CN107609539A - Fingerprint recognition module and electronic installation - Google Patents
Fingerprint recognition module and electronic installation Download PDFInfo
- Publication number
- CN107609539A CN107609539A CN201710952543.7A CN201710952543A CN107609539A CN 107609539 A CN107609539 A CN 107609539A CN 201710952543 A CN201710952543 A CN 201710952543A CN 107609539 A CN107609539 A CN 107609539A
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- Prior art keywords
- recognition module
- piezoelectric element
- cover plate
- fingerprint recognition
- fingerprint
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- 238000009434 installation Methods 0.000 title claims abstract description 28
- 230000000994 depressogenic effect Effects 0.000 abstract description 4
- VTLYHLREPCPDKX-UHFFFAOYSA-N 1,2-dichloro-3-(2,3-dichlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1Cl VTLYHLREPCPDKX-UHFFFAOYSA-N 0.000 description 16
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 210000002615 epidermis Anatomy 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Abstract
The invention discloses a kind of fingerprint recognition module and electronic installation.Fingerprint recognition module includes cover plate；It is attached to the fingerprint sensor of the lower surface of cover plate；Piezoelectric element, piezoelectric element are arranged on cover plate backwards to the side of fingerprint sensor, and the pressing that piezoelectric element is used to be subject to according to fingerprint sensor is inputted to produce vibration, so as to drive cover plate to vibrate together.In above-mentioned fingerprint recognition module and electronic installation, piezoelectric element can drive cover plate to vibrate together in the depressed input of fingerprint sensor, so that user can experience vibrational feedback, improve Consumer's Experience.
Description
Technical field
The present invention relates to field of electronic devices, more particularly to a kind of fingerprint recognition module and electronic installation.
Background technology
In the related art, the electronic installation such as mobile phone includes fingerprint recognition module, and user can be by pressing fingerprint recognition
The purpose of module is to realize solution lock screen.However, after user presses fingerprint recognition module, the feedback effects of electronic installation are poor, use
Family experience is poor.
The content of the invention
The present invention provides a kind of fingerprint recognition module and a kind of electronic installation.
The fingerprint recognition module of embodiment of the present invention includes cover plate；Fingerprint sensor, the fingerprint sensor are attached to
The lower surface of the cover plate；Piezoelectric element, the piezoelectric element set the cover plate backwards to the side of the fingerprint sensor,
And the pressing that the piezoelectric element is used to be subject to according to the fingerprint sensor is inputted to produce vibration, so as to drive the cover plate
Vibrate together.
In above-mentioned fingerprint recognition module, piezoelectric element can drive cover plate together in the depressed input of fingerprint sensor
Vibration, so that user can experience vibrational feedback, improves Consumer's Experience.
In some embodiments, the piezoelectric element is attached to the lower surface, the piezoelectric element and the fingerprint
Sensor distance is set.
In this way, piezoelectric element is attached to the lower surface of cover plate so that the vibration force that cover plate is subject in piezoelectric element
It is larger, be advantageous to user and experience seismaesthesia exactly, improve Consumer's Experience.
In some embodiments, the quantity of the piezoelectric element is multiple that multiple piezoelectric elements are around the finger
Line sensor is set.
In this way, multiple piezoelectric elements can improve the oscillation intensity of cover plate, to improve the experience of user.
In some embodiments, the fingerprint recognition module includes the flexible PCB for connecting the fingerprint sensor,
The flexible PCB and the cover plate are respectively positioned at the opposite both sides of the fingerprint sensor.
In this way, flexible PCB can cause fingerprint sensor to carry out data transmission with outer member (such as processor).
In some embodiments, the fingerprint recognition module includes the stiffening plate being fixed on the flexible PCB,
The stiffening plate and the fingerprint sensor both sides that to be separately positioned on the flexible PCB opposite.
In this way, the defects of stiffening plate can prevent flexible PCB from producing curling, so that can not be effective with fingerprint sensor
Ground connects.
In some embodiments, the piezoelectric element is fixed on the stiffening plate, the piezoelectric element with it is described soft
Property circuit board is separately positioned on the opposite both sides of the stiffening plate.
So, so that the installing space of piezoelectric element is larger, is advantageous to the installation of piezoelectric element.
In some embodiments, the piezoelectric element is located at the underface of the fingerprint sensor.
In this way, be so advantageous to piezoelectric element effectively passes to cover plate in vibration by vibration, so that cover plate vibration is strong
Degree is stronger.
