CN206161182U - Electronic components tests constant temperature system - Google Patents
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- 238000012360 testing method Methods 0.000 title claims abstract description 52
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- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000005057 refrigeration Methods 0.000 description 3
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Abstract
本实用新型涉及电子元器件技术领域，特别涉及一种电子元器件测试恒温系统。包括：制冷片、导热平台、加热片、温度传感器、夹具、电源及控制单元；导热平台的一侧设置有制冷片，另一侧设置有加热片；温度传感器设置在导热平台上，并与控制单元连接；夹具设置在导热平台上，夹具用于固定电子元器件；电源与制冷片及加热片连接；控制单元与制冷片及加热片连接，控制制冷片及加热片工作。本实用新型提供的电子元器件测试恒温系统，提高了电子元器件的高低温测试效率，提高了电子元器件测试精度，减少了测试误差。
The utility model relates to the technical field of electronic components, in particular to a constant temperature system for testing electronic components. Including: refrigerating sheet, heat conduction platform, heating sheet, temperature sensor, fixture, power supply and control unit; one side of the heat conduction platform is provided with a refrigerating sheet, and the other side is provided with a heating sheet; The unit is connected; the fixture is set on the heat conduction platform, and the fixture is used to fix the electronic components; the power supply is connected to the cooling sheet and the heating sheet; the control unit is connected to the cooling sheet and the heating sheet to control the operation of the cooling sheet and the heating sheet. The electronic component test constant temperature system provided by the utility model improves the high and low temperature test efficiency of the electronic component, improves the test accuracy of the electronic component, and reduces the test error.
Description
技术领域technical field
本实用新型涉及电子元器件技术领域，特别涉及一种电子元器件测试恒温系统。The utility model relates to the technical field of electronic components, in particular to a constant temperature system for testing electronic components.
背景技术Background technique
电子元器件的高低温测试是验证电子元器件可靠性筛选测试之一，因此电子元器件高低温测试显得尤为重要，现在常用的测试方法为把电子元器件放入高温烘箱或者冰箱后移位测量。由于采用移位测试，在电子元器件从冰箱或烘箱取出移动中温度会发生变化，导致测试结果产生误差。如果将一批电子元器件一起放入烘箱，在每次烘箱开启后烘箱温度会发生变化需要再次等待时间，效率很低。另一种检测方式是采用热流罩加热检测，现在的热流罩只有加热功能，并且在电子元器件放入热流罩中后电子元器件的实时温度不能实时监测，电子元器件在热流罩中由室温变为测试温度需要等待时间，使测试效率降低。The high and low temperature test of electronic components is one of the screening tests to verify the reliability of electronic components, so the high and low temperature test of electronic components is particularly important. Now the commonly used test method is to measure the displacement of electronic components after they are placed in a high temperature oven or refrigerator . Due to the displacement test, the temperature will change when the electronic components are taken out of the refrigerator or oven, resulting in errors in the test results. If a batch of electronic components are put into the oven together, the temperature of the oven will change every time the oven is turned on, requiring another waiting time, and the efficiency is very low. Another detection method is to use a heat flow hood for heating detection. The current heat flow hood only has a heating function, and the real-time temperature of the electronic components cannot be monitored in real time after the electronic components are placed in the heat flow hood. It takes a waiting time to change to the test temperature, which reduces the test efficiency.
