CN205082113U - Electronic product heat radiation structure - Google Patents
Electronic product heat radiation structure Download PDFInfo
- Publication number
- CN205082113U CN205082113U CN201520749002.0U CN201520749002U CN205082113U CN 205082113 U CN205082113 U CN 205082113U CN 201520749002 U CN201520749002 U CN 201520749002U CN 205082113 U CN205082113 U CN 205082113U
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- CN
- China
- Prior art keywords
- heat
- electronic product
- heat radiation
- air duct
- pedestal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an electronic product heat radiation structure, including pedestal and heat conduction piece, the heat conduction piece sets up in the pedestal, still including heat dissipation fan, heat dissipation body and heat pipe, the heat dissipation body extends the pedestal and is connected with the heat conduction piece through the heat pipe from the horizontal direction, seted up air duct on the internal horizontal direction of cooling tube, air duct includes air inlet and first air outlet, the heat dissipation fan sets up at air inlet. It can guarantee CPU heat dissipation function and can form the heat radiation structure that the air flows in the electronic product to be one kind.
Description
Technical field
The utility model relates to a kind of radiator structure, particularly a kind of electronic product radiating structure.
Background technology
The CPU (central processing unit) of electronic product (as notebook computer) can produce a large amount of heats at work, if these heats are not distributed in time, cpu temperature can be caused to rise sharply, light then cause electronic product to crash, heavy then CPU may be burnt, therefore can be equipped with radiator structure at electronic product is CPU heat radiation.Existing heat sink and heat emission fan are vertically set on above CPU, the heat produced by CPU is delivered to after heat sink to be accelerated to discharge by heat emission fan, but this radiator structure can only process the heat be passed on heat sink, and the heat that around CPU, other electronic units produce can not be processed, air flowing is not formed in electronic product, cause in electronic product, still there is amount of heat cannot distribute, out of condition to electronic product integral heat sink, and can have an impact to the heat radiation of CPU.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of radiator structure that CPU heat sinking function also can form air flowing in electronic product that can ensure.
The utility model solves the problems of the technologies described above adopted technical scheme:
A kind of electronic product radiating structure, comprise pedestal and heat-conducting block, heat-conducting block is arranged in pedestal, its structure also comprises heat emission fan, heat radiation body and heat pipe, described heat radiation body is extended pedestal from horizontal direction and is connected with heat-conducting block by heat pipe, in described heat radiation body, horizontal direction offers air duct, air duct comprises air intake and the first air outlet slit, and described heat emission fan is arranged on air intake.Heat radiation body is opened in the horizontal direction of pedestal, be delivered to heat radiation body by heat-conducting block and heat pipe after the heat that CPU is produced to distribute, the offering of air duct to make with the position of heat emission fan air-cooledly in electronic product, to form air flowing by air duct, heat emission fan can take away the heat being passed to heat radiation body simultaneously, helps CPU quick heat radiating.
As preferably, described air duct also offers the second air outlet slit on pedestal direction.Second air outlet slit is offered to cpu bound, makes that a part is air-cooled directly to be reached around heat-conducting block, heat pipe and CPU thus to accelerate the heat radiation of CPU.
Further, be provided with flow distribution plate in described air duct, flow distribution plate one end extends to the second air outlet slit.Guide functions is played in the setting of flow distribution plate, makes more air-cooledly to blow to cpu bound from the second air outlet slit.
Further, the described flow distribution plate other end extends to air intake.Flow distribution plate extends to air intake makes the cold wind of heat emission fan can directly enter the air duct leading to the second air outlet slit, and cooling effect is better.
Further, fin is provided with in the air duct between described air intake and the first air outlet slit.The setting of fin makes air-cooledly more easily to conduct to heat radiation body end face, and the heat on heat radiation body is dissipated sooner.
Further, described air duct is curved, and described fin be arranged in parallel and is the arc identical with air duct radius.The setting of arc makes air-cooled path in heat radiation body longer; Smooth for ensureing that flowing does not occur because of flow-disturbing air duct, fin be arranged in parallel and is the arc identical with air duct radius.
As preferably, described pedestal and heat radiation face, body one end one-body molded, described heat radiation body end face offers the cell body for installing heat pipe.One-body molded and cell body arranges the heat that CPU is produced and more easily conducts to heat radiation body.
Further, described heat pipe and cell body are the arc of snug fit, and after in the middle part of end face, extend to opposite side from described heat radiation body end face side.Heat pipe and cell body curved and ensure the path of heat pipe and snug fit good heat conduction effect by reaching end face another side behind middle part.
