CN208940092U - Image scanning module and electronic machine including the same - Google Patents
Image scanning module and electronic machine including the same Download PDFInfo
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- CN208940092U CN208940092U CN201790000731.3U CN201790000731U CN208940092U CN 208940092 U CN208940092 U CN 208940092U CN 201790000731 U CN201790000731 U CN 201790000731U CN 208940092 U CN208940092 U CN 208940092U
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- 239000000758 substrate Substances 0.000 claims abstract description 57
- 230000005540 biological transmission Effects 0.000 claims abstract description 32
- 239000010410 layer Substances 0.000 claims description 93
- 238000000465 moulding Methods 0.000 claims description 28
- 239000006059 cover glass Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 230000010355 oscillation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 229910010252 TiO3 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000004204 blood vessel Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000010356 wave oscillation Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Human Computer Interaction (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Optics & Photonics (AREA)
- Signal Processing (AREA)
- Image Input (AREA)
Abstract
According to an embodiment, a kind of image scanning module is provided characterized by comprising sensor drives layer, and arrangement on the first substrate, generates electric signal；And ultrasonic transmission/reception layer, it is formed at least part in the upper surface of the sensor driving layer, the supersonic oscillations of sensing subject are used in by receiving electric signal, reception is by the ultrasonic wave that above-mentioned subject reflects and converts thereof into electric signal, which is transmitted to the sensor driving layer.
Description
Technical field
The utility model relates to a kind of image scanning module and including its e-machine, that is, be related to that ultrasound can be being executed
Display panel lower part is arranged in the state of wave fingerprint recognition without reducing the image scanning module of performance and including its electricity
Handset device.
Background technique
In recent years, becoming increasingly conspicuous with security-related problem, such as smart phone and tablet computer personal mobile device
Safety also become more and more concerned.Recently, e-commerce or financial transaction are executed by mobile device with user
Frequency increases, and safety problem related with this also further increases.
Based on these demands, people solve safety problem and make efforts to be authenticated by me.Typically,
Through introducing the authentication method using such as biological information of fingerprint, iris, face, voice and blood vessel.
In these biometric information authentication technologies, the technology most generally used is fingerprint authentication techniques.By fingerprint recognition and
It is applied to the product in smart phone and tablet computer etc. by the authentication techniques of fingerprint recognition to have listed.
In recent years, in order to increase device display area purpose or beautiful purpose, for fingerprint sensor is located at glass
Glass lower end or the demand of technology for attaching it to display area increasingly increase.
Fingerprint Identification sensor can realize in various ways, for example, optical mode, hot sensing mode, capacitive way and
Ultrasonic wave mode etc..
Wherein, ultrasonic type fingerprint Identification sensor is used by making ultrasonic wave direction subject vibrate and sense by subject
The waveform of reflection takes aim at the method for sweeping fingerprint image.
If cover glass is arranged in ultrasonic type fingerprint Identification sensor top, ultrasonic type is touched in the finger of people
Fingerprint Identification sensor top, ultrasonic wave is through the region with the ridges contact of fingerprint, and ultrasonic wave connects in the valley with fingerprint
The region of touching is reflected.
However, being easily occurred between cover glass and finger since the material of cover glass is various and its thickness is thicker
Can not impedance matching the case where.In the case, even if the ridges contact of fingerprint is to the top of cover glass, ultrasonic wave can not be
It is penetrated at corresponding point, therefore accurate fingerprint image can not be obtained.
That is, the module that there are ultrasonic type fingerprint Identification sensors to penetrate in modular construction according to ultrasonic wave
The problem of changing the type of material leads to reduced performance.
Utility model content
Technical problem
The utility model is to propose to solve the above-mentioned problems, and its purpose is to provide ultrasonic type fingerprint recognition biographies
Sensor includes the image scanning module in cover glass lower part in the state of not reducing performance.
Technical solution
In order to achieve the above object, an embodiment according to the present utility model provides a kind of image scanning module, feature
It is, comprising: sensor drives layer, and arrangement on the first substrate, generates electric signal；And ultrasonic transmission/reception layer, it is formed in above-mentioned
Sensor drives at least part in the upper surface of layer, and the ultrasonic wave that sensing subject is used in by receiving above electrical signal shakes
It swings, reception is by the ultrasonic wave that above-mentioned subject reflects and converts thereof into electric signal, which is transmitted to the sensor
Drive layer.