In some embodiments, the fingerprint recognition module includes case ring, the cover plate and the fingerprint sensor
It is contained in the case ring.
In this way, can so strengthen the signal intensity that fingerprint recognition circuit acts on finger epidermis, know so as to improve fingerprint
The accuracy rate of other module identification fingerprint.
In some embodiments, the case ring includes basic ring and flange, and the cover plate and the fingerprint sensor are equal
It is contained in the basic ring, the flange extends outwardly from the outside of the basic ring.
In this way, flange causes case ring to be easily mounted on the touch panel of electronic installation.
Fingerprint recognition of the electronic installation of embodiment of the present invention described in including touch panel and any of the above embodiment
Module, fingerprint recognition module are arranged on touch panel.
In above-mentioned electronic installation, piezoelectric element can drive the starting of oscillation of cover plate one in the depressed input of fingerprint sensor
It is dynamic, so that user can experience vibrational feedback, improve Consumer's Experience.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the partial cutaway schematic view of the electronic installation of embodiment of the present invention；
Fig. 2 is another partial cutaway schematic view of the electronic installation of embodiment of the present invention.
Fig. 3 is the floor map of the electronic installation of embodiment of the present invention.
Main element symbol description：
Fingerprint recognition module 100；
Cover plate 10, lower surface 11；
Fingerprint sensor 20；
Piezoelectric element 30；
Flexible PCB 40；
Stiffening plate 50；
Case ring 60, top 61, bottom 62, basic ring 63, centre bore 631, guide ramp 632, flange 64；
Electronic installation 200, touch panel 210, installation through-hole 211.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Description is of the invention to be described with simplified, rather than the device or element of instruction or hint meaning must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only example, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, the invention provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the fingerprint recognition module 100 of embodiment of the present invention includes cover plate 10, fingerprint sensor 20 and pressure
Electric device 30.Fingerprint sensor 20 is attached to the lower surface 11 of cover plate 10.Piezoelectric element 30 is provided in cover plate 10 backwards to fingerprint
The side of sensor 20.The pressing that piezoelectric element 30 is used to be subject to according to fingerprint sensor 20 is inputted to produce vibration, so as to band
Dynamic cover plate 10 vibrates together.
Incorporated by reference to Fig. 3, above-mentioned fingerprint recognition module 100 can apply in electronic installation 200, and electronic installation 200 is for example
There is the terminal of fingerprint identification function for mobile phone, tablet personal computer or notebook computer etc..Specifically, electronic installation 200 includes touching
Panel 210 is touched, fingerprint recognition module 100 is arranged on touch panel 210.Touch panel 210 is for example compound by glass, macromolecule
The materials such as material are made.
In above-mentioned fingerprint recognition module 100 and electronic installation 200, piezoelectric element 30 can fingerprint sensor 20 by by
Drive cover plate 10 to vibrate together during pressure input, so that user can experience vibrational feedback, improve Consumer's Experience.
Specifically, the material that cover plate 10 can be used hardness higher is made to avoid cover plate 10 from being scratched, the material of cover plate 10
The for example, material such as sapphire or ceramics.
It is appreciated that user, when carrying out fingerprint recognition operation, the finger of user is pressed against on cover plate 10.Fingerprint sensor
20 be, for example, capacitive fingerprint sensing device 20, and when user carries out fingerprint recognition operation, finger can be placed on to cover plate 10 and fingerprint
Position corresponding to sensor 20.The signal of fingerprint sensor 20, to gather the fingerprint pattern of identification user, will be used through cover plate 10
The fingerprint pattern at family is matched with the fingerprint pattern to prestore, if the match is successful, fingerprint recognition operates successfully.For example, when finger
When line identification is operated successfully, electronic installation 200 can realize solution lock screen or log in the functions such as application software.
Piezoelectric element 30 is, for example, piezo ceramic element, and piezoelectric element 30 can receive and hand over when cover plate 10 is depressed
The electric signal of change, so that piezoelectric element 30 produces exciting force and moved back and forth, so as to vibrate.Due to piezoelectric element 30 and lid
Plate 10 connects, and piezoelectric element 30 can drive cover plate 10 to vibrate together when vibrating.It should be noted that piezoelectric element 30 and cover plate
10 connections also refer to piezoelectric element 30 and are directly connected to cover plate 10, can also finger pressure electric device 30 pass through other elements with covering
Plate 10 connects.
In one example, when user carries out fingerprint recognition operation to solve lock screen failure, piezoelectric element 30 can shake
Move so that obtaining user feels vibrational feedback, so as to remind user that finger is pressed against on cover plate 10 again to re-start finger
Line identification operation.
