CN204629218U - Backlight device - Google Patents

Abstract

The utility model discloses a backlight device, this backlight device includes: the backlight module comprises a reflector plate, a rubber frame in contact with the reflector plate and a light guide plate accommodated in the rubber frame, wherein one surface of the rubber frame in contact with the reflector plate is a first surface of the rubber frame, and one surface of the rubber frame departing from the reflector plate is a second surface of the rubber frame; the glue frame comprises at least one groove for fixing the light-emitting element, and further comprises a heat dissipation channel, wherein the heat dissipation channel is arranged in at least one of the first surface and the second surface of the glue frame, and is located at the peripheral position of the groove. The utility model discloses a link up the heat dissipation channel who glues the frame in gluing the frame, make the interior air convection that forms of heat dissipation channel for heat energy exchange improves the radiating efficiency, heat dissipation channel with glue frame integrated into one piece, do not influence backlight unit thickness, have simple process, low cost, the advantage of the device slimming of being convenient for in a poor light.

Description

A backlight device

technical field

The utility model relates to the display field, in particular to a backlight device for a display.

Background technique

The backlight module is located under the liquid crystal display panel. The liquid crystal display panel is a passive light-emitting element. It does not emit light itself, but the light source provided by the light source located in the backlight module below it. The backlight module and the liquid crystal display panel are combined together A liquid crystal display module is formed, and the luminous effect of the backlight module will directly affect the display effect of the liquid crystal display module.

Since there are multiple light sources in the backlight module, heat radiation will be generated when the light sources emit light. In the prior art, heat sinks are usually used to dissipate heat from the light sources in the backlight module. Referring to Fig. 1 (a), it is a schematic diagram of a backlight module provided in the prior art. As shown in the figure, an extruded heat sink 11 is arranged in the backlight module, and the heat sink 11 is directly in contact with the light source 12 , when the light source 12 emits light, the heat sink 11 absorbs heat radiation and dissipates heat. Referring to FIG. 1( b ), it is a schematic diagram of another backlight module provided in the prior art. As shown in the figure, a heat sink 21 is attached to the shell of the backlight module, and the heat sink 21 absorbs heat radiation to dissipate heat.

The defect of the prior art is that the heat sink is either embedded in the backlight module or attached to the shell of the backlight module, which increases the thickness of the backlight module, which is not conducive to the thinning of the backlight module, and the heat dissipation efficiency is low. In addition, when manufacturing the backlight module, it is necessary to increase the process of attaching the heat sink, and the manufacturing cost is relatively high.

Utility model content

The utility model provides a backlight device to solve the problems of large thickness, low heat dissipation efficiency and high manufacturing cost in the prior art.

The utility model provides a backlight device, which comprises: a reflective sheet, a plastic frame in contact with the reflective sheet, and a light guide plate accommodated in the plastic frame, wherein the plastic frame and the reflective The side in contact with the sheet is the first side of the plastic frame, and the side of the plastic frame away from the reflective sheet is the second side of the plastic frame;

The plastic frame includes at least one groove for fixing the light-emitting element, and the plastic frame also includes a heat dissipation channel, and the heat dissipation channel is arranged in at least one of the first surface and the second surface of the plastic frame, And the heat dissipation channel is located at the peripheral position of the groove.

The backlight device provided by the utility model is provided with a heat dissipation channel in the plastic frame, and the heat dissipation channel and the plastic frame are integrally formed and molded in the plastic frame mold, which does not require a new design mold and does not increase the thickness of the backlight device at the same time, and has the advantages of simple process and low cost. , The advantages of facilitating the thinning of the backlight device. In addition, the heat dissipation channel of the present invention penetrates the left side and the right side of the plastic frame, as well as the first surface and the second surface of the plastic frame, so that air convection is formed in the groove, which speeds up the heat exchange and improves the heat dissipation efficiency, and There is no need to attach heat dissipation glue or heat dissipation fins in the plastic frame, which reduces the attachment process and reduces the manufacturing cost.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings that need to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description The drawings show some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative work.

Figure 1(a) is a schematic diagram of a backlight module provided by the prior art;

Fig. 1(b) is a schematic diagram of another backlight module provided by the prior art;

Fig. 2 (a) is a structural diagram of a backlight device provided by an embodiment of the present invention;

Fig. 2 (b) is the plastic frame schematic diagram that an embodiment of the present invention provides;

Fig. 2 (c) is the plastic frame schematic diagram that an embodiment of the present invention provides;

Fig. 3 (a) is the schematic diagram of the cooling channel provided by another embodiment of the utility model;

Fig. 3(b) is a schematic diagram of a heat dissipation channel provided by another embodiment of the present invention;

Fig. 3 (c) is the schematic diagram of the cooling channel provided by another embodiment of the utility model;

Fig. 3(d) is a schematic diagram of a heat dissipation channel provided by another embodiment of the present invention;

Fig. 3 (e) is the schematic diagram of the cooling channel provided by another embodiment of the utility model;

Fig. 4 (a) is the schematic diagram of the cooling channel provided by another embodiment of the utility model;