Above-mentioned image scanning module may also include that first electrode, is arranged in above-mentioned first substrate and obtains a part in above；
And second electrode, a part being arranged in the upper surface of the sensor driving layer, and be electrically connected with above-mentioned first electrode.
Above-mentioned image scanning module may also include molding section, and above-mentioned molding section is formed from the upper surface of above-mentioned first substrate to upper
State the upper surface of ultrasonic transmission/reception layer.
Above-mentioned molding section can be formed in a manner of covering the upper surface of above-mentioned ultrasonic transmission/reception layer, and above-mentioned molding section can be by
It is formed with the material of body acoustic impedance match.
It could be formed with multiple through-holes in the sensor driving layer, above-mentioned multiple through-holes are extended parallel to each other from below
Predetermined position to inside the sensor driving layer, so that above-mentioned first substrate and the sensor driving layer electrical connection.
Above-mentioned image scanning module may also include the protective layer for being formed in above-mentioned ultrasonic transmission/reception layer top.
Above-mentioned image scanning module may also include that first electrode and second electrode, be respectively formed on above-mentioned first substrate
A part above a part and the sensor driving layer in face；Third electrode and the 4th electrode are formed in above-mentioned first electricity
Pole and second electrode top, and be located at height identical from above-mentioned first substrate；5th electrode makes above-mentioned third electrode and the 4th
Electrode electrical connection；And molding section, it is formed in a manner of covering the upper surface of above-mentioned first substrate and the upper surface of sensor driving layer, and
It is formed with and extends to the first through hole of third electrode from above-mentioned first electrode and extend to the 4th electrode from above-mentioned second electrode
Second through-hole.
Above-mentioned image scanning module may also include that first electrode and second electrode, be respectively formed on above-mentioned first substrate
A part above a part and the sensor driving layer in face；Third electrode, is formed in above-mentioned first electrode top, and on
It states third electrode and above-mentioned second electrode is located at identical height；5th electrode makes above-mentioned second electrode and third electrode be electrically connected
It connects；And molding section, it is formed in a manner of covering the upper surface of above-mentioned first substrate, and be formed with from above-mentioned first electrode and extend to
The through-hole of three electrodes.
On the other hand, another embodiment according to the present utility model, provides a kind of e-machine characterized by comprising
Above-mentioned image scanning module；Display panel is formed in above-mentioned image scanning module top；And the second substrate, it is formed in above-mentioned
Image scanning module lower part.
The lower part that above-mentioned image scanning module can be formed in above-mentioned display panel is comprehensive or a part of region below.
Do not arrange that a part of region of above-mentioned image scanning module could be formed in above-mentioned the second substrate upper zone
Circuit element.
Above-mentioned the second substrate may include being formed at least part of step, on the basis of above-mentioned step, in a lateral areas
The upper surface of domain could be formed with foregoing circuit element, and the upper surface of another side region can be formed as higher than an above-mentioned side region
Above.
Above-mentioned e-machine may also include the reinforcer for being formed in above-mentioned the second substrate lower part.
Another embodiment according to the present utility model, provides a kind of e-machine characterized by comprising above-mentioned figure
As scan module；And cover glass, it is arranged in the top of above-mentioned image scanning module.
Above-mentioned e-machine may also include display panel, and above-mentioned display panel not weigh up and down with above-mentioned image scanning module
Folded mode is arranged, and is arranged in the lower part of above-mentioned cover glass.
Beneficial effect
According to an embodiment, the image scanning module including ultrasonic type fingerprint Identification sensor can not reduce performance
In the state of be arranged in display panel and cover glass lower part.
Detailed description of the invention
Fig. 1 is the attached drawing for showing the composition of image scanning module of an embodiment according to the present utility model.
Fig. 2 to Fig. 4 is the image scanning module for showing flexible base board and being mounted on an embodiment according to the present utility model
The attached drawing of an example.
Fig. 5 and Fig. 6 is the image scanning module for showing the second substrate and being formed in an embodiment according to the present utility model
The attached drawing of an example of lower part.
Fig. 7 and Fig. 8 is the attached drawing for showing the composition of image scanning module of another embodiment according to the present utility model.
Fig. 9 is the attached drawing for showing the composition of image scanning module of another embodiment according to the present utility model.
Figure 10 is the attached drawing for showing the image scanning module of another embodiment according to the present utility model.
