CN205607883U - Formation of image detecting system is received a little to compound three -dimensional of optoacoustic - Google Patents
Formation of image detecting system is received a little to compound three -dimensional of optoacoustic Download PDFInfo
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Abstract
本实用新型公开了一种光声复合三维微纳成像检测系统，包括光全息光路，还包括计算机、显微镜、用于放置固体样品的压电晶片和用于驱动压电晶片振动的功率放大器，计算机上接有同步控制器和数字相机，同步控制器上接有波形发生器和脉冲激光器；光全息光路包括物光光路、参考光光路和第一分束立方镜，物光光路包括依次设置的第二分束立方镜、第一扩束镜和第一反射镜，参考光光路包括第三分束镜和第二反射镜，以及第二扩束镜，压电晶片设置在显微镜的正下方。本实用新型设计合理，实现方便，能够适用于不同厚度的固体样品的缺陷检测，检测速度快，检测精度和可靠度高，真正实现了无损检测，实用性强，应用范围广，便于推广使用。
The utility model discloses a photoacoustic composite three-dimensional micro-nano imaging detection system, which includes an optical holographic optical path, a computer, a microscope, a piezoelectric chip for placing solid samples, and a power amplifier for driving the vibration of the piezoelectric chip. A synchronous controller and a digital camera are connected to the synchronous controller, and a waveform generator and a pulse laser are connected to the synchronous controller; the optical holographic optical path includes an object light path, a reference light path and a first beam splitting cube mirror, and the object light path includes a sequentially arranged second Two beam-splitting cube mirrors, a first beam expander and a first reflector, the reference light path includes a third beam-splitter, a second reflector, and a second beam expander, and the piezoelectric wafer is arranged directly below the microscope. The utility model is reasonable in design, easy to implement, suitable for defect detection of solid samples of different thicknesses, fast in detection speed, high in detection accuracy and reliability, truly realizes non-destructive detection, has strong practicability, wide application range, and is easy to popularize and use.
Description
技术领域technical field
本实用新型属于无损检测技术领域，具体涉及一种光声复合三维微纳成像检测系统。The utility model belongs to the technical field of non-destructive testing, in particular to a photoacoustic composite three-dimensional micro-nano imaging detection system.
背景技术Background technique
随着半导体制造技术和微纳制造技术的飞速发展，使用这些新技术制造出来的微器件与微系统(例如超高集成芯片、微传感器等)将渗透到航空航天、国防、军事和生活的各个领域。然而，对这些微型产品的可靠性测试与质量控制技术大大滞后于制造技术的发展。扫描声学显微镜(scanning acoustic microscopy,SAM)其显微成像技术通过高频超声聚焦探头的逐点扫描实现样品内部缺陷的断层成像检测，但是，一个300MHz的超声聚焦探头，其横向分辨率也只能达到十几微米，而且，对于如此高频声波由于色散衰减导致其穿透能力非常差，只能检测很薄的样品。最新三维X射线CT(3D X-Ray CT)能达到50nm的分辨率，但是，必须把测试样品切割成很小的单元，破坏微电子封装样品的完整性，而且成像效率极低。原子力显微镜及相关技术尽管分辨率可以达到纳米级，但是只能扫描非常小的样品区域(几个微米×几个微米)，而且成像速度很慢，而且没有穿透力，不能对微电子封装内部缺陷进行检测。传统的检测技术已经不能适应这些先进制造技术的发展，现有的无损检测技术面临着严重挑战，需要更高体积分辨率的先进无损评价技术对微集成系统的可靠性进行评估。With the rapid development of semiconductor manufacturing technology and micro-nano manufacturing technology, micro devices and micro systems (such as ultra-highly integrated chips, micro sensors, etc.) field. However, the reliability testing and quality control technology for these miniature products lags far behind the development of manufacturing technology. The scanning acoustic microscopy (SAM) microscopic imaging technology realizes the tomographic detection of internal defects of the sample through the point-by-point scanning of the high-frequency ultrasonic focusing probe. However, the lateral resolution of a 300MHz ultrasonic focusing probe can only be It can reach more than ten microns, and, for such a high-frequency sound wave, its penetrating ability is very poor due to dispersion attenuation, so it can only detect very thin samples. The latest three-dimensional X-ray CT (3D X-Ray CT) can achieve a resolution of 50nm, but the test sample must be cut into very small units, which destroys the integrity of the microelectronic packaging sample, and the imaging efficiency is extremely low. Although the resolution of atomic force microscopy and related technologies can reach the nanometer level, they can only scan very small sample areas (several micrometers × several micrometers), and the imaging speed is very slow, and they have no penetrating power, so they cannot scan the inside of the microelectronic package. Defects are detected. The traditional detection technology can no longer adapt to the development of these advanced manufacturing technologies. The existing non-destructive testing technology is facing serious challenges. Advanced non-destructive evaluation technology with higher volume resolution is needed to evaluate the reliability of micro-integrated systems.
