CN104134637A - Radiating structure for high-power logic chip PoP - Google Patents

Abstract

The invention relates to a heat dissipation structure for PoP packaging of high-power logic chips. A bottom support ball is welded on the upper surface of a printed circuit board, an organic substrate is arranged on the bottom support ball, and a lower package is fixed on the upper surface of the organic substrate. The lower package body is provided with a communication hole, the lower package body is provided with a micro-spray cavity, a heat-conducting film is provided on the upper cavity plate of the micro-spray cavity, and a cooling device is opened in the middle of the lower cavity plate of the micro-spray cavity. The medium inlet is provided with a cooling medium outlet at the left and right ends of the lower chamber plate of the micro-spray chamber, a double-layer packaging support ball is provided on the upper surface of the lower package body, and an upper package substrate is provided on the double-layer package support ball. An upper packaging body is fixed on the upper surface of the upper packaging substrate, and a cooling pump and a heat exchanger are fixed on the upper surface of the printed circuit board. The invention helps to conduct the heat generated by the chip to the outside of the package as soon as possible, thereby improving the heat dissipation capability of the PoP package of the high-power chip.

Description

Heat dissipation structure for PoP packaging of high-power logic chips

technical field

The invention relates to a chip packaging structure, in particular to a heat dissipation structure for PoP packaging of high-power logic chips.

Background technique

PoP (Package on Package) packaging is a three-dimensional packaging structure that can integrate logic chips and memory chips at the same time, and has been used more and more, such as Apple mobile phones, BlackBerry mobile phones and tablet computers. However, due to the stacking of the upper and lower packages, the air flow between the packages is relatively poor, resulting in poor heat dissipation performance of the package, especially for logic chips whose power consumption in the lower package is increasing, the heat dissipation problem is even more serious.

Contents of the invention

The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a heat dissipation structure for PoP packaging of high-power logic chips that can enhance air flow between packages and improve heat dissipation performance.

According to the technical solution provided by the present invention, the heat dissipation structure for PoP packaging of high-power logic chips has a bottom supporting ball welded on the upper surface of the printed circuit board, an organic substrate is arranged on the bottom supporting ball, and an organic substrate is arranged on the organic substrate. The surface is fixed with a lower packaging body, and a communication hole is opened on the lower packaging body. The communication hole runs through the upper and lower surfaces of the lower packaging body. The thermal conductive film is provided with a cooling medium inlet in the middle of the lower cavity plate of the micro-spray cavity, and a cooling medium outlet is opened at the left and right ends of the lower cavity plate of the micro-spray cavity, and a double-layer package is provided on the upper surface of the lower package. The support ball is provided with an upper packaging substrate on the double-layer packaging support ball, an upper packaging body is fixed on the upper surface of the upper packaging substrate, and a cooling pump is fixed on the upper surface of the printed circuit board on the right side of the bottom support ball. A heat exchanger is fixed on the upper surface of the printed circuit board on the right side of the cooling pump; the outlet of the cooling pump is connected to the inlet of the cooling medium through a first connecting pipe, and the outlet of the heat exchanger is connected to the inlet of the cooling pump through a second connecting pipe , the outlet of the cooling medium is connected with the inlet of the heat exchanger through a third connecting pipe.

A partition is erected in the middle of the left side plate and the right side plate of the micro-spray chamber, and a partition through hole is opened on the partition.

The first connecting pipe and the third connecting pipe bypass the bottom support ball.

The connecting hole is conical, and the big opening of the connecting hole is on the top, and the small opening of the connecting hole is on the bottom.

The invention adopts an active heat dissipation method, that is, the application of the micro-jet heat dissipation technology to the PoP package high-power processor chip helps to conduct the heat generated by the chip to the outside of the package as soon as possible, thereby improving the heat dissipation capability of the high-power chip PoP package.

Description of drawings

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a schematic structural view of the micro-spray chamber in the present invention.

