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CN101608747A - LED lamp module - Google Patents

LED lamp module Download PDF

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Publication number
CN101608747A
CN101608747A CNA2009101349856A CN200910134985A CN101608747A CN 101608747 A CN101608747 A CN 101608747A CN A2009101349856 A CNA2009101349856 A CN A2009101349856A CN 200910134985 A CN200910134985 A CN 200910134985A CN 101608747 A CN101608747 A CN 101608747A
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CN
China
Prior art keywords
light
emitting diode
radiating piece
lamp module
diode lamp
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Pending
Application number
CNA2009101349856A
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Chinese (zh)
Inventor
莊永富
林己智
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Light Ocean Tech Corp
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Taiwan Yingjie Co ltd
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Priority to CNA2009101349856A priority Critical patent/CN101608747A/en
Publication of CN101608747A publication Critical patent/CN101608747A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

A light emitting diode lamp module directly arranges a light emitting diode chip on a heat radiating piece and then electrically connects the light emitting diode chip with a circuit layer or a substrate arranged on the heat radiating piece. The invention can simplify the prior process and ensure that the LED lamp module has good heat dissipation effect.

Description

发光二极管灯具模块 LED light module

技术领域 technical field

本发明涉及一种发光二极管封装技术，特别是一种发光二极管灯具模块。The invention relates to a light-emitting diode packaging technology, in particular to a light-emitting diode lamp module.

背景技术 Background technique

发光二极管(light-emitting diodes，LED)具有寿命长、省电、较耐用等优点，因此高亮度LED照明装置为绿色环保产品，未来将可广泛应用。一般高亮度LED灯具多是将发光模块，通常包括多个LED灯泡，其直接焊接在一般电路板或铝基板上。为了增加散热效果，会额外设计散热构件，如在基板下方设置散热鳍片。然而，高亮度LED照明装置除了散热性问题外，如何降低成本与简化制造方法而使其高单价问题获得解决，将是一个重要的课题。Light-emitting diodes (light-emitting diodes, LEDs) have the advantages of long life, power saving, and durability. Therefore, high-brightness LED lighting devices are green and environmentally friendly products that will be widely used in the future. Generally, high-brightness LED lamps are mostly light-emitting modules, usually including a plurality of LED bulbs, which are directly welded on a common circuit board or an aluminum substrate. In order to increase the heat dissipation effect, additional heat dissipation components are designed, such as heat dissipation fins are arranged under the substrate. However, in addition to the heat dissipation problem of the high-brightness LED lighting device, how to reduce the cost and simplify the manufacturing method to solve the problem of high unit price will be an important issue.

发明内容 Contents of the invention

为了解决上述问题，本发明目的之一为提供一种发光二极管灯具模块，其直接将发光二极管芯片设置于散热件上，再将发光二极管芯片与设置于散热件上的电路层或基板电性连接。In order to solve the above problems, one of the objects of the present invention is to provide a light emitting diode lamp module, which directly arranges the light emitting diode chip on the heat sink, and then electrically connects the light emitting diode chip to the circuit layer or substrate disposed on the heat sink .

本发明目的之一为提供一种发光二极管灯具模块，其将具有开口的电路基板设置于散热件上，直接将发光二极管芯片设置于基板开口处的散热件上，具有极优散热效果，并且简化了制作过程。One of the objects of the present invention is to provide a light-emitting diode lamp module, which arranges the circuit substrate with an opening on the heat sink, and directly arranges the light-emitting diode chip on the heat sink at the opening of the substrate, which has an excellent heat dissipation effect and simplifies the production process.

为了达到上述目的，本发明实施例的发光二极管灯具模块，包括：散热件，其中散热件的材料为金属或高导热材料；基板，其设置于散热件上，其中基板上具有电路与至少一个开口，该开口暴露出散热件并形成凹穴；发光二极管芯片，其设置于凹穴的散热件上并利用多条金属引线与基板上的电路电性连接；以及透光封装材料，其填入凹穴并包覆发光二极管芯片、金属引线与部分基板。In order to achieve the above object, the light-emitting diode lamp module of the embodiment of the present invention includes: a heat sink, wherein the material of the heat sink is metal or a high thermal conductivity material; a substrate, which is arranged on the heat sink, wherein the substrate has a circuit and at least one opening The opening exposes the heat sink and forms a cavity; the light-emitting diode chip is arranged on the heat sink of the cavity and is electrically connected to the circuit on the substrate by using a plurality of metal leads; and the light-transmitting packaging material is filled into the cavity Hole and cover the light emitting diode chip, metal leads and part of the substrate.

