CN206365219U - Boxlike heat radiating type radome and equipment - Google Patents
Boxlike heat radiating type radome and equipment Download PDFInfo
- Publication number
- CN206365219U CN206365219U CN201720077257.6U CN201720077257U CN206365219U CN 206365219 U CN206365219 U CN 206365219U CN 201720077257 U CN201720077257 U CN 201720077257U CN 206365219 U CN206365219 U CN 206365219U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- cover body
- support frame
- chip
- cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000741 silica gel Substances 0.000 claims abstract description 17
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims description 65
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000004945 silicone rubber Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Details Of Aerials (AREA)
Abstract
The utility model is related to technical field of electronic equipment, more particularly, to a kind of boxlike heat radiating type radome and equipment.To alleviate the bad technical problem that radiates of electronic apparatus system radome present in prior art.Including：Cover body, support frame and the heat radiation silica gel pad being detachably connected；In the assembled state, pcb board is located in the receiving space of cover body and support frame formation and is detachably connected with support frame；Chip is installed, heat radiation silica gel pad is covered on chip on pcb board, and abutted against with cover body top inner side face, for the heat transfer that produces chip to cover body.Due to the presence of heat radiation silica gel pad, the heat that the chip on pcb board is produced can be transferred to cover body by heat radiation silica gel pad, thus can be effectively improved the problem of radiating of existing electronic apparatus system radome is bad.
Description
Technical Field
The utility model belongs to the technical field of the electronic equipment technique and specifically relates to a box-like heat dissipation type shield cover and equipment are related to.
Background
The system structure of the electronic equipment is gradually complicated, the size of components in the system is small, the components are closely distributed, and the power consumption is increased, so that the application electromagnetic environment of the whole system is severe. To prevent electromagnetic interference, it is often necessary to house a shielding enclosure over the electronic equipment system.
The common shielding case comprises a support below the PCB and a cover body above the PCB, the support is welded with the PCB, holes are formed in the periphery of the support, salient points are processed at corresponding positions of the cover body, and the holes of the support and the salient points of the cover body are matched with each other to lock the support and the cover body. The shielding case with the shape and the structure has a larger gap between the component and the cover body, and because air is a poor conductor of heat, heat generated by the electronic component on the PCB is not easy to dissipate, and the service life of electronic equipment is further influenced.
Therefore, how to improve the problem of poor heat dissipation of the conventional electronic equipment system shield case is a technical problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a box-type heat dissipation type shield cover and equipment to alleviate the bad technical problem of heat dissipation of the electronic equipment system shield cover that exists among the prior art.
In order to solve the technical problem, the utility model provides a technical scheme lies in:
technical scheme 1's utility model provides a box-like heat dissipation type shield cover, include: the cover body, the support frame and the heat dissipation silica gel pad are detachably connected;
in an assembling state, the PCB is positioned in an accommodating space formed by the cover body and the support frame and is detachably connected with the support frame; the PCB board is provided with a chip, and the heat dissipation silica gel pad covers on the chip and is abutted against the inner side face of the top end of the cover body and used for transferring heat generated by the chip to the cover body.
In addition, the utility model of the technical proposal 2, on the basis of the technical proposal 1,
the cover body is provided with a bulge part used for pressing the heat dissipation silica gel pad towards the support frame at a position corresponding to the heat dissipation silica gel pad.
In addition, the utility model of the technical proposal 3, on the basis of the technical proposal 2,
the cover body is provided with a plurality of radiating tooth sheets which are arranged in parallel and protrude towards the outside of the cover body.
In addition, the utility model of claim 4, on the basis of claim 3,
the cover body is provided with a plurality of radiating tooth sheets which are arranged in parallel and protrude towards the outside of the cover body.
In addition, the utility model of claim 5, on the basis of claim 1,
the cover body is provided with a plurality of radiating tooth sheets which are arranged in parallel and protrude towards the outside of the cover body.
In addition, the utility model of the technical proposal 6, on the basis of the technical proposal 1,
the cover body and the support frame are fixed through a connecting mechanism.
In addition, the utility model of claim 7, on the basis of claim 6,
the connecting mechanism comprises a threaded hole formed in the side wall of the cover body in the vertical direction, a through hole formed in the support frame in a position corresponding to the threaded hole, and a screw penetrating through the through hole and the threaded hole to connect the cover body and the support frame.
In addition, the utility model of claim 8, on the basis of claim 1,
the shielding case is characterized in that side plates are arranged on two opposite sides of the case body, and a plurality of connecting holes used for fixing the shielding case on the case are formed in the side plates.
In addition, the utility model of claim 9, on the basis of claim 1,
the number of the through holes on the single side plate is at least two.
