CN208708070U - Electromagnetic shielding film and wiring board - Google Patents
Electromagnetic shielding film and wiring board Download PDFInfo
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- CN208708070U CN208708070U CN201821076441.XU CN201821076441U CN208708070U CN 208708070 U CN208708070 U CN 208708070U CN 201821076441 U CN201821076441 U CN 201821076441U CN 208708070 U CN208708070 U CN 208708070U
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- conductive adhesive
- electromagnetic shielding
- shielding film
- adhesive layer
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- 239000010410 layer Substances 0.000 claims abstract description 178
- 239000012790 adhesive layer Substances 0.000 claims abstract description 87
- 239000002245 particle Substances 0.000 claims description 40
- 230000001681 protective effect Effects 0.000 claims description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 4
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 12
- 239000013039 cover film Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 6
- 239000010941 cobalt Substances 0.000 description 6
- 229910017052 cobalt Inorganic materials 0.000 description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 229910052725 zinc Inorganic materials 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 210000003746 feather Anatomy 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
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- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241000555268 Dendroides Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920006269 PPS film Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 238000000280 densification Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to electronic technology fields, disclose a kind of electromagnetic shielding film and wiring board, wherein, electromagnetic shielding film includes shielded layer and conductive adhesive layer, by the way that conductive adhesive layer is set on shielded layer, shielded layer is flat surface close to the one side of conductive adhesive layer, and run through the through-hole of its upper and lower surface by setting on the shielding layer, be conducive to volatile matter in conductive adhesive layer at high temperature to be exhausted by the through-hole of shielded layer, it is difficult to be discharged to avoid volatile matter in conductive adhesive layer at high temperature, it causes to remove between electromagnetic shielding film and the stratum of wiring board so as to avoid electromagnetic shielding film blistering layering, and then it ensures electromagnetic shielding film ground connection and exports interference charge.
Description
Technical field
The utility model relates to electronic technology fields, more particularly to a kind of electromagnetic shielding film and wiring board.
Background technique
With the rapid development of electronics industry, electronic product is further to miniaturization, lightweight, assembling densification hair
Exhibition greatly pushes the development of flexible electric circuit board, to realize component arrangement and conducting wire connecting integration.Flexible electric circuit board can be wide
It is general to be applied to the industries such as mobile phone, liquid crystal display, communication and space flight.
Under the promotion of international market, function flexible electric circuit board is occupied an leading position in flexible electric circuit board market, and is evaluated
One important indicator of function flexible electric circuit board performance is electromagnetic shielding (Electromagnetic Interference
Shielding, abbreviation EMI Shielding).With the integration of the communication apparatus function such as mobile phone, internal component sharply high frequency
High speed.Such as: for cell-phone function other than original audio communication function, camera function has become necessary function, and WLAN
(Wireless Local Area Networks, WLAN), GPS (Global Positioning System, the whole world
Positioning system) and function of surfing the Net popularized, along with the integration of following sensing component, sharply high-frequency high-speed becomes component
Gesture is more inevitable.The component internal and the electromagnetic interference of outside, signal caused under the driving of high frequency and high speed exists
Decaying and insertion loss and jitter problem are gradually serious in transmission.
Currently, the common electromagnetic shielding film of existing line plate includes shielded layer and conductive adhesive layer, shielded layer passes through conducting resinl
Layer contacts conducting with the stratum of wiring board.But during implementing the utility model, utility model people is had found in the prior art
At least there are the following problems: there is volatile matter in conductive adhesive layer under the high temperature conditions, but shielded layer is finer and close, volatile matter is difficult to
Discharge causes to remove between electromagnetic shielding film and the stratum of wiring board, and then causes so as to cause electromagnetic shielding film blistering layering
Earthing failure, can not be by interference charge export.
Utility model content
The purpose of the utility model embodiment is to provide a kind of electromagnetic shielding film and wiring board, can be effectively prevented from existing
Volatile matter can not be discharged conductive adhesive layer in some electromagnetic shielding films by fine and close shielded layer at high temperature, so as to avoid electricity
Magnetic shield film blistering layering causes to remove between electromagnetic shielding film and the stratum of wiring board, to ensure that electromagnetic shielding film is grounded, into
And it will interference charge export.