本发明另一实施例的发光二极管灯具模块，包括：散热件，其具有设置于其上的至少一个凹穴，其中散热件的材料为金属或高导热材料；电路层，其设置于散热件上并围绕凹穴；发光二极管芯片，其设置于散热件的凹穴内并利用多条金属引线与电路层电性连接；以及透光封装材料，其填入凹穴并包覆发光二极管芯片、金属引线与部分电路层。An LED lamp module according to another embodiment of the present invention includes: a heat sink, which has at least one recess disposed thereon, wherein the material of the heat sink is metal or a material with high thermal conductivity; a circuit layer, which is disposed on the heat sink and surround the cavity; the light emitting diode chip is arranged in the cavity of the heat sink and is electrically connected to the circuit layer by a plurality of metal leads; and a light-transmitting packaging material is filled into the cavity and covers the light emitting diode chip and the metal lead with some circuit layers.

附图说明 Description of drawings

图1与图2所示为根据本发明不同实施例的示意图。1 and 2 are schematic diagrams according to different embodiments of the present invention.

图3A、图3B、图3C与图3D所示为根据本发明实施例的流程示意图。3A, 3B, 3C and 3D are schematic flowcharts according to an embodiment of the present invention.

图4A与图4B所示为根据本发明实施例的流程示意图。4A and 4B are schematic flowcharts according to an embodiment of the present invention.

图5所示为根据本发明实施例的示意图。Fig. 5 is a schematic diagram according to an embodiment of the present invention.

图6A、图6B、图6C、图6D与图6E所示为根据本发明不同实施例的示意图。6A, 6B, 6C, 6D and 6E are schematic diagrams according to different embodiments of the present invention.

图7A与图7B所示为根据本发明不同实施例的示意图。7A and 7B are schematic diagrams according to different embodiments of the present invention.

主要组件符号说明Explanation of main component symbols

  10 10   散热件 Heat sink   12 12   真空腔体 vacuum chamber   14 14   散热鳍片 Heat sink fins   16 16   管状中空腔体 Tubular hollow cavity   18 18   延伸部 extension   20 20   基板 Substrate   20’ 20'   电路层 circuit layer   22 twenty two   黏着层 Adhesive layer   22’ twenty two'   黏着层 Adhesive layer   30 30   发光二极管芯片 LED chip   32 32   黏着材料 Adhesive material   40 40   透光封装材料 Light-transmitting packaging materials   50 50   控制芯片 control chip   60 60   被动组件 Passive components

具体实施方式 Detailed ways

请参照图1，在本实施例中，发光二极管灯具模块包括：散热件10；基板20；发光二极管芯片30；以及透光封装材料40，其包覆发光二极管芯片30和部分基板20。其中，基板20设置于散热件10上，并且基板20具有电路(图上未示)和至少一个开口(图上未标)，该开口暴露出散热件10并形成凹穴(图上未标)。其中，散热件10的材料为金属或高导热材料。Referring to FIG. 1 , in this embodiment, the LED lamp module includes: a heat sink 10 ; a substrate 20 ; an LED chip 30 ; Wherein, the substrate 20 is arranged on the heat sink 10, and the substrate 20 has a circuit (not shown on the figure) and at least one opening (not marked on the figure), the opening exposes the heat sink 10 and forms a cavity (not marked on the figure) . Wherein, the heat sink 10 is made of metal or high thermal conductivity material.