Fig. 4(b) is a schematic diagram of a heat dissipation channel provided by another embodiment of the utility model;

Fig. 4(c) is a schematic diagram of a heat dissipation channel provided by another embodiment of the utility model;

Fig. 4(d) is a schematic diagram of a heat dissipation channel with heat dissipation through holes provided by another embodiment of the present invention;

Fig. 4 (e) is the schematic diagram of the cooling channel provided by another embodiment of the utility model;

Fig. 4 (f) is the schematic diagram of the cooling channel provided by another embodiment of the utility model;

Fig. 5(a) is a schematic cross-sectional shape diagram of a heat dissipation channel provided by another embodiment of the present invention;

Figure 5(b) is a schematic diagram of the cross-sectional inner wall structure of the heat dissipation channel provided by another embodiment of the present invention

Fig. 5(c) is a schematic diagram of the inner wall film layer of the heat dissipation channel provided by another embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described through implementation modes with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments It is a part of embodiments of the present utility model, but not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

In the embodiment of the utility model, the structure of the plastic frame is designed, and heat dissipation channels are added to improve the heat dissipation efficiency of the light emitting elements of the display panel.

Referring to Fig. 2 (a), it is a structural diagram of a backlight device provided by an embodiment of the present invention, the backlight device includes: a reflective sheet 110, a plastic frame 120 in contact with the reflective sheet 110, a plastic frame 120 accommodated in the plastic The light guide plate 130 in the frame 120, wherein the side of the plastic frame 120 in contact with the reflective sheet 110 is the first surface 121 of the plastic frame 120, and the side of the plastic frame 120 away from the reflective sheet 110 is the second surface of the plastic frame 120 (not shown) ); the plastic frame 120 includes at least one groove 122 for fixing the light-emitting element, the plastic frame 120 also includes a heat dissipation channel 123, and the heat dissipation channel 123 is arranged in at least one of the first surface 121 and the second surface of the plastic frame 120 , and the cooling channel 123 is located at the peripheral position of the groove 122 .

It is known that the liquid crystal display panel itself cannot emit light, but provides light through the light-emitting elements in the backlight module located under the liquid crystal display panel, and provides sufficient brightness and distribution for the display panel through optical films such as the reflective sheet 110 and the light guide plate 130 With a uniform light source, the liquid crystal display panel can display images normally only by modulating the light generated by the light-emitting elements. The light-emitting elements of the liquid crystal display are independent from the backlight device, a plurality of light-emitting elements are packaged in the backlight device, and the light emitted by the backlight module directly affects the visual effect of the liquid crystal display panel. In this embodiment, the light emitting element may be a light emitting diode (LED).

In this embodiment, as shown in FIG. 2(a), the backlight device includes a plastic frame 120, and the plastic frame 120 includes a plurality of grooves 122, and the grooves 122 are used for accommodating light-emitting elements, and its function is to fix a plurality of For the light-emitting element, the plastic frame 120 has a first surface 121 and a second surface. The first surface 121 of the plastic frame 120 refers to the side of the plastic frame 120 that is in contact with the reflective sheet 110. The second surface of the plastic frame 120 refers to the surface of the plastic frame 120 away from the reflection One side (not shown) of the sheet 110; the reflective sheet 110, the reflective sheet 110 is in contact with the first surface 121 of the plastic frame 120, when the light-emitting element emits light, the reflective sheet 110 receives part of the light and reflects the light, so that The light propagates along the direction facing the liquid crystal display panel, and the function of the reflective sheet 110 is to improve the light use efficiency of the light-emitting element; the light guide plate 130, the light guide plate 130 is accommodated in the plastic frame 120 and the light guide plate 130 is arranged opposite to the reflective sheet 110, The light guide plate 130 is usually a highly reflective and non-light-absorbing material and has multiple diffusion points. The light guide plate 130 receives the light reflected by the reflective sheet 110 and guides the light into the light guide plate 130. When the light hits the diffusion point, the light goes to The light is diffused at various angles, and then the light is emitted from the front of the light guide plate 130, and the light guide plate 130 can emit light evenly by using various diffusion points of different densities and sizes. The function of the light guide plate 130 is to guide the direction of light diffusion, so that the light can be fully utilized and evenly distributed.

In order to ensure the display effect of the liquid crystal display panel, a plurality of light-emitting elements usually need to be installed in the backlight module. An increase in temperature may increase the temperature of the light-emitting element, resulting in failure of the light-emitting element, accelerated aging of the cooling device, uneven temperature of the device, and reduced service life of the light-emitting element. In order to improve the performance of the backlight device, in this embodiment, a heat dissipation channel 123 is formed on the plastic frame 120. The heat dissipation channel 123 is arranged on at least one of the first surface 121 and the second surface of the plastic frame 120, and is connected to the outside air. and the heat dissipation channel 123 can guide the heat radiation and hot air generated when the light-emitting element emits light, and because the light-emitting element is located in the groove 122 of the plastic frame 120, the heat dissipation channel 123 is specifically located at the peripheral position of the groove 122, At this time, when the light-emitting element in the groove 122 is heated, the heat dissipation channel 123 around the groove 122 will lead out the heat radiation around the light-emitting element, and exchange the hot air with the outside air to speed up the heat dissipation without causing the heat radiation to gather in the Around the light-emitting element, compared with the backlight device of the prior art, this embodiment forms the heat dissipation channel 123 integrally when the plastic frame 120 is formed, which can not only directly and quickly lead out the heat radiation generated by the light-emitting element in the groove 122, but also The hot air in the groove 122 is exchanged with the outside air, which also improves the heat dissipation problem of the existing backlight device and improves the heat dissipation efficiency of the backlight device.

