CN205194687U - A thermally conductive silicone sheet for mobile phones - Google Patents

Abstract

The utility model discloses a heat conduction silica gel piece for cell-phone, including last heat-conducting layer, graphite membrane and the lower heat-conducting layer that sets gradually, last heat-conducting layer and graphite membrane between and all be provided with the adhesive layer between lower heat-conducting layer and the graphite membrane, the upper surface of last heat-conducting layer and the lower surface of lower heat-conducting layer all be provided with one deck pressure sensitive adhesive layer, last heat-conducting layer, lower heat-conducting layer constitute by silica gel matrix material and the solid high thermal conductivity granule of packing in silica gel matrix material. The utility model has the advantages that: the structure that the heat conducting layers are arranged on the two sides of the graphite film is adopted, so that heat diffusion is facilitated, and the phenomenon that the local temperature is too high is avoided. Compared with the existing heat conducting gasket, the high-power heat conducting gasket can effectively cool more than 8 ℃, and well solves the heat dissipation problem of the high-power heat generating chip.

Description

A thermally conductive silicone sheet for mobile phones

technical field

The utility model relates to the technical field of heat dissipation of electronic components, in particular to a heat-conducting silica gel sheet for mobile phones.

Background technique

Thermal pad is a material commonly used in IC packaging and electronic heat dissipation. It is mainly used to fill the micro-gap generated when two hard materials are in contact, reduce thermal resistance, and improve the heat dissipation performance of the device. With the rapid development of contemporary electronics, the integration level of electronic components has been continuously improved. While improving the powerful use functions, it has also led to an increase in the power consumption and heat generation of its work. High temperature will have a harmful effect on the stability, reliability and life of electronic components. For example, excessive temperature will endanger the junction of semiconductors and damage the connection cross section of the circuit. Thermal pads are key components for heat dissipation of electronic components. The contact effect and thermal conductivity are the two main factors that affect the heat transfer of large thermal pads. The current thermal pads have certain defects in the contact performance and thermal conductivity.

At present, the shape of the heating chip is mostly a convex shape with a high central height and a low peripheral height, and the height difference between the central and surrounding areas is about 1 to 2 mm. Because the housing that the heat conduction pad contacts has a fixed height during assembly. If it is desired to paste a thermal pad on the heating chip, the thickness of the thermal pad can only be selected according to the height of the center or the surrounding of the heating chip. This will lead to a significant reduction in the heat transfer area of new heat-generating products or make the thermal pad too thick, resulting in assembly interference problems.

Contents of the invention

The purpose of the utility model is to overcome the disadvantages of the prior art, and provide a heat-conducting silica gel sheet for mobile phones which is beneficial to heat diffusion and avoids excessive local temperature.

The purpose of the utility model is achieved through the following technical solutions: a heat-conducting silica gel sheet for mobile phones, including an upper heat-conducting layer, a graphite film, and a lower heat-conducting layer arranged in sequence, and between the upper heat-conducting layer and the graphite film and the lower heat-conducting layer An adhesive layer is arranged between the heat conduction layer and the graphite film, and a layer of pressure-sensitive adhesive layer is provided on the upper surface of the upper heat conduction layer and the lower surface of the lower heat conduction layer, and the upper heat conduction layer and the lower heat conduction layer are composed of It consists of a silica gel matrix material and solid high thermal conductivity particles filled in the silica gel matrix material.

The lower surface of the lower heat conduction layer is provided with a groove matching with the heat generating component, and a layer of phase change heat conduction material is provided on the groove bottom surface of the groove and the surfaces of the four groove side walls. The phase-change heat-conducting material layer is made of a commercially available phase-change material. When heated, the phase-change heat-conducting material layer undergoes a phase change, and the original solid layer softens into a semi-liquid state.

The solid high thermal conductivity particles are silver powder or copper powder.

The outside of the pressure-sensitive adhesive layer is covered with a layer of release paper.

The utility model has the following advantages:

The utility model adopts the structure that heat conduction layers are arranged on both sides of the graphite film, which is beneficial to the diffusion of heat and avoids the phenomenon that the local temperature is too high. Compared with the existing thermal pads, it can effectively reduce the temperature by more than 8°C, which well solves the heat dissipation problem of high-heating-power heating chips.