承上所述，发光二极管芯片30设置于凹穴的散热件10上，并利用多条金属引线(图上未标)与基板20上的电路电性连接。透光封装材料40，填入凹穴并包覆发光二极管芯片30、金属引线与部分基板20。在实施例中，金属引线可以是部分被覆盖。在实施例中，设置该发光二极管芯片30后可提供荧光材料(图上未示)涂布于发光二极管芯片30，或是将荧光材料混合于透光封装材料40中。As mentioned above, the LED chip 30 is disposed on the heat sink 10 in the cavity, and is electrically connected to the circuit on the substrate 20 by a plurality of metal leads (not marked in the figure). The light-transmitting encapsulation material 40 fills the cavity and covers the LED chip 30 , metal leads and part of the substrate 20 . In an embodiment, the metal lead may be partially covered. In an embodiment, after the LED chip 30 is disposed, a fluorescent material (not shown in the figure) can be provided to coat the LED chip 30 , or the fluorescent material can be mixed into the light-transmitting encapsulation material 40 .

在另一实施例中，如图2所示，散热件10具有至少一个凹穴设置于其上。电路层20’则设置于散热件10上，并围绕凹穴。发光二极管芯片30设置于散热件10的凹穴内，并利用多条金属引线与电路层20’电性连接。透光封装材料40填入凹穴并包覆发光二极管芯片30、金属引线与部分电路层20’。在实施例中，电路层20’也可为基板。In another embodiment, as shown in FIG. 2 , the heat sink 10 has at least one cavity disposed thereon. The circuit layer 20' is disposed on the heat sink 10 and surrounds the cavity. The LED chip 30 is disposed in the cavity of the heat sink 10, and is electrically connected to the circuit layer 20' by a plurality of metal leads. The light-transmitting encapsulation material 40 fills the cavity and covers the LED chip 30, metal leads and part of the circuit layer 20'. In an embodiment, the circuit layer 20' may also be a substrate.

图3A、图3B、图3C与图3D所示为根据本发明实施例的流程示意图。在本实施例中，发光二极管灯具模块的制造方法包括下列步骤。首先，如图3A所示，提供散热件10。接着，利用黏着层22将基板20固定于散热件10上，其中黏着层22为导热材料或绝缘材料。基板20具有至少一个开口暴露出散热件10并形成一凹穴(图上未标)。其中，基板20可为铜箔基板、绝缘材料基板、玻璃纤维基板、陶瓷基板、玻璃纤维预浸布或高分子材料基板。3A, 3B, 3C and 3D are schematic flowcharts according to an embodiment of the present invention. In this embodiment, the manufacturing method of the LED lamp module includes the following steps. First, as shown in FIG. 3A , a heat sink 10 is provided. Next, the substrate 20 is fixed on the heat sink 10 by using the adhesive layer 22 , wherein the adhesive layer 22 is a heat conducting material or an insulating material. The substrate 20 has at least one opening exposing the heat sink 10 and forming a cavity (not marked in the figure). Wherein, the substrate 20 may be a copper foil substrate, an insulating material substrate, a glass fiber substrate, a ceramic substrate, a glass fiber prepreg or a polymer material substrate.

继续，请参照图3B，利用一黏着材料32将发光二极管芯片30固定于散热件10上，其中黏着材料32为导电材料，导热材料或绝缘材料，可为金属或非金属材料。利用多条金属引线使发光二极管芯片30与基板20上的电路(图上未示)电性连接。之后，如图3C所示，提供透光封装材料40填入凹穴，并包覆发光二极管芯片30、金属引线与部分基板20。To continue, please refer to FIG. 3B , using an adhesive material 32 to fix the LED chip 30 on the heat sink 10 , wherein the adhesive material 32 is a conductive material, a thermal conductive material or an insulating material, which can be metal or non-metal material. The LED chip 30 is electrically connected to a circuit (not shown) on the substrate 20 by a plurality of metal wires. Afterwards, as shown in FIG. 3C , a light-transmitting encapsulation material 40 is provided to fill the cavity and cover the LED chip 30 , metal leads and part of the substrate 20 .

承上所述，在实施例中，如图3D所示，可将控制芯片50与被动组件60等设置于基板20上，与其上的电路电性连接。如此，此发光二极管灯具模块组装上灯罩或壳体即为发光二极管灯泡的成品。在实施例中，也可以将控制电路集成于基板20的电路内。Based on the above, in an embodiment, as shown in FIG. 3D , the control chip 50 and the passive component 60 can be disposed on the substrate 20 and electrically connected to the circuit on the substrate. In this way, the light-emitting diode lamp module is assembled with a lampshade or a casing to become a finished product of the light-emitting diode light bulb. In an embodiment, the control circuit can also be integrated into the circuit of the substrate 20 .

