CN201127160Y - Windshield structure - Google Patents

Abstract

A wind scooper structure is arranged on a cover body covering an electronic equipment shell, the electronic equipment is provided with a heating component and a heat radiation fan, the wind scooper structure comprises a cover body and a combining part, the cover body is provided with a first opening corresponding to the heating component and a second opening corresponding to the heat radiation fan, the combining part is positioned at the top of the cover body, an air channel communicated between the heating component and the heat radiation fan is formed inside the cover body, the combining part is fixedly combined with the cover body, and therefore the cover body can be assembled and disassembled together when the cover body is assembled and disassembled, and the defects of the prior art are overcome.

Description

Windshield structure

technical field

The utility model relates to an air guide cover structure, in more detail, relates to an air guide cover structure arranged in electronic equipment with heating elements and cooling fans.

Background technique

The electronic equipment used in the current market often causes the temperature of the working environment inside the electronic equipment to rise due to frequent use and long operation time. In severe cases, it will even affect the normal operation of the electronic equipment. For example, taking electronic equipment as an example, due to The heating components contained in the mainframe, such as the central processing unit (Central processing unit, hereinafter referred to as CPU), memory, north bridge chip, and power supply, etc., can achieve faster and faster computing speeds, and the data processing capacity is also increasing. As a result, electronic components often fail due to overheating. In order to prevent such heating components from malfunctioning due to overheating, the current solution generally used in the industry is to install in the host of electronic equipment. A heat dissipation fan, heat sink, etc., to export the heat energy generated by the heating components to the outside of the electronic equipment, so as to avoid the electronic equipment from being damaged due to excessive temperature and causing unstable operation of the electronic equipment.

However, the above-mentioned method of only exporting the heat generated by the heating element through the cooling fan is not a permanent solution, because there are some problems in the actual process, especially for the heating element installed on the motherboard, only one The cooling fan cannot force the airflow to pass through the desired heat dissipation path to achieve the best heat dissipation effect. Therefore, the designer installs a heat dissipation air guide cover with a space for air flow on the main board. The wind deflector is arranged between the heating element and the cooling fan, so that the airflow generated by the cooling fan can only pass through the wind deflector, and the airflow flowing through the wind deflector is changed to discharge the hot air, so as to effectively Improve the heat dissipation effect of the cooling fan on the heat-generating components on the motherboard.

In the prior art, many systems directly arrange the heat dissipation air guide cover on the main board. In this way, in order to make the heat dissipation air guide play the role of air guide when the main board is working, certain fixing means must be required to make the heat dissipation air guide The windshield is firmly attached to this motherboard. At this time, it is also necessary to consider the material hardness, mold opening and manufacturing cost of the heat dissipation windshield, and at the same time, the convenience of disassembly must be taken into consideration. Undoubtedly, it is necessary to add locking components that can be assembled and disassembled, which will increase the design. cost. In addition, the direct installation of the heat dissipation air guide cover on the main board will definitely take up valuable space on the main board, which will undoubtedly increase the difficulty of design for electronic devices with relatively small space in the case.

Therefore, how to design a heat-dissipating and air-guiding technology that can reduce manufacturing costs, facilitate installation and disassembly, and save motherboard space, so as to avoid the above-mentioned defects, is an urgent problem to be solved by operators in related fields.

Utility model content

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wind deflector structure that is easy to assemble and disassemble.

Another object of the present invention is to provide an air guide cover structure to save the space of the motherboard.

Another object of the present invention is to provide an air guide cover structure to reduce manufacturing cost.

In order to achieve the above purpose and other related purposes, an air guide cover structure is provided, which is arranged on the cover of the electronic equipment housing, and the electronic equipment has a heating component and a cooling fan, and the feature is that the air guide cover Structures include:

The cover body has a first opening corresponding to the heating component and a second opening corresponding to the cooling fan, and an air duct communicating between the heating component and the cooling fan is formed inside to guide the flow of cooling air; and

The connecting portion is located on the top of the cover for connecting the cover.