In order to solve the above-mentioned technical problem, the utility model embodiment provides a kind of electromagnetic shielding film, including shielded layer and
Conductive adhesive layer, the conductive adhesive layer are set on the shielded layer；The shielded layer is smooth close to the one side of the conductive adhesive layer
Surface, the shielded layer are equipped with the through-hole through its upper and lower surface.
Preferably, the shielded layer is equipped with the conductive particles of convex close to the one side of the conductive adhesive layer.
Preferably, the height of the conductive particles is 0.1 μm -30 μm.
Preferably, the shielded layer with a thickness of 0.1 μm -45 μm, the conductive adhesive layer with a thickness of 1 μm of -80 μ
m。
Preferably, the shielded layer includes metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and stone
One of black alkene shielded layer is a variety of.
Preferably, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Wherein, described
Monometallic shielded layer is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloy shielding
Layer is made of any one or more material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
Preferably, the electromagnetic shielding film further includes protective film layer, and the protective film layer is set to the shielded layer
In one side far from the conductive adhesive layer.
Preferably, the area of the through-hole is 0.1 μm2-1mm2。
Preferably, the number of the through-hole in the shielded layer every square centimeter is 10-1000.
In order to solve identical technical problem, the utility model embodiment also provides a kind of wiring board, including wiring board sheet
Body and the electromagnetic shielding film, the electromagnetic shielding film are mutually pressed by the conductive adhesive layer with the wiring board ontology,
The conductive adhesive layer is electrically connected with the stratum of the wiring board ontology.
The utility model embodiment provides a kind of electromagnetic shielding film and wiring board, wherein electromagnetic shielding film includes shielded layer
And conductive adhesive layer, by the way that conductive adhesive layer to be set on shielded layer, shielded layer is flat surface close to the one side of conductive adhesive layer, and
By the way that the through-hole through its upper and lower surface is arranged on the shielding layer, being conducive to conductive adhesive layer, volatile matter passes through shielded layer at high temperature
Through-hole be exhausted, be difficult to be discharged to avoid conductive adhesive layer volatile matter at high temperature, so as to avoid electromagnetic shielding film blistering
Layering causes to remove between electromagnetic shielding film and the stratum of wiring board, and then ensures that electromagnetic shielding film is grounded and will interfere charge
Export.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the electromagnetic shielding film in the utility model embodiment；
Fig. 2 is the structural schematic diagram of another angle of the electromagnetic shielding film in the utility model embodiment；
Fig. 3 is the structural schematic diagram of another embodiment of the electromagnetic shielding film in the utility model embodiment；
Fig. 4 is the structural schematic diagram of the wiring board in the utility model embodiment；
Fig. 5 is the flow diagram of the preparation method of the electromagnetic shielding film in the utility model embodiment；
Wherein, 1, shielded layer；11, through-hole；2, conductive adhesive layer；3, conductive particles；4, protective film layer；6, wiring board ontology.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
In conjunction with shown in Fig. 1 to Fig. 4, a kind of electromagnetic shielding film of the preferred embodiment in the utility model, including shielded layer 1 and lead
Electric glue-line 2, the conductive adhesive layer 2 are set on the shielded layer 1；The shielded layer 1 is flat close to the one side of the conductive adhesive layer 2
Whole surface, the shielded layer 1 are equipped with the through-hole 11 through its upper and lower surface.
In the utility model embodiment, by the way that conductive adhesive layer 2 to be set on shielded layer 1, shielded layer 1 is close to conductive adhesive layer
2 one side is flat surface, and runs through the through-hole 11 of its upper and lower surface by being arranged on shielded layer 1, is conducive to conducting resinl
Volatile matter is exhausted layer 2 by the through-hole 11 of shielded layer 1 at high temperature, than avoiding volatile matter in conductive adhesive layer 2 at high temperature
It is difficult to be discharged, causes to remove between electromagnetic shielding film and the stratum of wiring board so as to avoid electromagnetic shielding film blistering layering, into
And it ensures electromagnetic shielding film ground connection and exports interference charge.