The groove can closely fit the central surface and surrounding sides of the heating chip, and the phase-change heat-conducting material layer on the side wall of the groove and the bottom surface of the groove undergoes a phase change when heated, softening from the original solid layer to a semi-liquid state, so that it can be changed from The microscopic angle is in closer contact with the surface of the heating chip, which improves the thermal conductivity.

Description of drawings

Fig. 1 is the structural representation of the utility model.

In the figure, 1-upper thermal conductive layer, 2-graphite film, 3-lower thermal conductive layer, 4-adhesive layer, 5-pressure-sensitive adhesive layer, 6-groove, 7-phase change thermal conductive material layer, 8-release paper .

detailed description

Below in conjunction with accompanying drawing, the utility model is further described:

As shown in Figure 1, a thermally conductive silica gel sheet for mobile phones includes an upper thermally conductive layer 1, a graphite film 2, and a lower thermally conductive layer 3 arranged in sequence, and the upper thermally conductive layer 1 and the graphite film 2 and the lower thermally conductive layer An adhesive layer 4 is provided between the layer 3 and the graphite film 2, and a layer of pressure-sensitive adhesive layer 5 is provided on the upper surface of the upper heat-conducting layer 1 and the lower surface of the lower heat-conducting layer 3, and the upper heat-conducting layer 1 Both the lower heat conducting layer 3 and the lower heat conducting layer 3 are composed of a silica gel matrix material and solid particles with high thermal conductivity filled in the silica gel matrix material.

The lower surface of the lower heat conduction layer 3 is provided with a groove 6 matching with the heat-generating components, and a layer of phase change heat conduction material layer 7 is provided on the groove bottom surface of the groove 6 and the surfaces of the four groove side walls. The phase-change heat-conducting material layer 7 is made of commercially available phase-change materials. When heated, the phase-change heat-conducting material layer 7 undergoes a phase change, and the original solid layer softens into a semi-liquid state.

The solid high thermal conductivity particles are silver powder or copper powder.

The outside of the pressure-sensitive adhesive layer 5 is covered with a layer of release paper 8 .

The utility model adopts the structure that heat conduction layers are arranged on both sides of the graphite film 2, which is beneficial to the diffusion of heat and avoids the phenomenon of excessive local temperature. Compared with the existing thermal pads, it can effectively reduce the temperature by more than 8°C, which well solves the heat dissipation problem of high-heating-power heating chips.

The groove 6 can closely fit the central surface and surrounding sides of the heating chip, and the phase-change heat-conducting material layer 7 on the side wall of the groove 6 and the bottom surface of the groove undergoes a phase change when heated, and the original solid layer softens into a semi-liquid state. Therefore, the surface of the heating chip can be more closely contacted from a microscopic point of view, and the thermal conductivity is improved.

Claims (4)

1. the heat-conducting silica gel sheet for mobile phone, it is characterized in that: comprise the upper heat-conducting layer (1) set gradually, graphite film (2) and lower heat-conducting layer (3), adhesive layer (4) is provided with between described upper heat-conducting layer (1) and graphite film (2) and between lower heat-conducting layer (3) and graphite film (2), the upper surface of described upper heat-conducting layer (1) and the lower surface of lower heat-conducting layer (3) are provided with one deck pressure-sensitive adhesive layer (5), described upper heat-conducting layer (1), lower heat-conducting layer (3) is formed by silica gel basis material and the solid high heat conductance particle be filled in silica gel basis material.

2. a kind of heat-conducting silica gel sheet for mobile phone according to claim 1, it is characterized in that: the lower surface of described lower heat-conducting layer (3) is provided with the groove (6) matched with heat generating components, in the groove bottom of groove (6) and on the surface of four groove sidewalls, be provided with one deck phase change thermal conductive material layer (7).

3. a kind of heat-conducting silica gel sheet for mobile phone according to claim 1, is characterized in that: described solid high heat conductance particle is silver powder or copper powder.

4. a kind of heat-conducting silica gel sheet for mobile phone according to claim 1, is characterized in that: the outside of described pressure-sensitive adhesive layer (5) is all covered with one deck release liners (8).