CN209151242U - Imaging module, camera assembly and electronic device - Google Patents

Abstract

The present application provides an imaging module, a camera assembly and an electronic device. The imaging module includes a casing; and a reflective element, an image sensor, a lens assembly, a moving element and a driving mechanism all arranged in the casing, the moving element is located between the reflective element and the image sensor, and the lens assembly is fixed on the moving element; The optical port, the imaging module also includes a chip circuit board and a driving chip. The chip circuit board is fixed on the side of the driving mechanism, and the driving chip is fixed on the side of the chip circuit board that is opposite to the driving mechanism. The driving chip is electrically connected to the driving mechanism through the chip circuit board. sexual connection. In the imaging module, the camera assembly and the electronic device of the embodiments of the present application, the driving chip is fixed on the side of the driving mechanism through the chip circuit board, and is electrically connected to the driving mechanism through the chip circuit board, so that the gap between the driving chip and the driving mechanism is formed. The structure is more compact, which is beneficial to reduce the volume of the imaging module.

Description

Imaging module, camera assembly and electronic device

technical field

The present application relates to the field of electronic devices, and in particular, to an imaging module, a camera assembly and an electronic device.

Background technique

In the related art, in order to improve the photographing effect of the mobile phone, the camera of the mobile phone adopts a periscope lens. For example, the periscope camera can perform three times the optical focal length to obtain images with better quality. The periscope camera includes a light-reversing element, and the light-reversing element is used for turning the light incident into the periscope lens and then conducting it to the image sensor, so that the image sensor can obtain an image outside the periscope lens. The periscope camera also includes a driver chip for the periscope camera to work, and the driver chip causes the periscope camera to be bulky.

Utility model content

In view of this, the present application provides an imaging module, a camera assembly and an electronic device.

The imaging module of the embodiment of the present application includes:

shell; and

A reflective element, an image sensor, a lens assembly, a moving element and a driving mechanism are all arranged in the housing, the moving element is located between the reflective element and the image sensor, and the lens assembly is fixed on the moving element superior;

The housing has a light inlet, and the reflective element is used for diverting incident light incident from the light inlet and passing through the lens assembly to the image sensor so that the image sensor senses the image the incident light outside the module;

The driving mechanism is used to drive the moving element to move along the optical axis of the lens assembly to make the lens assembly focus and image on the image sensor;

The imaging module further includes a chip circuit board and a driving chip, the chip circuit board is fixed on the side of the driving mechanism, and the driving chip is fixed on the side of the chip circuit board opposite to the driving mechanism, so the The driving chip is electrically connected to the driving mechanism through the chip circuit board.

The camera assembly of the embodiment of the present application includes a first imaging module, a second imaging module and a third imaging module, the first imaging module is the imaging module described above, and the third imaging module is The viewing angle is greater than the viewing angle of the first imaging module and smaller than the viewing angle of the second imaging module.

The electronic device according to the embodiment of the present application includes a body and a sliding module, the sliding module is used for sliding between a first position accommodated in the body and a second position exposed from the body, and the sliding module is provided with There is the camera assembly described above.

In the imaging module, the camera assembly, and the electronic device of the embodiments of the present application, the driving chip is fixed on the side of the driving mechanism through the chip circuit board, and is electrically connected to the driving mechanism through the chip circuit board, so that the gap between the driving chip and the driving mechanism is formed. The structure is more compact, which is beneficial to reduce the volume of the imaging module.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

1 is a schematic state diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is another state schematic diagram of the electronic device according to an embodiment of the present application;

3 is a schematic perspective view of a camera assembly according to an embodiment of the present application;

4 is a schematic perspective view of a first imaging module according to an embodiment of the present application;

5 is an exploded schematic view of a first imaging module according to an embodiment of the present application;

6 is a schematic cross-sectional view of a first imaging module according to an embodiment of the present application;

7 is a partial cross-sectional schematic diagram of a first imaging module according to an embodiment of the present application;

8 is a schematic cross-sectional view of a first imaging module according to another embodiment of the present application;

FIG. 9 is a schematic perspective view of a light-reflecting element according to an embodiment of the present application.

10 is a schematic diagram of light reflection imaging of an imaging module in the related art;

11 is a schematic diagram of light reflection imaging of the first imaging module according to an embodiment of the present application;

12 is a schematic structural diagram of an imaging module in the related art;

13 is a schematic structural diagram of a first imaging module according to an embodiment of the present application;

14 is a schematic cross-sectional view of a second imaging module according to an embodiment of the present application.

Description of main component symbols:

Electronic device 1000, body 110, sliding module 200, gyroscope 120;

Camera assembly 100, first imaging module 20, housing 21, light inlet 211, groove 212, top wall 213, side wall 214, avoidance hole 215, reflective element 22, light incident surface 222, backlight surface 224, incident light Surface 226, light exit surface 228, mounting seat 23, arc surface 231, first lens assembly 24, lens 241, moving element 25, clip 222, first image sensor 26, drive mechanism 27, drive device 28, arc guide 281, central axis 282, chip circuit board 201, mounting part 2011, connecting part 2022, driver chip 202, sensor circuit board 203, shield 204, second imaging module 30, second lens assembly 31, second image sensor 32 , a third imaging module 40 , and a bracket 50 .

Detailed ways

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present application, and should not be construed as a limitation on the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

In the existing optical anti-shake method, a separate camera gyroscope is usually installed in the imaging module to detect the jitter of the camera. At the same time, the imaging module includes a PCB circuit board with a driver chip, which results in an optical anti-shake. The size of the shaking imaging module is larger than that of the ordinary imaging module, and cannot be reduced.

