CN209017102U - Camera assembly and electronic device - Google Patents
Camera assembly and electronic device Download PDFInfo
- Publication number
- CN209017102U CN209017102U CN201822021538.7U CN201822021538U CN209017102U CN 209017102 U CN209017102 U CN 209017102U CN 201822021538 U CN201822021538 U CN 201822021538U CN 209017102 U CN209017102 U CN 209017102U
- Authority
- CN
- China
- Prior art keywords
- imaging module
- circuit board
- camera assembly
- light inlet
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003384 imaging method Methods 0.000 claims abstract description 150
- 230000007246 mechanism Effects 0.000 claims description 38
- 230000003287 optical effect Effects 0.000 claims description 27
- 230000000694 effects Effects 0.000 description 17
- 238000009434 installation Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000013036 cure process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Studio Devices (AREA)
Abstract
本申请提供一种摄像头组件及电子装置。摄像头模组包括第一成像模组、第二成像模组和闪光灯。第一成像模组包括外壳、反光元件、第一图像传感器。外壳包括顶壁和自顶壁的侧边延伸的侧壁，顶壁具有第一进光口。反光元件和第一图像传感器均设置在外壳内。反光元件用于将从第一进光口入射的入射光转向后传至第一图像传感器以使第一图像传感器感测第一成像模组外部的入射光。第二成像模组设置在第一成像模组一侧。第二成像模组具有第二进光口，第二成像模组通过第二进光口采集外界图像。闪光灯设置在第一进光口和第二进光口之间。电子装置包括上述任意一项的摄像头组件，摄像头组件与主板连接。
The present application provides a camera assembly and an electronic device. The camera module includes a first imaging module, a second imaging module and a flash. The first imaging module includes a casing, a reflective element, and a first image sensor. The housing includes a top wall and side walls extending from sides of the top wall, and the top wall has a first light inlet. Both the reflective element and the first image sensor are disposed within the housing. The reflective element is used for diverting the incident light incident from the first light inlet and transmitting it to the first image sensor, so that the first image sensor can sense the incident light outside the first imaging module. The second imaging module is arranged on one side of the first imaging module. The second imaging module has a second light inlet, and the second imaging module collects external images through the second light inlet. The flash is arranged between the first light inlet and the second light inlet. The electronic device includes any one of the above-mentioned camera assembly, and the camera assembly is connected to the main board.
Description
Technical field
This application involves field of electronic devices more particularly to a kind of CCD camera assemblies and electronic device.
Background technique
In the related art, in order to improve the effect of taking pictures of mobile phone, the camera of mobile phone uses periscopic camera, dives and hope
Formula camera can for example carry out three times optical focal length to obtain quality more image.Periscopic camera includes one turn of light member
Part turns optical element for conduction after being incident to the turn light rays in periscopic camera to imaging sensor so that image sensing
Device obtains the image outside periscope type lens.
However, the space that periscopic camera occupies electronic device is larger, therefore, how reasonably arranging electronic device
Each components become focus of attention so that the structure of electronic device is more compact.
Utility model content
In view of this, the application provides a kind of CCD camera assembly and electronic device.
The CCD camera assembly of the application embodiment, comprising:
First imaging modules, first imaging modules include:
Shell, the shell include roof and the side wall that extends from the side of the roof, the roof have first into
Optical port；
The reflecting element and the first imaging sensor being arranged in the shell, the reflecting element is for will be from described
The incident light of first light inlet incidence reaches the first image sensor after turning to so that the first image sensor senses
The incident light outside first imaging modules；
Second imaging modules of first imaging modules side are set, and second imaging modules have the second entering light
Mouthful, second imaging modules are used to acquire external image by second light inlet；With
Flash lamp, the flash lamp are arranged between first light inlet and second light inlet.
In the CCD camera assembly of the application embodiment, by being arranged flash lamp in the first light inlet and the second light inlet
Between, reduce the total length or overall width of the first imaging modules and the second imaging modules and flash lamp collocation, structure is tighter
It gathers, space hold is smaller, reduces the cost of CCD camera assembly, is conducive to the large-scale production of CCD camera assembly.
The electronic device of the application embodiment, comprising:
Mainboard；With
The CCD camera assembly of above-mentioned any one, the CCD camera assembly are connect with the mainboard.
In the CCD camera assembly of the electronic device of the application embodiment, by by flash lamp setting in the first light inlet and
Between second light inlet, reduce the total length or beam overall of the first imaging modules and the second imaging modules and flash lamp collocation
Degree, more compact structure, space hold is smaller, reduces the cost of CCD camera assembly, is conducive to the extensive life of CCD camera assembly
It produces.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the floor map of the electronic device of the application embodiment；
Fig. 2 is the partial structure diagram of the electronic device of the application embodiment；
Fig. 3 is the structural schematic diagram of the CCD camera assembly of the application embodiment；
Fig. 4 is the floor map of the CCD camera assembly of the application embodiment；
Fig. 5 is the diagrammatic cross-section of the CCD camera assembly of the application embodiment；
Fig. 6 is the stereoscopic schematic diagram of the first imaging modules of the application embodiment；
Fig. 7 is the decomposition diagram of the first imaging modules of the application embodiment；
Fig. 8 is the diagrammatic cross-section of the first imaging modules of the application embodiment；
Fig. 9 is the partial cutaway schematic view of the first imaging modules of the application embodiment；
Figure 10 is the diagrammatic cross-section of the first imaging modules of another embodiment of the application；
Figure 11 is the stereoscopic schematic diagram of the reflecting element of the application embodiment.