Fig. 3 is a cross-sectional view along line A-A of Fig. 2 .

Detailed ways

The present invention will be further described below in conjunction with specific examples.

The heat dissipation structure for PoP packaging of high-power logic chips has bottom support balls 102 welded on the upper surface of the printed circuit board 600, an organic substrate 101 is arranged on the bottom support balls 102, and a lower layer is fixed on the upper surface of the organic substrate 101. The package body 107 has a communication hole 108 on the lower package body 107. The communication hole 108 runs through the upper and lower surfaces of the lower package body 107. A heat-conducting film 104 is arranged on the chamber plate, a cooling medium inlet 111 is provided at the middle part of the lower chamber plate of the micro-spray chamber body 103, and a cooling medium outlet 112 is provided at the left and right ends of the lower chamber plate of the micro-spray chamber body 103. The upper surface of the package body 107 is provided with a double-layer package support ball 200, an upper package substrate 301 is arranged on the double-layer package support ball 200, an upper package body 305 is fixed on the upper surface of the upper package substrate 301, and the bottom support The upper surface of the printed circuit board 600 on the right side of the ball 102 is fixed with a cooling pump 400, and the upper surface of the printed circuit board 600 on the right side of the cooling pump 400 is fixed with a heat exchanger 500; The outlet of the heat exchanger 500 is connected to the inlet of the cooling pump 400 through the second connecting pipe 800 , and the cooling medium outlet 112 is connected to the inlet of the heat exchanger 500 through the third connecting pipe 900 .

A partition 109 is erected in the middle of the left side plate and the right side plate of the micro spray chamber body 103 , and a partition through hole 110 is opened on the partition 109 .

The first connecting pipe 700 and the third connecting pipe 900 bypass the bottom supporting ball 102 .

The communication hole 108 is conical, and the large opening of the communication hole 108 is on the top, and the small opening of the communication hole 108 is on the bottom.

Organic substrate 101, bottom support ball 102, micro-spray cavity 103, heat conduction film 104, high-power chip 105, lead wire 106, lower package body 107, communication hole 108, partition 109, partition via hole 110, cooling medium inlet 111 Together with the cooling medium outlet 112 , it is called the lower package 100 .

The upper package substrate 301 , the first upper package memory chip 302 , the second upper package memory chip 303 , the upper package lead 304 and the upper package body 305 are collectively referred to as an upper package 300 .

In the present invention, the micro-spray chamber body 103 is assembled on the lower surface of the high-power logic chip 105, and the cooling medium inlet 111 and the cooling medium outlet 112 are drawn out. The high-power chip 105 is bonded to the organic substrate 101 through wires 106, a second upper package memory chip 303 is fixed on the upper surface of the upper package substrate 301 in the upper package body 305, and a second upper package memory chip 303 is provided on the upper surface. There is a first upper package memory chip 302, a second upper package memory chip 303 and the first upper package memory chip 302 are bonded to the upper package substrate 301 through an upper package lead wire 304, and a heat conduction film 104 made of high thermal conductivity diamond material is placed on the high power chip. On the lower surface of 105, deionized water or liquid metal is used as the micro-spray cooling medium, which is pressurized and driven by the cooling pump 400, so that the deionized water or liquid metal flows into the micro-spray cavity 103 through the cooling medium inlet 111. In order to make the high-power When the chip 105 is working, the temperature distribution is uniform to avoid local hot spots. The micro-spray chamber 103 contains a partition 109, and there are several partition holes 110 on the partition. Deionized water or liquid metal passes through the holes and sprays evenly to The upper chamber plate of the micro-spray chamber body 103 absorbs the heat generated by the high-power chip 105. After the ionized water or liquid metal is heated and cooled, it flows back to the heat exchanger 500 from the cooling medium outlets 112 on both sides, and is heated by the heat exchanger 500 and the surrounding air. The convective heat exchange completes a cycle, and repeats the cycle so that the heat generated by the high-power chip 105 is continuously conducted to the heat exchanger 500, and finally transferred to the surrounding environment through air convection.