Please refer to FIG. 1 and FIG. 2 , the electronic device 1000 according to the embodiment of the present application includes a body 110 and a sliding module 200 . The sliding module 200 is used for sliding between a first position accommodated in the body 110 and a second position exposed from the body 110 . The sliding module 200 is provided with a camera assembly 100 and a gyroscope 120 , and the camera assembly 100 and the gyroscope 120 are separated. set up. The electronic device 1000 can be used to control the camera assembly 100 to work according to the feedback data of the gyroscope 120 to realize optical anti-shake shooting.

In the above electronic device, the camera assembly 100 is disposed separately from the gyroscope 120 , which reduces the components in the camera assembly 100 , thereby reducing the volume of the camera assembly 100 . In addition, the camera assembly 100 and the gyroscope 120 are both arranged in the sliding module 200, so that the gyroscope 120 is relatively close to the camera assembly 100, and the gyroscope 120 can accurately detect the shaking of the camera assembly 100, which improves the anti-shake effect of the camera assembly 100. .

Exemplarily, the electronic device 1000 may be any one of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is exemplarily shown in FIG. 1 ). Specifically, the electronic device 1000 can be a mobile phone or a smart phone (eg, iPhone TM-based, Android TM-based phones), portable game devices (eg, Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), laptop laptops, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices, as well as watches, in-ear headphones, pendants, headphones, etc., the electronic device 100 can also be other wearable devices (for example, Head mounted devices (HMDs) such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices or smart watches.

The electronic device 1000 may also be any of a number of electronic devices, including but not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders , video recorders, cameras, other media recorders, radios, medical equipment, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptops, desktop computers, printers, netbooks, personal digital assistants (PDAs), portable Multimedia players (PMP), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices and digital cameras and combinations thereof.

In some cases, the electronic device 1000 may perform various functions (eg, play music, display videos, store pictures, and receive and send phone calls). If desired, the electronic device 1000 may be a portable device such as a cellular phone, media player, other handheld device, wristwatch device, pendant device, handset device, or other compact portable device.

As a typical sensor, the gyroscope 120 can be used to detect the linear motion of the electronic device 1000 in the axial direction, and can measure the motion of rotation and deflection. For example, the gyroscope 120 can detect the vertical or horizontal state of the electronic device 1000, and then the central processing unit of the electronic device 1000 can control the rotation of the display screen according to the acquired detection data.

In this embodiment, during imaging, the gyroscope 120 of the electronic device 1000 is used to detect the tiny shaking generated by the camera assembly 100, and the gyroscope 120 will detect the shaking data, such as the tilt angle caused by the shaking of the camera assembly 100, by The offset generated by the tilt is sent to the processing chip of the electronic device 1000 , and the processing chip is, for example, the driver chip described below. The processing chip controls the components in the imaging module to move relative to the components generated by the camera assembly 100 according to the received feedback data of the gyroscope 120 to realize anti-shake.

It can be understood that the gyroscopes 120 of the electronic device 1000 are all disposed at other positions than the camera assembly 100 , thereby saving the space for disposing the independent gyroscopes and driving chips in the camera assembly 100 . In this way, the size of the camera assembly 100 is similar to that of a common camera assembly, and the gyroscope 120 of the electronic device 1000 can be used to realize optical anti-shake, effectively reducing the size of the camera assembly 100 while retaining the anti-shake function.

Specifically, please refer to FIG. 1 and FIG. 2 , the body 110 further includes a top end surface 1002 and a bottom end surface 1003 disposed opposite to the top end surface 1002 . Generally, the top end surface 1002 and the bottom end surface 1003 may extend along the width direction of the body 110 . That is, the top end surface 1002 and the bottom end surface 1003 are the short sides of the electronic device 1000 . The bottom end surface 1003 is used for arranging connectors, microphones, speakers, etc. of the electronic device 1000 .

An accommodating groove 1004 is formed on the top of the body 110 , and the accommodating groove 1004 is recessed from the top of the body 110 to the interior of the body 110 . The accommodating groove 1004 may penetrate the side surface of the body 110 . The sliding module 200 is slidably connected to the main body 110 in the accommodating slot 1004 . In other words, the sliding module 200 is slidably connected to the body 110 to extend or retract the accommodating groove 1004 .

The sliding module 200 includes a top surface 2003 , and when the sliding module 200 is in the first position, the top surface is substantially flush with the top surface 1002 . The sliding module 200 can be connected with a screw mechanism, and the screw mechanism can drive the sliding module 200 to slide between the first position and the second position.

It can be understood that when the sliding module 200 extends out of the accommodating slot 1004, the camera assembly 100 is exposed outside the body 110, and at this time, the camera assembly 100 can shoot normally.

Please refer to FIG. 3 , the camera assembly 100 includes a first imaging module 20 , a second imaging module 30 , a third imaging module 40 and a bracket 50 .

The first imaging module 20 , the second imaging module 30 and the third imaging module 40 are all disposed in the bracket 50 and fixedly connected to the bracket 50 . The bracket 50 can reduce the impact on the first imaging module 20 , the second imaging module 30 and the third imaging module 40 , and improve the service life of the first imaging module 20 , the second imaging module 30 and the third imaging module 40 .

In this embodiment, the field of view angle FOV3 of the third imaging module 40 is greater than the field of view angle FOV1 of the first imaging module 20 and smaller than the field of view angle FOV2 of the second imaging module 30 , that is, FOV1 < FOV3 <FOV2. In this way, the three imaging modules with different viewing angles enable the camera assembly 100 to meet shooting requirements in different scenarios.