That is to say, the utility model provides an air guide cover structure, the air guide cover structure is arranged on the cover of the electronic equipment housing, and the electronic equipment has a heating component and a cooling fan, the air guide cover structure It includes a first opening corresponding to the heat-generating component and a second opening corresponding to the heat-dissipating fan, and a cover body is formed inside to communicate with the air duct between the heat-generating component and the heat-dissipating fan; The joint part for being combined with the cover guides the flow direction of the cooling air flow through the cover, and the cover is assembled and disassembled when the cover is assembled and disassembled.

In the aforementioned structure of the windshield of the present utility model, in one embodiment, the joint part is a folded edge, and the joint part is integrally formed with the cover body, and can be welded, screw-locked, riveted, or glued for example. The fixing method is firmly combined with the cover of the electronic device. For example, the cover system is provided with a perforation, and the joint part has a screw hole corresponding to the perforation, so as to firmly combine the cover with the cover through a fixing method such as a screw lock; The studs extending from the casing, and the joint has a gourd hole corresponding to the stud, as long as the cover is moved corresponding to the joint on the cover, the stud can be clamped to the gourd hole, and the Combining the cover with the cover; and, the above-mentioned wind deflector structure may optionally include an adhesive member disposed between the joint and the cover for bonding the joint and the cover.

In addition, in one embodiment, the first opening can be the air inlet corresponding to the heat-generating component, and the second opening can be, for example, the air exhaust corresponding to the cooling fan; The second opening should be the air exhaust port of the heat-generating component, and the air inlet corresponding to the cooling fan.

As mentioned above, the main feature of the windshield structure of the present utility model is that the cover system is fixedly combined with the cover body of the electronic device through the joint part provided integrally, so that when assembling and disassembling the cover body, the cover body is also fixed. Body assembly and disassembly. Compared with the prior art where the air guide cover is arranged on the main board, the structural design of the air guide cover of the utility model is not only easy to assemble and disassemble, but also can save the space of the main board, and can reduce the manufacturing cost, which effectively overcomes the existing There are various flaws in the technology.

Description of drawings

Fig. 1 is a schematic diagram showing the application of the wind guide cover structure of the present invention to electronic equipment;

Fig. 2 is a perspective view showing the structure of the wind guide cover of the present utility model; and

Fig. 3 is a schematic diagram showing the specific structure of the combination of the wind guide structure of the present invention and the cover of the electronic equipment.

[Description of main component symbols]

1 electronic equipment

10 Shell

10a Cover

11 Heating components

111 Radiator

12 Cooling fans

13 motherboard

3 Wind hood structure

30 cover body

300 first opening

301 second opening

31 junction

A Direction of airflow

Detailed ways

The implementation of the present utility model is described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The utility model can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the utility model.

Furthermore, the following drawings are all simplified schematic diagrams, and only illustrate the basic idea of the utility model in a schematic way, so only the elements related to the utility model are shown in the drawings rather than the number, shape and shape of the elements according to the actual implementation. Dimensional drawing, the type, quantity and ratio of each component can be changed arbitrarily during actual implementation, and the component layout type may be more complicated.

Please refer to FIG. 1 . FIG. 1 is a schematic diagram of applying the structure of the air guide cover of the present invention to electronic equipment. As shown in the figure, the utility model provides a wind guide cover structure 3 on the cover body 10a of the electronic device 1. The electronic device 1 is provided with a casing 10 and a cover body 10a for covering the casing 10. , in this embodiment, the electronic device 1 is a server as an example, but not limited thereto; In this embodiment, the heating element 11 is an example of a memory, but it is not limited thereto. Other heating elements such as a central processing unit (CPU), a north bridge chip, and a power supply are also suitable for the present utility model; meanwhile, the The heat sink 111 is arranged on the heating component 11 , but this is an illustrative illustration, not intended to limit the present invention. In this embodiment, the heat dissipation fan 12 is an exhaust fan, but it is not limited thereto. The air guide cover structure 3 includes a cover body 30 disposed between the heating element 11 and the cooling fan 12 and a joint portion 31 located at the top of the cover body 30 .

