CN208754632U - Electromagnetic shielding film and wiring board - Google Patents
Electromagnetic shielding film and wiring board Download PDFInfo
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- CN208754632U CN208754632U CN201821214412.5U CN201821214412U CN208754632U CN 208754632 U CN208754632 U CN 208754632U CN 201821214412 U CN201821214412 U CN 201821214412U CN 208754632 U CN208754632 U CN 208754632U
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Abstract
The utility model relates to electronic technology fields, disclose a kind of electromagnetic shielding film and wiring board, wherein, electromagnetic shielding film includes the first screen layer being cascading, insulating layer, secondary shielding layer and adhesive film, secondary shielding layer is flat surface close to the one side of adhesive film, secondary shielding layer is equipped with the conductive particles of convex close to the one side of adhesive film, by the way that insulating layer is arranged between first screen layer and secondary shielding layer, to realize the multilayer screen to the interference signal of electromagnetic shielding film two sides, to the effectively weak interference signal of electromagnetic shielding film two sides, and excess charge is imported by stratum by secondary shielding layer, substantially increase shield effectiveness.
Description
Technical field
The utility model relates to electronic technology fields, more particularly to a kind of electromagnetic shielding film and wiring board.
Background technique
With the rapid development of electronics industry, electronic product is further to miniaturization, lightweight, assembling densification hair
Exhibition greatly pushes the development of flexible electric circuit board, to realize component arrangement and conducting wire connecting integration.Flexible electric circuit board can be wide
It is general to be applied to the industries such as mobile phone, liquid crystal display, communication and space flight.
Under the promotion of international market, function flexible electric circuit board is occupied an leading position in flexible electric circuit board market, and is evaluated
One important indicator of function flexible electric circuit board performance is electromagnetic shielding (Electromagnetic Interference
Shielding, abbreviation EMI Shielding).With the integration of the communication apparatus function such as mobile phone, internal component sharply high frequency
High speed.Such as: for cell-phone function other than original audio communication function, camera function has become necessary function, and WLAN
(Wireless Local Area Networks, WLAN), GPS (Global Positioning System, the whole world
Positioning system) and function of surfing the Net popularized, along with the integration of following sensing component, sharply high-frequency high-speed becomes component
Gesture is more inevitable.The component internal and the electromagnetic interference of outside, signal caused under the driving of high frequency and high speed exists
Decaying and insertion loss and jitter problem are gradually serious in transmission.
Currently, the common electromagnetic shielding film of existing line plate includes shielded layer and conductive adhesive layer, will be shielded by conductive adhesive layer
The stratum for covering layer and wiring board connects, and then the stratum that charge will be interfered to import wiring board, to realize shielding.Above structure
The shield effectiveness of electromagnetic shielding film is lower, leads to the asking there are still electromagnetic interference in the transmission of the signal of high frequency and high speed
Topic.
Utility model content
The purpose of the utility model embodiment is to provide a kind of electromagnetic shielding film and wiring board, can effectively improve electricity
The shield effectiveness of magnetic shield film.
In order to solve the above-mentioned technical problem, the utility model embodiment provides a kind of electromagnetic shielding film, including the first shielding
Layer, insulating layer, secondary shielding layer and adhesive film, the first screen layer, the insulating layer, the secondary shielding layer and the glue
Film layer is cascading, and the secondary shielding layer is flat surface, the secondary shielding layer close to the one side of the adhesive film
The conductive particles of convex are equipped with close to the one side of the adhesive film.
Preferably, the conductive particles include one in metallic particles, carbon nanotube particulate and ferrite particle
Kind is a variety of.
Preferably, the metallic particles includes monometallic particle and/or alloying pellet；Wherein, the monometallic
Particle is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloying pellet by aluminium, titanium,
Two or more any material in zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.
Preferably, the shape of the conductive particles is identical, and/or, the spacing of the conductive particles is identical.
Preferably, the height of the conductive particles is 0.1 μm -30 μm.
