CN204648057U - Oil-cooled LED automotive headlight light sources and components - Google Patents
Oil-cooled LED automotive headlight light sources and components Download PDFInfo
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- 239000000919 ceramic Substances 0.000 claims abstract description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 239000005361 soda-lime glass Substances 0.000 claims abstract description 7
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims abstract description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052796 boron Inorganic materials 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims abstract description 4
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 19
- 229920002545 silicone oil Polymers 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 22
- 239000003921 oil Substances 0.000 abstract 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 241000217776 Holocentridae Species 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 4
- 239000011224 oxide ceramic Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- -1 lutetium aluminum Chemical compound 0.000 description 1
- 229910003443 lutetium oxide Inorganic materials 0.000 description 1
- MPARYNQUYZOBJM-UHFFFAOYSA-N oxo(oxolutetiooxy)lutetium Chemical compound O=[Lu]O[Lu]=O MPARYNQUYZOBJM-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HYXGAEYDKFCVMU-UHFFFAOYSA-N scandium oxide Chemical compound O=[Sc]O[Sc]=O HYXGAEYDKFCVMU-UHFFFAOYSA-N 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及LED发光技术，具体地，涉及一种油冷LED汽车前照灯光源及组件。The utility model relates to LED lighting technology, in particular to an oil-cooled LED automotive headlight light source and components.
背景技术Background technique
近年来LED已经在各个领域逐步替代传统光源，其中LED汽车前照灯就是一个很重要的应用领域，并且多种品牌的高端车型已经开始使用LED前照灯。目前市面上出现了很多用于替换传统汽车前照灯光源的LED光源。然而由于亮度不够、光型不好的原因，LED汽车前照灯光源没能引起替换市场的广泛认可。这是因为现用于汽车前照灯的灯丝灯、氙气灯的发光部位体积很小，通常小于并且是360°发光光源。然而，LED为180°发光光源，目前市面上的替换是LED汽车前照灯通过两个LED光源背靠背或多个LED光源贴在正多边形侧面的形式达到360°发光的目的。这种方法虽然达到了360°发光的目的，但是造成了光源散热不良和体积过大的问题，使其配于传统汽车前照灯总成时出现亮度不够、光型不好的问题。In recent years, LEDs have gradually replaced traditional light sources in various fields, among which LED automotive headlights are a very important application field, and high-end models of various brands have begun to use LED headlights. At present, there are many LED light sources on the market that are used to replace traditional automotive headlight light sources. However, due to insufficient brightness and poor light pattern, the LED automotive headlight light source has not been widely recognized in the replacement market. This is because the volume of the light-emitting parts of the filament lamps and xenon lamps currently used in automobile headlights is very small, usually smaller than And it is a 360° luminous light source. However, LED is a 180° light source. The current replacement on the market is that the LED car headlight achieves 360° light emission in the form of two LED light sources back to back or multiple LED light sources attached to the side of a regular polygon. Although this method achieves the purpose of 360° luminescence, it causes the problems of poor heat dissipation and excessive volume of the light source, which leads to problems of insufficient brightness and poor light pattern when it is equipped with a traditional automobile headlight assembly.
实用新型内容Utility model content
针对现有技术中的缺陷，本实用新型的目的是提供一种油冷LED汽车前照灯光源及组件。Aiming at the defects in the prior art, the purpose of this utility model is to provide an oil-cooled LED automotive headlight light source and components.
根据本实用新型的一个方面提供的油冷LED汽车前照灯光源，包括透明灯管、LED灯芯、导热硅油及散热基座；According to one aspect of the utility model, the oil-cooled LED automotive headlight light source includes a transparent lamp tube, an LED wick, a heat-conducting silicone oil, and a heat-dissipating base;
其中，所述LED灯芯设置在所述透明灯管内侧且设置在所述散热基座上；所述透明灯管与LED灯芯形成第一空腔，所述导热油填充于所述第一空腔内。Wherein, the LED wick is arranged inside the transparent lamp tube and on the heat dissipation base; the transparent lamp tube and the LED wick form a first cavity, and the heat transfer oil is filled in the first cavity Inside.