Figure 12 is the light catoptric imaging schematic diagram of imaging modules in the related technology；
Figure 13 is the light catoptric imaging schematic diagram of the first imaging modules of the application embodiment；
Figure 14 is the structural schematic diagram of imaging modules in the related technology；
Figure 15 is the structural schematic diagram of the first imaging modules of the application embodiment；
Figure 16 is the diagrammatic cross-section of the second imaging modules of the application embodiment.
Main element symbol description:
Electronic device 1000, mainboard 110, the first mounting hole 112, the second mounting hole 114, the first imaging modules 20, mould group
Circuit board 205, flash lamp 140, connector 150；Flash lamp circuit plate 151；Second light inlet 152；Lens barrel 153；Pedestal 154；
CCD camera assembly 100, the first imaging modules 20, shell 21, the first light inlet 211, groove 212, roof 213, side
Wall 214, avoid holes 215, reflecting element 22, incidence surface 222, shady face 224, incidence surface 226, light-emitting surface 228, mounting base 23,
Arcwall face 231, the first Lens assembly 24, eyeglass 241, motor element 25, intermediate plate 222, the first imaging sensor 26, driving mechanism
27, driving device 28, arc-shaped guide rail 281, central axis 282, chip circuit plate 201, mounting portion 2011, interconnecting piece 2022, drive
Dynamic chip 202, sensor circuit board 203, the second imaging modules 30, the second Lens assembly 31, the second imaging sensor 32.
Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
It describes the application and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore should not be understood as the limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In the description of the present application, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to
Simplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the electronic device 1000 of the application embodiment includes casing 102 and CCD camera assembly 100.Camera shooting
Head assembly 100 is exposed by casing 102.
Illustratively, electronic device 1000 can be various types of calculating that are mobile or portable and executing wireless communication
Any one of machine system equipment (only illustratively shows a kind of form) in Fig. 1.Specifically, electronic device 1000 can be with
For mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable gaming device
(such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), knee
Laptop, PDA, portable Internet appliance, music player and data storage device, other handheld devices and such as
Wrist-watch, In-Ear Headphones, pendant, headphone etc., electronic device 100 can also be other wearable devices (for example, all
As electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics are tatooed, the headset equipment of electronic equipment or smartwatch
(HMD))。
Electronic device 1000 can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited to
Cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, sound
Happy logger, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, can
Program remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant
(PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) play
Device, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 1000 can execute multiple functions and (for example, playing music, show video, storage
Picture and send and receive call).If desired, electronic device 1000 can be such as cellular phone, media play
The portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
In present embodiment, 100 postposition of CCD camera assembly, in other words, CCD camera assembly 100 are arranged in electronic device 1000
The back side so that electronic device 1000 can carry out postposition camera shooting.As Fig. 1 example in, CCD camera assembly 100 be arranged in machine
The upper left corner portions of shell 102.It will be appreciated, of course, that CCD camera assembly 100 can be set in casing 102 position or
The other positions such as upper-right position.The position that casing 102 is arranged in CCD camera assembly 100 is not limited to the example of the application.
Further, Fig. 1 and Fig. 2 are please referred to, electronic device 1000 includes mainboard 110, mainboard 110 and CCD camera assembly
100 connections.Mainboard 110 is the main circuit board of electronic device 1000, is the control unit of electronic device 1000.
Fig. 3 to Fig. 5 is please referred to, the CCD camera assembly 100 of the application embodiment includes the first imaging modules 20, the second one-tenth
As mould group 30 and flash lamp 140.First imaging modules 20 are located at the side of the second imaging modules 30 and 20 He of the first imaging modules
Second imaging modules 30 are laterally arranged on electronic device 1000.
Fig. 3 and Fig. 4 are please referred to, in some embodiments, CCD camera assembly 100 includes flash lamp circuit plate 151, flash of light
Lamp 140 is arranged on flash lamp circuit plate 151, and the first imaging modules 20 are connected with mould-group circuit-board 205, mould-group circuit-board 205
It is connect with flash lamp circuit plate 151, mould-group circuit-board 205 is structure as a whole with flash lamp circuit plate 151.
Mould-group circuit-board 205 and flash lamp circuit plate 151 are structure as a whole so that the first imaging modules 20 and flash lamp 140
Assemble more convenient, and mould-group circuit-board 205 and flash lamp circuit plate 151 are structure as a whole and enable to mould-group circuit-board
205 manufacture more convenient, the manufacture effect of promotion mould-group circuit-board 205 and flash lamp circuit plate 151 with flash lamp circuit plate 151
Rate is conducive to the large-scale production of CCD camera assembly 100.
Specifically, in the example of fig. 4, the quantity of flash lamp 140 is two.It is appreciated that in other embodiments
In, the quantity of flash lamp 140 can be 1,3 or 4.The quantity of flash lamp 140 is not defined herein.
In addition, may be provided with connector 150 on mould-group circuit-board 205, connector 150 is, for example, board to board connector
(Board-to-board Connectors), CCD camera assembly 100 can be connected to mainboard 110 by connector 150.Connection
150 transmittability of device is strong, it is ensured that the reliability that CCD camera assembly 100 is connect with mainboard 110.