Preferably, the first screen layer with a thickness of 0.1 μm -45 μm, the secondary shielding layer with a thickness of
0.1 μm -45 μm, the insulating layer with a thickness of 1 μm -80 μm, the adhesive film with a thickness of 1 μm -80 μm.
Preferably, the adhesive film includes the adhesion layer containing conducting particles；Or, the adhesive film includes being free of
The adhesion layer of conducting particles.
Preferably, the electromagnetic shielding film further includes protective film layer, and the protective film layer is set to first screen
It covers in one side of the layer far from the adhesive film.
In order to solve identical technical problem, the utility model embodiment also provides a kind of wiring board, including wiring board sheet
Body and the electromagnetic shielding film, the electromagnetic shielding film are mutually pressed by the adhesive film with the wiring board ontology；Institute
Conductive particles are stated to pierce through the adhesive film and be electrically connected with the stratum of the wiring board ontology.
The utility model embodiment provides a kind of electromagnetic shielding film and wiring board, wherein electromagnetic shielding film includes successively layer
First screen layer, insulating layer, secondary shielding layer and the adhesive film of folded setting, by between first screen layer and secondary shielding layer
Insulating layer is set, to realize the multilayer screen to the interference signals of electromagnetic shielding film two sides, thus effectively weak electromagnetic screen
The interference signal of film two sides is covered, and excess charge is imported by stratum by secondary shielding layer, substantially increases shield effectiveness；Separately
Outside, by the way that insulating layer is arranged between first screen layer and secondary shielding layer, the bending of electromagnetic shielding film is effectively increased；
In addition, by the conductive particles for being equipped with convex in one side of the secondary shielding layer close to adhesive film, so that conductive particles are in electricity
Magnetic shield film with can pierce through adhesive film when circuit board pressing and be connect with the stratum of wiring board, ensure that electromagnetic shielding film
It is connect with the stratum of wiring board.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the electromagnetic shielding film in the utility model embodiment；
Fig. 2 is the structural schematic diagram of another embodiment of the electromagnetic shielding film in the utility model embodiment；
Fig. 3 is the structural schematic diagram of the wiring board in the utility model embodiment；
Fig. 4 is the flow diagram of the preparation method of the electromagnetic shielding film in the utility model embodiment；
Wherein, 1, first screen layer；2, insulating layer；3, secondary shielding layer；31, conductive particles；4, adhesive film；5, protective film
Layer；7, wiring board ontology.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
Refering to Figure 1, a kind of electromagnetic shielding film of the preferred embodiment in the utility model, including first screen layer 1, absolutely
Edge layer 2, secondary shielding layer 3 and adhesive film 4, the first screen layer 1, the insulating layer 2, the secondary shielding layer 3 and described
Adhesive film 4 is cascading, and the secondary shielding layer 3 is flat surface, second screen close to the one side of the adhesive film 4
Cover the conductive particles 31 that layer 3 is equipped with convex close to the one side of the adhesive film 4.
In the utility model embodiment, successively by first screen layer 1, insulating layer 2, secondary shielding layer 3 and adhesive film 4
It is stacked, by the way that insulating layer 2 is arranged between first screen layer 1 and secondary shielding layer 3, to realize to electromagnetic shielding film two sides
Interference signal multilayer screen, thus the effectively weak interference signal of electromagnetic shielding film two sides, and pass through the second screen
It covers layer 3 and excess charge is imported into stratum, substantially increase shield effectiveness；In addition, by first screen layer 1 and secondary shielding layer
Insulating layer 2 is set between 3, effectively increases the bending of electromagnetic shielding film；In addition, by secondary shielding layer 3 close to glue
The one side of film layer 4 is equipped with the conductive particles 31 of convex, so that conductive particles 31 are in electromagnetic shielding film and circuit board pressing
Adhesive film 4 can be pierced through and connect with the stratum of wiring board, ensure that the stratum of electromagnetic shielding film and wiring board connects.