Technical scheme 10's utility model provides an including any one of above-mentioned technical scheme the equipment of box-type heat dissipation type shield cover still includes the PCB board and set up in chip on the PCB board.
To sum up, the utility model discloses the beneficial effect that can reach lies in:
because the utility model provides a box-type heat dissipation type shield cover, including the cover body, support frame and the heat dissipation silica gel pad that can dismantle the connection. In an assembling state, the PCB is positioned in an accommodating space formed by the cover body and the support frame and is detachably connected with the support frame; the PCB board is provided with a chip, and the heat dissipation silica gel pad covers the chip and is abutted against the inner side face of the top end of the cover body and used for transferring heat generated by the chip to the cover body. Due to the existence of the heat dissipation silica gel pad, heat generated by the chip on the PCB can be transferred to the cover body through the heat dissipation silica gel pad, so that the problem of poor heat dissipation of the shielding cover of the conventional electronic equipment system can be effectively solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic overall structural diagram of a box-type heat dissipation type shielding case according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a cassette heat dissipation type shielding case according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a support frame of a box-type heat dissipation shielding cover according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a cover body of a cassette heat dissipation type shielding case according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a PCB board of the box-type heat dissipation shielding case according to an embodiment of the present invention.
Icon: 100-a cover body; 200-a support frame; 300-heat dissipation silica gel pad; 110-heat dissipation fins; 501-a threaded hole; 502-a through hole; 503-screws; 120-side plate; 121-connecting hole; 600-a PCB board; 700-chip.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Embodiment 1 and embodiment 2 are described in detail below with reference to the accompanying drawings:
fig. 1 is a schematic overall structural diagram of a box-type heat dissipation type shielding case according to an embodiment of the present invention; fig. 2 is a cross-sectional view of a cassette heat dissipation type shielding case according to an embodiment of the present invention; fig. 3 is a schematic structural diagram of a support frame of a box-type heat dissipation shielding cover according to an embodiment of the present invention; fig. 4 is a schematic structural diagram of a cover body of a cassette heat dissipation type shielding case according to an embodiment of the present invention; fig. 5 is a schematic structural diagram of a PCB board of the box-type heat dissipation shielding case according to an embodiment of the present invention.
Example 1
Referring to fig. 1 to 5, the present embodiment provides a box-type heat dissipation shielding cover, including: the cover body 100, the support frame 200 and the heat dissipation silica gel pad 300 are detachably connected.
Wherein,
in an assembled state, the PCB 600 is located in the accommodating space formed by the cover 100 and the supporting bracket 200 and detachably connected to the supporting bracket 200; the chip 700 is mounted on the PCB 600, and the heat dissipation silicone pad 300 covers the chip 700 and abuts against the inner side surface of the top end of the cover body 100, so as to transfer heat generated by the chip 700 to the cover body 100. Due to the existence of the heat dissipation silicone rubber pad 300, heat generated by the chip 700 on the PCB 600 can be transferred to the cover body 100 through the heat dissipation silicone rubber pad 300, so that the problem of poor heat dissipation of the conventional shielding case of the electronic device system can be effectively solved.
In an alternative of this embodiment, it is preferable that a supporting member is provided to stably fix the heat-dissipating silicone rubber pad 300 on the PCB 600 above the chip 700.
More specifically:
the top holding assembly includes a plurality of positioning members disposed around the chip 700. The number of the positioning members may be, for example, four, which surround the periphery of the chip 700 and form a rectangular space. Of course, the number of positioning elements may also be provided as others, for example five, six. The space enclosed by the plurality of positioning members may also be configured according to the specific structure and shape of the chip 700.
As a modification of the above-mentioned positioning member, preferably, the positioning member is a positioning screw, and a plurality of positioning screws form a region for limiting the heat dissipation silicone pad 300. Or the positioning piece is arranged into a positioning stud, a positioning baffle, a limiting groove and the like.
In an alternative of this embodiment, the cover 100 is provided with a protrusion for pressing the heat-dissipating silicone pad 300 toward the supporting frame 200 at a position corresponding to the heat-dissipating silicone pad 300.
In an alternative embodiment, the cover 100 is provided with a plurality of heat dissipation fins 110 arranged in parallel and protruding toward the outside of the cover 100. Preferably, the plurality of heat dissipation fins 110 located at the upper portion of the housing 100 are vertically arranged at equal intervals. Preferably, the plurality of heat dissipation fins 110 on both sides of the cover 100 are horizontally arranged at equal intervals.