In some embodiments, the second imaging modules 30 are electrically connected with mould-group circuit-board 205.
So set, controlling the second imaging modules 30 and the first imaging modules 20 simultaneously by mould-group circuit-board 205, make
The working efficiency for obtaining the second imaging modules 30 and the first imaging modules 20 is more increased.
Wherein, above-mentioned electrical connection refers to that the second imaging modules 30 can be with mould-group circuit-board 205 and is indirectly connected with, such as
Second imaging modules 30 can be connect by conductor wire with mould-group circuit-board 205 or the second imaging modules 30 directly and mould
Group circuit board 205 is directly connected to.
Referring to Fig. 5, the second imaging modules 30 are directly connected to mould-group circuit-board 205, such as mould group in present embodiment
Circuit board 205 extends to the second imaging modules 30 and connect with the second imaging modules 30 around the side of the first imaging modules 20.
Specifically, flash lamp circuit plate 151 and mould-group circuit-board 205 can be flexible circuit board, flexible circuit board wiring
Density is high, light-weight, thickness is thin, bending is good, can mitigate the overall weight of CCD camera assembly 100 and save CCD camera assembly
100 inner space.Certainly, flash lamp circuit plate 151 and mould-group circuit-board 205 are also possible to printed circuit board or soft or hard combination
Other circuit boards such as plate, are not defined the concrete form of flash lamp circuit plate 151 and mould-group circuit-board 205 herein.
Further referring to Fig. 2, mainboard 110 is formed with the first mounting hole 112 and the second mounting hole 114, the first imaging mould
Group 20 and the second imaging modules 30 are located in the first mounting hole 112 and the second mounting hole 114, in this way, can reduce electronics
The thickness of device 1000, so that the structure of electronic device 1000 is more compact.
In addition, the first mounting hole 112 and the second mounting hole 114 be there are also the effect of limit, by 20 He of the first imaging modules
When second imaging modules 30 are installed on mainboard 110, the efficiency of installation can be improved.First mounting hole 112 and the second connecting hole
114 can be connected to.
Please refer to Fig. 6-8, in present embodiment, the first imaging modules 20 include shell 21, reflecting element 22, mounting base
23, the first Lens assembly 24, motor element 25, the first imaging sensor 26 and driving mechanism 27.
Reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25 are arranged in shell 21.Reflective member
Part 22 is arranged in mounting base 23, and the first Lens assembly 24 is fixed on motor element 25.Motor element 25 is arranged in the first figure
As 26 side of sensor.Further, motor element 25 is located between reflecting element 22 and the first imaging sensor 26.
Driving mechanism 27 connects motor element 25 and shell 21.After incident light enters shell 21, by 22 turns of reflecting element
To then through the first Lens assembly 24 the first imaging sensor 26 of arrival, so that the first imaging sensor 26 obtains outside
Boundary's image.Driving mechanism 27 is for driving motor element 25 to move along the optical axis of the first Lens assembly 24.
Shell 21 is generally square shaped, and shell 21 has the first light inlet 211, and incident light enters from the first light inlet 211
In first imaging modules 20.That is, reflecting element 22 for after being turned to from the incident incident light of the first light inlet 211 simultaneously
The first imaging sensor 26 is reached after the first Lens assembly 24 so that the first imaging sensor 26 senses the first imaging modules 20
External incident light.
It will therefore be appreciated that the first imaging modules 20 are periscope type lens mould group, compared to vertical imaging modules, periscopic
The height of lens module is smaller, so as to reduce the integral thickness of electronic device 1000.Vertical imaging modules refer to camera lens
The optical axis of mould group is straight line, and in other words, incident light is conducted along the direction of a straight optical axis to the photoreceptor of lens module
On part.
Specifically, Fig. 3, Fig. 5 and Fig. 7 please be join, shell 21 includes roof 213 and side wall 214.Side wall 214 is from roof 213
Side 2131 extends to form.Roof 213 includes two opposite sides 2131, and the quantity of side wall 214 is two, each side wall
A 214 self-corresponding sides 2131 extend, and in other words, side wall 214 is separately connected the opposite two sides of roof 213.First entering light
Mouth 211 is formed in roof 213.
Reflecting element 22 is prism or plane mirror.In one example, when reflecting element 22 is prism, prism can be
Triangular prism, the section of prism are right angled triangle, wherein light is incident from one of right-angle side in right angled triangle,
To which another right-angle side is emitted after the reflection of bevel edge.It is appreciated that certainly, incident light can go out after refraction by prism
It penetrates, and without reflection.Prism can be made of relatively good materials of translucency such as glass, plastics.In an embodiment
In, it can be in reflectorized materials such as one of surface silver coatings of prism to reflect incident light.
It is appreciated that the reflection of generation incident light is realized that incident light is turned to by plane mirror when reflecting element 22 is plane mirror.
More, Fig. 8 and Figure 11 are please referred to, reflecting element 22 has incidence surface 222, shady face 224,226 and of reflective surface
Light-emitting surface 228.Incidence surface 222 close to and towards the first light inlet 211.Shady face 224 far from the first light inlet 211 and with enter light
Face 222 is opposite.Reflective surface 226 connects incidence surface 222 and shady face 224.Light-emitting surface 228 connects incidence surface 222 and shady face
224.Light-emitting surface 228 is towards the first imaging sensor 26.Reflective surface 226 is obliquely installed relative to incidence surface 222.Light-emitting surface 228
It is disposed opposite to each other with reflective surface 226.
