CN205680676U - Heat sink device - Google Patents

Abstract

The utility model provides a heat dissipation device. The heat dissipation device includes a thermal pad, a plurality of first flat heat pipes, a plurality of second flat heat pipes and a first heat dissipation fin group. The first bottom surface of the thermal pad is attached to the chip, and the first top surface has a plurality of first recessed portions and a plurality of first protruding portions. The first flat heat pipe has a first flat part and a first rounded corner part. The second flat heat pipe has a second flat part and a second rounded corner part. The first heat dissipation fin group forms a groove at a position facing the second flat heat pipe. The groove has a plurality of second recessed portions and a plurality of second protruding portions. The first flat heat pipe is sandwiched between the second flat heat pipe and the thermal pad, and the second flat heat pipe is sandwiched between the first heat dissipation fin group and the first flat heat pipe. The utility model improves the heat dissipation efficiency of the heat dissipation device by flattening the double-layer heat pipe and forming protrusions and recesses complementary to the shape of the flat heat pipe on the heat conduction pad and the heat dissipation fin set.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a heat dissipation device with stacked heat pipes.

Background technique

A heat pipe is a common heat dissipation device, which uses a capillary structure to evaporate and condense, and achieves the effect of cooling in the process of circulation. As the speed and performance of the central processing unit continue to improve, the stacked heat pipe design is proposed when the single-row heat pipe can no longer bear the load, hoping to maximize the heat dissipation efficiency in the smallest volume. In the existing stacked heat pipe design, for example, the double-layer heat pipe disclosed in the Chinese Utility Model Patent No. CN203217462U still adopts circular heat pipes to be stacked, and is sandwiched between two heat-conducting pads, thus causing The heat source cannot be directly transferred from the first layer of heat pipes to the second layer of heat pipes, and the second layer of heat pipes cannot directly transfer heat to the lack of heat dissipation fins. Therefore, there is still a lot of room for improvement in the existing stacked heat pipes.

Utility model content

The technical problem to be solved by the utility model is to provide a heat dissipation device capable of rapid heat conduction between two layers of heat pipes and heat dissipation fins to improve heat dissipation efficiency in view of the above-mentioned deficiencies in the prior art.

The technical solution adopted by the utility model to solve the technical problem is to provide a heat dissipation device for laminating a chip. The heat dissipation device includes a heat conducting pad, a plurality of first flat heat pipes, a plurality of second flat heat pipes and a first heat dissipation a fin group, the heat conduction pad has a first bottom surface and a first top surface opposite to each other, the first bottom surface is attached to the chip, and the first top surface has a plurality of first depressions and a plurality of first protrusions; The first flat heat pipe has a first flat portion and a first rounded corner portion; the second flat heat pipe has a second flat portion and a second rounded corner portion; A groove is formed at the heat pipe, and the groove has a plurality of second depressions and a plurality of second protrusions; wherein, the first flat heat pipe is sandwiched between the second flat heat pipe and the heat conduction pad, and the first flat heat pipe is sandwiched between the second flat heat pipe and the thermal pad. A flattened part fits the second flattened part and the first concave part up and down respectively, and the first rounded corner part sticks to the first protruding part, and the second flat heat pipe is sandwiched between the first cooling fins Between the sheet group and the first flat heat pipe, the second flat part is attached to the second concave part and the first flat part up and down respectively, and the second rounded corner part is attached to the second protruding part.

Preferably, the second flat heat pipe is a U-shaped pipe arranged in the first cooling fin group.

Preferably, the cross-sectional area of the first flat heat pipe is greater than or equal to the cross-sectional area of the second flat heat pipe.

Preferably, the number of the first flat heat pipes is greater than or equal to the number of the second flat heat pipes.

Preferably, the height of the first flat heat pipe is greater than or equal to the height of the second flat heat pipe.

Preferably, the heat dissipation device further includes a fan, and the fan is arranged outside the first heat dissipation fin group.

Preferably, the heat dissipation device further includes a second heat dissipation fin set, and the first flat heat pipe extends from the first heat dissipation fin set to the second heat dissipation fin set.

Preferably, the heat dissipation device further includes a fan, and the fan is arranged outside the second heat dissipation fin group.

The heat dissipation device of the utility model adopts an improved heat pipe stacking design. By flattening the double-layer heat pipes and omitting a heat conduction pad, the second-layer heat pipes are directly in contact with the heat dissipation fins, which simplifies the composition of the heat sink. It also increases the contact area between the heat pipes, thereby improving the efficiency of heat dissipation. In addition, since the flat heat pipe is flat in the middle, there are still rounded corners at both ends due to the plastic shape. In view of this point, the design proposed by the utility model also improves the shape of the heat dissipation fins , a groove is formed at the place where the heat dissipation fin faces the heat pipe, and a protrusion that can complement the shape of the rounded corner is formed on the groove. In this way, the heat conduction pad that is in direct contact with the chip can quickly conduct heat to the first layer heat pipe, the second layer heat pipe and the heat dissipation fins through the flatness design of the heat pipe, so as to maximize the heat dissipation efficiency.

