CN204611391U - Bulb-shaped lamp and lighting device - Google Patents

Abstract

Bulb-shaped lamp of the present utility model (1) possesses enclosed globe shade (10), LED module (20a) and (20b), and pillar (40), LED module (20a) has substrate (21), and be arranged on the element line of the LED (22b) on the front of substrate (21), LED module (20b) has substrate (21), and be arranged on the element line of the LED (32) on the back side of substrate (21), pillar (40) be not positioned at the element line of LED (32) just below, and be arranged on the rear side of substrate (21), and there is the shape that width broadens to substrate (21).

Description

Bulb-shaped lamps and lighting devices

technical field

The utility model relates to a bulb-shaped lamp and a lighting device, for example, relates to a bulb-shaped lamp using a semiconductor light-emitting element and a lighting device using it.

Background technique

In recent years, semiconductor light-emitting elements such as LED (Light Emitting Diode) are expected to become new light sources for various lamps due to their high efficiency and long life, and research and development of LED lamps using LEDs as light sources is progressing.

Such an LED lamp includes a bulb-shaped LED lamp (bulb-shaped LED lamp), and in the bulb-shaped LED lamp, an LED module including a substrate and a plurality of LEDs mounted on the substrate is used. For example, Patent Document 1 discloses a conventional bulb-shaped LED lamp.

(patent documents)

Patent Document 1: Japanese Unexamined Patent Publication No. 2006-313717

Furthermore, in the conventional bulb-shaped LED lamp, a heat sink is used to dissipate heat generated in the LED, and the LED module is fixed to the heat sink. For example, in the bulb-shaped LED lamp disclosed in Patent Document 1, a metal frame that functions as a heat sink is provided between a hemispherical glove and the base, and the LED module is mounted on the metal frame. .

Therefore, in such a conventional light bulb-shaped LED lamp, the light emitted from the LED module to the heat sink side is blocked by the metal heat sink. Other lamps with full light distribution characteristics are different. That is, according to the conventional bulb-shaped LED lamp, it is difficult to realize the same wide light distribution angle as an incandescent bulb, a bulb-shaped fluorescent lamp, and the like.

Therefore, it is conceivable to adopt the same structure as that of an incandescent bulb in a bulb-shaped LED lamp. That is, a bulb-shaped LED lamp is conceivable in which the filament coil of an incandescent bulb is simply replaced with an LED module without using a heat sink. In this case, the light from the LED modules is not blocked by the heat sink.

However, an LED module used in a bulb-shaped LED lamp is generally a structure in which light is extracted from only one side of the substrate (the side on which the LED is mounted). Therefore, even if the above replacement structure is adopted, the luminous flux to the base side of the bulb-shaped LED lamp is small, and it is difficult to realize a wide light distribution angle. In this regard, another LED module that emits light toward the lamp head may be added to the back surface (surface on which no LED is mounted) of the substrate of one LED module to cope. However, in this case, since a plurality of LEDs are arranged, the temperature rise of the substrate increases, resulting in a reduction in the lifetime of the LEDs.

Utility model content

In order to solve such a problem, it is an object of this invention to provide the lightbulb-shaped lamp and illuminating device which have a wide light distribution angle and can suppress the life-span reduction of LED.

In order to solve the above problem, the utility model relates to one of the implementations of the bulb-shaped lamp, wherein, the light-transmitting spherical cover; the pillars are set to extend to the inside of the spherical cover; and the main light-emitting module and the auxiliary light-emitting module The module is arranged in the spherical cover and fixed on the support. The main light-emitting module has a substrate and a first light-emitting element group. The first light-emitting element group consists of a front surface of the substrate A plurality of first light-emitting elements, the sub-light-emitting module has the substrate and a second light-emitting element group, the second light-emitting element group is composed of a plurality of second light-emitting elements arranged on the back of the substrate, so The pillar is not located directly under the second light-emitting element group, but is arranged on the rear side of the substrate, and has a shape whose width becomes wider toward the substrate.

Furthermore, in one of the embodiments of the bulb-shaped lamp according to the present invention, it is also possible that the auxiliary light-emitting module has a plurality of the second light-emitting element groups, and the plurality of second light-emitting element groups are separated by The pillars are provided, and the pillars have a shape such that a width in an arrangement direction of the plurality of second light emitting element groups becomes wider toward the substrate.

Furthermore, in one of the embodiments of the light bulb-shaped lamp according to the present invention, the shape of the pillar may be such that the width in the arrangement direction of the plurality of second light emitting elements becomes wider toward the substrate.

Furthermore, in one of the embodiments of the bulb-shaped lamp of the present invention, it is also possible that the substrate is composed of a main substrate and a sub-substrate, and the first light-emitting element group is arranged on the front of the main substrate, The second light-emitting element group is provided on the front surface of the sub-substrate, and the main substrate and the sub-substrate are configured such that the back surfaces of the first light-emitting element group and the second light-emitting element group are not provided with each other. against each other.

Furthermore, in one of the embodiments of the bulb-shaped lamp involved in the present invention, it is also possible that the first light-emitting element group is composed of a plurality of first light-emitting elements connected in series, and the second light-emitting element group is It consists of a plurality of second light emitting elements connected in series, and the first light emitting element group and the second light emitting element group are composed of the same number of elements.

Furthermore, in one of the embodiments of the bulb-shaped lamp involved in the present invention, it is also possible that the auxiliary light-emitting module is directly installed on the support, and the heat generated in the auxiliary light-emitting module is transferred to the In addition, the main light-emitting module is indirectly installed on the pillar through the auxiliary light-emitting module, and the heat generated in the main light-emitting module is indirectly transferred to the pillar through the auxiliary light-emitting module.

Furthermore, in one of the embodiments of the bulb-shaped lamp according to the present invention, a heat conduction member may be provided between the main light-emitting module and the auxiliary light-emitting module.

Furthermore, in one embodiment of the lightbulb-shaped lamp which concerns on this invention, the said heat conduction member may be any one of a heat conductive resin, a ceramic paste, and a metal paste.

Furthermore, in one of the embodiments of the bulb-shaped lamp of the present invention, it is also possible that the auxiliary light-emitting module is glued and fixed to the support.

Furthermore, in one of the embodiments of the light bulb-shaped lamp according to the present invention, the substrate may have 50% or more of light emitted from the first light-emitting element group and the second light-emitting element group. light reflectivity.

Furthermore, in one embodiment of the light bulb-shaped lamp according to the present invention, the substrate may contain any one of Al ₂ O ₃ , MgO, SiO, and TiO ₂ as a main component.

Furthermore, in one of the embodiments of the bulb-shaped lamp according to the present invention, the surface of the pillar may have a thickness of 30 for the light emitted from the first light-emitting element group and the second light-emitting element group. % of light reflectance above.

Furthermore, in one embodiment of the lightbulb-shaped lamp concerning this invention, the said support|pillar may contain any one of Al, Cu, and Fe as a main component.

Furthermore, in one of the embodiments of the bulb-shaped lamp of the present invention, it is also possible that the main light-emitting module has at least two or more of the first light-emitting element groups, and the secondary light-emitting module has at least two Two or more second light emitting element groups.

And it is one of embodiment of the illuminating device which concerns on this invention, Comprising: The said light bulb-shaped lamp is provided.

According to the present invention, it is possible to realize a light bulb-shaped lamp and a lighting device having a wide light distribution angle and a simple structure.

Description of drawings

Fig. 1 is a side view of a light bulb-shaped lamp according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view of the bulb-shaped lamp according to the embodiment of the present invention.

Fig. 3 is a cross-sectional view of the bulb-shaped lamp according to the embodiment of the present invention.

It is a figure which shows the structure of the lightbulb-shaped lamp which concerns on the Example of this invention, (a) is a top view, (b), (c), (d), and (e) are cross-sectional views.

5 is an enlarged cross-sectional view of LEDs of the LED module of the light bulb-shaped lamp according to the embodiment of the present invention.

6A , FIG. 6B , and FIG. 6C are diagrams showing how the light distribution characteristics of the light bulb-shaped lamp according to the embodiment of the present invention change depending on the width of the pillar.

Fig. 7 is a cross-sectional view illustrating a configuration of a modified example of the light bulb-shaped lamp according to the embodiment of the present invention.

8 is a view showing a structure of a light bulb-shaped lamp according to a modified example of the embodiment of the present invention, (a) is a top view, and (b), (c), (d) and (e) are cross-sectional views.

9 is a cross-sectional view of a modified example of the light bulb-shaped lamp according to the embodiment of the present invention.

Fig. 10 is a schematic cross-sectional view of the lighting device according to the embodiment of the present invention.