The heat dissipation structure of the present invention adopts the following steps during manufacture:

Making an organic substrate 101, and making three via holes on the organic substrate 101;

Make the micro-spray cavity body 103, the micro-spray cavity body 103 contains a partition 109, there are several partition plate through holes 110 on the partition plate 109, the micro-spray cavity body 103 includes two cooling medium outlets 112 and a cooling medium inlet 111 ;

Assembling the micro spray chamber body 103 on the upper surface of the organic substrate 101;

A thermally conductive film 104 made of a high thermally conductive diamond film is pasted on the surface of the micro spray chamber 103;

The high-power chip 105 is surface-attached on the heat-conducting film 104, and the wire 106 is bonded to the organic substrate 101;

The lower package body 107 is potted, heated and pressurized to cure, and the lower package body 107 plays a role of protecting the upper package lead 304;

Complete the interconnection of the PoP upper package 300 and the lower package 100;

Brush flux on the pads on the back of the organic substrate 101 in the lower package, plant the supporting balls 102 at the bottom of the BGA on the stencil, and reflow to form a PoP package;

Assembling the PoP package, the cooling pump 400 and the heat exchanger 500 on the same PCB;

Use the first connecting pipe 700 to connect the cooling medium inlet 111 in the PoP lower package 100 with the outlet of the cooling pump 400; use the third connecting pipe 900 to connect the cooling medium outlet 112 in the PoP lower package with the inlet of the heat exchanger 500 Get up; use the second connecting pipe 800 to connect the outlet of the heat exchanger 500 with the inlet of the cooling pump 400.

Claims (4)

1. the radiator structure for high-power logic chip PoP encapsulation, it is characterized in that: be welded with bottom support ball (102) at the upper surface of printed substrate (600), on bottom support ball (102), be provided with organic substrate (101), be fixed with lower floor's packaging body (107) at the upper surface of organic substrate (101), on lower floor's packaging body (107), offer linked hole (108), linked hole (108) runs through the upper and lower surface of lower floor's packaging body (107), in lower floor's packaging body (107), be provided with micro-spray chamber body (103), in the cavity plate of micro-spray chamber body (103), be provided with heat conduction film (104), cavity of resorption plate middle part at micro-spray chamber body (103) offers coolant entrance (111), offer coolant outlet (112) at the both ends, cavity of resorption plate left and right of micro-spray chamber body (103), be provided with double-deck encapsulation fulcrum ball (200) at the upper surface of lower floor's packaging body (107), on bilayer encapsulation fulcrum ball (200), be provided with upper layer package substrate (301), be fixed with upper strata packaging body (305) at the upper surface of upper layer package substrate (301), upper surface at the printed substrate (600) on described bottom support ball (102) right side is fixed with coolant pump (400), upper surface at the printed substrate (600) on coolant pump (400) right side is fixed with heat exchanger (500), between the outlet of coolant pump (400) and coolant entrance (111), be connected by the first connecting tube (700), the outlet of heat exchanger (500) is connected by the second connecting tube (800) with the entrance of coolant pump (400), and coolant outlet (112) is connected by the 3rd connecting tube (900) with the entrance of heat exchanger (500).

2. the radiator structure for high-power logic chip PoP encapsulation as claimed in claim 1, it is characterized in that: set up dividing plate (109) at the left plate of micro-spray chamber body (103) and the middle part of right plate, on dividing plate (109), offered dividing plate via hole (110).

3. the radiator structure for high-power logic chip PoP encapsulation as claimed in claim 1, is characterized in that: described the first connecting tube (700) gets around bottom support ball (102) with the 3rd connecting tube (900).

4. the radiator structure for high-power logic chip PoP encapsulation as claimed in claim 1, is characterized in that: described linked hole (108) is for conical, and large mouthful of linked hole (108) be upper, the osculum of linked hole (108) under.