part 214 are integrally formed, but in other embodiments, the heat dissipation part 212 and the support part 214 can be separate elements, which can be assembled to form the heat dissipation support 210 .
在本实施例中,散热支架210还包括多个夹持结构216,用以夹持光学补偿元件220。此外,在本实施例中,散热支架210还可包括多个凹槽218,而补偿模块200还可包括多个粘着件230,这些粘着件230可填充于该些凹槽218中。在本实施例中,粘着件230为UV胶,但本实用新型并不限于此。因此,光学补偿元件220除了可借由夹持结构216限位于散热支架210上之外,还可借由粘着件230粘附并固定于散热支架210上。如此一来,可进一步增加补偿模块200的稳定性,使光机模块100具有良好的光学效果。本实用新型不限定多个夹持结构216的数量及位置,其可为2~4个或更多,且多个夹持结构216可相对于所夹持的光学补偿元件220呈对称或非对称设置。In this embodiment, the heat dissipation bracket 210 further includes a plurality of clamping structures 216 for clamping the optical compensation element 220 . In addition, in this embodiment, the heat dissipation bracket 210 may further include a plurality of grooves 218 , and the compensation module 200 may further include a plurality of adhesive parts 230 , and the adhesive parts 230 may be filled in the grooves 218 . In this embodiment, the adhesive member 230 is UV glue, but the present invention is not limited thereto. Therefore, the optical compensation element 220 can not only be limited on the heat dissipation support 210 by the clamping structure 216 , but also can be adhered and fixed on the heat dissipation support 210 by the adhesive member 230 . In this way, the stability of the compensation module 200 can be further increased, so that the optical-mechanical module 100 has a good optical effect. The present invention does not limit the number and position of the multiple clamping structures 216, which may be 2 to 4 or more, and the multiple clamping structures 216 may be symmetrical or asymmetrical with respect to the clamped optical compensation element 220 set up.
图6为本实用新型另一实施例的光机模块的立体示意图。图7为图6的光机模块的分解示意图。请参考图6及图7,本实施例的光机模块100A类似于图1的光机模块100。两者在差别在于,在本实施例中,光机模块100A使用TIR光路架构。在此实施例中,补偿模块200中散热支架210的支架部214与光阀120(图中未绘示)分别位于光传导模块190的相对两侧。因此,在本实施例中,当光阀120中的一部分反射镜面处于第一状态时,使得光束传递通过光学补偿元件220。当光阀120中的该部分反射镜面处于第二状态时,使得光束传递至位在侧向上的散热支架210。如此一来,补偿模块200除了用以配置投影装置所需用的光学补偿片之外,还可用以在光机模块100内实现散热及遮光的效果,进一步增加光机模块100内的可用空间,及/或降低花费成本。FIG. 6 is a three-dimensional schematic diagram of an optical-mechanical module according to another embodiment of the present invention. FIG. 7 is an exploded schematic diagram of the optical-mechanical module of FIG. 6 . Please refer to FIG. 6 and FIG. 7 , the optical-mechanical module 100A of this embodiment is similar to the optical-mechanical module 100 of FIG. 1 . The difference between the two is that in this embodiment, the optical-mechanical module 100A uses a TIR optical path architecture. In this embodiment, the bracket part 214 of the heat dissipation bracket 210 in the compensation module 200 and the light valve 120 (not shown in the figure) are respectively located on opposite sides of the light transmission module 190 . Therefore, in this embodiment, when a part of the reflective mirrors in the light valve 120 is in the first state, the light beam passes through the optical compensation element 220 . When the part of the reflective mirror in the light valve 120 is in the second state, the light beam is transmitted to the heat dissipation bracket 210 on the side. In this way, the compensation module 200, in addition to being used to configure the optical compensation sheet required by the projection device, can also be used to achieve heat dissipation and light shielding effects in the optomechanical module 100, further increasing the available space in the optomechanical module 100, and/or reduce costs.