Referring to FIG. 2( b ), it is a schematic diagram of a plastic frame provided by an embodiment of the present invention. As shown in the figure, a plurality of light-emitting elements (not shown) are fixed in the groove 122 of the glue frame 120, and the light-emitting elements can be arranged in sequence, so the glue frame 120 has a plurality of hollow grooves 122 arranged in sequence, and the glue The frame 120 is also used to accommodate the light guide plate 130. Specifically, the groove 122 for fixing the light-emitting element in the plastic frame 120 has a gap in the direction close to the light guide plate 130, so the peripheral position of the groove 122 in the plastic frame 120 specifically includes the groove 122 The left area of the groove 122, the right area of the groove 122, and the lower area of the groove 122. It is known that the heat dissipation channel 123 specifically conducts the heat radiation around the light-emitting element out of the inside of the plastic frame 120, and exchanges the hot air around the light-emitting element with the outside air. Since the light-emitting element is located in the groove 122, the heat dissipation channel 123 is located in the groove At the peripheral position of 122 , preferably, the heat dissipation channel 123 is specifically formed at any position on the left side, right side or lower part of the groove 122 .

A cooling channel 123 is provided at the peripheral position of the groove 122 where the light-emitting element is fixed in the plastic frame 120, so that the heat radiation generated by the light-emitting element and the surrounding hot air can be introduced into the cooling channel 123. If the cooling channel 123 is only located in a certain concave If the peripheral position of the groove 122 is independent and not connected to each other, then the heat radiation of the light emitting element is still gathered at the peripheral position of the groove 122, and the temperature of the air around the light emitting element increases with the increase of the heat radiation, and the hot air cannot be directly exported to the Outside the backlight device, the hot air around the groove 122 cannot exchange with the outside air. In order to actually improve the problem of heat radiation emitted by the light-emitting elements, the heat dissipation channel 123 around the groove 122 of the light-emitting element needs to extend to the outside of the plastic frame 120 to communicate with the outside world. At this time, the heat radiation around the multiple light-emitting elements is penetrating. The heat dissipation channel 123 conducts and leads out to the plastic frame 120, and the hot air around the light-emitting element realizes convection with the outside air, and exchanges with the outside air outside the plastic frame 120 through the heat dissipation channel 123, so as to realize the heat radiation around the light-emitting element being exported, and the temperature is rapid The reduced effect improves the heat dissipation efficiency, so preferably, the heat dissipation channel 123 runs through the left side 124 and the right side 125 of the plastic frame 120, where the heat dissipation channel 123 is located in the first surface 121 and the second surface of the plastic frame 120 In at least one plane, wherein, the left side 124 of the glue frame 120 is located on the left side of the groove 122 , and the right side 125 of the glue frame 120 is located on the right side of the groove 122 .

Here, refer to FIG. 2( c ), which is a schematic diagram of a plastic frame provided by an embodiment of the present invention. If the heat dissipation channel 123 is set so that it does not penetrate the left side 124 and the right side 125 of the plastic frame 120, it is known that the surrounding area of the groove 122 on the second surface of the plastic frame 120 is not covered, so that the thermal radiation of the light-emitting element is derived, as shown in Figure 2 ( c) As shown in c), a heat dissipation channel 123 can be provided on the periphery of the groove 122 through the first surface 121 and the second surface of the plastic frame 120, and the heat radiation and hot air around the light-emitting element can directly contact with the heat dissipation channel 123 around the groove 122. External air exchange speeds up heat dissipation. Here, the heat dissipation channels 123 around any one of the grooves 122 can be independent or connected to each other. Therefore, preferably, the heat dissipation channel 123 runs through the first surface 121 and the second surface of the plastic frame 120 .

In addition, in order to improve the heat dissipation efficiency of the light-emitting element more optimally, preferably, the heat dissipation channel 123 can also pass through the left side 124 and the right side 125 of the plastic frame 120, and the heat dissipation channel 123 can pass through the first surface of the plastic frame 120 121 and the second side. Through the heat dissipation channel 123 formed in the plastic frame 120 in this way, the heat radiation of the light-emitting element and the surrounding hot air can convect and exchange with the outside air through the heat dissipation channel 123 penetrating through the peripheral position of the corresponding groove 122, so as to achieve faster heat dissipation. At the same time, the heat dissipation channel 123 penetrating through the periphery of the groove 122 is exported to the outside of the plastic frame 120, and the hot air is directly exchanged with the outside air to achieve faster heat dissipation, so the heat dissipation effect is relatively better.

