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CN205979632U - Integrated LED lamp - Google Patents

Integrated LED lamp Download PDF

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Publication number
CN205979632U
CN205979632U CN201620703935.0U CN201620703935U CN205979632U CN 205979632 U CN205979632 U CN 205979632U CN 201620703935 U CN201620703935 U CN 201620703935U CN 205979632 U CN205979632 U CN 205979632U
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light source
source board
lamp
lamp housing
integrated led
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Inventor
李琛
林运南
鲍永均
陈小波
傅明燕
李大强
王家鑫
黄温昌
张桂堂
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Leedarson Lighting Co Ltd
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Leedarson Lighting Co Ltd
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Abstract

The utility model discloses an integration LED lamp, including light source board and insulating non-light tight lamp body, wherein be equipped with a plurality of LED light emitting module on the light source board, the lamp body is integrated into one piece and direct cladding in the light source board outside. The lamp body is made by heat dissipation material, and LED light emitting module and lamp body hot link to it directly dispels the heat through the lamp body to generate heat in enabling LED light emitting module work, need not additionally to set up the radiating piece, and the radiating effect is good, and through integrated into one piece's direct cladding outside the light source board, compact structure, and simple process has simplified the assembly step.

Description

一体化LED灯Integrated LED light

技术领域technical field

本实用新型涉及LED领域,特别是涉及一体化LED灯。The utility model relates to the field of LEDs, in particular to an integrated LED lamp.

背景技术Background technique

现有的LED灯包括灯板、驱动电路板、散热件、外壳等结构,灯板、驱动电路板及散热件等元件连接组装后再装设于外壳中,外壳往往是上下盖板通过卡接、螺丝紧固或胶粘等方式装接固定,从而完成整灯装配。装配过程较为复杂,生产加工时间长,生产效率较低。此外,由于LED工作过程中发热严重,而上述装配形成的LED灯,热量集中于外壳之内,难以对外散热,内部温度较高而容易导致失效,因而需要额外设置散热件,增加了原材成本及装配复杂度。Existing LED lamps include structures such as a lamp board, a driving circuit board, a heat sink, and a housing. The components such as the lamp board, the driving circuit board, and the heat sink are connected and assembled before being installed in the housing. , screw fastening or gluing, etc., to complete the assembly of the whole lamp. The assembly process is relatively complicated, the production and processing time is long, and the production efficiency is low. In addition, due to the serious heat generation of the LED during operation, and the LED lamp formed by the above-mentioned assembly, the heat is concentrated in the outer casing, it is difficult to dissipate heat to the outside, and the internal temperature is high, which may easily lead to failure. Therefore, additional heat sinks are required, which increases the cost of raw materials. and assembly complexity.

实用新型内容Utility model content

本实用新型提供了一种一体化LED灯,其克服了现有技术的LED灯所存在的不足之处。The utility model provides an integrated LED lamp, which overcomes the disadvantages of the LED lamp in the prior art.

本实用新型解决其技术问题所采用的技术方案是:一种一体化LED灯包括光源板和绝缘透光的灯壳,其中光源板上设有若干LED发光模块,灯壳是一体成型的并直接包覆于光源板外部。灯壳由散热材料制成,LED发光模块与灯壳热连接。The technical solution adopted by the utility model to solve the technical problem is: an integrated LED lamp includes a light source board and an insulating and light-transmitting lamp housing, wherein a number of LED light-emitting modules are arranged on the light source board, and the lamp housing is integrally formed and directly Wrapped on the outside of the light source board. The lamp housing is made of heat-dissipating material, and the LED light-emitting module is thermally connected with the lamp housing.

相较于现有技术,本实用新型的一体化LED灯,灯壳是通过一体成型并与光源板相匹配的直接包覆于光源板上,装配操作简单,极大的缩短了生产加工时间,大大提高了生产效率。得到的整灯结构紧凑简单,且可以通过灯壳直接向外界散热,通过空气对流传热,散热效果好,无需额外设置散热件,进一步简化了结构。Compared with the prior art, the integrated LED lamp of the present utility model, the lamp shell is directly coated on the light source plate through integral molding and matched with the light source plate, the assembly operation is simple, and the production and processing time is greatly shortened. Greatly improved production efficiency. The obtained whole lamp has a compact and simple structure, and can directly dissipate heat to the outside through the lamp housing, and conduct heat through air convection, so that the heat dissipation effect is good, and no additional heat dissipation parts are required, which further simplifies the structure.