In one example, the field of view angle FOV1 of the first imaging module 20 is 10-30 degrees, the field of view angle FOV2 of the second imaging module 30 is 110-130 degrees, and the field of view angle FOV3 of the third imaging module 40 80-110 degrees.

For example, the field of view angle FOV1 of the first imaging module 20 is 10 degrees, 12 degrees, 15 degrees, 20 degrees, 26 degrees, or 30 degrees. The field of view angle FOV2 of the second imaging module 30 is 110 degrees, 112 degrees, 118 degrees, 120 degrees, 125 degrees or 130 degrees. The field of view angle FOV3 of the third imaging module 40 is 80 degrees, 85 degrees, 90 degrees, 100 degrees, 105 degrees, or 110 degrees.

Since the field of view FOV1 of the first imaging module 20 is relatively small, it can be understood that the focal length of the first imaging module 20 is relatively large. Therefore, the first imaging module 20 can be used for shooting long-range images, so as to obtain images with clear long-range views. . The field of view FOV2 of the second imaging module 30 is relatively large. It can be understood that the focal length of the second imaging module 30 is relatively short. Therefore, the second imaging module 30 can be used to capture close-up shots to obtain local close-up images of objects. The third imaging module 40 can be used to photograph objects normally.

In this way, through the combination of the first imaging module 20 , the second imaging module 30 and the third imaging module 40 , image effects such as background blur and partial picture sharpening can be obtained.

The first imaging module 20 , the second imaging module 30 and the third imaging module 40 are arranged side by side. In this embodiment, the first imaging module 20 , the second imaging module 30 and the third imaging module 40 are arranged in a line. Further, the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40 .

Due to the angle of view of the first imaging module 20 and the third imaging module 40, in order to obtain better quality images from the first imaging module 20 and the third imaging module 40, the first imaging module 20 and the third imaging module 40 The three imaging modules 40 may be configured with an optical anti-shake device, and the optical anti-shake device is generally configured with many magnetic elements, so the first imaging module 20 and the third imaging module 40 can generate a magnetic field.

In this embodiment, the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40, so that the first imaging module 20 and the third imaging module 40 can be far away, preventing the first imaging The magnetic field formed by the module 20 and the magnetic field formed by the third imaging module 40 interfere with each other and affect the normal use of the first imaging module 20 and the third imaging module 40 .

In other embodiments, the first imaging module 20 , the second imaging module 30 and the third imaging module 40 may be arranged in an L shape.

The first imaging module 20 , the second imaging module 30 and the third imaging module 40 may be arranged at intervals, and two adjacent imaging modules may also abut against each other.

In the first imaging module 20, the second imaging module 30 and the third imaging module 30, any imaging module can be a black and white camera, an RGB camera or an infrared camera.

The processing chip of the electronic device 1000 is used to control the operation of the first imaging module 20 according to the feedback data of the gyroscope 120 to realize optical anti-shake shooting.

Referring to FIGS. 4-6 , in this embodiment, the first imaging module 20 includes a housing 21 , a reflective element 22 , a mounting seat 23 , a first lens assembly 24 , a moving element 25 , a first image sensor 26 and a driving mechanism 27 .

The reflective element 22 , the mounting seat 23 , the first lens assembly 24 , and the moving element 25 are all arranged in the housing 21 . The reflective element 22 is arranged on the mounting seat 23 , and the first lens assembly 24 is fixed on the moving element 25 . The moving element 25 is provided on the side of the first image sensor 26 . Further, the moving element 25 is located between the reflective element 22 and the first image sensor 26 .

The drive mechanism 27 connects the moving element 25 with the housing 21 . After the incident light enters the housing 21, it is deflected by the reflective element 22, and then passes through the first lens assembly 24 to reach the first image sensor 26, so that the first image sensor 26 obtains an image of the outside world. The driving mechanism 27 is used to drive the moving element 25 to move along the optical axis of the first lens assembly 24 .

The casing 21 is substantially in the shape of a square. The casing 21 has a light inlet 211 , and incident light enters the first imaging module 20 from the light inlet 211 . That is to say, the reflective element 22 is used to redirect the incident light incident from the light inlet 211 and transmit it to the first image sensor 26 through the first lens assembly 24 so that the first image sensor 26 senses the first imaging module 20 External incident light.

Therefore, it can be understood that the first imaging module 20 is a periscope lens module. Compared with the vertical lens module, the height of the periscope lens module is smaller, so that the overall thickness of the electronic device 1000 can be reduced. The vertical lens module means that the optical axis of the lens module is a straight line, or in other words, the incident light is transmitted to the photosensitive device of the lens module along the direction of a straight optical axis.

It can be understood that the light inlet 211 is exposed through the through hole 11 so that the external light enters the first imaging module 20 from the light inlet 211 after passing through the through hole 11 .

Specifically, referring to FIG. 5 , the housing 21 includes a top wall 213 and a side wall 214 . The side wall 214 is formed to extend from the side edge 2131 of the top wall 213 . The top wall 213 includes two opposite sides 2131 , the number of the side walls 214 is two, and each side wall 214 extends from a corresponding side 2131 , or in other words, the side walls 214 are connected to the opposite sides of the top wall 213 respectively. sides. The light inlet 211 is formed on the top wall 213 .