Detailed ways

Hereinafter, an embodiment of the present invention will be described using the drawings. In addition, the embodiment described below shows a preferable specific example of this invention. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, steps, order of steps, etc. shown in the following embodiments are examples and do not limit the gist of the present invention. The utility model is limited only by the claims. Therefore, among the constituent elements of the following embodiments, the constituent elements not described in the independent claims showing the highest concept of the present invention are described as arbitrary constituent elements. In addition, in the drawings, the same symbols are attached to elements showing substantially the same configuration, operation, and effect.

First, the overall structure of the light bulb-shaped lamp 1 which concerns on the Example of this invention is demonstrated with reference to FIGS. 1-3.

FIG. 1 is a side view of a light bulb-shaped lamp 1 according to the present embodiment. Fig. 2 is an exploded perspective view of the light bulb-shaped lamp 1 according to this embodiment. FIG. 3 is a cross-sectional view of the light bulb-shaped lamp 1 according to this embodiment.

1 to 3 , the upper part of the drawing is the front of the light bulb-shaped lamp 1 , the lower part of the drawing is the rear of the light bulb-shaped lamp 1 , and the left and right of the drawing are the sides of the light bulb-shaped lamp 1 . Here, in this specification, "rear" refers to the direction of the cap side based on the substrate of the LED module, "front" refers to the direction on the opposite side of the cap based on the substrate of the LED module, and " The "side" means a direction parallel to the main surface of the substrate of the LED module. In addition, in FIGS. 1 and 3 , the dashed-dotted line drawn along the vertical direction of the drawing shows the lamp axis J (central axis) of the light bulb-shaped lamp 1 . The lamp axis J is an axis that becomes the center of rotation when the lightbulb-shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.

The lightbulb-shaped lamp 1 is an example of a light source for illumination, and is a lightbulb-shaped LED lamp (LED light bulb) as a substitute for a lightbulb-shaped fluorescent lamp or an incandescent bulb. The bulb-shaped lamp 1 includes a light-transmitting globe 10, LED modules 20a and 20b as light sources, a base 30 for receiving electric power from the outside of the lamp, a pillar 40, a support stand 50, a resin case 60, lead wires 70, and a lighting circuit 80. .

In the lightbulb-shaped lamp 1 , the globe 10 , the resin case 60 (first case portion 61 ), and the base 30 constitute a peripheral. the

[dome cover]

The glove 10 accommodates the LED modules 20a and 20b. The glove 10 is made of a material transparent to the light from the LED modules 20a and 20b, and is a translucent glove that transmits the light from the LED modules 20a and 20b to transmit light to the outside of the lamp. Such a glove 10 can be used as a glass bulb made of silicon-based glass (transparent bulb) transparent to visible light. In this case, the LED modules 20a and 20b housed in the glove 10 can be seen from the outside of the glove 10 .

The shape of the glove 10 is a shape in which one end is closed in a spherical shape and the other end has an opening 11 . Specifically, the shape of the glove 10 is a part of a hollow ball that is narrow while extending in a direction away from the center of the ball, and the opening 11 is formed at a position away from the center of the ball. For the glove 10 having such a shape, a glass bulb having the same shape as a general incandescent light bulb can be used. For example, an A-type, G-type, or E-type glass bulb can be used for the glove 10 .

Furthermore, the glove 10 does not necessarily have to be transparent to visible light, and the glove 10 may have a light-diffusing function. For example, a resin containing a light-diffusing material such as silica and calcium carbonate, and a white pigment may be coated on the entire inner or outer surface of the glove 10 to form a milky-white light-diffusing film. Also, the glove 10 does not necessarily need to be made of silicon-based glass. For example, a dome cover 10 made of a resin material such as acrylic can also be used.

[LED module]

The LED modules 20 a and 20 b are light-emitting modules that include LEDs (LED chips) and supply power to the LEDs via lead wires 70 to emit light. The LED modules 20a and 20b are held in the hollow of the dome cover 10 by the pillars 40 .

Preferably, the LED modules 20a and 20b are arranged at the center of the spherical shape formed by the glove 10 (for example, inside the glove 10 where the inner diameter is large). By arranging the LED modules 20a and 20b at the center of the glove 10 in this way, the light distribution characteristic of the bulb-shaped lamp 1 becomes a light distribution characteristic similar to that of a conventional ordinary incandescent light bulb using a filament coil.

In addition, the detailed configuration of the LED modules 20a and 20b will be described later.

[lamp holder]

The base 30 is a power receiving unit that receives electric power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb-shaped lamp 1 . The base 30 receives alternating current through double contacts, and the electric power received by the base 30 is input to the power input part of the lighting circuit 80 via lead wires. The base 30 is attached to a socket of a lighting fixture (illumination device), receives electric power from the socket, and lights the light bulb-shaped lamp 1 (LED modules 20 a and 20 b ).

For example, the base 30 is E-shaped, and a screwing portion for screwing with a socket of a lighting device is formed on its outer peripheral surface, and a screwing portion for screwing with the resin case 60 is formed on its inner peripheral surface. The base 30 is in the shape of a bottomed cylinder made of metal. Furthermore, as the base 30, an E26-type or E17-type base, which is a screw-type Edison screw type (E-type) base, or the like can be used. Furthermore, as the base 30, a plug-in type base can also be used.

[pillar]

The pillar 40 is a column core extending from the vicinity of the opening 11 of the glove 10 to the inside of the glove 10 , and functions as a holding member for holding the LED modules 20 a and 20 b in the glove 10 . One end of the support 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support stand 50 .

The pillar 40 also functions as a heat dissipation member for dissipating heat generated in the LED modules 20a and 20b to the base 30 side. Therefore, the strut 40 is made of a metal material with high thermal conductivity, for example, aluminum having a thermal conductivity of 237 [W/m·K], so that the heat dissipation efficiency by the strut 40 can be improved. As a result, it is possible to suppress reductions in luminous efficiency and lifetime of LEDs due to temperature rise. Furthermore, the pillar 40 may be made of resin or the like.

The strut 40 is constituted by, for example, a main shaft portion 41 and a fixing portion 42 which are integrally formed. The main shaft portion 41 is a cylindrical member with a constant cross-sectional area. One end of the main shaft part 41 is connected to the fixing part 42 , and the other end is connected to the support stand 50 . The fixing part 42 has a fixing surface for fixing the LED modules 20a and 20b, and the fixing surface is in contact with the back surface of the substrate of the LED modules 20a and 20b. The fixing part 42 further has a protrusion protruding from the fixing surface, and the protrusion is fitted into a through-hole provided in the substrate of the LED modules 20a and 20b. The LED modules 20a and 20b are bonded to the fixing surface with, for example, a resin adhesive such as silicone resin.

The fixed portion 42 of the support 40 has a larger cross-sectional area (width in the direction perpendicular to the lamp axis J) perpendicular to the lamp axis J than the main shaft portion 41 of the support 40 . Furthermore, the fixing portion 42 of the support 40 has a shape that is in line with the light bulb-shaped lamp 1 in the direction toward the front of the light bulb-shaped lamp 1, that is, in the direction from the support base 50 to the substrates of the LED modules 20a and 20b (approaching direction). The area of the cross section perpendicular to the axis J becomes larger. In other words, the fixing portion 42 of the pillar 40 has a shape such that, in the direction toward the front of the light bulb-shaped lamp 1, the arrangement direction of the element rows of the LEDs of the LED modules 20a and 20b and the arrangement direction of the LEDs in the element rows The upper width becomes wider. Therefore, the pillar 40 has the largest cross-sectional area perpendicular to the lamp axis J on the fixing surface of the fixing portion 42 that contacts the substrates of the LED modules 20a and 20b. Thereby, the heat dissipation path from the LED module 20b to the support|pillar 40 can be widened, and the halation of the light of the LED module 20b by the support|support 40 can be suppressed.

Furthermore, it is preferable to surface-treat the fixing surface of the fixing part 42 of the support|pillar 40 so that the light of the LED of the LED module 20b may be reflected. Thereby, the light of the LED module 20b toward the base 30 can be reflected on the fixing surface, and can be extracted as the light of the LED module 20b.

[support stand]

The support stand (support plate) 50 is a support member for supporting the pillar 40 and is fixed to the resin case 60 . The support stand 50 is connected to the opening end of the opening 11 of the glove 10 and is configured to close the opening 11 of the glove 10 . Specifically, the support stand 50 is constituted by a disk-shaped member having a stepped portion on the edge, and the stepped portion is in contact with the opening end of the opening portion 11 of the glove 10 . Furthermore, at the stepped portion, the support base 50, the resin case 60, and the opening end of the opening 11 of the glove 10 are adhered with an adhesive.