以下结合附图及实施例对本实用新型作进一步详细说明;但本实用新型的一体化LED灯不局限于实施例。The utility model will be described in further detail below in conjunction with the accompanying drawings and embodiments; however, the integrated LED lamp of the utility model is not limited to the embodiments.

附图说明Description of drawings

图1是本实用新型第一实施例LED灯的分解结构示意图;Fig. 1 is a schematic diagram of the exploded structure of the LED lamp of the first embodiment of the present invention;

图2是本实用新型第一实施例LED灯的整体结构示意图;Fig. 2 is a schematic diagram of the overall structure of the LED lamp of the first embodiment of the present invention;

图3是本实用新型第二实施例LED灯的分解结构示意图;Fig. 3 is a schematic diagram of the exploded structure of the LED lamp of the second embodiment of the present invention;

图4是本实用新型第二实施例LED灯的整体结构示意图;Fig. 4 is a schematic diagram of the overall structure of the LED lamp of the second embodiment of the present invention;

图5是本实用新型第三实施例LED灯的分解结构示意图;Fig. 5 is a schematic diagram of an exploded structure of an LED lamp according to a third embodiment of the present invention;

图6是本实用新型第三实施例LED灯的整体结构示意图。Fig. 6 is a schematic diagram of the overall structure of the LED lamp according to the third embodiment of the present invention.

具体实施方式detailed description

实施例1Example 1

参考图1至图2,一体化LED灯100包括光源板110和绝缘透光的灯壳120。光源板110上设有若干LED发光模块111。灯壳120一体成型并直接包覆于光源板110外部。灯壳由散热材料制成,该些LED发光模块111与灯壳120热连接,以能使LED发光模块工作中发热直接通过灯壳120进行散热。Referring to FIG. 1 to FIG. 2 , the integrated LED lamp 100 includes a light source board 110 and an insulating and transparent lamp housing 120 . Several LED lighting modules 111 are disposed on the light source board 110 . The lamp housing 120 is integrally formed and directly covers the outside of the light source board 110 . The lamp housing is made of heat-dissipating materials, and the LED light emitting modules 111 are thermally connected to the lamp housing 120 so that the LED light emitting modules can heat up during operation and directly dissipate heat through the lamp housing 120 .

光源板110上还设有用于插入外部灯座的两个输入端子130。两个输入端子130的一端与该些LED发光模块111电连接,另一端延伸出灯壳120之外,灯壳120一体包覆两个输入端子130与LED发光模块111连接的一端。具体的,两个输入端子130是装设于光源板110一末端具有一定间距的两个金属引脚,光源板110上设有两个连接孔112,两个输入端子130的一端分别固定在连接孔112内。根据金属引脚间的间距大小形成G4或G9型号的灯。The light source board 110 is also provided with two input terminals 130 for inserting into an external lamp socket. One end of the two input terminals 130 is electrically connected to the LED lighting modules 111 , and the other end extends out of the lamp housing 120 . The lamp housing 120 integrally covers one end of the two input terminals 130 connected to the LED lighting modules 111 . Specifically, the two input terminals 130 are two metal pins mounted on one end of the light source board 110 with a certain distance. Inside the hole 112. Form G4 or G9 type lamps according to the spacing between the metal pins.

光源板110上还设有驱动模块113,驱动模块113与LED发光模块111及输入端子130电连接以用于驱动LED发光模块111,灯壳120一体覆盖驱动模块113。将驱动模块113设置于光源板110上实现光电一体化,省却了电路板,简化了结构,装配过程更为简单。The light source board 110 is further provided with a driving module 113 , the driving module 113 is electrically connected with the LED light emitting module 111 and the input terminal 130 for driving the LED light emitting module 111 , and the lamp housing 120 covers the driving module 113 integrally. The drive module 113 is arranged on the light source board 110 to realize optoelectronic integration, which saves the circuit board, simplifies the structure, and makes the assembly process simpler.