The light-reflecting element 22 is a prism or a plane mirror. In one example, when the reflective element 22 is a prism, the prism can be a triangular prism, and the cross-section of the prism is a right-angled triangle, wherein the light is incident from one of the right-angled sides of the right-angled triangle, and after the reflection of the hypotenuse, the other right-angled side shot. It can be understood that, of course, the incident light can be refracted by the prism and then exit without being reflected. The prism can be made of materials with relatively good light transmittance such as glass and plastic. In one embodiment, one surface of the prism may be coated with a reflective material such as silver to reflect incident light.

It can be understood that when the reflective element 22 is a flat mirror, the flat mirror reflects the incident light so as to turn the incident light.

For more details, please refer to FIG. 6 and FIG. 9 , the reflective element 22 has a light incident surface 222 , a backlight surface 224 , a light reflection surface 226 and a light exit surface 228 . The light incident surface 222 is close to and faces the light inlet 211 . The backlight surface 224 is away from the light inlet 211 and is opposite to the light incident surface 222 . The light-reflecting surface 226 is connected to the light-incident surface 222 and the backlight surface 224 . The light-emitting surface 228 is connected to the light-incident surface 222 and the backlight surface 224 . The light-reflecting surface 226 is inclined relative to the light-incident surface 222 . The light-emitting surface 228 is disposed opposite to the light-reflecting surface 226 .

Specifically, in the process of light conversion, the light passes through the light inlet 211 and enters the reflective element 22 from the light incident surface 222, then is reflected by the reflective surface 226, and finally reflects out of the reflective element 22 from the light exit surface 228 to complete the light conversion. During the process, the backlight surface 224 and the mounting seat 23 are fixedly arranged to keep the reflective element 22 stable.

As shown in FIG. 10 , in the related art, due to the need to reflect incident light, the reflective surface 226a of the reflective element 22a is inclined with respect to the horizontal direction, and the reflective element 22a has an asymmetric structure in the reflection direction of the light, so the reflective element 22a has an asymmetric structure. The actual optical area below the reflective element 22a is relatively small, and it can be understood that the part of the reflective surface 226a far from the light inlet is less or unable to reflect light.

Therefore, referring to FIG. 11 , the reflective element 22 according to the embodiment of the present application has cut edges and corners away from the light inlet relative to the reflective element 22 a in the related art, which not only does not affect the effect of reflecting light of the reflective element 22 , but also reduces the reflection of light. The overall thickness of element 22 .

Referring to FIG. 6 , in some embodiments, the angle α of the light-reflecting surface 226 relative to the light-incident surface 222 is inclined at 45 degrees.

In this way, the incident light is better reflected and converted, and has a better light conversion effect.

The light-reflecting element 22 can be made of materials with relatively good light transmittance, such as glass and plastic. In one embodiment, a reflective material such as silver may be coated on one surface of the reflective element 22 to reflect incident light.

In some embodiments, the light incident surface 222 and the backlight surface 224 are arranged in parallel.

In this way, when the backlight surface 224 and the mounting seat 23 are fixedly arranged, the reflective element 22 can be kept stable, the light incident surface 222 also appears as a plane, and the incident light in the conversion process of the reflective element 22 also forms a regular light path, so that the light rays are The conversion efficiency is better. Specifically, along the light incident direction of the light inlet 211 , the cross-section of the reflective element 22 is substantially trapezoidal, or in other words, the reflective element 22 is substantially trapezoidal.

In some embodiments, the light incident surface 222 and the backlight surface 224 are both perpendicular to the light exit surface 228 .

In this way, a relatively regular light-reflecting element 22 can be formed, so that the light path of the incident light is relatively straight, and the conversion efficiency of the light is improved.

In some embodiments, the distance between the light incident surface 222 and the backlight surface 224 is in the range of 4.8-5.0 mm.

Specifically, the distance between the light incident surface 222 and the backlight surface 224 may be 4.85 mm, 4.9 mm, 4.95 mm, or the like. In other words, the range of the distance between the light incident surface 222 and the backlight surface 224 can be understood as the height of the reflective element 22 is 4.8-5.0 mm. The reflective element 22 formed by the light incident surface 222 and the backlight surface 224 in the above distance range is moderate in size, and can be well fitted into the first imaging module 20 to form a more compact and miniaturized first imaging module 20, The camera assembly 100 and the electronic device 1000 meet more demands of consumers.

In some embodiments, the light incident surface 222 , the backlight surface 224 , the light reflection surface 226 and the light exit surface 228 are all hardened to form a hardened layer.

When the reflective element 22 is made of materials such as glass, the material of the reflective element 22 itself is relatively brittle. 228 is hardened, and more, all surfaces of the reflective element can be hardened to further increase the strength of the reflective element. The hardening treatment is such as infiltration of lithium ions, and filming the above surfaces without affecting the light conversion of the reflective element 22 .

In one example, the angle at which the light reflecting element 22 turns the incident light incident from the light inlet 211 is 90 degrees. For example, the incident angle of the incident light on the emitting surface of the reflective element 22 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the angle at which the reflective element 22 turns the incident light can also be other angles, such as 80 degrees, 100 degrees, etc., as long as the incident light can be turned to reach the first image sensor 26 .

In this embodiment, the number of the reflective elements 22 is one, and at this time, the incident light is transmitted to the first image sensor 26 after being turned once. In other embodiments, the number of the reflective elements 22 is multiple. In this case, the incident light is transmitted to the first image sensor 26 after at least two turns.