Description of drawings

FIG. 1 is a perspective view of a heat dissipation device of the present invention.

FIG. 2A is a cross-sectional view of the heat sink shown along the section line 2A-2A in FIG. 1 .

2B is a schematic diagram of the relative structure of the heat conducting pad, the first flat heat pipe, the second flat heat pipe and the first heat dissipation fin in a heat dissipation device of the present invention.

FIG. 3 is a perspective view of the heat dissipation device of the present invention at another viewing angle.

detailed description

Please refer to FIG. 1 , FIG. 2A and FIG. 2B at the same time. According to an embodiment of the present invention, the heat dissipation device 2 provided can be applied to the display card 1 and other adapter cards. The heat sink 2 can be combined with the display card 1 by screws 3 or other fixing means, and then the heat conduction pad 27 is attached to the chip 11 to transfer the heat generated by the chip 11 to the inside of the heat sink 2 for heat dissipation. . The heat dissipation device 2 includes a heat conduction pad 27 , a plurality of first flat heat pipes 25 , a plurality of second flat heat pipes 26 , a first heat dissipation fin set 22 , a second heat dissipation fin set 23 and a fan 28 . Wherein, a plurality of first flat heat pipes 25 and a plurality of second flat heat pipes 26 intersect in the middle of the first cooling fin group 22 and the heat conduction pad 27 to form a double-layer stack structure, and the fan 28 is arranged on The outer sides of the first cooling fin set 22 and the second cooling fin set 23 are covered by an outer casing (not shown in the figure). The detailed structure of each component of the heat sink 2 will be described in detail below.

The heat conduction pad 27 has a first bottom surface and a first top surface opposite to each other, wherein the first bottom surface can be bonded to the chip 11, and the first top surface has a plurality of first depressions 27a and a plurality of first protrusions Section 27b. A plurality of first flat heat pipes 25 are arranged on the heat conduction pad 27 and have a first flattened portion 25a and a first rounded corner portion 25b. The first flattened portion 25a is located in the central area of the first flattened heat pipe 25. The first rounded corner portion 25b is located on both sides of the first flat heat pipe 25 and has an arc surface. A plurality of second flat heat pipes 26, stacked on the first flat heat pipe 25, have a second flattened portion 26a and a second rounded corner portion 26b, wherein the second flattened portion 26a is located in the central area of the second flattened heat pipe 26, also It can be formed by pressing or other molding methods; the second rounded corner portion 26 b is located at the two sides of the second flat heat pipe 26 and has an arc surface. A groove is formed in the first cooling fin group 22 facing the second flat heat pipe 26 , and the groove has a plurality of second recesses 22 a and a plurality of second protrusions 22 b.

Please refer to FIG. 2A and FIG. 2B at the same time. When the heat dissipation device 2 provided by the present invention is assembled, the stacked first flat heat pipe 25 and the second flat heat pipe 26 are sandwiched between the heat conduction pad 27 and the first heat dissipation fin group. 22, wherein the first flat heat pipe 25 is sandwiched between the second flat heat pipe 26 and the heat conduction pad 27, so that the first flattened portion 25a of the first flat heat pipe 25 is attached to the first flat part 25a of the second flat heat pipe 26 up and down. The two flattened portions 26 a and the first concave portion 27 a of the heat conduction pad 27 , while the first rounded corner portion 25 a of the first flat heat pipe 25 is attached to the first protruding portion 27 b of the heat conduction pad 27 . In addition, the second flat heat pipe 26 is sandwiched between the first heat dissipation fin set 22 and the first flat heat pipe 25, so that the second flat portion 26a of the second flat heat pipe 26 is attached to the first heat dissipation fin set up and down. 22 and the first flattened portion 25a of the first flat heat pipe 25, while the second rounded corner portion 26b of the second flat heat pipe 26 is attached to the second protruding portion of the first cooling fin group 22 22b.

Through the above-mentioned first embodiment of the present invention, the structural correspondence and bonding design of the heat conduction pad 27, the first flat heat pipe 25, the second flat heat pipe 26, and the first cooling fin group 22 can allow The heat generated by the chip is quickly and directly transferred to the first flat portion 25a of the first flat heat pipe 25, the second flat portion 26a of the second flat heat pipe 26, and to the The second recessed portion 22a of the first heat dissipation fin group 22 improves the efficiency of heat dissipation and simplifies the composition of components. In addition, by the first protruding portion 27b of the heat conduction pad 27 and the first rounded corner portion 25b of the first flat heat pipe 25, and the second protruding portion 22a of the first cooling fin set 22 and the first rounded corner portion 25b of the second flat heat pipe 26 The complementary design of the two rounded corners 26b in shape can increase the contact area between the two, so that the heat dissipation device 2 can maximize the heat dissipation efficiency.