The utility model compared with the existing technology has the following advantages and effect: heat radiation body is opened in the horizontal direction of pedestal, be delivered to heat radiation body by heat-conducting block and heat pipe after the heat that CPU is produced to distribute, one-body molded and cell body arranges the heat that CPU is produced and more easily conducts to heat radiation body, heat pipe and cell body curved and by the path that reaches end face another side guarantee heat pipe behind middle part and snug fit good heat conduction effect; The offering of air duct to make with the position of heat emission fan air-cooledly in electronic product, to form air flowing by air duct, heat emission fan can take away the heat being passed to heat radiation body simultaneously, help CPU quick heat radiating, the setting of the second air outlet slit, flow distribution plate and fin enables CPU dispel the heat more rapidly.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is explosive view of the present utility model.
Label declaration:
Pedestal 1 heat-conducting block 2 heat emission fan 3
Heat radiation body 4 air duct 41 air intake 411
First air outlet slit 412 second air outlet slit 413 flow distribution plate 42
End face 43 cell body 431 fin 44
Heat pipe 5
Embodiment
Be described in further detail the utility model below in conjunction with embodiment, following examples are that the utility model is not limited to following examples to explanation of the present utility model.
Embodiment 1:
As shown in Fig. 1 to 2, the present embodiment comprises pedestal 1 and heat-conducting block 2, heat-conducting block 2 to be arranged in pedestal and to be connected with CPU by silica gel Heat Conduction Material, the heat radiation end face 43 of body 4 and pedestal 1 one-body molded and extend pedestal 1 from horizontal direction, end face 43 offers and runs through end face 43 and by the arc cell body 431 in the middle part of it, be close in cell body 431 and be provided with heat pipe 5, heat pipe 5 other end is connected with heat-conducting block 2.In heat radiation body 4, horizontal direction offers arc air duct 41, the second air outlet slit 413 that air duct 41 comprises air intake 411, first air outlet slit 412 and offers on pedestal 1 direction, flow distribution plate 42 extends to the second air outlet slit 413 from air intake 411, heat emission fan 3 is arranged on air intake 41 place, also be provided with fin 44 in air duct 411 between air intake 411 and the first air outlet slit 412, each fin 44 equidistant parallels arrange and are the arc identical with air duct 41 radius.
In addition, it should be noted that, the specific embodiment described in this specification, the shape, institute's title of being named etc. of its parts and components can be different.All equivalences of doing according to structure, feature and the principle described in the utility model inventional idea or simple change, be included in the protection range of the utility model patent.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment; only otherwise depart from structure of the present utility model or surmount this scope as defined in the claims, protection range of the present utility model all should be belonged to.
Claims (8)
1. an electronic product radiating structure, comprise pedestal and heat-conducting block, heat-conducting block is arranged in pedestal, it is characterized in that: also comprise heat emission fan, heat radiation body and heat pipe, described heat radiation body is extended pedestal from horizontal direction and is connected with heat-conducting block by heat pipe, in described heat radiation body, horizontal direction offers air duct, air duct comprises air intake and the first air outlet slit, and described heat emission fan is arranged on air intake.
2. electronic product radiating structure according to claim 1, is characterized in that: described air duct also offers the second air outlet slit on pedestal direction.
3. electronic product radiating structure according to claim 2, it is characterized in that: be provided with flow distribution plate in described air duct, flow distribution plate one end extends to the second air outlet slit.
4. electronic product radiating structure according to claim 3, is characterized in that: the described flow distribution plate other end extends to air intake.
5. electronic product radiating structure according to claim 4, is characterized in that: be provided with fin in the air duct between described air intake and the first air outlet slit.
6. electronic product radiating structure according to claim 5, is characterized in that: described air duct is curved, and described fin be arranged in parallel and is the arc identical with air duct radius.
7. electronic product radiating structure according to claim 1, is characterized in that: described pedestal is one-body molded with heat radiation face, body one end, and described heat radiation body end face offers the cell body for installing heat pipe.
8. electronic product radiating structure according to claim 7, is characterized in that: described heat pipe and cell body are the arc of snug fit, and after in the middle part of end face, extends to opposite side from described heat radiation body end face side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520749002.0U CN205082113U (en) | 2015-09-24 | 2015-09-24 | Electronic product heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520749002.0U CN205082113U (en) | 2015-09-24 | 2015-09-24 | Electronic product heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205082113U true CN205082113U (en) | 2016-03-09 |
Family
ID=55434481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520749002.0U Expired - Fee Related CN205082113U (en) | 2015-09-24 | 2015-09-24 | Electronic product heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205082113U (en) |
-
2015
- 2015-09-24 CN CN201520749002.0U patent/CN205082113U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160309 Termination date: 20160924 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |