CN208016152U - Electronic device filled with heat conduction capsulation material - Google Patents
Electronic device filled with heat conduction capsulation material Download PDFInfo
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- CN208016152U CN208016152U CN201820269465.0U CN201820269465U CN208016152U CN 208016152 U CN208016152 U CN 208016152U CN 201820269465 U CN201820269465 U CN 201820269465U CN 208016152 U CN208016152 U CN 208016152U
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Abstract
The utility model is mainly concerned with the electronic device filled with heat conduction capsulation material.There is the shell of printed circuit board including inner containment, wherein being equipped with first kind electronic device and the second electron-like device on a printed circuit.Definition is useful for carrying one or more designated mounting regions of the first kind electronic component, and the perimeter in designated mounting region on a printed circuit is equipped with the second electron-like device.Designated mounting area peripheral edge is provided with isolation board, heat conduction capsulation material of the enclosure filled with cladding first kind electronic component also at the designated mounting region, designated mounting region is isolated plate and separates relative to other perimeters on printed circuit board, when the heat that calorific value of the calorific value of first kind electronic device than the second electron-like device causes greatly first kind electronic device to generate is radiated the second electron-like device, isolation board is radiated the second electron-like device come the heat for preventing first kind electronic device from generating via heat conduction capsulation material.
Description
Technical field
The utility model is mainly concerned with the electronic device design field with printed circuit board and exactly uses
The scheme of capsulation material is filled in the enclosure of electronic device, heat conduction is carried out to electronic component by capsulation material, is avoided pair
The more sensitive device of temperature is influenced to may insure the safe and reliable of entire electronic device by the big device of other calorific values.
Background technology
It is also known as printed circuit board in electronic circuit field printed circuit board, is the supplier of electronic component electrical connection.
The history of existing upper a century of development of circuit board, using printed circuit board, major advantage is to greatly reduce wiring and dress
The mistake matched greatly improves the gentle productive labor rate of Automated water of circuit design, its design is mainly layout design.It presses
It can be divided into single sided board, dual platen, four laminates, six laminates and other multilayer circuit boards according to the wiring board number of plies.Board substrate is general
All over being to be allocated as classifying with the insulation division of substrate, common raw material has bakelite plate and glass mat and various plastic plate etc., in reality
The manufacturer of printed circuit board generally can be with a kind of insulation division formed with glass fibre, fabric material and resin in the application of border
Divide and adhesive film use is pressed into epoxy resin and copper foil again.
It is in progress with the high speed of electronic technology, printed circuit board is widely used in electronic field, and essentially all electronics is set
Corresponding printed circuit board can not be all left in standby.In field of power electronics, many electric devices are all first to be about to electronics member device
On part patch to printed circuit board, the encapsulating to enclosure filling insulation, this insulation are needed in final assembling steps
Glue material is widely used in the bonding of electronic component, sealing, embedding dress and coating protection etc., it is uncured before it belong to it is liquid simultaneously
With mobility, glue viscosity is according to the material of product, performance, the difference of production technology and different from.After being fully cured
The use value that can realize it, can be played after solidification waterproof and dampproof, dust-proof, insulation, heat conduction, secrecy, anticorrosion and heatproof with
And shockproof effect.Colloidal materials are divided from material type, using at most most common main including epoxy resin
Encapsulating, organic siliconresin encapsulating, polyurethane encapsulating, they are very necessary for protection electronic device, it is contemplated that insulation glue material
Then its drawback is the thermal conductance of material：The different device of temperature sensitive degree is easy to interfere with each other.
There are prodigious doubt namely heat dissipation problems in practice for electronic device.Heat dissipation problem is always electronics dress
It sets the bottleneck in application and is not solved preferably, it is difficult to reach heat dissipation standard and device requirement, especially electronics and fill
It sets internal containing the high power electronic component for easy ting produce high heat.Very with typical desktop computer or notebook computer
To the mobile terminals such as mobile phone, working stage of the electronic components such as central processing unit and semiconductor power switch in energization
The generation amount of heat that can continue, and in same printed circuit board other than these components, it is also very quick to temperature
For example certain Hall elements, the electronic component for being sensitive to temperature are easy by other hairs the other kinds of electronic component of sense
The negative effect of the big electronic component of heat and generate temperature drift, lead to not accurately work, be still to be directed to after all
Heat dissipation problem does not provide good solution.The high power electronic device product used on the market now, it is most of all to wrap
Include it is packaged by fritter aluminum substrate and single high-power die and/or aluminum substrate and multiple high-power dies is packaged, by certain
A little electronic components are separately mounted on different radiator structures, finally again to the encapsulating of enclosure filling insulation.
