CN204534854U - A kind of high-performance semiconductor air-conditioning - Google Patents

Abstract

The utility model discloses a high-performance semiconductor air conditioner, which comprises an internal fan, an internal radiator, an external fan, an external radiator and a semiconductor refrigeration sheet. The internal and external fans cooperate to form internal and external heat dissipation air ducts. The semiconductor cooling chip is composed of several A chips and B chips fixed on a substrate, wherein the power of the B chip is smaller than that of the A chip; the A and B chips are divided into two parts. Each group includes B chips. The two groups of chips are first connected in series and then connected in parallel. The B chips are facing the positions of the internal and external fans. The air conditioner effectively improves the refrigeration energy efficiency ratio of the semiconductor air conditioner through the reasonable selection and arrangement of the refrigeration chip, and the air conditioner has a compact structure, a small volume, is easy to install, and has wide practicability.

Description

A high-performance semiconductor air conditioner

technical field

The utility model relates to a temperature control device for an outdoor cabinet in the communication or electric power industry, in particular to a semiconductor refrigeration air conditioner for a communication outdoor battery cabinet or a battery compartment in a communication machine room.

Background technique

The semiconductor air conditioner is small in size and light in weight. Its refrigeration is realized by semiconductor chips. It has no refrigeration mechanical moving parts, no refrigerant, no leakage, environmental protection and high reliability. It is widely used in outdoor cabinets in the communication and power industries. The main structure of the semiconductor refrigeration air conditioner currently used includes a semiconductor refrigeration sheet composed of several chips connected in series or in parallel inside the air conditioner, and an internal and external heat sink composed of internal and external heat sinks and internal and external fans located on both sides of the semiconductor refrigeration sheet. Two heat dissipation channels, the air conditioner housing is provided with inner and outer air inlets and inner and outer air outlets connected with the inner and outer air ducts. The chips used in series or parallel connection in the prior art semiconductor refrigerating sheets are all high-power chips of the same type. The chip in the refrigerating sheet facing the rotors of the two fans has the largest wind resistance and small air volume. The effect cannot be fully utilized, resulting in waste of power consumption, resulting in a semiconductor air conditioner refrigeration energy efficiency ratio of about 0.6, which is generally low.

Contents of the invention

The purpose of the utility model is to overcome the deficiencies of the prior art and provide a high-performance semiconductor air conditioner. The air conditioner divides a number of high-power A chips into two groups and then connects them in series with low-power B chips, and then connects the two groups of chips in parallel. The waste of energy consumption of the position chip improves the refrigeration energy efficiency ratio of the semiconductor air conditioner.

The technical scheme of the utility model is:

A high-performance semiconductor air conditioner, comprising an internal fan 6, an internal radiator, an external fan 7, an external radiator and a semiconductor refrigeration sheet 8, the internal and external radiators are closely attached to both sides of the semiconductor refrigeration sheet 8, and are respectively connected to the semiconductor refrigeration sheet. The internal and external fans 6 and 7 cooperate to form internal and external heat dissipation air ducts B and C, and the semiconductor cooling chip 8 is composed of a number of A chips 9 and B chips 10 fixed on a substrate 11, wherein the power of the B chip 10 is less than that of the A chip 9 The A and B chips are divided into two groups and each group includes B chips 10. The two groups of chips are connected in series and then in parallel, wherein the B chips 10 are facing the positions of the internal and external fans 6 and 7.

Further, in order to improve the heat dissipation speed of the radiator, the inner and outer radiators are composed of a bottom plate and a plurality of fins 12 perpendicular to the bottom plate and arranged in parallel, the bottom plate is close to the two sides of the semiconductor refrigeration sheet 8, the The fins 12 cooperate with the internal and external fans 6 and 7 to form internal and external heat dissipation air ducts B and C.

Further, the inner and outer heat sinks are both made of copper or aluminum, and the fins 12 are fixed on the bottom plate by welding or integrally formed with the bottom plate.

Further, the air conditioner also includes an air conditioner casing 1, the middle positions of the front and rear ends of the casing 1 are respectively provided with an inner air inlet 2 and an outer air inlet 3 communicating with the inner and outer cooling air ducts B and C, and the left and right sides of the casing 1 The two sides are respectively provided with inner air outlet 4 and outer air outlet 5 communicating with inner and outer cooling air ducts B and C, and said inner and outer fans 6 and 7 are respectively arranged at inner and outer air inlets 2 and 3.

Further, preferably, the semiconductor cooling chip 8 is composed of 8 A chips 9 and 2 B chips 10 fixed on the substrate 11 .

Further, preferably, the A and B chips are divided into two groups, and each group includes 4 A chips 9 and 1 B chip 10, and the two groups of chips are connected in series and then connected in parallel, wherein the B chip 10 is located in the middle of the series.

The utility model has the advantages of:

1. In the semiconductor refrigerating sheet of the semiconductor air conditioner of the utility model, the chip directly facing the internal and external fans is replaced with a low-power B chip, where the wind resistance is large and the air volume is small, and the cooling effect of the high-power A chip does not fully exert its existing energy. It is wasteful, but the cooling effect of the B chip with low power can be fully utilized, which ensures the cooling effect and reduces energy consumption, thereby improving the energy efficiency ratio of air conditioning and cooling.

2. The chip on the semiconductor cooling chip in the semiconductor air conditioner is connected in series and parallel on the substrate, and the position of the chip is easy to adjust to ensure that the B chip is always facing the internal and external fans. The overall structure of the air conditioner is compact, small in size, easy to install, and wide in practicability.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described:

Fig. 1 is the structural representation of embodiment semiconductor air conditioner;

Fig. 2 is the side view of embodiment semiconductor air conditioner structure;

Fig. 3 is A-A sectional view among Fig. 1;

Among them: 1-shell 2-inner air inlet 3-outer air inlet 4-inner air outlet 5-outer air outlet 6-inner fan 7-outer fan 8-semiconductor cooling chip 9-A chip 10-B chip 11-substrate 12- Fin B-inner cooling air duct C-outer cooling air duct.