实用新型内容Utility model content
本实用新型所要解决的技术问题在于针对上述现有技术中的不足，提供一种光声复合三维微纳成像检测系统，其设计合理，实现方便，能够适用于不同厚度的固体样品的缺陷检测，检测速度快，检测精度和可靠度高，真正实现了无损检测，实用性强，应用范围广，便于推广使用。The technical problem to be solved by the utility model is to provide a photoacoustic composite three-dimensional micro-nano imaging detection system for the deficiencies in the above-mentioned prior art. The detection speed is fast, the detection accuracy and reliability are high, the non-destructive detection is truly realized, the practicability is strong, the application range is wide, and it is easy to promote and use.
为解决上述技术问题，本实用新型采用的技术方案是：一种光声复合三维微纳成像检测系统，包括光全息光路，其特征在于：还包括计算机、显微镜、用于放置固体样品的压电晶片和用于驱动压电晶片振动的功率放大器，所述计算机上接有同步控制器和与同步控制器连接的数字相机，所述同步控制器上接有波形发生器和脉冲激光器，所述功率放大器与波形发生器的输出端连接，所述压电晶片与功率放大器的输出端连接；所述光全息光路包括物光光路、参考光光路和第一分束立方镜，所述物光光路包括依次设置且与脉冲激光器设置在同一水平线上的第二分束立方镜、第一扩束镜和第一反射镜，所述参考光光路包括设置在第二分束立方镜下方的第三分束镜和设置在第三分束镜下方的第二反射镜，以及与第三分束镜设置在同一水平线上的第二扩束镜，所述第一分束立方镜设置在第一反射镜的下方且与第二扩束镜设置在同一水平线上，所述显微镜设置在第一分束立方镜的正下方，所述压电晶片设置在显微镜的正下方，所述数字相机设置在第一分束立方镜的旁侧，所述脉冲激光器设置在第二分束立方镜的旁侧。In order to solve the above technical problems, the technical solution adopted by the utility model is: a photoacoustic composite three-dimensional micro-nano imaging detection system, including an optical holographic optical path, characterized in that it also includes a computer, a microscope, and a piezoelectric sensor for placing solid samples. wafer and a power amplifier for driving piezoelectric wafer vibration, the computer is connected with a synchronous controller and a digital camera connected with the synchronous controller, the synchronous controller is connected with a waveform generator and a pulse laser, and the power The amplifier is connected to the output end of the waveform generator, and the piezoelectric wafer is connected to the output end of the power amplifier; the optical holographic optical path includes an object light path, a reference light path and a first beam splitting cube mirror, and the object light path includes The second beam splitting cube mirror, the first beam expander mirror and the first reflector arranged in sequence and arranged on the same horizontal line as the pulse laser, the reference light optical path includes the third beam splitting cube mirror arranged below the second beam splitting cube mirror mirror and the second mirror arranged below the third beam splitter, and the second beam expander arranged on the same horizontal line as the third beam splitter, the first beam splitter cube mirror is arranged on the first mirror below and set on the same horizontal line as the second beam expander, the microscope is set directly below the first beam splitting cube mirror, the piezoelectric wafer is set directly below the microscope, and the digital camera is set on the first beam splitting cube The side of the beam cube mirror, the pulse laser is arranged on the side of the second beam splitting cube mirror.
上述的光声复合三维微纳成像检测系统，其特征在于：所述功率放大器的型号为HSA4101。The above-mentioned photoacoustic composite three-dimensional micro-nano imaging detection system is characterized in that: the model of the power amplifier is HSA4101.
上述的光声复合三维微纳成像检测系统，其特征在于：所述数字相机为CCD数字相机。The above-mentioned photoacoustic composite three-dimensional micro-nano imaging detection system is characterized in that: the digital camera is a CCD digital camera.
