CN206413251U - A kind of high efficiency and heat radiation circuit board - Google Patents
A kind of high efficiency and heat radiation circuit board Download PDFInfo
- Publication number
- CN206413251U CN206413251U CN201720115733.9U CN201720115733U CN206413251U CN 206413251 U CN206413251 U CN 206413251U CN 201720115733 U CN201720115733 U CN 201720115733U CN 206413251 U CN206413251 U CN 206413251U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- blind
- heat
- blind hole
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 239000011241 protective layer Substances 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000741 silica gel Substances 0.000 claims abstract description 6
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of high efficiency and heat radiation circuit board; include protective layer, circuit layer, basic unit and heat dissipating layer successively from top to bottom; there is heat dissipation channel in the heat dissipating layer; the circuit board also includes multiple first blind holes and multiple second blind holes; the openend of first and second blind hole with the heat dissipation channel UNICOM; first blind hole runs through the circuit layer and basic unit; the blind end of first blind hole is located in the protective layer; the blind end of second blind hole is located in the basic unit, and heat conductive silica gel is each filled with first and second blind hole；Also there are multiple radiating fins in the heat dissipation channel.Circuit board of the present utility model, good heat dissipation effect.
Description
Technical field
The utility model is related to electric field, and in particular to a kind of high efficiency and heat radiation circuit board.
Background technology
Circuit board is indispensable part in current electronic product, and with advances in technology, on circuit board
Integrated electronic device is more and more, so that the caloric value of circuit board in use is also increasing, but existing electricity
Radiating effect is not good sometimes for road plate, once radiating effect is bad, influences its performance.
Utility model content
Utility model purpose：The utility model is intended to overcome the defect of prior art, and there is provided a kind of high efficiency and heat radiation circuit board.
Technical scheme：A kind of cooling circuit board, includes protective layer, circuit layer, basic unit and heat dissipating layer, institute successively from top to bottom
Stating has heat dissipation channel in heat dissipating layer, the circuit board also includes multiple first blind holes and multiple second blind holes, described first and second
The openend of blind hole with the heat dissipation channel UNICOM, first blind hole run through the circuit layer and basic unit, described first is blind
The blind end in hole is located in the protective layer, and the blind end of second blind hole is located in the basic unit, first and second blind hole
Inside it is each filled with heat conductive silica gel；Also there are multiple radiating fins in the heat dissipation channel.
Further, the heat dissipating layer is made up of albronze.
Further, the radiating fin is made up of albronze.
Further, the circuit layer is copper foil.
Further, the basic unit is made up of polyimide material.
Further, the blind end of first blind hole is hemispherical.
Beneficial effect：Circuit board of the present utility model, passes through heat dissipating layer, the setting of first and second blind hole, good heat dissipation effect.
Brief description of the drawings
Fig. 1 is circuit board schematic diagram.
Embodiment
Reference：1 protective layer；2 circuit layers；3 basic units；4 heat dissipating layers；4.1 heat dissipation channel；4.2 radiating fin；11 first
Blind hole；12 second blind holes.
A kind of cooling circuit board, includes protective layer 1, circuit layer 2, basic unit 3 and heat dissipating layer 4 successively from top to bottom, described to dissipate
There is heat dissipation channel 4.1, the circuit board also includes multiple first blind holes 11 and multiple second blind holes 12 in thermosphere 4, described the
First, the openend of two blind holes with the UNICOM of heat dissipation channel 4.1, first blind hole 11 run through the circuit layer and basic unit,
The blind end of first blind hole 11 is located in the protective layer 3, and the blind end of second blind hole 12 is located at the basic unit 3
It is interior, it is each filled with heat conductive silica gel in first and second blind hole；Also there are multiple radiating fins 4.2 in the heat dissipation channel 4.1.Institute
Heat dissipating layer is stated to be made up of albronze.The radiating fin is made up of albronze.The circuit layer is copper foil.The basic unit by
Polyimide material is made.The blind end of first blind hole is hemispherical.
Circuit board of the present utility model, the heat of protective layer is transferred to heat dissipation channel from the heat conductive silica gel in the first blind hole,
The heat of basic unit is transferred to heat dissipation channel from the heat conductive silica gel in the second blind hole, and radiating fin is more by the heat of heat dissipating layer
Ground is transferred to heat dissipation channel, is promptly dissipated heat by heat dissipation channel, so as to ensure the high efficiency and heat radiation of circuit board.
Although the utility model is illustrated and described with regard to preferred embodiment, those skilled in the art should manage
Solution, without departing from claim limited range of the present utility model, can to the utility model carry out various change and
Modification.
Claims (6)
1. a kind of high efficiency and heat radiation circuit board, it is characterised in that include protective layer, circuit layer, basic unit and radiating successively from top to bottom
Layer, has heat dissipation channel in the heat dissipating layer, and the circuit board also includes multiple first blind holes and multiple second blind holes, and described the
First, the openend of two blind holes with the heat dissipation channel UNICOM, first blind hole runs through the circuit layer and basic unit, described the
The blind end of one blind hole is located in the protective layer, and the blind end of second blind hole is located in the basic unit, and described first and second
Heat conductive silica gel is each filled with blind hole；Also there are multiple radiating fins in the heat dissipation channel.
2. high efficiency and heat radiation circuit board according to claim 1, it is characterised in that the heat dissipating layer is made up of albronze.
3. high efficiency and heat radiation circuit board according to claim 1, it is characterised in that the radiating fin is by albronze system
Into.
4. high efficiency and heat radiation circuit board according to claim 1, it is characterised in that the circuit layer is copper foil.
5. high efficiency and heat radiation circuit board according to claim 1, it is characterised in that the basic unit is by polyimide material system
Into.
6. high efficiency and heat radiation circuit board according to claim 1, it is characterised in that the blind end of first blind hole is in hemisphere
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720115733.9U CN206413251U (en) | 2017-02-08 | 2017-02-08 | A kind of high efficiency and heat radiation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720115733.9U CN206413251U (en) | 2017-02-08 | 2017-02-08 | A kind of high efficiency and heat radiation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206413251U true CN206413251U (en) | 2017-08-15 |
Family
ID=59557532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720115733.9U Expired - Fee Related CN206413251U (en) | 2017-02-08 | 2017-02-08 | A kind of high efficiency and heat radiation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206413251U (en) |
-
2017
- 2017-02-08 CN CN201720115733.9U patent/CN206413251U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170815 Termination date: 20180208 |