CN207364684U - Light emitting diode lamp - Google Patents

Abstract

The utility model relates to a light emitting diode (L ED) lamp, this L ED lamp includes a L0 ED device and a lamp holder, this L1 ED device contains a plurality of L2 ED crystalline grains, a plurality of conductive substrate, an encapsulation layer, a protective sheath, this a plurality of conductive substrate are the interval setting, each L ED crystalline grain is born the weight of and forms electric connection by two double-phase adjacent conductive substrate jointly, this encapsulation layer cladding these a plurality of L ED crystalline grains and cover on the partial region of each conductive substrate, this protective sheath cladding these a plurality of L ED crystalline grains and these a plurality of conductive substrate, form a flexible L ED device, because these L ED crystalline grains are close to this protective sheath, make the heat energy that these L ED crystalline grains produced distribute to the air fast, improve the thermal diffusivity, and utilize the arrangement mode of each L ED crystalline grain, make this L ED device can reach the effect that the light is continuous and light is even.

Description

Light Emitting Diode Lamps

technical field

The utility model relates to an illuminating lamp, in particular to a light-emitting diode lamp.

Background technique

Please refer to Fig. 16, which is an existing light-emitting diode bulb 80, which includes a light-emitting diode light bar 81, a lamp holder 82, a lamp holder 85 and a lampshade 86, the light-emitting diode The body light bar 81 is erected on the lamp holder 82, and the LED light bar 81 is fixed on the lamp holder 82 through a plurality of fixing parts 83; the lamp holder 82 is installed on the lamp holder 85; the lampshade 86 It is connected with the lamp holder 82 so that the LED light bar 81 and the lamp holder 82 are wrapped in the lampshade 86 .

Generally speaking, the lampshade 86 is made of glass, which is prone to cracks or even ruptures under impact or pressure; moreover, there is a distance between the position where the LED light bar 81 is placed and the lampshade 86, so that the The heat energy generated by the light-emitting diode light bar 81 is easily concentrated in the lampshade 86 and is not easy to dissipate heat.

Please refer to FIG. 17 , which is an existing light-emitting diode light bar 90, which includes a substrate 91, a plurality of light-emitting diode crystal grains 92, and a plurality of resistors 93. The resistors 93 are current-limiting resistors to reduce the The current flowing through the light-emitting diode grain 92 prevents the temperature of the light-emitting diode grain 92 from being too high due to excessive load current, or even burns out. The light-emitting diode grain 92 and the The resistors 93 are mounted on one side of the substrate 91 and placed alternately with each other, wherein the light emitting diode crystal grains 92 and the resistors 93 are electrically connected.

Since the light-emitting type of the light-emitting diodes 92 is a point light source, and the resistor 93 is inserted between the light-emitting diode crystal grains 92, the distance between the light-emitting diode crystal grains 92 is too long. As a result, when emitting light, the illumination ranges emitted by two adjacent light emitting diodes 92 are adjacent but not intersecting, so that the light bar 90 appears as a continuous point light source, causing the problem of discontinuous illumination.

Utility model content

In view of the problems of poor heat dissipation and discontinuous illumination of the existing light-emitting diode bulbs, the main purpose of this utility model is to propose a light-emitting diode lamp, which uses a protective cover as a lampshade to make the light bar self-generated Heat can be dissipated effectively, heat dissipation is improved, and features such as the addition of an encapsulation layer and the arrangement of these light-emitting diode crystal grains not only facilitate heat dissipation and save energy, but also achieve the effect of continuous and uniform light.

In order to achieve the aforementioned purpose, the light-emitting diode lamp of the present invention includes:

A light emitting diode device, comprising:

a plurality of light emitting diode crystal grains;

A plurality of conductive substrates, each of which is a thin metal sheet, the plurality of conductive substrates are arranged at intervals, and each light-emitting diode crystal grain is carried by two adjacent conductive substrates and electrically connected, wherein each light-emitting diode The length of the polar body is W1, the distance between two adjacent light-emitting diodes is W2, and W2<2W1;

An encapsulation layer, which includes an upper encapsulation layer, the upper encapsulation layer is light-transmitting and covers the plurality of light-emitting diode crystal grains and simultaneously covers the upper surface of each conductive substrate, the encapsulation layer and the plurality of light-emitting diodes The polar crystal grains and the plurality of conductive substrates form a light bar;

a protective sheath, which is an insulative light-transmitting and curved tube body, and the protective sheath wraps the light bar;

A fixing block, which has at least one perforation, through which at least one end of the light-emitting diode light bar passes, and is used to fix the light-emitting diode device;

a circuit board, which is electrically connected to at least one end of the light-emitting diode light bar, and is used to control the light-emitting diode light bar;

A lamp holder, the fixed block and the circuit board are arranged inside it.

In the aforementioned light-emitting diode lamp, both sides of the conductive substrate extend out of the upper encapsulation layer.

In the light-emitting diode lamp described above, both the upper surface and the lower surface of the light-emitting diode grain can emit light.

The aforementioned light-emitting diode lamp, wherein, the conductive substrate has a width D1, and the inner diameter of the protective cover is D3,

Among them, 0.3<(D1/D3)<1.

The aforementioned light-emitting diode lamp, wherein, the upper encapsulation layer has a first length L1, and the first length L1 is that the upper encapsulation layer extends from the upper surface of each conductive substrate to the light-emitting surface of the light-emitting diode crystal grain. The upper encapsulation layer has a second length L2, the second length L2 is the thickness of the upper encapsulation layer extending from the center of each conductive substrate to the width direction of each conductive substrate;

Among them, 3L1>L2.

The aforementioned light-emitting diode lamp, wherein the light-emitting diode lamp further includes a lower encapsulation layer, and the lower encapsulation layer covers the lower surfaces of the plurality of light-emitting diode crystal grains and the plurality of conductive substrates.

In the aforementioned light-emitting diode lamp, wherein, the upper encapsulation layer and the lower encapsulation layer have a thickness and are both in the shape of a semi-elliptical arc.

In the light-emitting diode lamp described above, the light bar further includes a lower light-transmitting plate, which is insulated and transparent and disposed on the lower surface of the conductive substrate.

A light emitting diode lamp, comprising:

A light emitting diode device, comprising:

a plurality of light emitting diode crystal grains;

A plurality of conductive substrates, including a plurality of positive conductive substrates and a negative conductive substrate, the positive conductive substrates are arranged at intervals, and each light-emitting diode crystal grain is jointly carried by two adjacent positive conductive substrates and the negative conductive substrate and forming an electrical connection, wherein the length of each light-emitting diode is W1, the distance between two adjacent light-emitting diodes is W2, and W2<2W1; the negative conductive substrate is arranged on one side of the positive conductive substrate;

An encapsulation layer, which includes an upper encapsulation layer, the upper encapsulation layer is light-transmitting and covers the plurality of light-emitting diode crystal grains and covers part of the upper surface of each conductive substrate at the same time, so that at least one of each positive electrode conductive substrate The side and at least one side of the negative electrode conductive substrate extend beyond the upper encapsulation layer, and the encapsulation layer forms a light bar with the plurality of light-emitting diode crystal grains and the plurality of conductive substrates;

a protective cover, which is a transparent and flexible tube body, and the protective cover wraps the light bar;

a fixing block, which has a perforation for passing through one end of the light emitting diode device to fix the light emitting diode device;

A circuit board, which is electrically connected to one end of the light-emitting diode light bar, for controlling the light-emitting diode light bar;

A lamp holder, the fixed block and the circuit board are arranged inside it.

In the aforementioned light-emitting diode lamp, both sides of the conductive substrate extend out of the upper encapsulation layer.

In the light-emitting diode lamp described above, both the upper surface and the lower light-emitting surface of the light-emitting diode grain can emit light.

The aforementioned light-emitting diode lamp, wherein, the conductive substrate has a width D1, the width D1 is the adjacent sides of two adjacent conductive substrates, the inner diameter of the protective cover is D3,

Among them, 0.3<(D1/D3)<1.

The aforementioned light-emitting diode lamp, wherein, the upper encapsulation layer has a first length L1, which is the upper surface extending from the upper surface of each conductive substrate to the light-emitting surface of each light-emitting diode crystal grain. Encapsulation layer thickness; the upper encapsulation layer has a second length L2, the second length L2 is the thickness of the upper encapsulation layer extending from the center of each conductive substrate to the width direction of each conductive substrate;

Among them, 3L1>L2.