The support base 50 is made of a metal material with high thermal conductivity such as aluminum, similarly to the support base 40 , so that the heat radiation efficiency of the LED modules 20 a and 20 b that conducts heat through the support base 50 to the support base 40 is improved. As a result, it is possible to further suppress reductions in luminous efficiency and lifetime of LEDs due to temperature rise.

[resin case]

The resin case 60 is an insulating case (circuit holder) for insulating the support 40 and the base 30 and housing the lighting circuit 80, and consists of a large-diameter cylindrical first case portion 61 and a small-diameter cylindrical second case Body 62 constitutes. The resin case 60 can be formed of, for example, polybutylene terephthalate (PBT).

Since the outer surface of the first case portion 61 is exposed to the outside air, the heat conducted to the resin case 60 is mainly dissipated from the first case portion 61 . The second case portion 62 is configured such that its outer peripheral surface is in contact with the inner peripheral surface of the cap 30 , and a screwing portion for screwing into the cap 30 is formed on the outer peripheral surface of the second case portion 62 .

[lead]

The two lead wires 70 are a pair of lead wires for supplying electric power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b, and can be composed of wire-shaped metal wires such as copper wires. Each lead wire 70 is arranged in the spherical cover 10, one end is electrically connected to the external terminals of the LED modules 20a and 20b, and the other end is electrically connected to the power output part of the lighting circuit 80, in other words, the other end is electrically connected to the lamp base 30. . A part of the lead wire 70 is connected to the external terminal of the LED modules 20a and 20b, and also functions as a support part for supporting the LED modules 20a and 20b.

The two lead wires 70 are, for example, polyethylene resin wires composed of a metal core wire and an insulating resin covering the core wire, and are electrically connected to the LED modules 20 a and 20 b through the core wire not covered by the insulating resin but exposed on the surface. In this case, the core wires do not need to be covered with the insulating resin at the portions of the two lead wires 70 protruding from the front surface of the substrate 21 and the portions protruding 3 mm or less from the rear surface of the substrate 21 .

Moreover, the connection relationship with the LED modules 20a and 20b of the lead wire 70 is demonstrated in detail later.

[lighting circuit]

The lighting circuit 80 is a circuit unit for lighting the LEDs of the LED modules 20a and 20b, and has a plurality of circuit elements and a circuit board on which the respective circuit elements are mounted. The lighting circuit 80 includes a circuit for converting the AC power fed from the base 30 into a DC power, and supplies the converted DC power to the LEDs of the LED modules 20 a and 20 b through the two lead wires 70 .

Furthermore, the light bulb-shaped lamp 1 does not necessarily need to include the lighting circuit 80 . For example, when a direct current is directly supplied to the light bulb-shaped lamp 1 from a lighting fixture or a battery, the light bulb-shaped lamp 1 may not be provided with the lighting circuit 80. Furthermore, the lighting circuit 80 is not limited to a smoothing circuit, and may be configured by appropriately selecting and combining a dimming circuit, a booster circuit, and the like.

Next, the detailed structure of the LED modules 20a and 20b, and the connection relationship of the LED modules 20a and 20b and the lead wire 70 are demonstrated using FIG.4 and FIG.5.

FIG. 4 is a diagram showing the structure of the light bulb-shaped lamp 1 according to the present embodiment. FIG. 5 is an enlarged cross-sectional view of LEDs of the LED modules 20 a and 20 b of the light bulb-shaped lamp 1 according to the present embodiment.

Moreover, (a) of FIG. 4 is a plan view when the LED module 20a of the state which removed the globe 10 of the lightbulb-shaped lamp 1 was seen from above. 4(b) is a cross-sectional view of the light bulb-shaped lamp 1 cut along the AA' line of (a), and FIG. 4(c) is cut along the BB' line of (a). The cross-sectional view of the bulb-shaped lamp 1, Fig. 4(d) is a cross-sectional view of the bulb-shaped lamp 1 cut along the line CC' of (a), and Fig. 4(e) is a cross-sectional view along (a) ) is a cross-sectional view of the bulb-shaped lamp 1 cut by the DD' line.

The LED module 20a is an example of a main light emitting module (first light emitting module), and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the front surface (one main surface) of the substrate 21 . On the other hand, the LED module 20b is an example of a sub light emitting module (second light emitting module), and has a COB structure in which a bare chip is directly mounted on the back surface (the other main surface) of the substrate 21 .

The LED module 20a includes a substrate 21, a plurality of LEDs 22a and 22b provided on the front surface of the substrate 21, sealing members 23a and 23b, metal wirings 24 and 26, wiring 25, a conductive adhesive member 27, and terminals (external terminals). 28. On the other hand, the LED module 20 b includes a substrate 21 , a plurality of LEDs 32 provided on the back surface of the substrate 21 , a sealing member 33 , metal wirings 34 and 36 , wires 35 , a conductive adhesive member 37 , and terminals 38 .

[substrate]

As the substrate 21 , a translucent substrate or a non-translucent substrate can be used, for example, a ceramic substrate made of alumina or aluminum nitride, a metal substrate, a resin substrate, a glass substrate, or a flexible substrate. The board|substrate 21 is a rectangular mounting board|substrate (substrate for LED mounting) for mounting LED22a, 22b, and 32. For the substrate 21 , if L1 is the length of the long side, L2 is the length of the short side, and d is the thickness, L1 = 26 mm, L2 = 13 mm, and d = 1 mm, for example.

Preferably, the substrate 21 is made of a white substrate such as a white alumina substrate or a metal substrate with low light transmittance to light emitted from the LEDs 22a, 22b, and 32, for example, 10% or less. For example, the substrate 21 may be composed of a substrate having a light reflectance of 50% or more for light emitted from the LEDs 22a, 22b, and 32 and containing any of Al ₂ O ₃ , MgO, SiO, and TiO ₂ as a main component. When the light transmittance of the substrate 21 is high, in the LED module 20a, part of the light of the LEDs 22a and 22b on the front side of the substrate 21 passes through the substrate 21 and then is emitted from the rear side of the substrate 21. Similarly, in the LED module 20b, after a part of light of the LED32 on the back side of the board|substrate 21 passes through the board|substrate 21, it emits from the front side of the board|substrate 21. Therefore, in the lightbulb-shaped lamp 1 , color unevenness occurs with respect to light extracted from the base side and the side opposite thereto. In contrast, such color unevenness can be suppressed by reducing the light transmittance of the substrate 21 . In addition, since an inexpensive white substrate can be used, it is possible to reduce the cost of the light bulb-shaped lamp 1 .

Two through-holes 21 b penetrating from the front to the back of the substrate 21 are provided at both ends in the longitudinal direction of the substrate 21 . These two through-holes 21b constitute the terminals 28 and 38 for connecting the lead wire 70 for power supply to the LED modules 20a and 20b, and the lead wire 70 is inserted through each of the two through-holes 21b.

One through-hole 21 a penetrating from the front surface to the rear surface of the substrate 21 is provided in the central portion of the substrate 21 . The through-hole 21a is used to fix the LED modules 20a and 20b to the support 40, and the protrusion 42b of the support 40 is fitted into the through-hole 21a.

Moreover, even without the through-hole 21a, the LED modules 20a and 20b can be fixed to the support|pillar 40 with an adhesive. Therefore, the through-hole 21a may not be provided.

[LED]

A plurality of LED22a and 22b are respectively mounted on the front surface of the board|substrate 21. As shown in FIG. A plurality of LEDs 22a are arranged in an element row formed by being arranged linearly at the same pitch in the long side direction of the substrate 21. Arrange multiple lines above. On the other hand, a plurality of LEDs 22b are arranged in a row of elements arranged linearly at the same pitch in the long side direction of the substrate 21, and in the short side direction of the substrate 21, that is, in the arrangement of the LEDs 22b in the row of elements of the LEDs 22b. A plurality of strips are arranged in a direction perpendicular to the direction. At this time, some element rows of LED22b are arrange|positioned so that it may be located between two element rows of LED22a in the short side direction of the board|substrate 21.

The some LED22a is connected in series in an element row, and is connected in parallel among element rows. Similarly, some LED22b is also connected in series in an element row, and is connected in parallel among element rows. Furthermore, the element row of LED22a and the element row of LED22b are also connected in parallel. The element row of this LED22b is an example of a 1st light emitting element group, and the element row of LED22a is an example of a 1st light emitting element group. For example, some LED22a and 22b are arrange|positioned so that the space|interval (pitch) of adjacent LED in an element row may be 1.8 mm. Moreover, the distance between adjacent LEDs is arranged to be, for example, 4mm in the element row of the adjacent LED22a and the element row of the LED22b.