In the backlight device provided by the embodiment of the present utility model, a heat dissipation channel 123 is provided in the plastic frame 120, and the heat dissipation channel 123 is integrally formed with the plastic frame 120, and is molded in the mold of the plastic frame 120, which does not require a new design mold and does not affect the thickness of the backlight device. The invention has the advantages of simple process, low cost, and facilitates thinning of the backlight device. In addition, in the backlight device provided by the present invention, a plurality of grooves 122 are provided in the plastic frame 120, and a light-emitting element is fixed in each groove 122, so that the light-emitting elements are independent of each other. In addition, the heat dissipation channel 123 of the embodiment of the present invention penetrates through a plurality of grooves 122 and extends to the left side 124 and the right side 125 of the plastic frame 120, so that air convection is formed in the groove 122, which speeds up the heat exchange and improves the heat dissipation. Efficiency, there is no need to attach heat dissipation glue or heat dissipation fins in the glue frame 120, which reduces the attachment process and reduces the manufacturing cost.

Referring to FIG. 3( a ), it is a schematic diagram of a heat dissipation channel provided by another embodiment of the present invention. The heat dissipation channel 123 runs through the left side 124 and the right side 125 of the plastic frame 120. Specifically, the heat dissipation channel 123 is formed on the left side and the right side of any one of the grooves 122, and extends to the left side of the plastic frame 120. The surface 124 and the right side 125, and the heat dissipation channel 123 formed on the left and right sides of any one of the grooves 122 pass through, and the heat radiation emitted by any light-emitting element and the surrounding hot air will flow to the left and right respectively, In this way, heat radiation is exported and air convection is realized. In the heat dissipation channel 123, the heat radiation emitted by adjacent light-emitting elements causes the temperature of the air around the light-emitting elements to rise, and the heat radiation and hot air are respectively introduced into the left and right sides of the groove 122, and the left and right sides of any groove 122 Both are connected with the outside air, so under the action of the through heat dissipation channel 123 and air convection, the hot air and the outside air will convect in the through heat dissipation channel 123, and then the heat radiation will be exported to the heat dissipation channel 123 to realize heat dissipation.

Referring to FIG. 3( b ), it is a schematic diagram of a heat dissipation channel provided by another embodiment of the present invention. The heat dissipation channel 123 runs through the left side 124 and the right side 125 of the plastic frame 120 , specifically, the heat dissipation channel 123 is formed at the lower part of the groove 122 and extends to the left side 124 and the right side 125 of the plastic frame 120 The lower part of any one of the grooves 122 forms a heat dissipation channel 123, and the heat dissipation channels 123 of all the grooves 122 are connected and extended to the outside of the plastic frame 120. When the light-emitting element emits light, the heat radiation emitted by the light-emitting element will increase the temperature of the air around the light-emitting element. High, heat radiation and hot air are introduced into the lower part of the groove 122, and the hot air is convected with the outside air in the through heat dissipation channel 123, and the heat radiation channel 123 leads the heat radiation directly from the lower part of the groove 122 to realize heat dissipation .

Referring to FIG. 3( c ), it is a schematic diagram of a heat dissipation channel provided by another embodiment of the present invention. The cooling channel 123 runs through the left side 124 and the right side 125 of the plastic frame 120. Specifically, the cooling channel 123 is formed on the left side and the right side of the groove 122 and extends to the left side 124 and the right side of the plastic frame 120. The right side 125 is also formed at the lower part of the groove 122 and extends through to the left side 124 and the right side 125 of the plastic frame 120 . After the light-emitting element generates heat radiation, the heat radiation and hot air around the light-emitting element circulate to the left, right, and lower positions around the groove 122, and the hot air passes through the heat dissipation channels 123 on the left, right, and lower positions of the groove 122. The air is exchanged with the outside world, and the heat radiation is exported to the inside of the plastic frame 120 through the heat dissipation channel 123. At the same time, the hot air is convected with the outside air in the heat dissipation channel 123 at the lower part of the groove 122, and the heat radiation is also exported to the plastic frame 120 to realize heat dissipation.