Utility model content
In the optional but nonessential embodiment of the application, mainly disclose a kind of filled with heat conduction plastic packaging material
The electronic device of material, it is characterised in that including：
Inner containment has the shell of printed circuit board and is equipped with electronic component on a printed circuit；
One or more installation regions for carrying electronic component are defined on a printed circuit；
It is set to the isolation board for being spaced apart the different installation regions mutually adjoined of enclosure；
Heat conduction plastic packaging material filled with the electronic component for enveloping its carrying at least at a specified installation region
Material.
The above-mentioned electronic device filled with heat conduction capsulation material, wherein：Different installation region institutes on printed circuit board
The calorific value of the electronic component of installation is different.
The above-mentioned electronic device filled with heat conduction capsulation material, wherein：The electricity that the specified installation region is installed
The calorific value of sub- component is higher than the calorific value for the electronic component that other remaining installation regions are installed.
The above-mentioned electronic device filled with heat conduction capsulation material, wherein：Inside the housing at least also described specified
Heat conduction capsulation material is filled at other installation regions on installation region periphery.
The above-mentioned electronic device filled with heat conduction capsulation material, wherein：Inside the housing only in the specified peace
It fills at region filled with heat conduction capsulation material and at other remaining installation regions other than the specified installation region
Without filling any heat conduction capsulation material.
The above-mentioned electronic device filled with heat conduction capsulation material, wherein：It is arranged in the specified installation region periphery
Isolation board be used for preventing the heat that the electronic component that the specified installation region installed generates via heat conduction plastic packaging material
Expect to ambient radiation.
The above-mentioned electronic device filled with heat conduction capsulation material, wherein：The electricity that the specified installation region is installed
Sub- component includes power switch or power inductance.
In the optional but nonessential embodiment of the application, while also disclosing another filled with heat conduction plastic packaging
The electronic device of material, it is characterised in that including：
Inner containment has the shell of printed circuit board, wherein being equipped with first kind electronic device and on a printed circuit
Two electron-like devices；
Definition is useful for carrying one or more designated mounting regions of the first kind electronic component on printed circuit board,
And the perimeter in the designated mounting region on a printed circuit is equipped with the second electron-like device；
The designated mounting area peripheral edge is provided with isolation board and enclosure also to fill out at the designated mounting region
Heat conduction capsulation material filled with the first kind electronic component for enveloping its carrying；
The designated mounting region is isolated plate and separates relative to other perimeters on printed circuit board,
Calorific value of the calorific value of a kind of electronic device than the second electron-like device leads to greatly the heat spoke that first kind electronic device generates
When being mapped to the second electron-like device, prevent the heat that first kind electronic device generates via heat conduction capsulation material by isolation board
It is radiated the second electron-like device.
The above-mentioned electronic device filled with heat conduction capsulation material, wherein：Inside the housing at least also in the specified peace
It fills and is filled with heat conduction capsulation material at other perimeters of area peripheral edge.
The above-mentioned electronic device filled with heat conduction capsulation material, wherein：Inside the housing only in the designated mounting
Do not have at other remaining perimeters other than the designated mounting region filled with heat conduction capsulation material at region
There is any heat conduction capsulation material of filling.
Description of the drawings
To keep above-mentioned purpose and feature and advantage more obvious and easy to understand, specific implementation mode is done below in conjunction with the accompanying drawings
Detailed explaination, read it is described further below and with reference to attached drawing after, the feature and advantage of the utility model will be evident.
Fig. 1 is the printed circuit board that electronic device is commonly provided with and division in this application has different installation regions.
Fig. 2 is the schematic diagram for the different zones that electronic component is mounted on printed circuit board using surface mount technology etc..
Fig. 3 is that the enclosure filling heat conduction capsulation material with hollow cavity that electronic device is equipped with that is to say encapsulating.
Fig. 4 is disposed on the isolation board that can be used for the different installation regions mutually adjoined being spaced apart of enclosure.
Fig. 5 is with the electronic component of the electronic component alternative semiconductors power switch classification of power inductor classification.
Fig. 6 be at certain specified installation region filled with capsulation material and other installation regions are then without capsulation material.
Fig. 7 is that heat conduction capsulation material is filled at other installation regions on certain specified installation region and its periphery.
Specific implementation mode
Below in conjunction with each embodiment, the technical solution disclosed the utility model is clearly completely illustrated, but institute
The embodiment of description is only the utility model embodiment not all with the embodiment being described herein used in explanation, based on such
On the basis of embodiment, any scheme that those skilled in the art is obtained without making creative work is all
Belong to the scope of protection of the utility model.