优选地，所述透明灯管采用透明的钠钙硅玻璃、硼玻璃、石英玻璃、氧化铝透明陶瓷、氧化钇透明陶瓷或钇铝石榴石透明陶瓷制成。Preferably, the transparent lamp tube is made of transparent soda lime silica glass, boron glass, quartz glass, alumina transparent ceramics, yttrium oxide transparent ceramics or yttrium aluminum garnet transparent ceramics.
优选地，所述透明灯管为一端开口、另一端闭合的柱状体，所述柱状体为圆柱状、矩形柱、四方柱状、六方柱状或八方柱状。Preferably, the transparent lamp tube is a columnar body with one end open and the other end closed, and the columnar body is cylindrical, rectangular, square, hexagonal or octagonal.
优选地，所述LED灯芯包括第一单元模块和第二单元模块；Preferably, the LED wick includes a first unit module and a second unit module;
其中，所述第一单元模块与所述第二单元模块背靠背拼接；所述第一单元模块和所述第二单元模块均包括LED芯片、散热基板和围坝框；所述LED芯片设置在所述散热基板上；所述围坝框设置在所述LED芯片的外周。Wherein, the first unit module and the second unit module are spliced back to back; both the first unit module and the second unit module include an LED chip, a heat dissipation substrate and a dam frame; the LED chip is arranged on the on the heat dissipation substrate; the dam frame is arranged on the outer periphery of the LED chip.
优选地，所述散热基座设置有第二空腔；Preferably, the heat dissipation base is provided with a second cavity;
其中，所述第一空腔和所述第二空腔形成循环回路。Wherein, the first cavity and the second cavity form a circulation loop.
优选地，还包括透明荧光陶瓷；所述透明荧光陶瓷设置在所述围坝框的内框中。Preferably, transparent fluorescent ceramics are also included; the transparent fluorescent ceramics are arranged in the inner frame of the dam frame.
优选地，所述LED灯芯包括单元模块；Preferably, the LED wick includes a unit module;
其中，所述单元模块包括LED芯片、散热基板和透明荧光陶瓷；Wherein, the unit module includes an LED chip, a heat dissipation substrate and a transparent fluorescent ceramic;
所述LED芯片设置在所述散热基板上；所述透明荧光陶瓷设置在所述LED芯片上侧。The LED chip is arranged on the heat dissipation substrate; the transparent fluorescent ceramic is arranged on the upper side of the LED chip.
优选地，所述LED灯芯包括晶圆级封装芯片和透明荧光陶瓷；Preferably, the LED wick includes wafer-level package chips and transparent fluorescent ceramics;
其中，所述透明荧光陶瓷设置在所述晶圆级封装芯片的两侧。Wherein, the transparent fluorescent ceramics are arranged on both sides of the wafer-level package chip.
优选地，所述导热硅油采用透明的导热硅油。Preferably, the heat-conducting silicone oil is transparent heat-conducting silicone oil.
优选地，所述LED灯芯为360度出光光源，该360度出光光源的实现形式为灯芯采用透明材料、多块含LED芯片的散热板组合、直接在灯芯的多个面上放置LED芯片。Preferably, the LED wick is a 360-degree light-emitting light source, and the 360-degree light-emitting light source is realized in the form that the wick is made of transparent materials, a combination of multiple heat dissipation plates containing LED chips, and LED chips are directly placed on multiple surfaces of the wick.
优选地，所述透明荧光陶瓷采用稀土掺杂的氧化钇陶瓷(Re：Y2O3)，氧化镥陶瓷(Re：Lu2O3)，氧化钪陶瓷(Re：Sc2O3)，钇铝石榴石陶瓷(Re：Y3Al5O12)，镥铝石榴石陶瓷(Re：Lu3Al5O12)或过渡元素掺杂的氧化铝陶瓷。Preferably, the transparent fluorescent ceramics are rare earth doped yttrium oxide ceramics (Re: Y 2 O 3 ), lutetium oxide ceramics (Re: Lu 2 O 3 ), scandium oxide ceramics (Re: Sc 2 O 3 ), yttrium oxide ceramics (Re: Sc 2 O 3 ), Aluminum garnet ceramics (Re: Y 3 Al 5 O 12 ), lutetium aluminum garnet ceramics (Re: Lu 3 Al 5 O 12 ) or transition element-doped alumina ceramics.