综上所述,本实用新型的实施例至少具有以下其中一个优点或功效。在本实用新型的光机模块中,光机模块借由至少三个固定元件与壳体的至少三个固定结构配合,将散热模块固定连接至壳体。可避免散热模块产生晃动而提升散热模块的稳定性,以提升光阀的散热效率,进而提供良好的光学效果。In summary, the embodiments of the present invention have at least one of the following advantages or functions. In the optical-mechanical module of the present invention, the optical-mechanical module is fixedly connected to the housing by at least three fixing elements cooperating with at least three fixing structures of the housing. The shaking of the heat dissipation module can be avoided to improve the stability of the heat dissipation module, so as to improve the heat dissipation efficiency of the light valve, thereby providing good optical effects.
惟以上所述者,仅为本实用新型的较佳实施例,当不能以此限定本实用新型实施的范围,即所有依本实用新型权利要求书及实用新型内容所作的简单的等效变化与修改,皆仍属本实用新型专利涵盖的范围内。另外本实用新型的任一实施例或权利要求不须达成本实用新型所揭露的全部目的或优点或特点。此外,摘要和实用新型名称仅是用来辅助专利文件检索之用,并非用来限制本实用新型的权利范围。此外,本说明书或权利要求书中提及的“第一”、“第二”等用语仅用以命名元件(element)的名称或区别不同实施例或范围,而并非用来限制元件数量上的上限或下限。But the above-mentioned person is only the preferred embodiment of the present utility model, when can not limit the scope of the present utility model implementation with this, namely all simple equivalent changes made according to the claims of the utility model and the content of the utility model and Amendments all still belong to the scope covered by the utility model patent. In addition, any embodiment or claim of the present utility model does not need to achieve all the purposes, advantages or features disclosed in the present utility model. In addition, the abstract and the name of the utility model are only used to assist the retrieval of patent documents, and are not used to limit the scope of rights of the utility model. In addition, terms such as "first" and "second" mentioned in the specification or claims are only used to name elements or to distinguish different embodiments or ranges, and are not used to limit the number of elements. upper or lower limit.
附图标记说明:Explanation of reference signs:
100、100A:光机模块100, 100A: Optical-mechanical module
110:壳体110: shell
110_1:上壳体110_1: Upper housing
110_2:下壳体110_2: lower housing
112:固定结构112: fixed structure
113:电路板固定结构113: Circuit board fixing structure
114:开口114: opening
116:槽口116: Notch
120:光阀120: light valve
130:散热模块130: cooling module
132:穿孔132: perforation
133:弹簧件承靠面133: spring bearing surface
134:凸出部134: Protrusion
140:固定元件140: Fixed element
150:弹簧件150: spring piece
160:电路板160: circuit board
1601:电路板穿孔1601: Circuit board perforation
1602:电路板穿孔1602: Circuit board perforation
162:凸出部穿孔162: Projection perforation
170:转接元件170: Transfer element
172:内螺纹部172: Internal thread part
174:外螺纹杆部174: Externally threaded shank
180:辅助元件180: auxiliary components
190:光传导模块190: Light transmission module
200:补偿模块200: compensation module
210:散热支架210: cooling bracket
212:散热部212: Cooling Department
214:支架部214: Bracket
216:夹持结构216: clamping structure
218:凹槽218: Groove
220:光学补偿元件220: Optical compensation element
230:粘着件230: Adhesive parts
240:电路板固定件240: circuit board holder
S1:主动面S1: active surface
S2:热介面S2: thermal interface
S3:散热接触面。S3: Thermal contact surface.
Claims (11)
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111198474A (en) * | 2018-11-16 | 2020-05-26 | 中强光电股份有限公司 | Optical-mechanical module |
TWI709810B (en) * | 2019-10-25 | 2020-11-11 | 台達電子工業股份有限公司 | Projection device |
US11036119B2 (en) | 2019-10-25 | 2021-06-15 | Delta Electronics, Inc. | Projection device |
US11249378B2 (en) | 2018-11-16 | 2022-02-15 | Coretronic Corporation | Optical engine module |
-
2018
- 2018-11-16 CN CN201821887553.3U patent/CN209248236U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111198474A (en) * | 2018-11-16 | 2020-05-26 | 中强光电股份有限公司 | Optical-mechanical module |
US11249378B2 (en) | 2018-11-16 | 2022-02-15 | Coretronic Corporation | Optical engine module |
TWI709810B (en) * | 2019-10-25 | 2020-11-11 | 台達電子工業股份有限公司 | Projection device |
US11036119B2 (en) | 2019-10-25 | 2021-06-15 | Delta Electronics, Inc. | Projection device |
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