The mounting seat 23 is used for mounting the reflective element 22 , or in other words, the mounting seat 23 is a carrier of the reflective element 22 , and the reflective element 22 is fixed on the mounting seat 23 . In this way, the position of the reflective element 22 can be determined, which is beneficial to the reflection or refraction of the incident light by the reflective element 22 . The reflective element 22 can be fixed on the mounting seat 23 by adhesive bonding to realize the fixed connection with the mounting seat 23 .

Referring to FIG. 5 again, in one example, the mounting seat 23 is movably disposed in the housing 21 , and the mounting seat 23 can be rotated relative to the housing 21 to adjust the direction in which the reflective element 22 turns the incident light.

The mounting seat 23 can drive the reflective element 22 to rotate together in the opposite direction of the shaking of the first imaging module 20 , thereby compensating for the incident light deviation of the incident light of the light inlet 211 and realizing the effect of optical anti-shake.

The first lens assembly 24 is accommodated in the moving element 25 , and further, the first lens assembly 24 is disposed between the reflective element 22 and the first image sensor 26 . The first lens assembly 24 is used to image incident light on the first image sensor 26 . In this way, the first image sensor 26 can obtain images with better quality.

The first lens assembly 24 can form an image on the first image sensor 26 when it moves as a whole along its optical axis, so as to realize the focusing of the first imaging module 20 . The first lens assembly 24 includes a plurality of lenses 241. When at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, so as to realize the zoom function of the first imaging module 20. More, it is driven by the driving mechanism 27 The moving element 25 moves in the housing 21 for zooming purpose.

In the example of FIG. 6 , in some embodiments, the moving element 25 is cylindrical, and the plurality of lenses 241 in the first lens assembly 24 are fixed in the moving element 25 along the axial interval of the moving element 25 . In the example of FIG. 8 , the moving element 25 includes two clips 252 that sandwich the lens 241 between the two clips 252 .

It can be understood that since the moving element 25 is used to fix a plurality of lenses 241, the required length of the moving element 25 is relatively large. If the element 25 is installed in a tube, a plurality of lenses 241 can be better arranged, and the lenses 241 can be better protected in the cavity, so that the lenses 241 are not easily shaken.

In addition, in the example of FIG. 8 , the moving element 25 clamps the plurality of lenses 241 between the two clips 252 , which not only has a certain stability, but also reduces the weight of the moving element 25 and reduces the driving force of the driving mechanism 27 . The power required by the moving element 25 is relatively low, and the design difficulty of the moving element 25 is also relatively low, and the lens 241 is also easier to set on the moving element 25 .

Of course, the moving element 25 is not limited to the above-mentioned cylindrical shape and two clips 252. In other embodiments, the moving element 25 may include three, four or more clips 252 to form a more stable structure. , or a simpler structure such as a clip 252 ; or a rectangular body, a circular body, etc., with a cavity to accommodate various regular or irregular shapes of the lens 241 . On the premise of ensuring the normal imaging and operation of the imaging module 10, the specific selection can be made.

The first image sensor 26 may use a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) photosensitive element or a charge-coupled device (CCD, Charge-coupled Device) photosensitive element.

In some embodiments, the driving mechanism 27 is an electromagnetic driving mechanism, a piezoelectric driving mechanism or a memory alloy driving mechanism.

Specifically, the electromagnetic drive mechanism includes a magnetic field and a conductor. If the magnetic field moves relative to the conductor, an induced current will be generated in the conductor. The induced current causes the conductor to be affected by the ampere force, and the ampere force causes the conductor to move. The conductor here is an electromagnetic The part of the driving mechanism that drives the moving element 25 to move; the piezoelectric driving mechanism is based on the inverse piezoelectric effect of the piezoelectric ceramic material: if a voltage is applied to the piezoelectric material, mechanical stress will be generated, that is, the conversion between electrical energy and mechanical energy will occur. Controlling its mechanical deformation to generate rotational or linear motion has the advantages of simple structure and low speed.

The drive of the memory alloy drive mechanism is based on the characteristics of the shape memory alloy: the shape memory alloy is a special alloy, once it has memorized any shape, even if it is deformed, when it is heated to a certain appropriate temperature, it can return to The shape before deformation, in order to achieve the purpose of driving, has the characteristics of rapid displacement and free direction.

Please refer to FIG. 6 again, further, the first imaging module 20 further includes a driving device 28 , and the driving device 28 is used to drive the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29 . The drive device 28 is used to drive the mounting seat 23 to move axially along the axis of rotation 29 . The rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the photosensitive direction of the first image sensor 26 , so that the first imaging module 20 realizes optical image stabilization on the optical axis of the light inlet 211 and the axial direction of the rotation axis 29 .

In this way, since the volume of the reflective element 22 is smaller than that of the lens barrel, the driving device 28 drives the mounting seat 23 to move in two directions, which can not only achieve the optical anti-shake effect of the first imaging module 20 in two directions, but also The volume of the first imaging module 20 is made smaller.

Referring to FIGS. 5-6 , for the convenience of description, the width direction of the first imaging module 20 is defined as the X direction, the height direction is defined as the Y direction, and the length direction is defined as the Z direction. Therefore, the optical axis of the light inlet 211 is the Y direction, the light receiving direction of the first image sensor 26 is the Z direction, and the axial direction of the rotation axis 29 is the X direction.

The driving device 28 drives the mounting seat 23 to rotate, so that the reflective element 22 rotates around the X direction, so that the first imaging module 20 can achieve the effect of optical anti-shake in the Y direction. In addition, the driving device 28 drives the mounting base 23 to move along the axial direction of the rotation axis 29 , so that the first imaging module 20 achieves the effect of X-direction optical image stabilization. Additionally, the first lens assembly 24 may be along the Z direction to enable the first lens assembly 24 to focus on the first image sensor 26 .