In conjunction with shown in Fig. 1 to Fig. 3, the conductive particles 31 may include it is multiple, multiple conductive particles 31 can advise
Then or the secondary shielding layer 3 is irregularly distributed in the one side of the adhesive film 4；Wherein, multiple conductors
Grain 31 is regularly distributed over the secondary shielding layer 3 and refers to multiple conductive particles 31 in the one side of the adhesive film 4
Shape it is identical and be evenly distributed in the secondary shielding layer 3 in the one side of the adhesive film 4；Multiple conductors
Grain 31 is irregularly distributed in the secondary shielding layer 3 and refers to multiple conductive particles in the one side of the adhesive film 4
31 different and the secondary shielding layer 3 is disorderly distributed in the one side of the adhesive film 4.In the present embodiment
In, the shape of the conductive particles 31 is identical, and/or, the spacing of the conductive particles 31 is identical.Preferably, multiple described to lead
The shape of body particle 31 is identical, and multiple conductive particles 31 are evenly distributed on the secondary shielding layer 3 close to the adhesive film 4
One side on.In addition, the surface that on one side can be any shape of the secondary shielding layer 3 far from the adhesive film 4, for example,
It can be flat surface, be also possible to contoured non-smooth surface or other rough surfaces.The utility model attached drawing is only with institute
It states secondary shielding layer 3 to be illustrated far from the one side of the adhesive film 4 for flat surface, but other any shapes are all at this
Within the protection scope of utility model.
In specific implementation, it can be initially formed secondary shielding layer 3, then again by other techniques in the secondary shielding
Conductive particles 31 are formed on layer 3.Certainly, the secondary shielding layer 3 and the conductive particles 31 can also be and pass through one-pass molding
The overall structure that technique is formed.
Preferably, the height of the conductive particles 31 is 0.1 μm -30 μm；The conductive particles 31 can be with the adhesive film 4
Outer surface there are a certain distance, can also be in contact with the outer surface of the adhesive film 4 or extend the outer of the adhesive film 4
Surface.In addition, the outer surface of the adhesive film 4 can be the flat surface without fluctuating, it is also possible to the out-of-flatness gently to rise and fall
Surface.
It should be noted that the shape of the conductive particles 31 of the Fig. 1 into Fig. 3 is only exemplary, due to technique
Difference in means and parameter, the conductive particles 31 can also for cluster-shaped, hang ice-like, stalactite, dendroid etc. other
Shape.In addition, conductive particles 31 in the utility model embodiment are by illustrating and above-mentioned shape is limited, as long as having
The conductive particles 31 of puncture and conducting function, both are within the protection scope of the present invention.
Preferably, the first screen layer 1 with a thickness of 0.1 μm -45 μm, the secondary shielding layer 3 with a thickness of 0.1 μ
M-45 μm, the insulating layer 2 with a thickness of 1 μm -80 μm, the adhesive film 4 with a thickness of 1 μm -80 μm.4 institute of adhesive film
It is selected from material following several: modified epoxy class, acrylic compounds, modified rubber class, modified thermoplastic polyimide.It can
With understanding, in order to guarantee that the first screen layer 1 and the secondary shielding layer 3 have good electric conductivity, first screen
It covers layer 1 and the secondary shielding layer 3 respectively includes metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene
One of shielded layer is a variety of.Wherein, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Wherein,
The monometallic shielded layer is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloy
Shielded layer is made of two or more any material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
In the utility model embodiment, the conductive particles 31 include metallic particles, carbon nanotube particulate and ferrite
One of particle is a variety of.In addition, the metallic particles includes monometallic particle and/or alloying pellet；Wherein, the Dan Jin
Metal particles are made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloying pellet by aluminium,
Two or more any material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.It should be noted that described
Conductive particles 31 can be identical as the material of the first screen layer 1 or secondary shielding layer 3, can not also be identical.
In the utility model embodiment, in order to further ensure that the stratum connection of the electromagnetic shielding film and wiring board,
The adhesive film 4 in the present embodiment includes the adhesion layer containing conducting particles.It include containing conductive particle by the adhesive film 4
The adhesion layer of son has thereby further ensured that the electromagnetic shielding film and wiring board to improve the conductive capability of the adhesive film 4
Stratum connection.Certainly, the adhesive film 4 may include the adhesion layer without conducting particles, have the electromagnetic screen to reduce
The insertion loss of the wiring board of film is covered, to improve the bending of wiring board while improving shield effectiveness.