上述的光声复合三维微纳成像检测系统，其特征在于：所述CCD数字相机的型号为PCO1600。The above-mentioned photoacoustic composite three-dimensional micro-nano imaging detection system is characterized in that: the model of the CCD digital camera is PCO1600.
上述的光声复合三维微纳成像检测系统，其特征在于：所述波形发生器的型号为AFG2021-SC。The above-mentioned photoacoustic composite three-dimensional micro-nano imaging detection system is characterized in that: the model of the waveform generator is AFG2021-SC.
上述的光声复合三维微纳成像检测系统，其特征在于：所述脉冲激光器为纳秒激光器。The above-mentioned photoacoustic composite three-dimensional micro-nano imaging detection system is characterized in that: the pulsed laser is a nanosecond laser.
上述的光声复合三维微纳成像检测系统，其特征在于：所述脉冲激光器的型号为Nimma-400。The above-mentioned photoacoustic composite three-dimensional micro-nano imaging detection system is characterized in that: the model of the pulsed laser is Nimma-400.
本实用新型与现有技术相比具有以下优点：Compared with the prior art, the utility model has the following advantages:
1、本实用新型的结构简单，设计合理，实现方便。1. The utility model has the advantages of simple structure, reasonable design and convenient realization.
2、本实用新型可以通过调节波形发生器产生的正弦信号的周期使超声波穿透不同厚度的固体样品(如微电子器件)，能够适用于不同厚度的固体样品(如微电子器件)的缺陷检测。2. The utility model can make ultrasonic waves penetrate solid samples of different thicknesses (such as microelectronic devices) by adjusting the period of the sinusoidal signal generated by the waveform generator, and can be applied to defect detection of solid samples of different thicknesses (such as microelectronic devices) .
3、本实用新型能够得到固体样品(如微电子器件)内部缺陷的三维图，成像速度快，能够对固体样品(如微电子器件)内部的缺陷进行快速检测，检测精度和可靠度高。3. The utility model can obtain a three-dimensional image of internal defects of solid samples (such as microelectronic devices), has fast imaging speed, can quickly detect internal defects of solid samples (such as microelectronic devices), and has high detection accuracy and reliability.
4、采用本实用新型进行固体样品(如微电子器件)内部缺陷进行检测时，不会损坏固体样品(如微电子器件)的完整性，真正实现了无损检测。4. When the utility model is used to detect internal defects of solid samples (such as microelectronic devices), the integrity of solid samples (such as microelectronic devices) will not be damaged, and nondestructive testing is truly realized.
5、本实用新型除了能够应用到无损检测中，还能够应用在很多领域，例如生物医学成像，用于研究生物细胞机械特性(包括生物细胞的厚度，密度，声波速度，衰减系数的变化)，生物软组织中应变和弹性模量分布的定量成像，活细胞的内部结构的断层成像等，实用性强，使用效果好，便于推广使用。5. In addition to being applicable to non-destructive testing, the utility model can also be applied in many fields, such as biomedical imaging, for studying the mechanical characteristics of biological cells (including the thickness, density, sound wave velocity, and attenuation coefficient changes of biological cells), Quantitative imaging of strain and elastic modulus distribution in biological soft tissue, tomographic imaging of the internal structure of living cells, etc., have strong practicability, good effect, and are easy to promote and use.
综上所述，本实用新型设计合理，实现方便，能够适用于不同厚度的固体样品的缺陷检测，检测速度快，检测精度和可靠度高，真正实现了无损检测，实用性强，应用范围广，便于推广使用。To sum up, the utility model is reasonable in design and convenient in implementation, and can be applied to the defect detection of solid samples of different thicknesses, with fast detection speed, high detection accuracy and reliability, truly realized non-destructive testing, strong practicability, and wide application range , which is convenient for promotion and use.
下面通过附图和实施例，对本实用新型的技术方案做进一步的详细描述。The technical solutions of the present utility model will be further described in detail through the drawings and embodiments below.
附图说明Description of drawings
图1为本实用新型的结构示意图。Fig. 1 is the structural representation of the utility model.