图4A与图4B所示为根据本发明实施例的流程示意图。在本实施例中，发光二极管灯具模块的制造方法包括下列步骤。首先，如图4A所示，提供散热件10，其具有至少一个凹穴设置于其上。接着，利用一黏着层22’设置电路层20’于散热件10上并围绕凹穴。4A and 4B are schematic flowcharts according to an embodiment of the present invention. In this embodiment, the manufacturing method of the LED lamp module includes the following steps. First, as shown in FIG. 4A , a heat sink 10 is provided, which has at least one cavity disposed thereon. Next, the circuit layer 20' is placed on the heat sink 10 and surrounds the cavity by using an adhesive layer 22'.

接着，请参照图4B所示，设置发光二极管芯片30于散热件10的凹穴内，并利用多条金属引线使发光二极管芯片30与电路层20’电性连接。其中，利用黏着材料32将发光二极管芯片30固定于散热件10上，并且黏着材料32为导热材料或绝缘材料，可为金属或非金属材料。之后，在实施例中，可提供荧光材料(图上未示)涂布于发光二极管芯片30。透光封装材料40填入凹穴并包覆发光二极管芯片30、金属引线与部分电路层20’。在实施例中，荧光材料(图上未示)也可混合于透光封装材料40中。Next, as shown in FIG. 4B , the LED chip 30 is disposed in the cavity of the heat sink 10, and a plurality of metal leads are used to electrically connect the LED chip 30 to the circuit layer 20'. Wherein, the LED chip 30 is fixed on the heat sink 10 by an adhesive material 32 , and the adhesive material 32 is a thermally conductive material or an insulating material, which can be metal or non-metal material. Afterwards, in an embodiment, a fluorescent material (not shown in the figure) may be provided to coat the LED chip 30 . The light-transmitting encapsulation material 40 fills the cavity and covers the LED chip 30, metal leads and part of the circuit layer 20'. In an embodiment, a fluorescent material (not shown in the figure) may also be mixed in the transparent encapsulation material 40 .

承上所述，在实施例中，可设置控制芯片或被动组件等在电路层上与电路电性连接。另外，在上述实施例中，本发明可对金属材料的散热件表面进行阳极表面处理程序，使其产生阳极表面处理层，增加其散热或反光效果。Based on the above, in the embodiment, a control chip or a passive component can be arranged to be electrically connected to the circuit on the circuit layer. In addition, in the above-mentioned embodiments, the present invention can perform anodic surface treatment on the surface of the heat sink made of metal material, so that an anodic surface treatment layer can be formed to increase its heat dissipation or light reflection effect.

另外，如图5所示，在实施例中，取决于设计或功能需求，本发明并不限定发光二极管芯片的数量。此外，也不限制散热件10的形状和数目，如可设计成具有多个鳍片或有鳍片和热导管的散热件10。In addition, as shown in FIG. 5 , in the embodiment, depending on design or functional requirements, the present invention does not limit the number of LED chips. In addition, the shape and number of the heat sink 10 are not limited, for example, the heat sink 10 may be designed with multiple fins or with fins and heat pipes.