Referring to FIG. 3( d ), it is a schematic diagram of a heat dissipation channel provided by another embodiment of the present invention. The heat dissipation channel 123 is formed at the lower part of the groove 122 , and is also formed at the left and right sides of the groove 122 , the heat dissipation channels 123 at the left and right sides of the groove 122 pass through but do not extend to both sides of the plastic frame 120 , the heat dissipation channel 123 at the lower part of the groove 122 penetrates but does not extend to both sides of the plastic frame 120, and then in the formed heat dissipation channel 123, the heat dissipation channel 123 near the left side 124 of the plastic frame 120 and located at the lower part of the groove 122 The port is connected to the heat dissipation port on the left side of the groove 122 closest to the left side of the plastic frame and extends through to the left side 124 of the plastic frame 120, and the heat dissipation channel 123 is located near the right side 125 of the plastic frame 120 and is located on the plastic frame. The heat dissipation port at the lower part of the groove 122 closest to the right side of the frame is connected to the heat dissipation port on the right side of the groove 122 and extends to the right side 125 of the plastic frame 120. At this time, it extends to the left side 124 of the plastic frame 120. The heat dissipation opening of the heat dissipation hole and the heat dissipation opening extending to the right side 125 of the plastic frame 120 are connected. Preferably, the heat dissipation port extending to the left side 124 of the plastic frame 120 and the heat dissipation port extending to the right side 125 of the plastic frame 120 are connected and penetrated with the heat dissipation channel 123 at the lower part of the groove 122, so that the heat radiation around the light emitting element Respectively flow out from the left side, right side and lower part of the groove 122 to the inside of the plastic frame 120, and the outside air is introduced from the heat dissipation channels 123 at the lower part of the groove 122 to the left and right sides of the plastic frame 120 to convect the hot air inside the plastic frame 120, Realize heat dissipation. Preferably, the heat dissipation openings extending to the left side 124 of the plastic frame 120 and the heat dissipation openings extending to the right side 125 of the plastic frame 120 are connected and penetrated with the heat dissipation channels 123 on the left and right sides of the groove 122, so that the light emitting element The surrounding heat radiation flows out from the left side, the right side and the lower part of the groove 122 to the inside of the plastic frame 120, and the outside air is introduced from the heat dissipation channels 123 on the left and right sides of the groove 122 to the left and right sides of the rubber frame 120 and Convection with hot air to achieve heat dissipation.

Referring to FIG. 3( e ), it is a schematic diagram of a heat dissipation channel provided by another embodiment of the present invention. The heat dissipation channel 123 is formed at the lower part of the groove 122, and is also formed at the left and right sides of the groove 122; wherein, in the heat dissipation channel 123, the part close to the left side 124 of the plastic frame 120 and located at the lower part of the groove 122 The heat dissipation port is connected to the heat dissipation port on the left side of the groove 122 and extends through to the left side 124 of the plastic frame 120, and the heat dissipation port in the heat dissipation channel 123, which is close to the right side 125 of the plastic frame 120 and located at the lower part of the groove 122 It is connected with the heat dissipation port on the right side of the groove 122 and extends through to the right side 125 of the plastic frame 120; The heat dissipation channel 123 at the side position is connected. Here, after the outside air is introduced into the heat dissipation passage 123 through the heat dissipation ports on the left side 124 and the right side 125 of the plastic frame 120, it will pass through the heat dissipation passage 123 at the lower part of the groove 122, and the heat dissipation connected between the left side and the lower part of the groove 122. The channel 123 , the heat dissipation channel 123 connected to the right side of the groove 122 and the lower part respectively convect the hot air generated by the light-emitting element, and the heat radiation emitted by the light-emitting element will also be exported to the plastic frame 120 through the heat dissipation channel 123 .

The heat dissipation channel 123 provided in the plastic frame 120 provided by the embodiment of the present invention passes through the left side 124 and the right side 125 of the plastic frame 120, and the heat radiation around the light-emitting element is exported through the heat dissipation channel 123, and the heat radiation around the light-emitting element The hot air is convected and exchanged with the outside air through the heat dissipation channel 123, which improves the heat dissipation efficiency of the light emitting element.

Referring to FIG. 4( a ), it is a schematic diagram of a heat dissipation channel provided by another embodiment of the present invention. The heat dissipation channel 123 is formed at the lower part of the groove 122 but does not extend through to the left side 124 and the right side 125 of the plastic frame 120. Radiation is gathered inside the plastic frame 120. In order to allow the hot air to convect quickly with the outside air, based on the structure that the second surface of the plastic frame 120 is not covered, a non-through heat dissipation channel 123 is formed that penetrates the first surface 121 of the plastic frame 120 and The thermal vias 126 on the second surface. When the heat dissipation through hole 126 is formed in the heat dissipation channel 123, the heat dissipation through hole 126 can realize the convection between the hot air and the outside air, and the heat radiation is exported to the plastic frame 120 through the heat dissipation through hole 126, so the heat dissipation of the hot air at the lower part of the groove 122 When the flow in the passage 123 is conducted, it will be conducted from any one of the heat dissipation through holes 126 in the heat dissipation passage 123 at the lower part of the groove 122 and exchanged with the outside air to achieve convection and conduction of heat radiation. In this figure, the heat dissipation channel 123 at the lower part of the groove 122 of any light-emitting element can also be independent of each other, and is not connected with the heat dissipation channel 123 at the lower part of other grooves 122. At this time, the heat dissipation channel at the lower position of any groove 122 At least one heat dissipation through hole 126 is disposed in 123 .

