CN207038514U - Chip heat dissipation cooling device coupled with flat heat pipe cluster and semiconductor refrigeration - Google Patents

Abstract

The utility model discloses the chip cooling cooling device that a kind of flat-plate heat pipe cluster couples with semiconductor refrigerating.The device includes chip, semiconductor chilling plate, flat plate heat tube cluster, radiating fin and radiator fan；The semiconductor chilling plate includes semiconductor chilling plate cold end and semiconductor chilling plate hot junction；The flat plate heat tube cluster includes flat plate heat tube cluster bottom, sleeping C-channel, flat plate heat tube cluster middle part, cannelure, flat plate heat tube cluster top, pipe and interior pod；The flat plate heat tube cluster bottom includes vertical inner edge and undercut type stage casing.The utility model device is in the radiating of flat plate heat tube cluster and the compound action of semiconductor chilling plate refrigeration cool-down, increasing extent of temperature when reducing chip operation to greatest extent, raising chip operation efficiency.The advantages that the utility model is compared with other chip cooling heat sinks with simple in construction, easy for installation, and service life is long.

Description

Chip heat dissipation cooling device coupled with flat heat pipe cluster and semiconductor refrigeration

technical field

The utility model relates to cooling and heat dissipation technology, in particular to a chip heat dissipation and cooling device coupled with semiconductor refrigeration and plate heat pipe cluster heat dissipation.

Background technique

Chips are the core components of various electronic devices, and their performance directly affects the performance of electronic devices. At present, the functions of high-speed computing chips are becoming more and more powerful, but the heat released during their work will also increase. If the heat is not taken away, the temperature of the chip will rise sharply, which will not only affect the working performance of the chip, but eventually It will cause the chip to stop working or even burn out, thereby causing damage to electronic equipment.

At present, the heat dissipation of the chip usually adopts a combination of a heat sink and a fan or a combination of a heat pipe and a fan. Although these technologies can take away most of the heat generated by the chip when it is working, the temperature of the chip will still rise, which will affect the work of the chip. Performance is affected, especially when the computing speed of the chip is getting faster and more powerful, how to ensure that the heat generated when the chip is working is taken away, and at the same time, the temperature rise of the chip is minimized, or even kept unchanged Or lower than room temperature, thereby improving the working efficiency of the chip is a problem that needs to be solved urgently.

Utility model content

The purpose of this utility model is to overcome the shortcomings of the above prior art, and provide a chip cooling device with simple structure, convenient installation, which can effectively reduce the temperature rise of the chip or even reduce it to below room temperature. .

In order to achieve the above object, the utility model adopts the following technical solutions:

A chip heat dissipation and cooling device coupled with a flat heat pipe cluster and a semiconductor refrigeration, comprising a chip, a semiconductor refrigeration sheet, a flat heat pipe cluster, a heat dissipation fin, and a cooling fan; the semiconductor refrigeration sheet includes a semiconductor refrigeration sheet cold end and a semiconductor refrigeration sheet thermal end; the flat heat pipe cluster includes the lower part of the flat heat pipe cluster, the horizontal C-shaped groove, the middle part of the flat heat pipe cluster, the longitudinal groove, the upper part of the flat heat pipe cluster, the pipe and the inner longitudinal groove; the lower part of the flat heat pipe cluster includes a vertical Inner edge and undercut midsection;