In some embodiments, piezoelectric element 30 is attached to lower surface 11, between piezoelectric element 30 and fingerprint sensor 20
Every setting.
In this way, piezoelectric element 30 is attached to the lower surface 11 of cover plate 10 so that cover plate 10 when piezoelectric element 30 vibrates by
The vibration force arrived is larger, is advantageous to user and experiences seismaesthesia exactly, improves Consumer's Experience.In this embodiment, cover plate
10 are directly connected to piezoelectric element 30.Piezoelectric element 30 can be adhesively fixed on the lower surface 11 of cover plate 10.
In some embodiments, the quantity of piezoelectric element 30 is multiple that multiple piezoelectric elements 30 are around fingerprint sensor
20 are set.
In this way, multiple piezoelectric elements 30 can improve the oscillation intensity of cover plate 10, to improve the experience of user.In an example
In son, the quantity of piezoelectric element 30 is, for example, two, and two piezoelectric elements 30 are respectively positioned at the opposite both sides of fingerprint sensor 20.
In another example, the quantity of piezoelectric element 30 is four, and four piezoelectric elements 30 are uniformly distributed around fingerprint sensor 20.
In some embodiments, fingerprint recognition module 100 includes flexible PCB 40.Flexible PCB 40 connects fingerprint
Sensor 20.Flexible PCB 40 and cover plate 10 are respectively positioned at the opposite both sides of fingerprint sensor 20.
In this way, flexible PCB 40 can cause fingerprint sensor 20 to carry out data biography with outer member (such as processor)
Defeated, for example, after fingerprint sensor 20 gathers user fingerprint image, outer member can carry out feature recognition to obtain to fingerprint image
Obtain preferable fingerprint image.
Fingerprint sensor 20 can be fixed on flexible PCB 40 by way of welding, for example, fingerprint sensor 20
On formed with the first pad, pass through the first pad and second formed with the second pad, fingerprint sensor 20 on flexible PCB 40
Pad solder, so as to be weldingly fixed on flexible PCB 40.
In some embodiments, fingerprint recognition module 100 includes the stiffening plate 50 being fixed on flexible PCB 40, mends
Strong plate 50 and fingerprint sensor 20 both sides that to be separately positioned on flexible PCB 40 opposite.
In this way, the defects of stiffening plate 50 can prevent flexible PCB 40 from producing curling, so that can not be with fingerprint sensor
20 effectively connect.Therefore, stiffening plate 50 can make it that the reliability of the normal work of fingerprint sensor 20 is higher.
In one example, when assembling fingerprint recognition module 100, can by first by stiffening plate 50 by bonding in a manner of consolidate
It is scheduled on flexible PCB 40, then fingerprint sensor 20 is fixed on to the flexibility opposite with stiffening plate 50 by way of welding
The side of circuit board 40, cover plate 10 is finally fixed on to the side of the fingerprint sensor 20 opposite with flexible PCB 40.
Referring to Fig. 2, in some embodiments, piezoelectric element 30 is fixed on stiffening plate 50, piezoelectric element 30 with it is soft
Property circuit board 40 is separately positioned on the opposite both sides of stiffening plate 50.
So, so that the installing space of piezoelectric element 30 is larger, is advantageous to the installation of piezoelectric element 30.Piezoelectric element
30 can be fixed on stiffening plate 50 by way of bonding.In this embodiment, piezoelectric element 30 and stiffening plate 50 are indirect
Connection, specifically, piezoelectric element 30 is connected by the elements such as stiffening plate 50, flexible PCB 40 and fingerprint sensor 20 and cover plate 10
Connect.
In some embodiments, piezoelectric element 30 is located at the underface of fingerprint sensor 20.In this way, be so advantageous to press
Vibration is effectively passed to cover plate 10 by electric device 30 in vibration, so that the intensity that cover plate 10 vibrates is stronger.
Referring to Fig. 1, in some embodiments, fingerprint recognition module 100 includes case ring 60, cover plate 10 and refers to
Line sensor 20 is contained in case ring 60.
Specifically, case ring 60 includes top 61 and bottom 62, and cover plate 10 and fingerprint sensor 20 are respectively positioned on the He of top 61
Between the bottom of top 62, so that cover plate 10 and fingerprint sensor 20 are contained in case ring 60.