Figure 4(a) shows the structure in which the heat dissipation channel 123 is formed at the lower part of the groove 122 and the heat dissipation through hole 126 is formed in the heat dissipation channel 123, as shown in Figure 4(b) here, it is another implementation of the present utility model The schematic diagram of the heat dissipation channel provided in the example, as mentioned above, the heat dissipation channel 123 can also be formed on the left and right sides of the groove 122, and the heat dissipation channel 123 is also formed to penetrate the first surface 121 and the second surface of the plastic frame 120. The heat dissipation through hole 126, at least one heat dissipation through hole 126 is formed in the heat dissipation channel 123 located on the left and right sides of any one of the grooves 122, which can realize heat radiation export, air exchange inside and outside the plastic frame 120, and accelerate heat dissipation. As shown in Fig. 4 (c), it is a schematic diagram of a cooling channel provided by another embodiment of the utility model, where the cooling channel 123 is formed in the lower position of the groove 122, and is also formed in the left and right sides of the groove 122 At the side position, the heat dissipation channel 123 also forms a heat dissipation through hole 126 penetrating through the first surface 121 and the second surface of the plastic frame 120 , and any peripheral position of any light emitting element includes at least one heat dissipation through hole 126 .

Referring to FIG. 4( d ), it is a schematic diagram of a heat dissipation channel with heat dissipation through holes provided by another embodiment of the present invention. Any one of the heat dissipation channels 123 shown in FIGS. 3( a )-3 ( e ) communicates with the outside air through the heat dissipation opening extending to the outside of the plastic frame 120 to achieve the effect of accelerating heat dissipation and leading out heat radiation. If at least one heat dissipation through hole 126 is added in the heat dissipation passage 123 shown in Fig. The heat dissipation through holes 126 on the surface 121 and the second surface, the number of heat dissipation through holes 126 can be set according to different user situations, taking the heat dissipation channel 123 shown in Figure 3 (e) as an example, adding heat dissipation through holes to the heat dissipation channel 123 126, the heat dissipation channel 123 formed is as shown in FIG. 4(d). Here, preferably at least one heat dissipation through hole 126 is provided in the heat dissipation channel 123 on the left side, the right side and the lower part of the groove 122, then the heat dissipation channel 123 passes through the heat dissipation port on the left side 124 and the right side of the plastic frame 120 The heat dissipation port of 125 exchanges with the outside air, and the heat radiation of the light-emitting element is exported, and at the same time, the heat dissipation port of the heat dissipation through hole 126 on the second surface of the plastic frame 120 convects the hot air generated by the light-emitting element, and leads out the heat radiation.

As shown in Fig. 4(d), in Fig. 3(e), heat dissipation through-holes 126 are added to dissipate heat through the heat-dissipating through-holes 126 on the second surface of the plastic frame 120. Here, the first surface 121 of the plastic frame 120 It is in contact with the reflection sheet 110, but the reflection sheet 110 does not completely cover the first surface 121 of the plastic frame 120, so as shown in FIG. 3(a)-3(e), any one of the heat dissipation passages 123 located on the first surface 121 of the plastic frame 120 also forms a heat dissipation passage 123 (heat dissipation groove 127), and the heat dissipation passage 123 extends to the first surface of the plastic frame 120. The area not covered by the reflector 110 in the surface 121 can be used as an air inlet to exchange with the hot air, so as to accelerate the derivation of heat radiation and heat dissipation. Here, a heat dissipation channel 123 shown in FIG. 3( e) is taken as an example , add a heat sink 127 to the heat dissipation channel 123, and the formed heat dissipation channel 123 is shown in FIG. To the area of the first surface 121 of the plastic frame 120 not covered by the reflective sheet 110 .

Combining the heat dissipation channel 123 described in Figure 4(d) and Figure 4(e), as shown in Figure 4(f), it is a schematic diagram of the heat dissipation channel provided by another embodiment of the utility model, and the heat dissipation through hole 126 can be combined with In combination with the heat dissipation groove 127, preferably, the heat dissipation channel 123 is also formed on the first surface 121 of the plastic frame 120 and is located at the peripheral position of the groove 122, and extends through to the area of the first surface 121 of the plastic frame 120 not covered by the reflective sheet 110 , and a heat dissipation through hole 126 penetrating through the first surface 121 and the second surface of the plastic frame 120 is also formed in the heat dissipation channel 123 .

The heat dissipation channel 123 provided in the plastic frame 120 provided by the embodiment of the present invention not only runs through the left side 124 and the right side 125 of the plastic frame 120, but also has a heat dissipation channel 123 that runs through the first surface 121 and the second side of the plastic frame 120. The heat dissipation holes 126 on the surface, then the heat radiation around the light-emitting element is exported to the outside of the plastic frame 120 through the heat dissipation channel 123, and is exported to the second surface of the plastic frame 120, and the hot air around the light-emitting element realizes convection through the heat dissipation channel 123 And exchange with the outside air, speeding up the heat dissipation efficiency of the light-emitting element.