The aforementioned light-emitting diode lamp further includes a lower encapsulation layer, and the lower encapsulation layer covers the lower surfaces of the plurality of light-emitting diode crystal grains and the plurality of conductive substrates.

In the light-emitting diode lamp mentioned above, the upper and lower packaging layers have a thickness and are in the shape of a semi-elliptical arc, so that light can be evenly distributed to the outside of the upper and lower packaging layers.

In the light-emitting diode lamp described above, the light bar further includes a lower light-transmitting plate, which is disposed on the lower surface of the conductive substrate, and is insulated and light-transmitting.

Since each LED crystal grain emits light in a point shape, the distance between each light emitting diode is controlled within twice the length of each light emitting diode, so that the light bar can emit continuous light when emitting light, and the multiple The light bar in which the light-emitting diode crystal grains are connected in series with the plurality of conductive substrates has flexibility, which greatly increases the bending degree of the LED device, and can form a variety of different light bar shapes during the manufacturing process, providing diversified options ; In addition, through the oval shape of the upper encapsulation layer, the light can be evenly scattered from the inside to the outside of the upper encapsulation layer to achieve the effect of uniform light; in addition, because the protective sleeve tightly covers the light bar, the light bar The distance between it and the protective cover is very close, so that the heat generated by the light bar itself can be quickly dissipated into the air and not easy to accumulate in the protective cover, thereby improving the heat dissipation effect.

Description of drawings

Fig. 1 is a disassembled schematic diagram of a light-emitting diode lamp of the present invention.

Fig. 2 is a schematic diagram of the light bar of the present invention.

Fig. 3 is a side view of the light bar of the present invention.

Fig. 4 is a three-dimensional schematic view of the light bar of the present invention.

FIG. 5A is a cross-sectional view of the light bar of the present invention.

FIG. 5B is a cross-sectional view of the LED device of the present invention.

Fig. 6 is a schematic diagram of the utility model.

Fig. 7 is an exploded schematic diagram of a light-emitting diode lamp according to another embodiment of the present invention.

Fig. 8 is a schematic diagram of a light-emitting diode lamp according to another embodiment of the present invention.

Fig. 9 is a schematic diagram of another embodiment of the light bar of the utility model applying Fig. 7 and Fig. 8 .

Fig. 10 is an exploded schematic diagram of a light-emitting diode lamp according to another embodiment of the present invention.

Fig. 11 is a schematic diagram of a light-emitting diode lamp according to another embodiment of the present invention.

Fig. 12 to Fig. 15 are schematic diagrams of different shapes of light-emitting diode lamps of the present invention.

Fig. 16 is a schematic diagram of a conventional LED lamp.

FIG. 17 is a schematic diagram of a conventional LED light bar.

Explanation of reference signs:

10 LED devices

13 encapsulation layer

16 Cases

50 lamp heads.

Detailed ways

Please refer to FIG. 6 , which is a light-emitting diode lamp of the present invention. To realize the present invention, please refer to FIG. 1 further. The present invention includes an LED device 10 , a fixing block 20 , a circuit board 30 and a lamp holder 50 .

Please further refer to FIG. 2 and FIG. 3, the LED device 10 includes a light bar 14, the light bar 14 has a plurality of light emitting diode crystal grains 11 (Light Emitting Diode Chip, hereinafter referred to as LED grain), a plurality of conductive substrates 12 and an encapsulation layer 13. In this embodiment, the encapsulation layer 13 includes an upper encapsulation layer 131. The plurality of LED chips 11 can be upper and lower double-sided light-emitting diodes, which have at least one upper light-emitting surface 111. The LED chips 11 can project the generated light outward through the upper light-emitting surface 111 , wherein the upper light-emitting surface 111 is located on the top of each LED chip 11 . Each conductive substrate 12 is a metal conductive sheet, and each conductive substrate 12 is arranged in sequence with a pitch, and each LED chip 11 is mounted between two adjacent conductive substrates 12 and electrically connected to the two adjacent conductive substrates 12, so as to A light bar 14 is formed. Specifically, a conductive substrate 12 , an LED die 11 , a conductive substrate 12 , an LED die 11 . . . are connected in series in an alternate arrangement; in this embodiment, the light bar 14 is flexible. In this embodiment, the conductive substrate 12 at one end of the light bar 14 extends to form a first conductive portion 121 , and the conductive substrate 12 at the other end of the light bar 14 extends to form a second conductive portion 122 , and the first conductive portion 121 The two ends of the second conductive portion 122 are electrodes different from each other.