The shape and structure of the cover 100 is further described below:
referring to fig. 4, the cover body 100 includes a top surface, a first side surface, a second side surface, a third side surface and a fourth side surface, the first side surface, the second side surface, the third side surface and the fourth side surface extend from an edge of the top surface to the direction of the supporting frame 200 to form a box-shaped structure for accommodating the PCB 600, and the first side surface is opposite to the third side surface, and the second side surface is opposite to the fourth side surface.
In an alternative of this embodiment, in order to achieve good heat dissipation of the cover 100, a plurality of heat dissipation fins 110 arranged in parallel and protruding toward the outside of the cover 100 are provided on the cover 100. The plurality of heat dissipation fins 110 are arranged to form a plurality of parallel groove structures. The above-mentioned parallel arrangement of the plurality of heat dissipation fins 110 is helpful to increase the heat dissipation area and improve the heat dissipation effect.
In the above alternative, the material of the heat dissipation fins 110 is preferably aluminum, which is light and dissipates heat quickly.
In an alternative of this embodiment, in order to avoid components of the electronic device system, an avoiding channel may be provided on the side wall as needed. In order to achieve structural symmetry, the escape channels can be arranged on opposite sides. For example on the first side and the third side, respectively, or on the second side and the fourth side, respectively. The above-mentioned avoidance channel is preferably configured as a rectangular structure, and of course, other structures or forms of deformation of the rectangular avoidance channel should also be within the scope of the claimed invention.
In an alternative of this embodiment, in order to reinforce the overall strength of the cover body 100, reinforcing ribs are provided on the inner side surface of the top surface of the cover body 100.
The shape and structure of the supporting frame 200 are further described as follows:
referring to fig. 3, the supporting frame 200 is disposed at the lower portion of the cover body 100, and when the supporting frame 200 is in a matching state with the cover body 100, the supporting frame 200 and the cover body 100 form a closed box-shaped structure. In order to adapt to the cover body 100, the supporting frame 200 is provided with a connecting plate at a position corresponding to the avoiding channel, the connecting plate is provided with a plurality of holes for avoiding the electronic components, and the hole opening form of the holes can be set according to specific components.
Further, when the cover 100 is configured as a rectangular structure, the supporting frame 200 is configured as a rectangular structure, and when the cover 100 is configured as another structure, the supporting frame 200 is configured as a corresponding shape structure.
The following describes the connection mechanism for fixing the cover 100 and the supporting frame 200 in detail:
referring to fig. 2, the connection mechanism includes a threaded hole 501 formed in a sidewall of the cover 100 along a vertical direction, a through hole 502 formed in the support 200 at a position opposite to the threaded hole 501, and a screw 503 passing through the through hole 502 and the threaded hole 501 to connect the cover 100 and the support 200. The above-described connection means may be provided at four corners of the shield case, and of course, the connection means may be provided at other positions, for example, at the midpoint of the bottom edge of each side surface, in order to more stably fix the cassette type heat sink shield case.
As a further variation of the above-mentioned connection mechanism, the connection mechanism includes a groove formed in the vertical direction of the side wall of the cover body, a projection provided on the support frame 200 and extending into the groove, and a locking screw 503 for fixing the projection and the groove in the horizontal direction.
As a variation of the above-mentioned another structure form of the connecting mechanism, the connecting mechanism includes a snap member and a mating member used in cooperation with the snap member.
It will be understood by those skilled in the art that other variations in the structure and form of the connecting mechanism without departing from the spirit of the invention are also within the scope of the invention as claimed.
The beneficial effect that coupling mechanism can reach above-mentioned lies in: the cover 100 and the supporting frame 200 are connected by a connecting mechanism, and the cover 100 and the supporting frame 200 are detachable according to the structural form of the connecting mechanism. The problem of deformation of the shield can caused during removal of the conventional shield can thus be avoided.
The following detailed description of the fixing mode of the technical scheme and the case of the present invention is as follows:
the cover 100 is provided at opposite sides thereof with side plates 120, and the side plates 120 extend outwardly parallel to the top end of the cover 100. The side plate 120 is provided with a plurality of connection holes 121 for fixing the shield case to the chassis. The number of the connection holes 121 may be set according to circumstances, for example, two connection holes 121 are provided on the side plate 120 of one side, and the two connection holes 121 equally divide the side plate 120 into three equal parts in the length direction of the side plate 120. Of course, the number of the connection holes 121 may be set to be other.
Example 2
The present embodiment provides an apparatus including the cassette heat dissipation type shield case described in embodiment 1, further including a PCB 600 and a chip 700 disposed on the PCB 600.