Field of power electronics, many electric devices are first about on electronic component patch to printed circuit board, most
The encapsulating to enclosure filling insulation is needed in whole assembling steps.For example：Solar junction box is between solar panel
Connector between solar cell array and solar charging controller for electric consumption that part is constituted, has provided solar cell to the user
The combination connection scheme of plate.Solar junction box is extremely important in the composition of solar components, and main function is by solar energy
The electric power that battery generates is connect with outside line.Terminal box is sticked together by the backboard of silica gel and photovoltaic module, in component
Bus-bar is linked together by the internal wiring in terminal box, and internal wiring links together with External cable, make component with
External cable is connected.It is provided with diode in terminal box, ensures that component can be worked normally when being in the light.Solar junction box exists
A large amount of heat is generated when work, will have a direct impact on the performance of terminal box.At present using the close of capsulation material (encapsulating) mode
The terminal box of envelope is in industry widely used.Silica gel is poured into terminal box, and there is insulation well after silica gel solidification
Property and resistance to ag(e)ing, especially heat conductivility it is splendid, be conducive to the heat dissipation of diode, effectively improve terminal box power and avoid
Terminal box temperature is excessively high.Other electronic devices can also use encapsulating other than terminal box.
The heat conduction capsulation material namely electronics encapsulating used about electronic device：It is heat conduction encapsulating, epoxy resin encapsulating, organic
The encapsulating of silicon material, polyurethane encapsulating, etc..Heat conduction capsulation material/heat conduction encapsulating：Heat conduction encapsulating (HCY) is that low viscosity is fire-retardant
Property bi-component addition type organosilicon heat conduction encapsulating, can also be heating and curing with room temperature curing, have temperature more high solidification it is faster
The characteristics of, it is that made of addition heat conduction object, not will produce in curing reaction on the basis of commonly filling silica gel or bonding silica gel
Any by-product can be applied to surface and the filling of the materials such as PC (Poly-carbonate), PP, ABS, PVC and metal class
To the inside of electronic device.Heat conduction capsulation material can suitable for electronic components heat conduction, insulation, waterproof and fire-retardant and its anti-flammability
To reach UL94-V0 grades, main application fields are each electron-like member devices such as power electronics, semiconductor devices and finished product electric appliance component
The embedding of part is also useful for the sealing occasion of similar temperature sensor etc..
Referring to Fig. 1, pacify on the subregion AREA-1/2 of basic printed circuit board (Print Circuit Board)
Equipped with electronic component, various common electronic components, such as have resistance, potentiometer, electron tube, radiator, electromechanical compo
With connector, semi-conductor discrete device, electro-acoustic element, laser device, electron display device, photoelectric device, sensor and power supply
Device, switch, micro machine, electronic transformer, relay, printed circuit board, integrated circuit, types of functionality circuit module, pressure
Electricity, crystal, quartz, ceramic magnet material, base material substrate used for printed circuit, electric function technique proprietary material and electric adhesive tape
Product etc..In addition to the external AREA-1 of region AREA-1 yet includes nearby the region of AREA-2 on printed circuit board, that
Temporarily with the much bigger embodiment party of the calorific value of the device of the calorific value ratio AREA-2 installations for the device installed at AREA-1
Formula is as example, since the device heating amount of AREA-1 is big, it is known that the region AREA-1 of circuit board, which embodies to be easier, to be interfered
The electronic component of AREA-2.If the device installed at the regions AREA-1 is central processing unit or the work(with metal fin
Rate switching tube, if the regions AREA-2 installation major part be resistance capacitance even to the logic chip of temperature extreme sensitivity,
Storage chip, band gap reference etc., usually the electronic component using silicon chip as base material is more sensitive to deformation, such as hall sensing
Device, then the heat radiation for having no doubt AREA-1 region devices can influence the electronic component of the regions AREA-2 installation, cause
The device failure in the regions AREA-2.
Referring to Fig. 1, speak of printed circuit board (Printed Circuit Board) then we have to illustrate industry again
So-called wiring layer (Routing/wiring layer), the printed circuit board of multi-layer board (Multi-Layer Boards) pattern
Based on the wiring plate for increasing the area that can be connected up and having used more single or double faces, for example：With monolithic dual platen make internal layer or
Two pieces of single sided boards of person make outer layer and the printed wiring board that combines, or make internal layer using two pieces of dual platens, two pieces of single sided boards make it is outer
The printed wiring board of layer, industry are based on such technology so that these dual platens or single sided board are fixed by the fining between plank
Position and adhesive material alternatively laminated are together and the printed wiring board that is interconnected by design requirement of internal conductive pattern
Just multilayer printed circuit board is often referred to as four layers, six-layer printed circuit board namely industry.