Detailed ways

Example:

A kind of high-performance semiconductor air conditioner, its structure as shown in Figure 1, comprises the air conditioner sheet metal shell 1, is located at the inner blower fan 6 in the shell 1, inner radiator, outer blower fan 7, outer radiator and semiconductor refrigerating sheet 8, so The inner and outer radiators are closely attached to both sides of the semiconductor refrigeration sheet 8, and cooperate with the inner and outer fans 6, 7 to form inner and outer heat dissipation air ducts B and C respectively, and the middle positions of the front and rear ends of the housing 1 are An inner air inlet 2 and an outer air inlet 3 communicating with the inner and outer cooling air ducts B and C are respectively provided, and the left and right sides of the housing 1 are respectively provided with inner air outlets 4 and 4 communicating with the inner and outer cooling air ducts B and C. The air outlet 5 is outside, and the inside and outside blowers 6,7 are respectively arranged at the inside and outside air inlets 2,3. The semiconductor cooling chip 8 is composed of several A chips 9 and B chips 10 fixed on a substrate 11, wherein the power of the B chip 10 is smaller than that of the A chip 9; in this example, the semiconductor cooling chip 8 includes 8 A chips 9 and 2 B chips 10. They are divided into two groups, each group has 4 A chips 9 and 1 B chip 10. The 5 chips in each group are first connected in series, and then the two groups of chips connected in series are connected in parallel, and the B chips 10 are all located in the series The middle position ensures that the two B chips 10 are in direct alignment with the rotors of the internal and external fans 6, 7 (as shown in Figure 3).

Further, in order to improve the heat dissipation speed of the radiator, the inner and outer radiators are all composed of a base plate and several fins 12, 13 arranged in parallel perpendicular to the base plate, and the base plate is closely attached to both sides of the semiconductor refrigeration sheet 8 ( As shown in Figure 2), fins 12,13 cooperate with internal and external fans 6,7 to form internal and external cooling air ducts B, C respectively. Both the bottom plate and the fins 12, 13 are copper or aluminum with good thermal conductivity, and the fins 12, 13 can be welded and fixed on the bottom plate, or integrally formed with the bottom plate.

In this example, the refrigeration energy efficiency ratio of the semiconductor air conditioner is 0.8, which is greatly improved compared with the 0.6 of the existing air conditioner.

It can be seen from the above embodiments that a high-performance semiconductor air conditioner of the present invention effectively improves the cooling energy efficiency ratio of the semiconductor air conditioner through reasonable selection and arrangement of refrigeration chips. The air conditioner is compact in structure, small in size, easy to install, and practical. wide.

Of course, the above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present utility model, and its purpose is to allow people familiar with this technology to understand the content of the present utility model and implement it accordingly, and cannot limit the protection scope of the present utility model with this. All modifications made according to the spirit of the main technical solutions of the utility model shall fall within the protection scope of the utility model.

Claims (6)

1. a high-performance semiconductor air-conditioning, comprise inner blower (6), inner radiator, outer blower fan (7), outer radiator and semiconductor chilling plate (8), described inside and outside radiator is close to semiconductor chilling plate (8) both sides, and coordinate with described inside and outside blower fan (6,7) respectively and form inside and outside heat dissipation wind channel (B, C), it is characterized in that, described semiconductor chilling plate (8) is fixed on a substrate (11) by some A chips (9) and B chip (10) and forms, and wherein B chip (10) power is less than A chip (9); Described A, B chip is divided into two groups and often organizes and all comprises B chip (10), and two groups of chip is first in parallel after series connection separately, and wherein B chip (10) is just to described inside and outside blower fan (6,7) position.

2. a kind of high-performance semiconductor air-conditioning according to claim 1, it is characterized in that, described inside and outside radiator by a base plate and perpendicular to base plate and the some fins (12) be arranged in parallel composition, described base plate is close to semiconductor chilling plate (8) both sides, and described fin (12) coordinates inside and outside blower fan (6,7) to form inside and outside heat dissipation wind channel (B, C).

3. a kind of high-performance semiconductor air-conditioning according to claim 2, is characterized in that, described inside and outside radiator is made by copper or aluminium, and described fin (12) is by be fixedly welded on base plate or one-body molded with base plate.

4. a kind of high-performance semiconductor air-conditioning according to claim 1, it is characterized in that, also comprise air conditioner housing (1), described shell (1) front and back ends centre position is respectively equipped with the interior air inlet (2) and external air inlet mouth (3) that are communicated with inside and outside heat dissipation wind channel (B, C), shell (1) left and right sides is respectively equipped with the interior air outlet (4) and outer air outlet (5) that are communicated with inside and outside heat dissipation wind channel (B, C), and described inside and outside blower fan (6,7) is located at inside and outside air inlet (2,3) place respectively.

5. a kind of high-performance semiconductor air-conditioning according to claim 1, is characterized in that, described semiconductor chilling plate (8) is fixed on substrate (11) by 8 A chips (9) and 2 B chips (10) and forms.

6. a kind of high-performance semiconductor air-conditioning according to claim 5, it is characterized in that, described A, B chip divide equally two groups often group comprise 4 A chips (9) and 1 B chip (10), two groups of chip is in parallel after connecting separately, and wherein B chip (10) is positioned at series connection position, middle.