请参照图6A，在本实施例中，在其上具有凹穴的散热件10为具有至少一个真空腔体12的均温板、热导管或压平的热导管。均温板是一个内壁具有毛细微结构的真空腔体。当热由热源传导至蒸发区时，真空腔体12内的热超导介质的蒸发热快速均匀散布到低温处冷凝，再由腔体内的毛细结构回流至热源。此操作在腔体内周而复始的进行，此为均温板的工作原理。发光二极管芯片30设置在散热件10(均温板)的凹穴内，发光二极管芯片30所产生的热源可均匀快速的移出或传给额外散热装置，如与散热件10接触的散热鳍片14。在实施例中，如图6B所示，散热鳍片14也可以与均温板式的散热件10一体成型(one-piece form)。均温板也可为平面无凹穴的设计。Please refer to FIG. 6A , in this embodiment, the heat sink 10 having the cavity thereon is a vapor chamber with at least one vacuum chamber 12 , a heat pipe or a flattened heat pipe. The vapor chamber is a vacuum chamber with a capillary structure on the inner wall. When the heat is conducted from the heat source to the evaporation area, the heat of evaporation of the thermal superconducting medium in the vacuum chamber 12 is quickly and evenly distributed to the low temperature for condensation, and then flows back to the heat source from the capillary structure in the chamber. This operation is carried out repeatedly in the cavity, which is the working principle of the uniform temperature plate. The LED chip 30 is arranged in the cavity of the heat sink 10 (chamber), and the heat source generated by the LED chip 30 can be moved out evenly and quickly or transferred to an additional heat sink, such as the heat dissipation fin 14 in contact with the heat sink 10 . In an embodiment, as shown in FIG. 6B , the cooling fins 14 can also be integrally formed with the vapor chamber type heat sink 10 (one-piece form). The vapor chamber can also be designed as a flat surface without recesses.

继续参照图6B与6C，在不同实施例中，均温板式的散热件10的表面通过设置于在其上的基板20或电路层20’的开口形成凹穴结构，发光二极管芯片30设置在凹穴中，并直接接触散热件10的表面，因此能获得良好的均塭、散热效果。Continuing to refer to FIGS. 6B and 6C, in different embodiments, the surface of the vapor chamber heat sink 10 forms a cavity structure through the openings of the substrate 20 or the circuit layer 20' disposed thereon, and the LED chip 30 is disposed in the cavity. In the hole, and directly contact the surface of the heat sink 10, so can obtain good uniformity and heat dissipation effect.

如图6D所示，在实施例中，凹穴的深度通过散热件10上设置的凹部配合基板20的开口所构成。此外，散热件10也可具有多个管状中空腔体16，如图6E所示。此散热件10可由多个中空管压合组成，其管状中空腔体16可为开放式或封闭式。在实施例中，图上未示，也可在腔体内置入导热管提高散热效率。在实施例中，散热件也可为具有至少一个真空腔体的导热管。在实施例中，根据不同需求可设置排气装置，如涡轮排气抽风机，在散热件位置处用来快速带走热量。As shown in FIG. 6D , in the embodiment, the depth of the cavity is formed by matching the recess on the heat sink 10 with the opening of the substrate 20 . In addition, the heat sink 10 may also have a plurality of tubular hollow cavities 16 , as shown in FIG. 6E . The heat sink 10 can be formed by pressing a plurality of hollow tubes, and the tubular hollow cavity 16 can be open or closed. In an embodiment, not shown in the figure, a heat pipe may also be built into the cavity to improve heat dissipation efficiency. In an embodiment, the heat sink may also be a heat pipe having at least one vacuum chamber. In an embodiment, according to different requirements, an exhaust device, such as a turbo exhaust fan, can be provided at the position of the heat sink to quickly remove heat.

在实施例中，如图7A与图7B，本发明的散热件10可具有延伸部18。此延伸部18可构成二次光学结构，可增进发光二极管灯具模块的发光效果。散热件10与延伸部18的靠近光源侧也可进行表面处理以增加光反射率，例如镜面处理。如此散热件10与延伸部18可构成反射杯的二次光学结构。在此实施例中，散热件可同时拥有载板、散热、反射杯的功能，故可有效减少既有工艺与降低成本。In an embodiment, as shown in FIG. 7A and FIG. 7B , the heat sink 10 of the present invention may have an extension portion 18 . The extension part 18 can constitute a secondary optical structure, which can enhance the luminous effect of the LED lamp module. The sides of the heat sink 10 and the extension portion 18 close to the light source can also be treated to increase light reflectivity, such as mirror treatment. In this way, the heat sink 10 and the extension portion 18 can constitute a secondary optical structure of the reflective cup. In this embodiment, the heat sink can have the functions of a carrier plate, a heat sink, and a reflection cup at the same time, so the existing process and cost can be effectively reduced.