Further, it is known that the heat dissipation vias 126 are formed at the left and right sides of the groove 122, or the heat dissipation vias 126 are formed at the lower part of the groove 122, or the heat dissipation vias 126 are formed at the left, right and right sides of the groove 122. The lower position, so for the heat dissipation through holes 126 formed on the left and right sides of the groove 122, the area of the heat dissipation through holes 126 should be smaller than the area of the plastic frame 120 between two adjacent grooves 122, that is, That is to say, part of the plastic frame 120 should be reserved between two adjacent light-emitting elements. For the heat dissipation through hole 126 formed at the lower part of the groove 122, the area of the heat dissipation through hole 126 should be smaller than the area of the plastic frame 120 at the lower part of the groove 122. It is beneficial to ensure the mechanical strength of the plastic frame and the stability of the backlight module.

Further, it is known that the heat dissipation via hole 126 is located at the lower part of the groove 122, and the heat dissipation via hole 126 is located at the left side and the position of the groove 122, then based on the area of the heat dissipation via hole 126 located on the left side and the right side of the groove 122 is less than The area of the adjacent two grooves 122, the shape of the heat dissipation through hole 126 can be arbitrarily set under the limitation of the area of the heat dissipation through hole 126, and the shape of the heat dissipation through hole 126 can be at least circular, or oval, or square, or Rhombus, or hexagon, as shown in FIG. 4( d ), the shape of the heat dissipating via hole 126 is set as a circle.

Further, it is known that the heat dissipation channel 123 is formed on at least one of the first surface 121 and the second surface of the plastic frame 120. Here, when the heat dissipation channel 123 is formed on the first surface 121 or the second surface of the plastic frame 120, Then the depth of the heat dissipation channel 123 can be set to be arbitrarily smaller than the thickness of the heat dissipation channel 123 between the first surface 121 and the second surface of the plastic frame 120, but in order to prevent the plastic frame 120 from breaking and affecting the strength of the plastic frame 120, it is preferable to set The depth of the heat dissipation channel 123 is no more than 1/3 of the thickness of the plastic frame 120 . When the heat dissipation channels 123 are formed on the first surface 121 and the second surface of the plastic frame 120, and the heat dissipation channels 123 on the first surface 121 of the plastic frame 120 and the heat dissipation channels 123 on the second surface of the plastic frame 120 are on the same side of the plastic frame 120 The positions and heights are relatively set, so the sum of the depths of the two cooling channels 123 cannot exceed the thickness of the plastic frame 120. In order to ensure the strength of the plastic frame 120, preferably, the sum of the depths of the two cooling channels 123 should be less than one-third of the thickness of the plastic frame 120 . When the heat dissipation channel 123 is formed on the first surface 121 and the second surface of the plastic frame 120, and the heat dissipation channel 123 on the first surface 121 of the plastic frame 120 and the heat dissipation channel 123 on the second surface of the plastic frame 120 are in the plastic frame 120 If the positions are completely staggered, then preferably, the depth of any heat dissipation channel 123 should be less than one-third of the thickness of the plastic frame 120. Referring to the multiple heat dissipation channels 123 shown in Figures 3 (a)-4 (f), the depth setting It is less than one-third of the thickness of the glue frame 120 .

Further, for any heat dissipation channel 123, the grooved shape of the heat dissipation channel 123 should have the advantages of increasing the radiation area and accelerating heat dissipation, so as shown in Figure 5 (a), the heat dissipation channel provided by another embodiment of the utility model The schematic diagram of the cross-sectional shape of the heat dissipation channel 123 is set to a semicircle. Here, the cross-sectional shape of the heat dissipation channel 123 can also be set to a square, U-shaped or V-shaped, wherein the heat dissipation of the semicircular heat dissipation channel 123 Works best.

For any material, its surface treatment is different, and the heat radiation rate of the material will also be different, resulting in different radiation and heat dissipation capabilities of the material. When multiple light-emitting elements generate heat radiation, the air layer becomes a contact due to the small thermal conductivity of the air. When the contact thermal resistance in the heat dissipation channel 123 is large, if the inner wall of the heat dissipation channel 123 is smooth, the heat dissipation effect of the heat dissipation channel 123 is poor under the large contact thermal resistance. Since the contact thermal resistance is inversely proportional to the contact area, in order to perform good heat dissipation, the inner wall surface of the heat dissipation channel 123 can be set as a surface with roughness. When the inner wall of the heat dissipation channel 123 has roughness, the heat radiation contact area becomes larger. The heat dissipation channel 123 has a good heat dissipation effect. Preferably, as shown in FIG. 5( b ), which is a cross-sectional inner wall structure diagram of a heat dissipation channel provided by another embodiment of the present invention, the inner wall surface of the heat dissipation channel 123 has a high surface roughness or a low surface roughness.

It is known that metal materials have electrons that can move freely. When one end of the metal material is heated, the vibration frequency of the electrons inside the metal increases and collides with the next electron, so that heat is introduced from one end of the metal material to the other end of the metal material, so the metal material It is a conductor, which can quickly conduct heat. Therefore, for the heat dissipation channel 123 provided in this embodiment, a metal film can be pasted on the inner wall of the heat dissipation channel 123 to speed up the heat dissipation of the heat dissipation channel 123. In addition, a layer of heat conduction material can also be coated on the inner wall surface of the heat dissipation channel 123 to accelerate the heat dissipation of the heat dissipation channel 123 . Therefore, as shown in FIG. 5( c), it is a schematic diagram of the inner wall film layer of the heat dissipation channel provided by another embodiment of the present utility model. Preferably, the inner wall surface of the heat dissipation channel 123 has a layer of metal film layer 128 or 128 coated. Thermally conductive coating.