Case ring 60 is made up of metal material, such as stainless steel, so that case ring 60 has larger intensity.Separately
Outside, case ring 60 can be connected with fingerprint recognition circuit, and for user when fingerprint recognition operates, finger can touch case ring, this
Sample can strengthen the signal intensity that fingerprint recognition circuit acts on finger epidermis, refer to so as to improve the identification of fingerprint recognition module 100
The accuracy rate of line.Further, case ring 60 is fixedly connected with flexible PCB 40, for example, case ring 60 can pass through viscose glue
It is fixed on flexible PCB 40.
In some embodiments, case ring 60 includes basic ring 63 and flange 64, and cover plate 10 and fingerprint sensor 20 are received
It is dissolved in basic ring 63, flange 64 extends outwardly from the outside of basic ring 63.
In this way, flange 64 causes case ring 60 to be easily mounted on the touch panel 210 of electronic installation 200.Specifically, touch
Touch panel 210 and offer installation through-hole 211, when installing case ring 60, basic ring 63 is inserted in installation through-hole 211 from the bottom up,
And flange 64 is resisted against on touch panel 210.Flange 64 can be fixedly connected with touch panel 210 with viscose glue.
Basic ring 63 is contained in centre bore 631 formed with centre bore 631, cover plate 10 and fingerprint sensor 20.Centre bore
631 shape and size and the shape and dimensional fits of cover plate 10.For example, the shape of centre bore 631 and the shape of cover plate 10 are equal
It is rounded.It is appreciated that the size of centre bore 631 is more than the size of cover plate 10 so that cover plate 10 can be contained in centre bore 631
In.
In some embodiments, the top of basic ring 63 is formed with oblique towards the guiding that centre bore 631 is interior and tilts down
Face 632.
In this way, the finger that guide ramp 632 can guide user smoothly enters in basic ring 63 to carry out fingerprint recognition operation, can
Improve the accuracy rate that user carries out fingerprint recognition operation.Further, guide ramp 632 can process to be formed by glossing,
So that basic ring 63 is more attractive in appearance.
It is appreciated that guide ramp 632 is ring surface, it can so facilitate user that finger is inserted into basic ring 63 from all directions
It is interior with by cover clamp 10, so as to carry out fingerprint recognition operation.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment or example of the present invention.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Sign, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (10)
- A kind of 1. fingerprint recognition module, it is characterised in that including：Cover plate；Fingerprint sensor, the fingerprint sensor are attached to the lower surface of the cover plate；WithPiezoelectric element, the piezoelectric element is arranged on the cover plate backwards to the side of the fingerprint sensor, and the piezoelectricity is first The pressing that part is used to be subject to according to the fingerprint sensor is inputted to produce vibration, so as to drive the cover plate to vibrate together.
- 2. fingerprint recognition module as claimed in claim 1, it is characterised in that the piezoelectric element is attached to the lower surface, The piezoelectric element is arranged at intervals with the fingerprint sensor.
- 3. fingerprint recognition module as claimed in claim 2, it is characterised in that the quantity of the piezoelectric element is multiple to be multiple The piezoelectric element is set around the fingerprint sensor.
- 4. fingerprint recognition module as claimed in claim 1, it is characterised in that the fingerprint recognition module includes connecting the finger The flexible PCB of line sensor, the flexible PCB and the cover plate respectively positioned at the fingerprint sensor it is opposite two Side.
- 5. fingerprint recognition module as claimed in claim 4, it is characterised in that the fingerprint recognition module is described including being fixed on Stiffening plate on flexible PCB, it is opposite that the stiffening plate with the fingerprint sensor is separately positioned on the flexible PCB Both sides.
- 6. fingerprint recognition module as claimed in claim 5, it is characterised in that the piezoelectric element is fixed on the stiffening plate On, the piezoelectric element and the flexible PCB both sides that to be separately positioned on the stiffening plate opposite.
- 7. fingerprint recognition module as claimed in claim 6, it is characterised in that the piezoelectric element is located at the fingerprint sensor Underface.
- 8. fingerprint recognition module as claimed in claim 1, it is characterised in that the fingerprint recognition module includes case ring, institute State cover plate and the fingerprint sensor is contained in the case ring.
- 9. fingerprint recognition module as claimed in claim 8, it is characterised in that the case ring includes basic ring and flange, described Cover plate and the fingerprint sensor are contained in the basic ring, and the flange extends outwardly from the outside of the basic ring.
