CN204560112U - A heat conduction gasket with increased contact area - Google Patents

Abstract

The utility model discloses an increase area of contact's heat conduction gasket, including the heat conduction gasket body, be provided with on the heat conduction gasket body and generate heat the protruding style of calligraphy of chip surface matched with recess (1), the heat conduction gasket body include heat-conducting layer (2) and set up in the fine enhancement layer of glass (3) of heat-conducting layer (2) one side, recess (1) set up in the surface of heat-conducting layer (2), heat-conducting layer (2) include silica gel base member (4) and fill wire (5) in silica gel base member (4). The utility model has the advantages that: the groove can be tightly attached to the central plane and the peripheral side faces of the heating chip, so that heat of each heating surface of the heating chip is conducted, the heat dissipation problem of the high-heating-power heating chip is well solved, the filled metal wires are continuously distributed in the silica gel matrix, a through heat transfer path is formed, and the heat conduction performance of the heat conduction layer body is improved.

Description

A heat conduction gasket with increased contact area

technical field

The utility model relates to the technical field of heat dissipation of a heating chip, in particular to a heat conduction gasket with an enlarged contact area.

Background technique

At present, the shape of the heating chip is mostly a convex shape with a high central height and a low peripheral height, and the height difference between the central and surrounding areas is about 1 to 2 mm. Because the housing that the heat conduction pad contacts has a fixed height during assembly. If it is desired to stick a thermal pad on the heating chip, the thickness of the thermal pad can only be selected according to the height of the center or the surrounding of the heating chip. This will greatly reduce the heat transfer area of new heat-generating products or make the thermal pad too thick, resulting in assembly interference problems.

Contents of the invention

The purpose of the utility model is to overcome the disadvantages of the prior art, and provide a heat conduction gasket that conducts heat from each heating surface of a heating chip and increases the contact area.

The purpose of this utility model is achieved through the following technical solutions: a thermal pad with an enlarged contact area, covering the convex surface of the heating chip, including a thermal pad body, the thermal pad body is provided with a contact with the heating chip A groove matching the convex surface, the heat conduction gasket body includes a heat conduction layer and a glass fiber reinforcement layer arranged on one side of the heat conduction layer, the groove is arranged on the surface of the heat conduction layer, and the heat conduction layer includes a silica gel substrate and Metal wire filled in a silicone matrix. The metal wire is silver wire, copper wire or aluminum wire. The diameter of the metal wire is 0.5mm-1mm, and the volume filling rate of the metal wire in the silica gel matrix is 20-60%. The inventor found through experiments that the diameter of the metal wire and the volume filling rate of the metal wire in the silica gel matrix are factors that affect the thermal conductivity of the thermal pad. Further, the larger the diameter of the metal wire, the less the content of the metal wire reaches a maximum value. , the elasticity of the thermal pad decreases significantly, and the reduction of the content of the metal wire reduces the thermal conductivity of the thermal pad. Properly reducing the diameter of the metal wire can effectively reduce the influence of the content of the metal wire on the elasticity of the thermal pad, but Too thin metal wires are difficult to form a through heat conduction path, which also affects the thermal conductivity of the thermal pad. Through scientific research, the inventor found that when the diameter of the metal wire is 0.5 mm to 1 mm, it can not only ensure the formation of a through heat conduction path, but also maintain a relatively high content of metal wire, and the overall heat conduction gasket has better elasticity. The metal wires extend in the silica gel matrix in a direction perpendicular to the heat conduction gasket, so that each metal wire forms a through heat conduction path. The shape of the thermal pad is square or circular. The groove is a rectangular groove. The utility model has the following advantages: the groove of the utility model can closely fit the central surface and the surrounding side of the heating chip, thereby conducting the heat of each heating surface of the heating chip, and there is no assembly interference problem, compared with the existing heat conducting The gasket can effectively reduce the temperature by more than 5°C, which solves the heat dissipation problem of the high-heating power heating chip. The utility model combines a layer of glass fiber reinforced layer on the heat conduction gasket, improves the mechanical strength of the heat conduction gasket without increasing the thickness and thermal resistance of the heat conduction gasket, and has good tear resistance and puncture resistance , will not be punctured by pins, avoiding the occurrence of short circuit problems in electronic products. The metal wire is filled in the thermal pad, and the filled metal wire is continuously distributed in the silica gel matrix, forming a through heat transfer path, thus improving the thermal conductivity of the heat conduction layer body.

Description of drawings

Fig. 1 is the structural representation of the utility model.