The cover 30 is, for example, an H-shaped cover for covering between the heating component 11 and the cooling fan 12, and forming an air passage connected between the heating component 11 and the cooling fan 12, for In order to guide the direction of the cooling air flow, and then dissipate the heat energy of the heating component 11 outside the housing 10 .

In order to further highlight the structure of the wind guide hood of the present invention, please refer to FIG. 2 , which is a perspective view showing the cover body of the wind guide hood structure of the present invention. Please refer to FIG. 1 and FIG. 2 together. The cover body 30 has a first opening 300 corresponding to the heating element 11 and a second opening 301 corresponding to the cooling fan 12 . When the cover body 30 is installed in the inner space of the electronic device 1, one side makes the heating component 11 (including the heat sink 111) arranged on the motherboard 13 be covered into the hollow inner space of the cover body 30 Inside, the other side communicates with the cooling fan 12; that is, the cooling fan 12 continuously passes through the cover 30 to draw air from the casing 10, forming the airflow direction A as shown in the figure, and then making the heat generation The heat emitted by the component 11 is sucked into the housing 30 due to the air pressure ratio, and the cold air inside the casing 10 can also pass through the heating component 11 along the airflow direction A. In this way, an excellent convection heat dissipation effect is formed in which cold air enters and hot air exits, rapidly cooling the high temperature generated by the heating component 11 during operation, and can highlight the ultra-high-efficiency heat dissipation effect.

In order to clearly show the specific structure of the fixed position of the cover body 30 and the cover body 10a of the wind guide cover structure 3 of the present invention, please refer to FIG. The cover 30 is combined with the cover 10a of the electronic device 1 through the joint 31; in this embodiment, the joint 31 is a folded edge, preferably, the joint 31 is integrated with the cover 30 forming. In this embodiment, the joint portion 31 is firmly combined with the cover 30 on the cover 10a by means of welding, for example, but it is not limited thereto; in other embodiments, it can also be on the cover 10a A fixing structure (not shown) corresponding to the coupling portion 31 is provided.

For example, a perforation (not shown) may be provided on the cover 10a, and a screw hole (not shown) corresponding to the perforation may be provided on the joint portion 31 of the windshield structure 3 to pass through, for example, a screw lock. The cover body 30 is firmly combined with the cover body 10a in a fixed manner. In addition, the cover 10a may, for example, be provided with studs (not shown) extending downward toward the housing 10, and the joint portion 31 has a gourd hole (not shown) corresponding to the studs, as long as it corresponds to the cover 10a moves the cover body 30, so that the studs of the cover body 10a are fastened to the gourd hole, and the cover body 30 is firmly combined with the cover body 10a. Alternatively, an adhesive member (not shown) may be provided between the joint portion 31 and the cover 10a for bonding the joint portion 31 and the cover 10a, so as to firmly combine the cover 30 with the cover 10a. Certainly, such as riveting, or other fixing means that can fix and combine the cover body 30 to the cover body 10a are also suitable for the present utility model, and are understood by those with ordinary knowledge in the technical field, so no further drawings are made here. Figures and detailed descriptions.

It should be noted that the cover 30 can be, for example, a cover made of a material selected from mylar, metal, and plastic. When the material of the cover 30 is selected from mylar The way of fixing it to the cover body 10a of the electronic device 1 can be selected such as bonding; when the material of the cover body 30 is selected from metal, it can be fixed on the cover body 10a by welding, screw locking, riveting One of the fixing methods; when the material of the cover body 30 is selected from plastic, it can be fixed on the cover body 10a by either screw lock or riveting. Certainly, the material of the cover body 30 is not limited thereto, and other fixing methods for fixing the cover body 30 to the cover body 10a are suitable for the present invention.