Figure 11 and Figure 12 is to show for the image scanning module of embodiment according to the present utility model to be mounted on electronics
The attached drawing of the structure of machine.
Figure 13 shows the embodiment that display panel is formed in the image scanning module of embodiment according to the present utility model.
Figure 14 shows the embodiment that cover glass is formed in the image scanning module of embodiment according to the present utility model.
Specific embodiment
Hereinafter, the exemplary embodiment of the utility model will be described in detail with reference to the attached drawings, so that the technology of this field
Personnel can the utility model concept easy to accomplish.It is to be noted, however, that the utility model is not limited to exemplary embodiment
But it can be realized in a manner of various other.In the accompanying drawings, some components being not directly relevant to explanation will be removed to improve
The clarity of attached drawing, and the like numerals in entire document indicate similar component.It is respectively constituted in addition, shown in the drawings
Size and thickness are to be arbitrarily shown for ease of description, and the utility model is not limited thereto.
In the present invention, "~on " refer to positioned at the upper surface of target component or in the following, do not necessarily mean that gravity side
To top.Throughout the specification, the terms such as "include", "comprise" indicate, when without especially opposite record, do not arrange
Except other constituent elements, and further comprise other constituent elements.
Throughout the specification, when a unit is referred to as " being connected with another unit ", which can be direct
It is connected with another unit, or there may also be insertion units.
The embodiments of the present invention are described in detail with reference to the accompanying drawings.
Fig. 1 is the attached drawing for showing the composition of image scanning module of an embodiment according to the present utility model.
Referring to Fig.1, image scanning module 100 may include the first substrate 110 sequentially arranged, sensor drives layer 120
And ultrasonic transmission/reception layer 130.
First substrate 110 can make to include the component electrical connection in image scanning module 100, and can be implemented as printing
Printed circuit board (PCB；Print Circuit Board) or flexible printed circuit board (FPCB；Flexible Print Circuit
Board)。
Sensor driving layer 120 is formed at least part on first substrate 110, and with endless all standing first substrate
Mode above 110 is arranged.Sensor driving layer 120, which is executed by applying electric signal to ultrasonic transmission/reception layer 130, makes ultrasound
Wave receives and dispatches the function that layer 130 irradiates ultrasonic wave.Also, work as irradiated ultrasonic wave to be reflected by subject and return to ultrasonic transmission/reception
When layer 130, sensor driving layer 120 senses received signal.It is cmos element that sensor, which drives layer 120, and be can wrap
Include CMOS substrate and cmos circuit.
Electrode 111,121 can be respectively formed in the upper surface of first substrate 110 and the upper surface of sensor driving layer 120.
These electrodes 111,121 can be connected by lead connecting method to make first substrate 110 and sensor drive layer 120 electric each other
Connection.
Ultrasonic transmission/reception layer 130 is formed at least part on sensor driving layer 120, and with endless all standing sensing
The mode of device driving layer 120 is arranged.The region exposed in the upper surface of sensor driving layer 120 is formed with above-mentioned electrode 121.
Ultrasonic transmission/reception layer 130 drives according to the electric signal received from sensor driving layer 120.Specifically, ultrasonic transmission/reception layer
130 may include piezoelectric material, and above-mentioned piezoelectric material generates physical deformation according to the electric signal of application to make ultrasound to subject
Wave oscillation.Also, ultrasonic transmission/reception layer 130 is returned to by the ultrasonic wave that subject or other constituent elements reflect after oscillation, with
Cause the physical deformation of above-mentioned piezoelectric material.Physical deformation is converted into electric signal and is transmitted to sensor driving layer 120.Including
Piezoelectric material in ultrasonic transmission/reception layer 130 may include PZT, PST, Quartz, (Pb, Sm) TiO3, PVDF or PVDF-
TrFe etc..On the other hand, ultrasonic transmission/reception layer 130 can be implemented as MEMS element.
It may also include molding section 140 according to the image scanning module 100 of an embodiment, above-mentioned molding section 140 is to surround
The mode of the upper surface of one substrate 110, entire sensor driving layer 120 and ultrasonic transmission/reception layer 130 is formed.Molding section 140 can be with
Image scanning module 100 is protected from external physical and chemical shock, and is made of the resin of epoxy resin etc..