In the utility model embodiment, the area of the through-hole 11 is preferably 0.1 μm2-1mm2.By by the through-hole
11 area is preferably 0.1 μm2-1mm2, to ensure the conductive adhesive layer 2, when high temperature is swollen, volatile matter can be by sufficiently large
The through-hole 11 is vented, so that volatile matter in conductive adhesive layer 2 at high temperature be avoided to be difficult to be discharged, and then avoids electromagnetic shielding film
Blistering layering causes to remove between electromagnetic shielding film and the stratum of wiring board, to ensure electromagnetic shielding film ground connection and will interfere charge
Export.Preferably, the number of the through-hole 11 in the shielded layer 1 every square centimeter is 10-1000.By at every square
The number of the through-hole 11 in centimetre shielded layer 1 is set as 10-1000, to ensure the conductive adhesive layer 2 in high temperature
When volatile matter can be vented by enough through-holes 11, so that volatile matter in conductive adhesive layer 2 at high temperature be avoided to be difficult to
Discharge, and then avoid electromagnetic shielding film blistering layering and cause to remove between electromagnetic shielding film and the stratum of wiring board, to ensure
Electromagnetic shielding film ground connection simultaneously will interference charge export.
In the utility model embodiment, the through-hole 11 can be regularly or irregularly distributed on the shielded layer 1；
Wherein, the through-hole 11, which is regularly distributed on the shielded layer 1, refers to that each 11 shape of through-hole is identical and is evenly distributed in
On the shielded layer 1；The through-hole 11 be irregularly distributed on the shielded layer 1 refer to the different of each through-hole 11 and
It is disorderly distributed on the shielded layer 1.Preferably, the shape of each through-hole 11 is identical, and each through-hole 11 is evenly distributed on institute
It states on shielded layer 1.In addition, the through-hole 11 can be circular through hole, the through-hole of other arbitrary shapes can also be, this is practical new
Type attached drawing is only that circular through hole is illustrated, but the through-hole 11 of other any shapes is all in this reality with the through-hole 11
Within novel protection scope.
In conjunction with shown in Fig. 3 and Fig. 4, in order to further ensure that the electromagnetic shielding film is electrically connected with the stratum of wiring board, this
The shielded layer 1 in embodiment is equipped with the conductive particles 3 of convex close to the one side of the conductive adhesive layer 2.By described
Shielded layer 1 is equipped with the conductive particles 3 of convex close to the one side of the conductive adhesive layer 2, in order to pierce through the conductive adhesive layer 2,
Thereby further ensure that the electromagnetic shielding film is electrically connected with the stratum of wiring board.
Preferably, the conductive particles 3 can there are a certain distance with the outer surface of the conductive adhesive layer 2, can also be with institute
The outer surface for stating conductive adhesive layer 2 is in contact or extends the outer surface of the conductive adhesive layer 2.In addition, the conductive adhesive layer 2 is outer
Surface can be the flat surface without fluctuating, be also possible to the out-of-flatness surface gently to rise and fall.
In the utility model embodiment, the conductive particles 3 may include it is multiple, multiple conductive particles 3 can be with
The shielded layer 1 is regularly or irregularly distributed in the one side of the conductive adhesive layer 2；Wherein, multiple conductors
Grain 3 is regularly distributed over the shape that the shielded layer 1 refers to multiple conductive particles 3 in the one side of the conductive adhesive layer 2
Shape is identical and is evenly distributed in the shielded layer 1 in the one side of the conductive adhesive layer 2；Multiple conductive particles 3 are not
It is regularly distributed over the shielded layer 1 and refers to that the shape of multiple conductive particles 3 is each in the one side of the conductive adhesive layer 2
It is different and be disorderly distributed in the shielded layer 1 in the one side of the conductive adhesive layer 2.Preferably, multiple conductive particles 3
Shape it is identical, multiple conductive particles 3 are evenly distributed on the shielded layer 1 in the one side of the conductive adhesive layer 2.
In specific implementation, it can be initially formed shielded layer 1, then pass through other techniques shape on the shielded layer 1 again
At conductive particles 3.Certainly, the shielded layer 1 and the conductive particles 3 can also be the entirety formed by one-shot forming technique
Structure.In addition, the surface that on one side can be any shape of the shielded layer 1 far from the conductive adhesive layer 2, for example, it may be
Flat surface is also possible to contoured non-smooth surface or other rough surfaces.The utility model attached drawing is only with the shielding
1 one side far from the conductive adhesive layer 2 of layer is illustrated for flat surface, but other any shapes are all in the utility model
Protection scope within.
It should be noted that the shape of the conductive particles 3 in Fig. 3 and Fig. 4 is only exemplary, due to technique hand
Difference in section and parameter, the conductive particles 3 can also be other shapes such as cluster-shaped, extension ice-like, stalactite, dendroid
Shape.In addition, conductive particles 3 in the utility model are pierced through and are led as long as having not by illustrating and above-mentioned shape is limited
The conductive particles 3 of Electricity Functional, both are within the protection scope of the present invention.
In the utility model embodiment, the height of the conductive particles 3 is 0.1 μm -30 μm, the thickness of the shielded layer 1
Degree be 0.1 μm -45 μm, the conductive adhesive layer 2 with a thickness of 1 μm -80 μm.2 material therefor of conductive adhesive layer is selected from following several
Kind: modified epoxy class, acrylic compounds, modified rubber class, modified thermoplastic polyimide.It should be understood that in order to protect
The shielded layer 1 is demonstrate,proved with good electric conductivity, the shielded layer 1 includes metal screen layer, carbon nanotube shielded layer, ferrite
One of shielded layer and graphene shielded layer are a variety of.Wherein, the metal screen layer includes monometallic shielded layer and/or conjunction
Golden shielded layer；Wherein, the monometallic shielded layer is by any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold
Material is made, the alloy shielded layer by aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold it is any two or more
Material is made.
It should be noted that the shielded layer 1 of the present embodiment can be single layer structure, or multilayered structure；The conduction
Glue-line 2 can be single layer structure, be also possible to multilayered structure；The shielded layer 1 and conductive adhesive layer 2 can be set to multiple.It is excellent
Selection of land, when the shielded layer 1 and respectively multiple conductive adhesive layer 2, the shielded layer 1 and conductive adhesive layer 2 are successively spaced setting,
For example, when the shielded layer 1 and conductive adhesive layer 2 are respectively 2, putting in order can be with are as follows: a shielded layer 1, one
A conductive adhesive layer 2, another described shielded layer 1, another described conductive adhesive layer 2, and so on, it does not do herein more
It repeats；When the shielded layer 1 is multilayer, each layer shielded layer 1 can be equipped in the one side of the conductive adhesive layer 2
The conductive particles 3 of convex or the conductive particles 3 for being not provided with convex.In addition, according to the needs of actual production and application, this implementation
The shielded layer 1 of example may be configured as foaming shape etc., does not do more repeat herein.
It is described in the present embodiment in order to improve the conductive capability of the conductive adhesive layer 2 in the utility model embodiment
Conductive adhesive layer 2 includes the adhesion layer containing conducting particles.It include the adhesion layer containing conducting particles by the conductive adhesive layer 2,
To improve the conductive capability of the conductive adhesive layer 2, thereby further ensure that the electromagnetic shielding film is connected to ground.It needs to illustrate
, the conducting particles can be the conducting particles being separated from each other, or bulky grain conducting particles made of reunion；When
When the conducting particles is the conducting particles being separated from each other, the earth-continuity of the conductive adhesive layer 2 can further improve；And work as
When the conducting particles is bulky grain conducting particles made of reuniting, puncture intensity can be increased.
