CN204632756U - a flash - Google Patents

Abstract

A flashlight, comprising an LED light source and a lens matched with the LED light source, the LED light source comprises more than two chip-scale packaged white light LEDs, each chip-scale packaged white light LED has a different color temperature, and each chip-scale packaged white light LED With an independent drive circuit, all chip-scale packaged white LEDs share one lens. The use of chip-level packaged LEDs as the light source makes the flash light small in size, large in flash light flux, uniform in light output from the flash light, and able to adjust the color temperature of the flash light to improve photo quality. u/

Description

a flash

technical field

The utility model relates to the field of LED lighting, in particular to a flash lamp.

Background technique

When people use a camera or video camera to shoot, they are often at night or when the ambient light is not good, so they usually need to be equipped with auxiliary equipment to enhance the light effect. As a common light reinforcement device, the flashlight has been used It is widely used in photography art. As users' requirements for photographic effects increase, the requirements for flashlights in photographic equipment also increase accordingly. Existing mobile phone flashlights generally use LEDs as light sources. The luminous flux and color temperature of this single LED as a flashlight light source cannot be adjusted. Severe color cast occurs, which fails to meet the ideal lighting requirements, thus affecting the quality of photography. In order to solve the deficiency of the single-chip light source of the flashlight, people have developed a double-flash flashlight, that is, the light source of the flashlight has two LEDs, the two LEDs are separated independently, the two LEDs are independently packaged, and there are corresponding lenses. This kind of double-flash flash has high brightness, but because it is independently packaged, the light is mixed after passing through their respective lenses, so the light mixing effect is not ideal; in addition, due to the occupation of two independently packaged LEDs and lenses The space is larger.

Contents of the invention

The technical problem to be solved by the present invention is to provide a flashlight with small size, large flash light flux, uniform light output from the flashlight, and the ability to adjust the color temperature of the flashlight to improve the quality of photographing.

In order to solve the above-mentioned technical problems, the technical solution of the present invention is: a flashlight, comprising an LED light source and a lens matched with the LED light source, the LED light source comprising more than two chip-scale packaged white LEDs, each chip-scale packaged White LEDs have different color temperatures, and each chip-scale package white LED has an independent drive circuit, and all chip-scale package white LEDs share a lens. In the present invention, a plurality of chip-level packaged white light LEDs are packaged together and share a lens. The LED chips generate white lights with different color temperatures by exciting their respective fluorescent glues. The white lights with different color temperatures are mixed during the propagation process, and finally emitted through the lens after light distribution. , so as to achieve a better light output effect, and the light mixing is relatively uniform; because the LED light source has LEDs with different color temperatures, and they correspond to different control circuits, the purpose of adjusting the color temperature of the flash can be achieved by changing the ratio of different color temperatures; using chip-level The packaged white LEDs can be packaged in one LED light source and share one lens, so the volume of the flashlight can be made smaller, which is convenient for integration into mobile phones.

As an improvement, the LED light source includes a high color temperature chip scale package white LED, a high color temperature drive circuit for driving the high color temperature chip scale package white LED, a low color temperature chip scale package white LED, and a low color temperature driver for driving the low color temperature chip scale package white LED. circuit; the high color temperature chip-scale packaged white light LED includes a first LED chip, the top surface of the first LED chip is provided with a first fluorescent glue layer, and the four sides of the first LED chip are provided with a first LED chip to prevent light from the side of the chip A light blocking adhesive layer; the low color temperature chip-scale packaged white light LED includes a second LED chip, the top surface of the second LED chip is provided with a second fluorescent adhesive layer, and the four sides of the second LED chip are provided with blocking chips The second light-blocking adhesive layer for side light emission.

As an improvement, a layer of fluorescent adhesive layer is further provided between the first light-blocking adhesive layer and the side of the first LED chip; a layer of fluorescent adhesive is also provided between the second light-blocking adhesive layer and the side of the second LED chip. glue layer.

As an improvement, the inner surface of the first light-blocking adhesive layer is provided with a reflective layer, and the inner surface of the second light-blocking adhesive layer is provided with a reflective layer.

As an improvement, the color temperature of high color temperature chip-scale package white LEDs is 4000~10000K, and the color temperature of low color temperature chip-scale package white LEDs is 2000~4000K.