Referring to FIG. 4 , in this embodiment, each of the plurality of LED chips 11 has a length W1 , and there is a distance W2 between two LED chips 11 , wherein the distance W2 is less than twice the length W1 . In this way, the number of the plurality of LED crystal grains 11 can be fully increased, and the effect of achieving continuous light emission can be achieved.

As shown in FIG. 5A, it is another embodiment of the light bar 14, wherein the light bar 14 further includes a lower encapsulation layer 132 and a lower light-transmitting plate 15, and the lower light-transmitting plate 15 is arranged on the lower surface of each conductive substrate 12. , wherein the lower light-transmitting plate 15 has a lower light-emitting surface 151, so that light can be emitted from the lower light-emitting surface 151; the area of the lower light-transmitting plate 15 is greater than or equal to the area of each conductive substrate 12; the upper packaging layer 131 is It is semi-elliptical, and it is arranged on the upper surface of the conductive substrate 12 and completely covers the plurality of LED chips 11. Two sides of each conductive substrate 12 are exposed to the encapsulation layers 131 , 132 and are not covered by the encapsulation layers 131 , 132 . Through the combination of the upper encapsulation layer 131 and the lower encapsulation layer 132, the protection ability for the plurality of LED dies 11 and the plurality of conductive substrates 12 can be improved, and the bonding between each LED die 11 and each conductive substrate 12 can be improved. strength, so that the light bar 14 is more difficult to break; in addition, as shown in the figure, there is a central axis C1 vertically extending from the midpoint of the conductive substrate 12 to the upper light-emitting surface 111 and the lower light-emitting surface 151, because the upper package The layer 131 has a semi-elliptical shape viewed from the side, wherein the height of the upper encapsulation layer 131 extending from the upper surface of each conductive substrate 12 toward the light-emitting surface of each light-emitting diode crystal grain 11 is defined as a first length L1, from The central axis C1 extends laterally to the width direction of each conductive substrate 12 to the thickness of the upper encapsulation layer 131 defined as a second length L2, three times of the first length L1 is greater than the second length L2 (ie 3×L1 >L2), while the lower encapsulation layer 132 also has the above-mentioned specifications, so that when the plurality of LED crystal grains 11 emit light, the light can be distributed outwards on average along the radial direction of the encapsulation layers 131, 132, so as to reduce the The amount of light reflected by these encapsulation layers 131 and 132 increases the amount of light transmitted and penetrates evenly, achieving the effect of uniform brightness.

In this embodiment, after the plurality of LED chips 11 and the plurality of conductive substrates 12 are electrically connected and fixed, a high-viscosity packaging material is used to cover the plurality of LED chips 11 and the plurality of conductive substrates. The surface of the conductive substrate 12, so that the encapsulation material completely covers each LED chip 11, and then control the flow condition and hardening time of the encapsulation material to form the upper encapsulation layer 131 and the lower encapsulation layer 132 after curing. The encapsulation materials used for the encapsulation layer 131 and the lower encapsulation layer 132 can be respectively a transparent resin-material, a transparent silicone material or a transparent polymer material.

