CN208655692U - A kind of adopting surface mounted LED - Google Patents
A kind of adopting surface mounted LED Download PDFInfo
- Publication number
- CN208655692U CN208655692U CN201821493022.6U CN201821493022U CN208655692U CN 208655692 U CN208655692 U CN 208655692U CN 201821493022 U CN201821493022 U CN 201821493022U CN 208655692 U CN208655692 U CN 208655692U
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- Prior art keywords
- metal framework
- surface mounted
- adopting surface
- bowl
- mounted led
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- 239000002184 metal Substances 0.000 claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 claims abstract description 82
- 239000000084 colloidal system Substances 0.000 claims abstract description 24
- 239000013078 crystal Substances 0.000 claims abstract description 21
- 229920006335 epoxy glue Polymers 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of adopting surface mounted LEDs, the adopting surface mounted LED includes: metal framework, the bowl in metal framework, the crystal bonding area that bowl bottom is arranged in, the LED wafer in crystal bonding area, the colloid for being packaged to LED wafer, wherein, colloid is wrapped in the periphery of metal framework.Above-mentioned technical proposal disclosed in the present application, adopting surface mounted LED includes metal framework, the bowl in metal framework and the LED wafer positioned at bowl bottom, metal framework is wrapped up comprehensively using colloid, to improve the leakproofness of adopting surface mounted LED, enter in bowl so as to be effectively prevented steam and the normal work of LED wafer is impacted, and then the probability that adopting surface mounted LED fails can be reduced, improve the reliability of adopting surface mounted LED.
Description
Technical field
The utility model relates to LED technology fields, more specifically to a kind of adopting surface mounted LED.
Background technique
Adopting surface mounted LED (Light Emitting Diode, light emitting diode) is because having the spies such as small in size, energy-saving and environmental protection
It puts and is used widely.
Referring to Fig. 1, it illustrates the structural schematic diagram of existing adopting surface mounted LED, including frame, bowl, colloid, the bottoms of frame
Portion is the welding surface for being welded with circuit board.LED wafer is placed in bowl, and in the top rubber cover of bowl
LED wafer is encapsulated (arrow represents the junction of colloid and frame in figure) in the frame using colloid by body.But due to glue
The package of body is limited, then in humid and/or high temperature, steam be easy to enter in bowl from the intersection of colloid and frame and
The normal work of LED wafer is impacted, consequently, it is possible to adopting surface mounted LED is made to fail.
It is current art technology to reduce the entrance of steam in conclusion how to improve the leakproofness of adopting surface mounted LED
Personnel's technical problem urgently to be resolved.
Utility model content
In view of this, the purpose of the utility model is to provide a kind of adopting surface mounted LED, to improve the leakproofness of adopting surface mounted LED,
To reduce the entrance of steam, and then the probability that adopting surface mounted LED fails is reduced, improves the reliability of adopting surface mounted LED.
To achieve the goals above, the utility model provides the following technical solutions:
A kind of adopting surface mounted LED, comprising: metal framework, is arranged at the bowl bottom bowl in the metal framework
The crystal bonding area in portion, the LED wafer in the crystal bonding area, the colloid for being packaged to the LED wafer, wherein institute
State the periphery that colloid is wrapped in the metal framework.
Preferably, the bowl wall of the bowl is metal bowl wall.
Preferably, protrusion is provided on the crystal bonding area side and the metal bowl wall that is connected with the crystal bonding area.
Preferably, the pin positioned at the metal framework bottom is the pin bent to the metal framework bottom.
Preferably, the bottom of the metal framework is provided with blind hole hole.
Preferably, the blind hole hole is circular hole.
Preferably, the colloid is epoxy glue.
Preferably, the bottom of the LED wafer is provided with heat sink.
The utility model provides a kind of adopting surface mounted LED, which includes: metal framework, is located in metal framework
Bowl, bowl bottom is set crystal bonding area, the LED wafer in crystal bonding area, the glue for being packaged to LED wafer
Body, wherein colloid is wrapped in the periphery of metal framework.
Above-mentioned technical proposal disclosed in the present application, adopting surface mounted LED include metal framework, the bowl in metal framework,
And the LED wafer positioned at bowl bottom, metal framework is wrapped up comprehensively using colloid, to improve the close of adopting surface mounted LED
Feng Xing enters in bowl and impacts to the normal work of LED wafer so as to be effectively prevented steam, and then can drop
The probability that low adopting surface mounted LED fails improves the reliability of adopting surface mounted LED.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is the structural schematic diagram of existing adopting surface mounted LED；
Fig. 2 is a kind of structural schematic diagram of adopting surface mounted LED provided by the embodiment of the utility model；
Fig. 3 is the structural schematic diagram of metal framework bottom provided by the embodiment of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 2 is referred to, it illustrates a kind of structural schematic diagrams of adopting surface mounted LED provided by the embodiment of the utility model, can
To include: metal framework 1, the bowl 2 in metal framework 1, the crystal bonding area 3 that 2 bottom of bowl is arranged in, be located at crystal bonding area 3
Interior LED wafer, the colloid 4 for being packaged to LED wafer, wherein colloid 4 is wrapped in the periphery of metal framework 1.