Similarly, a plurality of LED32 are mounted on the back surface of the board|substrate 21. As shown in FIG. A plurality of LED32 is arranged in the long side direction of the board|substrate 21, the element row which is arranged in a linear form at the same pitch, and the short side direction of the board|substrate 21, ie, the direction orthogonal to the arrangement direction of LED32 in the element row of LED32. Arrange multiple lines in the direction. A plurality of LED32 is connected in series in the element row, and is connected in parallel between the element rows. The element row of this LED32 is an example of a 2nd light emitting element group.

LED22a is arrange|positioned so that it may oppose LED32 via the board|substrate 21. As shown in FIG. For example, it is arrange|positioned so that the whole surface of the lower surface which contacts the board|substrate 21 of LED22a, and the whole surface of the bottom surface which contacts the board|substrate 21 of LED32 are arrange|positioned. In this case, as shown in FIG.4(c), the whole LED22a exists in the area|region F above LED32, and the whole LED32 exists in the area|region E below LED22a. Therefore, LED22a is arrange|positioned so that it may oppose the sealing member 33 via the board|substrate 21 and LED32, and LED32 may be arrange|positioned so that it may oppose the sealing member 23a via the board|substrate 21 and LED22a.

LED22b is arrange|positioned so that it may oppose the fixing surface of the fixing part 42 of the support|pillar 40 via the board|substrate 21. As shown in FIG. For example, it arrange|positions so that the whole surface of the lower surface which contacts the board|substrate 21 of LED22b and the fixing surface of the fixing part 42 of the support|pillar 40 may oppose. In this case, as shown in FIG.4(c), the whole LED22b exists in the region X above the fixing surface of the fixing part 42 of the support|pillar 40. As shown in FIG.

The LEDs 22a, 22b, and 32 are bare chips that emit monochromatic visible light in all directions, that is, laterally, upwardly, and downwardly. LED22a, 22b, and 32 emit light of 20% of total light quantity to the side, emit light of 60% of total light quantity upward, and emit light of 20% of total light quantity downward, for example.

The LEDs 22a, 22b, and 32 are, for example, rectangular (square) blue LED chips that have a length of about 0.35 mm (350 μm) on one side and emit blue light when energized. For the blue LED chip, for example, a gallium nitride-based semiconductor light emitting element having a center wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.

As shown in FIG. 5, LED22a, 22b, and 32 have the sapphire substrate 122a, and the several nitride semiconductor layer 122b which consists of mutually different compositions laminated|stacked on the sapphire substrate 122a.

A cathode electrode 122c and an anode electrode 122d are provided at both ends of the upper surface of the nitride semiconductor layer 122b. Furthermore, a wire bonding portion 122e is provided on the cathode electrode 122c, and a wire bonding portion 122f is provided on the anode electrode 122d. For example, among adjacent LEDs 22a, the cathode electrode 122c of one LED 22a and the anode electrode 122d of the other LED 22a are connected by the wire 25 via the wire bonding portions 122e and 122f.

LED22a, 22b, and 32 are fixed to the board|substrate 21 by the translucent die-bonding material 122g so that the surface by the side of the sapphire board|substrate 122a may oppose the front or back of the board|substrate 21. For the die-bonding material 122g, a silicone resin or the like containing a filler made of oxidized metal can be used. By using a light-transmitting material for 122 g of die-bonding materials, the loss of the light emitted from the side surface of LED22a can be reduced, and generation|occurrence|production of the shadow by 122 g of die-bonding materials can be suppressed.

[Seal Parts]

The sealing member 23a is a conversion member which converts the wavelength of the light which LED22a emits, and is formed so that LED22a may be covered. The sealing member 23a is sealing resin which consists of the wavelength conversion material which converts the wavelength of the light which LED22a emits, and the resin material containing a wavelength conversion material. As the wavelength conversion material, phosphor particles that are excited by the light emitted by the LED 22a to emit light of a desired color (wavelength) can be used, or phosphor particles that absorb a certain wavelength including semiconductors, metal complexes, organic dyes, and pigments can be used. A material that emits light of a different wavelength than the light absorbed. Furthermore, in the sealing member 23a, you may disperse|distribute light-diffusion materials, such as a silica particle.

For such fluorescent substance particles, when LED22a is a blue LED which emits blue light, in order to emit white light from the sealing member 23a, the fluorescent substance particle which converts the wavelength of blue light into yellow light is used. For example, as phosphor particles, YAG (yttrium aluminum garnet)-based yellow phosphor particles can be used. Accordingly, part of the blue light emitted by the LED 22a is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing member 23a. And, the blue light that is not absorbed by the yellow phosphor particles (not converted in wavelength) and the yellow light after the wavelength conversion by the yellow phosphor particles are diffused and mixed in the sealing member 23a to become white light, which is transmitted from the sealing member 23a. shoot out. Moreover, for phosphor particles, green phosphor particles, red phosphor particles, etc. can also be used in addition to yellow phosphor particles. A combination of phosphor particles of each color emitting light in three primary colors (red, green, blue).

On the other hand, as the resin material containing phosphor particles, transparent resin materials such as silicone resins, organic materials such as fluororesins, and inorganic materials such as low-melting glass and sol-gel glass can be used.

The sealing member 23a of the said structure is formed linearly along the arrangement direction of some LED22a which comprises an element row, and seals the element row of LED22a collectively. Meanwhile, a plurality of sealing members 23a are formed along the arrangement direction of the element rows, and individually seal different element rows. Each sealing member 23a has, for example, a length of 24 mm, a line width of 1.6 mm, and a maximum center height of 0.7 mm.

Similarly, the sealing member 23b is a conversion member which converts the wavelength of the light which LED22b emits, and is formed so that LED22b may be covered. The sealing member 23b is sealing resin which consists of the wavelength conversion material which converts the wavelength of the light which LED22b emits, and the resin material containing a wavelength conversion material. For the wavelength conversion material, phosphor particles that are excited by the light emitted by the LED 22b to emit light of a desired color (wavelength) can be used, or a material that absorbs a certain wavelength including semiconductors, metal complexes, organic dyes, and pigments can be used. A material that emits light of a different wavelength than the light absorbed.

The sealing member 23b is formed linearly along the arrangement direction of some LED22b which comprises an element row, and seals the element row of LED22b collectively. Meanwhile, a plurality of sealing members 23b are formed along the arrangement direction of the element rows, and individually seal different element rows. At this time, the plurality of sealing members 23b are formed so as to be located between two sealing members 23a in the short-side direction of the substrate 21 .

Similarly, the sealing member 33 is a conversion member which converts the wavelength of the light which LED32 emits, and is formed so that LED32 may be covered. The sealing member 33 is a sealing resin made of a wavelength conversion material that converts the wavelength of light emitted by the LED 32 and a resin material containing the wavelength conversion material. For the wavelength conversion material, phosphor particles that are excited by the light emitted by the LED 32 to emit light of a desired color (wavelength) can also be used to absorb a certain wavelength including semiconductors, metal complexes, organic dyes, and pigments. A material that emits light of a different wavelength than the light absorbed.

The sealing member 33 is formed linearly along the arrangement direction of the plurality of LEDs 32 constituting the element row, and seals the element row of the LED 32 collectively. At the same time, a plurality of sealing members 33 are formed along the arrangement direction of the element rows, and individually seal different element rows.

Furthermore, the sealing members 23a, 23b, and 33 may be formed so as not to seal a plurality of LEDs collectively, but to individually seal each of the LEDs 22a, 22b, and 32. In this case, each sealing member 23a, 23b, and 33 may be formed in a substantially hemispherical shape.

[metal wiring, terminal]

In order to electrically connect the element rows of LED22a and 22b to the terminal 28 in parallel, two metal wirings 26 are formed in an island shape in a predetermined shape at both ends of the substrate 21 . Such two metal wirings 26 are formed on the front surface of the board|substrate 21 so that the element row which sandwiches some LED22a and 22b may be formed.

The metal wiring 26 protrudes toward the element row at the part adjacent to the element row of LED22a and 22b on the front surface of the board|substrate 21. As shown in FIG. The protrusion part of this metal wiring 26 becomes a connection part with the wiring 25 from LED22a and 22b.

Similarly, in order to electrically connect the element rows of LED32 and 22b to the terminal 38 in parallel, two metal wirings 36 are formed in an island shape in a predetermined shape at both ends of the substrate 21 . Such two metal wirings 36 are formed on the back surface of the substrate 21 so as to sandwich an element row of a plurality of LEDs 32 .

The metal wiring 36 protrudes toward the element row in the part adjacent to the element row of LED32 on the back surface of the board|substrate 21. As shown in FIG. The protrusion part of this metal wiring 36 becomes a connection part with the wiring 35 from LED32.