The upper end of the chip is provided with a first thermally conductive adhesive layer, and the cold end of the semiconductor refrigeration sheet is connected to the upper end of the chip through the first thermally conductive adhesive layer; Two heat-conducting adhesive layers, through the second heat-conducting adhesive layer, fix the hot end of the semiconductor refrigeration sheet and the flat heat pipe cluster; the flat heat pipe cluster consists of three parts: the lower part of the flat heat pipe cluster, the middle part of the flat heat pipe cluster and the upper part of the flat heat pipe cluster; the flat plate The lower part of the type heat pipe cluster is an inverted concave metal block structure. The vertical inner edge of the inverted concave shape is in close contact with the chip and the semiconductor cooling chip, which can directly transfer the heat on the vertical side of the chip and the semiconductor cooling chip. It is connected with the hot end of the semiconductor refrigeration sheet through the second thermally conductive adhesive layer, and transfers the heat of the hot end of the semiconductor refrigeration sheet to the flat heat pipe cluster; the middle part of the flat heat pipe cluster is a trapezoidal container, and the container is filled with ordinary heat pipes Consistent liquid; there is a horizontal C-shaped groove at the bottom of the container. Due to the function of the C-shaped groove, the evaporation temperature of the liquid in the middle container can be reduced, which is conducive to reducing the start-up temperature of the flat heat pipe cluster and dissipating the heat from the hot end of the semiconductor refrigeration sheet earlier. There are longitudinal grooves on the inner side of the container, which is conducive to the return of liquid; there are a number of pipes with inner longitudinal grooves on the upper part, and heat dissipation fins are connected to the outside of the pipes, and a heat dissipation fan is installed on the upper side of the flat heat pipe cluster The heat from the condensing end of the flat heat pipe cluster is dissipated through the heat dissipation fan; the inside of the pipe is provided with an inner longitudinal groove, which is beneficial to the return flow of the liquid.

Further, the area of the cold end of the semiconductive cooling chip is equal to the cross-sectional area of the chip, and the shape of the two is exactly the same in the horizontal direction.

Further, the offset angles between the four sides of the central container of the flat heat pipe cluster and the vertical axis are 0-15°;

Further, the end area of the hot end of the semiconductor refrigeration sheet should be equal to the area in the horizontal direction of the concave middle part of the lower part of the flat heat pipe cluster.

Further, the height of the vertical sides of the bottom concave shape of the flat heat pipe cluster is equal to the sum of the height of the chip, the height of the first thermally conductive adhesive layer, the height of the semiconducting cooling sheet and the height of the second thermally conductive adhesive layer. The lengths of the vertical sides of the vertical sides of the bottom concave type of the heat pipe cluster are respectively equal to the lengths of the corresponding chip sides.

Further, the heat dissipation fins are integrally formed.

Further, the semiconductor cooling chip is in the shape of a cuboid.

Further, the flat heat pipe cluster needs to be processed into a whole in advance.

Further, the flat plate heat pipe cluster with an inverted concave structure is only tightly connected to the corresponding side surfaces of the chip and the semiconductor cooling chip on two parallel sides, and the other two parallel sides of the chip and the semiconductor cooling chip are not covered by any shield, so as to lead out the wires.

Preferably, the horizontal C groove and various longitudinal grooves in the flat heat pipe cluster adopt the current general C-shaped groove pipe and longitudinal groove pipe processing technology, and the longitudinal groove pipe at the condensing end of the flat heat pipe cluster is welded by welding technology , and finally process the flat heat pipe cluster into a whole;

The cooling fins on the outside of the vertical groove tube at the condensation end of the preferred flat heat pipe cluster are integrally formed;

Preferably, the horizontal cross-section of the semiconducting cooling chip is the same size as the horizontal cross-section of the chip, and they are completely correspondingly connected through the first thermally conductive adhesive layer.

Compared with the prior art, the utility model has the following advantages and effects:

1. The utility model relates to a chip heat dissipation and cooling device coupled with a flat heat pipe cluster and a semiconductor refrigeration, including a chip, a semiconductor refrigeration chip, a flat heat pipe cluster, heat dissipation fins and a heat dissipation fan. The upper end of the chip is provided with a first heat-conducting adhesive layer, the cold end of the semiconductor refrigeration chip is fixed by the first heat-conducting adhesive layer and the upper end of the chip, and the hot-end end surface of the semiconductor refrigeration sheet is connected with the concave middle section end surface of the lower end of the flat heat pipe cluster. Covered with a second heat-conducting adhesive layer, the flat heat pipe cluster consists of upper, middle and lower parts. The lower part is a metal block structure with a concave shape. Directly transfer the heat on the vertical side of the chip and the semiconductor cooling chip, and the concave middle horizontal part is connected with the hot end of the semiconductor cooling chip through the second heat conduction glue, and transfer the heat of the hot end of the semiconductor cooling chip to the flat heat pipe cluster ;The middle part is a trapezoidal container, and the bottom of the container has a horizontal C-shaped groove, which is conducive to the evaporation of the liquid. There are longitudinal grooves on the four sides of the container, which is conducive to the return of the liquid; there are several pipes with inner longitudinal grooves on the upper part. , the outside of the tube is connected by a number of heat dissipation fins, and a heat dissipation fan is installed on the upper side, and the heat from the condensing end of the flat heat pipe cluster is dissipated by the fan heat fan. The flat-plate heat pipe cluster of the utility model is a combined effect of heat dissipation and cooling and cooling of the semiconductor refrigeration sheet, which can minimize the temperature rise range when the chip is working, and improve the working efficiency of the chip.