Specifically, light passes through the first light inlet 211 and enters reflective member by incidence surface 222 in the conversion process of light
In part 22, then via the reflection of reflective surface 226, reflecting element 22 finally is reflected from light-emitting surface 228, completes the mistake of light conversion
Journey, and shady face 224 and mounting base 23 are fixedly installed, so that reflecting element 22 is keeping stablizing.
As shown in figure 12, in the related art, due to the needs of reflection incident ray, the reflective surface of reflecting element 22a
226a is tilted relative to horizontal direction, and reflecting element 22a is unsymmetric structure, thus reflective member on the reflection direction of light
The lower section of part 22a is smaller with respect to the practical optical area above reflecting element 22a, it can be understood as, far from the first light inlet 211
Part reflective surface 226a it is less or can not reflection light.
Therefore, Figure 13 please be join, the reflecting element 22 of the application embodiment is relative to reflecting element 22a in the related technology
The corner angle far from the first light inlet 211 have been cut off, have not only also been dropped without the effect of the reflection light of influence reflecting element 22 in this way
The low integral thickness of reflecting element 22.
Referring to Fig. 8, in some embodiments, reflective surface 226 is tilted relative to the angle [alpha] of incidence surface 222 in 45 degree.
In this way, incident light is made preferably to reflect and convert, has preferable light conversion effect.
Reflecting element 22 can be made of relatively good materials of translucency such as glass, plastics.In one embodiment,
It can be in reflectorized materials such as one of surface silver coatings of reflecting element 22 to reflect incident light.
In some embodiments, incidence surface 222 is arranged in parallel with shady face 224.
In this way, 22 held stationary of reflecting element, incidence surface 222 can be made when shady face 224 and mounting base 23 are fixedly installed
Also it is rendered as plane, incident light imitates the conversion of light in the optical path of the conversion process also formation rule of reflecting element 22
Rate is preferable.Specifically, the section of reflecting element 22 is substantially trapezoidal, in other words, instead along the light direction that enters of the first light inlet 211
The substantially trapezoidal body of optical element 22.
In some embodiments, incidence surface 222 and shady face 224 are each perpendicular to light-emitting surface 228.
In this way, more regular reflecting element 22 can be formed, keep the optical path of incident ray more straight, improves turning for light
Change efficiency.
In some embodiments, the distance range of incidence surface 222 and shady face 224 is 4.8-5.0mm.
Specifically, the distance between incidence surface 222 and shady face 224 can be 4.85mm, 4.9mm, 4.95mm etc..Or
It says, the distance range of incidence surface 222 and shady face 224 is it is to be understood that the height of reflecting element 22 is 4.8-5.0mm.More than
It is moderate that the incidence surface 222 of distance range and shady face 224 are formed by 22 volume of reflecting element, can preferably suit into the first one-tenth
The first imaging modules 20, CCD camera assembly 100 and electronic device 1000 as in mould group 20, forming more compact property and miniaturization,
Meet the more demands of consumer.
In some embodiments, incidence surface 222, shady face 224, reflective surface 226 and the equal cure process shape of light-emitting surface 228
At there is hardened layer.
When reflecting element 22 is made of materials such as glass, the material of reflecting element 22 itself is more crisp, in order to improve reflective member
The intensity of part 22 can be done at hardening in incidence surface 222, shady face 224, reflective surface 226 and the light-emitting surface 228 to reflecting element 22
Reason, more, can do cure process to all surface of reflecting element, to further increase the intensity of reflecting element.At hardening
Reason such as penetrate into lithium ion, do not influence reflecting element 22 convert light under the premise of to above each film on surface.
In one example, the angle turned to from the incident incident light of the first light inlet 211 is 90 degree by reflecting element 22.
For example, incidence angle of the incident light on the surface of emission of reflecting element 22 is 45 degree, angle of reflection is also 45 degree.Certainly, reflecting element
22 angles for turning to incident light can also be other angles, for example, 80 degree, 100 degree etc., as long as can by incident light turn back to
Up to the first imaging sensor 26.
In present embodiment, the quantity of reflecting element 22 is one, at this point, incident light reaches first after once turning to
Imaging sensor 26.In other embodiments, the quantity of reflecting element 22 is multiple, at this point, incident light is by least twice
The first imaging sensor 26 is reached after steering.
Mounting base 23 is for installing reflecting element 22, and in other words, mounting base 23 is the carrier of reflecting element 22, reflecting element
22 are fixed in mounting base 23.Make the position of reflecting element 22 in this way it was determined that being conducive to the reflection of reflecting element 22 or folding
Penetrate incident light.Reflecting element 22 can use viscose glue to be adhesively fixed in mounting base 23 to realize and be fixedly connected with mounting base 23.
Specifically, in present embodiment, mounting base 23 is provided with position limiting structure 232, and position limiting structure 232 connects reflecting element
22 to limit position of the reflecting element 22 in mounting base 23.
In this way, position limiting structure 232 limits position of the reflecting element 22 in mounting base 23 so that reflecting element 22 by
Positional shift will not occur in the case where shock, be conducive to 20 normal use of the first imaging modules.
It is appreciated that in one example, reflecting element 22 is fixed in mounting base 23 by way of bonding, if saved
Slightly position limiting structure 232, then, when the first imaging modules 20 are impacted, if between reflecting element 2222 and mounting base 23
Bonding force is insufficient, and reflecting element 22 is easy to fall off from mounting base 23.