Specifically, when the reflective element 22 rotates around the X direction, the light reflected by the reflective element 22 moves in the Y direction, so that the first image sensor 26 forms different images in the Y direction to achieve the anti-shake effect in the Y direction. When the reflective element 22 moves along the X direction, the light reflected by the reflective element 22 moves in the X direction, so that the first image sensor 26 forms different images in the X direction to realize the anti-shake effect in the X direction.

In some embodiments, the drive device 28 is formed with an arc-shaped guide rail 281 , and the drive device 28 is used to drive the mounting seat 23 to rotate along the arc-shaped guide rail 281 about the central axis 282 of the arc-shaped guide rail 281 and the axis along the central axis 282 Moving forward, the central axis 2282 coincides with the axis of rotation 29.

It can be understood that the driving device 28 is used to drive the mounting seat 23 to rotate and move axially along the central axis 282 of the curved guide rail 281 along the curved guide rail 281 .

In this way, since the driving device 28 uses the arc guide rail 281 to drive the mounting seat 23 with the reflective element 22 to rotate together, the frictional force between the driving device 28 and the mounting seat 23 is small, which is beneficial to the stable rotation of the mounting seat 23 , the optical anti-shake effect of the first imaging module 20 is improved.

Specifically, please refer to FIG. 12, in the related art, the mounting seat (not shown) is rotatably connected with the rotating shaft 23a, and the mounting seat rotates around the rotating shaft 23a to drive the reflective element 22a to rotate together. It is assumed that the frictional force is f1, the radius of the rotating shaft 23a is R1, the thrust force is F1, and the turning radius is R1. Then the ratio K1 of friction torque and thrust torque is K1=f1R1/F1A1. Since the reflective element 22a only needs to be rotated slightly, F1 cannot be too large; and the imaging module itself needs to be light, thin and short, so that the size of the reflective element 22a cannot be too large, and the space for A to increase is also limited, so that the influence of friction cannot be further eliminated.

Referring to FIG. 13 , in the present application, the mounting seat 23 rotates along the arc-shaped guide rail 281 , and the radius of the arc-shaped guide rail 281 is R2 . At this time, the ratio K2 of friction torque and rotational torque is K2=f2R2/F2A. In the case that f2, R2, and F2 do not change significantly, due to the use of orbital oscillation, the corresponding thrust is rotated. The moment becomes R2, and R2 is not limited by the size of the reflective element 22, and can even be several times more than R1. Therefore, in this case, the influence of the friction force on the rotation of the reflective element 22 can be greatly reduced (the size of K2 is reduced), thereby improving the rotation accuracy of the reflective element 22 and making the optical anti-shake effect of the first imaging module 20 better. good.

Referring to FIG. 6 , in some embodiments, the mounting seat 23 includes an arc-shaped surface 231 , and the arc-shaped surface 231 and the arc-shaped guide rail 281 are concentrically disposed and matched with the arc-shaped guide rail 281 . In other words, the center of the arc-shaped surface 231 coincides with the center of the arc-shaped guide rail 281 . In this way, the mounting base 23 and the driving device 28 can be matched more compactly.

In some embodiments, the central axis 282 is located outside the first imaging module 20 . In this way, the radius R2 of the curved guide rail 281 is relatively large, which can reduce the adverse effect of friction on the rotation of the mounting seat 23 .

In some embodiments, the drive device 28 is located at the bottom of the housing 21 . In other words, the driving device 28 is integrally formed with the casing 21 . In this way, the structure of the first imaging module 20 is more compact.

In some embodiments, the driving device 28 drives the mounting base 23 to rotate electromagnetically. In one example, the driving device 28 is provided with a coil, and the mounting seat 23 is fixed with an electromagnetic sheet. After the coil is energized, the coil can generate a magnetic field to drive the electromagnetic sheet to move, thereby driving the mounting seat 23 and the reflective element to rotate together.

Of course, in other embodiments, the driving device 28 may drive the mounting base 23 to move by means of piezoelectric driving or memory alloy driving. For the piezoelectric driving method and the memory alloy driving method, please refer to the above description, which will not be repeated here.

Please refer to FIGS. 4-7 again, the first imaging module 20 further includes a chip circuit board 201 and a driving chip 202 , the chip circuit board 201 is fixed on the side of the driving mechanism 27 , and the driving chip 202 is fixed on the chip circuit board 201 and the driving mechanism. On the side opposite to 27 , the driving chip 202 is electrically connected to the driving mechanism 27 through the chip circuit board 201 .

In this way, the driving chip 202 is fixed on the side of the driving mechanism 27 through the chip circuit board 201, and is electrically connected to the driving mechanism 27 through the chip circuit board 201, so that the structure between the driving chip 202 and the driving mechanism 27 is more compact, which is beneficial to The volume of the first imaging module 20 is reduced.

Specifically, the driving chip 202 is used to control the driving mechanism 27 to drive the moving element 25 to move along the optical axis of the first lens assembly 24 , so that the first lens assembly 24 is focused and imaged on the first image sensor 26 . The driving chip 202 is used to control the driving device 28 to drive the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29 according to the feedback data of the gyroscope 120 . The driving chip 202 is further configured to control the driving device 28 to drive the mounting base 23 to move along the axial direction of the rotation axis 29 according to the feedback data of the gyroscope 120 .