Referring to Fig. 2, in electronic circuit field with MLCC (Multi-layer Ceramic Capacitors) capacitance structure
For identify the second electron-like component 112.Although its interior shape is very different with many capacitances, but still can learn
Its basic structure, without what essential distinction, is all multilayered structure with conventional aluminum capacitor.The basic circuit of capacitor accords with
Number its structure is just had been described above, the manufacture craft of multilayer ceramic capacitor, what is paid much attention to is three pieces of contents：First is that ceramics are matched
The purity and granulation uniformity of square powder and the extraction process of ceramic powder, ceramic powder particles are uniform in size cannot sintering phenomenon
Otherwise the reliability and specific performance parameter of capacitance are influenced whether.Second is dielectric layer thinning, this understands that it is to get up very much
Simply, under same thickness, if dielectric layer is thinner it means that more layers can be laminated, to promote capacitance totality
Capacity.Third is the cofiring technology of ceramic powder and metal electrode, briefly seeks to ceramic powder to be close to, uniformly fires in electrode
Surface, even and if expand with heat and contract with cold deformation in the case of can not generate layering, cracking phenomena such as.
Referring to Fig. 2, if power switch 111, by taking mos field effect transistor as an example, field-effect is brilliant
Many pins of body pipe need it is mating be inserted into many vias, gate lead and source lead and drain lead be field effect
Answer transistor typical pin or be pin.It is compared again with the capacitance of Fig. 2, the pad of circuit board is primarily used to welding electronics
The pin or pin of element, the pin of multilayer ceramic capacitor be just patch type just can good pad directly pass through scolding tin
Class is docked or welding, and the pin of power switch 111 is direct insertion in Fig. 2, and via is substantially similar with the function of pad, only
But it is that via is through a hole of plank, being provided with metal part around hole has been equivalent to more than simple pad one
Circle helps welding structure, and via can just allow pin or pin insertion is entered and the device being inserted into can also be by pin or pin
Bending, such as just the bending from pin makes the plastic shell of power switch closer to printed circuit to the power switch 111 of Fig. 2
The loose mail piece of plate, especially power switch directly keeps appropriately distance close to the front of printed circuit board but with circuit board, no
It is in direct contact.For example the pin of multilayer ceramic capacitor or pin are exactly patch type when soldered elements are patches,
Pad be just a pocket of top layer or bottom expose and as the pin of welding portion and multilayer ceramic capacitor
It is welded, the ceramic condenser in Fig. 2 is exactly patch type.Therefore it is laid out the pad or via in face on a printed circuit, it is right
It should be respectively used to the pin of docking patch type or direct insertion pin.
Referring to Fig. 2, test quantity reaches thousands of a ceramic disc capacitors, the capacitance of same nominal capacity in the experiment of the application
Measure that the reading difference come is bigger, and actual measurement capacity would generally float up and down ± 50% than nominal capacity.Same nominal tile
Capacitance wherein capacity it is big can reach 1500pF or more, capacity it is small then have a 900pF, it is irregular.For example in actual measurement ceramics
Power switch 111 is in the stage that is powered on when capacitance and high frequency switches between turn-on and turn-off, finds capacitance meter
Reading since pF more than 900 once toward decline, 500pF can be dropped to；Power switch 111 be in power-off non-operational phase and
No longer high frequency on and off, then capacitance temperature be gradually reduced, capacity again up lifting return to pF more than 900.Similar to multi-layer ceramics electricity
This kind of device for being sensitive to temperature of container is easy the temperature radiation shadow by other electronic components on same circuit board
It may cause component failure since device heating amount is inconsistent between sound namely different zones.
Referring to Fig. 2, in addition to this forceful electric power region on the field of certain strong and weak electricities mixing, printed circuit board is due to more
Often quantity of heat production is more for more use high pressure and high power devices, will produce more heat radiation and influences light current region
Electronic component, light current region then more uses the surface-mounted device of control device etc.Problem is：There are the first kind
Electronic component namely generate the source of heat but be not easy the influence of received heat in itself, and there are the second electron-like component namely
The victim radiated by heat on circuit board.In an alternate embodiment of the invention by way of isolation, the device being affected by temperature is allowed
Part region AREA-2 is isolated, and the heat of calorie source head region AREA-1 is limited in own range, it is expected that the mesh reached
Be the device that allows inside the regions AREA-2 by temperature influenced to ignore substantially.