In present embodiment, mounting base 23 is formed with mounting groove 233, and reflecting element 22 is arranged in mounting groove 233, limit
Structure 232 is arranged in the edge of mounting groove 233 and against reflecting element 22.
In this way, mounting groove 233 can make reflecting element 22 be easily mounted in mounting base 23.Position limiting structure 232 is arranged
Mounting groove 233 edge and against the edge of reflecting element 22, the position of reflecting element 22 not only can be limited, also not
Reflecting element 22 can be interfered incident light emitting to the first imaging sensor 26.
Further, position limiting structure 232 includes the protrusion 234 of the edge protrusion of self installation slot 233, and protrusion 234 is against out
The edge of smooth surface 228.Since reflecting element 22 is mounted in mounting base 23 by reflective surface 226, and light-emitting surface 228 and reflective surface
226 are disposed opposite to each other.Therefore, reflecting element 22 is more easier that position occurs towards the side of light-emitting surface 228 when being impacted.And
In present embodiment, in this way, position limiting structure 232 not only can prevent reflecting element 22 to light out against the edge of light-emitting surface 228
228 side of face displacement, it can also be ensured that light normally goes out light from light-emitting surface 228.
Certainly, in other embodiments, position limiting structure 232 may include other structures, as long as reflective member can be limited
The position of part 22.For example, position limiting structure 232 is formed with card slot, reflecting element 22 is formed with limited post, and limited post is fastened on
The position of reflecting element 22 is limited in card slot.
In some embodiments, protrusion 234 is in a strip shape and extends along the edge of light-emitting surface 228.In this way, protrusion 234 with
The contact area at the edge of light-emitting surface 228 is big, and reflecting element 22 is allowed more to be seated firmly on mounting base 23.
Certainly, in other embodiments, protrusion 234 can also be in other structures such as bulks.
It please join referring again to Fig. 7, in one example, mounting base 23 is movable to be arranged in shell 21,23 energy of mounting base
It is enough to rotate relative to shell 21 to adjust the direction that reflecting element 22 turns to incident light.
Mounting base 23 can drive reflecting element 22 to rotate together towards the opposite direction of the shake of the first imaging modules 20, from
And the incident deviation of the incident light of the first light inlet 211 is compensated, realize the effect of optical anti-vibration.
First Lens assembly 24 is contained in motor element 25, and further, the first Lens assembly 24 is arranged in reflective member
Between part 22 and the first imaging sensor 26.First Lens assembly 24 is used for image incoming light in the first imaging sensor 26
On.The first imaging sensor 26 is allowed to obtain the preferable image of quality in this way.
First Lens assembly 24 can be imaged when moving integrally along its optical axis on the first imaging sensor 26, thus real
Existing first imaging modules 20 focusing.First Lens assembly 24 includes multiple eyeglasses 241, when at least one eyeglass 241 is mobile, the
The whole focal length of one Lens assembly 24 changes, so that the function of 20 zoom of the first imaging modules is realized, more, by driving mechanism
27 driving motor elements 25 move in shell 21 to reach zoom purpose.
Specifically, the reflecting element 22 in periscopic camera is when periscopic camera falls, reflecting element
22 are easy by positional shift occurs, and reflecting element 22 can not cause accurately by turn light rays to the first imaging sensor 26
First imaging sensor 26 can not accurately sense the subject image outside periscopic camera, can not normal use.
In the example of fig. 8, in some embodiments, motor element 25 is cylindrical in shape, more in the first Lens assembly 24
A eyeglass 241 is fixed in motor element 25 along the axially spaced-apart of motor element 25.As Fig. 8 example in, motor element 25 wrap
Two intermediate plates 252 are included, eyeglass 241 is folded between two intermediate plates 252 by two intermediate plates 252.
It is appreciated that since motor element 25 is for being fixedly installed multiple eyeglasses 241, the length ruler of required motor element 25
Very little larger, motor element 25 can have the shape of more certain cavity for cylindrical shape, square tube shape etc., and such motor element 25 is in cylinder
Multiple eyeglasses 241 can be preferably arranged in dress, and can preferably protect eyeglass 241 in cavity, making eyeglass 241 be not susceptible to shake
It is dynamic.
In addition, in the example in Figure 10, multiple eyeglasses 241 are held between two intermediate plates 252 by motor element 25, both had
Standby certain stability, can also reduce the weight of motor element 25, can reduce driving mechanism 27 and drive needed for motor element 25
Power, and the design difficulty of motor element 25 is relatively low, and eyeglass 241 is also easier to be set on motor element 25.
Certainly, motor element 25 is not limited to tubular and two intermediate plates 252 mentioned above, in other implementations,
Motor element 25 such as may include that three pieces, four more intermediate plates 252 form more firm structure or a piece of intermediate plate 252 in this way
More simple structure；Or has cavity for cuboid, round etc. to accommodate the various regular or irregular of eyeglass 241
Shape.Under the premise of guaranteeing 10 normal imaging of imaging modules and operation, specific choice.
First imaging sensor 26 can use complementary metal oxide semiconductor (CMOS, Complementary Metal
Oxide Semiconductor) photosensitive element or charge coupled cell (CCD, Charge-coupled Device) photosensitive member
Part.