The finger for the ultrasonic wave direction subject, that is, people vibrated from ultrasonic transmission/reception layer 130 is propagated, if ultrasonic wave is towards fingerprint
Spine (Ridge), most of ultrasonic wave just penetrates human skin.However, if ultrasonic wave towards fingerprint valley (Valley),
Then since there are outside air (Air) between image scanning module 100 and the valley of fingerprint, due to acoustic impedance difference
Ultrasonic wave is reflected.If even not with the finger acoustic impedance match of people, the ultrasonic wave just propagated to the spine of fingerprint is also anti-
The reflection characteristic for the ultrasonic wave penetrated, therefore propagated to the spine of fingerprint and valley is each other without very big difference.Therefore, in order to accurate
Fingerprint detection, molding section 140 with the material of body acoustic impedance match preferably by that can form.
Fig. 2 to Fig. 4 is to show the image scanning module that flexible base board is mounted on to an embodiment according to the present utility model
An example attached drawing.
Referring to Fig. 2, at least part on the first substrate 110 of image scanning module 100 could be formed with flexibility
Substrate 150.
Flexible base board 150 is engaged with first substrate 110, and image scanning module 100 and other electronic components (are schemed
In be not shown) electrical connection.
In the case, flexible base board can be not formed to be covered in the upper surface of first substrate 110 in molding section 140
The mode in 150 region is formed.
Secondly, at least part below the first substrate 110 of image scanning module 100 can referring to Fig. 3 and Fig. 4
To be formed with flexible base board 150.
Specifically, as shown in figure 3, flexible base board 150 can be formed in below first substrate 110 in be formed in the
The neighbouring region of electrode 111 on one substrate 110, or as shown in figure 4, can be formed on first substrate 110 with electrode 111
Not neighbouring region.
In the case, as shown in figure 3, molding section 140 can with so that in the upper surface of first substrate 110 be formed with it is soft
Property substrate 150 below opposite region expose mode and formed, or as shown in figure 4, so that in the upper surface of first substrate 110 with
The mode that the opposite region in region of flexible base board 150 is exposed is formed with to be formed.
Referring to Figure 2 to Figure 4, molding section 140 can be to surround at least part, sensor in the upper surface of first substrate 110
Drive the side of the upper surface of layer 120, the electrode 111,121 of first substrate 110, sensor driving layer 120 and ultrasonic transmission/reception layer 130
The portion and mode for the upper surface of making ultrasonic transmission/reception layer 130 and exposing is formed.
As described above, when molding section 140 is formed in a manner of surrounding the top of ultrasonic transmission/reception layer 130, in order to prevent
The accuracy of fingerprint recognition reduces, and molding section 140 is needed by being formed with the material of body acoustic impedance match.
However, embodiment as shown in Figures 2 to 4, when molding section 140 does not surround the upper surface of ultrasonic transmission/reception layer 130,
From ultrasonic transmission/reception layer 130 vibrate ultrasonic wave without molding section 140 and towards subject and the finger of people, thus, in mould
Acoustic impedance match is not necessarily between portion 140 processed and human body.Therefore, in the case, molding section 140 can be by general molding material shape
At.
However, molding section 140 can certainly be to be completely covered ultrasonic wave receipts in embodiment as shown in Figure 3 and Figure 4
The mode of the upper surface of hair layer 130 is formed.
Fig. 5 and Fig. 6 is the image scanning module for showing the second substrate and being formed in an embodiment according to the present utility model
The attached drawing of an example of lower part.
Referring to figure 5 and figure 6, the second substrate 160 can be formed in the lower part of image scanning module 100 as shown in Figure 1.The
Two substrates 160 play the role of being electrically connected image scanning module 100 with other electronic component (not shown)s.
On the other hand, referring to Fig. 6, image scanning module 100 can be engaged by multiple soldered balls 161 with the second substrate 160.
Fig. 7 and Fig. 8 is the attached drawing for showing the composition of image scanning module of another embodiment according to the present utility model.
Referring to Fig. 7 and Fig. 8, image scanning module 200 may include the first substrate 210 of stacked above one another, sensor driving
Layer 220 and ultrasonic transmission/reception layer 230.
Due to the detailed description of the effect about first substrate 210, sensor driving layer 220 and ultrasonic transmission/reception layer 230
It is identical as the content illustrated referring to figs. 1 to Fig. 6, therefore the description thereof will be omitted herein.
It could be formed with multiple through-holes 221 in the image scanning module 200 of another embodiment according to the present utility model,
Above-mentioned multiple through-holes 221 can be formed in sensor driving layer 220 in parallel to each other in the longitudinal direction.
