CN208848156U

CN208848156U - A cooling system for a server

Info

Publication number: CN208848156U
Application number: CN201821652519.8U
Authority: CN
Inventors: 宗斌
Original assignee: Zhengzhou Yunhai Information Technology Co Ltd
Current assignee: Zhengzhou Yunhai Information Technology Co Ltd
Priority date: 2018-10-10
Filing date: 2018-10-10
Publication date: 2019-05-10
Anticipated expiration: 2028-10-10

Abstract

A kind of cooling system for server, including fan, radiator, the cooperation of the central processor CPU of the radiator and server, it radiates for central processor CPU, the fan is located on rear side of mainboard, the front side of power supply module PSU, the fan is provided at least 4, wind scooper is equipped between radiator air outlet and wind inlet of fan, the wind scooper is flared, the tightening port of flared wind scooper and radiator air outlet cooperate, the ECP Extended Capabilities Port of flared wind scooper and the air inlet of at least 4 fans cooperate, make to form an independent air-guiding aisle between radiator and more fans by wind scooper.The utility model can be used for the higher calculation type server system of CPU power consumption, by the way that limited air quantity is gathered key position, meets it to distinguished and admirable requirement, existing air quantity is made full use of to accomplish that cpu temperature is minimum.

Description

A kind of cooling system for server

Technical field

The utility model belongs to technical field of heat dissipation, more particularly to by reasonable distribution using chassis space, make full use of A kind of cooling system for server of node air quantity.

Background technique

It is higher and higher to the bandwidth and capacity requirement of data storage with the development of the new techniques such as cloud computing, big data, The arithmetic speed of central processor CPU and operand are also increasing, and power consumption increases.Each first device such as corresponding memory, hard disk The temperature of part also constantly increases, and the space in cabinet is limited in addition, so that the heat dissipation of electronic device becomes, mesh is previous quite to dash forward Out the problem of.

For the temperature overtemperature problem for solving each electronic component, effective means should not be only simple increase air quantity, And the characteristics of should more utilizing type, carries out the cooling system of server whole on the basis of making full use of limited air quantity Optimization requires Spe to meet the temperature specification of each electronic device.Present demand of the server to hard disk, CPU is higher and higher, With the increase of calculation amount, the requirement to cpu performance is higher and higher, and the power consumption of CPU is also higher and higher, for computer type Speech, the CPU of superelevation power consumption is also a bottleneck point to the design of entire machine.

As Chinese patent (Authorization Notice No. CN102520771B) discloses a kind of " server ", comprising: machine box for server, With two pairs of side walls being oppositely arranged respectively, two pairs of side walls include the first side wall and second sidewall and third side wall and the 4th side Wall；Fan mould group is fixed on the inside of the first side wall of machine box for server, and is made of multiple fans；Fan housing has air intake And outlet air end, wherein air intake have at least one fan in fan mould group it is adjacent first opening, outlet air end have with The second adjacent opening of second sidewall, fan housing have the side wall being oppositely arranged and top surface；And cooling fin, it is located at fan housing It is interior, and be fixedly connected with server master board, for multiple chip coolings on mainboard.Using fan mould group, cooling fin and The combination of unique fan housing, is able to carry out and timely and effectively radiates, and improves the operational efficiency of CPU, so that it is steady to improve system Qualitative and service life, improves system performance on the whole.

For another example Chinese patent (Authorization Notice No. CN104460908B) discloses that " a kind of multi-channel cooling of 1U server is set Meter method " belongs to server radiating field, specific steps are as follows: server master board layout, heat dissipation opening area assessment: according to clothes Business device motherboard layout assesses feasibility and reasonability that independent heat dissipation channel divides, according to the topology layout of server, assesses machine The feasibility and reasonability of the heat dissipation opening area of box cover；Independent heat dissipation channel design: it is radiated according to mainboard emphasis device logical Road assessment result divides the independent heat dissipation channel of each emphasis radiating element using air register；Radiate opening area design: according to The heat dissipation opening area assessment result of chassis cover carries out the heat dissipation circulation opening area of design heat dissipation on the way for heat dissipation channel, Guarantee that function of environment heat emission air is directly entered the independent heat dissipation channel of emphasis radiating element；Dissipating for complete machine may be implemented in the utility model Hot flow path design carries out high efficiency and heat radiation to emphasis device, meets the cooling requirements of complete machine, uses so that the complexity for adapting to different is severe Environment.

On address existing server radiating system structure is complicated, independence is poor, and due to server machine box space and Settable number of fans is limited, is unable to reach the central processor CPU temperature specification requirement of existing calculation type server.

Utility model content

The utility model provides a kind of cooling system for server, for solving the problems of the prior art.