In some embodiments, driving mechanism 27 is electromagnetic drive mechanism, drive mechanism or memorial alloy driving
Mechanism.
It specifically, include magnetic field and conductor in electromagnetic drive mechanism, if magnetic field in the conductor can relative to conductor motion
Induced current is generated, induced current makes effect of the conductor by Ampere force, and Ampere force makes conductor motion, and conductor herein is
The part for driving motor element 25 mobile in electromagnetic drive mechanism；Drive mechanism, the inverse piezoelectricity based on piezoceramic material
Effect: if applying voltage to piezoelectric material, mechanical stress is generated, i.e., is changed between electric energy and mechanical energy, control is passed through
Make its mechanically deform generate rotation or linear motion, have the advantages that structure simply, low speed.
Characteristic of the driving of memorial alloy driving mechanism based on marmem: marmem is a kind of special
Alloy, once it is made to have remembered any shape, even if being deformed, but when being heated to a certain proper temperature, it can restore
Shape before to deformation achievees the purpose that driving with this, has the characteristics that displacement is rapid, direction is free.
Referring to Fig. 8, further, the first imaging modules 20 further include driving device 28, and driving device 28 is used for
Mounting base 23 of the driving with reflecting element 22 is rotated around pivot center 29.Driving device 28 is for drive installation seat 23 along rotation
The axial movement of axis 29.Pivot center 29 perpendicular to the first light inlet 211 optical axis and the first imaging sensor 26 it is photosensitive
Direction, so that the first imaging modules 20 realize the optics in the optical axis of the first light inlet 211 and the axial direction of pivot center 29
Stabilization.
In this way, 28 drive installation seat 23 of driving device moves in two directions due to the small volume of reflecting element 22,
The first imaging modules 20 not only may be implemented in the optical anti-vibration effect of both direction, it is also possible that the first imaging modules 20
Small volume.
It please join Fig. 7-Fig. 8, for the convenience of description, the width direction of the first imaging modules 20 is defined as X to short transverse
It is defined as Y-direction, length direction is defined as Z-direction.The optical axis of the first light inlet 211 is Y-direction as a result, the first imaging sensor 26
Photosensitive direction is Z-direction, the axial direction of pivot center 29 be X to.
The rotation of 28 drive installation seat 23 of driving device so that reflecting element 22 around X to rotation so that the first imaging mould
Group 20 realizes the effect of Y-direction optical anti-vibration.In addition, axial movement of 28 drive installation seat 23 of driving device along pivot center 29,
So that the first imaging modules 20 realize effect of the X to optical anti-vibration.In addition, the first Lens assembly 24 can along Z-direction with
Realize that the first Lens assembly 24 is focused on the first imaging sensor 26.
Specifically, around X to when rotation, the light that reflecting element 22 reflects moves reflecting element 22 in Y-direction, so that
First imaging sensor 26 forms different images in Y-direction to realize the anti-shake effect of Y-direction.Reflecting element 22 is along X to shifting
When dynamic, the light that reflecting element 22 reflects is moved up in X, so that the first imaging sensor 26 is upwardly formed difference in X
Image with realize X to anti-shake effect.
In some embodiments, driving device 28 is formed with arc-shaped guide rail 281, and driving device 28 is used for drive installation seat
23 along arc-shaped guide rail 281 around arc-shaped guide rail 281 central axis 282 rotation and along central axis 282 axial movement, in
Mandrel line 2282 is overlapped with pivot center 29.
It is appreciated that driving device 28 is used for drive installation seat 23 along arc-shaped guide rail 281 around the center of arc-shaped guide rail 281
The rotation of axis 282 and the axial movement along central axis 282.
In this way, since driving device 28 drives the mounting base 23 with reflecting element 22 by the way of arc-shaped guide rail 281
It rotates together, so that friction is small between driving device 28 and mounting base 23, is conducive to 23 stability of rotation of mounting base, improve
The optical anti-vibration effects of first imaging modules 20.
Specifically, Figure 14 please be join, in the related art, mounting base (not shown) and shaft 23a are rotatablely connected, mounting base around
Shaft 23a rotation to drive reflecting element 22a to rotate together.It is assumed that frictional force is f1, shaft 23a radius is R1, and thrust is
F1, radius of gyration R1.So friction-torque and thrust torque ratio K1 are K1=f1R1/F1A1.Due to reflecting element 22a
Fine rotation is only needed, therefore F1 cannot be excessive；And imaging modules itself need light and short to cause reflecting element 22a size cannot
Too big, the space that becomes larger of A is also limited, can not further eliminate so as to cause the influence of frictional force.
It please join Figure 15, and in the application, mounting base 23 is rotated along arc-shaped guide rail 281, and the radius of arc-shaped guide rail 281 is
R2.At this point, the ratio K2 of friction-torque and rotational torque is K2=f2R2/F2A, do not significantlyd change in f2, R2, F2
In the case where, due to being rotated using the swing mode of rail mounted, corresponding thrust torque becomes R2, and R2 can not be by anti-
The limitation of 22 size of optical element, or even accomplish the several times of R1 or more.Therefore in this case, frictional force rotates reflecting element 22
Influence the size of K2 (reduce) can be greatly reduced, so as to improve the rotation precision of reflecting element 22, so that the first imaging
The optical anti-vibration effect of mould group 20 is preferable.