Please refer to Fig. 3, which shows the heat dissipation device 2 provided by the embodiment of the present utility model from another angle of view. From this perspective view, it can be understood that a plurality of first flat heat pipes 25 in contact with the heat conduction pad 27 are directly in contact with the heat conduction pad. 27 is in contact with the first layer of heat pipes, so it shoulders the largest heat dissipation task. Therefore, in the design of this embodiment, a plurality of first flat heat pipes 25 will reduce the bending of the pipeline as much as possible, so as to reduce the damage to the internal capillary structure during molding. , and make it extend from the first cooling fin set 22 to the second cooling fin set 23 for heat dissipation. The multiple second flat heat pipes 26 will use U-shaped pipes to make the bending degree of the pipes larger than that of the first flat heat pipes 26 under the consideration of the limitation of the overall volume of the heat sink 2 .

Continuing the above-mentioned design concept, since a plurality of first flat heat pipes 25 shoulder heavier heat dissipation tasks, the number of first flat heat pipes 25 can be selected to be greater than or equal to the number of second flat heat pipes 26, and the number of first flat heat pipes 25 The cross-sectional area can be selected to be greater than or equal to the cross-sectional area of the second flat heat pipe 26, and the height of the first flat heat pipe 25 can be selected to be greater than or equal to the height of the second flat heat pipe 26.

In addition, for the first flat heat pipe 25 and the second flat heat pipe 26 proposed in the present invention, the definition of the flat shape means that the width of the heat pipe is greater than the height of the heat pipe, and as long as the heat conduction pad 27 and the first heat dissipation fin group 22 clamp The middle area provided, that is, the first flat heat pipe 25 and the second flat heat pipe 26 are stacked in a flat shape. For example, circular or elliptical, etc., the utility model does not limit the entire section of the heat pipe to be flat.

In addition, the first radiating fin group 22 and the second radiating fin group 23 proposed by the present utility model do not mean that they are completely independent and have no connection, but because they will be matched with different fans 28. Separately, the first heat dissipation fin set 22 and the second heat dissipation fin set 23 can also be integrated into one body through other fins or components.

Furthermore, the gap between the first flat heat pipe and the second flat heat pipe may also be filled with a heat conducting medium (not shown in the figure) to facilitate heat transfer.

Claims (8)

1. A heat dissipation device, used to bond a chip, is characterized in that the heat dissipation device comprises: The heat conduction pad has a first bottom surface and a first top surface opposite to each other, the first bottom surface is attached to the chip, and the first top surface has a plurality of first depressions and a plurality of first protrusions; A plurality of first flat heat pipes, the first flat heat pipes have a first flattened portion and a first rounded corner portion; a plurality of second flat heat pipes, the second flat heat pipes have a second flat portion and a second rounded corner portion; and a first cooling fin group, the first cooling fin group is formed with a groove facing the second flat heat pipe, and the groove has a plurality of second depressions and a plurality of second protrusions; Wherein, the first flat heat pipe is sandwiched between the second flat heat pipe and the heat conduction pad, the first flat part is attached to the second flat part and the first concave part up and down respectively, and the first rounded corner The second flat part is attached to the first protruding part, the second flat heat pipe is sandwiched between the first cooling fin group and the first flat heat pipe, and the second flat part is respectively attached to the second concave part up and down. and the first flat portion, and the second rounded corner portion is attached to the second protruding portion. 2 . The heat dissipation device according to claim 1 , wherein the second flat heat pipe is a U-shaped pipe disposed in the first heat dissipation fin group. 3 . 3. The heat dissipation device according to claim 1, wherein the cross-sectional area of the first flat heat pipe is greater than or equal to the cross-sectional area of the second flat heat pipe. 4. The heat dissipation device according to claim 1, wherein the number of the first flat heat pipes is greater than or equal to the number of the second flat heat pipes. 5. The heat dissipation device according to claim 1, wherein the height of the first flat heat pipe is greater than or equal to the height of the second flat heat pipe. 6. The heat dissipation device according to claim 1, further comprising a fan disposed outside the first heat dissipation fin set. 7. The heat dissipation device according to claim 1, further comprising a second heat dissipation fin set, the first flat heat pipe extending from the first heat dissipation fin set to the second heat dissipation fin Group. 8 . The heat dissipation device according to claim 7 , further comprising a fan disposed outside the second heat dissipation fin group.