Referring to Fig. 3, electronic device can first be about to electronic component for example semiconductor power switch 111 above-mentioned and aforementioned
112 patch of ceramic condenser/installation/be arranged to above printed circuit board 100, based on heat conduction demand above, in final group
Need to fill the encapsulating of insulation to the inside of shell 200 in dress step, heat conduction capsulation material can the insulation glue material of heat conduction be used for
Plastic-packaged electronic component is widely used in bonding, sealing, embedding dress and coating protection of electronic component etc..For example pass through spray
80 glue spraying of mouth, it is uncured before it belong to liquid and the hollow cavity of shell 200 can be poured into mobility and easily
It is interior, encapsulating in shell can also be directed out without using nozzle 80, glue viscosity is according to the material of product, performance and production technology
Different and slightly different from.Heat conduction capsulation material could realize its use value after being fully cured, and can be played after solidification anti-
Water is moisture-proof, dust-proof, insulation, heat conduction, secrecy, anticorrosion and heatproof and shockproof effect, to carry various electronic components
Printed circuit board 100 enveloped by heat conduction capsulation material, printed circuit board can be that regional area is enveloped by capsulation material
Can also be that whole region is enveloped by capsulation material.Heat conduction capsulation material/colloidal materials/insulation glue material is drawn from material
Point, most commonly used main encapsulating, organic siliconresin encapsulating, the polyurethane encapsulating for including epoxy resin, heat conduction capsulation material
It is very necessary for the electronic component inside protection electronic device.The major drawbacks of thermal conductance of glue material of insulating are：To temperature
The different device of degree susceptibility is easy to interfere with each other, and the heat that for example power switch 111 generates is by coating the power switch
Heat conduction capsulation material firmly is transmitted to ceramic condenser 112, preceding by slight or severe heating between being equivalent to ceramic condenser unintentionally
The actual measurement capacity of literary by the agency of ceramic disc capacitor is easy by temperature interference.In addition the printed circuit board 100 can also use buckle
Or the fasteners such as screw hold/are fixed to inside shell 200.
Referring to Fig. 4, defines and refer to for some for installing the regional area AREA-1 of electronic component on printed circuit board 100
Fixed device mounting area Components Mounting Region, the program are at least disposed on printed circuit board 100
Isolation board 300, the part that isolation board 300 may belong to printed circuit board can also be independent structure, or even can also be
A component part inside shell 200, it should have preferable heat insulation.Heat-barrier material is broadly divided into porous material and heat is anti-
Three big classifications of material and vacuum material are penetrated, the material of hot-fluid transmission, also known as heat insulator can be functionally blocked.Wherein
Porous material is heat-insulated using the contained hole of material itself, because the thermal coefficient of the air or inert gas in gap is very low,
Such as foamed material, fibrous material.Heat-reflecting material has very high reflectance factor, can reflect away heat and avoid hot biography
It passs, such as gold, silver, nickel, aluminium foil or the polyester, the Kapton that plate metal.Vacuum heat insulation materials are the inside using material
It is next heat-insulated that the vacuum section of offer reaches barrier convection current.Common foamed plastics, super glass wool and high silica wool, vacuum heat-insulation
Plate, glass fibre, asbestos, rock wool, silicate material etc. and the materials such as aerogel blanket, evacuated panel come it is heat-insulated, the application every
The above material is preferably used from plate 300.
Referring to Fig. 4, in an optional embodiment of the application, the electronic device filled with heat conduction capsulation material has
There is feature below：It is fire proofing to have the shell 200 of printed circuit board 100 and shell major part occasion including inner containment
The plastic shell of preparation, is sayed as discussed above, all kinds of electronic components is equipped on printed circuit board 100 and above with half
For conductor power switch 111 and ceramic condenser 112, power switch 111 here typically has MOS field
Effect transistor and igbt and thyristor etc., and the substitute of ceramic condenser 112 has various common electricity
Sub- component is such as resistance, potentiometer, electron tube.Before one or more is defined on printed circuit board 100 for carrying
The installation region for stating electronic component for example power switch 111 and capacitance 112, with some specified installation region AREA-1 and it
For neighbouring other installation regions AREA-2：Installation region AREA-1 is used to carry the big power switch 111 of calorific value, as
Comparison, installation region AREA-2 are small or even do not generate the ceramic condenser 112 of any heat for carrying calorific value.Setting is also provided
The isolation board 300 for being spaced apart the different installation regions mutually adjoined inside shell 200, it is found that isolation board 300
Neighbouring installation region AREA-1/2 is spaced apart.In an electronic at least in the specified installation region installation regions Chu Ji
Heat conduction capsulation material filled with the electronic component for example power switch 111 for enveloping its carrying at AREA-1, Fig. 4 are not drawn
Heat conduction capsulation material, reference can be made to the schematic top plan view of Fig. 6：It is filled out at the installation region AREA-1 positioned at PCB inside shell 200
Heat conduction capsulation material 400 filled with the electronic component for example power switch 111 for enveloping its carrying, but in shell 200
Without filling any heat conduction capsulation material at the installation region AREA-2 positioned at PCB in portion, so installation region AREA-2 is carried
Electronic component for example ceramic condenser 112 not by heat conduction capsulation material plastic packaging live but it is exposed.