The driving chip 202 is further configured to control the driving device 28 to drive the mounting base 23 to rotate and move axially along the central axis 282 of the curved guide rail 281 along the curved guide rail 281 according to the feedback data of the gyroscope 120 .

In some embodiments, the first imaging module 20 includes a sensor circuit board 203, the first image sensor 26 is fixed on the sensor circuit board 203, the chip circuit board 201 includes a mounting portion 2011 and a connecting portion 2022, and the mounting portion 2011 is fixed on the driver On the side of the mechanism 27 , the driver chip 202 is fixed to the mounting portion 2011 , and the connecting portion 2022 connects the mounting portion 2011 and the sensor circuit board 203 .

In this way, the driving chip 202 can be electrically connected to the driving mechanism 27 through the sensor circuit board 203 . Specifically, the connection portion 2022 can be fixedly connected to the sensor circuit board 203 by welding.

In an example, when assembling the first imaging module 20, the driver chip 202 can be fixed on the chip circuit board 201 first, and then the chip circuit board 201 with the driver chip 202 and the sensor circuit board 203 are welded together Connect, and finally fix the chip circuit board 201 with the driving chip 202 on the side of the driving mechanism 27 .

The chip circuit board 201 can be fixedly connected to the driving mechanism 27 by welding, bonding or the like.

It should be pointed out that the fixing of the chip circuit board 201 on the side of the driving mechanism 27 may mean that the chip circuit board 201 is fixed in contact with the side of the driving mechanism 27 , or it can also mean that the chip circuit board 201 is fixedly connected to the side of the driving mechanism 27 through other components.

In this embodiment, the mounting portion 2011 is a rigid circuit board, the connecting portion 2022 is a flexible circuit board, and the mounting portion 2011 is attached to the side surface of the driving mechanism 27 .

In this way, the mounting portion 2011 is a rigid circuit board, so that the mounting portion 2011 has good rigidity and is not easily deformed, which is beneficial to the fixed connection between the mounting portion 2011 and the side surface of the driving mechanism 27 . The mounting portion 2011 can be attached to the side surface of the driving mechanism 27 by means of adhesive. In addition, the connection portion 2022 is a flexible circuit board, so that the chip circuit board 201 can be easily deformed, so that the chip circuit board 201 can be easily installed on the side of the driving mechanism 27 .

Of course, in other embodiments, the mounting portion 2011 may also be a flexible circuit board.

In some embodiments, the casing 21 is formed with an escape hole 215 , and the driving chip 202 is at least partially located in the escape hole 215 , so as to be exposed to the casing 21 . In this way, the driving chip 202 passes through the casing 21 so that there is an overlapping portion between the driving chip 202 and the casing 21 , which makes the structure between the driving chip 202 and the casing 21 more compact, and can further reduce the volume of the first imaging module 20 .

It can be understood that when there is a gap between the side surface of the driving mechanism 27 and the housing 21 , the driving chip 202 is partially located in the avoidance hole 215 .

Preferably, the shape and size of the avoidance hole 215 are matched with the shape and size of the driving chip 202 respectively. For example, the size of the avoidance hole 215 is slightly larger than that of the driving chip 202 , and the shape of the avoidance hole 215 is the same as that of the driving chip 202 .

In this embodiment, the escape hole 215 is formed on the side wall 214 of the housing 21 . It can be understood that the avoidance hole 215 penetrates the inner and outer sides of the side wall 214 . Of course, in other embodiments, the escape hole 215 may also be formed on the top wall 213 of the housing 21 .

In one embodiment, the first imaging module 20 further includes a shielding cover 204 , and the shielding cover 204 is fixed on the chip circuit board 201 and covers the driving chip 202 . In this way, the shielding cover 204 can protect the driving chip 202 and prevent the driving chip 202 from being physically impacted. In addition, the shielding cover 204 can also reduce the electromagnetic influence on the driving chip 202 .

The shielding case 204 can be made of metal material. For example, the material of the shielding case 204 is stainless steel. In this embodiment, the chip circuit board 201 is fixed on the mounting portion 2011 , and at this time, the mounting portion 2011 is preferably a rigid circuit board or a plate combining a flexible circuit board and a reinforcing plate.

Referring to FIG. 14 , in this embodiment, the second imaging module 30 is a vertical lens module. Of course, in other embodiments, the second imaging module 30 can also be a periscope lens module.

The second imaging module 30 includes a second lens assembly 31 and a second image sensor 32. The second lens assembly 31 is used to image light on the second image sensor 32. The incident optical axis of the second imaging module 30 is the same as the second image sensor 32. The optical axes of the lens assemblies 31 coincide.

In this embodiment, the second imaging module 30 can be a fixed-focus lens module. Therefore, the number of lenses 241 in the second lens assembly 31 is less, so that the height of the second imaging module 30 is lower, which is beneficial to reduce the size of the electronic device. 1000 thickness.

The type of the second image sensor 32 may be the same as the type of the first image sensor 26 , which will not be repeated here.

The structure of the third imaging module 40 is similar to that of the second imaging module 30 . For example, the third imaging module 40 is also a vertical lens module. Therefore, for the features of the third imaging module 40, please refer to the features of the second imaging module 40, and details are not described here.

To sum up, the first imaging module 20 includes a housing 21 , a reflective element 22 , a first lens assembly 24 , a moving element 25 , a first image sensor 26 and a driving mechanism 27 . The reflective element 22 , the first lens assembly 24 , the moving element 25 , the first image sensor 26 and the driving mechanism 27 are all arranged in the housing 21 . The moving element 25 is located between the reflective element 22 and the first image sensor 26 . The first lens assembly 24 is fixed on the moving element 25 .

The housing 21 has a light inlet 211 . The reflective element 22 is used to redirect the incident light incident from the light inlet 211 and transmit it to the first image sensor 26 through the first lens assembly 24 , so that the first image sensor 26 can sense the incident light outside the first imaging module 20 Light.

The first imaging module 20 also includes a chip circuit board 201 and a driving chip 202. The chip circuit board 201 is fixed on the side of the driving mechanism 27, and the driving chip 202 is fixed on the side of the chip circuit board 201 opposite to the driving mechanism 27. The driving chip 202 It is electrically connected to the driving mechanism 27 through the chip circuit board 201 .

In the imaging module of the present application, the driving chip 202 is fixed on the side of the driving mechanism 27 through the chip circuit board 201 , and is electrically connected to the driving mechanism 27 through the chip circuit board 201 , so that the connection between the driving chip 202 and the driving mechanism 27 is ensured. The structure is more compact, which is beneficial to reduce the volume of the first imaging module 20 .

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc. A particular feature, structure, material, or characteristic described in this embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims (15)

1. an imaging module, is characterized in that, comprises: shell; and A reflective element, an image sensor, a lens assembly, a moving element and a driving mechanism are all arranged in the housing, the moving element is located between the reflective element and the image sensor, and the lens assembly is fixed on the moving element superior; The housing has a light inlet, and the reflective element is used for diverting incident light incident from the light inlet and passing through the lens assembly to the image sensor so that the image sensor senses the image the incident light outside the module; The driving mechanism is used to drive the moving element to move along the optical axis of the lens assembly to make the lens assembly focus and image on the image sensor; The imaging module further includes a chip circuit board and a driving chip, the chip circuit board is fixed on the side of the driving mechanism, and the driving chip is fixed on the side of the chip circuit board opposite to the driving mechanism, so the The driving chip is electrically connected to the driving mechanism through the chip circuit board. 2 . The imaging module according to claim 1 , wherein the imaging module comprises a sensor circuit board, the image sensor is fixed on the sensor circuit board, and the chip circuit board comprises a mounting portion and a connecting portion. 3 . and the mounting portion is fixed on the side surface of the driving mechanism, the driving chip is fixed on the mounting portion, and the connecting portion connects the mounting portion and the sensor circuit board. 3 . The imaging module of claim 2 , wherein the mounting portion is a rigid circuit board, the connecting portion is a flexible circuit board, and the mounting portion is attached to a side surface of the driving mechanism. 4 . 4 . The imaging module of claim 1 , wherein the casing is formed with an escape hole, and the driving chip is at least partially located in the escape hole. 5 . 5 . The imaging module of claim 4 , wherein the housing comprises a top wall and a side wall, the side wall is formed extending from a side edge of the top wall, and the escape hole is formed in the side wall. 6 . The imaging module of claim 4 , wherein the imaging module further comprises a shielding cover fixed on the chip circuit board and covering the driving chip. 7 . 7 . The imaging module of claim 1 , wherein the moving element is cylindrical, and a plurality of lenses in the lens assembly are fixed in the moving element at intervals along the axial direction of the moving element. 8 . ;or The moving element includes two clips between which the lens assembly is sandwiched. 8. A camera assembly, comprising a first imaging module, a second imaging module and a third imaging module, wherein the first imaging module is the imaging module described in any one of claims 1-7 A module, wherein the field of view of the third imaging module is larger than the field of view of the first imaging module and smaller than the field of view of the second imaging module. 9 . The camera assembly of claim 8 , wherein the first imaging module, the second imaging module and the third imaging module are arranged in an inline shape, and the second imaging module is arranged in a line. 10 . The imaging module is located between the first imaging module and the third imaging module. 10. An electronic device, characterized in that, comprising: ontology; A sliding module for sliding between a first position accommodated in the body and a second position exposed from the body, the sliding module is provided with the camera according to claim 8 or 9 components. 11. The electronic device according to claim 10, wherein a gyroscope is arranged in the sliding module, and the camera assembly is arranged separately from the gyroscope; The driving chip is used to control the operation of the camera assembly according to the feedback data of the gyroscope to realize optical anti-shake shooting, and the driving chip is used to control the operation of the first imaging module according to the feedback data of the gyroscope for optical image stabilization. 12 . The electronic device according to claim 11 , wherein the first imaging module further comprises a mounting seat, the reflective element is fixed on the mounting seat, and the driving chip is used for according to the gyroscope. 13 . The feedback data of the instrument controls the driving device to drive the mounting seat with the reflective element to rotate around the rotation axis, so as to realize the optical anti-shake in the direction of the optical axis of the light inlet, and the rotation axis is perpendicular to the The optical axis of the light inlet. 13 . The electronic device according to claim 12 , wherein the driving device is formed with an arc-shaped guide rail, and the driving chip is used to control the driving device to drive the driving device according to the feedback data of the gyroscope. 14 . The mounting seat rotates around the central axis of the arc-shaped guide rail along the arc-shaped guide rail, and the central axis coincides with the rotation axis. 14. The electronic device according to claim 13, wherein the driving chip is used to control the driving device to drive the mounting seat to move axially along the central axis, so as to make the first imaging The module realizes optical anti-shake in the direction of the central axis. 15 . The electronic device of claim 13 , wherein the mounting base comprises an arc-shaped surface disposed concentrically with the arc-shaped guide rail and matched with the arc-shaped guide rail. 16 .