In the utility model embodiment, the conductive particles 3 include metallic particles, carbon nanotube particulate and ferrite paricles
One of grain is a variety of.In addition, the metallic particles includes monometallic particle and/or alloying pellet；Wherein, the monometallic
Particle is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloying pellet by aluminium, titanium,
Two or more any material in zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.It should be noted that described lead
Body particle 3 can be identical as the material of the shielded layer 1, can not also be identical.
In conjunction with shown in Fig. 3 and Fig. 4, the embodiment of the present invention electromagnetic shielding film further includes protective film layer 4, the protective film layer
4 are set in one side of the shielded layer 1 far from the conductive adhesive layer 2.Since the protective film layer 4 has insulating effect,
It ensure that the shield effectiveness of the shielded layer 1；In addition, the protective film layer 4 also has protective effect, to guarantee the shielded layer
1 is not scratched breakage in use, to maintain the high shield effectiveness of the shielded layer 1.The protective film layer 4 includes
It is film layer that PPS film layer, PEN film layer, laminated polyester film, polyimide film layer, epoxy resin ink are formed after solidifying, poly-
Shape after film layer or the polyimide resin solidification formed after the film layer that is formed after urethane ink solidification, acrylic resin modified solidification
At film layer.Wherein, carrier film is also provided in one side of the protective film layer 4 far from the shielded layer 1.In addition, described
Protective film layer 4 and the conductive adhesive layer 2 can be in close contact after pressing or printing through the through-hole 11, so as to have
Effect ground improves the peel strength between the protective film layer 4 and the shielded layer 1, i.e., the described protective film layer 4 and the shielded layer 1
Between be susceptible to remove.
Referring to Fig. 4, the utility model embodiment also provides a kind of wiring board in order to solve identical technical problem, packet
Wiring board ontology 6 and the electromagnetic shielding film are included, the electromagnetic shielding film passes through the conductive adhesive layer 2 and the wiring board
The pressing of 6 phase of ontology, the conductive adhesive layer 2 are electrically connected with the stratum of the wiring board ontology 6.
In the utility model embodiment, it is connect by the conductive adhesive layer 2 with the stratum of the wiring board ontology 6, from
And ensure that the shielded layer 1 and the stratum of the wiring board ontology 6 are connect, to realize the interference charge in shielded layer 1
Import ground in, avoid interference charge accumulation and formed interference source influence wiring board normal work.
Preferably, the wiring board ontology 6 is flexible single-side, flexibility double face, flexible multi-layer plate, one in rigid-flex combined board
Kind.
Referring to Fig. 5, in order to solve identical technical problem, the utility model embodiment also provides a kind of electromagnetic shielding film
Preparation method, comprising the following steps:
S11 forms shielded layer 1；Wherein, the through-hole 11 of its upper and lower surface, the screen are formed through on the shielded layer 1
The one side for covering layer 1 is flat surface；
S12 forms conductive adhesive layer 2 on the flat surface of the shielded layer 1.
In the utility model embodiment, the area of the through-hole 11 is preferably 0.1 μm2-1mm2.By by the through-hole
11 area is preferably 0.1 μm2-1mm2, to ensure the conductive adhesive layer 2, volatile matter can be by sufficiently large institute at high temperature
The exhaust of through-hole 11 is stated, so that volatile matter in conductive adhesive layer 2 at high temperature be avoided to be difficult to be discharged, and then electromagnetic shielding film is avoided and rises
Bubble layering causes to remove between electromagnetic shielding film and the stratum of wiring board, to ensure electromagnetic shielding film ground connection and lead interference charge
Out.Preferably, the number of the through-hole 11 in the shielded layer 1 every square centimeter is 10-1000.By at every square li
The number of the through-hole 11 in meter Suo Shu shielded layer 1 is set as 10-1000, to ensure the conductive adhesive layer 2 at high temperature
Volatile matter can be vented by enough through-holes 11, so that volatile matter in conductive adhesive layer 2 at high temperature be avoided to be difficult to arrange
Out, so avoid electromagnetic shielding film blistering layering cause to remove between electromagnetic shielding film and the stratum of wiring board, to ensure electricity
Magnetic shield film ground connection simultaneously will interference charge export.In addition, the through-hole 11 can be circular through hole, it can also be other irregular
Through-hole.