As an improvement, the color temperature range of each chip-scale packaged white LED is 2000~10000K,

As an improvement, both the first LED chip and the second LED chip are flip chips.

As an improvement, the lens is a Fresnel lens.

As an improvement, a diffusion layer is provided between the LED light source and the lens, and the diffusion layer helps to mix light after multiple LEDs emit light, making the light output of the flash more uniform.

Compared with the prior art, the present invention has the following beneficial effects:

1. Both the high color temperature chip-level packaged white light LED and the low color temperature chip-level packaged white light LED of the present invention emit light from one side, and the two LED chips generate white light with different color temperatures by exciting their respective fluorescent glues. Mixed light, finally through the lens after light distribution, so as to achieve a better light output effect, and the mixed light is relatively uniform;

2. Since the LED light source has two LEDs with different color temperatures, and each corresponds to a different control circuit, the purpose of adjusting the color temperature of the flash can be achieved by changing the ratio of different color temperatures;

3. Two white LEDs with chip-level packaging can be packaged in one LED light source and share one lens, so the volume of the flashlight can be made smaller, which is convenient for integration into mobile phones.

Description of drawings

Fig. 1 is a schematic diagram of the structure of the flash lamp in Embodiment 1.

Fig. 2 is a schematic structural diagram of the flash lamp in Embodiment 2.

Fig. 3 is a schematic diagram of the structure of the flash lamp in Embodiment 3.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings of the description.

The present invention provides a flashlight, which includes an LED light source and a lens 1 matched with the LED light source. The LED light source includes more than two chip-scale packaged white light LEDs, each chip-scale packaged white light LED has a different color temperature, each chip-scale packaged white light LED has an independent driving circuit, and all chip-scale packaged white light LEDs share a lens. The color temperature of each chip-scale packaged white LED is 2000~10000K. Multiple chip-scale packaged white LEDs divide the color temperature of 2000~10000K into multiple color temperature zones. In the following embodiments, the LED light source includes chip-scale packaged white LEDs with two color temperatures for illustration. Chip-scale packaged white LEDs with various color temperatures are only different in the number of chip-scale packaged white LEDs and the color temperature range.

Example 1

As shown in FIG. 1 , a flashlight includes an LED light source and a lens 1 matched with the LED light source. The LED light source includes a high color temperature chip-scale package white LED 3, a high color temperature driving circuit for driving the high color temperature chip-scale package white LED 3, a low color temperature chip-scale package white LED 4, and a low color temperature drive circuit for driving the low-color temperature chip-scale white LED 4. Drive circuit. The high color temperature chip-scale packaged white light LED 3 includes a first LED chip 31, the top surface of the first LED chip 31 is provided with a first fluorescent adhesive layer 32, and the four sides of the first LED chip 31 are provided with blocking chip sides. The first light-shielding adhesive layer 33 that emits light; the low color temperature chip-scale package white light LED 4 includes a second LED chip 41, the top surface of the second LED chip 41 is provided with a second fluorescent adhesive layer 42, and the second LED chip The four sides of 41 are provided with a second light-blocking adhesive layer 43 that prevents light from coming out from the side of the chip. Both the first LED chip 31 and the second LED chip 41 are flip chips, electrodes are provided on the bottom surface of the chip, and the first LED chip 31 and the second LED chip 41 are integrated on the same circuit board 2 . Among them, the color temperature of high color temperature chip-scale package white LED is 4000~10000K, and the color temperature of low color temperature chip-scale package white LED is 2000~4000K. In this embodiment, the color temperature of the high color temperature chip-scale packaged white LED 3 is 6500K, and the color temperature of the low color temperature chip-scale packaged white LED 4 is 2700K. The high color temperature chip-scale package white light LED 3 and the low color temperature chip-scale package white light LED 4 share a lens 1, and the lens 1 is a Fresnel lens 1.

A diffusion layer 5 is provided between the LED light source and the lens. The diffusion layer 5 is formed by doping diffusion powder in the transparent glue. The transparent glue wraps the two LEDs to form a packaging structure. The diffusion layer 5 helps The mixed light after multiple LEDs emit light makes the light output of the flash more uniform. In addition, it should be pointed out that the diffusion layer 5 may also be replaced by a diffusion plate.

