[go: up one dir, main page]

CN103956421A - LED lamp based on transparent fluorescent ceramics - Google Patents

LED lamp based on transparent fluorescent ceramics Download PDF

Info

Publication number
CN103956421A
CN103956421A CN201410161313.5A CN201410161313A CN103956421A CN 103956421 A CN103956421 A CN 103956421A CN 201410161313 A CN201410161313 A CN 201410161313A CN 103956421 A CN103956421 A CN 103956421A
Authority
CN
China
Prior art keywords
yag
fluorescent
led
led lamp
ceramics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410161313.5A
Other languages
Chinese (zh)
Inventor
周圣明
林辉
陈冲
易学专
丰岳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Institute of Optics and Fine Mechanics of CAS
Original Assignee
Shanghai Institute of Optics and Fine Mechanics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Institute of Optics and Fine Mechanics of CAS filed Critical Shanghai Institute of Optics and Fine Mechanics of CAS
Priority to CN201410161313.5A priority Critical patent/CN103956421A/en
Publication of CN103956421A publication Critical patent/CN103956421A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Luminescent Compositions (AREA)

Abstract

一种基于透明荧光陶瓷的LED灯,该LED灯由LED灯丝，电极引线和灯罩组成，其特征在于所述的LED灯丝由长条状的宽度与所用LED芯片相当的透明荧光陶瓷作为基板，然后将蓝光LED芯片（包括引线）顺次粘合固定于透明荧光陶瓷板条上,而另一侧粘合相同的透明荧光陶瓷条或涂覆荧光光胶构成。所述的透明荧光陶瓷可以是Ce:YAG(包括Ce离子浓度为零的情况)或Ce:Tb3Al5O12或Ce,Cr:YAG或Ce,Pr:YAG或“Ce:YAG+MgAl2O4”或“Ce,Pr:YAG+MgAl2O4”或“Ce,Cr:YAG+MgAl2O4”中的一种。本发明实施例的LED灯可有效解决荧光粉硅胶树脂混合物荧光体的光衰，提高LED灯丝灯的性能及寿命。

An LED lamp based on transparent fluorescent ceramics, the LED lamp is composed of LED filaments, electrode leads and lampshades, characterized in that the LED filaments are made of strip-shaped transparent fluorescent ceramics with a width equivalent to that of the LED chip used as the substrate, and then The blue LED chips (including lead wires) are sequentially bonded and fixed on the transparent fluorescent ceramic strip, and the other side is glued with the same transparent fluorescent ceramic strip or coated with fluorescent photoglue. The transparent fluorescent ceramics can be Ce:YAG (including the case where Ce ion concentration is zero) or Ce:Tb 3 Al 5 O 12 or Ce, Cr:YAG or Ce, Pr:YAG or "Ce:YAG+MgAl 2 One of O 4 ” or “Ce,Pr:YAG+MgAl 2 O 4 ” or “Ce,Cr:YAG+MgAl 2 O 4 ”. The LED lamp of the embodiment of the present invention can effectively solve the light decay of the fluorescent material of the fluorescent powder silicone resin mixture, and improve the performance and service life of the LED filament lamp.

Description

基于透明荧光陶瓷的LED灯LED lamps based on transparent fluorescent ceramics

技术领域technical field

本发明涉及LED照明技术领域，尤其是一种基于透明荧光陶瓷的LED灯。The invention relates to the technical field of LED lighting, in particular to an LED lamp based on transparent fluorescent ceramics.

