CN206573462U - A kind of chip solder bond force measuring device - Google Patents
A kind of chip solder bond force measuring device Download PDFInfo
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- CN206573462U CN206573462U CN201720319374.9U CN201720319374U CN206573462U CN 206573462 U CN206573462 U CN 206573462U CN 201720319374 U CN201720319374 U CN 201720319374U CN 206573462 U CN206573462 U CN 206573462U
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- fixed block
- pressure gauge
- chip
- hold
- measuring device
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Abstract
The utility model provides a kind of chip solder bond force measuring device, including fixed block, pressure gauge and hold-down devices, wherein：Pressure gauge is arranged in hold-down devices, and hold-down devices control pressure meter is moved up or down；Pressure gauge has fixed block；Fixed block is provided with neck；During test, insertion welded plate in neck, the plate face of welded plate is parallel to the pressure gauge direction of motion.The chip solder bond force measuring device that the utility model is provided, moved down by hold-down devices and drive pressure gauge chip is separated from welded plate to chip application pressure, pressure between pressure gauge and chip is measured, the numerical values recited of the adhesion of chip and welded plate is drawn by the interaction of power.The chip solder bond force measuring device that the utility model is provided, simple in construction, test result is accurate, the problem of solving uncontrollable separating rate when prior art chips are separated with welded plate, manual separation is changed into mechanically decoupled, improves testing efficiency, save the testing time.
Description
Technical field
The utility model is related to chip adhesion fields of measurement, more particularly to a kind of chip solder bond force measuring device.
Background technology
With developing rapidly for electronics industry, the integrated level of printed circuit board (PCB) is constantly improved, and printed circuit board (PCB) is added
Work technique proposes higher requirement.To ensure safety and interests, product from research and development, produce to using being required for introducing failure point
Work is analysed, failure analysis is played an important role in the reliability quality assurance and raising of product.
Traditional adhesion method of testing is four angles and the printed circuit board (PCB) point for the component for first making detection with nipper plier
From, reuse and be pried away from tool, set about at the gap that four angles are produced with printed circuit board (PCB) before, separating component and printing electricity
Road plate, the adhesion between the component and printed circuit board (PCB) of detection is judged by artificial feel；This method of testing easily by
Operation technique standard degree influences, it is impossible to control separating rate, nonstandard operation cause error big and can not accurate evaluation its weldering
Situation is connect, also, component vertical separation from printed circuit board (PCB) can not be made, it is impossible to chip and printed circuit board (PCB) adhesion is drawn
The information such as strength values size.
Utility model content
The problem of to solve to mention in above-mentioned background technology, the utility model provides a kind of chip solder bond power measurement dress
Put, including fixed block, pressure gauge and hold-down devices, wherein：
The pressure gauge is arranged in the hold-down devices, and the hold-down devices control the pressure gauge to move up or down
It is dynamic；The pressure gauge has the fixed block；The fixed block is provided with neck；During test, insertion welded plate in the neck,
The plate face of welded plate is parallel to the pressure gauge direction of motion.
Further, the pressure gauge has briquetting；The briquetting is on litter；The litter, which is fixed on litter, to be determined
On the block of position；The litter locating piece is bolted with pedestal.
Further, the neck is arranged on the wall of the fixed block side；The fixed block includes the first fixed block and the
Two fixed blocks；The neck on first fixed block and the second fixed block is oppositely arranged.
Further, second fixed block is fixed on pedestal side, and the pedestal opposite side is provided with locating slot, described fixed
First fixed block is provided with the groove of position；First fixed block and the second fixed block are fixed by spring.
Further, the hold-down devices are fixed on base；The hold-down devices include rifle bar, handwheel and support；
Described rifle bar one end is connected through the through hole on the support with the handwheel, in the groove on other end inserted base.
The chip solder bond force measuring device that the utility model is provided, band dynamic pressure is at the uniform velocity moved down by hold-down devices
Power meter applies pressure to chip makes chip be separated from welded plate, pressure between pressure gauge and chip is measured, by the mutual of power
Effect draws the numerical values recited of the adhesion of chip and welded plate；Meanwhile, pressure gauge uniformly presses to chip, makes test result more
Plus it is accurate.The chip solder bond force measuring device that the utility model is provided, simple in construction, ingenious in design, test result is accurate,
The problem of solving uncontrollable separating rate when prior art chips are separated with welded plate, traditional manual separation is changed
Separated for mechanical automation, improve testing efficiency, save the testing time.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the accompanying drawing used required in description of the prior art is briefly described, it should be apparent that, drawings in the following description are
Some embodiments of the present utility model, for those of ordinary skill in the art, are not paying the premise of creative labor
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
The chip solder bond force measuring device schematic perspective view that Fig. 1 provides for the utility model；
Fig. 2 is partial cutaway schematic view when chip solder bond force measuring device is tested.