Referring to Fig. 4, in an optional embodiment of the application, the different installation region institutes on printed circuit board 100
The calorific value of the electronic component of installation is different：For example installation region AREA-1 is used to carry the big certain electronics member devices of calorific value
Part for example power switch 111, as a comparison, installation region AREA-2 are small or even do not generate any heat for carrying calorific value
Certain electronic components for example ceramic condenser 112.In an optional embodiment of the application, specified installation region is for example
The calorific value of the electronic component that AREA-1 is installed for example power switch 111 is higher than other remaining installation regions for example AREA-2
The calorific value of the electronic component installed for example ceramic condenser 112.In an optional embodiment of the application, in shell
It is not filled at AREA-2 for example in other installation regions on specified installation region for example peripheries AREA-1 also at least inside 200
Any heat conduction capsulation material, it is shown in Figure 6.In other alternative embodiments of Fig. 7 of the application, inside shell 200 extremely
It is few also specified installation region for example the peripheries AREA-1 other installation regions for example the places AREA-2 filled with heat conduction plastic packaging material
Material 400, namely the electricity for enveloping its carrying is filled at certain installation region AREA-1 of PCB inside shell 200
Sub- component for example those of power switch 111 heat conduction capsulation material 400, and also inside shell 200 positioned at PCB certain
A little places installation region AREA-2 are filled with enveloping electronic component that it is carried for example those of ceramic condenser 112 heat conduction plastic packaging
Material 400, so for example 111-112 is firmly rather than naked by heat conduction capsulation material plastic packaging for the electronic component of installation region carrying
Dew.In an optional embodiment of the application, only in specified installation region AREA- inside shell 200 in Fig. 6
Filled with heat conduction capsulation material and in remainder other installation regions AREA-2 other than specified installation region AREA-1 at 1
Place is without filling any heat conduction capsulation material.In the alternative embodiment of the application, specified peace is arranged in Fig. 6-7
The isolation board 300 on dress region namely the region peripheries AREA-1 is used for preventing the electronics member device that specified installation region AREA-1 is installed
The part heat that for example power switch 111 generates is via heat conduction capsulation material 400 to ambient radiation.Isolation board 300 is by power in Fig. 6
The heat that switch 111 generates is limited in the heat conduction capsulation material 400 being coated at the AREA-1 of region, although heat conduction capsulation material
It can be to external heat conduction, since the presence of isolation board 300 is without to region AREA-2 heat conduction.One in the application is optional
In embodiment, the heat that power switch 111 generates also is limited to and is coated on leading at the AREA-1 of region by isolation board 300 in Fig. 7
In thermoplastic closure material 400, although heat conduction capsulation material can be to external heat conduction, due to the presence of isolation board 300, installation region
Heat conduction capsulation material 400 at AREA-1 will not conduct heat to the heat conduction capsulation material 400 at the AREA-2 of region, this namely every
The advantage brought from plate 300.
Referring to Fig. 5, in the optional embodiment of the application, power switch 111 above is substituted by power inductance 121
And ceramic condenser 112 can be by replacements such as Hall sensor, resistance, potentiometer, electron tubes, power inductance is in switch power supply type
Electronic device in using very extensive.In the optional embodiment of the application, the electronics filled with heat conduction capsulation material fills
It sets and has following characteristics：The shell 200 for having printed circuit board 100 including inner containment, wherein being equipped on a printed circuit
First kind electronic device for example power inductance 121 or aforementioned power device etc. and is equipped with the second electron-like device for example Hall
Sensor or foregoing ceramic capacitance etc., on printed circuit board 100 definition be useful for carrying one of the first kind electronic component
Or multiple designated mounting regions for example AREA-1, the perimeter in the designated mounting region on printed circuit board 100 is for example
AREA-2 is equipped with the second electron-like device, and in designated mounting region, for example the peripheries AREA-1 are provided with isolation board 300, and outer
Filled with the first kind electronic component example for enveloping its carrying also at the designated mounting region for example AREA-1 inside shell 200
Such as the heat conduction capsulation material 400 of power inductance 121, Fig. 6-7 is seen.Because the designated mounting region for example AREA-1 relative to printing
Other perimeters on circuit board 100 for example AREA-2 and be isolated plate 300 and separate, so when electronic device is powered on
Stage, the unsuspecting first kind electronic device of milli for example power inductance 121 calorific value for example suddenly than the second electron-like device
The calorific value of your element is big, and the heat that first kind electronic device generates can be caused to be radiated the second electron-like device, at this time by
Isolation board 300 is radiated the second electron-like device come the heat for preventing first kind electronic device from generating via heat conduction capsulation material 400
Part.The heat of first kind electronic device generation is equivalent to by the designated mounting region heat conduction plastic packaging material that for example AREA-1 is filled