The utility model is achieved by the following technical programs:

A kind of cooling system for server, including fan, radiator, the central processing of the radiator and server Device CPU cooperation, radiates for central processor CPU, and the fan is located on rear side of mainboard, the front side of power supply module PSU, institute It states fan and is provided at least 4, wind scooper is equipped between radiator air outlet and wind inlet of fan, the wind scooper is flaring Shape, the tightening port of flared wind scooper and radiator air outlet cooperate, the ECP Extended Capabilities Port of flared wind scooper and at least 4 wind The air inlet of fan cooperates, and makes to form an independent air-guiding aisle between radiator and more fans by wind scooper.

A kind of cooling system for server strictly according to the facts, the heat dissipation machine that the radiator, wind scooper, fan are constituted Structure is at least provided with 2 sets.

A kind of cooling system for server as described above, the flared wind scooper are flared structure.

A kind of cooling system for server as described above, the wind scooper turning position of the flared structure are arc Shape.

A kind of cooling system for server as described above, the flared wind scooper are symmetrically arranged flanging knot Structure, folded edges include the first flanged plate and the second flanged plate, and the junction of the first flanged plate and the second flanged plate is wind scooper Turning position.

The angle model that a kind of cooling system for server as described above, first flanged plate and the second folding are formed It encloses between 120 °~145 °.

A kind of cooling system for server as described above, the turning position of the wind scooper is pasted with noise elimination part Part cooperates with corner shape on the outside of sound attenuation features, and the inside of sound attenuation features is arc, the inside radian of sound attenuation features be 1/6 π~ Between 1/4 π.

A kind of cooling system for server as described above, the sound attenuation features are made of noise reduction cotton material.

Compared with the prior art, the advantages of the utility model are:

1, the utility model proposes a kind of completely new heat radiating structure scheme on the basis of original system framework, original By migrating postposition in the fan of cabinet tail end to mainboard rear end on the basis of scheme, number of fans is increased, after tradition The fan Forward set, avoids space occupied by the power supply module PSU of postposition.

2, the utility model increases the central processor CPU wind scooper of a postposition simultaneously, and wind scooper is by radiator and wind Sector will form individual air-guiding aisle at straight-through air-guiding aisle between CPU HS and fan, guarantee most of wind of system The radiator HS that stream can all flow through CPU reduces CPU surface temperature Tcase to reduce the thermal resistance value of radiator HS, guarantees CPU can also be operated normally under full load, by the way that the cooling system is sufficiently effective existing systematic air flow be utilized, full The distinguished and admirable requirement of each device in foot system is not realized with increasing air quantity of fan to meet with optimization system framework

3, wind scooper turning position is provided with silencing cotton, on the one hand, can make it is distinguished and admirable more smooth, on the other hand, can be with Avoid turning position due to there are the vortex that angle generates, making the wind scooper reduce noise while being conducive to distinguished and admirable heat dissipation.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described.

Fig. 1 is the structural schematic diagram of the utility model；

Fig. 2 is I partial enlargement diagram in Fig. 1.

Appended drawing reference: 1- fan, 2- radiator, 3- wind scooper, the first flanged plate of 31-, the second flanged plate of 32-, 4- wind-guiding Channel, 5- sound attenuation features, 6- mainboard, 7- power supply module PSU, 8- cabinet.

Specific embodiment

It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.

Hereinafter, being illustrated to technical term involved in embodiment:

Spec Chinese meaning is specification requirement；CPU full name is Central Processing Unit, and Chinese meaning is Central processing unit；HS full name is heatsink, and Chinese meaning is radiator, and Tcase Chinese meaning is surface temperature；In PSU Literary meaning is power supply module.

As shown in Figure 1 and Figure 2, a kind of cooling system for server disclosed in the present embodiment, including fan 1, heat dissipation The central processor CPU of device 2, radiator 2 and server cooperates, and radiates for central processor CPU, and fan 1 is located at mainboard 6 Rear side, the front side of power supply module 7, fan 1 are provided at least 4, set between 1 air inlet of 2 air outlet of radiator and fan There is wind scooper 3, wind scooper 3 is flared, and the tightening port of flared wind scooper 3 and 2 air outlet of radiator cooperate, and flared is led The ECP Extended Capabilities Port of fan housing 3 and the air inlet of at least 4 fans 1 cooperate, and are made between radiator 2 and more fans 1 by wind scooper 3 Form an independent air-guiding aisle 4.

As shown in Figure 1, the cooling mechanism that radiator 2, wind scooper 3, fan 1 are constituted is at least provided with 2 sets.

As shown in Figure 1, flared wind scooper 3 is symmetrically arranged folded edges in this implementation, folded edges include first The angular range that flanged plate 31 and the second flanged plate 32, the first flanged plate 31 and the second folding are formed is between 120 °~145 °.The The junction of one flanged plate 31 and the second flanged plate 32 is 3 turning position of wind scooper.In addition, flared wind scooper 3 is tubaeform Structure, the 3 turning position of wind scooper of flared structure are arc.