- A kind of 10. electronic installation, it is characterised in that including：Touch panel；WithFingerprint recognition module described in claim any one of 1-9, the fingerprint recognition module are arranged on the touch panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710952543.7A CN107609539A (en) | 2017-10-13 | 2017-10-13 | Fingerprint recognition module and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710952543.7A CN107609539A (en) | 2017-10-13 | 2017-10-13 | Fingerprint recognition module and electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107609539A true CN107609539A (en) | 2018-01-19 |
Family
ID=61078130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710952543.7A Withdrawn CN107609539A (en) | 2017-10-13 | 2017-10-13 | Fingerprint recognition module and electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107609539A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108875571A (en) * | 2018-05-10 | 2018-11-23 | Oppo广东移动通信有限公司 | Fingerprint recognition module assembly method, fingerprint recognition module and electronic device |
| CN109829419A (en) * | 2019-01-28 | 2019-05-31 | 京东方科技集团股份有限公司 | Fingerprint recognition mould group and its driving method and production method, display device |
| CN110196636A (en) * | 2019-05-13 | 2019-09-03 | Oppo广东移动通信有限公司 | Prompting method and device, storage medium and electronic equipment |
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
| CN110286752A (en) * | 2019-06-06 | 2019-09-27 | Oppo广东移动通信有限公司 | Control method of electronic device and electronic device |
| WO2020181738A1 (en) * | 2019-03-08 | 2020-09-17 | 南昌欧菲生物识别技术有限公司 | Touch feedback device, intelligent terminal and vehicle |
| CN111679750A (en) * | 2019-03-11 | 2020-09-18 | 三星显示有限公司 | Display device and method of driving the same |
| CN112037354A (en) * | 2020-08-26 | 2020-12-04 | 刘鹏程 | Fingerprint identification attendance equipment based on thing networking |
| CN114627511A (en) * | 2020-12-10 | 2022-06-14 | 北京小米移动软件有限公司 | Fingerprint identification subassembly, display screen subassembly and terminal |
-
2017
- 2017-10-13 CN CN201710952543.7A patent/CN107609539A/en not_active Withdrawn
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108875571A (en) * | 2018-05-10 | 2018-11-23 | Oppo广东移动通信有限公司 | Fingerprint recognition module assembly method, fingerprint recognition module and electronic device |
| US11397495B2 (en) | 2019-01-28 | 2022-07-26 | Boe Technology Group Co., Ltd. | Fingerprint identification module and driving method thereof and electronic device |
| CN109829419A (en) * | 2019-01-28 | 2019-05-31 | 京东方科技集团股份有限公司 | Fingerprint recognition mould group and its driving method and production method, display device |
| US11487389B2 (en) | 2019-01-28 | 2022-11-01 | Beijing Boe Technology Development Co., Ltd. | Fingerprint recognition module, driving method thereof, manufacturing method thereof and display device |
| US11442583B2 (en) | 2019-01-28 | 2022-09-13 | Beijing Boe Technology Development Co., Ltd. | Fingerprint identification module, manufacturing method thereof and electronic device |
| CN109829419B (en) * | 2019-01-28 | 2021-08-24 | 京东方科技集团股份有限公司 | Fingerprint identification module, driving method and manufacturing method thereof, and display device |
| WO2020181738A1 (en) * | 2019-03-08 | 2020-09-17 | 南昌欧菲生物识别技术有限公司 | Touch feedback device, intelligent terminal and vehicle |
| US12322202B2 (en) | 2019-03-11 | 2025-06-03 | Samsung Display Co., Ltd. | Display device and method of driving the same |
| CN111679750A (en) * | 2019-03-11 | 2020-09-18 | 三星显示有限公司 | Display device and method of driving the same |
| CN110196636A (en) * | 2019-05-13 | 2019-09-03 | Oppo广东移动通信有限公司 | Prompting method and device, storage medium and electronic equipment |
| CN110210388B (en) * | 2019-05-31 | 2021-03-09 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
| CN110286752B (en) * | 2019-06-06 | 2022-07-12 | Oppo广东移动通信有限公司 | Control method of electronic device and electronic device |
| CN110286752A (en) * | 2019-06-06 | 2019-09-27 | Oppo广东移动通信有限公司 | Control method of electronic device and electronic device |
| CN112037354A (en) * | 2020-08-26 | 2020-12-04 | 刘鹏程 | Fingerprint identification attendance equipment based on thing networking |
| CN114627511A (en) * | 2020-12-10 | 2022-06-14 | 北京小米移动软件有限公司 | Fingerprint identification subassembly, display screen subassembly and terminal |
| CN114627511B (en) * | 2020-12-10 | 2026-01-02 | 北京小米移动软件有限公司 | Fingerprint recognition components, display components and terminals |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180119 |