Material 400 radiates, the heat that first kind electronic device generates will not conduct radiation to the second electron-like device, will not radiate
It is transmitted to the heat conduction capsulation material 400 that other perimeters where the second electron-like device are for example filled at AREA-2.Ginseng
Fig. 7 is seen, in the optional embodiment of the application, at least also designated mounting region for example AREA-1 weeks inside shell 200
Heat conduction capsulation material 400 is for example filled at other perimeters on side at AREA-2, it is therefore an objective to utilize heat conduction capsulation material
First and second electron-likes component above-mentioned is given plastic packaging by 400 respectively, and each dependence envelopes the plastic packaging of itself
Material transmits heat to shell external radiation respectively namely first kind electronic component relies on designated mounting region for example AREA-1
The heat conduction capsulation material 400 of place's filling distributes heat, the second electron-like component is for example filled out at AREA-2 by perimeter
The heat conduction capsulation material 400 filled distributes heat.Referring to Fig. 6, in the optional embodiment of the application, inside shell 200 only
Filled with heat conduction capsulation material 400 and more than other than designated mounting region only at designated mounting region for example AREA-1
At other lower perimeters for example the places AREA-2 without filling any heat conduction capsulation material namely the dependence of first kind electronic component
It is naturally scattered that the heat conduction capsulation material 400 that designated mounting region is for example filled at AREA-1 distributes heat, the second electron-like component
Calorific value and portion rely on any Heat Conduction Material because second electron-like component itself do not generate heat in the working stage powered on or
Calorific value is extremely small and can ignore.
In conclusion the application may be used in the electronic equipment of Switching Power Supply etc and solve heat dissipation problem, provide
The method of the approach and cost complex optimum of heat dissipation problem.In Switching Power Supply application, especially power is relatively large and right
The higher equipment of reliability requirement can select to come improving radiating effect and reliability, heat conduction modeling using heat conduction capsulation material (encapsulating)
Closure material makes heat generating spot component be balanced, but the temperature of other component parts is also made to be higher than self-heating.Whole plastic packagings and
The equipment glue consumption for recording colloidal materials is big, of high cost, weight is big.Why heat dissipation can become the electronic equipment that Switching Power Supply is tired out
The problem of needing concern is caused entire because the electronic device of control section is unable to reliably working when temperature is higher
System it is unstable, the main heating source for generating heat is frequently not the device to most temperature-sensitive.Method：In pyrotoxin and by shadow
It is obstructed using light heat-insulating material (such as foam) between sound circuit, it is dynamic to carry out injecting glue to heating region and sensitizing range respectively
Make, or even can not injecting glue according to the heat condition of control section.Advantage：Inductor heating device self-heating but it is not afraid of
Heat has only lacked very small part sinking path, because main heat is by shortest heat conduction after doing heat-insulated blocking processing
The approach of injecting glue is transmitted to radiator, thermally sensitive region and component because being blocked with heating region, is generated heat
Regional effect smaller, and the use for recording colloidal materials can be reduced using cheap light heat-insulating material, and mitigate electronics and set
The overall weight of standby/electronic device.Before rectification：Whole encapsulatings, the heat that glue consumption is big, main screw lift is big, power inductance is sent out
It can be transmitted to electronic circuit region, other electronic devices are easy to be influenced by generating heat；After rectification：If there is the more electronics that generates heat
(heating device in addition to electronic power switch pipe distributes device due to electronic power switch pipe reliably abuts directly on radiator
Most of heat), then the device radiating condition is preferable.One of amelioration method：Part encapsulating, glue consumption is small and electronic device
Main screw lift is small；The heat that power inductance is sent out is not easy to be transmitted to electronic circuit region, other electronic devices are by power inductance
Fever influence it is small；And To Be Protected from Heat for power inductance itself；The device radiating condition if there is the more electronic device of fever
It is poor.The two of amelioration method：Part encapsulating, glue consumption is greatly and the weight of complete machine is big；The heat that power inductance is sent out is not easy
It is transmitted to electronic circuit region, electronic device is influenced small by the fever of power inductance；And To Be Protected from Heat for power inductance itself；If depositing
In the more electronic device of fever, then the device radiating condition is preferable.
Above by description and accompanying drawings, the exemplary embodiments of the specific structure of specific implementation mode, above-mentioned practicality are given
It is novel to propose existing preferred embodiment, but these contents are not intended as limiting to.For a person skilled in the art, it reads
After reading above description, various changes and modifications undoubtedly will be evident.Therefore, appended claims, which should be regarded as, covers this
The true intention of utility model and whole variations and modifications of range.The model of any and all equivalences in Claims scope
It encloses in the intention and range for being all considered as still belonging to the utility model with content.