Reference：
The neck of 11 first 12 second fixed block of fixed block 13
The litter locating piece of 20 briquetting, 31 litter 32
The spring of 40 pedestal, 41 locating slot 50
The handwheel of 60 pressure gauge, 71 rifle bar 72
The welded plate of 73 support, 80 base 90
91 chips
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that retouched
The embodiment stated is a part of embodiment of the utility model, rather than whole embodiments.Based on the implementation in the utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made is belonged to
The scope of the utility model protection.
, it is necessary to explanation in description of the present utility model, term " " center ", " on ", " under ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " bottom ", " interior ", " outer " be based on orientation shown in the drawings or position relationship,
It is for only for ease of description the utility model and simplifies description, rather than indicates or imply that the device or element of meaning must have
Specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.In addition, term
" first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance.
As shown in figure 1, a kind of chip solder bond force measuring device that the utility model embodiment is provided, including fixation
Block, pressure gauge 60 and hold-down devices, wherein：
The pressure gauge 60 is arranged in the hold-down devices, the hold-down devices control the pressure gauge 60 upwards or to
Lower movement；The pressure gauge 60 has the fixed block；The fixed block is provided with neck 13；During test, in the neck 13
Welded plate 90 is inserted, the plate face of welded plate 90 is parallel to the direction of motion of pressure gauge 60.
When it is implemented, pressure gauge 60 is arranged in hold-down devices, hold-down devices control pressure meter 60 is moved up or down
Dynamic, pressure gauge 60 has the fixed block with neck 13；As shown in Fig. 2 during test, in the insertion neck 13 of welded plate 90, neck
13 direction is identical with the direction of motion of pressure gauge 60, and chip 91 is welded on welded plate 90, so that the leg of chip 91 is vertical
Set；The downward uniform motion under the control of hold-down devices of pressure gauge 60, it is follow-up that the test lead of pressure gauge 60 withstands the side wall of chip 91
It is continuous to make uniform motion downwards, until chip 91 is separated with welded plate 90, so that measuring pressure gauge 60 is used to make chip 91 and weldering
The pressure that fishplate bar 90 is separated, pressure value is shown on the display screen of pressure gauge 60；From the interaction of power, pressure gauge 60
Pressure when separating chips 91 are with welded plate 90 is equal with the adhesion of welded plate 90 with chip 91, so, pressure gauge 60 is shown
Pressure value size be the adhesion size of chip 91 and welded plate 90, so as to measure the combination of chip 91 and welded plate 90
Power.
The chip solder bond force measuring device that the utility model is provided, band dynamic pressure is at the uniform velocity moved down by hold-down devices
Power meter applies pressure to chip makes chip be separated from welded plate, pressure between pressure gauge and chip is measured, by the mutual of power
Effect draws the numerical values recited of the adhesion of chip and welded plate；Meanwhile, pressure gauge uniformly presses to chip, makes test result more
Plus it is accurate.The chip solder bond force measuring device that the utility model is provided, simple in construction, ingenious in design, test result is accurate,
The problem of solving uncontrollable separating rate when prior art chips are separated with welded plate, traditional manual separation is changed
Separated for mechanical automation, improve testing efficiency, save the testing time.
Preferably, the pressure gauge 60 has briquetting 20；The briquetting 20 is on litter 31；The litter 31 is fixed
On litter locating piece 32；The litter locating piece 32 is bolted with pedestal 40.
When it is implemented, pressure gauge 60 has briquetting 20,20 " 7 " shapes of briquetting, one end of briquetting 20 is provided with through hole, led to
Litter 31 is provided with hole, litter 31 is fixed on litter locating piece 32, and litter locating piece 32 is bolted with pedestal 40；Litter
31 surface is smooth, during test, and chip 91 is withstood in the end of briquetting 20, waits the arrival of pressure gauge 60.
The chip solder bond force measuring device that the utility model is improved, by setting briquetting and litter, during test, briquetting
Chip side wall is withstood, the lifting surface area of briquetting is bigger than chip, be easy to pressure gauge under the control of hold-down devices accurately to chip
Pressure, improves the precision of test.
Preferably, the neck 13 is arranged on the wall of the fixed block side；The fixed block includes the He of the first fixed block 11
Second fixed block 12；The neck 13 on the fixed block 12 of first fixed block 11 and second is oppositely arranged.
Preferably, second fixed block 12 is fixed on the side of pedestal 40, and the opposite side of pedestal 40 is provided with locating slot 41,
First fixed block 11 is provided with the locating slot 41；The fixed block 12 of first fixed block 11 and second is solid by spring 50
It is fixed.
When it is implemented, the side of pedestal 40 has been bolted the second fixed block 12, the opposite side of pedestal 40 is provided with
Locating slot 41, the first fixed block 11 is arranged on locating slot 41, is controlled by adjusting position of first fixed block 11 in locating slot 41
Make the distance between the first fixed block 11 and the second fixed block 12；Being equipped with first fixed block 11 and the second fixed block 12 is used for
It is fixedly connected with the cylinder of spring 50；The two ends of spring 50 are connected with two cylinders respectively, so that the first fixed block 11 and second be consolidated
Determine block 12 to fix.