It please join Fig. 8, in some embodiments, mounting base 23 includes arcwall face 231, arcwall face 231 and arc-shaped guide rail 281
It is arranged concentrically and cooperates with arc-shaped guide rail 281.In other words, the center of arcwall face 231 is overlapped with the center of arc-shaped guide rail 281.This
It is more compact that sample cooperates mounting base 23 with driving device 28.
In some embodiments, central axis 282 is located at outside the first imaging modules 20.In this way, the half of arc-shaped guide rail 281
Diameter R2 is larger, can reduce the adverse effect that frictional force rotates mounting base 23 in this way.
In some embodiments, driving device 28 is located at the bottom of shell 21.In other words, driving device 28 and shell 21
It is structure as a whole.In this way, the structure of the first imaging modules 20 is more compact.
In some embodiments, the drive installation seat 23 by way of electromagnetism of driving device 28 rotates.In an example
In, driving device 28 is provided with coil, is fixed with electromagnetic plate in mounting base 23, and after coil energization, coil can produce magnetic field
To drive electromagnetic plate to move, so that mounting base 23 and reflecting element be driven to rotate together.
Certainly, in other embodiments, driving device 28 can by way of Piezoelectric Driving or memorial alloy driving
Mode drive installation seat 23 move.The mode of Piezoelectric Driving and memory alloy driven mode please join foregoing description, herein not
It repeats again.
Referring to Fig. 6-Fig. 9, the first imaging modules 20 further include chip circuit plate 201 and driving chip 202, chip
Circuit board 201 is fixed on the side of driving mechanism 27, and driving chip 202 is fixed on chip circuit plate 201 and 27 phase of driving mechanism
The one side of back, driving chip 202 are electrically connected by chip circuit plate 201 and driving mechanism 27.
In this way, driving chip 202 is fixed on the side of driving mechanism 27 by chip circuit plate 201, and pass through chip
Circuit board 201 and driving mechanism 27 are electrically connected, so that the structure between driving chip 202 and driving mechanism 27 is more stepped up
It gathers, advantageously reduces the volume of the first imaging modules 20.
Specifically, driving chip 202 drives motor element 25 along the first Lens assembly 24 for controlling driving mechanism 27
Optical axis is mobile, the imaging so that the first Lens assembly 24 is focused on the first imaging sensor 26.Driving chip 202 is used for according to top
Mounting base 23 of the feedback data control driving of driving device 28 with reflecting element 22 of spiral shell instrument is rotated around pivot center 29.Driving
Chip 202 is also used to control 28 drive installation seat 23 of driving device along the axial direction of pivot center 29 according to the feedback data of gyroscope
It is mobile.
Driving chip 202 is also used to control 28 drive installation seat 23 of driving device along arc according to the feedback data of gyroscope
Shape guide rail 281 is around the rotation of central axis 282 of arc-shaped guide rail 281 and along the axial movement of central axis 282.
In some embodiments, the first imaging modules 20 include sensor circuit board 203, and the first imaging sensor 26 is solid
It is scheduled on sensor circuit board 203, chip circuit plate 201 includes mounting portion 2011 and interconnecting piece 2022, and mounting portion 2011 is fixed on
The side of driving mechanism 27, driving chip 202 are fixed on mounting portion 2011, and interconnecting piece 2022 connects mounting portion 2011 and sensor
Circuit board 203.
In this way, driving chip 202 can be electrically connected by sensor circuit board 203 and the first imaging sensor 26.Tool
Body, interconnecting piece 2022 can be fixedly connected with sensor circuit board 203 by welding.
In one example, when assembling the first imaging modules 20, driving chip 202 first can be fixed on chip circuit
On plate 201, then the chip circuit plate 201 with driving chip 202 is connected by welding with sensor circuit board 203
It connects, the chip circuit plate 201 with driving chip 202 is finally fixed on to the side of driving mechanism 27.
Chip circuit plate 201 can be fixedly connected by the modes such as welding, being bonded with driving mechanism 27.
It should be pointed out that the side that chip circuit plate 201 is fixed on driving mechanism 27 can refer to chip circuit plate 201 with
The side of driving mechanism 27, which contacts, to be fixed, and can also refer to that chip circuit plate 201 passes through the side of other elements and driving mechanism 27
It is fixedly connected.
In present embodiment, mounting portion 2011 is rigid circuit board, and interconnecting piece 2022 is flexible circuit board, mounting portion 2011
It is fitted in the side of driving mechanism 27.
In this way, mounting portion 2011 is that rigid circuit board makes mounting portion 2011 have preferable rigidity, it is unlikely to deform, favorably
It is fixedly connected in mounting portion 2011 with the side of driving mechanism 27.Mounting portion 2011 can be fitted in driving by way of bonding
The side of mechanism 27.In addition, interconnecting piece 2022 is that flexible circuit board is easily deformed chip circuit plate 201, so that chip is electric
Road plate 201 is easily mounted on the side of driving mechanism 27.
Certainly, in other embodiments, mounting portion 2011 or flexible circuit board.
In some embodiments, shell 21 is formed with avoid holes 215, and driving chip 202 is at least partially disposed at avoid holes
In 215, to be exposed to shell 21.Make between driving chip 202 and shell 21 in this way, driving chip 202 wears shell 21
There are the parts of overlapping, so that the structure between driving chip 202 and shell 21 is more compact, can further decrease
The volume of one imaging modules 20.
It is appreciated that 202 part of driving chip is located at when having gap between the side of driving mechanism 27 and shell 21
In avoid holes 215.