In the figure, 1-groove, 2-thermal conduction layer, 3-glass fiber reinforcement layer, 4-silica gel substrate, 5-wire.

Detailed ways

Below in conjunction with accompanying drawing, the utility model is further described:

As shown in Figure 1, a heat conduction gasket with an enlarged contact area covers the convex surface of the heating chip, including a heat conduction gasket body, and the heat conduction gasket body is provided with a heat conduction pad that matches the convex surface of the heat generation chip. Groove 1, the heat conduction gasket body includes a heat conduction layer 2 and a glass fiber reinforcement layer 3 disposed on one side of the heat conduction layer 2, the groove 1 is disposed on the surface of the heat conduction layer 2, and the heat conduction layer 2 includes a silica gel matrix 4 and the metal wire 5 filled in the silica gel matrix 4.

The metal wire 5 is silver wire, copper wire or aluminum wire.

The diameter of the metal wire 5 is 0.5mm-1mm, and the volume filling rate of the metal wire 5 in the silica gel matrix 4 is 20-60%. The inventor found through experiments that the diameter of the metal wire 5 and the volume filling rate of the metal wire 5 in the silica gel matrix 4 are factors that affect the thermal conductivity of the thermal pad. Further, the larger the diameter of the metal wire 5, the greater the content of the metal wire 5. When the maximum value is not reached, the elasticity of the thermal pad decreases significantly, and the reduction of the content of the metal wire 5 reduces the thermal conductivity of the thermal pad. Properly reducing the diameter of the metal wire 5 can effectively reduce the impact of the content of the metal wire 5 on thermal conductivity. The impact of gasket elasticity is reduced, but too thin metal wire 5 is difficult to form a through heat conduction path, which also affects the thermal conductivity of the heat conduction gasket. Through scientific research, the inventor found that when the diameter of the metal wire 5 is 0.5 mm to 1 mm, it can not only ensure the formation of a through heat conduction path, but also maintain a higher content of the metal wire 5, and the heat conduction gasket as a whole has better elasticity .

The metal wires 5 extend in the silica gel matrix 4 in a direction perpendicular to the heat conduction pad, so that each metal wire 5 forms a through heat conduction path. The shape of the thermal pad is square or circular. The groove 1 is a rectangular groove.

Groove 1 can closely fit the central surface and surrounding sides of the heating chip, so as to conduct heat from each heating surface of the heating chip, and there is no problem of assembly interference. Compared with the existing thermal pad, it can effectively reduce the temperature by more than 5°C. It solves the heat dissipation problem of the high heating power heating chip well. A layer of glass fiber reinforced layer 3 is compounded on the heat conduction gasket, which improves the mechanical strength of the heat conduction gasket without increasing the thickness and thermal resistance of the heat conduction gasket, and has good tear resistance and puncture resistance. It will be punctured by pins, avoiding the occurrence of short circuit problems in electronic products. Metal wires 5 are filled in the heat conduction pad, and the filled metal wires 5 are continuously distributed in the silica gel matrix 4 to form a through heat transfer path, thus improving the heat conduction performance of the heat conduction layer 2 body.

Claims (6)

1. A heat conduction gasket with increased contact area, characterized in that: it includes a heat conduction gasket body, and the heat conduction gasket body is provided with a groove (1) that matches the convex surface of the heating chip, and the heat conduction The gasket body includes a heat conduction layer (2) and a glass fiber reinforcement layer (3) arranged on one side of the heat conduction layer (2), the groove (1) is arranged on the surface of the heat conduction layer (2), and the heat conduction layer (2) ) includes a silica gel matrix (4) and a metal wire (5) filled in the silica gel matrix (4). 2. A heat conduction gasket with increased contact area according to claim 1, characterized in that: said metal wire (5) is silver wire, copper wire or aluminum wire. 3. A thermal pad with increased contact area according to claim 1, characterized in that: the diameter of the metal wire (5) is 0.5 mm to 1 mm, and the metal wire (5) is placed on the silica gel matrix (4 ) within the volume filling rate of 20 to 60%. 4 . The heat conduction pad with increased contact area according to claim 1 , characterized in that: the metal wire ( 5 ) extends in a direction perpendicular to the heat conduction pad in the silica gel matrix ( 4 ). 5. A heat conduction pad with increased contact area according to claim 1, characterized in that: the shape of the heat conduction pad is square or circular. 6. A heat conduction pad with increased contact area according to claim 1, characterized in that: said groove (1) is a rectangular groove.