Adopting surface mounted LED may include metal framework 1, in metal framework 1 and with bowl-shape cavity bowl 2, setting
2 bottom of bowl and for carry the crystal bonding area 3 of LED wafer, the LED wafer (not showed that in figure) in crystal bonding area 3, with
And the colloid 4 for being packaged to LED wafer.
Metal framework 1 can not only play the role of support to LED wafer, but also have good electric conductivity, thus
Electric current can be transmitted, preferably to be powered for internal LED wafer.
Bowl 2 can be set the central part in metal framework 1, i.e., so that the crystal bonding area 3 that 2 bottom of bowl is arranged in can be with
Positioned at the central part of metal framework 1, correspondingly, then LED wafer is allowed to be located at the central part of metal framework 1, and
The diameter of bowl 2 can be successively increased from the inside of metal framework 1 to the surface of metal framework 1, to increase shining for LED wafer
Angle, consequently facilitating obtaining the luminous product that light is relatively uniform, light-out effect is relatively good using adopting surface mounted LED.In addition, may be used also
It is adjusted with the depth to bowl 2 set in metal framework 1, is adjusted with the depth degree being put into LED wafer
It is whole, so as to adjust the light emission luminance and light emitting angle of LED wafer.
It should be noted that bowl 2 can also be arranged in the non-central part of metal framework 1 according to actual needs.
After being fixed on LED wafer in crystal bonding area 3 and completing bonding wire, then metal framework 1 is carried out entirely using colloid 4
Colloid 4 is wrapped in the periphery of entire metal framework 1, LED wafer is encapsulated in metal framework 1 by bread glue.This envelope
The binding force of colloid 4 Yu metal framework 1 can be improved in dress mode, the leakproofness of metal framework 1 is improved, so as to effectively subtract
The entrance of steam under few moist and/or hot environment.In addition, colloid 4 be formed by semicircular structure above metal framework 1 can
So that the light that LED wafer is issued has certain angle, it can the launch angle of increasing light, thus increasing light
Irradiated area.
Above-mentioned technical proposal disclosed in the present application, adopting surface mounted LED include metal framework, the bowl in metal framework,
And the LED wafer positioned at bowl bottom, metal framework is wrapped up comprehensively using colloid, to improve the close of adopting surface mounted LED
Feng Xing enters in bowl and impacts to the normal work of LED wafer so as to be effectively prevented steam, and then can drop
The probability that low adopting surface mounted LED fails improves the reliability of adopting surface mounted LED.
A kind of adopting surface mounted LED provided by the embodiment of the utility model, the bowl wall of bowl 2 can be metal bowl wall.
The bowl wall of bowl 2 in metal framework 1 can be metal bowl wall.Relative to existing plastic cement material bowl wall and
Speech, metal bowl wall then has stronger reflectivity to light, so that spotlight effect is more preferably.
When the light that LED wafer is issued is irradiated in metal bowl wall, then the reflection of light can occur, to improve optically focused
Property, and more light is allow to be irradiated to outside, to improve the utilization rate of light, to improve the luminous effect of adopting surface mounted LED
Fruit.
It should be noted that the metal material of mentioned metal bowl wall can be with the metal material of metal framework 1 here
It is identical, at this point, corresponding metal framework 1 and bowl 2 can be an integral structure, i.e., it is directly logical when preparing metal framework 1
It crosses the modes such as punching press and bowl 2 is set.It is of course also possible to select the metal material conduct different from the metal material of metal framework 1
The bowl wall of bowl 2.
A kind of adopting surface mounted LED provided by the embodiment of the utility model is connected positioned at 3 side of crystal bonding area and with crystal bonding area 3
Protrusion is provided in metal bowl wall.
Upward protrusion is set in the metal bowl wall that can be connected on the side of crystal bonding area 3 and with crystal bonding area 3, the protrusion
For a part of metal bowl wall.
When the light that LED wafer is emitted exposes in protrusion, which can play the role of reflection to light, with
The probability that increasing light is reflected, to improve the utilization rate of light.
A kind of adopting surface mounted LED provided by the embodiment of the utility model, the pin 5 positioned at 1 bottom of metal framework are to metal
The pin of 1 bottom of frame bending.
Pin 5 positioned at 1 bottom of metal framework can be the pin bent to the bottom of metal framework 1, that is, be located at
The pin 5 of 1 bottom of metal framework is not the pin to be bonded 1 bottom surface of metal framework, but has one with the bottom surface of metal framework 1
Determine the pin of angle.Carrying out welding using the pin and circuit board that are bent to the bottom of metal framework 1 can be improved welding
Property.