背景技术Background technique

传统LED封装结构由于其支架由Cu、Al等热沉材料构成，该结构LED只能单面出光，在采用透镜均衡发光分布的情况下，发光角一般也不超过165°，日本牛尾光源于2008年率先推出了由LED灯珠构成灯丝的仿传统白炽灯，引起了业界极大关注，并且实现了量产化。如对比文件1(发明专利申请号:201310239213.5)中公开了一种LED灯丝灯结构,其包括基板,固定于基板至少一侧面上的发光单元(蓝光和红光LED芯片),以及包覆于发光单元外层的封胶层。而此LED灯丝采用荧光粉+硅胶(或树脂)的传统封胶,散热较差,使得荧光粉转化型高功率白光LED存在以下两方面引起的光衰问题，即来自蓝光LED芯片在高注入电流下由缺陷、俄歇电子-空缺复合等效应所引起的发光衰减和来自荧光粉材料在高温下的热衰减，包括荧光粉本身的温度淬灭及有机硅胶树脂的老化等引起的光衰。因此，其难以实现稳定长效的高品质发光。此外,对比文件2(发明专利申请号:201220717834.0)提出采用玻璃做为灯丝芯柱,并安置至少一根与竖直方向倾斜一定角度的灯丝,以改善光强空间分布,但在荧光粉材料上仍无改进,因此仍存在荧光粉的热光衰问题。所以在完善LED灯丝使得灯球长效稳定发光等领域仍有大量问题需要解决。Because the traditional LED packaging structure is made of heat sink materials such as Cu and Al, the LED with this structure can only emit light from one side. When the lens is used to balance the light distribution, the light angle generally does not exceed 165°. The Japanese Ushio Light Source was launched in 2008 In 2010, it first launched the imitation traditional incandescent lamp made of LED lamp beads, which attracted great attention from the industry and achieved mass production. For example, reference document 1 (invention patent application number: 201310239213.5) discloses an LED filament lamp structure, which includes a substrate, a light-emitting unit (blue and red LED chips) fixed on at least one side of the substrate, and a light-emitting The sealant layer on the outside of the unit. However, this LED filament adopts the traditional sealant of phosphor powder + silica gel (or resin), which has poor heat dissipation, so that the phosphor conversion high-power white LED has the problem of light decay caused by the following two aspects, that is, from the blue LED chip under high injection current. Luminescence attenuation caused by defects, Auger electron-vacancy recombination and thermal attenuation from phosphor materials at high temperatures, including light attenuation caused by temperature quenching of phosphor itself and aging of silicone resin. Therefore, it is difficult to achieve stable and long-lasting high-quality luminescence. In addition, reference document 2 (invention patent application number: 201220717834.0) proposes to use glass as the filament stem and place at least one filament inclined at a certain angle to the vertical direction to improve the spatial distribution of light intensity. There is still no improvement, so there is still the problem of thermal and light decay of phosphors. Therefore, there are still a lot of problems to be solved in the field of perfecting the LED filament to make the light bulb long-lasting and stable.

本发明针对现有LED灯丝由于散热差导致的传统荧光粉+硅胶(树脂)封胶难以实现长效稳定高品质发光的问题,提出一种基于透明荧光陶瓷的LED灯丝结构,采用透明荧光陶瓷做为基板,不同于对比文件1,即基板位于LED芯片的外侧,在起到基板作用的同时起到荧光材料的作用,可以有效解决LED灯丝灯的荧光粉光衰问题。Aiming at the problem that the traditional fluorescent powder + silica gel (resin) sealant is difficult to achieve long-term, stable and high-quality light emission due to the poor heat dissipation of the existing LED filament, a LED filament structure based on transparent fluorescent ceramics is proposed, which is made of transparent fluorescent ceramics. It is the substrate, which is different from Reference Document 1, that is, the substrate is located outside the LED chip, and plays the role of the fluorescent material as well as the substrate, which can effectively solve the problem of phosphor light decay in LED filament lamps.

发明内容Contents of the invention

本发明的目的在于提供一种基于荧光陶瓷的LED灯，为了实现灯丝LED灯在改善或至少不降低散热效果的情况下，解决荧光材料发光的热衰减，改善高功率LED照明的长效稳定性。The purpose of the present invention is to provide a LED lamp based on fluorescent ceramics, in order to improve the long-term stability of high-power LED lighting by solving the thermal attenuation of fluorescent material light emission under the condition of improving or at least not reducing the heat dissipation effect of the filament LED lamp .

本发明提出的技术方案为：The technical scheme that the present invention proposes is:

一种基于透明荧光陶瓷的LED灯，包括LED灯的灯丝，其特点在于所述的LED灯的灯丝是在条状透明荧光陶瓷的基板上依次粘合多个串连的蓝光LED芯片，在多个蓝光LED芯片上再粘合与其相同的透明陶瓷条或是涂覆荧光光胶构成。An LED lamp based on transparent fluorescent ceramics, including a filament of the LED lamp, is characterized in that the filament of the LED lamp is sequentially bonded with a plurality of serially connected blue LED chips on a strip-shaped transparent fluorescent ceramic substrate. A blue LED chip is bonded with the same transparent ceramic strip or coated with fluorescent glue.

所述的透明荧光陶瓷是掺铈石榴石单相结构,或掺铈石榴石和镁铝尖晶石混合相结构。The transparent fluorescent ceramic has a single-phase structure of cerium-doped garnet, or a mixed-phase structure of cerium-doped garnet and magnesium-aluminum spinel.

所述的透明荧光陶瓷的单相结构包括Ce:YAG、Ce:TAG、Ce,Cr:YAG或Ce,Pr:YAG。The single-phase structure of the transparent fluorescent ceramic includes Ce:YAG, Ce:TAG, Ce,Cr:YAG or Ce,Pr:YAG.