优选地，稀土元素可为单掺的Ce，或者Ce与Eu、Er、Nd、Pr、Gd、Tb、Sm、Tm、Dy、Yb或Lu其中的一种或任意几种共掺；稀土元素掺杂总量为0.001到10wt.％。Preferably, the rare earth element can be single-doped Ce, or Ce and one or any of several of Eu, Er, Nd, Pr, Gd, Tb, Sm, Tm, Dy, Yb or Lu are co-doped; The amount of impurities is 0.001 to 10 wt.%.
根据本实用新型的另一个方面提供的油冷LED汽车前照灯组件，所述的油冷LED汽车前照灯光源，还包括光源基座、导油管和散热器；According to another aspect of the utility model, the oil-cooled LED automobile headlight assembly provided, the oil-cooled LED automobile headlight light source also includes a light source base, an oil guide pipe and a radiator;
其中，所述油冷LED汽车前照灯光源设置在所述光源基座上；所述油冷LED汽车前照灯光源的LED灯芯设置在所述导油管的插槽上；Wherein, the oil-cooled LED automobile headlight light source is arranged on the light source base; the LED wick of the oil-cooled LED automobile headlight light source is arranged on the slot of the oil guide pipe;
所述光源基座设置在所述散热器上；所述导油管设置在在所述光源基座的内侧。The light source base is arranged on the radiator; the oil guide pipe is arranged inside the light source base.
与现有技术相比，本实用新型具有如下的有益效果：Compared with the prior art, the utility model has the following beneficial effects:
1、本实用新型通过采用油冷方式增强LED光源的散热能力，导热硅油填充于透明灯管和散热基座中的空腔中，LED灯芯发出的热量能够有效地扩散到导热硅油中，同时可以有效地提高LED光色及光强的空间均匀性；1. The utility model enhances the heat dissipation capacity of the LED light source by adopting an oil cooling method, and the heat-conducting silicone oil is filled in the cavity in the transparent lamp tube and the heat-dissipating base, and the heat emitted by the LED wick can be effectively diffused into the heat-conducting silicone oil, and at the same time can Effectively improve the spatial uniformity of LED light color and light intensity;
2、本实用新型中LED灯芯与散热基座装配时，导热硅油在光源与散热基座之间形成循环流动，通过导热硅油的对流散热及高热容将光源的热量快速地带离到散热基座中，并在散热基座中形成良好的均温；2. In the utility model, when the LED wick is assembled with the heat dissipation base, the heat conduction silicone oil forms a circular flow between the light source and the heat dissipation base, and the heat of the light source is quickly taken away from the heat dissipation base by the convective heat dissipation and high heat capacity of the heat conduction silicone oil , and form a good uniform temperature in the heat dissipation base;
3、本实用新型提供的LED汽车前照灯能够获得与现有汽车前照灯相近的发光强度、发光面积及发光角度，能够直接替换现有的汽车前照灯光源。3. The LED automobile headlight provided by the utility model can obtain similar luminous intensity, luminous area and luminous angle to the existing automobile headlight, and can directly replace the existing light source of the automobile headlight.
附图说明Description of drawings
通过阅读参照以下附图对非限制性实施例所作的详细描述，本实用新型的其它特征、目的和优点将会变得更明显：Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:
图1为本实用新型中油冷LED汽车前照灯光源的结构示意图；Fig. 1 is the structure schematic diagram of oil-cooled LED automobile headlight source in the utility model;
图2为本实用新型中油冷LED汽车前照灯组件结构示意图；Fig. 2 is a structural schematic diagram of the utility model medium oil-cooled LED automobile headlamp assembly;
图3为本实用新型中一个单元模块的光强角分布图。Fig. 3 is a light intensity angular distribution diagram of a unit module in the utility model.
图中：In the picture:
11为透明灯管；11 is a transparent light tube;
12为导热硅油；12 is heat-conducting silicone oil;
13为LED灯芯；13 is the LED wick;
21为油冷LED汽车前照灯光源；21 is an oil-cooled LED automotive headlight light source;
22为导油管；22 is the oil guide pipe;
23为光源基座；23 is a light source base;
24为散热器。24 is radiator.
具体实施方式Detailed ways
下面结合具体实施例对本实用新型进行详细说明。以下实施例将有助于本领域的技术人员进一步理解本实用新型，但不以任何形式限制本实用新型。应当指出的是，对本领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干变形和改进。这些都属于本实用新型的保护范围。The utility model is described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present utility model. These all belong to the protection domain of the present utility model.
实施例1：Example 1:
如图1所所示，LED灯芯由两片单元模块背靠背拼接而成。单片模块由5颗白光LED芯片、氮化铝散热基板以及围坝框组成。5颗白光LED芯片使用共晶焊工艺焊接于氮化铝散热基板的表面，使用金线键合工艺使5颗芯片形成串联结构。选用管径10mm、管壁厚度为1mm的透明石英玻璃管。透明石英玻璃管将两单片模块封闭于内，两单片模块背靠背紧贴，模块与透明石英玻璃管形成一个U型空腔，即第一空腔，U型空腔内填充导热油，利用导热油在光源内腔的循环流动实现光源的高效散热。通电后光源呈6000K白光，灯管360度发光且无明显暗区。所述LED灯芯设置在所述散热基座上。散热基座设置有第二空腔；所述第一空腔和所述第二空腔形成循环回路。所述导热油采用透明的导热硅油。所述透明灯管采用透明的钠钙硅玻璃、硼玻璃、石英玻璃、氧化铝透明陶瓷、氧化钇透明陶瓷或钇铝石榴石透明陶瓷制成。所述透明灯管为一端开口、另一端闭合的柱状体，所述柱状体为圆柱状、矩形柱、四方柱状、六方柱状或八方柱状。As shown in Figure 1, the LED wick is formed by splicing two unit modules back to back. The monolithic module consists of 5 white LED chips, an aluminum nitride heat sink substrate and a dam frame. 5 white LED chips are soldered to the surface of the aluminum nitride heat sink substrate by eutectic soldering process, and the 5 chips are connected in series by using gold wire bonding process. A transparent quartz glass tube with a diameter of 10 mm and a wall thickness of 1 mm was selected. The transparent quartz glass tube seals the two monolithic modules inside, and the two monolithic modules are attached back to back. The module and the transparent quartz glass tube form a U-shaped cavity, that is, the first cavity. The U-shaped cavity is filled with heat-conducting oil. The circulating flow of heat transfer oil in the inner cavity of the light source realizes the efficient heat dissipation of the light source. After power on, the light source is 6000K white light, and the lamp tube emits light at 360 degrees without obvious dark areas. The LED wick is arranged on the heat dissipation base. The heat dissipation base is provided with a second cavity; the first cavity and the second cavity form a circulation loop. The heat-conducting oil adopts transparent heat-conducting silicone oil. The transparent lamp tube is made of transparent soda lime silica glass, boron glass, quartz glass, alumina transparent ceramics, yttrium oxide transparent ceramics or yttrium aluminum garnet transparent ceramics. The transparent lamp tube is a columnar body with one end open and the other end closed, and the columnar body is cylindrical, rectangular, square, hexagonal or octagonal.