进一步,光源板110是印刷线路板(PCB),各部件通过PCB实现电路布置及电性连接。该些LED发光模块111分设于PCB相对的两面上以实现全范围发光。Further, the light source board 110 is a printed circuit board (PCB), and various components realize circuit layout and electrical connection through the PCB. The LED light emitting modules 111 are respectively arranged on two opposite sides of the PCB to realize full-range light emission.

灯壳120通过吸塑工艺包覆于光源板110外部。具体的,将光源板110固定于机台上,备好一定厚度的PC板材,将PC板材加热变软后采用真空吸附于光源板110表面,冷却后定型并包覆附着于光源板110表面,由于灯壳120直接以光源板110为模板进行吸塑成型,外观上具有与光源板110及其上的LED发光模块111和驱动模块113相应的凹凸结构,从而实现了与LED发光模块111的紧密结合,实现了热传导。The lamp housing 120 is covered on the outside of the light source board 110 through a blister process. Specifically, fix the light source board 110 on the machine, prepare a PC board with a certain thickness, heat and soften the PC board, and then use vacuum adsorption on the surface of the light source board 110, after cooling, shape it and cover it on the surface of the light source board 110, Since the lamp housing 120 is directly molded with the light source board 110 as a template, it has a concave-convex structure corresponding to the light source board 110 and the LED light emitting module 111 and the driving module 113 on the appearance, thereby achieving a close connection with the LED light emitting module 111. Combined, heat conduction is achieved.

实施例2Example 2

参考图3至图4,一体化LED灯200包括光源板210和绝缘透光的灯壳220。光源板210上设有若干LED发光模块211。灯壳220一体成型并直接包覆于光源板210外部。灯壳由散热材料制成,该些LED发光模块211与灯壳220热连接,以能使LED发光模块工作中发热直接通过灯壳220进行散热。Referring to FIG. 3 to FIG. 4 , the integrated LED lamp 200 includes a light source board 210 and an insulating and light-transmitting lamp housing 220 . Several LED lighting modules 211 are disposed on the light source board 210 . The lamp housing 220 is integrally formed and directly covers the outside of the light source board 210 . The lamp housing is made of heat-dissipating materials, and the LED light-emitting modules 211 are thermally connected to the lamp housing 220 so that the LED light-emitting modules generate heat during operation and directly dissipate heat through the lamp housing 220 .

本实施例的一体化LED灯200还包括灯头230,灯壳220底部一体连接设有连接部221,灯头230固定在连接部221上。光源板210的末端还包括导电部212,导电部212伸出灯壳220之外并容置于灯头230。导电部212与灯头230电连接,例如可以通过连接线等进行连接,以使灯头外接电源时为LED发光模块211供电。The integrated LED lamp 200 of this embodiment further includes a lamp base 230 , the bottom of the lamp housing 220 is integrally connected with a connecting portion 221 , and the lamp base 230 is fixed on the connecting portion 221 . The end of the light source board 210 further includes a conductive part 212 , and the conductive part 212 extends out of the lamp housing 220 and is accommodated in the lamp holder 230 . The conductive part 212 is electrically connected to the lamp base 230 , for example, through a connecting wire, so that the lamp base supplies power to the LED light emitting module 211 when the lamp base is connected to an external power source.

该一体化LED灯200是一字灯,光源板210是灯泡状平板结构,包括为过半圆形的圆板部210a及由圆板部210a向下延伸收窄形成的柄部210b,LED发光模块211间隔排列于圆板部210a的周缘,导电部212设置在柄部210b上。光源板210上还设有驱动模块213,驱动模块213与LED发光模块211及导电部212电连接以用于驱动LED发光模块211,灯壳220一体覆盖驱动模块213。The integrated LED lamp 200 is a straight lamp, the light source board 210 is a light bulb-shaped flat plate structure, including a circular plate portion 210a that is over semicircular and a handle portion 210b formed by extending and narrowing the circular plate portion 210a downwards, and the LED light emitting module 211 are arranged at intervals on the periphery of the disc portion 210a, and the conductive portion 212 is disposed on the handle portion 210b. The light source board 210 is further provided with a driving module 213 , the driving module 213 is electrically connected with the LED light emitting module 211 and the conductive part 212 for driving the LED light emitting module 211 , and the lamp housing 220 covers the driving module 213 integrally.

进一步,光源板210是印刷线路板(PCB),各部件通过PCB实现电路布置及电性连接。该些LED发光模块211分设于PCB相对的两面上以实现全范围发光。Further, the light source board 210 is a printed circuit board (PCB), and various components realize circuit layout and electrical connection through the PCB. The LED light emitting modules 211 are respectively arranged on two opposite sides of the PCB to realize full-range light emission.

灯壳220通过注塑工艺包覆于光源板210外部。具体的,LED发光模块211采用抗高温的不熔性光源,将光源板210置于机台的模具中,直接向模具中注入熔融塑料,冷却定型后即形成灯壳220。通过模具的设计,可使形成的灯壳220于光源板210与灯头230装配处形成连接部221,以实现光源板210与灯头230的固定。相对于吸塑工艺,注塑工艺亦是以光源板210为内表面的模板,形成的灯壳220与光源板210及其上部件紧密结合从而实现热传导。通过模具的设计,可以使其具有预设的特殊外观,便于形成其他结构件,例如形成上述连接部。The lamp housing 220 is covered on the outside of the light source board 210 through injection molding process. Specifically, the LED light-emitting module 211 uses a high-temperature-resistant infusible light source. The light source board 210 is placed in a mold of the machine, and molten plastic is directly injected into the mold, and the lamp housing 220 is formed after cooling and shaping. Through the design of the mould, the formed lamp housing 220 can form a connecting portion 221 at the assembly place of the light source board 210 and the lamp holder 230 , so as to realize the fixing of the light source board 210 and the lamp holder 230 . Compared with the blister process, the injection molding process also uses the light source plate 210 as the template on the inner surface, and the formed lamp housing 220 is closely combined with the light source plate 210 and its upper parts to realize heat conduction. Through the design of the mold, it can have a preset special appearance, which is convenient for forming other structural parts, such as forming the above-mentioned connection part.

实施例3Example 3

参考图5至图6,与实施例1的差别在于,本实施例的输入端子312是一体连接于光源板310底部并具有一定间距的两外凸部,两外凸部的自由端伸出灯壳320之外。其余结构及相互关系参考实施例1,在此不加以赘述。Referring to Figures 5 to 6, the difference from Embodiment 1 is that the input terminal 312 of this embodiment is integrally connected to the bottom of the light source board 310 and has two convex parts with a certain distance, and the free ends of the two convex parts protrude out of the lamp. Shell 320 outside. Refer to Embodiment 1 for other structures and interrelationships, and details are not repeated here.

灯壳320包覆于光源板310外部的工艺参考实施例2,不加以赘述。制得说明的是,通过注塑模具的设计,亦可使灯壳320外观上具有特殊的构造,例如在对应LED发光模块311的分布中心设置一环状部321以增加美观性。The process of wrapping the lamp housing 320 on the outside of the light source board 310 refers to Embodiment 2, and no further description is given. It should be noted that through the design of the injection mold, the lamp housing 320 can also have a special structure in appearance, for example, an annular portion 321 is provided at the distribution center corresponding to the LED light emitting modules 311 to enhance the aesthetics.

上述实施例中,光源板优选为LED发光模块可以是LED芯片,也可以是封装好的LED灯珠,由驱动模块驱动。灯壳所用绝缘透光材料可由例如聚碳酸酯、聚苯乙烯、聚甲基丙烯酸甲酯、聚丙烯或硅胶制成,透光性好,绝缘佳,稳定性强,耐高温性能好。In the above embodiments, the light source board is preferably an LED light emitting module, which may be an LED chip or a packaged LED lamp bead, and is driven by a driving module. The insulating and light-transmitting material used for the lamp housing can be made of, for example, polycarbonate, polystyrene, polymethyl methacrylate, polypropylene or silica gel, which has good light transmission, good insulation, strong stability and good high temperature resistance.

本实用新型中,由于灯壳是以光源板为模板直接一体成型,因而与光源板的结构完全匹配,通过与LED发光模块的紧密配合实现了热传导,从而可以通过灯壳直接向外界散热,并通过空气对流传热,无需额外设置散热件,散热效果好。通过吸塑或注塑工艺加工速度快,每批次加工数量可达100余个,极大缩短了生产加工时间。In the utility model, since the lamp housing is directly integrally formed with the light source board as a template, it completely matches the structure of the light source board, and realizes heat conduction through close cooperation with the LED light-emitting module, so that heat can be directly radiated to the outside through the lamp housing, and The heat is transferred by air convection, without additional heat dissipation parts, and the heat dissipation effect is good. The processing speed is fast through the blister or injection molding process, and the processing quantity in each batch can reach more than 100, which greatly shortens the production and processing time.