实用新型内容Utility model content
本实用新型通过提供一种电子元器件测试恒温系统，解决了现有技术中电子元器件高低温测试效率低、误差大的技术问题，实现了测试温度的准确、快速调控，降低了电子元器件高低温测试误差、提高了电子元器件高低温测试效率。本实用新型提供了一种电子元器件测试恒温系统，包括：制冷片、导热平台、加热片、温度传感器、夹具、电源及控制单元；The utility model solves the technical problems of low efficiency and large error in high and low temperature testing of electronic components in the prior art by providing a constant temperature system for testing electronic components, realizes accurate and rapid control of the test temperature, and reduces the temperature of electronic components. The high and low temperature test error improves the high and low temperature test efficiency of electronic components. The utility model provides a constant temperature system for testing electronic components, comprising: a cooling sheet, a heat conduction platform, a heating sheet, a temperature sensor, a fixture, a power supply and a control unit;
所述导热平台的一侧设置有所述制冷片，另一侧设置有所述加热片；One side of the heat conduction platform is provided with the cooling sheet, and the other side is provided with the heating sheet;
所述温度传感器设置在所述导热平台上，并与所述控制单元连接；所述夹具设置在所述导热平台上，所述夹具用于固定电子元器件；The temperature sensor is set on the heat conduction platform and connected to the control unit; the clamp is set on the heat conduction platform, and the clamp is used to fix electronic components;
所述电源与所述制冷片及所述加热片连接；The power supply is connected to the refrigerating sheet and the heating sheet;
所述控制单元与所述制冷片及所述加热片连接，控制所述制冷片及所述加热片工作。The control unit is connected with the cooling chip and the heating chip, and controls the operation of the cooling chip and the heating chip.
进一步地，还包括：散热片；所述散热片的一侧与所述加热片贴合。Further, it also includes: a cooling fin; one side of the cooling fin is attached to the heating sheet.
进一步地，还包括：散热风扇；所述散热风扇与所述散热片的另一侧连接。Further, it also includes: a cooling fan; the cooling fan is connected to the other side of the cooling fin.
进一步地，所述温度传感器的测温头与所述电子元器件相接触。Further, the temperature measuring head of the temperature sensor is in contact with the electronic components.
进一步地，所述制冷片为半导体制冷片。Further, the cooling chip is a semiconductor cooling chip.
进一步地，所述加热片为PTC加热片。Further, the heating sheet is a PTC heating sheet.
本实用新型提供的一种或多种技术方案，至少具备以下有益效果或优点：One or more technical solutions provided by the utility model have at least the following beneficial effects or advantages:
本实用新型提供的电子元器件测试恒温系统，通过温度传感器实时测量测试温度，将测试温度上传至控制单元，控制单元实时控制制冷片及加热片工作，降温及升温速度快，提高了电子元器件的高低温测试效率。本实用新型提供的电子元器件测试恒温系统，控制单元实时控制制冷片及加热片工作，能够动态的将测试温度值维持在所需的区间内，提高了电子元器件测试精度，减少了测试误差。The constant temperature system for testing electronic components provided by the utility model measures the test temperature in real time through a temperature sensor, uploads the test temperature to the control unit, and the control unit controls the work of the refrigeration sheet and the heating sheet in real time, and the cooling and heating speed is fast, which improves the temperature of the electronic components. High and low temperature test efficiency. The electronic component testing constant temperature system provided by the utility model, the control unit controls the work of the cooling chip and the heating chip in real time, and can dynamically maintain the test temperature value in the required interval, which improves the testing accuracy of the electronic component and reduces the test error .
附图说明Description of drawings
图1为本实用新型实施例提供的电子元器件测试恒温系统结构示意图；Fig. 1 is a schematic structural diagram of an electronic component testing constant temperature system provided by an embodiment of the present invention;
图2为图1的主视图；Fig. 2 is the front view of Fig. 1;
图3为图2的左视图；Fig. 3 is the left view of Fig. 2;
图4为图2的后视图。FIG. 4 is a rear view of FIG. 2 .
具体实施方式detailed description
本实用新型实施例通过提供一种电子元器件测试恒温系统，解决了现有技术中电子元器件高低温测试效率低、误差大的技术问题，实现了测试温度的准确、快速调控，降低了电子元器件高低温测试误差、提高了电子元器件高低温测试效率。The embodiment of the utility model provides a constant temperature system for testing electronic components, which solves the technical problems of low efficiency and large errors in the high and low temperature testing of electronic components in the prior art, realizes accurate and rapid control of the test temperature, and reduces the electronic components. The high and low temperature test error of components improves the high and low temperature test efficiency of electronic components.
参见图1-图4，本实用新型提供了一种电子元器件测试恒温系统，包括：散热风扇1、散热片2、制冷片3、导热平台5、导热平台5、温度传感器7、夹具4、电源及控制单元。Referring to Fig. 1-Fig. 4, the utility model provides a constant temperature system for testing electronic components, including: cooling fan 1, cooling fin 2, cooling fin 3, heat conduction platform 5, heat conduction platform 5, temperature sensor 7, fixture 4, Power supply and control unit.