Preferably, the hold-down devices are fixed on base 80；The hold-down devices include rifle bar 71, handwheel 72 and branch
Frame 73；Described one end of rifle bar 71 is connected through the through hole on the support 73 with the handwheel 72, other end inserted base 80
On groove in.
When it is implemented, the rod status of rifle bar 71 is furnished with external screw thread, pressure gauge 60 is fixed in fixed plate, had in fixed plate
Three through holes, middle through hole is provided with internal thread, and the one end of rifle bar 71 is connected through middle tapped through hole with handwheel 72, another
Hold fixed position in the groove of inserted base 80；Two pillars on the inner wall smooth of remaining two through hole, support 73 are smooth through two
Through hole, during test, control the rotation of handwheel 72, make fixed plate in rifle bar 71 to moving down by the structure of screw thread and bolt
It is dynamic, so that control pressure meter 60 is moved down.
Although more herein used such as fixed block, neck, briquetting, litter, litter locating piece, pedestal, positioning
The terms such as groove, rifle bar, support, base, welded plate, but it is not precluded from the possibility using other terms.Use these terms
Just for the sake of more easily describing and explaining essence of the present utility model；It is construed as any additional limitation all
Disagreed with the utility model spirit.
Finally it should be noted that：Various embodiments above is only limited to illustrate the technical solution of the utility model, rather than to it
System；Although the utility model is described in detail with reference to foregoing embodiments, one of ordinary skill in the art should
Understand：It can still modify to the technical scheme described in foregoing embodiments, or to which part or whole
Technical characteristic carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality newly
The scope of each embodiment technical scheme of type.
Claims (5)
1. a kind of chip solder bond force measuring device, it is characterised in that：Including fixed block, pressure gauge (60) and hold-down devices,
Wherein：
The pressure gauge (60) is arranged in the hold-down devices, the hold-down devices control the pressure gauge (60) upwards or to
Lower movement；The pressure gauge (60) has the fixed block；The fixed block is provided with neck (13)；During test, the neck
(13) insertion welded plate (90) in, the plate face of the welded plate (90) is parallel to the pressure gauge (60) direction of motion.
2. chip solder bond force measuring device according to claim 1, it is characterised in that：The pressure gauge (60) is divided into
There is briquetting (20)；The briquetting (20) is on litter (31)；The litter (31) is fixed on litter locating piece (32)；It is described
Litter locating piece (32) is bolted with pedestal (40).
3. chip solder bond force measuring device according to claim 1, it is characterised in that：The neck (13) is arranged at
On the wall of the fixed block side；The fixed block includes the first fixed block (11) and the second fixed block (12)；First fixed block
(11) neck (13) and on the second fixed block (12) is oppositely arranged.
4. chip solder bond force measuring device according to claim 3, it is characterised in that：Second fixed block (12)
Pedestal (40) side is fixed on, pedestal (40) opposite side is provided with locating slot (41), the locating slot (41) provided with described
First fixed block (11)；First fixed block (11) and the second fixed block (12) are fixed by spring (50).
5. chip solder bond force measuring device according to claim 1, it is characterised in that：The hold-down devices are fixed on
On base (80)；The hold-down devices include rifle bar (71), handwheel (72) and support (73)；Wear described rifle bar (71) one end
The through hole crossed on the support (73) is connected with the handwheel (72), in the groove on other end inserted base (80).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720319374.9U CN206573462U (en) | 2017-03-29 | 2017-03-29 | A kind of chip solder bond force measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720319374.9U CN206573462U (en) | 2017-03-29 | 2017-03-29 | A kind of chip solder bond force measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206573462U true CN206573462U (en) | 2017-10-20 |
Family
ID=60053191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720319374.9U Active CN206573462U (en) | 2017-03-29 | 2017-03-29 | A kind of chip solder bond force measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206573462U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114034540A (en) * | 2021-06-21 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Chip performance testing method and device |
| CN114813356A (en) * | 2022-07-01 | 2022-07-29 | 江铃汽车股份有限公司 | Method for detecting welding quality of packaged chip welding leg |
-
2017
- 2017-03-29 CN CN201720319374.9U patent/CN206573462U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114034540A (en) * | 2021-06-21 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Chip performance testing method and device |
| CN114034540B (en) * | 2021-06-21 | 2024-05-17 | 重庆康佳光电科技有限公司 | Chip performance testing method and device |
| CN114813356A (en) * | 2022-07-01 | 2022-07-29 | 江铃汽车股份有限公司 | Method for detecting welding quality of packaged chip welding leg |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Chip welding combines force measuring device Effective date of registration: 20190618 Granted publication date: 20171020 Pledgee: Xiamen finance Company limited by guarantee Pledgor: Xiamen SINOFAITH Electronics Technology Co., Ltd. Registration number: 2019990000581 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |