CN101110408A - Light emitting diode module - Google Patents

Abstract

The invention relates to a light-emitting diode module, which comprises a metal circuit substrate and a plurality of light-emitting diode crystal grains. The metal circuit substrate sequentially comprises a metal layer, an insulating heat conduction layer and a circuit layer; the LED dies are arranged on the metal circuit substrate and are respectively electrically connected with the circuit layer.

Description

LED Module

technical field

The present invention relates to a light-emitting module (that is, a module, hereinafter referred to as a module), in particular to a light-emitting diode module (LIGHT EMITTING DIODE MODULE).

Background technique

A light-emitting diode is a light-emitting element made of semiconductor materials. It has two electrode terminals. When a voltage is applied between the terminals and a very small voltage is passed through, the remaining energy can be converted into light through the combination of electron holes. The form of stimulated release.

Different from ordinary incandescent light bulbs, light-emitting diodes are cold-emitting, which have the advantages of low power consumption, long life of components, no need for warm-up time, and fast response. Coupled with its small size, vibration resistance, suitable for mass production, it is easy to make extremely small or array light-emitting modules according to application requirements, so it can be widely used in lighting equipment, information, communication, and consumer electronics. Devices and display devices have become one of the indispensable and important components in daily life.

Please refer to Fig. 1, in the prior art, a light emitting diode module (LED module) 10 includes a carrier board S and a plurality of light emitting diode elements 20, each light emitting diode element (LED device) 20 is arranged on the carrier board S, and The circuit on the carrier board S is used for electrical connection. In addition, in order to improve the utilization rate of light, in the prior art, a reflective sheet (not shown) is attached on the surface of the carrier board S of the LED module 10 .

Please refer to FIG. 2 , which is a schematic cross-sectional view of the LED element along the line A-A in FIG. 1 . The LED device 20 includes a substrate 21 , a LED die 22 , a lead frame 23 and an encapsulant 24 .

The lead frame 23 is arranged on the substrate 21, the LED die 22 is arranged on the lead frame 23 by using the bump 221, and then the lead frame 23 is used as the external electrical connection of the LED die 22, and the encapsulant 24 covers LED die 22 to protect the LED die 22 and form the LED element 20 .

As can be seen from FIGS. 1 and 2 , the assembly of the LED module 10 is quite complicated. The lead frame 23 needs to be combined with the substrate 21 first, and the LED die 22 needs to form bumps 221 to electrically connect with the lead frame 23 . After the assembly of the LED elements 20 is completed, a plurality of LED elements 20 must be placed on the carrier board S to complete the LED module 10 . Moreover, in order to improve the utilization rate of light, a reflective plate is even attached to the surface of the carrier plate S, which increases the assembly time.

In addition, solving the heat dissipation of the LED die 22 or the LED element 20 is an important issue. As the usage time increases, the temperature of the LED element 20 may generate considerable heat energy due to incomplete photoelectric conversion of the LED die 22 . If the temperature of the LED element 20 is not reduced immediately, the luminous efficiency of the LED die 22 will be affected, and its service life will be shortened. In the prior art, the heat energy generated by each LED die 22 can only be conducted from the bump 221 to the carrier board S through the lead frame 23 in the same way as the electrical connection, and there is no other heat dissipation path, so Obviously, it cannot meet the requirement of having the light emitting diode module 10 .

Therefore, how to provide an LED module that can solve the problem of heat dissipation of LED chips and LED elements is an important issue.

It can be seen that the above-mentioned existing light-emitting diode modules obviously still have inconveniences and defects in structure and use, and need to be further improved urgently. In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general products have no suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve. Therefore, how to create a new type of light-emitting diode module has become a goal that needs to be improved in the current industry.

In view of the defects existing in the above-mentioned existing light-emitting diode modules, the inventor actively researches and innovates based on years of rich practical experience and professional knowledge engaged in the design and manufacture of such products, and cooperates with the application of academic theories, in order to create a new type of LED module. The light-emitting diode module can improve the general existing light-emitting diode module to make it more practical. Through continuous research, design, and after repeated trial samples and improvements, the present invention with practical value is finally created.

Contents of the invention

The main purpose of the present invention is to overcome the defects of the existing LED module and provide a new LED module. The technical problem to be solved is to solve the heat dissipation problem, so that it is more suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. A light emitting diode module proposed according to the present invention includes: a metal circuit substrate, which sequentially includes a metal layer, an insulating heat conducting layer, and a circuit layer; and a plurality of light emitting diode crystal grains, arranged on the metal circuit substrate, And the light emitting diode crystal grains are respectively electrically connected with the circuit layer.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned LED module, the metal layer is made of copper or aluminum.

In the aforementioned light-emitting diode module, the surface of the metal layer has a metal coating film.

The aforementioned light-emitting diode module further includes: a heat-conducting metal plate connected with the metal layer.

In the aforementioned light-emitting diode module, the material of the insulating and heat-conducting layer is resin mixed with silicon carbide powder.

The aforementioned light emitting diode module, wherein the circuit layer includes a plurality of metal pads, the metal pads are arranged on the insulating and heat-conducting layer corresponding to the openings, and the light emitting diode crystal grains are respectively arranged on the metal pads above.

In the aforementioned LED module, the metal circuit substrate further includes an insulating layer disposed on the circuit layer, and the insulating layer has a plurality of openings.

In the aforementioned LED module, the insulating layer is a high reflective layer.

In the aforementioned light-emitting diode module, the material of the insulating layer is a mixture of titanium dioxide and resin.

The aforementioned light emitting diode module further includes: an encapsulant, using the edges of the openings exposed by the insulating layer as encapsulation boundaries.

The aforementioned light emitting diode module further includes: a driving circuit, which is arranged on the metal circuit substrate and is electrically connected with the light emitting diode crystal grains.

With the above-mentioned technical solutions, the LED module of the present invention has at least the following advantages: because a LED module according to the present invention includes a metal circuit substrate and a plurality of LED chips, wherein the metal circuit substrate includes a metal layer. Compared with the prior art, the LED dies of the LED module are arranged on the insulating heat-conducting layer or the circuit layer, which can quickly transmit the heat energy generated by the LED dies to the metal layer, so it can effectively assist the LED dies Heat dissipation, prolong the service life of the LED module, and ensure the luminous quality of the LED module. Secondly, the LED dies are placed on the metal circuit substrate to form a chip-on-chip package (COB). That is to say, the LED dies only need to be placed on the metal substrate to complete the assembly of the LED module. The steps and time of the assembly process. Furthermore, in the embodiment, the metal circuit substrate further includes an insulating layer, and the insulating layer has a plurality of openings, and each opening can be used as a sealing boundary of the encapsulation process, so as to reduce the steps and time of the encapsulation process.

To sum up, the novel LED module of the present invention can solve the problem of heat dissipation. The present invention has the above-mentioned many advantages and practical value, it has great improvement no matter in device structure or function, has significant progress in technology, and has produced easy-to-use and practical effect, and compared with existing light-emitting diode The module has improved functions, so it is more suitable for practical use, and has wide application value in the industry. It is a novel, progressive and practical new design.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a light emitting diode module in the prior art;

Fig. 2 is a schematic cross-sectional view of a light-emitting diode element in a prior art light-emitting diode module along the line A-A of Fig. 1;

FIG. 3 is a three-dimensional schematic diagram of the LED module of the present invention;

Fig. 4 is a schematic cross-sectional view of the LED module of the present invention along the line B-B in Fig. 3;

5 is another schematic cross-sectional view of the LED module of the present invention;

6 is another schematic cross-sectional view of the LED module of the present invention;

7 is another schematic cross-sectional view of the LED module of the present invention;

FIG. 8 is another schematic cross-sectional view of the LED module of the present invention; and

FIG. 9 is another schematic cross-sectional view of the LED module of the present invention.

10 LED modules

20 LED components

21 Substrate

22 LED grains

221 bump

23 lead frame

24 sealants

30 LED modules

31 metal circuit board

311 metal layer

312 Insulation and heat conduction layer

313 line layer

314 insulating layer

315 opening

32 LED Die

33 sealant

34 drive circuit

35 cooling element

351 cooling fins

36 heat conduction metal plate

A-A straight line

B-B straight line

M metal pad

P solder paste

S load plate

V through hole

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and effects of the light-emitting diode module proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , as detailed below.

Please refer to FIG. 3 , the LED module 30 includes a metal circuit substrate 31 and a plurality of LED dies 32 . It should be noted that the number and arrangement of the LED chips 32 in the LED module 30 are not limited. In this embodiment, the light emitting diode dies 32 are arranged in an array as an example, of course, each light emitting diode die 32 may also be arranged in a straight line.

Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 4 is a schematic cross-sectional view along the line B-B in FIG. The metal circuit substrate 31 sequentially includes a metal layer 311, an insulating and heat-conducting layer 312, and a circuit layer 313. For example, the circuit substrate 31 can be a printed circuit board (PCB), sandwiched between the metal layer 311 and the circuit layer 313 The insulating and heat-conducting layer 312 can be used as an insulating layer, and the printed circuit board can be a flexible printed circuit board or a rigid printed circuit board. Wherein, the material of the metal layer 311 can be a metal with high thermal conductivity, such as copper or aluminum, and the thickness of the metal layer 311 can reach several micrometers (μm). Wherein, the metal layer 311 can also be a metal composite laminate layer, that is, the metal layer 311 can be formed by stacking multiple metal layers, such as stacking a copper metal layer on an aluminum metal layer. In addition, the material of the insulating and thermally conductive layer 312 is an insulating layer with high thermal conductivity, such as resin mixed with silicon carbide powder.

Each LED chip 32 is respectively arranged on the metal circuit substrate 31, and is electrically connected to the circuit layer 313, which is commonly known as chip on board (COB). The connection of the circuit layer 313 can control the driving The light emission of each LED die 32 . In this embodiment, the type of the LED crystal grain 32 is not limited. In FIG. 4, the LED crystal grain 32 whose electrodes are fabricated on the same surface is taken as an example, and the LED crystal grain 32 is arranged on the metal layer 311. Therefore, Double wiring is required to electrically connect the LED die 32 and the circuit layer 313 .

Please refer to FIG. 5 , the electrodes of the LED die 32 can also be on different sides, so as to be a vertical conduction die. At this time, the LED die 32 is disposed on the circuit layer 313 to facilitate electrical connection. That is to say, in this embodiment, according to the different types of the LED die 32 , the LED die 32 and the circuit layer 313 can be electrically connected by wire bonding or flip-chip bonding.

Referring to FIG. 6 , in this embodiment, the metal circuit substrate 31 may further include an insulating layer 314 disposed on the wiring layer 313 , and the insulating layer 314 has a plurality of openings 315 . Wherein, the insulating layer 314 is a high reflection layer, and its material may be a mixture of titanium dioxide (TiO2) and resin, and the resin may be epoxy resin. Titanium dioxide can be used to form a white high-reflection surface on the metal circuit substrate 31 , so that the light emitted by the LED crystal grains 32 can have better light utilization efficiency.

In addition, the light emitting diode module 30 can further include a sealing body 33 , and the sealing body 33 can use the edge of the opening 315 of the insulating layer 314 as a sealing boundary of the package. In this way, it is not necessary to form another cavity as the encapsulation boundary of the package, so the steps and time of the package process can be reduced. In addition, the encapsulant 33 can be a lens or other light-transmitting covering material, which can have the effect of modifying the light shape of the LED die 32 .

Referring again to FIG. 6 , the LED module 30 may further include a heat-conducting metal plate 36 which is connected to the metal layer 311 by means of attachment, adhesion or locking. In this way, the thickness of the metal portion of the circuit substrate 31 can be increased to assist heat dissipation.

Since each light-emitting diode die 32 is disposed on the insulating heat-conducting layer 312 or the circuit layer 313 , the heat energy generated by the light-emitting diode die 32 can be directly transmitted down to the metal layer 311 through the insulating heat-conducting layer 312 or the circuit layer 313 , can increase the heat dissipation area, so it can effectively assist the LED die 32 to dissipate heat, prolong the service life of the LED die 32 , and improve the luminous quality of the LED die 32 . In addition, the light-emitting diode die 32 in the present invention only needs to be placed on the metal substrate 31 to complete the assembly of the light-emitting diode module, thus reducing the steps and time of the assembly process.

Referring to FIG. 3 again, the LED module 30 may further include a driving circuit 34, the driving circuit 34 is arranged on the metal circuit board 31, and is electrically connected with each LED die 32 to drive the LEDs. Grain 32. Wherein, the driving circuit 34 can comprise an active element or a passive element, and the active element can be a switching element, such as a transistor (i.e. a transistor) as a diode; the passive element can then be a capacitor, a resistor, a inductance or a combination thereof. In this embodiment, it is taken that the LED module 30 includes a plurality of driving circuits 34 as an example.

It is worth mentioning that, in this embodiment, the structure of the metal circuit substrate 31 may have different forms.

Please refer to FIG. 7 , the insulating layer 314 can also be extended to the insulating and heat-conducting layer 312 , and the leads of the LED die 32 pass through the insulating layer 314 to be electrically connected to the circuit layer 313 . In the actual manufacturing process, the via holes V required for wire bonding can be left in the insulating layer 314 to facilitate the wire bonding process.