参见图1-图4，导热平台5的一侧设置有制冷片3，另一侧设置有加热片6；温度传感器7设置在导热平台5上，并与控制单元连接；温度传感器7用于实时探测电子元器件温度。夹具4设置在导热平台5上，夹具4用于固定电子元器件。电源与制冷片3及加热片6连接，电源为制冷片3及加热片6供电；控制单元与制冷片3及加热片6连接，控制制冷片3及加热片6工作。Referring to Figures 1-4, one side of the heat conduction platform 5 is provided with a cooling plate 3, and the other side is provided with a heating plate 6; the temperature sensor 7 is provided on the heat conduction platform 5 and connected to the control unit; the temperature sensor 7 is used for real-time Detect the temperature of electronic components. The jig 4 is arranged on the heat conduction platform 5, and the jig 4 is used for fixing electronic components. The power supply is connected to the cooling sheet 3 and the heating sheet 6, and the power supply supplies power to the cooling sheet 3 and the heating sheet 6; the control unit is connected to the cooling sheet 3 and the heating sheet 6, and controls the cooling sheet 3 and the heating sheet 6 to work.
散热片2的一侧与加热片6贴合，散热风扇1与散热片2的另一侧连接。One side of the heat sink 2 is bonded to the heat sink 6 , and the cooling fan 1 is connected to the other side of the heat sink 2 .
温度传感器7的测温头与电子元器件相接触，用于实时探测电子元器件温度。The temperature measuring head of the temperature sensor 7 is in contact with the electronic components, and is used to detect the temperature of the electronic components in real time.
制冷片3为半导体制冷片。The cooling chip 3 is a semiconductor cooling chip.
加热片6为PTC加热片。The heating sheet 6 is a PTC heating sheet.
下面结合具体的实施例对本实用新型提供的电子元器件测试恒温系统进行说明：The electronic component testing constant temperature system provided by the utility model is described below in conjunction with specific embodiments:
参见图1-图4，本实施例提供了一种电子元器件测试恒温系统，包括：散热风扇1、散热片2、制冷片3、导热平台5、加热片6、温度传感器7、夹具4、电源及控制单元。导热平台5的一侧设置有半导体制冷片3，另一侧设置有PTC加热片。导热平台5上设置有温度传感器7，温度传感器7与控制单元连接。导热平台5上设置有夹具4。电源与半导体制冷片3及PTC加热片连接。控制单元与半导体制冷片3及PTC加热片连接，控制半导体制冷片3及PTC加热片工作。散热片2的一侧与PTC加热片贴合，散热风扇1与散热片2的另一侧连接。温度传感器7的测温头与电子元器件相接触。Referring to Figures 1-4, this embodiment provides a constant temperature system for testing electronic components, including: cooling fan 1, cooling fin 2, cooling fin 3, heat conduction platform 5, heating fin 6, temperature sensor 7, fixture 4, Power supply and control unit. One side of the heat conduction platform 5 is provided with a semiconductor cooling chip 3 , and the other side is provided with a PTC heating chip. A temperature sensor 7 is arranged on the heat conduction platform 5, and the temperature sensor 7 is connected with the control unit. A fixture 4 is arranged on the heat conduction platform 5 . The power supply is connected with the semiconductor cooling sheet 3 and the PTC heating sheet. The control unit is connected with the semiconductor cooling chip 3 and the PTC heating chip, and controls the semiconductor cooling chip 3 and the PTC heating chip to work. One side of the cooling fin 2 is attached to the PTC heating sheet, and the cooling fan 1 is connected to the other side of the cooling fin 2 . The temperature measuring head of the temperature sensor 7 is in contact with the electronic components.