Please refer to Fig. 5B, the protective cover 16 can be a long transparent structure, in this embodiment, the inner diameter of the protective cover 16 can be between 3 mm and 15 mm, and the outer diameter of the protective cover 16 can be 4 mm to 15 mm. Between 16mm; the protective cover 16 is a light-transmitting hollow tube and is used to cover the light bar 14. The protective cover 16 is flexible and can be bent into different shapes with the light bar 14, making it difficult to Fracture; in this embodiment, the protective cover 16 is an insulator, which prevents the user from contacting the light bar 14 and causing the risk of electric shock during use; in addition, these conductive substrates have a width D1, and the width D1 is two Adjacent sides of adjacent conductive substrates, the inner diameter of the protective sleeve is D3, wherein, 0.3<(D1/D3)<1, when the width D1 of these conductive substrates 12 is longer than the inner diameter of the protective sleeve 16 When the ratio of D3 is between 0.3 and 1, the maximum amount of light output can be achieved; in addition, the protective cover 16 can be manufactured by extrusion molding, and then deformed by heating methods such as thermoplastic methods. , and then put into the mould. When the light bar 14 is put into the protective cover 16, since the two edges of the conductive substrates 12 expose the encapsulation layers 131, 132, the friction between the protective cover 16 and the encapsulation layers 131, 132 can be reduced. The contact movement between the sides and the inner wall of the protective cover 16 further reduces the resistance encountered when the light bar 14 is inserted into the protective cover 16 . In addition, because the two sides of each conductive substrate 12 are in contact with the inner wall of the protective cover 16, they can be used as a support structure for the protective cover 16, so that the protective cover 16 is roughly round or oval, reducing the number of protective covers. 16 exerts pressure on each LED die 11; in addition, in this embodiment, the protective cover is a light-transmitting or transparent material, which can also maintain a good light-transmitting effect when protecting the light bar 14.

In the present utility model, since the two sides of each conductive substrate 12 are exposed outside the encapsulation layer 13, it can be in contact with the inner wall of the protective cover 16, and the frictional force between each conductive substrate 12 and the protective cover 16 is less than The frictional force between the encapsulation layer 13 and the protective cover 16, when the LED light bar 14 is installed on the protective cover 16, can pass through the small frictional force between each conductive substrate 12 and the protective cover 16, so that the installed The design process is smoother, reducing time costs and operational difficulties.

Please refer to Fig. 1, connect the LED device 10, in this embodiment, the fixing block 20 is made of an insulating material, the fixing block 20 is a circular block, and a plurality of Perforation 22. In this embodiment, the fixing block 20 has two perforations 22. In a preferred embodiment, each perforation 22 is a round hole. The diameter of each perforation 22 matches the LED device 10, so that the The first conductive part 121 and the second conductive part 122 at both ends of the LED device 10 are respectively inserted into the two through holes 22, and fixed inside the through holes 22, such as by bonding and fixing, so that the LED device 10 can maintain a firm state when it is bent; A flange 24 is formed on an outer edge of the fixing block 20 .

The circuit board 30 is provided with a plurality of electrode connection points, including two electrode connection points 311a, 311b in this embodiment, and each electrode connection point 311a, 311b is mutually different in polarity, for example, a positive electrode connection point is connected to a negative electrode point, the positive connection point can be electrically connected to the first conductive part 121, and the negative connection point can be electrically connected to the second conductive part 122; the circuit board 30 can be provided with electronic components, such as capacitors, resistors, etc. And constitute a control circuit.

The bottom of the lamp cap 50 has a first electrical connection portion 51, and the side of the lamp cap 50 has a second electrical connection portion 53, the first electrical connection portion 51 and the second electrical connection portion 53 are mutually The opposite polarities are connected to an external power supply respectively. In this embodiment, the second electrical connection portion 53 is a screw structure; can correspond to the stepped portion 55; in addition, the first electrical connection portion 51 and the second electrical connection portion 53 are electrically connected to the electrode connection ends 33a, 33b of the circuit board 30 inside the lamp cap 50, respectively. sexual connection.

Please refer to FIG. 7 to FIG. 8 , which are another preferred embodiment of the light-emitting diode lamp. The difference from the previous embodiment is that only one end of the LED device is inserted into the fixing block 20 for fixing.

