CN103148366A - Improved high-power LED (Light-emitting Diode) lamp - Google Patents

Abstract

The invention relates to the field of LED lamps, in particular to an improved high-power LED lamp. The lamp includes an LED light source part, a circuit board, a driving part, a conduit, a heat dissipation pipe, a thermally conductive connecting pipe, a hemispherical lampshade, and a T-accommodating shell. There is a driving part, a hemispherical lampshade is arranged above the T-accommodating shell, a circuit substrate is installed on the junction surface of the hemispherical lampshade and the T-accommodating shell, an LED light source part is installed above the circuit substrate, the circuit substrate and the T-accommodating shell There are a plurality of penetrating through-holes, and these through-holes are uniformly arranged around the LED light source part 1. A thermally conductive connecting pipe is fixed in each through-hole on the circuit board, and the conduit is inserted from the upper side of the circuit board to conduct heat. The detachable heat-dissipating pipe is inserted into the heat-conducting connecting pipe through the through hole of the T-accommodating shell. The invention effectively improves the heat dissipation effect of the LED lamp, and the heat dissipation direction is in all directions.

Description

An improved high-power LED lamp

technical field

The invention relates to the field of LED lamps, in particular to an improved high-power LED lamp.

Background technique

Today, LED lamps are widely used for their low power consumption, high luminous intensity, and less pollution. However, the heat generated by LED itself will seriously affect its luminous characteristics.

Known ways to dissipate heat from LED lamps, such as those disclosed in publication numbers CN202118551 and CN201032117, are to dissipate the heat generated by the LED through the installation of heat dissipation fins under the LED lamps. Such heat dissipation fins are located on the circuit board On the opposite side of the LED chip, the heat generated by the LED is transferred to the circuit board, heat dissipation adhesive layer, and heat dissipation fins in sequence. Due to the influence of the thermal conductivity of the material and the thermal conductivity area during the heat transfer process, the heat dissipation effect cannot be ideal.

Another known heat dissipation method for LED lamps, as disclosed in the publication number CN202327717, dissipates the heat generated by the LED chip to the outside through a reflector with a heat dissipation function. This heat dissipation method also transfers the heat generated by the LED chip to the circuit substrate first, then to the reflector, and finally the reflector dissipates the heat. Therefore, the thermal conductivity of the material and the heat conduction area during the heat transfer process cannot be avoided. effect on heat dissipation.

Contents of the invention

The invention aims at the problem that the heat dissipation effect in the prior art cannot be ideal, and provides an improved high-power LED lamp, which has excellent heat dissipation performance.

An improved high-power LED lamp, which includes an LED light source part 1, a circuit board 2, a drive part 3, a conduit 4, a heat dissipation pipe 5, a thermally conductive connecting pipe 6, a hemispherical lampshade 7, and a T-accommodating shell 8 ,in,

The drive part 3 is housed in the groove provided in the center of the horizontal part of the said T housing case 8, and the top of the T housing case 8 is provided with a hemispherical lampshade 7, between the hemispherical lampshade 7 and the T housing case 8 A circuit substrate 2 is installed on the interface surface, and the LED light source part 1 is installed above the circuit substrate 2. A plurality of through holes are opened on the circuit substrate 2 and the T-accommodating shell 8, and these through holes are along the LED light source part 1. Evenly arranged around, each through hole on the circuit substrate 2 is fixed with a thermally conductive connecting pipe 6, the conduit 4 is inserted into the thermally conductive connecting pipe 6 from the upper side of the circuit substrate 2, and the detachable heat dissipation pipe 5 passes through the T to accommodate The through-hole of the housing 8 is inserted into the heat-conducting connecting pipe 6 .

The hemispherical lampshade 7 is integrally formed with the conduit 4 .

A small hole is opened on the hemispherical lampshade 7 , and the conduit 4 is inserted into the thermally conductive connecting pipe 6 through the small hole on the hemispherical lampshade 7 .

The conduit 4 is made of a material with high light transmittance and the same refractive index as air.

The shape of the circuit board 2 is an oblate cylinder; the shape of the LED light source part 1 is an oblate cuboid; the shape of the horizontal part of the T housing case 8 is an oblate cylinder.

The angle formed by the heat dissipation pipe 5 and the T-accommodating shell 8 is between 10-45 degrees, and the diameter of the heat dissipation pipe gradually increases from one end inserted into the thermally conductive connecting pipe 6 to the other end.

Beneficial effects of the present invention: the present invention changes the traditional heat dissipation method that conducts the heat generated by the LED light source from its back to the outside through the heat dissipation fins, and proposes a new heat dissipation method that simultaneously provides heat dissipation on the front and back of the LED chip. The airflow path, thus obtaining a better heat dissipation effect, the heat dissipation direction is in all directions, which can maximize the use of external air flow. At the same time, the conduit and heat dissipation structure of the present invention are detachably connected to the LED lamp, therefore, daily cleaning and maintenance can be realized.