上述实施例仅用来进一步说明本实用新型的一体化LED灯,但本实用新型并不局限于实施例,凡是依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均落入本实用新型技术方案的保护范围内。The above embodiments are only used to further illustrate the integrated LED lamp of the present invention, but the present invention is not limited to the embodiments, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention , all fall within the scope of protection of the technical solution of the utility model.

Claims (11)

1. a kind of integrated LED lamp it is characterised in that:Lamp housing including light source board and insulated light transmission;If this light source board is provided with Dry LED light module;This lamp housing is integrally formed and is directly coated on outside this light source board, this lamp housing is by heat sink material system One-tenth, described LED light module and this lamp housing thermally coupled.
2. integrated LED lamp according to claim 1 it is characterised in that:This lamp housing passes through plastic uptake or injection and described light What source plate matched is coated on outside this light source board.
3. integrated LED lamp according to claim 1 and 2 it is characterised in that:This heat sink material is Merlon, polyphenyl Ethylene, polymethyl methacrylate, polypropylene or silica gel.
4. integrated LED lamp according to claim 1 it is characterised in that:It is additionally provided with for inserting outside on this light source board Two input terminals of lamp socket;One end of this two input terminals is electrically connected with those LED light module, and the other end extends this Outside lamp housing;This lamp housing one coats one end of this two input terminals.
5. integrated LED lamp according to claim 4 it is characterised in that:This two input terminals are mounted in this light source Plate one end has two metal pins at regular intervals, and this light source board is provided with two connecting holes, this two input terminals One end is separately fixed at described connection in the hole.
6. integrated LED lamp according to claim 4 it is characterised in that:This two input terminals are to be integrally connected to this Light source board bottom simultaneously has two male part at regular intervals, and the free end of this two male part stretches out outside this lamp housing.
7. integrated LED lamp according to claim 1 it is characterised in that:Also include a lamp holder;The bottom one of this lamp housing It is connected with connecting portion, this lamp holder is fixed on this connecting portion.
8. integrated LED lamp according to claim 7 it is characterised in that:The end of this light source board also includes conductive part, should Outside conductive part stretches out this lamp housing and be placed in this lamp holder;This conductive part is electrically connected with this lamp holder.
9. integrated LED lamp according to claim 7 it is characterised in that:This light source board is included for excessively semicircular plectane Portion and extended downwardly by this plectane portion and narrow the shank being formed, described LED light module is spaced in the periphery in this plectane portion, This connecting portion is arranged on this shank.
10. integrated LED lamp according to claim 7 it is characterised in that:It is additionally provided with drive module on this light source board, should Drive module is electrically connected with described LED light module, and described lamp housing one covers this drive module.
11. integrated LED lamps according to claim 1 it is characterised in that:This light source board is printed circuit board (PCB), described LED Light emitting module is divided on the relative two sides of this light source board.
CN201620703935.0U 2016-07-06 2016-07-06 Integrated LED lamp Active CN205979632U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107588403A (en) * 2016-07-06 2018-01-16 漳州立达信光电子科技有限公司 Integrated LED light
CN108679471A (en) * 2018-04-08 2018-10-19 中山德诚智造光电有限公司 The manufacture craft of graphene heat dissipation plastic material cladding high-voltage linear constant current driving lamp plate and high-voltage linear constant current drive lamp plate
CN108870106A (en) * 2017-05-09 2018-11-23 上海德士电器有限公司 The pin type LED bulb of injection molding packaging

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107588403A (en) * 2016-07-06 2018-01-16 漳州立达信光电子科技有限公司 Integrated LED light
CN108870106A (en) * 2017-05-09 2018-11-23 上海德士电器有限公司 The pin type LED bulb of injection molding packaging
CN108679471A (en) * 2018-04-08 2018-10-19 中山德诚智造光电有限公司 The manufacture craft of graphene heat dissipation plastic material cladding high-voltage linear constant current driving lamp plate and high-voltage linear constant current drive lamp plate

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