CN206650075U - A kind of adopting surface mounted LED packaging body of adjustable color temperature - Google Patents
A kind of adopting surface mounted LED packaging body of adjustable color temperature Download PDFInfo
- Publication number
- CN206650075U CN206650075U CN201720369590.4U CN201720369590U CN206650075U CN 206650075 U CN206650075 U CN 206650075U CN 201720369590 U CN201720369590 U CN 201720369590U CN 206650075 U CN206650075 U CN 206650075U
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- Prior art keywords
- color temperature
- electrode
- led
- light
- colour temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 210000005056 cell body Anatomy 0.000 claims abstract description 12
- 239000004033 plastic Substances 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000012876 topography Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 239000000084 colloidal system Substances 0.000 abstract description 4
- 238000000605 extraction Methods 0.000 abstract description 4
- 239000011159 matrix material Substances 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of adopting surface mounted LED packaging body of adjustable color temperature, including dielectric base, the carrier cup located at dielectric base surface, the LED light source in dielectric base and packaging plastic and electrode group.The utility model belongs to lighting field, and the wall of cup of carrier cup is provided with reflecting layer, effectively improves light extraction efficiency；The cell body of fluorescence film matches with flip chip type blue-light LED chip profile, is pasted without using other colloids, and packaging plastic is covered in the flip chip type blue-light LED chip with fluorescence film, fluorescence film is fixed, difficult for drop-off；The high color temperature wafer-level package white light LEDs and low colour temperature wafer-level package white-light LED encapsulation can not only realize the regulation of colour temperature, and the space taken is small on same matrix；The setting of at least one high color temperature wafer-level package white light LEDs and at least one low colour temperature wafer-level package white light LEDs, the regulation of colour temperature is realized in the combination change of quantity, applied widely.
Description
Technical field
The utility model belongs to lighting field, more particularly to a kind of adopting surface mounted LED packaging body of adjustable color temperature.
Background technology
LED（Light Emitting Diode）, light emitting diode, it is that a kind of can convert electrical energy into consolidating for visible ray
The semiconductor devices of state, electricity directly can be converted into light by it.The light source of new generation to be attracted most attention as the current whole world, LED because
It has the advantages that environmental protection and energy saving, brightness height, long lifespan, fast, low in calories, nontoxic, the recyclable recycling of toggle speed, is referred to as
It is 21 century most promising green illumination light source.
Obtained extensively with the performance and the continuous beyond tradition lighting engineering of efficiency, the new technology of LED solid state illumination technologies
General application.LED illumination lamp can not only substitute white-light illuminating, and can also realize new function, and these functions are with traditional
Lighting engineering is difficult to realize, changes environment say by regulation white light colour temperature, to meet various places Various Seasonal not
The difference of light colour temperature is required with the period.The efficiency and colour rendering of white light LEDs are that it is most important as normal illumination sources
Two indexs.Existing high color temperature wafer-level package white light LEDs and low colour temperature wafer-level package white light LEDs are individual packages, it
Carry out mixed light again afterwards, the light mixing effect of this kind of set-up mode is not ideal, and the spaces that take of the LED of two individual packages compared with
Greatly.
Utility model content
Problem to be solved in the utility model is existing high color temperature wafer-level package white light LEDs and low colour temperature chip-scale
Encapsulation white light LEDs are individual packages, carry out mixed light again afterwards, and the light mixing effect of this kind of set-up mode is not ideal, and two only
The space that the LED of vertical encapsulation takes is larger.
To achieve these goals, the technical scheme that the utility model is taken is：
A kind of adopting surface mounted LED packaging body of adjustable color temperature provided by the utility model, including dielectric base, located at insulation base
The carrier cup of basal surface, the LED light source in dielectric base, packaging plastic and electrode group, the wall of cup of the carrier cup are provided with instead
Layer is penetrated, the wall of cup of the carrier cup is a ramp structure, and the packaging plastic is interior coated in carrier cup and covers LED light source, LED light source electricity
Electrode group is connected to, the LED light source includes at least one high color temperature wafer-level package white light LEDs and at least one low colour temperature
Wafer-level package white light LEDs, the low colour temperature wafer-level package white light LEDs include the first flip chip type blue-light LED chip and low colour temperature
Fluorescence film, the high color temperature wafer-level package white light LEDs include the second flip chip type blue-light LED chip and high color temperature fluorescence film.
