CN205335256U - Integrate LED packaging structure - Google Patents

Abstract

The utility model provides an integrate LED packaging structure, includes base plate, LED chip, the top surface of this base plate is equipped with the top surface circuit layer, the LED chip form to be established ties through this top surface circuit layer interconnect or parallelly connected electricity is connected, and the top surface of this base plate is provided with the recess, the LED chip sets up in this recess, and this recess intussuseption is filled with the cladding the encapsulation glue film of LED chip, the bottom surface of this base plate still is equipped with the bottom surface circuit layer, and it has the electrically conductive hole of this top surface circuit layer with this bottom surface circuit layer intercommunication to open on this base plate, and the integration is provided with control on this base plate the circuit component of LED chip, circuit component with LED chip electric connection. This integrate LED packaging structure has better integrated level, the good advantage of heat dissipation.

Description

Integrated LED package structure

technical field

The utility model relates to the technical field of LED packaging, in particular to an integrated LED packaging structure.

Background technique

The LED chip is a light-emitting diode (LED, Lighting emitted diode), which is a solid-state light-emitting device that uses a PN junction to emit light under the action of an electric field. LED chips have the characteristics of long life, environmental protection, and energy saving. They are new green light sources. At present, LED chips are widely used in the field of LED lighting.

As we all know, the LED chip needs an external circuit to light up and drive. The existing LED lighting device is mainly provided with a driving circuit outside. The driving circuit contains various driving components. The LED chip, driving circuit and other control components They are welded on different circuit boards respectively. In this way, each circuit board needs to be assembled into the LED lighting device during assembly. The assembly process is cumbersome, and the overall shape of the LED lighting device is huge, requiring a large amount of raw materials, which is not conducive to automatic production. If multiple LED chips can be integrated and packaged in a single lighting source, the overall lamp design and production process of the LED lighting device can be greatly simplified, and the cost can be greatly reduced.

Utility model content

The purpose of the utility model is to overcome the disadvantages of the prior art and provide an integrated LED packaging structure with better integration.

The purpose of the utility model is achieved through the following technical solutions: an integrated LED packaging structure, including a substrate and an LED chip, the top surface of the substrate is provided with a top circuit layer, and the LED chips are formed by connecting each other through the top circuit layer electrical connection in series or in parallel, the top surface of the substrate is provided with a groove, the LED chip is arranged in the groove, the groove is filled with an encapsulation layer covering the LED chip, and the bottom surface of the substrate is also A bottom circuit layer is provided, and a conductive hole connecting the top circuit layer and the bottom circuit layer is opened on the substrate. Circuit elements for controlling the LED chips are integrated on the substrate, and the circuit elements are connected to the LED chips. The chip is electrically connected.

Preferably, the conductive hole includes a positive conductive hole and a negative conductive hole, and the bottom circuit layer is provided with a positive conductive pad connected to the positive conductive hole and a negative conductive pad connected to the negative conductive hole.

Preferably, the positive electrode conductive pad and the negative electrode conductive pad are metal sheet structures and are thermally connected to the bottom surface of the substrate.

Preferably, the encapsulating glue layer is made by mixing transparent glue and fluorescent powder.

Preferably, the LED chip is a flip-chip LED chip structure.

Preferably, the substrate is made of silicon material.

Preferably, the circuit element is a patch element, the circuit element is arranged on the periphery of the LED chip, and the circuit element is electrically connected to the LED chip through the top circuit layer.

Preferably, the conductive hole is a metallized plated hole or a metal filled hole.

The utility model has the following advantages:

1. In this utility model, the circuit components are directly pasted on the substrate and these chips are integrated on the same substrate. By setting the groove, it is beneficial to better form the packaging adhesive layer on the substrate. When applied to lamps At the same time, it saves the special place for placing circuit components in the traditional process, has a better integration level, simplifies the installation process, and greatly reduces the production cost.

2. The utility model is also provided with the positive conductive pad and the negative conductive pad. By designing the positive conductive pad and the negative conductive pad into a larger sheet structure, it is beneficial to the production of these LED chips. The heat conducts to the bottom of the substrate, so that the heat is evenly distributed to the substrate to avoid heat accumulation, and further connected to the external heat sink through the positive conductive pad and the negative conductive pad for heat dissipation, which is beneficial to extend these LED chip life.