In order to realize the light-emitting diode lamps in FIG. 7 and FIG. 8, the light bar 14 in FIG. 9 is adopted in this embodiment, and the light bar 14 has multiple light-emitting diode crystal grains 11, multiple conductive substrates 12 and a packaging layer 13. The encapsulation layer 13 includes an upper encapsulation layer 131. In this embodiment, the conductive substrate 12 further includes a first conductive portion 125 and a second conductive portion 126. The first conductive portion 125 is located on the light bar 14 Any end of the terminal is electrically connected to the conductive substrate 12 at the end. Each LED chip 11 is mounted between two adjacent conductive substrates 12 and electrically connected to the two adjacent conductive substrates 12 to form the light bar 14, specifically, a positive conductive substrate 12, an LED crystal grains 11, a conductive substrate 12, an LED crystal grain 11 ... are connected in series in an alternate arrangement; the second conductive part 126 is a strip-shaped conductive plate, which is arranged on one side of the conductive substrate 12 and connected to the conductive The substrate 12 is adjacent but not connected, one end of which is electrically connected to the LED chips 11 at the other end of the light bar 14, and part of the area of the second conductive portion 126 is covered and fixed by the upper packaging layer 131; In this embodiment, the conductive substrate 12 and the second conductive part 126 are separated, so that the current enters from the first conductive part 125, passes through the light-emitting diode crystal grain 11, and finally flows through the second conductive part 126 to form The current loop enables the light bar 14 to be put into the fixing block 20 at one end and connected to the circuit board 30 to still achieve the effect of lighting.

Please refer to FIG. 10 to FIG. 11, which is another preferred embodiment of the light-emitting diode lamp. The difference from the previous embodiment is that it has two LED devices 10; in order to achieve this embodiment, the fixing block 20 The number of through holes is increased to four, so that the two ends of each LED device 10 can be inserted into the fixing block 20 .

Please refer to FIG. 12 to FIG. 15. Since the LED device is flexible, it can be bent into different shapes. As shown in FIG. 12, the LED device 10 is bent into a circular shape to form a shape like a general light bulb; As shown in Figure 13, the LED device 10 is bent into a mushroom shape; as shown in Figure 14, the LED device 10 is bent into a heart shape; as shown in Figure 15, the LED device 10 is bent into a pear shape; The LED device 10 is bent into various shapes to provide users with various shape options.

Since each LED crystal grain 11 belongs to point-shaped light emission, the spacing of each light emitting diode crystal grain 11 is controlled within twice the length of each light emitting diode crystal grain 11, so that the light bar 14 can be lighted when emitting light. Showing continuous light emission, and the light bar 14 connected in series with the plurality of light emitting diode crystal grains 11 and the plurality of conductive substrates 12 is flexible, which greatly increases the bending degree of the LED device 10, and can form multiple LED devices during the manufacturing process. A variety of different shapes of the LED device 10 provide a variety of options.

Claims (16)

1. a kind of light-emitting diode lamp, it is characterised in that include：

One light-emitting diode device, including：

Multiple light-emitting diode crystal grain；

Multiple electrically-conductive backing plates, each multiple electrically-conductive backing plates are a sheet metal, and the plurality of electrically-conductive backing plate is set in distance, each luminous two Polar body crystal grain is carried and is electrically connected jointly by two adjacent electrically-conductive backing plate, wherein the length of each light-emitting diode is W1, the spacing of two adjacent light-emitting diodes are W2, and W2<2W1；

One encapsulated layer, it includes encapsulated layer on one, encapsulated layer is in printing opacity and the plurality of light-emitting diode crystal grain of cladding and same on this When be covered in the upper surface of each electrically-conductive backing plate, which forms with the plurality of light-emitting diode crystal grain and the plurality of electrically-conductive backing plate One lamp bar；

One protective case, it coats the lamp bar for an insulated light transmission and in the tube body of curved shape, the protective case；

One fixed block, it wears at least one end of the light-emitting diode lamp bar, shines to fix this with least one perforation Diode device；

One circuit board, it is electrically connected at least one end of the lamp bar, to control the lamp bar；

One lamp cap, it is internal for setting the fixed block and circuit board.

2. light-emitting diode lamp as claimed in claim 1, it is characterised in that all extend the two sides of the electrically-conductive backing plate Encapsulated layer on this.

3. light-emitting diode lamp as claimed in claim 1, it is characterised in that the upper surface of the light-emitting diode crystal grain and Lower surface all can light extraction.

4. light-emitting diode lamp as claimed in claim 1, it is characterised in that the electrically-conductive backing plate has a width D 1, should The interior diameter of protective case is D3,

Wherein, 0.3<(D1/D3)<1.

5. light-emitting diode lamp as claimed in claim 1, it is characterised in that encapsulated layer has one first length L1 on this, First length L1 is that encapsulated layer extends from the upper table of each electrically-conductive backing plate towards the light-emitting surface direction of light-emitting diode crystal grain on this Thickness；Encapsulated layer has an one second length L2 on this, second length L2 for encapsulated layer on this from each electrically-conductive backing plate center to The thickness of the width extension of each electrically-conductive backing plate；

Wherein, 3L1>L2.