The terminal 28 is a power supply electrode for providing the conductive adhesive member 27, for example, a solder electrode for soldering, and is attached to the substrate 21 in a manner to surround the through hole 21b and the opening on the front side of the substrate 21 surrounding the through hole 21b. The front surface is formed with connection pads of a predetermined shape. Two terminals 28 are formed corresponding to the two metal wirings 26 . The pair of terminals 28 are respectively integrally formed with the corresponding metal wiring 26 , and are connected in contact with the corresponding metal wiring 26 . A set of corresponding metal wirings 26 and terminals 28 constitutes one wiring pattern.

The terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a to make the LEDs 22a and 22b emit light, and supplies the received power to the LEDs 22a and 22b via the metal wirings 26 and 24 and the wiring 25 . Terminals 28 and 38 are arranged approximately concentrically.

Similarly, the terminal 38 is a power supply electrode for providing the conductive adhesive member 37, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 surrounding the through hole 21b. The connections are made with solder pads. Two terminals 38 are formed corresponding to the two metal wirings 36 , respectively. The pair of terminals 38 are respectively integrally formed with the corresponding metal wiring 36 , and are connected to the corresponding metal wiring 36 in contact. A set of corresponding metal wirings 36 and terminals 38 constitutes one wiring pattern.

The terminal 38 is a power supply unit of the LED module 20b, receives power from the outside of the LED module 20b in order to make the LED 32 emit light, and supplies the received power to each LED 32 via the metal wirings 36 and 34 and the wiring 35 .

A plurality of metal wirings 24 are formed in a predetermined shape on the front surface of the substrate 21 in order to electrically connect a plurality of LEDs 22 a and 22 b in series. Such a plurality of metal wirings 24 are formed in an island shape between adjacent LEDs 22 a and 22 b in the element row on the front surface of the substrate 21 .

Similarly, a plurality of metal wirings 34 are formed in a predetermined shape on the back surface of the substrate 21 in order to electrically connect a plurality of LEDs 32 to each other in series. Such a plurality of metal wirings 34 are formed in an island shape between adjacent LEDs 32 in the element row on the back surface of the substrate 21 .

The metal wirings 26 and 24 and the terminal 28 of the above-described structure are simultaneously patterned from the same metal material. As the metal material, for example, silver (Ag), tungsten (W), copper (Cu) or the like can be used. Furthermore, gold plating of nickel (Ni)/gold (Au) or the like may be performed on the surfaces of the metal wirings 26 and 24 and the terminals 28 . Furthermore, the metal wirings 26 and 24 and the terminal 28 may be made of different metal materials, or may be formed through different processes.

Likewise, the metal wirings 36 and 34 and the terminal 38 are simultaneously patterned from the same metal material.

[wiring]

The wiring 25 is an electric wire for connecting LED22a and 22b and the metal wiring 26, or LED22a and 22b and the metal wiring 24, for example, is a gold wire. As shown in FIG. 5, each of the wire bonding portions 122e and 122f provided on the upper surfaces of the LEDs 22a and 22b is wire bonded to the metal wiring 26 or the metal wiring 24 formed adjacent to both sides of the LEDs 22a and 22b through the wire 25. .

The wiring 25 is entirely embedded in the sealing members 23a and 23b, for example, so as not to be exposed from the sealing members 23a and 23b.

Likewise, the wire 35 is an electric wire for connecting the LED 32 and the metal wiring 36 or the LED 32 and the metal wiring 34 . As illustrated in FIG. 5 , each of the wire bonding portions 122 e and 122 f provided on the upper surface of the LED 32 is wire-bonded to the metal wiring 36 or the metal wiring 34 formed adjacent to both sides of the LED 32 by the wire 35 .

The wiring 35 is, for example, entirely embedded in the sealing member 33 so as not to protrude from the sealing member 33 .

[conductive parts]

The conductive adhesive member 27 is a conductive adhesive such as solder or silver paste that connects the terminal 28 and the lead wire 70 . The conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28 . The conductive adhesive member 27 is provided so as to close the opening of the through-hole 21 b on the front side of the substrate 21 .

Similarly, the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 and the lead wire 70 . The conductive adhesive member 37 is provided so as to be in contact with both the terminal 38 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 38 . The conductive adhesive member 37 is provided so as to close the opening of the through-hole 21 b on the back side of the substrate 21 .

Here, the conductive adhesive member 27 may be covered with an insulating resin. Moreover, this insulating resin may be white resin whose light transmittance with respect to the light emitted from LED22a, 22b, and 32 is low, for example, 10% or less.

After the components other than the conductive adhesive members 27 and 37 are provided on the front and back surfaces of the substrate 21, the two lead wires 70 are connected to the terminal 38 through the conductive adhesive member 27, and the conductive adhesive member 37 is used to connect the two leads 70 to the terminal 38. Two leads 70 are connected to terminals 28 to form LED modules 20a and 20b of FIG. 4 . At this time, for electrical connection between the lead wire 70 and the terminal 38 , first, the lead wire 70 is provided so as to be inserted from the opening on the rear side of the through hole 21b and protrude from the opening on the front side of the through hole 21b. Then, the conductive adhesive member 37 is provided so as to be in contact with both the rear side portion of the lead 70 and the terminal 38 , and the conductive adhesive member 27 is provided so as to be in contact with both the front side portion and the terminal 28 . Therefore, the terminal 28 and the terminal 38 are connected by the lead wire 70 . Furthermore, the same lead wire 70 is connected to the terminals 28 and 38, and the plurality of LEDs 22a and 22b on the front surface of the substrate 21 and the plurality of LEDs 32 on the rear surface of the substrate 21 are connected to the lead wire 70 in parallel. That is, the LED module 20a and the LED module 20b are electrically connected in parallel via a pair of lead wires 70 .

In addition, in the LED module 20a of FIG. 4, the current supplied to the lead wire 70 on the positive side of one side passes through the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LEDs 22a and 22b, and the metal wiring 24, and flows from the other side. The negative side of the lead 70 output. Similarly, in the LED module 20b, the current supplied to the lead 70 on the positive side passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32, and the metal wiring 34, and is output from the lead 70 on the other negative side. .

In addition, in the LED module 20b of FIG. 4 , in order to make the back surface of the substrate 21 contact the fixing surface of the fixing portion 42 of the pillar 40, the LED 32 and the sealing member 33 etc. are not provided on the part that contacts the fixing surface of the back surface of the substrate 21. various parts. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided so as to sandwich the fixing portion 42, and the spacing between the element rows sandwiching the fixing portion 42 of the pillar 40 is larger than that of other element rows.

Moreover, in the LED modules 20a and 20b of FIG. 4, the electroconductive adhesive members 27 and 37 are provided separately via the space in the through-hole 21b. However, since some LED22a, 22b, and 32 are connected in parallel with respect to the lead wire 70, even if electroconductive adhesive member 27 and 37 contact, there is no problem in particular. Therefore, the conductive adhesive members 27 and 37 may not be different members, but may be integrally provided as one adhesive member. That is, one conductive member may be continuously provided in the through hole 21b, on the front surface of the substrate 21, and on the rear surface of the substrate 21 so as to be in contact with the terminals 28 and 38 and the lead wire 70.

In addition, in the LED module 20 a of FIG. 4 , the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27 , but it may be completely covered by the conductive adhesive member 27 . In this case, since the contact area of the lead wire 70 and the conductive adhesive member 27 increases, the connection between the two can be strengthened.

As described above, the lightbulb-shaped lamp 1 of the present embodiment includes: the glove 10 ; the pillar 40 provided to extend into the glove 10 ; and the LED modules 20 a and 20 b arranged in the glove 10 and fixed. In strut 40. Furthermore, the LED module 20a has a substrate 21 and an element row of LED22b provided on the front surface of the substrate 21, and the LED module 20b has the substrate 21 and an element row of LED32 provided on the back surface of the substrate 21. Moreover, the pillar 40 is not located directly under the element row of LED32 (G in FIG.

Moreover, in the lightbulb-shaped lamp 1 of this Example, the element row|line of LED22a consists of some LED22a connected in series, and the element row of LED22b consists of some LED22b connected in series. And the element row of LED32 is comprised from the several LED32 connected in series. And the element row of LED22a, the element row of LED22b, and the element row of LED32 are comprised with the LED of the same number.

In addition, in the lightbulb-shaped lamp 1 of this embodiment, the surface of the pillar 40 has a light reflectance of 30% or more with respect to the light emitted from the element rows of LED22a and 22b and the element row of LED32. Furthermore, the pillar 40 has any one of Al, Cu, and Fe as a main component.

Moreover, in the lightbulb-shaped lamp of this Example, the LED module 20a has the element row of several LED22a, and the element row of some LED22b, and the LED module 20b has the element row of some LED32.