As shown in Fig. 2, the present embodiment is pasted with sound attenuation features 5 at the turning position of wind scooper, 5 outside of sound attenuation features with Corner shape cooperation, the inside of sound attenuation features 5 are arc, and the inside radian a of sound attenuation features 5 is 1/5 π, using noise reduction cotton material It is made.Turning position paste silencing cotton, can not only make it is distinguished and admirable more smooth, avoid angle generate vortex, be conducive to wind Noise is reduced while stream.

The utility model is according to the Spatial infrastructure of server, due to the fan 1 and two of 8 tail end of cabinet in prior art Layout setting power supply module PSU arranged side by side, limits the quantity of fan 1, can only at most place 6 fans 1.And it should The fan 1 of position is adjusted to 6 rear portion of mainboard, moves to the front PSU, which meets the space requirement of 8 fans 1.Pass through Increasing by 2 fans 1 obviously increases air quantity, but is not enough to solve whole heat dissipation problems.

If after increasing the expansion air quantity of fan 1, shown according to simulation result, the air quantity for flowing through HS main part is The Tcase temperature of 33CFM, CPU are 74.4 DEG C.Though hot-fluid belongs to normal range (NR) through the air quantity of the HS, it is not able to satisfy The cooling requirements of 300W CPU, beyond 72 degree of the spec requirement that user requires, to further decrease CPU Tcase value, according to Formula: △ t=R*P, it is known that wherein △ t is the difference of circumstance temperature and CPU Tcase, and R is the thermal resistance value of heat exchanger HS, P CPU Power consumption number, to reduce surface temperature Tcase, need to reduce △ t on the basis of circumstance temperature is constant.

It is constant in CPU power consumption value, need to drop low r-value according to formula, the thermal resistance value of heat exchanger HS is with flow velocity Increase and reduced variation tendency, reduces and seek to increase the wind flow of the HS in one of CPU HS thermal resistance value method.

The layout is analyzed, 60% air quantity is flowed away from the memory of the two sides HS, if memory is done part closure, can be led The flow resistance of cause system increases, and the air quantity of system can reduce, and the air quantity for flowing through CPUHS increases limited 5%, is not enough to CPU Tcase is reduced in spec, and if a wind scooper 3 will be added between HS and postposition fan 1, by shape between fan 1 and HS At closed smoothly air-guiding aisle 4, the most of air quantity for guaranteeing that fan 1 is taken away is all to flow through HS thus effective The air quantity for increasing HS, using the wind scooper 3, HS air quantity increases by 20%, and systematic air flow is basically unchanged, while air quantity reduces Memory, equally meet its temperature requirement.

It is designed by the wind scooper 3 of the optimization, CPU Tcase is reduced within the scope of spec.It is this to be changed by wind scooper 3 Become the mode in original flow field, simply and effectively change distinguished and admirable path, increases the heat exchanger air quantity for needing most the CPU of air quantity, Avoid most of distinguished and admirable caused waste that flows away from memory gap.

The utility model can be used for the higher calculation type server system of CPU power consumption, by gathering limited air quantity Key position meets it to distinguished and admirable requirement, existing air quantity is made full use of to accomplish that cpu temperature is minimum.

The technology contents of the not detailed description of the utility model are well-known technique.

Claims

1. a cooling system for a server, comprising a fan, a radiator, the radiator cooperates with the central processing unit CPU of the server, and is used for the central processing unit CPU to dissipate heat, it is characterized in that, the fan is located on the rear side of the main board, On the front side of the power supply module PSU, the fans are provided with at least 4 pieces, and an air guide cover is arranged between the air outlet of the radiator and the air inlet of the fan. The tightening port is matched with the air outlet of the radiator, the expansion port of the flared air duct is matched with the air inlets of at least 4 fans, and an independent air guide channel is formed between the radiator and multiple fans through the air duct.

2 . The heat dissipation system for a server according to claim 1 , wherein at least two sets of heat dissipation mechanisms formed by the radiator, the air guide cover and the fan are provided. 3 .

3 . The heat dissipation system for a server according to claim 1 , wherein the flared air duct has a horn-shaped structure. 4 .

4 . The cooling system for a server according to claim 3 , wherein the corner portion of the air guide cover of the trumpet-shaped structure is arc-shaped. 5 .

5 . The cooling system for a server according to claim 1 , wherein the flared air duct is a symmetrically arranged folded structure, and the folded structure comprises a first folded plate and a second folded plate. 6 . In the folding edge plate, the connection between the first folding edge board and the second folding edge board is the corner part of the air guide cover.

6 . The heat dissipation system for a server according to claim 5 , wherein the included angle formed by the first folded edge plate and the second folded edge ranges from 120° to 145°. 7 .

7. The cooling system for a server according to any one of claims 4-6, characterized in that, the corners of the air guide cover are pasted with sound-absorbing components, the outside of the sound-absorbing components is shaped to fit with the corners, and the The inner side is arc-shaped, and the inner radian a of the muffler component is between 1/6π to 1/4π.

8 . The cooling system for a server according to claim 7 , wherein the sound-absorbing component is made of sound-absorbing cotton material. 9 .