In the utility model embodiment, the through-hole 11 can be regularly or irregularly distributed on the shielded layer 1；
Wherein, the through-hole 11, which is regularly distributed on the shielded layer 1, refers to that each 11 shape of through-hole is identical and is evenly distributed in
On the shielded layer 1；The through-hole 11 be irregularly distributed on the shielded layer 1 refer to the different of each through-hole 11 and
It is disorderly distributed on the shielded layer 1.Preferably, the shape of each through-hole 11 is identical, and each through-hole 11 is evenly distributed on institute
It states on shielded layer 1.In addition, the through-hole 11 can be circular through hole, the irregular through-hole of other shapes can also be.
In the utility model embodiment, the preparation method of the electromagnetic shielding film further include: separate in the shielded layer 1
Protective film layer 4 is formed in the one side of the conductive adhesive layer 2.
In step s 11, the formation shielded layer 1 specifically includes:
S21 forms protective film layer 4 on a carrier film；
S22 forms shielded layer 1 in the protective film layer 4；Wherein, the shielded layer 1 is far from the protective film layer 4
It is on one side flat surface；Physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation plating, sputtering can be passed through
One of plating, plating and mixing plating or kinds of processes form shielded layer 1 in protective film layer 4；Or,
S31 forms shielded layer 1 on the strippable coating surface with carrier；Wherein, the shielded layer 1 is close to the band carrier
Strippable coating one side be flat surface；Can by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition,
One of evaporation plating, sputtering plating, plating and mixing plating or kinds of processes are formed on the strippable coating surface with carrier
Shielded layer 1；
S32 forms protective film layer 4 on the shielded layer 1；
S33 removes the strippable coating with carrier.
In the utility model embodiment, the protective film layer 4 can be tight through the through-hole 11 with the conductive adhesive layer 2
Contiguity touching, so as to effectively improve the peel strength between the protective film layer 4 and the shielded layer 1, i.e., the described protection
It is susceptible to remove between film layer 4 and the shielded layer 1.
In the utility model embodiment, after the formation shielded layer 1 further include:
S41 forms the conductive particles 3 of convex on the flat surface of the shielded layer 1.
In step S41, the conductive particles 3 that convex is formed on the flat surface of the shielded layer 1 are specifically included:
It plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation, sputter plating, be electroplated and is mixed
It closes one of plating or kinds of processes forms conductive particles 3 on the flat surface of the shielded layer 1.
In step s 12, conductive adhesive layer 2 is formed on the flat surface of the shielded layer 1, specifically:
S51, the applying conductive glue-line 2 on release film；
The conductive adhesive layer 2 pressing is transferred on the flat surface of the shielded layer 1 by S52；Or,
S61, the applying conductive glue-line 2 on the flat surface of the shielded layer 1.
The utility model embodiment provides the preparation method of a kind of electromagnetic shielding film, wiring board and electromagnetic shielding film, wherein
Electromagnetic shielding film includes shielded layer 1 and conductive adhesive layer 2, and by the way that conductive adhesive layer 2 to be set on shielded layer 1, shielded layer 1 is close to conductive
The one side of glue-line 2 is flat surface, and runs through the through-hole 11 of its upper and lower surface by being arranged on shielded layer 1, is conducive to lead
Electric glue-line 2 is exhausted in high-temperature expansion by the through-hole 11 of shielded layer 1, to alleviate the expansion of conductive adhesive layer 2, so as to avoid
Conductive adhesive layer 2 expands at high temperature and small molecule of volatilizing cause conductive adhesive layer 2 blistering layering cause electromagnetic shielding film with
It is removed between the stratum of wiring board, and then ensures electromagnetic shielding film ground connection and export interference charge.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvement and replacement can also be made, these change
It also should be regarded as the protection scope of the utility model into replacement.