在实施例中，散热件也可为具有可弯折性的薄板。如图7B所示，散热件10的延伸部18可在发光二极管灯具模块组装完成后，利用弯折散热件10完成延伸部18的制作。由于此特性，散热件除了设置发光二极管芯片或其它相关构件的区域外，其余区域可利用弯折构成各种所需形状。In an embodiment, the heat sink can also be a bendable thin plate. As shown in FIG. 7B , the extension portion 18 of the heat sink 10 can be fabricated by bending the heat sink 10 after the LED lamp module is assembled. Because of this feature, except for the area where the LED chip or other related components are arranged, the remaining areas of the heat sink can be bent into various desired shapes.

根据上述说明，本发明发光二极管芯片设置于凹穴内，此凹穴可为基板开口与散热件所构成，或是由散热件所提供。另外，凹穴内可设置一个或多个发光二极管。此外，针对发光二极管的发光效率的提升，本发明也可在凹穴内涂布反射层。若是凹穴的深度不足，也可以在凹穴周围的电路层或基板上设置环型挡墙来辅助凹穴结构。其中，本发明的基板或电路层并不限于单层载板或电路层，也可为多层载板或电路层构成一般凹穴或阶梯状凹穴。According to the above description, the light-emitting diode chip of the present invention is disposed in the cavity, and the cavity can be formed by the opening of the substrate and the heat sink, or provided by the heat sink. Additionally, one or more light emitting diodes may be disposed within the cavity. In addition, in order to improve the luminous efficiency of the light-emitting diode, the present invention can also coat the reflective layer in the cavity. If the depth of the cavity is insufficient, a ring-shaped retaining wall can also be provided on the circuit layer or the substrate around the cavity to assist the structure of the cavity. Wherein, the substrate or circuit layer of the present invention is not limited to a single-layer carrier or circuit layer, and can also be a multi-layer carrier or circuit layer to form a general cavity or a stepped cavity.

综合上述，本发明直接将发光二极管芯片设置于散热件上，再将发光二极管芯片与设置于散热件上的电路层或基板电性连接。封装完成的发光二极管灯具模块可直接使用，简化既有工艺，无须再焊接到电路板上或加装散热构件。本发明可根据发光产品的需求调整发光二极管的数量与排列方式，再配合发光产品的外罩与组件即可完成产品。本发明简化工艺，可降低成本，并使原来高单价LED灯具的产品价格降低成更能为市场接受。In summary, the present invention directly disposes the LED chip on the heat sink, and then electrically connects the LED chip to the circuit layer or the substrate disposed on the heat sink. The packaged light-emitting diode lamp module can be used directly, which simplifies the existing process and does not need to be soldered to the circuit board or installed with heat dissipation components. The invention can adjust the quantity and arrangement of light-emitting diodes according to the requirements of light-emitting products, and then cooperate with the outer cover and components of the light-emitting products to complete the product. The invention simplifies the process, can reduce the cost, and reduces the product price of the original high unit price LED lamp to be more acceptable to the market.

以上所述的实施例仅为说明本发明的技术思想和特点，其目的在使本领域技术人员能够了解本发明的内容并据以实施，而不能以此限定本发明，即凡是根据本发明所公开的精神所作的均等变化或修饰，仍应涵盖在本发明的权利要求中。The above-described embodiments are only to illustrate the technical ideas and characteristics of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, but not to limit the present invention. Equivalent changes or modifications made in the spirit of the disclosure should still be covered by the claims of the present invention.

Claims (10)