6. light-emitting diode lamp as claimed in claim 5, it is characterised in that the light-emitting diode lamp further includes one Lower encapsulated layer, the lower encapsulated layer are coated on the lower surface of the plurality of light-emitting diode crystal grain and the plurality of electrically-conductive backing plate.

7. light-emitting diode lamp as claimed in claim 6, it is characterised in that encapsulated layer and the lower encapsulated layer have thickness on this Spend and be semiellipse arc shape.

8. light-emitting diode lamp as claimed in claim 1, it is characterised in that the lamp bar further includes light-transmitting plate, The lower light-transmitting plate is insulated light transmission and is arranged at the lower surface of the electrically-conductive backing plate.

9. a kind of light-emitting diode lamp, it is characterised in that include：

One light-emitting diode device, including：

Multiple light-emitting diode crystal grain；

Multiple electrically-conductive backing plates, it includes multiple anode conductive substrates and a cathode conductive substrate, between the anode conductive substrate is in Every setting, each light-emitting diode crystal grain is carried jointly by two adjacent anode conductive substrates and the cathode conductive substrate and shape Into electric connection, wherein the length of each light-emitting diode is W1, the spacing of two adjacent light-emitting diodes is W2, and W2<2W1；Should Cathode conductive substrate is arranged at one side of the anode conductive substrate；

One encapsulated layer, it includes encapsulated layer on one, encapsulated layer is in printing opacity and the plurality of light-emitting diode crystal grain of cladding and same on this When be covered in the portion of upper surface of each electrically-conductive backing plate, make at least a side and the cathode conductive substrate of each anode conductive substrate At least a side is extended on this outside encapsulated layer, the encapsulated layer and the plurality of light-emitting diode crystal grain and the plurality of electrically-conductive backing plate Form a lamp bar；

One protective case, it is a transparent printing opacity and flexible tube body, which coats the lamp bar；

One fixed block, it has a perforation, is worn for one end of the light-emitting diode lamp bar, to fix light-emitting diode dress Put；

One circuit board, it is electrically connected one end of the light-emitting diode lamp bar, to control the light-emitting diode lamp bar；

One lamp cap, it is internal for setting the fixed block and circuit board.

10. light-emitting diode lamp as claimed in claim 9, it is characterised in that the two sides of the electrically-conductive backing plate all extend Go out encapsulated layer on this.

11. light-emitting diode lamp as claimed in claim 9, it is characterised in that the upper surface of the light-emitting diode crystal grain And lower light-emitting surface all can light extraction.

12. light-emitting diode lamp as claimed in claim 9, it is characterised in that the electrically-conductive backing plate has a width D 1, should Width D 1 is the adjacent side of adjacent conductive substrate two-by-two, a length of D3 of interior diameter of the protective case,

Wherein, 0.3<(D1/D3)<1.

13. light-emitting diode lamp as claimed in claim 9, it is characterised in that encapsulated layer has one first length L1 on this, First length L1 is envelope on this extended from the upper table of each electrically-conductive backing plate towards the light-emitting surface direction of each light-emitting diode crystal grain Fill layer thickness；It is from each electrically-conductive backing plate center to each conductive base that encapsulated layer, which has one second length L2, second length L2, on this Encapsulation layer thickness on this of the width extension of plate；

Wherein, 3L1>L2.

14. light-emitting diode lamp as claimed in claim 13, it is characterised in that the light-emitting diode lamp further includes Encapsulated layer once, the lower encapsulated layer are coated on the lower surface of the plurality of light-emitting diode crystal grain and the plurality of electrically-conductive backing plate.

15. light-emitting diode lamp as claimed in claim 14, it is characterised in that encapsulated layer and the lower encapsulated layer have on this Thickness and be semiellipse arc shape, enables light uniformly to distribute to outside encapsulated layer on this and the lower encapsulated layer.

16. light-emitting diode lamp as claimed in claim 9, it is characterised in that the lamp bar further includes light-transmitting plate, The lower light-transmitting plate is arranged at the lower surface of the electrically-conductive backing plate, it is insulated light transmission.