附图标记说明:Explanation of reference signs:
1—计算机； 2—固体样品； 3—压电晶片；1—computer; 2—solid sample; 3—piezoelectric chip;
4—功率放大器； 5—同步控制器； 6—数字相机；4—power amplifier; 5—synchronous controller; 6—digital camera;
7—波形发生器； 8—脉冲激光器； 9—第一分束立方镜；7—waveform generator; 8—pulse laser; 9—first beam splitting cube mirror;
10—第一扩束镜； 11—第二分束立方镜； 12—第一反射镜；10—the first beam expander; 11—the second beam splitting cube; 12—the first mirror;
13—第三分束镜； 14—第二反射镜； 15—显微镜；13—the third beam splitter; 14—the second mirror; 15—microscope;
16—第二扩束镜。16—the second beam expander.
具体实施方式detailed description
如图1所示，本实用新型的光声复合三维微纳成像检测系统，包括光全息光路，还包括计算机1、显微镜15、用于放置固体样品2的压电晶片3和用于驱动压电晶片3振动的功率放大器4，所述计算机1上接有同步控制器5和与同步控制器5连接的数字相机6，所述同步控制器5上接有波形发生器7和脉冲激光器8，所述功率放大器4与波形发生器7的输出端连接，所述压电晶片3与功率放大器4的输出端连接；所述光全息光路包括物光光路、参考光光路和第一分束立方镜9，所述物光光路包括依次设置且与脉冲激光器8设置在同一水平线上的第二分束立方镜11、第一扩束镜10和第一反射镜12，所述参考光光路包括设置在第二分束立方镜11下方的第三分束镜13和设置在第三分束镜13下方的第二反射镜14，以及与第三分束镜13设置在同一水平线上的第二扩束镜16，所述第一分束立方镜9设置在第一反射镜12的下方且与第二扩束镜16设置在同一水平线上，所述显微镜15设置在第一分束立方镜9的正下方，所述压电晶片3设置在显微镜15的正下方，所述数字相机6设置在第一分束立方镜9的旁侧，所述脉冲激光器8设置在第二分束立方镜11的旁侧。As shown in Figure 1, the photoacoustic composite three-dimensional micro-nano imaging detection system of the present invention includes an optical holographic optical path, a computer 1, a microscope 15, a piezoelectric chip 3 for placing a solid sample 2, and a piezoelectric chip for driving a piezoelectric The power amplifier 4 of wafer 3 vibrations, the computer 1 is connected with a synchronous controller 5 and a digital camera 6 connected with the synchronous controller 5, and the synchronous controller 5 is connected with a waveform generator 7 and a pulsed laser 8, so Described power amplifier 4 is connected with the output end of waveform generator 7, and described piezoelectric wafer 3 is connected with the output end of power amplifier 4; Described optical holographic optical path comprises object light optical path, reference light optical path and the first beam splitter cubic mirror 9 , the object light path includes a second beam splitting cube mirror 11, a first beam expander mirror 10, and a first mirror 12 arranged in sequence and on the same horizontal line as the pulse laser 8, and the reference light path includes a The third beam splitter 13 below the two beam splitter cube mirrors 11 and the second reflector 14 arranged below the third beam splitter 13, and the second beam expander arranged on the same horizontal line as the third beam splitter 13 16, the first beam splitting cube mirror 9 is arranged below the first reflector 12 and arranged on the same horizontal line as the second beam expander 16, and the microscope 15 is arranged directly under the first beam splitting cube mirror 9 , the piezoelectric wafer 3 is arranged directly below the microscope 15, the digital camera 6 is arranged on the side of the first beam splitting cube mirror 9, and the pulsed laser 8 is arranged on the side of the second beam splitting cube mirror 11 .
本实施例中，所述功率放大器4的型号为HSA4101。所述数字相机6为CCD数字相机，所述数字相机6通过USB线与计算机1连接。所述CCD数字相机的型号为PCO1600。所述波形发生器7的型号为AFG2021-SC。所述脉冲激光器8为纳秒激光器。所述脉冲激光器8的型号为Nimma-400。In this embodiment, the model of the power amplifier 4 is HSA4101. The digital camera 6 is a CCD digital camera, and the digital camera 6 is connected to the computer 1 through a USB cable. The model of the CCD digital camera is PCO1600. The model of the waveform generator 7 is AFG2021-SC. The pulsed laser 8 is a nanosecond laser. The model of the pulsed laser 8 is Nimma-400.