Please refer to FIG. 3 and FIG. 8 at the same time. The circuit layer 313 may include a plurality of metal pads M. It can be seen in FIG. 8 that each LED die 32 corresponds to a metal pad M. As shown in FIG. The metal pads M are respectively filled on the insulating and heat-conducting layer 312 corresponding to the openings 315 , and the light emitting diode die 32 are disposed on the metal pads M respectively. The metal pad part M can be formed simultaneously with the wiring layer 313 during fabrication, and is a part of the pattern of the wiring layer 313 . Wherein, the metal pad part M can be in direct contact with the LED die 32, in addition to increasing the height of the LED die 32 and preventing the light emitted from the side of the LED die 32 from being blocked by the insulating layer 314, The surface of the metal pad M can be plated with a metal with high reflectivity, such as silver, so as to reflect upward the side light emitted by the LED die 32 to improve light utilization efficiency. In addition, the metal pad part M can also assist the conduction of heat energy. When the LED die 32 is installed, it can be placed on the metal pad M after being coated with solder paste P, so as to increase the connection strength between the LED die 32 and the metal pad M. Referring to FIG.

Please refer to FIG. 9 , since the LED die 32 is disposed on the insulating and heat-conducting layer 312 or the wiring layer 313 . In order to improve the efficiency of heat dissipation, the LED module 30 can have an additional heat dissipation element 35, and the heat dissipation element 35 is connected with the metal layer 311, for example, the heat dissipation element 35 and the metal layer are connected by attaching, adhering, or locking. 311 link. The heat dissipation element 35 may have a plurality of heat dissipation fins 351 or other heat dissipation components (such as heat pipes, fans, etc.). FIG. 9 is an example of a heat dissipation element with a plurality of heat dissipation fins 351 .

To sum up, an LED module of the present invention includes a metal circuit substrate and a plurality of LED chips, wherein the metal circuit substrate includes a metal layer. Compared with the prior art, the LED dies of the LED module are arranged on the insulating heat-conducting layer or the circuit layer, which can quickly transmit the heat energy generated by the LED dies to the metal layer, so it can effectively assist the LED dies Heat dissipation, prolong the service life of the LED module, and ensure the luminous quality of the LED module. Secondly, the LED dies are placed on the metal circuit substrate to form a chip-on-chip package (COB). That is to say, the LED dies only need to be placed on the metal substrate to complete the assembly of the LED module. The steps and time of the assembly process. Furthermore, in the embodiment, the metal circuit substrate further includes an insulating layer, and the insulating layer has a plurality of openings, and each opening can be used as a sealing boundary of the encapsulation process, so as to reduce the steps and time of the encapsulation process.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but all the content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solutions of the present invention.

Claims (11)

1. A light emitting diode module, characterized in that it comprises: A metal circuit substrate sequentially includes a metal layer, an insulating and heat-conducting layer, and a circuit layer; and A plurality of light-emitting diode crystal grains are arranged on the metal circuit substrate, and the light-emitting diode crystal grains are respectively electrically connected with the circuit layer. 2. The LED module according to claim 1, wherein the metal layer is made of copper or aluminum. 3. The LED module according to claim 1, wherein the surface of the metal layer has a metal coating. 4. The LED module according to claim 1, further comprising: A thermally conductive metal plate is connected with the metal layer. 5 . The LED module according to claim 1 , wherein the insulating and heat-conducting layer is made of resin mixed with silicon carbide powder. 6. The light-emitting diode module according to claim 1, wherein the circuit layer includes a plurality of metal pads, and the metal pads are arranged on the insulating and heat-conducting layer corresponding to the openings, and the light-emitting diodes The crystal grains are respectively disposed on the metal pads. 7. The LED module according to claim 1, wherein the metal circuit substrate further comprises an insulating layer disposed on the circuit layer, and the insulating layer has a plurality of openings. 8. The LED module according to claim 7, wherein the insulating layer is a high reflection layer. 9. The LED module according to claim 7, wherein the material of the insulating layer is a mixture of titanium dioxide and resin. 10. The LED module according to claim 7, further comprising: The encapsulation body uses the edges of the openings exposed by the insulating layer as the encapsulation boundaries. 11. The LED module according to claim 1, further comprising: A driving circuit is arranged on the metal circuit substrate and is electrically connected with the LED crystal grains.

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