It should be noted that the conducting particles can be the conducting particles being separated from each other, or made of reunion
Bulky grain conducting particles；When the conducting particles is the conducting particles being separated from each other, the adhesive film 4 can further improve
Earth-continuity；And when the bulky grain conducting particles made of the conducting particles is to reunite, puncture intensity can be increased.
In conjunction with shown in Fig. 2 and Fig. 3, the embodiment of the present invention electromagnetic shielding film further includes protective film layer 5, the protective film layer
5 are set in one side of the first screen layer 1 far from the adhesive film 4.Since the protective film layer 5 has insulating effect, because
This ensure that the shield effectiveness of the first screen layer 1 and the secondary shielding layer 3；It is protected in addition, the protective film layer 5 also has
Shield effect, to guarantee that the first screen layer 1 is not scratched breakage in use, to maintain the first screen layer 1
High shield effectiveness.The protective film layer 5 include PPS film layer, PEN film layer, laminated polyester film, polyimide film layer,
After film layer that film layer that epoxy resin ink is formed after solidifying, polyurethane ink are formed after solidifying, acrylic resin modified solidification
The film layer that the film layer or polyimide resin of formation are formed after solidifying.Wherein, the protective film layer 5 is far from the first screen layer
Carrier film is also provided in 1 one side, the carrier film plays a supportive role to protective film layer 5, is conducive to following process.
It should be noted that the embodiment of the present invention first screen layer 1, the insulating layer 2 and the secondary shielding layer 3 can
Respectively single layer structure or multilayered structure.In order to enhance effectiveness, first shielding of the utility model embodiment
Layer 1, the insulating layer 2 and the secondary shielding layer 3 can be set to multiple.Preferably, when the first screen layer 1, described
When insulating layer 2 and the secondary shielding layer 3 are respectively multiple, the first screen layer 1, the insulating layer 2 and second screen
It covers 3 three of layer and is successively spaced setting, for example, when the first screen layer 1, the insulating layer 2 and the secondary shielding layer 3 are distinguished
When being 2, putting in order can be with are as follows: the described 2, secondary shieldings of insulating layer of a first screen layer 1, one
Layer 3, another described first screen layer 1, another described insulating layer 2, another described secondary shielding layer 3, and so on,
This, which does not do, more repeats.In addition, each layer secondary shielding layer 3 is close to described when the secondary shielding layer 3 is multilayer
The conductive particles 31 of convex can be equipped in the one side of adhesive film 4.In addition, according to the needs of actual production and application, this implementation
The first screen layer 1 and the secondary shielding layer 3 of example may be configured as latticed, foaming shape etc..
In order to solve identical technical problem, the utility model embodiment also provides a kind of wiring board, including wiring board sheet
Body 7 and the electromagnetic shielding film, the electromagnetic shielding film are pressed by the adhesive film 4 and 7 phase of wiring board ontology；
The conductive particles 31 pierce through the adhesive film 4 and are electrically connected with the stratum of the wiring board ontology 7.
It please refers to shown in Fig. 3, in order to solve identical technical problem, the utility model embodiment also provides a kind of route
Plate, including wiring board ontology 7 and the electromagnetic shielding film, the electromagnetic shielding film passes through the adhesive film 4 and the line
The pressing of 7 phase of road plate ontology；The conductive particles 31 pierce through the adhesive film 4 and are electrically connected with the stratum of the wiring board ontology 7.
In the utility model embodiment, the conductive particles 31 are in the electromagnetic shielding film and the wiring board ontology 7
The adhesive film 4 can be pierced through when pressing and is connect with the stratum of wiring board ontology 7, ensure that the first screen layer 1
It is connect with the secondary shielding layer 3 with the stratum of wiring board ontology 7, to realize the first screen layer 1 and described second
Interference charge in shielded layer 3 imports in ground, avoids the accumulation of interference charge and forms the normal of interference source influence wiring board
Work.