所述的透明荧光陶瓷的混合相结构包括Ce:YAG+MgAl2O4、Ce,Pr:YAG+MgAl2O4、或Ce,Cr:YAG+MgAl2O4。The mixed phase structure of the transparent fluorescent ceramic includes Ce:YAG+MgAl 2 O 4 , Ce,Pr:YAG+MgAl 2 O 4 , or Ce,Cr:YAG+MgAl 2 O 4 .

本发明的技术效果：Technical effect of the present invention:

本发明LED灯可以实现近全方位角的白光出光,相比玻璃和塑料基板，透明荧光陶瓷具有较高的热导率，在一定程度上可以改善散热。更重要的是，该荧光陶瓷在高功率LED的高温（150℃）工作场合仍可高效稳定发光，可有效解决目前荧光粉硅胶树脂混合物荧光体的热光衰，从而提高当前灯丝LED灯球的性能及寿命。The LED lamp of the present invention can realize white light emission at nearly omnidirectional angles, and compared with glass and plastic substrates, transparent fluorescent ceramics have higher thermal conductivity, which can improve heat dissipation to a certain extent. More importantly, the fluorescent ceramic can still emit light efficiently and stably in the high-temperature (150°C) working place of high-power LEDs, which can effectively solve the thermal and light decay of the current fluorescent powder silicone resin mixture phosphor, thereby improving the current filament LED bulb. performance and longevity.

附图说明Description of drawings

图1为本发明基于荧光陶瓷的LED灯结构示意图。Fig. 1 is a schematic structural diagram of an LED lamp based on fluorescent ceramics according to the present invention.

图2为本发明灯丝的第一种实施例的结构示意图Fig. 2 is the structural representation of the first embodiment of the filament of the present invention

图3为本发明灯丝的第二种实施例的结构示意图。Fig. 3 is a schematic structural view of the second embodiment of the filament of the present invention.

具体实施方式Detailed ways

下面结合附图和具体的实施例对本发明作进一步的详细说明Below in conjunction with accompanying drawing and specific embodiment the present invention will be described in further detail

参见图1～图3，为本发明基于荧光陶瓷的LED灯，包括蓝光LED芯片1、上、下荧光陶瓷条2、引线3、上、下荧光硅胶4、灯罩5。Referring to Fig. 1 to Fig. 3, the LED lamp based on fluorescent ceramics of the present invention includes a blue LED chip 1, upper and lower fluorescent ceramic strips 2, lead wires 3, upper and lower fluorescent silica gel 4, and a lampshade 5.

实施例1Example 1

上、下荧光陶瓷条2中采用：Ce:YAG荧光陶瓷加工成30mm×1.5mm×0.38mm的长条薄片两条，如图2所示，构成LED灯丝。由于Ce:YAG荧光陶瓷的热导率比玻璃，塑料等基板高很多，一定程度上可以改善LED灯丝灯的散热。而且，荧光陶瓷不存在传统荧光粉+硅胶（或树脂）封装的老化、变色等问题，更重要的是，Ce:YAG荧光陶瓷在适当掺杂浓度下也可以有效改善光衰问题，可以保证LED灯丝灯长效稳定工作性能和使用寿命。The upper and lower fluorescent ceramic strips 2 are made of: Ce:YAG fluorescent ceramics processed into two strips of 30mm×1.5mm×0.38mm, as shown in FIG. 2 , constituting the LED filament. Since the thermal conductivity of Ce:YAG fluorescent ceramics is much higher than that of glass, plastic and other substrates, it can improve the heat dissipation of LED filament lamps to a certain extent. Moreover, fluorescent ceramics do not have the problems of aging and discoloration of traditional phosphor + silica gel (or resin) packages. More importantly, Ce:YAG fluorescent ceramics can also effectively improve the problem of light attenuation under appropriate doping concentrations, which can ensure LED Filament lamps have long-term stable working performance and service life.

实施例2Example 2

上、下荧光陶瓷条2中采用：Ce,Pr:YAG荧光陶瓷加工成30mm×1.5mm×0.38mm的长条薄片两条，如图2所示，构成LED灯丝。The upper and lower fluorescent ceramic strips 2 are made of Ce, Pr:YAG fluorescent ceramics processed into two strips of 30mm×1.5mm×0.38mm, as shown in FIG. 2 , constituting the LED filament.

实施例3Example 3

上、下荧光陶瓷条2中采用：Ce,Cr:YAG荧光陶瓷加工成40mm×2mm×0.38mm的长条薄片两条，如图2所示，构成LED灯丝。The upper and lower fluorescent ceramic strips 2 are made of Ce,Cr:YAG fluorescent ceramics processed into two strips of 40mm×2mm×0.38mm, as shown in FIG. 2 , constituting the LED filament.