Multiple through-holes 221 can drive the first surface of layer 220 to extend to form to second surface from sensor.Wherein,
One surface is the surface that sensor drives layer 220 to connect with first substrate 210, and second surface is the table opposite with first surface
Face.
The length of each through-hole 221 can be formed as less than the above-mentioned first surface and second in sensor driving layer 220
The distance between surface.That is, each through-hole 221 extends to the pre- of inside from the first surface of sensor driving layer 220
Positioning is set.
Including that can be electrically connected by multiple through-holes 221 with first substrate 210 in the cmos element of sensor driving layer 220
It connects, to receive electric signal.
On the other hand, referring to Fig. 8, in image scanning module 200 as shown in Figure 7, in the upper of ultrasonic transmission/reception layer 230
Portion may also be formed with protective layer 240.
Protective layer 240 plays the role of protecting sensor driving layer 220 and ultrasonic transmission/reception layer 230 from external impact.
As described above, if the substance and body not acoustic impedance match on 230 top of ultrasonic transmission/reception layer are arranged in, with regard to fingerprint
Recognition accuracy can reduce, and therefore, the above problem, protective layer 240 are needed by the material with body acoustic impedance match in order to prevent
It is formed.
Also, in order to improve accuracy of fingerprint identification, preferably make the minimizing thickness of protective layer 240.
Fig. 9 is the attached drawing for showing the composition of image scanning module of another embodiment according to the present utility model.
Referring to Fig. 9, image scanning module 900 may include that flexible base board 910, sensor driving layer 920 and ultrasonic wave are received
Send out layer 930.
Flexible base board 910 can play the role of that layer 920 and ultrasonic transmission/reception layer 930 is driven to supply electric signal to sensor
And it is formed by flexible material.
Molding section 940 can be received with covering the upper surface of the upper surface of flexible base board 910, sensor driving layer 920 and ultrasonic wave
The mode for sending out the side of layer 930 is formed.
At least part of non-placement sensor driving layer 920 could be formed with first in the upper surface of flexible base board 910
Electrode 911a does not arrange that at least part of ultrasonic transmission/reception layer 930 could be formed in the upper surface of sensor driving layer 920
Second electrode 921a.
On the other hand, the top of above-mentioned first electrode 911a and second electrode 922a be disposed with respectively with first electrode
911a and second electrode 922a electrical connection third electrode 911b and the 4th electrode 921b, as an example, third electrode 911b and
4th electrode 921b can be located at from the height as above of flexible base board 910.In third electrode 911b and the 4th electrode 921b
When positioned at than the lower position of the upper surface of ultrasonic transmission/reception layer 930, molding section 940 also be can have and third electrode 911b and
The identical height of height of four electrode 921b.In other words, third electrode 911b and the 4th electrode 921b can be to be exposed to molding
The mode in the upper surface of portion 940 is formed.
For being electrically connected between first electrode 911a and third electrode 911b and in the electricity of second electrode 921a and the 4th
Electrical connection between the 921b of pole could be formed with first electrode hole 941a and second electrode hole 941b in molding section 940.
First electrode hole 941a is in order to be electrically connected to form first electrode 911a and third electrode 911b, and second electrode
Hole 941b is in order to be electrically connected to form second electrode 921a with the 4th electrode 921b.First electrode hole 941a and second electrode hole
941b can by molding section 940 formed hole after, inside hole fill such as metal material conductive material method formed,
But the utility model is without being limited thereto.
It could be formed on third electrode 911b and the 4th electrode 921b for making third electrode 911b and the 4th electrode
5th electrode 950 of 921b electrical connection.5th electrode 950 can be formed in the upper surface of molding section 940.
Electric signal from flexible base board 910 can sequentially pass through first electrode 911a, first electrode hole 941a, third electricity
Pole 911b, the 5th electrode 950, the 4th electrode 921b and second electrode 921b drive layer 920 to be applied to sensor.
Figure 10 is the attached drawing for showing the image scanning module of another embodiment according to the present utility model.
0 as it can be seen that molding section 940 is in image scanning module identical with Fig. 9 only to cover flexible base board 910 referring to Fig.1
The mode on top formed, and the 4th electrode 921b and second electrode hole 941b are omitted.