Preferably, the wiring board ontology 7 is flexible single-side, flexibility double face, flexible multi-layer plate, one in rigid-flex combined board
Kind.
Referring to Fig. 4, in order to solve identical technical problem, the utility model embodiment also provides a kind of electromagnetic shielding film
Preparation method, comprising the following steps:
S11 forms first screen layer 1；
S12 forms insulating layer 2 in the first screen layer 1；
S13 forms secondary shielding layer 3 on the insulating layer 2；Wherein, the secondary shielding layer 3 is far from the insulating layer
2 one side is flat surface；
S14 forms the conductive particles 31 of convex on the flat surface of the secondary shielding layer 3；
S15 forms adhesive film 4 in the one side that the secondary shielding layer 3 is formed with conductive particles 31.
In step s 11, the formation first screen layer 1, specifically includes:
S21 forms protective film layer 5 on a carrier film；
S22 forms first screen layer 1 in the protective film layer 5；Wherein it is possible to pass through physics feather plucking, chemical plating, object
One of physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, plating and mixing plating or kinds of processes are in the guarantor
First screen layer 1 is formed on cuticular layer 5；Or,
S31 forms first screen layer 1 on the strippable coating surface with carrier；
S32 forms protective film layer 5 in the first screen layer 1；
S33 removes the strippable coating with carrier；
Wherein it is possible to plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation plating, sputtering,
One of plating and mixing plating or kinds of processes form first screen layer 1 on the strippable coating surface with carrier.
In the step S12, insulating layer 2 is formed in the first screen layer 1, specifically: in first shielding
It is coated with ink on layer 1, the first screen layer 1 after coating ink can be stood, so that the ink in the first screen layer 1
Solidification, to form insulating layer 2；Preferably, the insulating layer 2 with a thickness of 1 μm -80 μm.In addition, the insulating layer 2 may be used also
With using PPS, PEN perhaps the materials such as Kapton due to insulating layer 2 using ink, PPS, PEN or polyimides it is thin
Film elastomeric material, therefore can be improved the bending of electromagnetic shielding film by the way that flexible insulating layer 2 is arranged.
In step s 13, can be plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation,
One of sputtering plating, plating and mixing plating or kinds of processes form secondary shielding layer 3 on the insulating layer 2.
In step S14, the conductive particles 31 of convex are formed on the flat surface of the secondary shielding layer 3, it is specific to wrap
It includes:
It plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation, sputter plating, be electroplated and is mixed
It closes one of plating or kinds of processes forms the conductive particles 31 of convex on the flat surface of the secondary shielding layer 3.
In step S15, adhesive film 4 is formed in the one side that the secondary shielding layer 3 is formed with conductive particles 31, specifically
Are as follows:
S41 is coated with adhesive film 4 on release film；
The adhesive film 4 pressing is transferred to the secondary shielding layer 3 and is formed in the one side of conductive particles 31 by S42；
Or,
S51 is coated with adhesive film 4 in the one side that the secondary shielding layer 3 is formed with conductive particles 31.
To sum up, the utility model embodiment provides the preparation method of a kind of electromagnetic shielding film, wiring board and electromagnetic shielding film,
Wherein, electromagnetic shielding film includes the first screen layer 1 being cascading, insulating layer 2, secondary shielding layer 3 and adhesive film 4, is led to
The setting insulating layer 2 between first screen layer 1 and secondary shielding layer 3 is crossed, to realize the interference signal to electromagnetic shielding film two sides
Multilayer screen, thus the effectively weak interference signal of electromagnetic shielding film two sides, and will be extra by secondary shielding layer 3
Charge imports stratum, substantially increases shield effectiveness；In addition, exhausted by being arranged between first screen layer 1 and secondary shielding layer 3
Edge layer 2 effectively increases the bending of electromagnetic shielding film；In addition, passing through the one side in secondary shielding layer 3 close to adhesive film 4
The conductive particles 31 of convex are equipped with, so that conductive particles 31 can pierce through glue film in electromagnetic shielding film and circuit board pressing
Layer 4 is simultaneously connect with the stratum of wiring board, ensures that the stratum of electromagnetic shielding film and wiring board connects.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvement and replacement can also be made, these change
It also should be regarded as the protection scope of the utility model into replacement.
Claims (9)
1. a kind of electromagnetic shielding film, which is characterized in that described including first screen layer, insulating layer, secondary shielding layer and adhesive film
First screen layer, the insulating layer, the secondary shielding layer and the adhesive film are cascading, and the secondary shielding layer is leaned on
The one side of the nearly adhesive film is flat surface, and the secondary shielding layer is equipped with leading for convex close to the one side of the adhesive film
Body particle.
2. electromagnetic shielding film as described in claim 1, which is characterized in that the conductive particles include metallic particles, carbon nanometer
One of tube particle and ferrite particle.
3. electromagnetic shielding film as claimed in claim 2, which is characterized in that the metallic particles includes monometallic particle；Wherein,
The monometallic particle is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
4. electromagnetic shielding film as described in claim 1, which is characterized in that the shape of the conductive particles is identical, and/or, institute
The spacing for stating conductive particles is identical.
5. electromagnetic shielding film as described in claim 1, which is characterized in that the height of the conductive particles is 0.1 μm -30 μm.
6. electromagnetic shielding film as described in any one in claim 1-5, which is characterized in that the first screen layer with a thickness of
0.1 μm -45 μm, the secondary shielding layer with a thickness of 0.1 μm -45 μm, the insulating layer with a thickness of 1 μm -80 μm, the glue
Film layer with a thickness of 1 μm -80 μm.
7. electromagnetic shielding film as described in any one in claim 1-5, which is characterized in that the adhesive film includes containing conductive particle
The adhesion layer of son；Or, the adhesive film includes the adhesion layer without conducting particles.
8. electromagnetic shielding film as described in any one in claim 1-5, which is characterized in that the electromagnetic shielding film further includes protection
Film layer, the protective film layer are set in one side of the first screen layer far from the adhesive film.
9. a kind of wiring board, which is characterized in that including wiring board ontology and such as the described in any item electromagnetic screens of claim 1-8
Film is covered, the electromagnetic shielding film is mutually pressed by the adhesive film with the wiring board ontology；Described in the conductive particles pierce through
Adhesive film is simultaneously electrically connected with the stratum of the wiring board ontology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821214412.5U CN208754632U (en) | 2018-07-27 | 2018-07-27 | Electromagnetic shielding film and wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821214412.5U CN208754632U (en) | 2018-07-27 | 2018-07-27 | Electromagnetic shielding film and wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208754632U true CN208754632U (en) | 2019-04-16 |
Family
ID=66059420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821214412.5U Active CN208754632U (en) | 2018-07-27 | 2018-07-27 | Electromagnetic shielding film and wiring board |
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| CN (1) | CN208754632U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769677A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN112351575A (en) * | 2019-12-30 | 2021-02-09 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN112351665A (en) * | 2019-12-30 | 2021-02-09 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| TWI718552B (en) * | 2019-05-28 | 2021-02-11 | 大陸商蘇州福萊盈電子有限公司 | A circuit board structure and a manufacturing method for preventing leakage of high-frequency signals |
| CN114641193A (en) * | 2021-02-09 | 2022-06-17 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and circuit board |
-
2018
- 2018-07-27 CN CN201821214412.5U patent/CN208754632U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769677A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| TWI718552B (en) * | 2019-05-28 | 2021-02-11 | 大陸商蘇州福萊盈電子有限公司 | A circuit board structure and a manufacturing method for preventing leakage of high-frequency signals |
| CN112351575A (en) * | 2019-12-30 | 2021-02-09 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN112351665A (en) * | 2019-12-30 | 2021-02-09 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN114641193A (en) * | 2021-02-09 | 2022-06-17 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and circuit board |
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