In this embodiment, the cover body 30 is selected from low-cost Mylar as a material to reduce the manufacturing cost of the wind deflector structure 3; however, the material of the cover body 30 is not limited to this, and other For purposes, other materials can also be selected for the cover body 30 .

Certainly, although in this embodiment, the cooling fan 12 forms the airflow that is forced to pass through the air duct of the cover 30 and discharges the airflow in the housing 10 by means of suction; but in other embodiments, the second fan can also be used An opening 300 is an air outlet corresponding to the heating element 11, and the second opening 301 is an air inlet corresponding to the heat dissipation fan 12, so that the heat dissipation fan 12 forms an air duct blowing through the cover 30 in a blowing manner to discharge the air. Airflow in housing 10. The installation position of the heat dissipation element and the actual implementation method and principle are all in the prior art, and can be changed through known technologies in the industry, so no further description is given here. At the same time, in this embodiment, the air guide structure 3 and the cover body 10a are set separately, so that the installation position of the air guide structure 3 can be adjusted according to the installation positions of the heating element 11 and the cooling fan 12; but , in other embodiments, the wind deflector structure 3 can also be integrally provided on the cover body 10a, and this is also understood by those with ordinary knowledge in the technical field, so no additional drawings are shown.

To sum up, the structure of the wind guide cover of the present utility model is to fix and combine the cover body of the electronic device through the cover system through the joint part, so that the cover body can be assembled and disassembled when the cover body is assembled and disassembled. The disassembly, such a design, is not only easy to assemble and disassemble, but also saves the space of the motherboard, and can also reduce the manufacturing cost, which effectively overcomes various defects in the prior art.

At the same time, compared with the prior art, the wind guide cover structure of the present utility model is easy to implement, because the cover body is fixed on the cover body of the electronic equipment, so that the cover body is independent from the main board and does not occupy the main board. Board any space. In addition, when disassembling, it is only necessary to remove the cover together with the cover, which greatly facilitates the operator; moreover, because the structure of the wind guide cover is easy to install and fix, materials with lower cost can be selected , so that the manufacturing cost can also be reduced. Therefore, the application of the utility model can overcome many shortcomings of the prior art, and has high industrial application value.

The above-mentioned embodiments only illustrate the principles and effects of the present utility model, but are not intended to limit the present utility model. Any person skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the utility model should still be covered by the scope of the appended claims.

Claims (8)

1. A wind deflector structure, which is arranged on the cover of the electronic equipment housing, and the electronic equipment has a heating element and a cooling fan, it is characterized in that the wind deflector structure comprises: The cover body has a first opening corresponding to the heating component and a second opening corresponding to the cooling fan, and an air duct communicating between the heating component and the cooling fan is formed inside to guide the flow of cooling air; and The connecting portion is located on the top of the cover for connecting the cover. 2 . The wind deflector structure according to claim 1 , wherein the joint portion is a folded edge. 3 . 3 . The wind deflector structure according to claim 1 , wherein the joint part is integrally formed with the cover body. 4 . 4 . The wind deflector structure according to claim 1 , wherein the cover system is provided with a through hole, and the joint part has a screw hole corresponding to the through hole. 5 . The wind deflector structure according to claim 1 , wherein the cover system is provided with studs, and the joint portion is provided with corresponding gourd holes. 6 . 6 . The wind deflector structure according to claim 1 , further comprising an adhesive member disposed between the joint portion and the cover. 7 . 7 . The wind deflector structure according to claim 1 , wherein the first opening is an air inlet corresponding to the heat-generating component, and the second opening is an air exhaust corresponding to the cooling fan. 8 . 8 . The wind deflector structure according to claim 1 , wherein the first opening is an air outlet corresponding to the heat-generating component, and the second opening is an air inlet corresponding to the cooling fan.

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