Claims (9)
1. a kind of electromagnetic shielding film, which is characterized in that including shielded layer and conductive adhesive layer, the conductive adhesive layer is set to the shielding
On layer；The shielded layer is flat surface close to the one side of the conductive adhesive layer, and the shielded layer is equipped with through following table thereon
The through-hole in face.
2. electromagnetic shielding film as described in claim 1, which is characterized in that one side of the shielded layer close to the conductive adhesive layer
It is equipped with the conductive particles of convex.
3. electromagnetic shielding film as claimed in claim 2, which is characterized in that the height of the conductive particles is 0.1 μm -30 μm.
4. electromagnetic shielding film as described in any one of claims 1-3, which is characterized in that the shielded layer with a thickness of 0.1 μm-
45 μm, the conductive adhesive layer with a thickness of 1 μm -80 μm.
5. electromagnetic shielding film as described in any one of claims 1-3, which is characterized in that the shielded layer includes metallic shield
One of layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer are a variety of.
6. electromagnetic shielding film as described in any one of claims 1-3, which is characterized in that the electromagnetic shielding film further includes protection
Film layer, the protective film layer are set in one side of the shielded layer far from the conductive adhesive layer.
7. electromagnetic shielding film as described in any one of claims 1-3, which is characterized in that the area of the through-hole is 0.1 μm2-
1mm2。
8. electromagnetic shielding film as described in any one of claims 1-3, which is characterized in that in the shielded layer every square centimeter
The number of the through-hole is 10-1000.
9. a kind of wiring board, which is characterized in that including wiring board ontology and such as the described in any item electromagnetic screens of claim 1-8
Cover film, the electromagnetic shielding film is mutually pressed by the conductive adhesive layer with the wiring board ontology, the conductive adhesive layer with it is described
The stratum of wiring board ontology is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821076441.XU CN208708070U (en) | 2018-07-06 | 2018-07-06 | Electromagnetic shielding film and wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821076441.XU CN208708070U (en) | 2018-07-06 | 2018-07-06 | Electromagnetic shielding film and wiring board |
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| Publication Number | Publication Date |
|---|---|
| CN208708070U true CN208708070U (en) | 2019-04-05 |
Family
ID=65937847
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821076441.XU Active CN208708070U (en) | 2018-07-06 | 2018-07-06 | Electromagnetic shielding film and wiring board |
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| CN (1) | CN208708070U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110691500A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110996504A (en) * | 2019-12-31 | 2020-04-10 | 深圳市弘海电子材料技术有限公司 | High-frequency electromagnetic shielding film capable of being quickly pressed for FPC (Flexible printed Circuit) and manufacturing method thereof |
| CN111295090A (en) * | 2019-12-27 | 2020-06-16 | 东莞市宸锐电子科技有限公司 | Production process of efficient anti-interference cable shielding tape |
| WO2021047093A1 (en) * | 2019-09-12 | 2021-03-18 | 广州方邦电子股份有限公司 | Circuit board and electronic device |
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2018
- 2018-07-06 CN CN201821076441.XU patent/CN208708070U/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110691500A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110691500B (en) * | 2018-07-06 | 2024-04-26 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| WO2021047093A1 (en) * | 2019-09-12 | 2021-03-18 | 广州方邦电子股份有限公司 | Circuit board and electronic device |
| US12108521B2 (en) | 2019-09-12 | 2024-10-01 | Guangzhou Fangbang Electronics Co., Ltd | Circuit board and electronic device |
| CN111295090A (en) * | 2019-12-27 | 2020-06-16 | 东莞市宸锐电子科技有限公司 | Production process of efficient anti-interference cable shielding tape |
| CN110996504A (en) * | 2019-12-31 | 2020-04-10 | 深圳市弘海电子材料技术有限公司 | High-frequency electromagnetic shielding film capable of being quickly pressed for FPC (Flexible printed Circuit) and manufacturing method thereof |
| CN110996504B (en) * | 2019-12-31 | 2020-10-16 | 深圳市弘海电子材料技术有限公司 | High-frequency electromagnetic shielding film capable of being quickly pressed for FPC (Flexible printed Circuit) and manufacturing method thereof |
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