On flexible base board 910 first electrode 911a, sensor driving layer 920 on second electrode 921a and with
The third electrode 911b that the mode separated is formed in the top of first electrode 911a is identical as embodiment as shown in Figure 9, therefore
The description thereof will be omitted herein.
Third electrode 911b can be formed by by way of the exposing of the upper surface of molding section 940, and can in sensor
Second electrode 921a on driving layer 920 is located at identical height, and the 5th electrode 950, which plays, makes second electrode 921a and third electricity
The effect of pole 911b electrical connection.
In the case, the electric signal from flexible base board 910 can sequentially pass through first electrode 911a, first electrode hole
941a, third electrode 911b, the 5th electrode 950 and second electrode 921a drive layer 920 to be applied to sensor.
Figure 11 and Figure 12 is to show for the image scanning module of embodiment according to the present utility model to be mounted on electronics
The attached drawing of the structure of machine.
Image scanning module M as is illustrated by figs. 11 and 12 can be implemented as the image scanning illustrated referring to figs. 1 to Figure 10
Any one of module 100,200,900.
1 and Figure 12 referring to Fig.1, image scanning module M can be arranged at least part above flexible base board 1100.
On the other hand, at least part on flexible base board 1100, in the region A of non-placement of images scan module M
It could be formed with the circuit element for driving image scanning module M or other electronic components.
Flexible base board 1100 partially can be formed as plane with shown in the part (b) of Figure 12 such as (a) of Figure 11, alternatively, such as
(a) of Figure 11 is partially and shown in the part (b) of Figure 12, and a part can be formed in the region A of non-placement of images scan module M
There is step.In the case, the region of non-placement of images scan module M can be using above-mentioned step as base in flexible base board 1100
Standard is divided into first area A1 and second area A2.
Second area A can be formed as the high predetermined altitude h on the basis of the upper surface of first area A1 height.
Circuit element as described above can be formed in first area A1, in this case, it is possible to obtain due to step and
The second area A2 protection of formation is formed in the effect of the circuit element of first area A1.
On the other hand, it could be formed with the reinforcer 1110 for keeping intensity below flexible base board 1100.
Figure 13 shows the embodiment that display panel is formed in the image scanning module of embodiment according to the present utility model.
Referring to Fig.1 3, display panel D can be formed in the image scanning module M of embodiment according to the present utility model.
Specifically, image scanning module M can be formed in the comprehensive of the lower part display panel D.The case where being thusly-formed
Under, therefore can receive and dispatch ultrasonic wave in entire display area can also can be carried out in any position on display panel D
Fingerprint image scanning.
Also, image scanning module M can be formed in a part of region below display panel D.For example, such as Figure 13 institute
Show, can be formed below image scanning module M in the side end region of display panel D.In the case where being thusly-formed, only
There is Chong Die with image scanning module M a part of region in display area that can receive and dispatch ultrasonic wave, therefore only in corresponding area
Domain can carry out fingerprint image scanning.Wherein, a part of region can on Figure 13 the left side, right side of display panel D or in
A part of region of the heart.
According to an embodiment, display panel D can be implemented as liquid crystal display (LCD；Liquid Crystal
Display) panel, Organic Light Emitting Diode (OLED；Organic Light Emitting Diode) display panel, luminous two
Pole pipe (LED；Light Emitting Diode) display panel and plasma display panel (PDP；Plasma Display
Panel) etc., it is preferable that it can be implemented as organic LED display panel.
It could be formed with bonding layer (not shown) between image scanning module M and display panel D.Bonding layer can be with
It is made of epoxy resin etc..
As described above, for accurate fingerprint detection, the existing material demand between image scanning module M and subject
With body acoustic impedance match, it is therefore preferred that bonding layer with the material of body acoustic impedance match also by forming.
On the other hand, cover glass (not shown) can be also disposed on the top of display panel D.
Figure 14 is the attached drawing for showing the arrangement form of image scanning module of another embodiment according to the present utility model.
Referring to Fig.1 4, image scanning module M can be arranged in the lower part cover glass G.
Specifically, display panel D and image scanning module M are formed in the lower part cover glass G, and display panel D and image
Scan module M can by up and down it is nonoverlapping in a manner of positioned adjacent.In the case, the height of image scanning module M can phase
It is same as the upper surface of display panel D height, and cover glass G can be in a manner of being completely covered image scanning module M and display panel D
Arrangement.