The shape and structure of the PCB 600 are not limited to the following forms:
referring to fig. 5, in the manufacturing process, electronic components are usually soldered on the PCB 600 by using two processes, wave soldering and reflow soldering. The wave soldering aims at achieving the purpose of soldering by enabling the soldering surface of the plug-in board to be directly contacted with high-temperature liquid tin, the high-temperature liquid tin keeps an inclined surface, and the liquid tin forms a wave-like phenomenon by a special device. Reflow soldering is to heat air or nitrogen to a high enough temperature through an internal heating circuit of reflow soldering equipment, blow the heated air or nitrogen to a circuit board with a mounted component, and make solder on two sides of the component melt and then bond the solder with a mainboard. Typically, the interposer is soldered to the PCB 600 by wave soldering, and is soldered to the PCB 600 by reflow soldering during surface mounting.
With reference to embodiment 1, in an assembled state, the PCB 600 is located in the accommodating space formed by the cover 100 and the supporting frame 200 and detachably connected to the supporting frame 200; the chip 700 is mounted on the PCB 600, and the heat dissipation silicone pad 300 covers the chip 700 and abuts against the inner side surface of the top end of the cover body 100, so as to transfer heat generated by the chip 700 to the cover body 100. Due to the existence of the heat dissipation silicone rubber pad 300, heat generated by the chip 700 on the PCB 600 can be transferred to the cover body 100 through the heat dissipation silicone rubber pad 300, so that the problem of poor heat dissipation of the conventional shielding case of the electronic device system can be effectively solved.
Combine embodiment 1 and embodiment 2, can regard as, the utility model provides a shield cover easy dismounting, heat dispersion are good.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A box-type heat dissipation type shield case, comprising: the heat dissipation silicon rubber pad comprises a cover body (100), a support frame (200) and a heat dissipation silicon rubber pad (300), which are detachably connected;
in an assembled state, the PCB (600) is positioned in a containing space formed by the cover body (100) and the support frame (200) and is detachably connected with the support frame (200); install chip (700) on PCB board (600), heat dissipation silica gel pad (300) cover in on chip (700) to with cover body (100) top medial surface looks butt, be used for with the heat transfer that chip (700) produced extremely cover body (100).
2. The cassette heat dissipation type shield case according to claim 1,
the cover body (100) is provided with a protruding part used for pressing the heat dissipation silica gel pad (300) towards the support frame (200) at a position corresponding to the heat dissipation silica gel pad (300).
3. The cassette heat dissipation type shield case according to claim 1,
the cover body (100) is provided with a plurality of radiating fins (110) which are arranged in parallel and are arranged to protrude towards the outside of the cover body (100).
4. The cassette heat dissipation type shield case according to claim 3,
the plurality of heat dissipation tooth sheets (110) positioned at the upper part of the cover body (100) are vertically arranged and have equal intervals.
5. The cassette heat dissipation type shield case according to claim 3,
the plurality of heat dissipation tooth sheets (110) positioned on the two sides of the cover body (100) are horizontally arranged and have equal intervals.
6. The cassette heat dissipation type shield case according to claim 1,
the cover body (100) and the support frame (200) are fixed through a connecting mechanism.
7. The cassette heat dissipation type shield case according to claim 6,
the connecting mechanism comprises a threaded hole (501) formed in the side wall of the cover body (100) in the vertical direction, a through hole (502) formed in the support frame (200) in a position corresponding to the threaded hole (501), and a screw (503) penetrating through the through hole (502) and the threaded hole (501) to connect the cover body (100) and the support frame (200).
8. The cassette heat dissipation type shield case according to claim 1,
the shielding case is characterized in that side plates (120) are arranged on two opposite sides of the cover body (100), and a plurality of connecting holes (121) used for fixing the shielding case on the case are formed in the side plates (120).
9. The cassette heat dissipation shield of claim 8, wherein the number of through-holes (502) in a single side plate (120) is at least two.
10. A device comprising a cassette heat sink shield according to any of claims 1-9, further comprising a PCB board (600) and a chip (700) arranged on the PCB board (600).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720077257.6U CN206365219U (en) | 2017-01-20 | 2017-01-20 | Boxlike heat radiating type radome and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720077257.6U CN206365219U (en) | 2017-01-20 | 2017-01-20 | Boxlike heat radiating type radome and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206365219U true CN206365219U (en) | 2017-07-28 |
Family
ID=59379929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720077257.6U Expired - Fee Related CN206365219U (en) | 2017-01-20 | 2017-01-20 | Boxlike heat radiating type radome and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206365219U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529328A (en) * | 2017-01-20 | 2017-12-29 | 北京数码视讯科技股份有限公司 | Boxlike heat radiating type radome and equipment |
-
2017
- 2017-01-20 CN CN201720077257.6U patent/CN206365219U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529328A (en) * | 2017-01-20 | 2017-12-29 | 北京数码视讯科技股份有限公司 | Boxlike heat radiating type radome and equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170728 Termination date: 20200120 |