Preferably, the shape of avoid holes 215, size respectively with the shape of driving chip 202, dimensional fits.For example, evacuation
The size in hole 215 is slightly larger than the size of driving chip 202, and the shape of avoid holes 215 is identical as the shape of driving chip 202.
In present embodiment, avoid holes 215 are formed in the side wall 214 of shell 21.It is appreciated that avoid holes 215 run through side
The interior outside of wall 214.Certainly, in other embodiments, avoid holes 215 can also be formed in the roof 213 of shell 21.
Please referring to Fig. 3, Fig. 4 and Figure 16, in present embodiment, the second imaging modules 30 are vertical imaging modules, certainly,
In other embodiments, the second imaging modules 30 can also be with periscope type lens mould group.
Second imaging modules 30 include the second Lens assembly 31 and the second imaging sensor 32, and the second Lens assembly 31 is used for
Light is imaged on the second imaging sensor 32, the optical axis of the incident light axis of the second imaging modules 30 and the second Lens assembly 31
It is overlapped.
The type of second imaging sensor 32 can be as the type of the first imaging sensor 26, and details are not described herein.
Second imaging modules 30 have the second light inlet 152, and the second imaging modules 30 are used to adopt by the second light inlet 152
Collect external image.Specifically, the second imaging modules 30 include pedestal 154 and the lens barrel 153 being arranged in pedestal 154, lens barrel 153
It is formed with the second light inlet 152, flash lamp 140 is arranged on pedestal 154 by flash lamp circuit plate 151.And 140, flash lamp
Between the first light inlet 211 and the second light inlet 152.
In the CCD camera assembly 100 of the application embodiment, by being arranged flash lamp 140 in 211 He of the first light inlet
Between second light inlet 152, reduce the total length that the first imaging modules 20 and the second imaging modules 30 are arranged in pairs or groups with flash lamp 140
Or overall width, more compact structure, space hold is smaller, reduces the cost of CCD camera assembly 100, is conducive to CCD camera assembly
100 large-scale production.
Specifically, the second Lens assembly 31 is located inside lens barrel 153, in this way, can protect the by the setting of lens barrel 153
Two Lens assemblies 31 are not damaged, to promote the service life of electronic device 1000.
In some embodiments, flash lamp circuit plate 151 is set on pedestal 154, it may also be said to flash lamp 140 and pedestal
154 are located at the two sides opposite in flash lamp circuit plate 151, and flash lamp 140 is arranged by flash lamp circuit plate 151 in other words
On pedestal 154.Pedestal 154 has the effect of that fixed flash lamp circuit plate 151, pedestal 154 enable to flash lamp circuit plate
Connect more stable between 151 and mould-group circuit-board 205, pedestal 154 can support flash lamp circuit plate 151, prevent from glistening
Excessive bending, which occurs, in lamp circuit board 151 leads to the damage of flash lamp circuit plate 151.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle and objective of the application and become
Type, scope of the present application are defined by the claims and their equivalents.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822021538.7U CN209017102U (en) | 2018-12-03 | 2018-12-03 | Camera assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822021538.7U CN209017102U (en) | 2018-12-03 | 2018-12-03 | Camera assembly and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209017102U true CN209017102U (en) | 2019-06-21 |
Family
ID=66843477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822021538.7U Expired - Fee Related CN209017102U (en) | 2018-12-03 | 2018-12-03 | Camera assembly and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209017102U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413243A (en) * | 2018-12-03 | 2019-03-01 | Oppo广东移动通信有限公司 | CCD camera assembly and electronic device |
-
2018
- 2018-12-03 CN CN201822021538.7U patent/CN209017102U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413243A (en) * | 2018-12-03 | 2019-03-01 | Oppo广东移动通信有限公司 | CCD camera assembly and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109327572B (en) | Imaging module, camera assembly and electronic device | |
| CN109274877A (en) | Imaging module, camera assembly and electronic device | |
| CN109286707A (en) | Camera assembly and electronics | |
| CN108769493A (en) | CCD camera assembly and electronic device | |
| CN108769325A (en) | Electronic device | |
| CN109194860A (en) | Imaging modules, CCD camera assembly and electronic device | |
| CN109218589A (en) | Imaging modules, CCD camera assembly and electronic device | |
| CN109218590A (en) | Imaging modules, CCD camera assembly and electronic device | |
| CN109327571A (en) | Camera assembly and electronic device | |
| CN209017100U (en) | Camera assembly and electronic device | |
| CN209151242U (en) | Imaging module, camera assembly and electronic device | |
| CN108769492A (en) | CCD camera assembly and electronic device | |
| CN109413315A (en) | Electronic device | |
| CN209017102U (en) | Camera assembly and electronic device | |
| CN209017101U (en) | Camera assembly and electronic device | |
| CN208874602U (en) | electronic device | |
| CN208874604U (en) | electronic device | |
| CN209151241U (en) | Imaging module, camera assembly and electronic device | |
| CN109413243A (en) | CCD camera assembly and electronic device | |
| CN109600535A (en) | CCD camera assembly and electronic device | |
| CN209072598U (en) | Electronic device | |
| CN109525690A (en) | Camera assembly and electronic device | |
| CN110062070B (en) | Imaging module, camera assembly and electronic device | |
| CN109246267A (en) | Electronic device | |
| CN109246268A (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190621 |