采用本实用新型进行光声复合三维微纳成像检测时的过程为：将固体样品2放置在压电晶片3上后，计算机1通过同步控制器5给波形发生器7发送一个触发信号，波形发生器7接收到触发信号后产生3～12个周期为T的正弦信号并输出给功率放大器4，功率放大器4对其接收到的正弦信号进行放大后输出给压电晶片3，驱动压电晶片3振动，产生超声波；同步控制器5延时一定时间后控制数字相机6启动，同步控制器5延时一定时间后给脉冲激光器8发送一个触发信号，脉冲激光器8接收到触发信号后产生一个脉冲激光照射在第二分束立方镜11上；第二分束立方镜11将脉冲激光分离为一个物光光束和一个参考光光束；第一扩束镜10对物光光束进行扩束后照射在第一反射镜12上，物光光束经过第一反射镜12反射后，再穿过第一分束立方镜9照射在固体样品2的表面上，创建物光波前；参考光光束穿过第三分束镜13照射在第二反射镜14上，经过第二反射镜14反射后，再穿过第三分束镜13到达第二扩束镜16，第二扩束镜16对参考光光束进行扩束后照射在第一分束立方镜9上；经固体样品2反射回来的物光波前到达第一分束立方镜9，并经过第一分束立方镜9将物光波前与参考光光束叠加在一起，在数字相机6的感光元件表面产生干涉，形成一幅全息图；数字相机6记录全息图，并将记录的全息图数据传输给计算机1；重复执行检测的过程，直到得到多幅全息图，其中，每幅全息图对应的超声波声场表示固体样品2中一个断层的图像，将多幅全息图对应的超声波声场上下层叠绘制到一张图中，就能够形成固体样品2内部结构和缺陷的三维图像。The process of using the utility model for photoacoustic composite three-dimensional micro-nano imaging detection is as follows: after the solid sample 2 is placed on the piezoelectric wafer 3, the computer 1 sends a trigger signal to the waveform generator 7 through the synchronous controller 5, and the waveform generates After the device 7 receives the trigger signal, it generates 3 to 12 sinusoidal signals with a period of T and outputs them to the power amplifier 4. The power amplifier 4 amplifies the received sinusoidal signals and outputs them to the piezoelectric wafer 3 to drive the piezoelectric wafer 3. Vibration to generate ultrasonic waves; the synchronous controller 5 controls the digital camera 6 to start after a certain time delay, and the synchronous controller 5 sends a trigger signal to the pulse laser 8 after a certain time delay, and the pulse laser 8 generates a pulse laser after receiving the trigger signal Irradiate on the second beam splitting cube mirror 11; The second beam splitting cube mirror 11 separates the pulse laser into an object light beam and a reference beam; the first beam expander 10 expands the object beam and irradiates the second beam On a reflector 12, the object light beam is reflected by the first reflector 12, and then passes through the first beam splitting cube mirror 9 to irradiate on the surface of the solid sample 2 to create an object light wavefront; the reference light beam passes through the third beam splitting cube The beam mirror 13 irradiates on the second reflector 14, and after being reflected by the second reflector 14, passes through the third beam splitter 13 to reach the second beam expander 16, and the second beam expander 16 expands the reference light beam. After the beam is irradiated on the first beam-splitting cube mirror 9; the object light wavefront reflected by the solid sample 2 reaches the first beam-splitting cube mirror 9, and passes through the first beam-splitting cube mirror 9 to superimpose the object light wavefront and the reference beam Together, interference occurs on the surface of the photosensitive element of the digital camera 6 to form a hologram; the digital camera 6 records the hologram, and transmits the recorded hologram data to the computer 1; repeat the detection process until multiple holograms are obtained In the figure, the ultrasonic sound field corresponding to each hologram represents an image of a slice in the solid sample 2, and the ultrasonic sound fields corresponding to multiple holograms are stacked and drawn into a single figure to form a three-dimensional view of the internal structure and defects of the solid sample 2 image.
以上所述，仅是本实用新型的较佳实施例，并非对本实用新型作任何限制，凡是根据本实用新型技术实质对以上实施例所作的任何简单修改、变更以及等效结构变化，均仍属于本实用新型技术方案的保护范围内。The above are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any simple modifications, changes and equivalent structural changes made to the above embodiments according to the technical essence of the present utility model still belong to Within the scope of protection of the technical solution of the utility model.
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