本实施例提供的电子元器件测试恒温系统的工作过程如下：参见图1-图4，电子元器件进行升降温测试时，控制单元采集温度传感器7上传的实时温度数据，在控制单元内设置目标温度数据，当实时温度数据大于目标温度数据时，控制单元控制半导体制冷片3工作，当实时温度数据等于目标温度数据时，控制半导体制冷片3停止工作。当实时温度数据大于目标温度数据时，控制单元控制PTC加热片工作，当实时温度数据等于目标温度数据时，控制PTC加热片停止工作。The working process of the constant temperature system for testing electronic components provided in this embodiment is as follows: Referring to Fig. 1-Fig. For temperature data, when the real-time temperature data is greater than the target temperature data, the control unit controls the semiconductor refrigeration sheet 3 to work, and when the real-time temperature data is equal to the target temperature data, controls the semiconductor refrigeration sheet 3 to stop working. When the real-time temperature data is greater than the target temperature data, the control unit controls the PTC heater to work, and when the real-time temperature data is equal to the target temperature data, controls the PTC heater to stop working.
参见图1-图4，本实用新型提供的电子元器件测试恒温系统，通过温度传感器7实时测量测试温度，将测试温度上传至控制单元，控制单元实时控制制冷片3及加热片6工作，降温及升温速度快，提高了电子元器件的高低温测试效率。本实用新型提供的电子元器件测试恒温系统，控制单元实时控制制冷片3及加热片6工作，能够动态的将测试温度值维持在所需的区间内，提高了电子元器件测试精度，减少了测试误差。Referring to Fig. 1-Fig. 4, the constant temperature system for testing electronic components provided by the utility model measures the test temperature in real time through the temperature sensor 7, uploads the test temperature to the control unit, and the control unit controls the work of the cooling plate 3 and the heating plate 6 in real time to cool down And the heating speed is fast, which improves the high and low temperature test efficiency of electronic components. In the constant temperature system for testing electronic components provided by the utility model, the control unit controls the work of the cooling sheet 3 and the heating sheet 6 in real time, and can dynamically maintain the test temperature value within the required interval, which improves the testing accuracy of electronic components and reduces the test error.
最后所应说明的是，以上具体实施方式仅用以说明本实用新型的技术方案而非限制，尽管参照实例对本实用新型进行了详细说明，本领域的普通技术人员应当理解，可以对本实用新型的技术方案进行修改或者等同替换，而不脱离本实用新型技术方案的精神和范围，其均应涵盖在本实用新型的权利要求范围当中。Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present utility model without limitation. Although the utility model has been described in detail with reference to examples, those of ordinary skill in the art should understand that the utility model can be Modifications or equivalent replacements of the technical solutions without departing from the spirit and scope of the technical solutions of the utility model shall be covered by the claims of the utility model.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109596973A (en) * | 2018-12-29 | 2019-04-09 | 北京智芯微电子科技有限公司 | The test method of chip parameter under different temperatures |
| CN110260985A (en) * | 2019-05-07 | 2019-09-20 | 重庆全营紧固件有限公司 | A kind of novel catalyst carrier new material equipment |
| CN110262590A (en) * | 2019-06-13 | 2019-09-20 | 深圳市燕麦科技股份有限公司 | A kind of temperature equipment for circuit board testing |
| CN111708390A (en) * | 2020-07-09 | 2020-09-25 | 南京铁道职业技术学院 | IoT chip thermostat |
| CN113467546A (en) * | 2021-07-26 | 2021-10-01 | 珠海格力电器股份有限公司 | Temperature control method and device and temperature measurement box |
-
2016
- 2016-10-18 CN CN201621133274.9U patent/CN206161182U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109596973A (en) * | 2018-12-29 | 2019-04-09 | 北京智芯微电子科技有限公司 | The test method of chip parameter under different temperatures |
| CN110260985A (en) * | 2019-05-07 | 2019-09-20 | 重庆全营紧固件有限公司 | A kind of novel catalyst carrier new material equipment |
| CN110262590A (en) * | 2019-06-13 | 2019-09-20 | 深圳市燕麦科技股份有限公司 | A kind of temperature equipment for circuit board testing |
| CN111708390A (en) * | 2020-07-09 | 2020-09-25 | 南京铁道职业技术学院 | IoT chip thermostat |
| CN113467546A (en) * | 2021-07-26 | 2021-10-01 | 珠海格力电器股份有限公司 | Temperature control method and device and temperature measurement box |
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