Note that the above are only preferred embodiments of the present invention and the applied technical principles. Those skilled in the art will understand that the utility model is not limited to the specific embodiments described here, and various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the utility model. Therefore, although the utility model has been described in detail through the above embodiments, the utility model is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the utility model. The scope of the present invention is determined by the appended claims.

Claims (14)

1. a back lighting device, it is characterized in that, comprise: reflector plate, the glue frame contacted with described reflector plate, the light guide plate be contained in described glue frame, wherein, the one side that described glue frame contacts with described reflector plate is described glue frame first surface, and the one side that described glue frame deviates from described reflector plate is described glue frame second;

Described glue frame comprises at least one groove for fixing light-emitting component, described glue frame also comprises heat dissipation channel, described heat dissipation channel is arranged at least one face in the first surface of described glue frame and second, and described heat dissipation channel is positioned at described recessed circumferential position.

2. back lighting device according to claim 1, is characterized in that, described heat dissipation channel is formed in the optional position of the left side of described groove, right side or bottom.

3. back lighting device according to claim 2, is characterized in that, the left surface of the through described glue frame of described heat dissipation channel and right flank; Or described heat dissipation channel runs through the first surface of described glue frame and second; Or the left surface of the through described glue frame of described heat dissipation channel and right flank, also run through the first surface of described glue frame and second simultaneously; Wherein, the left surface of described glue frame is positioned at the left side of described groove, and the right flank of described glue frame is positioned at the right side of described groove.

4. back lighting device according to claim 3, is characterized in that, described heat dissipation channel is formed in the left side of described groove and right positions and through left surface and the right flank extending to described glue frame; Or described heat dissipation channel is formed in the lower position of described groove and through left surface and the right flank extending to described glue frame; Or described heat dissipation channel is formed in the left side of described groove and right positions and through left surface and the right flank extending to described glue frame, be also formed in the lower position of described groove and through left surface and the right flank extending to described glue frame simultaneously.

5. back lighting device according to claim 3, is characterized in that, described heat dissipation channel is formed in the lower position of described groove, is also formed in left side and the right positions of described groove;

Wherein, in described heat dissipation channel, near described glue frame left surface and the thermovent being positioned at described groove lower position be connected with the thermovent be positioned on the left of described groove and the through left surface extending to described glue frame, and in described heat dissipation channel, near described glue frame right flank and the thermovent being positioned at described groove lower position be connected with the thermovent be positioned on the right side of described groove and the through right flank extending to described glue frame.

6. back lighting device according to claim 5, is characterized in that, the heat dissipation channel being formed in the lower position of described groove be formed in the left side of described groove, the heat dissipation channel of right positions is connected.

7. back lighting device according to claim 3, is characterized in that, described heat dissipation channel is formed in the lower position of described groove, also forms the thermal vias running through described glue frame first surface and second in described heat dissipation channel; Or described heat dissipation channel is also formed in left side and the right positions of described groove, in described heat dissipation channel, also form the thermal vias running through described glue frame first surface and second; Or described heat dissipation channel is formed in the lower position of described groove, and be also formed in left side and the right positions of described groove, in described heat dissipation channel, also form the thermal vias running through described glue frame first surface and second.

8. the back lighting device according to any one of claim 1-7, is characterized in that, also forms the thermal vias running through described glue frame first surface and second in described heat dissipation channel; Or described heat dissipation channel is also formed in described glue frame first surface and is positioned at described recessed circumferential position, and the through first surface region extending to the described glue frame do not covered by described reflector plate; Or, described heat dissipation channel is also formed in described glue frame first surface and is positioned at described recessed circumferential position, and the through first surface region extending to the described glue frame do not covered by described reflector plate, and in described heat dissipation channel, also form the thermal vias running through described glue frame first surface and second.

9. back lighting device according to claim 8, is characterized in that, the area of described thermal vias is less than the glue frame area between adjacent two described grooves.

10. back lighting device according to claim 8, is characterized in that, the shape of described thermal vias at least comprises: circular, oval, square, rhombus, hexagon.

11. back lighting devices according to any one of claim 1-7, it is characterized in that, the degree of depth of described heat dissipation channel is less than 1/3rd thickness of described glue frame.

12. back lighting devices according to any one of claim 1-7, it is characterized in that, the section shape of described heat dissipation channel at least comprises: semicircle, square, U-shaped or V-arrangement.

13. back lighting devices according to any one of claim 1-7, it is characterized in that, the inner wall surface of described heat dissipation channel is high surface roughness or low surface roughness.

14. back lighting devices according to any one of claim 1-7, it is characterized in that, the inner wall surface of described heat dissipation channel has layer of metal rete or the heat transfer coating of coating.