Description of drawings

Fig. 1 is the sectional view of the LED lamp of the embodiment of the present invention;

Fig. 2 is the top view of the LED lamp of the embodiment of the present invention;

Among them, 1-LED light source part, 2-circuit substrate, 3-drive part, 4-pipe, 5-radiating pipe, 6-thermally conductive connecting pipe, 7-hemispherical lampshade, 8-T housing shell.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

Referring to Fig. 1 and Fig. 2, the lamp includes an LED light source part 1, a circuit board 2, a drive part 3, a conduit 4, a heat dissipation pipe 5, a thermally conductive connecting pipe 6, a hemispherical lampshade 7 and a T-accommodating shell 8. The shape of the circuit board 2 is an oblate cylinder, the shape of the LED light source part 1 is an oblate cuboid, and the shape of the horizontal part of the T housing case 8 is an oblate cylinder. A driving part 3 is installed in a groove provided in the center of the horizontal part of the T housing housing 8, and the driving part 3 is used to control the lamp. A plurality of through holes are opened on the circuit board 2 and the T housing case 8 , and the through holes are uniformly arranged along the periphery of the LED light source part 1 .

Referring to Fig. 1, the circuit substrate 2 is installed on the junction surface of the hemispherical lampshade 7 and the T housing shell 8, the LED light source part 1 is installed directly below the hemispherical lampshade 7 and above the circuit substrate 2, and the position where the LED light source part 1 is installed And the purpose of adopting the hemispherical lampshade 7 is to facilitate the scattering of the light emitted by the LED light source part 1 . The conduit 4 is made of a material with high light transmittance and the same refractive index as air, and such a design is not only beneficial to light scattering but also beneficial to heat dissipation. The angle formed by the heat dissipation pipe 5 and the T-accommodating shell 8 is between 10-45 degrees, and the diameter of the heat dissipation pipe 5 gradually increases from one end inserted into the thermally conductive connecting pipe 6 to the other end. The conduit 4 and the heat dissipation pipe 5 provide airflow passages for the front and back of the LED lamp, thereby obtaining a better heat dissipation effect, and the heat dissipation is oriented in all directions, which can maximize the use of external air flow.

The present invention can effectively dissipate the heat emitted by the LED light source part 1 , especially the heat dissipation to the circuit substrate 2 is particularly remarkable. At the same time, the conduit and heat dissipation structure of the present invention are detachably connected to the LED lamp, therefore, daily cleaning and maintenance can be realized.

Claims (6)

1. improved high-power LED lamp, it is characterized in that, this light fixture comprises connecting tube (6), hemispherical lampshade (7) and the accommodating housing of T (8) of LED light source section (1), circuit substrate (2), drive division (3), conduit (4), radiating tube (5), thermal conductivity, wherein

drive division (3) is housed in the groove that the center of the horizontal component of the accommodating housing of described T (8) is offered, the accommodating housing of T (8) top is provided with hemispherical lampshade (7), on hemispherical lampshade (7) and the accommodating housing of T (8) interface, circuit substrate (2) is housed, LED light source section (1) is equipped with in circuit substrate (2) top, offer a plurality of through holes that run through on circuit substrate (2) and the accommodating housing of T (8), and these a plurality of through holes evenly arrange on every side along LED light source section (1), be fixed with the connecting tube (6) of thermal conductivity in upper each through hole of circuit substrate (2), conduit (4) is inserted the connecting tube (6) of thermal conductivity by the upside of circuit substrate (2), dismountable radiating tube (5) passes the connecting tube (6) of the through hole insertion thermal conductivity of the accommodating housing of T (8).

2. a kind of improved high-power LED lamp according to claim 1, is characterized in that, described hemispherical lampshade (7) is one-body molded with conduit (4).

3. a kind of improved high-power LED lamp according to claim 1, is characterized in that, has aperture on described hemispherical lampshade (7), and described conduit (4) inserts the connecting tube (6) of thermal conductivity by the aperture on hemispherical lampshade (7).

4. according to claim 1,2 or 3 described a kind of improved high-power LED lamps, is characterized in that, described conduit (4) adopts has high light transmittance and the material identical with the refractive index of air.

5. according to claim 1,2 or 3 described a kind of improved high-power LED lamps, is characterized in that, described circuit substrate (2) be shaped as oblate cylinder; Described LED light source section (1) is shaped as flat cuboid; The horizontal component of the accommodating housing of described T (8) be shaped as oblate cylinder.

6. a kind of improved high-power LED lamp according to claim 1, it is characterized in that, described radiating tube (5) and the accommodating housing of T (8) are angle between the 10-45 degree, and the diameter of described radiating tube (5) becomes large by an end of the connecting tube (6) of inserting thermal conductivity gradually to the other end.

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