Description of drawings

Fig. 1 is the top view of the first embodiment of the utility model integrated LED packaging structure;

Fig. 2 is a bottom view of the first embodiment of the integrated LED packaging structure shown in Fig. 1;

Fig. 3 is a side view of the first embodiment of the integrated LED packaging structure shown in Fig. 1;

detailed description

The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Embodiment 1 (please refer to Fig. 1 to Fig. 3):

An integrated LED packaging structure provided by the utility model includes a substrate 10 and an LED chip 21. The top surface of the substrate 10 is provided with a top circuit layer (not shown), and these LED chips 21 are connected to each other through the top circuit layer. Make a series or parallel electrical connection. In this embodiment, these LED chips 21 are flip-chip LED chip structures. Wherein, the top circuit layer is a printed circuit or is formed by connecting a printed circuit and a gold wire.

Wherein, the top surface of the substrate 10 is provided with a groove 13, and the LED chips 21 are arranged in the groove 13, and the groove 13 is filled with an encapsulation layer 51 covering the LED chips 21, by setting the groove 13 is conducive to better forming the encapsulation adhesive layer 51 on the substrate 10, covering the LED chips 21 and isolating them from the following circuit components 31. In fact, part of the circuit components 31 can also be placed in the groove as needed. within 13. Wherein, the packaging glue layer 51 is made by mixing transparent glue and fluorescent powder. The substrate 10 is made of silicon material. Circuit elements 31 for controlling the LED chips 21 are integrally arranged on the substrate 10 , and these circuit elements 31 are arranged on the top circuit layer. These circuit elements 31 are patch elements, these circuit elements 31 are arranged on the periphery of these LED chips 21 , and these circuit elements 31 are electrically connected to these LED chips 21 through the top surface circuit layer. The utility model directly pastes these circuit elements 31 on the substrate 10 and integrates these LED chips 21 on the same substrate. When it is applied to a lamp, it saves the special position for placing the circuit elements 31 in the traditional process, and has the advantages of Better integration, simplified installation process, greatly reduced production cost.

In addition, the bottom surface of the substrate 10 is also provided with a bottom circuit layer (not shown), and the substrate 10 is provided with conductive holes connecting the top circuit layer and the bottom circuit layer. These conductive holes are metallized plated holes or Metal filled holes. The bottom circuit layer can be a printed circuit. The conductive holes include a positive conductive hole 11 and a negative conductive hole 12 . The bottom circuit layer is provided with a positive conductive pad 41 connected to the positive conductive hole 11 and a negative conductive pad 42 connected to the negative conductive hole 12 . The positive conductive pad 41 and the negative conductive pad 42 are metal sheet structures and are thermally connected to the bottom surface of the substrate 10 . In this embodiment, the positive electrode conductive pad 41 and the negative electrode conductive pad 42 are designed into a sheet structure with a large area, which is conducive to the conduction of heat generated by these LED chips to the bottom of the substrate, so that the heat is evenly distributed to the substrate. In order to avoid heat accumulation, the positive electrode conductive pad 41 and the negative electrode conductive pad 42 are further connected to an external heat sink for heat dissipation, which is beneficial to prolong the life of these LED chips 21 .

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. within the spirit and principles of the present utility model shall include Within the protection scope of the utility model.

Claims (8)

1. an integrated LED encapsulating structure, including substrate, LED chip, the end face of this substrate is provided with end face circuit layer, described LED chip is interconnected to form the electrical connection of serial or parallel connection by this end face circuit layer, it is characterized in that: the end face of this substrate is provided with groove, described LED chip is arranged in this groove, the encapsulation glue-line being coated with described LED chip it is filled with in this groove, the bottom surface of this substrate is additionally provided with bottom surface circuit layer, this substrate has the conductive hole connected with this bottom surface circuit layer by this end face circuit layer, integrally disposed on this substrate have the component controlling described LED chip, described component electrically connects with described LED chip。

2. integrated LED encapsulating structure according to claim 1, it is characterized in that: described conductive hole includes positive conductive hole and negative conductive hole, this bottom surface circuit layer is provided with the positive conductive pad connecting this positive conductive hole and the negative conductive pad connecting this negative conductive hole。

3. integrated LED encapsulating structure according to claim 2, it is characterised in that: this positive conductive pad and this negative conductive pad are sheet metal structure the bottom surface thermally coupled with this substrate。

4. integrated LED encapsulating structure according to claim 1, it is characterised in that: this encapsulation glue-line is formed by transparent adhesive tape and fluorescent material mixing manufacture。

5. integrated LED encapsulating structure according to claim 4, it is characterised in that: described LED chip is flip LED chips structure。

6. integrated LED encapsulating structure according to claim 1, it is characterised in that: this substrate is made by silicon materials。

7. integrated LED encapsulating structure according to claim 1, it is characterised in that: described component is surface mount elements, and described component is arranged at the periphery of described LED chip, and described component is electrically connected with the formation of described LED chip by this end face circuit layer。

8. integrated LED encapsulating structure according to claim 1, it is characterised in that: described conductive hole is metallization plated hole or metal-filled holes。