Claims (10)
1. a kind of electronic device filled with heat conduction capsulation material, which is characterized in that including：
Inner containment has the shell of printed circuit board and is equipped with electronic component on a printed circuit；
One or more installation regions for carrying electronic component are defined on a printed circuit；
It is set to the isolation board for being spaced apart the different installation regions mutually adjoined of enclosure；
Heat conduction capsulation material filled with the electronic component for enveloping its carrying at least at a specified installation region.
2. the electronic device according to claim 1 filled with heat conduction capsulation material, it is characterised in that：On printed circuit board
The calorific value of electronic component installed of different installation regions it is different.
3. the electronic device according to claim 1 filled with heat conduction capsulation material, it is characterised in that：The specified peace
The calorific value for the electronic component that dress region is installed is higher than the fever for the electronic component that other remaining installation regions are installed
Amount.
4. the electronic device according to claim 3 filled with heat conduction capsulation material, it is characterised in that：Inside the housing extremely
It is few that heat conduction capsulation material is filled with also at other installation regions on the specified installation region periphery.
5. the electronic device according to claim 3 filled with heat conduction capsulation material, it is characterised in that：Inside the housing only
Filled with heat conduction capsulation material and more than other than the specified installation region only at the specified installation region
Without filling any heat conduction capsulation material at other lower installation regions.
6. the electronic device according to claim 4 or 5 filled with heat conduction capsulation material, it is characterised in that：It is arranged in institute
State the electronic component generation that the isolation board on specified installation region periphery is used for that the specified installation region is prevented to be installed
Heat via heat conduction capsulation material to ambient radiation.
7. the electronic device according to claim 3 filled with heat conduction capsulation material, it is characterised in that：The specified peace
The electronic component that dress region is installed includes power switch or power inductance.
8. a kind of electronic device filled with heat conduction capsulation material, which is characterized in that including：
Inner containment has the shell of printed circuit board, wherein being equipped with first kind electronic device and the second class on a printed circuit
Electronic device；
Definition is useful for carrying one or more designated mounting regions of the first kind electronic component on printed circuit board, and
The perimeter in the designated mounting region on a printed circuit is equipped with the second electron-like device；
The designated mounting area peripheral edge is provided with isolation board and enclosure to be also filled at the designated mounting region
Envelope the heat conduction capsulation material of the first kind electronic component of its carrying；
The designated mounting region is isolated plate and separates relative to other perimeters on printed circuit board, in the first kind
The heat that calorific value of the calorific value of electronic device than the second electron-like device causes greatly first kind electronic device to generate is radiated
When the second electron-like device, the heat that first kind electronic device generates is prevented to be radiated via heat conduction capsulation material by isolation board
To the second electron-like device.
9. the electronic device according to claim 8 filled with heat conduction capsulation material, it is characterised in that：Inside the housing extremely
It is few that heat conduction capsulation material is filled with also at other perimeters of the designated mounting area peripheral edge.
10. the electronic device according to claim 8 filled with heat conduction capsulation material, it is characterised in that：Inside the housing
Only filled with heat conduction capsulation material and in the remainder other than the designated mounting region at the designated mounting region
Without filling any heat conduction capsulation material at other perimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820269465.0U CN208016152U (en) | 2018-02-24 | 2018-02-24 | Electronic device filled with heat conduction capsulation material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820269465.0U CN208016152U (en) | 2018-02-24 | 2018-02-24 | Electronic device filled with heat conduction capsulation material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208016152U true CN208016152U (en) | 2018-10-26 |
Family
ID=63886887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820269465.0U Active CN208016152U (en) | 2018-02-24 | 2018-02-24 | Electronic device filled with heat conduction capsulation material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208016152U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115066144A (en) * | 2022-05-31 | 2022-09-16 | 华为数字能源技术有限公司 | Packaging structure and photovoltaic optimizer |
| WO2022227498A1 (en) * | 2021-04-25 | 2022-11-03 | 中国人民解放军海军工程大学 | Power electronic device packaging structure suitable for heavy-salt-fog environment |
-
2018
- 2018-02-24 CN CN201820269465.0U patent/CN208016152U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022227498A1 (en) * | 2021-04-25 | 2022-11-03 | 中国人民解放军海军工程大学 | Power electronic device packaging structure suitable for heavy-salt-fog environment |
| CN115066144A (en) * | 2022-05-31 | 2022-09-16 | 华为数字能源技术有限公司 | Packaging structure and photovoltaic optimizer |
| CN115066144B (en) * | 2022-05-31 | 2025-01-14 | 华为数字能源技术有限公司 | Packaging structure and photovoltaic optimizer |
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