实施例4Example 4

上、下荧光陶瓷条2中采用：Ce:YAG+MgAl2O4混合相荧光陶瓷加工成40mm×1.5mm×0.38mm的长条薄片两条，如图2所示，构成LED灯丝。The upper and lower fluorescent ceramic strips 2 use: Ce:YAG+MgAl 2 O 4 mixed-phase fluorescent ceramics processed into two strips of 40mm×1.5mm×0.38mm, as shown in Figure 2, to form LED filaments.

实施例5Example 5

上、下荧光陶瓷条2中采用：Ce,Pr:YAG+MgAl2O4混合相荧光陶瓷加工成30mm×1.5mm×0.38mm的长条薄片两条，如图2所示，构成LED灯丝。The upper and lower fluorescent ceramic strips 2 use: Ce, Pr:YAG+MgAl 2 O 4 mixed-phase fluorescent ceramics processed into two strips of 30mm×1.5mm×0.38mm, as shown in Figure 2, to form LED filaments.

实施例6Example 6

上、下荧光陶瓷条2中采用：Ce,Cr:YAG+MgAl2O4混合相荧光陶瓷加工成35mm×2.0mm×0.38mm的长条薄片两条，如图2所示，构成LED灯丝。The upper and lower fluorescent ceramic strips 2 are made of Ce, Cr:YAG+MgAl 2 O 4 mixed-phase fluorescent ceramics processed into two strips of 35mm×2.0mm×0.38mm, as shown in Figure 2, to form LED filaments.

实施例7Example 7

上（下）荧光陶瓷条2中采用Ce:YAG荧光陶瓷加工成30mm×1.6mm×0.38mm的长条薄片，然后将若干蓝光LED芯片（包括引线）粘合固定于该透明荧光陶瓷板条上，再在蓝光LED芯片上涂覆荧光粉硅胶光胶，即下（上）荧光光胶4，如图2所示，构成LED灯丝。The upper (lower) fluorescent ceramic strip 2 is processed into a long sheet of 30mm×1.6mm×0.38mm with Ce:YAG fluorescent ceramics, and then a number of blue LED chips (including leads) are bonded and fixed on the transparent fluorescent ceramic strip , and then coat the fluorescent powder silicone photoresist on the blue LED chip, that is, the lower (upper) fluorescent photoresist 4, as shown in FIG. 2, to form the LED filament.

实施例8Example 8

上（下）荧光陶瓷条2中采用Ce，Pr:YAG荧光陶瓷加工成35mm×1.5mm×0.4mm的长条薄片，然后将若干蓝光LED芯片（包括引线）粘合固定于该透明荧光陶瓷板条上，再在蓝光LED芯片上涂覆荧光粉硅胶光胶，即下（上）荧光光胶4，如图2所示，构成LED灯丝。The upper (lower) fluorescent ceramic strip 2 is made of Ce, Pr:YAG fluorescent ceramics and processed into a long sheet of 35mm×1.5mm×0.4mm, and then a number of blue LED chips (including leads) are glued and fixed on the transparent fluorescent ceramic plate On the blue LED chip, apply fluorescent powder silicone photoresist, that is, the lower (upper) fluorescent photoresist 4, as shown in Figure 2, to form the LED filament.

实施例9Example 9

上（下）荧光陶瓷条2中采用Ce，Cr:YAG荧光陶瓷加工成40mm×1.5mm×0.4mm的长条薄片，然后将若干蓝光LED芯片（包括引线）粘合固定于该透明荧光陶瓷板条上，再在蓝光LED芯片上涂覆荧光粉硅胶光胶，即下（上）荧光光胶4，如图2所示，构成LED灯丝。The upper (lower) fluorescent ceramic strip 2 is made of Ce, Cr:YAG fluorescent ceramics and processed into a long sheet of 40mm×1.5mm×0.4mm, and then a number of blue LED chips (including leads) are glued and fixed on the transparent fluorescent ceramic plate On the blue LED chip, apply fluorescent powder silicone photoresist, that is, the lower (upper) fluorescent photoresist 4, as shown in Figure 2, to form the LED filament.

实施例10Example 10

上（下）荧光陶瓷条2中采用Ce:YAG+MgAl2O4混合相荧光陶瓷加工成35mm×1.5mm×0.4mm的长条薄片，然后将若干蓝光LED芯片（包括引线）粘合固定于该透明荧光陶瓷板条上，再在蓝光LED芯片上涂覆荧光粉硅胶光胶，即下（上）荧光光胶4，如图2所示，构成LED灯丝。The upper (lower) fluorescent ceramic strip 2 is processed into a long sheet of 35mm×1.5mm×0.4mm by using Ce:YAG+MgAl 2 O 4 mixed-phase fluorescent ceramics, and then a number of blue LED chips (including leads) are glued and fixed on the On the transparent fluorescent ceramic slats, the blue LED chip is coated with fluorescent powder silica gel, that is, the lower (upper) fluorescent glue 4, as shown in FIG. 2, constitutes the LED filament.