实施例2：Example 2:
实施例2为实施例1的变形例，LED灯芯由两片单元模块背靠背拼接而成。单片模块由5颗蓝光LED芯片、氮化铝散热基板以及围坝框组成。5颗垂直结构蓝光LED芯片使用共晶工艺焊接于氮化铝散热基板的表面电极上，使用金线键合工艺使5颗蓝光LED芯片形成串联结构，蓝光LED芯片外周设置内框大小为3mm×7mm的围坝框。使用混合有黄色、红色荧光粉的硅胶填充于围坝框内并烤干。点亮时单元模块呈现近朗伯型光强分布，如图3所示。选用管径10mm、管壁厚度为1mm的透明石英玻璃管。透明石英玻璃灯管将两片单元模块封闭于内，两单元模块背靠背紧贴，两单元模块与石英玻璃灯管形成一个U型空腔，U型空腔内填充导热油。通电后光源呈5000K白光，灯管360度发光且无明显暗区。Embodiment 2 is a modified example of Embodiment 1. The LED wick is formed by splicing two unit modules back to back. The monolithic module consists of 5 blue LED chips, aluminum nitride heat sink substrate and dam frame. 5 vertical blue LED chips are welded on the surface electrodes of the aluminum nitride heat dissipation substrate by eutectic technology, and the 5 blue LED chips are connected in series by using gold wire bonding technology. 7mm dam frame. Fill the dam frame with silica gel mixed with yellow and red fluorescent powder and dry it. When lit, the unit module presents a nearly Lambertian light intensity distribution, as shown in Figure 3. A transparent quartz glass tube with a diameter of 10 mm and a wall thickness of 1 mm was selected. The transparent quartz glass lamp tube seals two unit modules inside, and the two unit modules are attached back to back. The two unit modules and the quartz glass lamp tube form a U-shaped cavity, and the U-shaped cavity is filled with heat-conducting oil. After power on, the light source is 5000K white light, and the lamp tube emits light at 360 degrees without obvious dark areas.
实施例3：Example 3:
实施例3为实施例1的变形例，LED灯芯由两片单元模块背靠背拼接而成。单片模块由5颗蓝光LED芯片、氮化铝散热基板、块状透明荧光陶瓷以及围坝框组成。5颗倒装结构芯片使用覆晶焊工艺焊接于氮化铝散热基板的表面电极上形成串联结构，芯片外周设置内框大小为3mm×7mm的围坝。将3mm×7mm×0.3mm的Ce:YAG透明荧光陶瓷嵌入围坝框的内框中。点亮时单模块呈现近朗伯型光强分布，如图3所示。选用管径10mm、管壁厚度为1mm的透明钠钙硅玻璃管。透明钠钙硅玻璃灯管将两单元模块封闭于内，两单元模块背靠背紧贴，单元模块与钠钙硅玻璃灯管形成一个U型空腔，U型空腔内填充导热油。通电后光源呈6000K白光，灯管360度发光且无明显暗区。Embodiment 3 is a modified example of Embodiment 1. The LED wick is formed by splicing two unit modules back to back. The monolithic module consists of 5 blue LED chips, aluminum nitride heat sink substrate, block transparent fluorescent ceramics and dam frame. Five flip-chip chips are welded on the surface electrodes of the aluminum nitride heat dissipation substrate by flip-chip welding to form a series structure, and a dam with an inner frame size of 3mm×7mm is set on the outer periphery of the chip. Embed 3mm×7mm×0.3mm Ce:YAG transparent fluorescent ceramics into the inner frame of the dam frame. When lit, a single module presents a nearly Lambertian light intensity distribution, as shown in Figure 3. A transparent soda-lime-silica glass tube with a diameter of 10 mm and a wall thickness of 1 mm was selected. The transparent soda-lime-silica glass lamp tube seals the two unit modules inside, and the two unit modules are attached back to back. The unit module and the soda-lime-silica glass lamp tube form a U-shaped cavity, and the U-shaped cavity is filled with heat-conducting oil. After power on, the light source is 6000K white light, and the lamp tube emits light at 360 degrees without obvious dark areas.