Accordingly, since the lightbulb-shaped lamp 1 emits light from both surfaces of the substrate 21, light is extracted from the front and rear of the lightbulb-shaped lamp 1, and the lightbulb-shaped lamp 1 having a wide light distribution angle can be realized.

Moreover, the support|pillar 40 has the shape whose width becomes wide near LED modules 20a and 20b. Therefore, the heat generated in the LED modules 20a and 20b can be efficiently dissipated to the wide support 40, and it is possible to suppress the reduction in the lifetime of the LEDs.

Moreover, the support|pillar 40 has the shape whose width becomes narrow as it distances from LED modules 20a and 20b. Therefore, it is possible to suppress halation of light from the LED modules 20a and 20b due to the pillars 40, and it is possible to suppress a decrease in light extraction efficiency.

Moreover, in the lightbulb-shaped lamp 1 of this Example, the LED module 20b has the element row of several LED22b, and the element row of some LED22b is provided via the support|pillar 40. As shown in FIG. And the pillar 40 has the shape in which the width|variety of the array direction of the element row of several LED22b becomes wide toward the board|substrate 21. As shown in FIG. Therefore, by providing a narrow region in the pillar 40 , it is possible to suppress halation of the light from the LED module 20 b due to the pillar 40 , and it is possible to suppress a decrease in light extraction efficiency. For example, when the width of the pillar 40 in the arrangement direction of the element row of a plurality of LED22b is large (FIG. 6A), most of the light from the sealing member 33 at the center of the arrangement direction of the LED22b in the element row is caused by the pillar. 40 occlusion, only light within a narrow range of angle A of FIG. 6A can be extracted. However, when the width of the pillar 40 in the arrangement direction of the element rows of a plurality of LED22b is small (FIG. 6B), the light from the sealing member 33 in the center of the arrangement direction of the LED22b in the element row can be extracted as shown in FIG. 6B. light over a wide range of angles B. That is, in the case of FIG. 6B , compared with FIG. 6A , vignetting due to the pillar 40 can be suppressed. As a result, the width|variety of the support|pillar 40 of the arrangement direction of the element row of several LED22b becomes small, and it becomes possible to extract light of a wide range. 6A, 6B, and 6C are plan views when the LED module 20b of the light bulb-shaped lamp 1 is seen from below.

Moreover, in the lightbulb-shaped lamp 1 of this Example, the support|pillar 40 has the shape in which the width|variety of the arrangement direction of some LED22b of the element row of LED22b becomes wide toward the board|substrate 21. Therefore, by providing a narrow region in the pillar 40 , it is possible to suppress halation of the light from the LED module 20 b due to the pillar 40 , and it is possible to suppress a decrease in light extraction efficiency. For example, when the width of the pillar 40 in the arrangement direction of the LED22b in the element row is large (FIG. 6B), most of the light from the sealing member 33 at the center of the arrangement direction of the LED22b in the element row is emitted by the pillar 40. With shading, only light within a relatively narrow range of angle B in FIG. 6B can be extracted. However, when the width of the pillar 40 in the arrangement direction of the LED22b in the element row is small (FIG. 6C), the light from the sealing member 33 in the center of the arrangement direction of the LED22b in the element row can be extracted as shown in FIG. 6C. Light in the range of angle C. Therefore, in the case of FIG. 6C , compared with FIG. 6B , vignetting due to the pillar 40 can be suppressed. As a result, the width|variety of the support|pillar 40 of the arrangement direction of LED22b in an element row becomes small, and it becomes possible to extract light of a wide range.

In addition, in the lightbulb-shaped lamp 1 of the present embodiment, the LED module 20a further includes an element row of LED22a provided on the front surface of the substrate 21, and the LED22a is arranged to face the LED32 with the substrate 21 interposed therebetween. Accordingly, the light of the LED 32 emitted from the front of the substrate 21 after passing through the substrate 21 is reflected or absorbed by the LED 22a facing the LED 32 to be shielded, and is not emitted as light of the LED module 20a. Similarly, the light of LED 22a emitted from the back surface of substrate 21 after passing through substrate 21 is reflected or absorbed by LED 32 facing LED 22a to be shielded, and is not emitted as light of LED module 20b. Therefore, color unevenness can be suppressed about the light emitted in all directions by the LED modules 20a and 20b.

In addition, in the lightbulb-shaped lamp 1 of this embodiment, the power supply to the LED modules 20a and 20b is simply to connect the lead wire 70 to both of the two terminals 28 and 38 through the through hole 21b through the conductive adhesive members 27 and 37. to fulfill. Therefore, compared with the structure of connecting one of the terminals 28 and 38 to the lead wire 70 and connecting the terminal 28 to the terminal 38 through a via hole, etc., no via hole or the like is required to connect the terminal 28 to the terminal 38 . In addition, the number of lead wires 70 can be reduced to half compared to the configuration in which the terminals 28 and 38 are connected to different lead wires 70 . As a result, the light bulb-shaped lamp 1 with a simple structure can be realized.

Moreover, in the lightbulb-shaped lamp 1 of this Example, the board|substrate 21 has the light reflectance of 50% or more with respect to the light emitted from the element row of LED22a and 22b, and the element row of LED32. Furthermore, the substrate 21 contains any one of Al ₂ O ₃ , MgO, SiO, and TiO ₂ as a main component. Thereby, the light transmittance of the board|substrate 21 can be reduced and the color unevenness of the light emitted from the LED modules 20a and 20b can be suppressed. In addition, it is possible to reduce the cost of the light bulb-shaped lamp 1 by using a low-cost white substrate for the substrate 21 .

Furthermore, in the lightbulb-shaped lamp 1 of this embodiment, the back surface of the substrate 21 is bonded and fixed to the support 40 so as to be in contact with the support 40 , and the LED modules 20 a and 20 b are directly fixed to the support 40 . Accordingly, the heat dissipation efficiency of the substrate 21 can be improved. As a result, the fall of the luminous efficiency and lifetime of LED22a, 22b, and 32 by temperature rise can be suppressed.

Moreover, in the lightbulb-shaped lamp 1 of this Example, LED22b is mounted in the LED module 20a so that all the LEDs of the element row of LED22b may face the fixing surface of the fixing part 42 of the support|pillar 40. However, LED22b may be mounted so that only some LEDs of the element row of LED22b may face the fixing surface of the fixing part 42 of the support|pillar 40. As shown in FIG.

In addition, in the lightbulb-shaped lamp 1 of this embodiment, the shape of the pillar 40 is a tapered shape in which the width of the array direction of the LED elements of the LED modules 20a and 20b gradually becomes wider toward the substrate 21, but it may also be in the form of a A shape that widens stepwise.

Furthermore, in the lightbulb-shaped lamp 1 of this embodiment, the fixing part 42 of the support|pillar 40 has the shape whose width becomes wider toward the board|substrate 21. As shown in FIG. However, if the pillar 40 as a whole has a shape in which the width of the array direction of the LEDs of the LED modules 20 a and 20 b increases toward the substrate 21 , it is not limited thereto. In other words, the pillar 40 may have a shape in which the width of the pillar 40 in the arrangement direction of the LED element rows of the LED modules 20a and 20b becomes the largest at the portion in contact with the LED modules 20a and 20b. For example, the fixed portion 42 of the support 40 may have a constant width in the array direction of the LED elements of the LED modules 20 a and 20 b toward the substrate 21 , and the main shaft portion 41 of the support 40 may have a shape that becomes wider toward the substrate 21 . In addition, both the main shaft portion 41 and the fixing portion 42 of the pillar 40 may have a shape whose width becomes wider toward the base plate 21 . In addition, as shown in FIG. 7 , the fixed portion 42 of the pillar 40 and the width of the array direction of the LED elements of the LED modules 20 a and 20 b of the main shaft portion 41 are constant toward the substrate 21, and the maximum width of the fixed portion 42 may be larger than The maximum width of the main shaft portion 41 is large.

(Modification)

In the bulb-shaped lamp 1 of the above-described embodiment, a light source and wiring for making it emit light are provided on the front and back sides of a substrate 21, thereby forming two LED modules 20a and 20b, and the light is extracted to the side of the bulb-shaped lamp 1. The side of the lamp head and the side opposite to it. However, the light source and the wiring for making it emit light are provided on the front surfaces of two different substrates, and the back surfaces of the two substrates are bonded together to form one substrate 21, so that light can also be extracted to the base side of the bulb-shaped lamp and vice versa. side. Therefore, the difference between the bulb-shaped lamp 1 according to this modified example and the bulb-shaped lamp 1 of the above-mentioned embodiment is that the substrate 21 of the LED module is equipped with a light source and wiring for making it emit light on the front, and the two substrates are made of an adhesive. Glue to form. Hereinafter, it demonstrates in detail centering on the point which differs from the lightbulb-shaped lamp 1 of the said Example.

FIG. 8 is a diagram illustrating a structure of a light bulb-shaped lamp according to a modified example of the embodiment of the present invention.

8( a ) is a plan view of the LED module 120 a seen from above in a state in which the glove 10 is removed in the lightbulb-shaped lamp according to this modification. 8(b) is a sectional view of the bulb-shaped lamp cut along the AA' line of (a), and FIG. 8(c) is cut along the BB' line of (a). The cross-sectional view of the bulb-shaped lamp, FIG. 8( d ) is a cross-sectional view of the bulb-shaped lamp cut along the line CC' of (a), and FIG. 8( e ) is a cross-sectional view along the line D of (a). A cross-sectional view of the bulb-shaped lamp cut by the line D'.

The LED module 120a is an example of a main light emitting module (first light emitting module), and has a COB structure in which bare chips are directly mounted on the front surface (one main surface) of the substrate 29 . On the other hand, the LED module 120b is an example of a sub-light-emitting module (second light-emitting module), and has a COB structure in which bare chips are directly mounted on the front surface (one main surface) of the substrate 39 .

The LED module 120a includes a substrate 29, a plurality of LEDs 22a and 22b provided on the front surface of the substrate 29, sealing members 23a and 23b, metal wirings 24 and 26, wiring 25, conductive adhesive members 27, and terminals 28. On the other hand, the LED module 120 b includes a substrate 39 , a plurality of LEDs 32 provided on the front surface of the substrate 39 , a sealing member 33 , metal wirings 34 and 36 , wires 35 , a conductive adhesive member 37 , and terminals 38 .

Furthermore, the substrate 29 is an example of a main substrate, and the substrate 39 is an example of a sub substrate.

[substrate]

The substrates 29 and 39 have the same structure and shape as each other, and their back surfaces are bonded together with an adhesive 90 to form one substrate 21 . For the substrates 29 and 39, translucent substrates or non-translucent substrates can be used, for example, ceramic substrates made of alumina or aluminum nitride, metal substrates, resin substrates, glass substrates, or flexible substrates. The board|substrate 29 is a rectangular mounting board|substrate for mounting LED22a and 22b, and the board|substrate 39 is a rectangular mounting board|substrate for mounting LED32.

It is preferable that the board|substrates 29 and 39 are comprised with the white board|substrates, such as a white alumina board|substrate whose light transmittance with respect to the light emitted from LED22a, 22b, and 32 is low, for example 10% or less. For example, the substrates 29 and 39 can be made of a substrate having a light reflectance of 50% or more for light emitted from the LEDs 22a, 22b, and 32 and having one of Al ₂ O ₃ , MgO, SiO, and TiO ₂ as a main component. constitute. Accordingly, the light transmittance of the substrate 21 can be reduced to suppress color unevenness of light emitted from the LED modules 120a and 120b. In addition, low-cost white substrates can be used for the substrates 29 and 39 to reduce the cost of the bulb-shaped lamp.

Two through holes 29 b penetrating from the front to the back of the substrate 29 are provided at both ends in the longitudinal direction of the substrate 29 , and two through holes 29 b penetrating from the front to the rear of the substrate 39 are also provided at both ends of the substrate 39 in the longitudinal direction. The two through holes 39b. The through hole 29b constitutes the terminal 28 for connecting the lead wire 70 for power supply and the LED module 120a, and the through hole 39b constitutes the terminal 38 for connecting the lead wire 70 for power supply and the LED module 120b. The through-holes 29 b and 39 b are arranged continuously to form the through-hole 21 b of the substrate 21 . Therefore, one lead wire 70 is inserted through one continuous through-hole 29b and 39b.

A through hole 29 a penetrating from the front to the back of the board 29 is provided at the center of the board 29 , and a through hole 39 a penetrating from the front to the back of the board 39 is also provided at the center of the board 39 . The through-holes 29 a and 39 a are used to fix the LED modules 120 a and 120 b to the support 40 , and are arranged continuously to form one through-hole 21 a of the substrate 21 . Therefore, the protruding portion 42b of the strut 40 is fitted into the continuous through-holes 29a and 39a.

[adhesive]

Adhesive 90 is provided between the back surface of substrate 29 and the back surface of substrate 39 to bond them together, and is made of, for example, resin such as silicone resin or metal paste such as Ag paste. In the case of the metal paste, the thermal conductivity between the substrate 29 and the substrate 39 is improved, and the thermal conductivity as the substrate 21 is improved, so the heat dissipation efficiency of the substrate 21 can be improved. As a result, the fall of the luminous efficiency and lifetime of LED22a, 22b, and 32 by temperature rise can be suppressed. In addition, since the light-shielding properties of the adhesive 90 , that is, the light-shielding properties of the substrate 21 can be improved, color unevenness due to light from the front to the back of the substrates 29 and 39 can also be suppressed.

Adhesive 90 is not provided in at least a part of the space between through holes 29 b and 39 b between the rear surface of substrate 29 and the rear surface of substrate 39 so as not to hinder the insertion of lead wire 70 into through holes 29 b and 39 b. In addition, the adhesive 90 is not provided between the back surface of the substrate 29 and the space between the through holes 29 b and 39 b between the back surface of the substrate 39 so as not to hinder the fitting of the through holes 29 a and 39 a with the protrusions of the pillar 40 . all.

In the manufacture of LED modules 120a and 120b of FIG. Likewise, a plurality of LEDs 32 , sealing member 33 , metal wirings 34 and 36 , wiring 35 , and terminals 38 are provided on the front surface of substrate 39 . Then, after the substrates 29 and 39 are bonded with the adhesive 90 , the two leads 70 and the terminal 28 are connected by the conductive bonding member 27 , and the two leads 70 and the terminal 38 are connected by the conductive bonding member 37 . Therefore, the LED modules 120a and 120b can be easily manufactured compared to the case where a light source and wiring for emitting light are provided on both the front and back surfaces of one substrate 29 .

As described above, the lightbulb-shaped lamp according to this modified example can realize a lightbulb-shaped lamp having a wide light distribution angle and suppressing reduction in the lifetime of LEDs for the same reason as the lightbulb-shaped lamp of the above-mentioned embodiment.

Moreover, in the lightbulb-shaped lamp concerning this modification, the board|substrate 21 is comprised from the board|substrate 29 in which the element rows of LED22a and 22b were provided in the front, and the board|substrate 39 in which the element row of LED32 was provided in the front. And the board|substrates 29 and 39 are arrange|positioned so that the back surface of the element row in which LED22a and 22b is not provided, and the element row of LED32 mutually opposes. At this time, the LED module 120b may also be glued and fixed to the pillar 40 . According to this, the LED modules 120a and 120b can be manufactured by preparing different substrates 29 and 39, arranging each component on each front surface, and bonding them together. Therefore, the LED modules 120a and 120b can be easily manufactured. As a result, an easy-to-manufacture light bulb-shaped lamp can be realized.

In addition, in the light bulb-shaped lamp according to this modified example, the LED module 120 b is directly attached to the support 40 , and heat generated in the LED module 120 b is transferred to the support 40 . Furthermore, the LED module 120a is indirectly attached to the support 40 via the LED module 120b, and the heat generated in the LED module 120a is indirectly transferred to the support 40 through the LED module 120b. Furthermore, between the LED modules 120a and 120b, an adhesive 90 as a thermally conductive member is provided. The binder 90 is any one of thermally conductive resin, ceramic paste, and metal paste. Accordingly, the heat dissipation efficiency and light-shielding performance of the substrate 21 can be improved, so that the decrease in the luminous efficiency and lifetime of the LEDs 22a, 22b, and 32 can be further suppressed, and the color unevenness of the light emitted by the LED modules 120a and 120b can be further suppressed.

Furthermore, in the lightbulb-shaped lamp according to this modified example, the substrate 39 may have a through-hole 39b penetrating from the front to the rear of the substrate 39, and the support 40 may pass through the through-hole 39b of the substrate 39 to be in contact with the rear surface of the substrate 29. . That is, the through hole 39b may be formed so as to fit integrally with the fixing portion 42 of the support 40 , and the fixing surface of the fixing portion 42 of the support 40 and the back surface of the substrate 29 may be bonded together with the adhesive 90 . Thereby, it becomes easy to fix the LED modules 120a and 120b to the support|pillar 40, and it can realize the easy-to-manufacture lightbulb-shaped lamp. In addition, the LED module 120a is bonded and fixed to the support post 40 to shorten the heat dissipation path from the substrate 29 to the support post 40, and the inner wall of the through hole 39b of the substrate 39 and the support post 40 are fixed by a thermally conductive member such as grease. The heat dissipation path from the substrate 39 to the pillar 40 can be widened by contacting the portion 42 . As a result, the fall of the luminous efficiency and lifetime of LED22a, 22b, and 32 can be suppressed more.

As mentioned above, although the lightbulb-shaped lamp which concerns on this invention was demonstrated based on an Example, this invention is not limited to such an Example. Various modifications conceivable by those skilled in the art within the range not departing from the gist of the present invention are also included in the scope of the present invention. In addition, it is also possible to arbitrarily combine the respective constituent elements of the plurality of embodiments within the scope not departing from the gist of the invention.

For example, in the above-described embodiments and modified examples, an example of an LED is shown as a light-emitting element, but semiconductor light-emitting elements such as semiconductor lasers, or EL elements such as organic EL (Electro Luminescence) and inorganic EL, can also be used. , Other solid light-emitting components.

Furthermore, in the above-described embodiments and modified examples, the LED module has a COB type structure in which LEDs are directly mounted on a substrate, but it is not limited thereto. For example, it is also possible to use the package type (SMD: Surface Mount Device) in which the LED chip is mounted in the cavity (recess) of the resin-molded container and the phosphor-containing resin is sealed in the cavity. The LED element is an LED module configured by mounting a plurality of SMD-type LED elements on a substrate as a light-emitting element. In particular, an SMD-type LED module in which the package has light transmittance to LED light can also be used.

Furthermore, in the above-described embodiments and modifications, a plurality of element rows are provided on each of the front surface and the rear surface of the substrate, but only one element row may be provided.

In addition, in the above-described embodiments and modified examples, the array direction of the LEDs in the LED element rows on the front and back of the substrate is parallel, and as an element that intersects with, for example, is perpendicular to, the array direction and is included in the front surface of the substrate. An example of the predetermined direction is the short-side direction of the substrate, but the predetermined direction is not limited to the short-side direction.

Furthermore, in the above-described embodiments and modifications, the LED element arrays are also provided on the front surface of the substrate other than above the pillars, but the LEDs may be provided only above the pillars.

Furthermore, in the above-described embodiments and modified examples, not only the width in the arrangement direction of the LED element rows of the LED module but also the width in the arrangement direction of the LEDs in the element rows of the LED module increases toward the substrate for the pillars. However, if at least the width in the array direction of the LED element rows of the LED module becomes larger toward the substrate, the array direction width of the LEDs in the LED module element rows may be constant or smaller toward the substrate 21 .

In addition, in the above-mentioned embodiments and modified examples, the lead wires are provided outside the pillars, but as shown in the cross-sectional view of the bulb-shaped lamp in FIG. Hollows in the pillars. In this case, the leads protrude from the upper side of the pillar in the vicinity of the LED module after directly entering the cavity in the pillar from the support base, and are connected to the LED module. According to this, it is possible to reduce the light of the LED module from being blocked by the lead wires. In FIG. 9 , the leads are inserted into the substrate from the back side of the substrate, but the leads may be wound around the front side of the substrate and then inserted from the front side of the substrate.

Moreover, this invention can also be realized as the lighting apparatus provided with the said light bulb-shaped lamp. For example, as shown in FIG. 10 , the lighting device 100 according to the present invention may also be configured to include the light bulb-shaped lamp 1 described above and a lighting device (lighting device) 200 for mounting the light bulb-shaped lamp 1 here. In this case, the lighting device 200 is used for turning off and lighting the light bulb-shaped lamp 1 , and includes, for example, a device main body 210 attached to the ceiling and a shade 220 covering the light bulb-shaped lamp 1 . Among them, the device main body 210 has a base 211 to which the light bulb-shaped lamp 1 is attached and which supplies power to the light bulb-shaped lamp 1 . Furthermore, a translucent plate may be provided in the opening of the globe 220 .

The utility model has a bulb-shaped lamp for replacing conventional incandescent bulbs and the like, and can be widely used in lighting devices and the like.

Symbol Description

1 bulb shaped lamp

10 dome cover

11 opening

20a, 20b, 120a, 120b LED modules

21, 29, 39 Substrate

21a, 21b, 29a, 29b, 39a, 39b through hole

22a, 22b, 32 LEDs

23a, 23b, 33 Sealing parts

24, 26, 34, 36 Metal wiring

25, 35 Wiring

27, 37 Conductive adhesive parts

28, 38 terminals

30 lamp holders

40 pillars

41 Spindle

42 fixed part

42b Protrusion

50 support table

60 resin case

61 First shell part

62 Second housing part

70 leads

80 lighting circuit

90 Adhesive

122a sapphire substrate

122b nitride semiconductor layer

122c cathode electrode

122d anode electrode

122e, 122f Wire splice

122g Die Bonding Material

100 lighting fixtures

200 lighting fixtures

210 Appliance body

211 lamp holder

220 shade.

Claims (15)

1. a bulb-shaped lamp, is characterized in that, possesses:

The enclosed globe shade of light transmission;

Pillar, the inside be configured to described enclosed globe shade extends; And

Main light emission module and secondary light emitting module, be configured in described enclosed globe shade, and be fixed on described pillar,

Described main light emission module has substrate and the first light emitting device group, and this first light emitting device group is made up of multiple first light-emitting components on the front being arranged on described substrate,

Described secondary light emitting module has described substrate and the second light emitting device group, and this second light emitting device group is made up of multiple second light-emitting components on the back side being arranged on described substrate,

Described pillar, be not positioned at described second light emitting device group just below, and be configured in the rear side of described substrate, and there is the shape that width broadens to described substrate.

2. bulb-shaped lamp as claimed in claim 1, is characterized in that,

Described secondary light emitting module has multiple described second light emitting device group,

Described multiple second light emitting device group, is set up across described pillar,

The shape of described pillar is, the width in the orientation of described multiple second light emitting device group broadens to described substrate.

3. bulb-shaped lamp as claimed in claim 1, is characterized in that,

The shape of described pillar is, the width in the orientation of described multiple second light-emitting component broadens to described substrate.

4. bulb-shaped lamp as claimed in claim 1, is characterized in that,

Described substrate is made up of main substrate and auxiliary substrate, and the front of described main substrate is provided with described first light emitting device group, and the front of described auxiliary substrate is provided with described second light emitting device group,

Described main substrate and described auxiliary substrate are configured to, and the back side not arranging described first light emitting device group and described second light emitting device group is opposed each other.

5. the bulb-shaped lamp as described in any one of Claims 1-4, is characterized in that,

Described first light emitting device group, is made up of multiple first light-emitting components be connected in series,

Described second light emitting device group, is made up of multiple second light-emitting components be connected in series,

Described first light emitting device group and described second light emitting device group, be made up of the element of equal number.

6. the bulb-shaped lamp as described in any one of Claims 1-4, is characterized in that,

Described secondary light emitting module, is directly installed on described pillar, and the heat occurred in described secondary light emitting module is transferred heat to described pillar, and,

Described main light emission module, is arranged on described pillar indirectly via described secondary light emitting module, by the heat occurred in described main light emission module, via described secondary light emitting module indirect heat transfer to described pillar.

7. bulb-shaped lamp as claimed in claim 6, is characterized in that,

Between described main light emission module and described secondary light emitting module, be provided with heat-conduction component.

8. bulb-shaped lamp as claimed in claim 7, is characterized in that,

Described heat-conduction component is the some of heat conductivity resin, ceramic size and metal paste.

9. bulb-shaped lamp as claimed in claim 6, is characterized in that,

Described secondary light emitting module, is adhesively fixed with described pillar.

10. bulb-shaped lamp as claimed in claim 1, is characterized in that,

Described substrate, has the light reflectivity of more than 50% for the light sent from described first light emitting device group and described second light emitting device group.

11. bulb-shaped lamps as claimed in claim 10, is characterized in that,

Described substrate, by Al ₂o ₃, MgO, SiO and TiO ₂some as principal component.

12. bulb-shaped lamps as claimed in claim 1, is characterized in that,

The surface of described pillar, has the light reflectivity of more than 30% for the light sent from described first light emitting device group and described second light emitting device group.

13. bulb-shaped lamps as claimed in claim 12, is characterized in that,

Described pillar, some as principal component using Al, Cu and Fe.

14. bulb-shaped lamps as described in any one of Claims 1-4, is characterized in that,

Described main light emission module, at least has plural described first light emitting device group,

Described secondary light emitting module, at least has plural described second light emitting device group.

15. 1 kinds of lighting devices, is characterized in that,

Possesses the bulb-shaped lamp described in any one of claim 1 to 14.