Both the high color temperature chip-level packaged white LED 3 and the low color temperature chip-level packaged white LED 4 of the present invention emit light from one side. The light is mixed, and finally it is emitted through the lens 1 after light distribution, so that a better light output effect can be achieved, and the light mixing is relatively uniform; since the LED light source has two LEDs with different color temperatures, and they correspond to different control circuits, it can be changed by changing different The purpose of adjusting the color temperature of the flash is achieved by adjusting the ratio of color temperature; two white LEDs using chip-scale packaging can be packaged in one LED light source and share a lens 1, so the volume of the flash can be made smaller, which is convenient for integration into mobile phones.

Example 2

As shown in FIG. 2 , a flashlight includes an LED light source and a lens 1 matched with the LED light source. The LED light source includes a high color temperature chip-scale package white LED 3, a high color temperature driving circuit for driving the high color temperature chip-scale package white LED 3, a low color temperature chip-scale package white LED 4, and a low color temperature drive circuit for driving the low-color temperature chip-scale white LED 4. Drive circuit. The high color temperature chip-scale packaged white light LED 3 includes a first LED chip 31, the top surface of the first LED chip 31 is provided with a first fluorescent adhesive layer 32, and the four sides of the first LED chip 31 are provided with blocking chip sides. The first light-shielding adhesive layer 33 that emits light; the low color temperature chip-scale package white light LED 4 includes a second LED chip 41, the top surface of the second LED chip 41 is provided with a second fluorescent adhesive layer 42, and the second LED chip The four sides of 41 are provided with a second light-blocking adhesive layer 43 that prevents light from coming out from the side of the chip. A layer of fluorescent adhesive layer 34 is also provided between the first light-blocking adhesive layer 33 and the side of the first LED chip 31; Layer fluorescent glue layer 44. In order to increase the amount of light output, a reflective layer is provided on the inner surface of the first light-blocking adhesive layer 33 , and a reflective layer is provided on the inner surface of the second light-blocking adhesive layer 43 . Both the first LED chip 31 and the second LED chip 41 are flip chips, electrodes are provided on the bottom surface of the chip, and the first LED chip 31 and the second LED chip 41 are integrated on the same circuit board 2 . Among them, the color temperature of high color temperature chip-scale package white LED is 4000~10000K, and the color temperature of low color temperature chip-scale package white LED is 2000~4000K. In this embodiment, the color temperature of the high color temperature chip-scale packaged white LED 3 is 6500K, and the color temperature of the low color temperature chip-scale packaged white LED 4 is 2700K. The high color temperature chip-scale package white light LED 3 and the low color temperature chip-scale package white light LED 4 share a lens 1, and the lens 1 is a Fresnel lens 1.

A diffusion layer 5 is provided between the LED light source and the lens. The diffusion layer 5 is formed by doping diffusion powder in the transparent glue. The transparent glue wraps the two LEDs to form a packaging structure. The diffusion layer 5 helps The mixed light after multiple LEDs emit light makes the light output of the flash more uniform. In addition, it should be pointed out that the diffusion layer 5 may also be replaced by a diffusion plate.

Both the high color temperature chip-level packaged white LED 3 and the low color temperature chip-level packaged white LED 4 of the present invention emit light from one side. The light is mixed, and finally it is emitted through the lens 1 after light distribution, so that a better light output effect can be achieved, and the light mixing is relatively uniform; since the LED light source has two LEDs with different color temperatures, and they correspond to different control circuits, it can be changed by changing different The purpose of adjusting the color temperature of the flash is achieved by adjusting the ratio of color temperature; two white LEDs using chip-scale packaging can be packaged in one LED light source and share a lens 1, so the volume of the flash can be made smaller, which is convenient for integration into mobile phones.

Example 3

As shown in FIG. 3 , a flashlight includes an LED light source and a lens 1 matched with the LED light source. The LED light source includes a high color temperature chip-scale package white LED 3, a high color temperature driving circuit for driving the high color temperature chip-scale package white LED 3, a low color temperature chip-scale package white LED 4, and a low color temperature drive circuit for driving the low-color temperature chip-scale white LED 4. Drive circuit. The high color temperature chip-scale package white light LED 3 includes a first LED chip 31 and a first fluorescent glue layer 32 wrapping the first LED chip 31; the low color temperature chip-scale package white light LED 4 includes a second LED chip 41 and a first fluorescent adhesive layer 32 wrapping the first LED chip 31; The second fluorescent adhesive layer 42 of the two LED chips 41 . Both the first LED chip 31 and the second LED chip 41 are flip chips, electrodes are provided on the bottom surface of the chip, and the first LED chip 31 and the second LED chip 41 are integrated on the same circuit board 2 . Among them, the color temperature of high color temperature chip-scale package white LED is 4000~10000K, and the color temperature of low color temperature chip-scale package white LED is 2000~4000K. In this embodiment, the color temperature of the high color temperature chip-scale packaged white LED 3 is 6500K, and the color temperature of the low color temperature chip-scale packaged white LED 4 is 2700K. The high color temperature chip-scale package white light LED 3 and the low color temperature chip-scale package white light LED 4 share a lens 1, and the lens 1 is a Fresnel lens 1.

A diffusion layer 5 is provided between the LED light source and the lens. The diffusion layer 5 is formed by doping diffusion powder in the transparent glue. The transparent glue wraps the two LEDs to form a packaging structure. The diffusion layer 5 helps The mixed light after multiple LEDs emit light makes the light output of the flash more uniform. In addition, it should be pointed out that the diffusion layer 5 may also be replaced by a diffusion plate.

The two LED chips generate white light with different color temperatures by exciting their respective fluorescent glues. The two white lights with different color temperatures are mixed during the propagation process, and finally emitted through the lens 1 after light distribution, so as to achieve a better light output effect and more uniform light mixing. ; Since the LED light source has two LEDs with different color temperatures, and they correspond to different control circuits, the purpose of adjusting the color temperature of the flash can be achieved by changing the ratio of different color temperatures; two white LEDs in chip-level packaging can be packaged in one LED In the light source, and share a lens 1, so the volume of the flash can be made smaller, easy to integrate into the mobile phone.

Claims (9)

1. a photoflash lamp, the lens comprising LED light source and coordinate with described LED light source, it is characterized in that: described LED light source comprises the wafer-level package white light LEDs of more than two, the colour temperature of every chips level encapsulation white light LEDs is different, each wafer-level package white light LEDs has independently drive circuit, and all wafer-level package white light LEDs share lens.

2. a kind of photoflash lamp according to claim 1, is characterized in that: described LED light source comprises high color temperature wafer-level package white light LEDs, the high color temperature drive circuit of driving high color temperature wafer-level package white light LEDs, low colour temperature wafer-level package white light LEDs and drives the low colour temperature drive circuit of low colour temperature wafer-level package white light LEDs; Described high color temperature wafer-level package white light LEDs comprises the first LED chip, and the end face of described first LED chip is provided with the first fluorescent adhesive layer, and four sides of the first LED chip are provided with the first gear optical cement layer stoping chip sides bright dipping; Described low colour temperature wafer-level package white light LEDs comprises the second LED chip, and the end face of described second LED chip is provided with the second fluorescent adhesive layer, and four sides of the second LED chip are provided with the second gear optical cement layer stoping chip sides bright dipping.

3. a kind of photoflash lamp according to claim 2, is characterized in that: be also provided with one deck fluorescent adhesive layer between described first gear optical cement layer and the side of the first LED chip; One deck fluorescent adhesive layer is also provided with between described second gear optical cement layer and the side of the second LED chip.

4. a kind of photoflash lamp according to claim 2, is characterized in that: the medial surface of described first gear optical cement layer is provided with reflector layer, and the medial surface of described second gear optical cement layer is provided with reflector layer.

5. a kind of photoflash lamp according to claim 2, is characterized in that: the colour temperature of high color temperature wafer-level package white light LEDs is 4000 ~ 10000K, and the colour temperature of low colour temperature wafer-level package white light LEDs is 2000 ~ 4000K.

6. a kind of photoflash lamp according to claim 1, is characterized in that: the colour temperature of every chips level encapsulation white light LEDs is 2000 ~ 10000K.

7. a kind of photoflash lamp according to claim 2, is characterized in that: the first LED chip and the second LED chip are flip-chip.

8. a kind of photoflash lamp according to claim 1, is characterized in that: described lens are Fresnel Lenses.

9. a kind of photoflash lamp according to claim 1, is characterized in that: be provided with diffusion layer between described LED light source and lens.