实施例4：Example 4:
实施例4为实施例1的变形例，LED灯芯由两片单元模块背靠背拼接而成。单片模块由5颗蓝光LED芯片、氮化铝散热基板、块状透明荧光陶瓷组成。5颗倒装结构蓝光LED芯片使用覆晶焊工艺焊接于氮化铝散热基板的表面电极上形成串联结构。将5片1mm×1mm×0.4mm的Ce:YAG透明荧光陶瓷贴于蓝光LED芯片正上方。点亮时单元模块呈现近朗伯型光强分布，如图3所示。选用管径10mm、管壁厚度为1mm的透明石英玻璃管。透明石英玻璃灯管将两模块封闭于内，两模块背靠背紧贴，模块与石英玻璃灯管形成一个U型空腔，U型空腔内填充导热油。通电后光源呈6000K白光，灯管360度发光且无明显暗区。Embodiment 4 is a modified example of Embodiment 1. The LED wick is formed by splicing two unit modules back to back. The monolithic module is composed of 5 blue LED chips, aluminum nitride heat sink substrate, and block transparent fluorescent ceramics. Five flip-chip blue LED chips are welded on the surface electrodes of the aluminum nitride heat dissipation substrate to form a series structure by using the flip-chip welding process. Paste five pieces of 1mm×1mm×0.4mm Ce:YAG transparent fluorescent ceramics directly above the blue LED chip. When lit, the unit module presents a nearly Lambertian light intensity distribution, as shown in Figure 3. A transparent quartz glass tube with a diameter of 10 mm and a wall thickness of 1 mm was selected. The transparent quartz glass lamp tube seals the two modules inside, and the two modules are attached back to back. The module and the quartz glass lamp tube form a U-shaped cavity, and the U-shaped cavity is filled with heat-conducting oil. After power on, the light source is 6000K white light, and the lamp tube emits light at 360 degrees without obvious dark areas.
实施例5：Example 5:
实施例5为实施例1的变形例，LED灯芯由单片单元模块组成。该单元模块由5颗LED芯片、块状透明荧光陶瓷、透明荧光陶瓷基板组成。5颗垂直结构芯片使用覆晶焊工艺焊接于透明荧光陶瓷基板的表面电极上并形成串联结构。将5片1mm×1mm×0.4mm的Ce:YAG透明荧光陶瓷贴于芯片正上方。点亮时单模块呈现360度发光。选用管径10mm、管壁厚度为1mm的透明石英玻璃管。透明石英玻璃灯管将单模块封闭于内，模块与石英玻璃灯管形成一个U型空腔，空腔内填充导热油。通电后光源呈6000K白光，灯管360度发光且无明显暗区。Embodiment 5 is a modified example of Embodiment 1, and the LED wick is composed of a single-chip unit module. The unit module is composed of 5 LED chips, block transparent fluorescent ceramics, and transparent fluorescent ceramic substrate. Five vertical structure chips are welded on the surface electrodes of the transparent fluorescent ceramic substrate by flip-chip welding process to form a series structure. Paste five pieces of 1mm×1mm×0.4mm Ce:YAG transparent fluorescent ceramics directly above the chip. When lit, the single module presents 360-degree light. A transparent quartz glass tube with a diameter of 10 mm and a wall thickness of 1 mm was selected. The transparent quartz glass lamp tube seals the single module inside, the module and the quartz glass lamp tube form a U-shaped cavity, and the cavity is filled with heat-conducting oil. After power on, the light source is 6000K white light, and the lamp tube emits light at 360 degrees without obvious dark areas.
实施例6：Embodiment 6:
实施例6为实施例1的变形例，LED灯芯由单片晶圆级封装芯片制成。蓝宝石衬底的晶圆级芯片不进行背面镀膜可以直接实现360度发光，将两片厚度为0.3mm的Ce:YAG透明荧光陶瓷贴于晶圆级芯片两面。选用管径10mm、管壁厚度为1mm的透明石英玻璃管。透明石英玻璃灯管将晶圆级封装芯片封闭于内，芯片与透明石英玻璃管形成一个U型空腔，空腔内填充导热油。通电后光源呈6000K白光，灯管360度发光且无暗区。Embodiment 6 is a modified example of Embodiment 1, and the LED wick is made of a single wafer-level packaged chip. The wafer-level chip on the sapphire substrate can directly achieve 360-degree light emission without back coating, and two pieces of Ce:YAG transparent fluorescent ceramics with a thickness of 0.3mm are pasted on both sides of the wafer-level chip. A transparent quartz glass tube with a diameter of 10 mm and a wall thickness of 1 mm was selected. The transparent quartz glass lamp tube seals the wafer-level packaging chip inside, and the chip and the transparent quartz glass tube form a U-shaped cavity, which is filled with heat-conducting oil. After power on, the light source is 6000K white light, and the lamp tube emits light at 360 degrees without dark areas.