实施例11Example 11

上（下）荧光陶瓷条2中采用Ce,Pr:YAG+MgAl2O4混合相荧光陶瓷加工成30mm×1.5mm×0.38mm的长条薄片，然后将若干蓝光LED芯片（包括引线）粘合固定于该透明荧光陶瓷板条上，再在蓝光LED芯片上涂覆荧光粉硅胶光胶，即下（上）荧光光胶4，如图2所示，构成LED灯丝。The upper (lower) fluorescent ceramic strip 2 uses Ce, Pr:YAG+MgAl 2 O 4 mixed-phase fluorescent ceramics to process it into a long strip of 30mm×1.5mm×0.38mm, and then bond several blue LED chips (including leads) Fix it on the transparent fluorescent ceramic slats, and then coat the blue LED chip with fluorescent powder silicone photoresist, that is, the lower (upper) fluorescent photoresist 4, as shown in Figure 2, to form the LED filament.

实施例12Example 12

上（下）荧光陶瓷条2中采用Ce,Cr:YAG+MgAl2O4混合相荧光陶瓷加工成45mm×1.7mm×0.38mm的长条薄片，然后将若干蓝光LED芯片（包括引线）粘合固定于该透明荧光陶瓷板条上，再在蓝光LED芯片上涂覆荧光粉硅胶光胶，即下（上）荧光光胶4，如图2所示，构成LED灯丝。The upper (lower) fluorescent ceramic strip 2 is processed into a long strip of 45mm×1.7mm×0.38mm by using Ce,Cr:YAG+MgAl 2 O 4 mixed-phase fluorescent ceramics, and then bonding several blue LED chips (including leads) Fix it on the transparent fluorescent ceramic slats, and then coat the blue LED chip with fluorescent powder silicone photoresist, that is, the lower (upper) fluorescent photoresist 4, as shown in Figure 2, to form the LED filament.

实施例13Example 13

上、下荧光陶瓷条2中采用：YAG透明陶瓷加工成30mm×1.5mm×0.38mm的长条薄片，然后将若干蓝光LED芯片（包括引线）粘合固定于该YAG透明陶瓷细板条上，并将上述装好蓝光LED芯片的YAG透明陶瓷细条裹覆在Ce:YAG荧光粉硅胶光胶中，即荧光光胶4，如图3所示，构成LED灯丝。The upper and lower fluorescent ceramic strips 2 use: YAG transparent ceramics processed into long strips of 30mm×1.5mm×0.38mm, and then a number of blue LED chips (including leads) are bonded and fixed on the thin YAG transparent ceramic strips. And the YAG transparent ceramic thin strips loaded with the blue LED chip are wrapped in the Ce:YAG fluorescent powder silicone photoresist, that is, the fluorescent photoresist 4, as shown in FIG. 3 , constituting the LED filament.

Claims (4)

1.一种基于透明荧光陶瓷的LED灯，包括LED灯的灯丝，其特征在于所述的LED灯的灯丝是在条状透明荧光陶瓷的基板上依次粘合多个串连的蓝光LED芯片，在多个蓝光LED芯片上再粘合与其相同的透明陶瓷条或是涂覆荧光光胶构成。1. A kind of LED lamp based on transparent fluorescent ceramics, comprising the filament of LED lamp, it is characterized in that the filament of described LED lamp is to bond successively a plurality of serially connected blue LED chips on the substrate of strip-shaped transparent fluorescent ceramics, Glue the same transparent ceramic strips on multiple blue LED chips or coat them with fluorescent glue. 2.如权利要求1所述的LED灯，其特征在于，所述的透明荧光陶瓷是掺铈石榴石单相结构,或掺铈石榴石和镁铝尖晶石混合相结构。2. The LED lamp according to claim 1, wherein the transparent fluorescent ceramic has a single-phase structure of cerium-doped garnet, or a mixed-phase structure of cerium-doped garnet and magnesium aluminum spinel. 3.如权利要求2所述的LED灯，其特征在于，所述的透明荧光陶瓷的单相结构包括Ce:YAG、Ce:TAG、Ce,Cr:YAG或Ce,Pr:YAG。3. The LED lamp according to claim 2, wherein the single-phase structure of the transparent fluorescent ceramic comprises Ce:YAG, Ce:TAG, Ce,Cr:YAG or Ce,Pr:YAG. 4.如权利要求2所述的LED灯，其特征在于，所述的透明荧光陶瓷的混合相结构包括Ce:YAG+MgAl2O4、Ce,Pr:YAG+MgAl2O4、或Ce,Cr:YAG+MgAl2O4。4. The LED lamp according to claim 2, wherein the mixed phase structure of the transparent fluorescent ceramic comprises Ce:YAG+MgAl 2 O 4 , Ce,Pr:YAG+MgAl 2 O 4 , or Ce, Cr:YAG+MgAl 2 O 4 .
CN201410161313.5A 2014-04-22 2014-04-22 LED lamp based on transparent fluorescent ceramics Pending CN103956421A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410161313.5A CN103956421A (en) 2014-04-22 2014-04-22 LED lamp based on transparent fluorescent ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410161313.5A CN103956421A (en) 2014-04-22 2014-04-22 LED lamp based on transparent fluorescent ceramics

Publications (1)

Publication Number Publication Date
CN103956421A true CN103956421A (en) 2014-07-30

Family

ID=51333671

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410161313.5A Pending CN103956421A (en) 2014-04-22 2014-04-22 LED lamp based on transparent fluorescent ceramics

Country Status (1)

Country Link
CN (1) CN103956421A (en)

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104253193A (en) * 2014-08-06 2014-12-31 浙江英特来光电科技有限公司 High-light effect and high-performance LED (light-emitting diode)
CN104609848A (en) * 2015-02-10 2015-05-13 中国科学院上海光学精密机械研究所 Composite-phase transparent ceramic for white light LED (light-emitting diode) fluorescence conversion and preparation method thereof
CN105405949A (en) * 2014-08-29 2016-03-16 无锡华润华晶微电子有限公司 Light-emitting diode lamp filament and preparation method therefor
WO2016127673A1 (en) * 2015-02-12 2016-08-18 苏州晶品新材料股份有限公司 Three-dimensional luminous led point light source and illuminating device
WO2016197901A1 (en) * 2015-06-10 2016-12-15 Jiaxing Super Lighting Electric Appliance Co., Ltd Led filament, led filament assembly and led bulb
CN106449625A (en) * 2016-11-30 2017-02-22 上海应用技术大学 Flip-chip LED filament based on fluorescent substrate and its packaging process
CN106549093A (en) * 2016-10-25 2017-03-29 江苏师范大学 A kind of long-range luminescent device of the LED based on fluorescent transparent ceramic material
CN107540368A (en) * 2017-02-28 2018-01-05 江苏罗化新材料有限公司 The preparation method and LED module of complex phase translucent fluorescent ceramics
CN107540369A (en) * 2017-02-28 2018-01-05 江苏罗化新材料有限公司 The preparation method of luminescent ceramic, LED encapsulation structure and luminescent ceramic
CN108947516A (en) * 2018-08-29 2018-12-07 江苏师范大学 A kind of (Cu, Ce): YAG transparent fluorescent ceramic and the preparation method and application thereof
US10240724B2 (en) 2015-08-17 2019-03-26 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament
US10473271B2 (en) 2015-08-17 2019-11-12 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament module and LED light bulb
US10527233B2 (en) 2015-08-17 2020-01-07 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED light bulb and LED Filament thereof
US10544905B2 (en) 2014-09-28 2020-01-28 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US10655792B2 (en) 2014-09-28 2020-05-19 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US10704741B2 (en) 2015-08-17 2020-07-07 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and light bulb
US10711951B1 (en) 2014-09-28 2020-07-14 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US10784428B2 (en) 2014-09-28 2020-09-22 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US10790419B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US10790420B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd Light bulb with a symmetrical LED filament
US10794545B2 (en) 2014-09-28 2020-10-06 Zhejiang Super Lighting Electric Appliance Co., Lt LED light bulb with segmented LED filament
US10845008B2 (en) 2014-09-28 2020-11-24 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US10982817B2 (en) 2014-09-28 2021-04-20 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with a flexible LED filament
US10982816B2 (en) 2014-09-28 2021-04-20 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb having uniform light emmision
US11015764B2 (en) 2014-09-28 2021-05-25 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with flexible LED filament having perpendicular connecting wires
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11168844B2 (en) 2015-08-17 2021-11-09 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb having filament with segmented light conversion layer
US11259372B2 (en) 2015-06-10 2022-02-22 Zhejiang Super Lighting Electric Appliance Co., Ltd High-efficiency LED light bulb with LED filament therein
CN114659038A (en) * 2022-02-11 2022-06-24 新沂市锡沂高新材料产业技术研究院有限公司 A double-colored laser lamp-house for unmanned aerial vehicle
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11690148B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US12060455B2 (en) 2018-04-17 2024-08-13 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101697367A (en) * 2009-09-30 2010-04-21 烁光特晶科技有限公司 Method for preparing LED by using transparent ceramics
US20110273863A1 (en) * 2010-05-04 2011-11-10 Zou Cai LED light source
CN202049951U (en) * 2010-12-14 2011-11-23 黄金鹿 Transparent fluorescent ceramic integrated high-power LED light source
CN102709452A (en) * 2012-05-21 2012-10-03 苏州晶品光电科技有限公司 Fluorescent transparent ceramic LED (light-emitting diode) sealing structure and sealing method thereof
CN103441207A (en) * 2013-08-30 2013-12-11 华南理工大学 All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101697367A (en) * 2009-09-30 2010-04-21 烁光特晶科技有限公司 Method for preparing LED by using transparent ceramics
US20110273863A1 (en) * 2010-05-04 2011-11-10 Zou Cai LED light source
CN202049951U (en) * 2010-12-14 2011-11-23 黄金鹿 Transparent fluorescent ceramic integrated high-power LED light source
CN102709452A (en) * 2012-05-21 2012-10-03 苏州晶品光电科技有限公司 Fluorescent transparent ceramic LED (light-emitting diode) sealing structure and sealing method thereof
CN103441207A (en) * 2013-08-30 2013-12-11 华南理工大学 All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated

Cited By (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104253193B (en) * 2014-08-06 2017-02-01 浙江英特来光电科技有限公司 High-light effect and high-performance LED (light-emitting diode)
CN104253193A (en) * 2014-08-06 2014-12-31 浙江英特来光电科技有限公司 High-light effect and high-performance LED (light-emitting diode)
CN105405949A (en) * 2014-08-29 2016-03-16 无锡华润华晶微电子有限公司 Light-emitting diode lamp filament and preparation method therefor
US11892127B2 (en) 2014-09-28 2024-02-06 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED bulb lamp
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US10976009B2 (en) 2014-09-28 2021-04-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament light bulb
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US10982817B2 (en) 2014-09-28 2021-04-20 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with a flexible LED filament
US11690148B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11629825B2 (en) 2014-09-28 2023-04-18 Zhejiang Super Lighting Electric Appliance Co., Lt LED light bulb with curved filament
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US10544905B2 (en) 2014-09-28 2020-01-28 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11187384B2 (en) 2014-09-28 2021-11-30 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US10982818B2 (en) 2014-09-28 2021-04-20 Zhejiang Super Lighting Electric Appliance Co., Ltd High light-emitting efficiency LED light bulb having filament with controlled refractive index differences of multiple interfaces
US12066155B2 (en) 2014-09-28 2024-08-20 Zhejiang Super Lighting Electric Ap LED bulb lamp
US10655792B2 (en) 2014-09-28 2020-05-19 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US10794545B2 (en) 2014-09-28 2020-10-06 Zhejiang Super Lighting Electric Appliance Co., Lt LED light bulb with segmented LED filament
US10711951B1 (en) 2014-09-28 2020-07-14 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11125393B2 (en) 2014-09-28 2021-09-21 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament light bulb having different surface roughness filament base layer
US10784428B2 (en) 2014-09-28 2020-09-22 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11168845B2 (en) 2014-09-28 2021-11-09 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb having muti-section bending filament
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11168843B2 (en) 2014-09-28 2021-11-09 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11028970B2 (en) 2014-09-28 2021-06-08 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament light bulb having organosilicon-modified polyimide resin composition filament base layer
US11015764B2 (en) 2014-09-28 2021-05-25 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with flexible LED filament having perpendicular connecting wires
US10845008B2 (en) 2014-09-28 2020-11-24 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US10982816B2 (en) 2014-09-28 2021-04-20 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb having uniform light emmision
US10982819B2 (en) 2014-09-28 2021-04-20 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with bendable LED filament
CN104609848A (en) * 2015-02-10 2015-05-13 中国科学院上海光学精密机械研究所 Composite-phase transparent ceramic for white light LED (light-emitting diode) fluorescence conversion and preparation method thereof
WO2016127673A1 (en) * 2015-02-12 2016-08-18 苏州晶品新材料股份有限公司 Three-dimensional luminous led point light source and illuminating device
US10627098B2 (en) 2015-06-10 2020-04-21 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb having the same
US11259372B2 (en) 2015-06-10 2022-02-22 Zhejiang Super Lighting Electric Appliance Co., Ltd High-efficiency LED light bulb with LED filament therein
WO2016197901A1 (en) * 2015-06-10 2016-12-15 Jiaxing Super Lighting Electric Appliance Co., Ltd Led filament, led filament assembly and led bulb
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US10473271B2 (en) 2015-08-17 2019-11-12 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament module and LED light bulb
US10240724B2 (en) 2015-08-17 2019-03-26 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament
US11035525B2 (en) 2015-08-17 2021-06-15 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb
US10527233B2 (en) 2015-08-17 2020-01-07 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED light bulb and LED Filament thereof
US10690293B2 (en) 2015-08-17 2020-06-23 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED light bulb with two sets of filaments
US10704741B2 (en) 2015-08-17 2020-07-07 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and light bulb
US10767817B2 (en) 2015-08-17 2020-09-08 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb and LED filament thereof
US11168844B2 (en) 2015-08-17 2021-11-09 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb having filament with segmented light conversion layer
CN106549093A (en) * 2016-10-25 2017-03-29 江苏师范大学 A kind of long-range luminescent device of the LED based on fluorescent transparent ceramic material
CN106449625A (en) * 2016-11-30 2017-02-22 上海应用技术大学 Flip-chip LED filament based on fluorescent substrate and its packaging process
CN107540369A (en) * 2017-02-28 2018-01-05 江苏罗化新材料有限公司 The preparation method of luminescent ceramic, LED encapsulation structure and luminescent ceramic
CN107540368B (en) * 2017-02-28 2020-03-10 江苏罗化新材料有限公司 Preparation method of complex-phase semitransparent fluorescent ceramic and LED module
CN107540368A (en) * 2017-02-28 2018-01-05 江苏罗化新材料有限公司 The preparation method and LED module of complex phase translucent fluorescent ceramics
US10797208B2 (en) 2017-12-26 2020-10-06 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb with conductive sections and exposed wires
US10790420B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd Light bulb with a symmetrical LED filament
US11121292B2 (en) 2017-12-26 2021-09-14 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb having filament with being partially coated by light conversion layer
US10868225B2 (en) 2017-12-26 2020-12-15 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb having filament with lighting face of LED chip located in the lower surface of top layer
US10804446B2 (en) 2017-12-26 2020-10-13 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb with spectral distribution of natural light
US10790419B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US10944028B2 (en) 2017-12-26 2021-03-09 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb having filament with conductive section providing with rivet structure
US12060455B2 (en) 2018-04-17 2024-08-13 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
CN108947516B (en) * 2018-08-29 2021-04-06 江苏师范大学 (Cu, Ce): YAG transparent fluorescent ceramic and preparation method and application thereof
CN108947516A (en) * 2018-08-29 2018-12-07 江苏师范大学 A kind of (Cu, Ce): YAG transparent fluorescent ceramic and the preparation method and application thereof
CN114659038A (en) * 2022-02-11 2022-06-24 新沂市锡沂高新材料产业技术研究院有限公司 A double-colored laser lamp-house for unmanned aerial vehicle

Similar Documents

Publication Publication Date Title
CN103956421A (en) LED lamp based on transparent fluorescent ceramics
CN104600181A (en) LED (Light Emitting Diode) light bar and preparation method thereof
CN109411589B (en) A kind of LED filament
CN105387355A (en) Parallel-connection type light emitting diode (LED) illuminants and LED illuminating lamp
CN102913787B (en) A kind of LED light source and the bulb adopting this light source to manufacture
WO2020010899A1 (en) Light-emitting diode for plant growth
CN103872224A (en) Novel LED (Light Emitting Diode) illuminating element
TWM407494U (en) LED package structure
CN204026264U (en) High thermally conductive LED 360 ° of light-emitting filament bulbs
CN106449625A (en) Flip-chip LED filament based on fluorescent substrate and its packaging process
WO2020015428A1 (en) Semiconductor light-emitting diode apparatus and lamp
CN106340579A (en) Remote quantum dot LED device based on blue LED chip
CN207500850U (en) LED filament and LEDbulb lamp
CN105822909A (en) Ultraviolet filament lamp
CN103075666A (en) Large angle LED lights
CN202992714U (en) led light bulb
CN105114847A (en) Cambered special-shaped all-around illuminating LED bulb
CN204943064U (en) The all-round emitting led bulb of Curved surface heterotype
CN204696115U (en) A kind of three primary colors white LED light source
CN204678115U (en) A kind of filament LED
CN107785476A (en) A kind of white light LEDs fluorescent glass film and preparation method thereof
CN202868390U (en) Novel light-emitting diode (LED) power source and bulb produced with the same
WO2015081649A1 (en) Led fluorescent lamp assembly
CN107799508A (en) A kind of LED filament and manufacture method for solving heat dissipation problem
CN207165565U (en) A kind of COB light source structure

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140730

WD01 Invention patent application deemed withdrawn after publication