Further, the cell body of low colour temperature fluorescence film and high color temperature the fluorescence film is groove topography, the low colour temperature
The profile of the cell body of fluorescence film and the first flip chip type blue-light LED chip matches, and the low colour temperature fluorescence film back-off is covered in
The light output surface of first flip chip type blue-light LED chip and side；The cell body of the high color temperature fluorescence film and the second flip chip type blue light
The profile of LED chip matches, and the high color temperature fluorescence film back-off is covered in the light output surface of the second flip chip type blue-light LED chip
And side.
Further, the LED light source includes a high color temperature wafer-level package white light LEDs and a low colour temperature chip
Level encapsulation white light LEDs, the electrode group include two pairs of electrodes, and a pair of electrodes includes first electrode and second electrode, first electricity
Pole, second electrode have spacing embedded in dielectric base surface and extend the exposed back side to dielectric base, the first electrode and the
Two electrodes respectively as the low colour temperature wafer-level package white light LEDs positive and negative electrode, the first flip chip type blue-light LED chip
Positive and negative electrode is respectively fixedly connected with first electrode and second electrode；Second pair of electrode includes the 3rd electrode and the 4th electrode, should
3rd electrode, the 4th electrode have being embedded in dielectric base surface and extending the exposed back side to dielectric base for spacing, the 3rd electricity
Pole is with the 4th electrode respectively as the positive and negative electrode of the high color temperature wafer-level package white light LEDs, the second flip chip type blue-ray LED
The positive and negative electrode of chip is respectively fixedly connected with the 3rd electrode and the 4th electrode.
Further, the color temperature value of the high color temperature wafer-level package white light LEDs is 5700-6500K.
Further, the color temperature value of the low colour temperature wafer-level package white light LEDs is 2700-3200K.
Further, the first flip chip type blue-light LED chip, the second flip chip type blue-light LED chip, low colour temperature fluorescent glue
Thermal conductivity soldering paste is provided between piece and high color temperature fluorescence film and dielectric base.
Further, the packaging plastic is transparent silica gel or epoxide-resin glue.
The utility model is had the advantages that using as above technical scheme：
1. the wall of cup of carrier cup is provided with reflecting layer, light extraction efficiency is effectively improved；
2. fluorescence film is groove topography, cell body and the flip chip type blue-light LED chip profile of the groove match, and cover
Light output surface and side in the flip chip type blue-light LED chip, its pasted between flip chip type blue-light LED chip firmly, without
Pasted using other colloids, packaging plastic is covered in the flip chip type blue-light LED chip with fluorescence film, fluorescence film is consolidated
It is fixed, it is difficult for drop-off.
3. the LED package has the characteristics that simple in construction, uniform in light emission, without veiling glare.
4. the high color temperature wafer-level package white light LEDs and low colour temperature wafer-level package white-light LED encapsulation are in same matrix
On, this kind of set-up mode can not only realize the regulation of colour temperature, and the space taken is small.
5. the LED light source includes at least one high color temperature wafer-level package white light LEDs and at least one low colour temperature chip
Level encapsulation white light LEDs, the regulation of colour temperature can be realized by the combination change of quantity, it is applied widely.
Brief description of the drawings
Fig. 1 is the structural representation of the present embodiment.
Embodiment
To further illustrate each embodiment, the utility model is provided with accompanying drawing.These accompanying drawings are in the utility model discloses
A part for appearance, it can coordinate the associated description of specification to explain the running of embodiment original mainly to illustrate embodiment
Reason.Cooperation refers to these contents, and those of ordinary skill in the art will be understood that other possible embodiments and this practicality are new
The advantages of type.Component in figure is not necessarily to scale, and similar element numbers are conventionally used to indicate similar component.
In conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in figure 1, a kind of adopting surface mounted LED packaging body for adjustable color temperature that the present embodiment provides, including dielectric base 1,
Carrier cup 2 located at the surface of dielectric base 1（Substrate 1 and carrier cup 2 are not integrated settings in the present embodiment, but are not limited to
This or integrated setting, will not be described in detail herein）, LED light source and packaging plastic 3 and electricity in dielectric base 1
Pole group, the wall of cup of the carrier cup 2 are provided with reflecting layer（Do not illustrate in figure）, the wall of cup of the carrier cup 2 is a ramp structure, the encapsulation
Glue 3 is interior coated in carrier cup 2 and covers LED light source, and the LED light source is electrically connected to electrode group, and the LED light source includes at least one
High color temperature wafer-level package white light LEDs and at least one low colour temperature wafer-level package white light LEDs, the low colour temperature chip-scale envelope
Dress white light LEDs include the first flip chip type blue-light LED chip 41 and low colour temperature fluorescence film 43, the high color temperature wafer-level package white light
LED includes the second flip chip type blue-light LED chip 42 and high color temperature fluorescence film 44.
In the present embodiment, the wall of cup of the carrier cup 2 is a ramp structure, and the setting of the ramp structure can make the adjustable color temperature
The light source that sends of adopting surface mounted LED packaging body is wider, range of exposures is bigger.
In the present embodiment, the wall of cup of carrier cup 2 is provided with reflecting layer, effectively improves light extraction efficiency.
In the present embodiment, the cell body of low the colour temperature fluorescence film 43 and high color temperature fluorescence film 44 is groove topography, should
The profile of the cell body and the first flip chip type blue-light LED chip 41 of low colour temperature fluorescence film 43 matches, the low colour temperature fluorescence film
43 back-offs are covered in light output surface and the side of the first flip chip type blue-light LED chip 41；The cell body of the high color temperature fluorescence film 44
Match with the profile of the second flip chip type blue-light LED chip 42, the back-off of high color temperature fluorescence film 44 is covered in the second flip chip type
The light output surface of blue-light LED chip 42 and side.The light that first flip chip type blue-light LED chip 41 is sent is incident upon low colour temperature fluorescent glue
In piece 43, then excited by low colour temperature fluorescence film 43 and to form low color temperature white light and outwards project；Second flip chip type blue-light LED chip 42
The light sent is incident upon in high color temperature fluorescence film 44, then is excited by high color temperature fluorescence film 44 and to be formed high color temperature white light and outwards penetrate
Go out.
In the present embodiment, the LED light source includes a high color temperature wafer-level package white light LEDs（This is not limited to, can also
It is two or three etc., will not be described in detail herein）An and low colour temperature wafer-level package white light LEDs（This is not limited to, also may be used
To be two or three etc., will not be described in detail herein）, in addition to two pairs of electrodes, a pair of electrodes include first electrode 51 and second
Electrode 52, the first electrode 51, second electrode 52 have being embedded in the surface of dielectric base 1 and extending exposed to dielectric base 1 for spacing
The back side, positive and negative electrode of the first electrode 51 with second electrode 52 respectively as the low colour temperature wafer-level package white light LEDs,
The positive pole 411 of the first flip chip type blue-light LED chip 41（That is the P poles of the chip）, negative pole 412（That is the N poles of the chip）Respectively
It is fixedly connected in first electrode 51 and second electrode 52；Second pair of electrode includes the 3rd electrode 53 and the 4th electrode 54, and this
Three electrodes 53, the 4th electrode 54 have spacing embedded in the surface of dielectric base 1 and extend the exposed back side to dielectric base 1, this
Three electrodes 53 and the 4th electrode 54 are respectively as the positive and negative electrode of the high color temperature wafer-level package white light LEDs, second flip chip type
The positive pole 421 of blue-light LED chip 42（That is the P poles of the chip）, negative pole 422（That is the N poles of the chip）It is respectively fixedly connected with
On three electrodes 53 and the 4th electrode 54.
In the present embodiment, the color temperature value of the high color temperature wafer-level package white light LEDs is 5700-6500K（The color temperature value is by height
High color temperature fluorescent material in colour temperature fluorescence film 44 is mixed to form with transparent silica gel, and the high color temperature fluorescence film 44 is existing skill
Art, no longer it is discussed in detail herein）.
In the present embodiment, the color temperature value of the low colour temperature wafer-level package white light LEDs is 2700-3200K（The color temperature value is by low
Low colour temperature fluorescent material in colour temperature fluorescence film 43 is mixed to form with transparent silica gel, and the low colour temperature fluorescence film 43 is existing skill
Art, no longer it is discussed in detail herein）.
In the present embodiment, the first flip chip type blue-light LED chip 41, the second flip chip type blue-light LED chip 42, low colour temperature are glimmering
Thermal conductivity soldering paste 6 is provided between ray film 43 and high color temperature fluorescence film 44 and dielectric base 1, the soldering paste 6 is set
Put and make it that the welding between component is more convenient and more firm.
In the present embodiment, the packaging plastic 3 is transparent silica gel or epoxide-resin glue.But this is not limited to, can also be with other
Conventional there is the colloid of insulation and light transmitting property to replace, and will not be described in detail herein.
The wall of cup of the utility model carrier cup 2 is provided with reflecting layer, effectively improves light extraction efficiency；Fluorescence film is outside groove
Shape, cell body and the flip chip type blue-light LED chip profile of the groove match, and are covered in going out for the flip chip type blue-light LED chip
Optical surface and side, it pastes firmly between flip chip type blue-light LED chip, pasted without using other colloids, encapsulation
Glue is covered in the flip chip type blue-light LED chip with fluorescence film, fluorescence film is fixed, difficult for drop-off.The LED package has
Have simple in construction, uniform in light emission, without veiling glare the features such as.High color temperature wafer-level package white light LEDs and low colour temperature wafer-level package are white
Light LED is encapsulated on same matrix, and this kind of set-up mode can not only realize the regulation of colour temperature, and the space taken is small.Should
LED light source includes at least one high color temperature wafer-level package white light LEDs and at least one low colour temperature wafer-level package white light
LED, the regulation of colour temperature can be realized by the combination change of quantity, it is applied widely.
Although specifically showing and describing the utility model with reference to preferred embodiment, those skilled in the art should
This is understood, is not departing from the spirit and scope of the present utility model that appended claims are limited, in form and details
On the utility model can be made a variety of changes, be the scope of protection of the utility model.
Claims (7)
- A kind of 1. adopting surface mounted LED packaging body of adjustable color temperature, it is characterised in that：Including dielectric base, located at dielectric base surface Carrier cup, the LED light source in dielectric base, packaging plastic and electrode group, the wall of cup of the carrier cup is provided with reflecting layer, should The wall of cup of carrier cup is a ramp structure, and the packaging plastic is interior coated in carrier cup and covers LED light source, and LED light source is electrically connected to Electrode group, the LED light source include at least one high color temperature wafer-level package white light LEDs and at least one low colour temperature chip-scale White light LEDs are encapsulated, the low colour temperature wafer-level package white light LEDs include the first flip chip type blue-light LED chip and low colour temperature fluorescent glue Piece, the high color temperature wafer-level package white light LEDs include the second flip chip type blue-light LED chip and high color temperature fluorescence film.
- 2. the adopting surface mounted LED packaging body of adjustable color temperature according to claim 1, it is characterised in that：The low colour temperature fluorescent glue The cell body of piece and high color temperature fluorescence film is groove topography, the cell body of the low colour temperature fluorescence film and the first flip chip type blue light The profile of LED chip matches, and the low colour temperature fluorescence film back-off is covered in the light output surface of the first flip chip type blue-light LED chip And side；The profile of the cell body of the high color temperature fluorescence film and the second flip chip type blue-light LED chip matches, the high color temperature fluorescence Film back-off is covered in light output surface and the side of the second flip chip type blue-light LED chip.
- 3. the adopting surface mounted LED packaging body of adjustable color temperature according to claim 1, it is characterised in that：The LED light source includes one Individual high color temperature wafer-level package white light LEDs and a low colour temperature wafer-level package white light LEDs, the electrode group include two pairs of electricity Pole, a pair of electrodes include first electrode and second electrode, and what the first electrode, second electrode had a spacing is embedded in dielectric base table Face simultaneously extends the exposed back side to dielectric base, and the first electrode is white respectively as the low colour temperature wafer-level package with second electrode Light LED positive and negative electrode, the positive and negative electrode of the first flip chip type blue-light LED chip are respectively fixedly connected with first electrode and second On electrode；Second pair of electrode includes the 3rd electrode and the 4th electrode, the 3rd electrode, the 4th electrode have spacing embedded in insulation base Basal surface simultaneously extends the exposed back side to dielectric base, the 3rd electrode and the 4th electrode respectively as high color temperature chip-scale envelope Fill the positive and negative electrode of white light LEDs, the positive and negative electrode of the second flip chip type blue-light LED chip be respectively fixedly connected with the 3rd electrode with On 4th electrode.
- 4. the adopting surface mounted LED packaging body of adjustable color temperature according to claim 1, it is characterised in that：The high color temperature chip-scale The color temperature value for encapsulating white light LEDs is 5700-6500K.
- 5. the adopting surface mounted LED packaging body of adjustable color temperature according to claim 1, it is characterised in that：The low colour temperature chip-scale The color temperature value for encapsulating white light LEDs is 2700-3200K.
- 6. the adopting surface mounted LED packaging body of adjustable color temperature according to claim 1, it is characterised in that：First flip chip type is blue Light LED chip, the second flip chip type blue-light LED chip, low colour temperature fluorescence film and high color temperature fluorescence film and dielectric base it Between be provided with thermal conductivity soldering paste.
- 7. the adopting surface mounted LED packaging body of adjustable color temperature according to claim 1, it is characterised in that：The packaging plastic is transparent Silica gel or epoxide-resin glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720369590.4U CN206650075U (en) | 2017-04-10 | 2017-04-10 | A kind of adopting surface mounted LED packaging body of adjustable color temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720369590.4U CN206650075U (en) | 2017-04-10 | 2017-04-10 | A kind of adopting surface mounted LED packaging body of adjustable color temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206650075U true CN206650075U (en) | 2017-11-17 |
Family
ID=60275976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720369590.4U Expired - Fee Related CN206650075U (en) | 2017-04-10 | 2017-04-10 | A kind of adopting surface mounted LED packaging body of adjustable color temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206650075U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461725A (en) * | 2018-11-20 | 2019-03-12 | 惠州市辉采实业有限公司 | Multi color temperature LED light source, lamp and preparation method |
| CN109817609A (en) * | 2018-12-06 | 2019-05-28 | 浙江开元机电科技有限公司 | A kind of color temperature-tunable LED tunnel lamp of dual chip |
| CN110630921A (en) * | 2018-06-01 | 2019-12-31 | 宏齐科技股份有限公司 | Handheld electronic device and its flip-chip light-emitting element with adjustable color temperature |
-
2017
- 2017-04-10 CN CN201720369590.4U patent/CN206650075U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110630921A (en) * | 2018-06-01 | 2019-12-31 | 宏齐科技股份有限公司 | Handheld electronic device and its flip-chip light-emitting element with adjustable color temperature |
| CN110630921B (en) * | 2018-06-01 | 2020-10-30 | 宏齐科技股份有限公司 | Handheld electronic device and flip-chip light-emitting element with adjustable color temperature |
| CN109461725A (en) * | 2018-11-20 | 2019-03-12 | 惠州市辉采实业有限公司 | Multi color temperature LED light source, lamp and preparation method |
| CN109817609A (en) * | 2018-12-06 | 2019-05-28 | 浙江开元机电科技有限公司 | A kind of color temperature-tunable LED tunnel lamp of dual chip |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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