At this point, being formed with the region of image scanning module M on cover glass G for example can be to be formed with home key (home
) etc. key region.
On the other hand, connecing for engagement can also be formed between image scanning module M and cover glass G in the case
Close layer (not shown).
The explanation of above-mentioned the utility model is only illustrative, as long as the utility model technical field is common
Technical staff can understand in the case where not changing the technical idea or essential feature of the utility model, can also deform easily
For other specific forms.
Therefore, embodiment described above is only illustrative in all respects, and however, it is not limited to this.For example, as list
Each structure member that one type is illustrated can also disperse to be implemented, and equally, use the structure member of dispersion being illustrated
It can be implemented in the form of combination.
The scope of the utility model is indicated by the appended claims, and not by above-mentioned detailed description,
And the form for having altered or deforming derived from the meaning as claims, range and its impartial concept should be interpreted that and be included in
In the scope of the utility model.
Claims (15)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20160047603 | 2016-04-19 | ||
| KR10-2016-0047603 | 2016-04-19 | ||
| PCT/KR2017/004121 WO2017183879A1 (en) | 2016-04-19 | 2017-04-17 | Image scanning module and electronic device having same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208940092U true CN208940092U (en) | 2019-06-04 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201790000731.3U Active CN208940092U (en) | 2016-04-19 | 2017-04-17 | Image scanning module and electronic machine including the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (2) | KR101938739B1 (en) |
| CN (1) | CN208940092U (en) |
| WO (1) | WO2017183879A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10192094B2 (en) * | 2016-09-05 | 2019-01-29 | Nanchang O-Film Bio-Identification Technology Co., Ltd | Ultrasonic fingerprint sensor package, ultrasonic fingerprint identification device and electronic device |
| US10262178B2 (en) * | 2016-09-05 | 2019-04-16 | Nanchang O-Film Bio-Identification Technology Co., Ltd | Ultrasonic fingerprint sensor package |
| US10192093B2 (en) * | 2016-09-05 | 2019-01-29 | Nanchang O-Film Bio-Identification Technology Co., Ltd. | Ultrasonic fingerprint sensor package |
| US10387706B2 (en) * | 2016-09-05 | 2019-08-20 | Nanchang O-Film Bio-Identification Technology Co., Ltd. | Ultrasonic transducer of ultrasonic fingerprint sensor and manufacturing method thereof |
| KR102138924B1 (en) * | 2018-07-13 | 2020-07-29 | (주)유티아이 | Manufacturing Method of Display with Ultrasonic Type Fingerprint Sensor and Display with Ultrasonic Type Fingerprint Sensor Thereby |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100446337B1 (en) * | 2001-09-12 | 2004-09-01 | 주식회사 코탑테크놀로지 | A fingerprint cognition element having high cognition ratio |
| KR100561851B1 (en) * | 2003-11-18 | 2006-03-16 | 삼성전자주식회사 | Fingerprint sensor and its manufacturing method |
| KR101320138B1 (en) * | 2011-11-30 | 2013-10-23 | 삼성전기주식회사 | Fingerprint sensor and manufacturing method thereof |
| KR101453027B1 (en) * | 2012-11-20 | 2014-10-23 | 주식회사 아이피시티 | Fingerprint sensor module, portable electronic device having the same, and manufacturing method therof |
| NO20131423A1 (en) * | 2013-02-22 | 2014-08-25 | Idex Asa | Integrated fingerprint sensor |
| US9323393B2 (en) * | 2013-06-03 | 2016-04-26 | Qualcomm Incorporated | Display with peripherally configured ultrasonic biometric sensor |
| KR20160016330A (en) * | 2014-08-05 | 2016-02-15 | 엘지이노텍 주식회사 | Finger sensor |
| KR20150087802A (en) * | 2015-01-16 | 2015-07-30 | 크루셜텍 (주) | Electronic device for recognizing fingerprints and multi-touching |
-
2017
- 2017-04-17 KR KR1020170049077A patent/KR101938739B1/en active IP Right Grant
- 2017-04-17 WO PCT/KR2017/004121 patent/WO2017183879A1/en active Application Filing
- 2017-04-17 CN CN201790000731.3U patent/CN208940092U/en active Active
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2018
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2017183879A1 (en) | 2017-10-26 |
| KR101938739B1 (en) | 2019-01-16 |
| KR20170119635A (en) | 2017-10-27 |
| KR20180075456A (en) | 2018-07-04 |
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