Fig. 3 is referred to, it illustrates the structural schematic diagram of metal framework bottom provided by the embodiment of the utility model, this realities
A kind of adopting surface mounted LED provided with new embodiment, the bottom of metal framework 1 is provided with blind hole hole 6.
Blind hole hole 6 can be set in the bottom of metal framework 1, for available frame bottom is flat welding surface,
Blind hole hole 6 set by 1 bottom of metal framework can increase the bonding area of metal framework 1.
When being welded using soldering tin material to metal framework 1, soldering tin material can enter in blind hole hole 6, to mention
High bonding area increases the fastness of welding force and welding.
It should be noted that blind hole hole 6 can be set in the central location of 1 bottom of metal framework, also can be set in gold
Belong to the other positions of 1 bottom of frame.
A kind of adopting surface mounted LED provided by the embodiment of the utility model, blind hole hole 6 can be circular hole.
The blind hole hole 6 that 1 bottom of metal framework is arranged in can be circular hole, i.e., the cross section in blind hole hole 6 can be circle.
The inlet of soldering tin material can be increased by setting circular hole for blind hole hole 6, to increase welding force, and increase welding
Fastness.It is of course also possible to set elliptical aperture, square hole etc. for blind hole hole 6.
A kind of adopting surface mounted LED provided by the embodiment of the utility model, colloid 4 can be epoxy glue.
Colloid 4 for being wrapped up metal framework 1 comprehensively is specifically as follows epoxy glue (also referred to as epoxy resin, epoxy
Resin glue), solidification is convenient, adhesion strength is strong, chemical stability is good, good stability of the dimension.
The entrance of steam then can be effectively prevented using the periphery that epoxy glue is wrapped in metal framework 1, and can be mentioned
The service life of high adopting surface mounted LED, so as to reduce the use cost of adopting surface mounted LED.
A kind of adopting surface mounted LED provided by the embodiment of the utility model, the bottom of LED wafer are provided with heat sink.
In view of LED wafer can generate certain heat while luminous, in order to by heat caused by LED wafer and
When distribute, then can be at the bottom of LED wafer to reduce adverse effect brought by normal work of the heat to LED wafer
Portion is arranged heat sink.
Wherein, heat sink can by the copper with high thermal conductivity at.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the element that the process, method, article or equipment including a series of elements is intrinsic.?
Do not have in the case where more limiting, the element limited by sentence "including a ...", it is not excluded that including the element
There is also other identical elements in process, method, article or equipment.In addition, provided by the embodiment of the utility model above-mentioned
In technical solution with correspond to the consistent part of technical solution realization principle and unspecified in the prior art, in order to avoid excessive superfluous
It states.
The foregoing description of the disclosed embodiments makes those skilled in the art can be realized or use the utility model.
Various modifications to these embodiments will be apparent for a person skilled in the art, general original as defined herein
Reason can be realized in other embodiments without departing from the spirit or scope of the present utility model.Therefore, this is practical new
Type is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase
Consistent widest scope.
Claims (8)
1. a kind of adopting surface mounted LED characterized by comprising metal framework, the bowl in the metal framework, setting exist
The crystal bonding area of the bowl bottom, the LED wafer in the crystal bonding area, the glue for being packaged to the LED wafer
Body, wherein the colloid is wrapped in the periphery of the metal framework.
2. adopting surface mounted LED according to claim 1, which is characterized in that the bowl wall of the bowl is metal bowl wall.
3. adopting surface mounted LED according to claim 2, which is characterized in that be located at the crystal bonding area side and with the die bond
Protrusion is provided in the connected metal bowl wall in area.
4. adopting surface mounted LED according to claim 1, which is characterized in that positioned at the metal framework bottom pin be to
The pin of the metal framework bottom bending.
5. adopting surface mounted LED according to claim 4, which is characterized in that the bottom of the metal framework is provided with blind hole hole.
6. adopting surface mounted LED according to claim 5, which is characterized in that the blind hole hole is circular hole.
7. adopting surface mounted LED according to claim 1, which is characterized in that the colloid is epoxy glue.
8. adopting surface mounted LED according to any one of claims 1 to 7, which is characterized in that the bottom of the LED wafer is arranged
There is heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821493022.6U CN208655692U (en) | 2018-09-12 | 2018-09-12 | A kind of adopting surface mounted LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821493022.6U CN208655692U (en) | 2018-09-12 | 2018-09-12 | A kind of adopting surface mounted LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208655692U true CN208655692U (en) | 2019-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821493022.6U Active CN208655692U (en) | 2018-09-12 | 2018-09-12 | A kind of adopting surface mounted LED |
Country Status (1)
| Country | Link |
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| CN (1) | CN208655692U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
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2018
- 2018-09-12 CN CN201821493022.6U patent/CN208655692U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119517A (en) * | 2018-09-12 | 2019-01-01 | 宁波升谱光电股份有限公司 | A kind of adopting surface mounted LED and preparation method thereof |
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