1. light-emitting diode lamp module comprises:
One radiating piece, its material are metal or highly heat-conductive material;
One substrate is arranged on the described radiating piece, wherein has a circuit and at least one opening on this substrate, and this opening exposes described radiating piece and forms a depression;
One light-emitting diode chip for backlight unit, it is arranged on the described radiating piece of described depression, and utilizes the described circuit on many strip metal lead-in wires and the described substrate to electrically connect; And
One printing opacity encapsulating material, it is inserted described depression and coats described light-emitting diode chip for backlight unit, described those metal lead wires and the described substrate of part.
2. light-emitting diode lamp module as claimed in claim 1 is characterized in that described radiating piece is a temperature-uniforming plate or the heat pipe with at least one vacuum cavity, or adds a radiating fin at described temperature-uniforming plate.
3. light-emitting diode lamp module as claimed in claim 1 is characterized in that described radiating piece is for having a plurality of cannulated cavitys.
4. light-emitting diode lamp module as claimed in claim 1 is characterized in that described radiating piece is a bent thin plate.
5. light-emitting diode lamp module as claimed in claim 1 is characterized in that described radiating piece has an extension as a secondary optics structure.
6. light-emitting diode lamp module comprises:
One radiating piece, it has at least one depression setting thereon, and the material of wherein said radiating piece is metal or highly heat-conductive material;
One circuit layer, it is arranged on the described radiating piece, and around described depression;
One light-emitting diode chip for backlight unit, it is arranged in the described depression of described radiating piece, and utilizes many strip metal lead-in wires to electrically connect with described circuit layer; And
One printing opacity encapsulating material, it is inserted described depression and coats described light-emitting diode chip for backlight unit, more described metal lead wire and the described circuit layer of part.
7. light-emitting diode lamp module as claimed in claim 6 is characterized in that described radiating piece is a temperature-uniforming plate or the heat pipe with at least one vacuum cavity, or adds a radiating fin at described temperature-uniforming plate.
8. light-emitting diode lamp module as claimed in claim 6 is characterized in that described radiating piece has a plurality of cannulated cavitys.
9. light-emitting diode lamp module as claimed in claim 6 is characterized in that described radiating piece is a bent thin plate.
10. light-emitting diode lamp module as claimed in claim 6 is characterized in that described radiating piece has an extension as a secondary optics structure.
CNA2009101349856A 2008-06-16 2009-04-20 LED lamp module Pending CN101608747A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101900264A (en) * 2010-03-11 2010-12-01 陕西科技大学 A high heat dissipation type high power LED integrated package lamp
CN102072422A (en) * 2010-09-30 2011-05-25 福建省万邦光电科技有限公司 Packaging structure of high-power LED (light emitting diode) light source module
CN102116424A (en) * 2009-12-31 2011-07-06 鸿富锦精密工业（深圳）有限公司 Light-emitting diode illuminating device
CN102842668A (en) * 2012-09-07 2012-12-26 浙江中博光电科技有限公司 Structure of directly encapsulating chip on uniform temperature plate and manufacturing method of structure
US8508030B2 (en) 2009-12-30 2013-08-13 Hon Hai Precision Industry Co., Ltd. LED module
CN103899955A (en) * 2014-03-14 2014-07-02 魏百远 Efficient-heat-dissipation LED module structure
CN104406074A (en) * 2014-11-28 2015-03-11 浙江晶日照明科技有限公司 Integrated LED (Light Emitting Diode) module
CN106931318A (en) * 2015-12-31 2017-07-07 绿点高新科技股份有限公司 Light emitting assembly and manufacturing method thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8508030B2 (en) 2009-12-30 2013-08-13 Hon Hai Precision Industry Co., Ltd. LED module
CN102116424A (en) * 2009-12-31 2011-07-06 鸿富锦精密工业（深圳）有限公司 Light-emitting diode illuminating device
CN101900264A (en) * 2010-03-11 2010-12-01 陕西科技大学 A high heat dissipation type high power LED integrated package lamp
CN102072422A (en) * 2010-09-30 2011-05-25 福建省万邦光电科技有限公司 Packaging structure of high-power LED (light emitting diode) light source module
CN102072422B (en) * 2010-09-30 2015-09-02 福建省万邦光电科技有限公司 Encapsulating structure
CN102842668A (en) * 2012-09-07 2012-12-26 浙江中博光电科技有限公司 Structure of directly encapsulating chip on uniform temperature plate and manufacturing method of structure
CN103899955A (en) * 2014-03-14 2014-07-02 魏百远 Efficient-heat-dissipation LED module structure
CN104406074A (en) * 2014-11-28 2015-03-11 浙江晶日照明科技有限公司 Integrated LED (Light Emitting Diode) module
CN106931318A (en) * 2015-12-31 2017-07-07 绿点高新科技股份有限公司 Light emitting assembly and manufacturing method thereof
CN106931318B (en) * 2015-12-31 2019-12-17 绿点高新科技股份有限公司 Light emitting component and manufacturing method thereof

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