实施例7：Embodiment 7:
如图2所示，将实施例1的油冷LED汽车前照灯光源21安装于光源基座23上。安装时灯芯插置在两导油管22中间的插槽上，再套上透明石英玻璃管，向内部空腔注满油后密封好。向LED光源加30W功率后，实现3000lm，6000K白光输出。热平衡时，透明石英玻璃管温度51℃，散热器温度46℃。替换H7氙气灯后光型良好，亮度增加。As shown in FIG. 2 , the oil-cooled LED automotive headlight light source 21 of Embodiment 1 is installed on a light source base 23 . During installation, the wick is inserted on the slot in the middle of the two oil guide pipes 22, and then the transparent quartz glass tube is put on, and the inner cavity is filled with oil and then sealed. After adding 30W power to the LED light source, 3000lm, 6000K white light output can be achieved. At the time of heat balance, the temperature of the transparent quartz glass tube is 51°C, and the temperature of the radiator is 46°C. After replacing the H7 xenon lamp, the light pattern is good and the brightness is increased.
实施例8：Embodiment 8:
将实施例2的油冷LED汽车前照灯光源安装于光源基座23上。安装时灯芯插置在两导油管22中间的插槽上，再套上透明石英玻璃管，向内部空腔注满油后密封好。向LED光源加30W功率后，实现2700lm，5000K白光输出。热平衡时，透明石英玻璃温度53℃，散热器温度47℃。替换H7氙气灯后光型良好，亮度增加。The oil-cooled LED automobile headlight light source of Embodiment 2 is installed on the light source base 23 . During installation, the wick is inserted on the slot in the middle of the two oil guide pipes 22, and then the transparent quartz glass tube is put on, and the inner cavity is filled with oil and then sealed. After adding 30W power to the LED light source, 2700lm, 5000K white light output is achieved. At the time of heat balance, the temperature of the transparent quartz glass is 53°C, and the temperature of the radiator is 47°C. After replacing the H7 xenon lamp, the light pattern is good and the brightness is increased.
以上对本实用新型的具体实施例进行了描述。需要理解的是，本实用新型并不局限于上述特定实施方式，本领域技术人员可以在权利要求的范围内做出各种变形或修改，这并不影响本实用新型的实质内容。The specific embodiments of the present utility model have been described above. It should be understood that the utility model is not limited to the above-mentioned specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the utility model.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109519863A (en) * | 2018-11-14 | 2019-03-26 | 鲍灵杰 | A kind of automobile LED high beam |
| CN110701514A (en) * | 2019-10-11 | 2020-01-17 | 深圳市德和生物科技有限公司 | Light-emitting diode (LED) light supplementing device for algae cultivation |
| CN110713901A (en) * | 2019-11-08 | 2020-01-21 | 深圳市德和生物科技有限公司 | Little algae cultivation light biological reaction cauldron and contain its continuous culture reaction system |
| CN110760439A (en) * | 2019-11-08 | 2020-02-07 | 深圳市德和生物科技有限公司 | Algae cultivation photo-biological reaction kettle and continuous culture reaction system containing same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109519863A (en) * | 2018-11-14 | 2019-03-26 | 鲍灵杰 | A kind of automobile LED high beam |
| CN110701514A (en) * | 2019-10-11 | 2020-01-17 | 深圳市德和生物科技有限公司 | Light-emitting diode (LED) light supplementing device for algae cultivation |
| CN110713901A (en) * | 2019-11-08 | 2020-01-21 | 深圳市德和生物科技有限公司 | Little algae cultivation light biological reaction cauldron and contain its continuous culture reaction system |
| CN110760439A (en) * | 2019-11-08 | 2020-02-07 | 深圳市德和生物科技有限公司 | Algae cultivation photo-biological reaction kettle and continuous culture reaction system containing same |
| WO2021088128A1 (en) * | 2019-11-08 | 2021-05-14 | 深圳市德和生物科技有限公司 | Algae culture photobiological reaction kettle and continuous culture reaction system comprising same |
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