2. The utility model is a chip heat dissipation and cooling device coupled with a flat heat pipe cluster and semiconductor refrigeration. The upper, middle and lower parts of the flat heat pipe cluster are made into a whole, and at the same time, the whole is assembled with heat dissipation fins and heat dissipation fans. Integrate, the lower concave structure of the entire flat heat pipe cluster is completely inverted and above the chip and the semiconductor refrigeration sheet, so that the chip heat dissipation and cooling device coupled with the flat heat pipe cluster and semiconductor refrigeration of the utility model has a simple structure, convenient installation, and long service life. At the same time, each component is closely connected, the overall structure is compact, and the overall heat transfer resistance is small, which can quickly dissipate the heat generated by the chip to the atmosphere.

Description of drawings

Fig. 1 is a schematic cross-sectional structure diagram of a chip heat dissipation cooling device coupled with a flat heat pipe cluster and semiconductor refrigeration of the present invention;

Figure 2 is a schematic diagram of the lower structure of the flat heat pipe cluster;

Figure 3 is a schematic diagram of the middle structure of the flat heat pipe cluster;

Fig. 4 is a schematic diagram of the upper structure of the flat heat pipe cluster;

Fig. 5 is a schematic diagram of axonometric view in the northeast direction of a chip heat dissipation cooling device coupled with flat heat pipe clusters and semiconductor refrigeration of the utility model.

The various components in the figure are as follows: chip 1, first thermally conductive adhesive layer 2, semiconductor cooling chip 3, second thermally conductive adhesive layer 4, flat heat pipe cluster 5, cooling fins 6, cooling fan 7, semiconductor cooling chip cold end 301, Hot end 302 of semiconductor refrigeration sheet, lower part of flat heat pipe cluster 501, horizontal C-shaped groove 502, middle part of flat heat pipe cluster 503, longitudinal groove 504, upper part of flat heat pipe cluster 505, tube 506, inner longitudinal groove 507, vertical inner edge 5011 , 5012 in the middle section of inverted concave.

detailed description

For the convenience of those skilled in the art to understand, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments.

Example 1

As shown in Figures 1 to 5, a chip heat dissipation and cooling device coupled with a flat heat pipe cluster and a semiconductor refrigeration is characterized in that it includes a chip 1, a semiconductor refrigeration chip 3, a flat heat pipe cluster 5, a cooling fin 6, and a cooling fan 7. The semiconductor cooling plate 3 includes the cold end 301 of the semiconductor cooling plate and the hot end 302 of the semiconductor cooling plate; the flat heat pipe cluster 5 includes the lower part of the flat heat pipe cluster 501, the horizontal C-shaped groove 502, and the middle part of the flat heat pipe cluster 503 , longitudinal groove 504, flat heat pipe cluster top 505, pipe 506 and inner longitudinal groove 507; the flat heat pipe cluster bottom 501 includes a vertical inner edge 5011 and an inverted concave middle section 5012; the upper end of the chip 1 is provided with a first heat conduction Adhesive layer 2, the cold end 301 of the semiconductor cooling chip is connected to the upper end of the chip 1 through the first thermally conductive adhesive layer 2; the end face of the hot end 302 of the semiconductor cooling chip and the concave middle end face of the lower part 501 of the flat heat pipe cluster are covered with a second thermally conductive adhesive layer 4. Fix the hot end 302 of the semiconductor refrigeration sheet and the flat heat pipe cluster 5 through the second heat-conducting adhesive layer 4; Partial composition; the lower part 501 of the flat heat pipe cluster is a concave metal block structure, and the vertical inner edge 5011 of the concave shape is in close contact with the chip 1 and the semiconductor cooling chip 3, so that the vertical side of the chip 1 and the semiconductor cooling chip 3 can be directly The heat is transferred out, and the horizontal part of the concave middle section 5012 is connected with the hot end 302 of the semiconductive cooling sheet through the second thermally conductive adhesive layer 4, and the heat of the hot end 302 of the semiconductive cooling sheet is transferred to the flat heat pipe cluster 5; the flat type heat pipe The middle part 503 of the cluster is a trapezoidal container, which is filled with the same liquid as a common heat pipe; the bottom of the container is provided with a horizontal C-shaped groove 502, which is conducive to the evaporation of the liquid, and the inner side of the container is provided with a longitudinal groove 504, which is beneficial to the liquid the upper part has some pipes 506 with internal longitudinal grooves, and the outside of the pipes 506 is connected with heat dissipation fins 6, and a heat dissipation fan 7 is installed on the side of the upper part 505 of the flat heat pipe cluster. The heat at the condensing end is dissipated; the inside of the tube 506 is provided with an inner longitudinal groove 507 . The area of the cold end 301 of the semiconductor refrigerating sheet is equal to the cross-sectional area of the chip 1 , and both have the same shape in the horizontal direction. The end area of the hot end 302 of the semiconductor refrigerating sheet should be equal to the area in the horizontal direction of the bottom concave type of the flat heat pipe cluster; The sum of the height of the adhesive layer, the height of the semiconductor cooling plate and the height of the second thermally conductive adhesive layer, the lengths of the vertical sides of the lower part 501 of the flat heat pipe cluster are respectively equal to the lengths of the two sides of the corresponding chip. The heat dissipation fins are integrally formed. The semiconductor cooling chip 3 is in the shape of a cuboid. The flat heat pipe cluster needs to be processed into a whole in advance. The down-concave structure of the flat heat pipe cluster is only tightly connected to the corresponding side surfaces of the chip and the semiconductor cooling chip on two parallel sides, and the other two parallel sides of the chip and the semiconductor cooling chip are not shielded by any means to lead out wires.

Under the composite effect of heat dissipation of the flat heat pipe cluster and the cooling and cooling of the semiconductor refrigerating sheet, the utility model can minimize the temperature rise range when the chip is working, and improve the working efficiency of the chip. Compared with other chip heat dissipation and cooling devices, the utility model has the advantages of simple structure, convenient installation, long service life and the like.

Specifically, the flat heat pipe cluster 5 should select the corresponding filling medium, so as to ensure that the heat generated by the hot end 302 of the semiconductor cooling chip 3 and the heat absorbed directly from the two sides of the chip 1 by the lower part 501 of the flat heat pipe cluster pass through the flat heat pipe. The filling medium in the cluster 5 is transferred to the cooling fins 6, and then through the cooling fan 7, all the heat is dissipated to the environment. In order to improve the working efficiency of the flat heat pipe cluster 5, the quality m of the charging medium in the flat heat pipe cluster 5 should be suitable, which can be selected according to the following formula:

m=(1.05-1.1)×Q/(Kλ);

Among them, Q in the above formula is the sum of the heat generated by the hot end of the semiconductor refrigeration sheet per unit time and the heat directly absorbed by the lower part 501 of the flat heat pipe cluster 5 from both sides of the chip 1, and K is the amount of heat in the flat heat pipe cluster 5 per unit time. The number of medium cycles, m is the mass of the filling medium, and λ is the latent heat of gas-liquid phase transition of the filling medium.

The specific implementation described above is a preferred embodiment of the utility model, and does not limit the utility model. Any other changes or other equivalent replacement methods that do not deviate from the technical solution of the utility model are included in the utility model. within the scope of the new protection.

Claims (6)

1. A chip heat dissipation and cooling device coupled with a flat heat pipe cluster and semiconductor refrigeration, characterized in that it includes a chip (1), a semiconductor refrigeration chip (3), a flat heat pipe cluster (5), heat dissipation fins (6) and a heat dissipation A fan (7); the semiconductor cooling plate (3) includes a cold end of the semiconductor cooling plate (301) and a hot end of the semiconductor cooling plate (302); the flat heat pipe cluster (5) includes a lower part of the flat heat pipe cluster (501) , horizontal C-shaped groove (502), middle part of flat heat pipe cluster (503), longitudinal groove (504), upper part of flat heat pipe cluster (505), pipe (506) and inner longitudinal groove (507); the flat heat pipe The tuft lower portion (501) includes a vertical inner edge (5011) and an undercut midsection (5012); The upper end of the chip (1) is provided with a first thermally conductive adhesive layer (2), and the cold end of the semiconductor refrigeration chip (301) is connected to the upper end of the chip (1) through the first thermally conductive adhesive layer (2); the hot end of the semiconductor refrigeration sheet ( 302) The end face and the concave middle end face of the lower part of the flat heat pipe cluster (501) are covered with a second thermally conductive adhesive layer (4), and the hot end of the semiconductor refrigeration sheet (302) and the flat heat pipe are connected through the second thermally conductive adhesive layer (4). The cluster (5) is fixed; the flat heat pipe cluster (5) consists of three parts: the lower part of the flat heat pipe cluster (501), the middle part of the flat heat pipe cluster (503) and the upper part of the flat heat pipe cluster (505); the lower part of the flat heat pipe cluster ( 501) is an inverted concave metal block structure, the vertical inner edge (5011) of the inverted concave type is in close contact with the chip (1) and the semiconductor cooling chip (3), and the horizontal part of the concave type middle section (5012) is in contact with the hot end of the semiconductor cooling chip ( 302) are connected through the second thermally conductive adhesive layer (4); the middle part (503) of the flat heat pipe cluster is a trapezoidal container, and the container is filled with the same liquid as the ordinary heat pipe; there is a horizontal C-shaped groove at the bottom of the container (502), the inner side of the container is provided with longitudinal grooves (504); the upper part has a number of pipes (506) with internal longitudinal grooves, and the outer part of the pipes (506) is connected with cooling fins (6). A heat dissipation fan (7) is installed on the side of the upper part of the heat pipe cluster (505), through which the heat from the condensing end of the flat heat pipe cluster is dissipated; the inside of the tube (506) is provided with an inner longitudinal groove (507). 2. A chip heat dissipation and cooling device coupled with flat heat pipe clusters and semiconductor refrigeration according to claim 1, characterized in that: the area of the cold end (301) of the semiconductor refrigeration sheet is equal to the cross-sectional area of the chip (1), and the two The shape is exactly the same in the horizontal direction. 3. A chip heat dissipation and cooling device coupled with flat heat pipe clusters and semiconductor refrigeration according to claim 1, characterized in that: the area of the hot end (302) of the semiconductor refrigeration sheet should be equal to the concave shape of the lower part of the flat heat pipe cluster The horizontal area of the middle. 4. A chip heat dissipation and cooling device coupled with flat heat pipe clusters and semiconductor refrigeration according to claim 1, characterized in that: the height of the concave vertical sides of the lower part (501) of the flat heat pipe cluster is equal to the height of the chip , the sum of the height of the first heat-conducting adhesive layer, the height of the semiconductor refrigeration sheet and the height of the second heat-conducting adhesive layer. The length of the sides. 5 . The chip heat dissipation and cooling device coupled with flat heat pipe clusters and semiconductor refrigeration according to claim 1 , characterized in that: the semiconductor refrigeration sheet ( 3 ) is in the shape of a cuboid. 6 . 6. A chip heat dissipation and cooling device coupled with a flat heat pipe cluster and semiconductor refrigeration according to claim 1, wherein the concave structure of the flat heat pipe cluster is only connected to the chip and the semiconductor refrigeration sheet on two parallel sides. The corresponding sides are tightly connected, and the other two parallel sides of the chip and the semiconductor cooling plate are not covered in any way so as to lead out the wires.